Quantitative pouring type casting equipment and casting process for investment silica sol

Abstract

The invention discloses investment silica sol quantitative pouring type casting equipment and a casting process, and relates to the technical field of casting equipment.The forging equipment comprises a table top assembly, a storage assembly and a temperature control assembly, the bottom end of the storage assembly is provided with a discharging assembly, the output end of the discharging assembly is provided with a mold assembly, and the mold assembly is located above the table top assembly; the discharging assembly is used for controlling the flow speed of silica sol, and a temperature control assembly is arranged on the mold assembly and used for rapidly cooling a mold.

Description

Technical Field

[0001] The present invention relates to the technical field of casting equipment, and specifically to a precision investment casting equipment and casting process using quantitative pouring of silica sol. Background Art

[0002] In modern industry, replacing forging with casting, developing towards small cutting or non-cutting, high precision, high surface finish, and complex parts or assemblies that are difficult to process by other methods has opened up a wide range of application prospects for precision casting technology. Due to its relatively simple manufacturing process, low cost, convenient source, and no pollution, silica sol is increasingly widely used in modern precision investment casting. Compared with other precision investment casting processes, the silica sol mold shell enables the production of larger precision castings in precision investment casting due to its higher strength.

[0003] However, when the forging equipment is pouring, the silica sol is discharged by tilting the storage component using gravity, and it is impossible to effectively control the flow rate of the silica sol, which easily leads to casting defects caused by too much or too little pouring amount, resulting in excessive use of materials, increasing the rejection rate of products. Moreover, non-quantitative pouring requires frequent manual adjustment of the pouring amount, increasing the complexity and labor intensity of the operation. Non-quantitative pouring may cause temperature fluctuations and affect the quality of the castings.

[0004] When the forging equipment is pouring, since the silica sol is poured into the mold, the silica sol poured first will cool first, and the silica sol poured later will have a temperature difference with the silica sol poured first, which is more likely to cause deformation or dimensional accuracy problems, increasing the difficulty and time of subsequent processing. Summary of the Invention

[0005] The purpose of the present invention is to provide a precision investment casting equipment and casting process using quantitative pouring of silica sol to solve the problems raised in the prior art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions: The forging equipment includes a desktop component, a storage component, and a temperature control component. The bottom end of the storage component is provided with a discharging component, and the output end of the discharging component is provided with a mold component. The mold component is located above the desktop component. The discharging component is used to control the flow rate of the silica sol, and the mold component is provided with a temperature control component, which is used to quickly cool the mold.

[0007] Its desktop component is used for transporting and placing the mold component. The mold component is used to form silica sol. Then, the temperature control component on the mold component cools the silica sol in the mold. The temperature control component can make the silica sol quickly solidify and can also eliminate the bubbles in the silica sol, thereby improving the forming accuracy of the casting and the service life of the mold (effect). The storage component is used to store the high-temperature silica sol and pour it at the input end of the module component through the discharging component. Bubbles will be generated during the transportation of the silica sol, which will cause pores on the surface or inside of the casting when the silica sol solidifies. These pores will affect the appearance quality of the casting. The storage component not only maintains the high temperature of the silica sol itself but also removes the bubbles in the silica sol. The mold component is located below the output end of the discharging component.

[0008] Further, the storage component includes a storage bin and a cover plate. A cavity is provided in the outer shell of the storage bin. An annular conductor block is provided in the cavity. The annular conductor block is sleeved on the storage bin. The annular conductor block is electrically connected to an external power supply. An outlet is provided on one side of the storage bin. A connecting piece is provided outside the outlet. The connecting piece is fixedly connected to the bottom end of the storage bin. The cover plate is snap-connected to the top end of the storage bin.

[0009] An outlet is provided on one side of the storage bin, which is the output end. A cavity is provided on the outer wall of the storage bin. The cavity and the storage bin are on the same central axis. An annular conductor block is provided in the cavity. The annular conductor block is used to eliminate the bubbles in the silica sol inside the storage bin. The principle is that after positive charges are introduced into the annular conductor block, it will attract the silica sol particles in the silica sol. The silica sol particles usually carry negative charges on their surfaces, so they will move in a directional circular motion under the attraction of the annular conductor block, finally achieving the stirring effect and reducing the generation of bubbles. The bottom end of the cover plate cooperates with the top end of the storage bin. The cover plate is used to seal the storage bin and reduce the temperature loss rate of the silica sol. An inlet is provided at the top end of the storage bin and is connected to an external pipeline, so as to reduce the contact area between the silica sol and the external air and reduce the probability of the silica sol containing bubbles and impurities.

