Exhaust device and substrate processing apparatus

Abstract

The invention provides an exhaust device and a substrate processing apparatus. The exhaust apparatus includes: a bowl provided around a support unit that supports and rotates a substrate; an exhaust duct configured to surround a side portion of the bowl and connected to the side portion of the bowl; and a discharge duct formed outside the exhaust duct in a rotation direction of the support unit.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of priority of Korean Patent Application No. 10 - 2023 - 0169879, filed on November 29, 2023, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to an exhaust device for exhausting gas in a processing chamber and substrate processing equipment. Background Art

[0004] To fabricate semiconductor devices, various processes such as cleaning, deposition, lithography, and ion implantation are performed. Among these processes, the lithography process may include a coating process for forming a film by applying a photosensitive liquid such as photoresist onto the surface of a substrate, an exposure process for transferring a circuit pattern onto the film formed on the substrate, and a development process for selectively removing the film formed on the substrate from the exposed area or the opposite area.

[0005] A substrate processing facility used in a coating process for forming a film by applying a photosensitive liquid such as photoresist may include a cup - shaped bowl having a processing space, a support unit for supporting and rotating the substrate in the processing space, and a nozzle unit for supplying photoresist to the substrate placed on the support unit.

[0006] An exhaust unit is connected to the bottom wall of the bowl to exhaust the gas in the processing space. Generally, the exhaust unit includes an integrated duct connecting a plurality of exhaust pipes, the plurality of exhaust pipes are respectively connected to a plurality of bowls, and the plurality of processing spaces can be exhausted simultaneously through the integrated duct. Summary of the Invention

[0007] One aspect of the present disclosure is to provide an exhaust device and substrate processing equipment capable of improving exhaust efficiency by minimizing the flow resistance of gas.

[0008] According to one aspect of the present disclosure, an exhaust device includes: a bowl disposed around a support unit for supporting and rotating a substrate; an exhaust duct configured to surround a side portion of the bowl and connected to the side portion of the bowl; and a discharge duct formed outside the exhaust duct in the rotation direction of the support unit.

[0009] A plurality of communication holes may be formed on the side portion of the bowl and spaced apart from each other in the circumferential direction, and the bowl and the exhaust duct may be connected through the plurality of communication holes.

[0010] The plurality of communication holes may be formed to be spaced upward from the inner lower surface of the bowl.

[0011] The inner lower surface of the bowl may be formed to slope downward from the side portion of the bowl.

[0012] The discharge pipes may be formed on one side and the other side of the exhaust pipe, respectively.

[0013] The exhaust device may further include a plurality of vanes arranged to be spaced apart from each other within the exhaust pipe and formed to slope outward in the rotational direction of the support unit.

[0014] The vanes may have a streamlined cross-section.

[0015] The vanes may be configured to have a variable tilt angle.

[0016] According to another aspect of the present disclosure, a substrate processing apparatus includes: a processing chamber; a support unit that supports and rotates a substrate within the processing chamber; a nozzle unit that discharges a chemical solution onto the substrate; a bowl disposed around the periphery of the support unit; an exhaust pipe configured to surround a side portion of the bowl and connected to the side portion of the bowl; and a discharge pipe formed outside the exhaust pipe in the rotational direction of the support unit.

[0017] According to another aspect of the present disclosure, a substrate processing apparatus includes: a processing chamber; a support unit that supports and rotates a substrate within the processing chamber; a nozzle unit that discharges a chemical solution onto the substrate; a bowl disposed around the periphery of the support unit and having a plurality of communication holes formed in a circumferential direction and spaced apart from each other on a side portion of the bowl; an exhaust pipe configured to surround the side portion of the bowl and connected to the side portion of the bowl through the plurality of communication holes; a discharge pipe connected to the exhaust pipe and formed outside the exhaust pipe in the rotational direction of the support unit; and a plurality of vanes arranged to be spaced apart from each other within the exhaust pipe and formed to slope outward in the rotational direction of the support unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a perspective view showing an exhaust device according to the related art;

[0020] Figure 2 is a perspective view showing a substrate processing facility according to an embodiment of the present disclosure;

[0021] Figure 3 is Figure 2Top view of a substrate processing facility;

[0022] Figure 4 is Figure 3 View of the substrate processing facility in the A-A direction;

[0023] Figure 5 is Figure 3 View of the substrate processing facility in the B-B direction;

[0024] Figure 6 is a cross-sectional view showing the interior of a substrate processing apparatus according to an embodiment of the present disclosure;

[0025] Figure 7 and Figure 8 is showing Figure 6 A perspective view of the exhaust device of the substrate processing apparatus;

[0026] Figure 9 and Figure 10 is showing Figure 7 and Figure 8 A cross-sectional view of the exhaust device;

[0027] Figure 11 is showing Figure 7 and Figure 8 A cut-away perspective view of the exhaust device; and

[0028] Figure 12 is Figure 11 An enlarged view of part A. Detailed Description of the Embodiments

[0029] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains can easily practice these embodiments. When describing the present disclosure, if a detailed description of related known functions or structures is considered to unnecessarily divert the gist of the present disclosure, such a description will be omitted, but those skilled in the art will understand. Similarly, throughout the specification, like reference numerals are used for like components. In the present disclosure, terms such as "above", "upper", "upper surface", "below", "lower", "lower surface", "side surface", etc. are determined based on the drawings, and in fact, the terms can be changed according to the orientation in which the device or element is arranged.

[0030] It will be understood that when an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected to" another element, no intervening elements are present. Further, unless explicitly stated to the contrary, the word "comprise" and its variations such as "comprises" or "comprising" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0031] Figures 2 to 5 FIG. is a schematic view showing a substrate processing facility according to an embodiment of the present disclosure, wherein Figure 2 is a perspective view showing the substrate processing facility, Figure 3 is Figure 2 a top view of the substrate processing facility of Figure 4 is Figure 3 a view of the substrate processing facility of Figure 5 is Figure 3 a view of the substrate processing facility in the A-A direction, and

[0032] Reference Figures 2 to 5 , the substrate processing facility 1 includes a load port 100, a transfer module 200, a buffer module 300, a coating and developing module 400, and an interface module 600. The load port 100, the transfer module 200, the buffer module 300, the coating and developing module 400, and the interface module 600 are arranged in a row in one direction.

[0033] Hereinafter, the direction in which the load port 100, the transfer module 200, the buffer module 300, the coating and developing module 400, and the interface module 600 are arranged is referred to as the first direction Y, the direction perpendicular to the first direction Y when viewed from above is referred to as the second direction X, and the direction perpendicular to the first direction Y and the second direction X is referred to as the third direction Z.

[0034] The substrate S moves while being stored in a wafer carrier (cassette) C. The wafer carrier C has a structure that can be sealed from the outside. For example, a front opening unified pod (FOUP) having a door at the front can be used as the wafer carrier C.

[0035] Hereinafter, the load port 100, the transfer module 200, the buffer module 300, the coating and developing module 400, and the interface module 600 will be described in detail.

[0036] The load port 100 has a mounting plate 120, and a wafer carrier C including the substrate S is disposed on the mounting plate 120. A plurality of mounting plates 120 are provided, and the mounting plates 120 are arranged in a row in the second direction X. At Figure 3In the example, four mounting plates 120 are shown, but the number can be changed. The transfer module 200 transfers the substrate S between the wafer carrier C and the buffer module 300 disposed on the mounting plate 120 of the loading port 100. The transfer module 200 includes a frame 210, a transfer robot