[0010] Further, the discharging component includes a discharging pipe and a main conductor plate. The input end of the discharging pipe is communicated with the output end of the storage bin. The discharging pipe is fixedly connected to the connecting piece. Main conductor plates are provided at the upper and lower ends of the discharging pipe. The main conductor plates are fixedly connected to the discharging pipe. A shunt pipe is provided at one end of the discharging pipe far from the input end. The shunt pipe is communicated with the discharging pipe. Three output ends are provided on the shunt pipe. Sub-conductor plates are provided at the upper and lower ends of the shunt pipe. The sub-conductor plates are fixedly connected to the shunt pipe. The main conductor plate and the sub-conductor plate are wrapped with a shell. A diversion groove is provided inside the shunt pipe. The diversion groove is used to reduce the flow rate of the silica sol. A detection component is provided at the output end of the shunt pipe. The detection component is used to detect the flow rate of the silica sol.

[0011] The function of the discharging component is that the transportation pipeline is located at the bottom end of the storage bin. The discharging pipe is fixedly connected to the connecting piece, and the discharging pipe is communicated with the output end at the bottom end of the storage bin. The discharging pipe is a single pipeline, and the shunt pipe is a three-pipeline for the shunting function. The conductor plate is connected to an external power supply to generate positive charges. The surface of the silica sol particles is charged, usually negatively charged, forming a double-layer structure. Under the action of an external electric field, that is, the conductor plate, the charged particles will move directionally towards the electrode with the opposite charge. By controlling the direction and intensity of the electric field, the flow of particles in the silica sol can be regulated. The achieved effect is that by adjusting the electric field intensity, the migration speed of the particles can be controlled, thereby regulating the flow direction and speed of the silica sol. At low voltages, the electric field intensity is low, and the flow speed of the silica sol is slow. The slower the flow rate, the smaller the flow. While at high voltages, the electric field intensity increases, the flow speed accelerates, the faster the flow rate, the larger the flow. The principle of the main conductor plate and the auxiliary conductor plate is the same. The number of auxiliary conductor plates is the same as the number of output ends of the shunt pipe. Thus, by adjusting the electric field intensity of the auxiliary conductor plate, multiple silica sol output ends with different flow rates can be achieved. The detection component is used to detect the flow rate of the shunt pipe and change the electric field intensity of the conductor plate according to the detected flow rate. Among them, the diversion groove is wavy. Thus, when the conductor plate drives the silica sol, its diversion groove also affects the flow direction of the silica sol, thereby achieving the effect of assisting in slowing down the flow rate of the silica sol and reducing the probability of splashing during pouring.

[0012] Further, the detection component includes a coil and an electrode. The coil is sleeved at the output end of the shunt pipe, and electrodes are provided on both sides of the coil.

[0013] The coil and the shunt pipe are on the same central axis. The coil is used to detect the silica sol flow rate. The principle is that when the silica sol flows through the coil, the fluid will cut the magnetic force lines, and thus an induced electromotive force will be generated in the fluid. The flow rate of the silica sol can be known through the magnitude of the induced electromotive force. Among them, the magnitude of the induced electromotive force is proportional to the flow rate of the fluid, the magnetic field intensity, and the pipe diameter. When the magnetic field intensity and the pipe diameter are constant, the flow rate is linearly related to the induced electromotive force. Among them, the electrode is used to capture the induced electromotive force, and the electrode is electrically connected to an external converter to convert the induced electromotive force into a flow rate value.

[0014] Further, the desktop component includes a base and a workbench surface. The base is located on the horizontal ground. A support column is provided on the upper surface of the base, and the support column is fixedly connected to the upper surface of the base. A workbench surface is provided at the top of the support column, and the workbench surface is fixedly connected to the support column. A conveyor belt is provided on the workbench surface, and a mold component is provided on the conveyor belt.

[0015] The desktop component, as the support column, is used to place the mold component at the output end of the discharging component. The support column is vertically and fixedly connected to the base, and the workbench surface is fixedly connected to the top of the support column. A conveyor belt is provided on the surface of the workbench surface, and the conveyor belt is used to drive multiple mold components, thereby facilitating the rapid pouring of multiple molds.

[0016] Further, the mold assembly includes an upper mold and a lower mold. The lower mold is located on the upper surface of the conveyor belt, and the upper mold is provided at the top of the lower mold. The upper mold and the lower mold are connected by clamping. An inverted material port is opened at the top of the upper mold, and a splash-proof block is provided outside the inverted material port. The splash-proof block is fixedly connected to the upper mold, and a temperature control component is provided outside the lower mold.

[0017] The mold assembly is used to receive the silica sol at the output end of the discharging assembly and form the silica sol inside the mold. The lower mold is located on the conveyor belt and moves through the conveyor belt to achieve the rapid movement of multiple molds, thereby facilitating the rapid pouring of multiple molds. The upper mold and the lower mold are connected by clamping. The inverted material port of the upper mold serves as the input end of the mold assembly. The splash-proof block is located at the inverted material port of the upper mold. Due to the action of the annular conductor block during the previous transportation process, the air bubbles are eliminated, and due to the conductor plate achieving the drainage effect, the conductor plate controls the flow and speed of the silica sol through the charge, so that when the silica sol reaches the mold, its flow rate and air holes are controlled, thereby effectively achieving the splash-proof effect. The temperature control component is used to control the silica sol inside the mold.

[0018] Further, clamping blocks are provided on the outer wall of the lower mold. The clamping blocks are fixedly connected to the lower mold. Clamping grooves are opened on the outer wall of the upper mold. The clamping blocks are matched with the clamping grooves. A cavity is opened inside the clamping blocks. A bimetallic strip is provided in the cavity. One end of the bimetallic strip is fixedly connected to the inner wall of the clamping block, and a main contact block is provided at the other end of the bimetallic strip. A secondary contact block is provided in the cavity.

[0019] The clamping blocks are located on the outer wall of the lower mold. There are four clamping blocks, and they are all fixedly connected to the outer wall of the lower mold. Clamping grooves are opened at the bottom end of the upper mold. The clamping blocks are matched with the clamping grooves. Due to the structure of the clamping grooves, the gap between the upper mold and the lower mold is irregular, so as to effectively avoid the leakage of the temperature of the internal silica sol. A cavity is opened inside the clamping blocks. A bimetallic strip is provided in the cavity. One end of the bimetallic strip is fixedly connected to the inner wall of the clamping block. Thus, when the mold is filled with silica sol, the temperature of the silica sol itself will affect the bimetallic strip. The principle is that when the temperature rises, the metal layer with a larger expansion coefficient will expand more, while the metal layer with a smaller expansion coefficient will expand less. This difference will cause the bimetallic strip to bend towards the side with a smaller expansion coefficient. After the silica sol is formed, the temperature will decrease, and the bimetallic strip will bend towards the side with a larger expansion coefficient and finally return to the initial state. When the temperature rises and the bimetallic strip bends, the distance between the main contact block and the secondary contact block will change. As the distance increases, the resistance value will increase; while when the distance decreases, the resistance value will decrease.

[0020] Further, the temperature control component includes a main semiconductor and a secondary semiconductor. Grooves are opened on the outer walls of the upper mold and the lower mold. The main semiconductor is provided in the groove and is fixedly connected to the inner wall of the groove. The secondary semiconductor is located on the side of the groove away from the main semiconductor, and the secondary semiconductor is fixedly connected to the inner wall of the groove.

[0021] The temperature control component is used to control the temperature of the silica sol in the mold. The main semiconductor and the secondary semiconductor are connected by wires to form a circuit. The main semiconductor and the secondary semiconductor are two different semiconductors. When an electric current passes through the circuit composed of two different semiconductors, heat absorption and heat release phenomena will occur at the contact points. The principle is that when electrons transition from a low energy level to a high energy level, they absorb heat to form a cold end, and when electrons transition from a high energy level to a low energy level, they release heat to form a hot end. The cooling and heating functions can also be switched by changing the direction of the current. The temperature control component is controlled by the temperature value detected by the bimetallic strip. The process is that when the silica sol enters the mold, the temperature control component is first used to maintain the overall temperature of the mold to be the same to prevent temperature difference. When the silica sol is filled, the temperature control component is used to cool the silica sol in the mold as a whole for molding.

[0022] Furthermore, a rotating component is provided at the bottom end of the storage bin. The rotating component includes a column and a rotating motor. The column is located on the upper surface of the base and is fixedly connected to the base. There are two columns. The storage bin is provided between the two columns and is rotatably connected to the columns. A rotating motor is provided on one side of the column. The fixed end of the rotating motor is located on the side of the column away from the storage bin and is fixedly connected to the column. The output end of the rotating motor is fixedly connected to the storage bin.

[0023] Specifically, the rotating component is used to control the inclination of the storage bin so that the silica sol in the storage bin flows to the discharging component and then flows to the mold through the discharging component to realize the pouring process. The column is vertically and fixedly connected to the base. There are two columns. The storage bin is provided between the two columns and is rotatably connected to the outer wall of the storage bin. The fixed end of the rotating motor is fixedly connected to the column. The rotating motor is located on the side of the column away from the storage bin. The output end of the rotating motor penetrates the column and is connected to the storage bin. The output end of the rotating motor is fixedly connected to the outer wall of the storage bin. The rotating motor serves as a power source to control the inclination of the storage bin.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. In the present invention, the annular conductor block is used to eliminate the bubbles in the silica sol inside the storage bin. After the annular conductor block is energized with positive charges, it will attract the silica sol particles in the silica sol, so that they move in a directional circular motion under the traction of the annular conductor block, and finally achieve the stirring effect to reduce the generation of bubbles.

[0025] 2. In the present invention, the conductor plate is connected to an external power source to generate positive charges. The silica sol particles are charged on the surface, usually negatively charged, forming a double-layer structure. Under the action of an external electric field, that is, the conductor plate, the charged particles will move directionally towards the electrode with the opposite charge. The achieved effect is that by adjusting the electric field strength, the migration speed of the particles can be controlled, thereby adjusting the flow direction and speed of the silica sol.

[0026] 3. In the present invention, the conductor plate cooperates with the shunt pipe, thereby effectively controlling the flow rate and flow volume of the silica sol in the discharging assembly. Among them, the coil is used to detect the flow volume of the silica sol, so that the magnitude of the electric field of the conductor plate changes according to the magnitude of the induced electricity generated by the coil. Under the guidance of the conductor plate, the silica sol flowing out reaches the set value.

[0027] 4. When the silica sol is poured into the mold in the present invention, the temperature of the mold is detected based on the principle that the bimetallic strip will deform under the influence of temperature. Then, through the operation of the main semiconductor and the secondary semiconductor, the overall temperature of the mold is maintained at the same level. Furthermore, according to the flow volume detected by the coil, the temperature of the mold is adjusted. When pouring the silica sol, the semiconductor is used to maintain the temperature. After the silica sol is poured, the semiconductor is used to cool down the overall mold, thereby improving the forming efficiency and the quality of the casting. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic structural diagram of the whole of the present invention; Figure 2 is a schematic structural diagram of the desktop assembly of the present invention; Figure 3 is a schematic structural diagram of the storage assembly of the present invention; Figure 4 is a schematic structural diagram of the cover plate of the present invention; Figure 5 is a schematic structural diagram of the annular conductor block of the present invention; Figure 6 is a schematic structural diagram of the discharging assembly of the present invention; Figure 7 is a schematic structural diagram of the main conductor plate of the present invention; Figure 8 is a schematic structural diagram of the shunt pipe of the present invention; Figure 9 is a schematic structural diagram of the mold assembly of the present invention; Figure 10 is a schematic structural diagram of the connecting member of the present invention; Figure 11 is a schematic structural diagram of the lower mold of the present invention.

[0029] In the figure: 1. Desktop component; 11. Base; 12. Workbench surface; 13. Conveyor belt; 14. Support column; 2. Storage component; 21. Storage bin; 211. Cavity; 212. Discharge port; 22. Cover plate; 23. Ring conductor block; 24. Connector; 3. Temperature control component; 31. Main semiconductor; 32. Sub-semiconductor; 4. Discharge component; 41. Discharge pipe; 42. Main conductor plate; 43. Sub-conductor plate; 44. Housing; 45. Diverging pipe; 451. Flow guiding groove; 5. Die component; 51. Upper die; 511. Pouring port; 52. Lower die; 53. Splash-proof block; 54. Clamping block; 55. Bimetallic strip; 56. Main contact block; 57. Sub-contact block; 6. Detection component; 61. Coil; 62. Electrode; 7. Rotating component; 71. Column; 72. Rotating motor. Detailed implementation manners

[0030] Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0031] As Figures 1 to 11 shown, the present invention provides a technical solution for a precision investment silica sol quantitative pouring casting equipment and a casting process. The forging equipment includes a desktop component 1, a storage component 2 and a temperature control component 3. A discharge component 4 is provided at the bottom end of the storage component 2. The output end of the discharge component 4 is provided with a die component 5. The die component 5 is located above the desktop component 1. The discharge component 4 is used to control the flow rate of the silica sol. The temperature control component 3 is provided on the die component 5 and is used to quickly cool the die.

[0032] Specifically, the desktop component 1 is used for transporting and placing the die component 5. The die component 5 is used to form the silica sol. Then, the temperature control component 3 on the die component 5 is used to cool the silica sol in the die. The temperature control component 3 is used to quickly form the silica sol and can also eliminate the bubbles in the silica sol, thereby improving the forming accuracy of the casting and the service life of the die (effect). The storage component 2 is used to store the high-temperature silica sol and pour it through the discharge component 4 at the input end of the module component. Bubbles will be generated during the transportation of the silica sol, which will cause pores on the surface or inside of the casting when the silica sol is formed. These pores will affect the appearance quality of the casting. The storage component 2 not only maintains the high temperature of the silica sol itself, but also removes the bubbles in the silica sol. Among them, the die component 5 is located below the output end of the discharge component 4.

[0033] As Figures 1 to 4As shown, the storage component 2 includes a storage bin 21 and a cover plate 22. A cavity 211 is formed in the outer shell of the storage bin 21. An annular conductor block 23 is arranged in the cavity 211. The annular conductor block 23 is sleeved on the storage bin 21 and is electrically connected to an external power supply. An outlet 212 is formed on one side of the storage bin 21. A connecting piece 24 is arranged outside the outlet 212. The connecting piece 24 is fixedly connected to the bottom end of the storage bin 21. The cover plate 22 is snap-connected to the top end of the storage bin 21.

[0034] Specifically, an outlet 212 is formed on one side of the storage bin 21, which is the output end. A cavity 211 is formed in the outer wall of the storage bin 21. The cavity 211 and the storage bin 21 are on the same central axis. An annular conductor block 23 is arranged in the cavity 211. The annular conductor block 23 is used to eliminate the bubbles in the silica sol inside the storage bin 21. The principle is that after positive charges are introduced into the annular conductor block 23, the silica sol particles in the silica sol will be attracted. The surfaces of the silica sol particles usually carry negative charges, so they will move in a directional circular motion under the traction of the annular conductor block 23, finally achieving a stirring effect and reducing the generation of bubbles. The bottom end of the cover plate 22 cooperates with the top end of the storage bin 21. The cover plate 22 is used to seal the storage bin 21 and reduce the temperature loss rate of the silica sol. An inlet is formed at the top end of the storage bin 21 and is connected to an external pipeline, so as to reduce the contact area between the silica sol and the external air and reduce the probability of bubbles and impurities in the silica sol.

[0035] As Figures 6 to 8 shown, the discharging component 4 includes a discharging pipe 41 and a main conductor plate 42. The input end of the discharging pipe 41 is communicated with the output end of the storage bin 21. The discharging pipe 41 is fixedly connected to the connecting piece 24. Main conductor plates 42 are arranged at the upper and lower ends of the discharging pipe 41. The main conductor plates 42 are fixedly connected to the discharging pipe 41. A shunt pipe 45 is arranged at one end of the discharging pipe 41 far from the input end. The shunt pipe 45 is communicated with the discharging pipe 41. Three output ends are formed on the shunt pipe 45. Secondary conductor plates 43 are arranged at the upper and lower ends of the shunt pipe 45. The secondary conductor plates 43 are fixedly connected to the shunt pipe 45. A housing 44 wraps the main conductor plates 42 and the secondary conductor plates 43. A diversion groove 451 is formed inside the shunt pipe 45. The diversion groove 451 is used to reduce the flow rate of the silica sol. A detection component 6 is arranged at the output end of the shunt pipe 45. The detection component 6 is used to detect the flow rate of the silica sol.

[0036] Specifically, the discharging assembly 4 functions such that the conveying pipe is located at the bottom end of the storage bin 21. The discharging pipe 41 is fixedly connected to the connecting member 24, and the discharging pipe 41 is communicated with the output end at the bottom end of the storage bin 21. The discharging pipe 41 is a single pipe, and the shunt pipe 45 is a three-pipe for shunting. The conductor plate is connected to an external power supply to generate positive charges. The silica sol particles are charged on the surface, usually negatively charged, forming a double-layer structure. Under the action of an external electric field, that is, the conductor plate, the charged particles will move directionally towards the electrode 62 with the opposite charge. By controlling the direction and intensity of the electric field, the flow of particles in the silica sol can be regulated. The achieved effect is that by adjusting the electric field intensity, the migration speed of the particles can be controlled, thereby regulating the flow direction and speed of the silica sol. At low voltages, the electric field intensity is low, and the flow speed of the silica sol is slow. The slower the flow rate, the smaller the flow. While at high voltages, the electric field intensity increases, the flow speed accelerates, the faster the flow rate, the larger the flow. The main conductor plate 42 and the secondary conductor plate 43 have the same principle. The number of secondary conductor plates 43 is the same as the number of output ends of the shunt pipe 45. Thus, by adjusting the electric field intensity of the secondary conductor plate 43, multiple silica sol output ends with different flow rates can be achieved. The detection assembly 6 is used to detect the flow rate of the shunt pipe 45 and change the electric field intensity of the conductor plate according to the detected flow rate. It should also be supplemented that the conductor plate refers to the main conductor plate 42 and the secondary conductor plate 43.

[0037] As Figure 8 shown, the detection assembly 6 includes a coil 61 and an electrode 62. The coil 61 is sleeved at the output end of the shunt pipe 45, and electrodes 62 are provided on both sides of the coil 61.

[0038] Specifically, the coil 61 and the shunt pipe 45 are on the same central axis. The coil 61 is used to detect the silica sol flow rate. The principle is that when the silica sol flows through the coil 61, the fluid will cut the magnetic force lines, and thus an induced electromotive force will be generated in the fluid. The silica sol flow rate can be known through the magnitude of the induced electromotive force. Among them, the magnitude of the induced electromotive force is proportional to the flow velocity of the fluid, the magnetic field intensity, and the pipe diameter. When the magnetic field intensity and the pipe diameter remain unchanged, the flow rate has a linear relationship with the induced electromotive force. Among them, the electrode 62 is used to capture the induced electromotive force, and the electrode 62 is electrically connected to an external converter to convert the induced electromotive force into a flow rate value.

[0039] As Figure 1 、 Figure 2 shown, the desktop assembly 1 includes a base 11 and a workbench surface 12. The base 11 is located on the horizontal ground. A support column 14 is provided on the upper surface of the base 11. The support column 14 is fixedly connected to the upper surface of the base 11. A workbench surface 12 is provided at the top of the support column 14. The workbench surface 12 is fixedly connected to the support column 14. A conveyor belt 13 is provided on the workbench surface 12, and a mold assembly 5 is provided on the conveyor belt 13.

[0040] Specifically, the desktop component 1 serves as a support column 14 to position the mold component 5 at the output end of the discharging component 4. The support column 14 is vertically and fixedly connected to the base 11, and the top of the support column 14 is fixedly connected to the workbench surface 12. A conveyor belt 13 is provided on the surface of the workbench surface 12, and the conveyor belt 13 is used to drive a plurality of mold components 5, thus facilitating the rapid pouring of a plurality of molds.

[0041] As Figures 9 to 11 shown in the figure, the mold component 5 includes an upper mold 51 and a lower mold 52. The lower mold 52 is located on the upper surface of the conveyor belt 13, and the upper mold 51 is provided at the top of the lower mold 52. The upper mold 51 and the lower mold 52 are snap-connected. A pouring port 511 is opened at the top of the upper mold 51. A splash-proof block 53 is provided outside the pouring port 511, and the splash-proof block 53 is fixedly connected to the upper mold 51. A temperature control component 3 is provided outside the lower mold 52.

[0042] Specifically, the mold component 5 is used to receive the silica sol at the output end of the discharging component 4 and form the silica sol inside the mold. The lower mold 52 is located on the conveyor belt 13 and moves through the conveyor belt 13 to achieve the rapid movement of a plurality of molds, thus facilitating the rapid pouring of a plurality of molds. The upper mold 51 and the lower mold 52 are snap-connected. The pouring port 511 of the upper mold 51 serves as the input end of the mold component 5. The splash-proof block 53 is located at the pouring port 511 of the upper mold 51. Since the bubbles are eliminated due to the action of the annular conductor block 23 during the previous transportation process, and also because the conductor plate achieves a drainage effect, the conductor plate controls the flow rate and speed of the silica sol through the charge, so that when the silica sol reaches the mold, its flow rate and pores are controlled, thus effectively achieving a splash-proof effect. The temperature control component 3 is used to control the silica sol inside the mold.

[0043] As Figure 10 shown in the figure, a snap block 54 is provided on the outer wall of the lower mold 52, and the snap block 54 is fixedly connected to the lower mold 52. A snap groove is opened on the outer wall of the upper mold 51, and the snap block 54 is matched with the snap groove. A cavity is opened inside the snap block 54, and a bimetallic strip 55 is provided in the cavity. One end of the bimetallic strip 55 is fixedly connected to the inner wall of the snap block 54, and a main contact block 56 is provided at the other end of the bimetallic strip 55. A secondary contact block 57 is provided in the cavity.

[0044] Specifically, the clamping blocks 54 are located on the outer wall of the lower mold 52. There are four clamping blocks 54, and they are all fixedly connected to the outer wall of the lower mold 52. A clamping groove is formed at the bottom end of the upper mold 51. The clamping blocks 54 are matched with the clamping groove. Due to the structure of the clamping groove, the gap between the upper mold 51 and the lower mold 52 is irregular, so as to effectively avoid the leakage of the temperature of the internal silica sol. A cavity is formed in the clamping block 54, and a bimetallic strip 55 is arranged in the cavity. One end of the bimetallic strip 55 is fixedly connected to the inner wall of the clamping block 54. Thus, when the mold is filled with silica sol, the temperature of the silica sol itself will affect the bimetallic strip 55. The principle is that when the temperature rises, the metal layer with a larger expansion coefficient will expand more, while the metal layer with a smaller expansion coefficient will expand less. This difference will cause the bimetallic strip 55 to bend towards the side with a smaller expansion coefficient. After the silica sol is formed, the temperature will decrease, and the bimetallic strip 55 will bend towards the side with a larger expansion coefficient and finally return to the initial state. When the temperature rises and the bimetallic strip 55 bends, the distance between the main contact block 56 and the secondary contact block 57 will change. As the distance increases, the resistance value will increase; while when the distance decreases, the resistance value will decrease.

[0045] As Figure 11 shown, the temperature control component 3 includes a main semiconductor 31 and a secondary semiconductor 32. Grooves are formed on the outer walls of the upper mold 51 and the lower mold 52. The main semiconductor 31 is arranged in the groove and fixedly connected to the inner wall of the groove. The secondary semiconductor 32 is located on the side of the groove far from the main semiconductor 31 and is fixedly connected to the inner wall of the groove.

[0046] Specifically, the temperature control component 3 is used to control the temperature of the silica sol in the mold. The main semiconductor 31 and the secondary semiconductor 32 are connected by wires to form a circuit. The main semiconductor 31 and the secondary semiconductor 32 are two different semiconductors. Thus, when an electric current passes through the circuit composed of two different semiconductors, heat absorption and heat release phenomena will occur at the contact points. The principle is that when electrons transition from a low energy level to a high energy level, heat is absorbed to form a cold end, while when electrons transition from a high energy level to a low energy level, heat is released to form a hot end. The switching of the refrigeration and heating functions can also be achieved by changing the direction of the electric current. The temperature control component 3 is controlled to work by the temperature value detected by the bimetallic strip 55. The process is that when the silica sol enters the mold, the temperature control component 3 is first used to maintain the temperature of the mold. After the silica sol is filled, the temperature control component 3 is used to cool the mold to form.

[0047] As Figure 3As shown in the figure, a rotating assembly 7 is provided at the bottom end of the storage bin 21. The rotating assembly 7 includes a column 71 and a rotating motor 72. The column 71 is located on the upper surface of the base 11, and the column 71 is fixedly connected to the base 11. There are two columns 71. The storage bin 21 is arranged between the two columns 71. The column 71 is rotatably connected to the storage bin 21. A rotating motor 72 is arranged on one side of the column 71. The fixed end of the rotating motor 72 is located on the side of the column 71 away from the storage bin 21, and the fixed end of the rotating motor 72 is fixedly connected to the column 71. The output end of the rotating motor 72 is fixedly connected to the storage bin 21.

[0048] Specifically, the rotating assembly 7 is used to control the inclination of the storage bin 21, so that the silica sol in the storage bin 21 flows to the discharging assembly 4, and then flows to the mold through the discharging assembly 4 to realize the pouring process. The column 71 is vertically and fixedly connected to the base 11. There are two columns 71. The storage bin 21 is arranged between the two columns 71. The column 71 is rotatably connected to the outer wall of the storage bin 21. The fixed end of the rotating motor 72 is fixedly connected to the column 71. The rotating motor 72 is located on the side of the column 71 away from the storage bin 21. The output end of the rotating motor 72 passes through the column 71 and is connected to the storage bin 21. The output end of the rotating motor 72 is fixedly connected to the outer wall of the storage bin 21. The rotating motor 72 serves as a power source to control the inclination of the storage bin 21.

[0049] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A quantitative casting equipment for investment silica sol, characterized in that: The forging equipment comprises a desktop component (1), a storage component (2) and a temperature control component (3); a discharge component (4) is provided at the bottom end of the storage component (2); a mold component (5) is provided at the output end of the discharge component (4); the mold component (5) is located above the desktop component (1); the discharge component (4) is used to control the flow rate of the silica sol; a temperature control component (3) is provided on the mold component (5); and the temperature control component (3) is used to quickly cool the mold.

2. The investment silica sol quantitative pouring casting equipment according to claim 1, characterized in that: The storage assembly (2) comprises a storage bin (21) and a cover plate (22); the outer shell of the storage bin (21) is provided with a cavity (211); an annular conductor block (23) is arranged in the cavity (211); the annular conductor block (23) is sleeved on the storage bin (21); the annular conductor block (23) is electrically connected to an external power supply; a discharge port (212) is provided on one side of the storage bin (21); a connecting piece (24) is arranged outside the discharge port (212); the connecting piece (24) is fixedly connected to the bottom end of the storage bin (21); and the cover plate (22) is snap-connected to the top end of the storage bin (21).

3. The investment silica sol quantitative pouring casting equipment according to claim 2, characterized in that: The discharge assembly (4) comprises a discharge pipe (41) and a main conductor plate (42); the input end of the discharge pipe (41) is connected to the output end of the storage bin (21); the discharge pipe (41) is fixedly connected to the connecting piece (24); the upper and lower ends of the discharge pipe (41) are provided with main conductor plates (42); the main conductor plate (42) is fixedly connected to the discharge pipe (41); the end of the discharge pipe (41) away from the input end is provided with a shunt pipe (45); the shunt pipe (45) is connected to the discharge pipe (41); the shunt pipe (45) is connected to the discharge pipe (41); The flow tube (45) is provided with three output ends. The upper and lower ends of the shunt tube (45) are provided with auxiliary conductor plates (43). The auxiliary conductor plates (43) are fixedly connected to the shunt tube (45). The main conductor plates (42) and the auxiliary conductor plates (43) are wrapped with a shell (44). The shunt tube (45) is provided with a guide groove (451) inside. The guide groove (451) is used to reduce the flow rate of the silica sol. The output end of the shunt tube (45) is provided with a detection component (6). The detection component (6) is used to detect the flow rate of the silica sol.

4. The investment silica sol quantitative pouring casting equipment according to claim 3, characterized in that: The detection component (6) comprises a coil (61) and an electrode (62); the coil (61) is sleeved at the output end of the shunt tube (45); and electrodes (62) are provided on both sides of the coil (61).

5. The investment silica sol quantitative pouring casting equipment according to claim 4, characterized in that: The desktop assembly (1) comprises a base (11) and a work surface (12); the base (11) is located on a horizontal ground; a support column (14) is provided on the upper surface of the base (11); the support column (14) is fixedly connected to the upper surface of the base (11); a work surface (12) is provided on the top of the support column (14); the work surface (12) is fixedly connected to the support column (14); the work surface (12) is provided with a conveyor belt (13); and a mold assembly (5) is provided on the conveyor belt (13).

6. The investment silica sol quantitative pouring casting equipment according to claim 5, characterized in that: The mold assembly (5) comprises an upper mold (51) and a lower mold (52); the lower mold (52) is located on the upper surface of the conveyor belt (13); the upper mold (51) is provided at the top of the lower mold (52); the upper mold (51) and the lower mold (52) are connected by snap-fitting; a pouring port (511) is provided at the top of the upper mold (51); a splash-proof block (53) is provided outside the pouring port (511); the splash-proof block (53) is fixedly connected to the upper mold (51); and a temperature control assembly (3) is provided outside the lower mold (52).

7. The investment silica sol quantitative pouring casting equipment according to claim 6, characterized in that: The outer wall of the lower mold (52) is provided with a clamping block (54), the clamping block (54) is fixedly connected to the lower mold (52), the outer wall of the upper mold (51) is provided with a clamping groove, the clamping block (54) cooperates with the clamping groove, a cavity is provided in the clamping block (54), a bimetallic strip (55) is provided in the cavity, one end of the bimetallic strip (55) is fixedly connected to the inner wall of the clamping block (54), the other end of the bimetallic strip (55) is provided with a main contact block (56), and an auxiliary contact block (57) is provided in the cavity.

8. The investment silica sol quantitative pouring casting equipment according to claim 7, characterized in that: The temperature control component (3) comprises a main semiconductor (31) and a secondary semiconductor (32); the outer walls of the upper mold (51) and the lower mold (52) are provided with a groove body, the main semiconductor (31) is arranged in the groove body, the main semiconductor (31) is fixedly connected to the inner wall of the groove body, the secondary semiconductor (32) is located on a side of the groove body away from the main semiconductor (31), and the secondary semiconductor (32) is fixedly connected to the inner wall of the groove body.

9. The investment silica sol quantitative pouring casting equipment according to claim 8, characterized in that: A rotating assembly (7) is provided at the bottom end of the storage bin (21), and the rotating assembly (7) comprises a column (71) and a rotating motor (72). The column (71) is located on the upper surface of the base (11), and the column (71) is fixedly connected to the base (11). Two columns (71) are provided, and a storage bin (21) is provided between the columns (71). The column (71) is rotatably connected to the storage bin (21). A rotating motor (72) is provided on one side of the column (71), and a fixed end of the rotating motor (72) is located on a side of the column (71) away from the storage bin (21). The fixed end of the rotating motor (72) is fixedly connected to the column (71), and an output end of the rotating motor (72) is fixedly connected to the storage bin (21).

10. The casting process of the investment silica sol quantitative pouring casting equipment according to claim 1, characterized in that: The following steps are involved: S1: first pouring silica sol into the storage bin (21), and then controlling the tilting of the storage bin (21) by rotating the motor (72); S2: When the silica sol is in the storage bin (21), when the annular conductor block (23) is charged with positive charge, the silica sol particles in the silica sol are pulled to move in a directional circular motion, thereby stirring the silica sol. The stirring action can make the gas and inclusions in the silica sol float up, thereby removing the bubbles in the silica sol. Then, under the drainage of the main conductor plate (42), the silica sol will flow from the storage bin (21) into the discharge pipe (41), and then flow to the diversion pipe (45). By controlling the three auxiliary conductor plates (43), a plurality of silica sols with different flow rates can be achieved at the same time for casting. The main conductor plate (42) and the auxiliary conductor plate (43) cooperate with the negative charge of the silica sol particles through their own positive charge to achieve the drainage and quantitative effects; S3: The silica sol flows into the mold component (5) through the output end of the discharge component (4). During pouring, the silica sol is poured into the mold, wherein the splash-proof block (53) plays a splash-proof role. When the silica sol enters the mold, its bimetallic strip (55) is deformed by temperature, and the distance between its main contact block (56) and the auxiliary contact block (57) changes, and the resistance value changes. According to the detected temperature value, the main semiconductor (31) and the auxiliary semiconductor (32) are controlled to work. When the silica sol enters the mold, the temperature control component (3) is first used to maintain the overall temperature of the mold to be the same. When the silica sol is filled, the temperature control component (3) is used to cool the entire silica sol in the mold to form, thereby accelerating the silica sol forming and improving product quality.

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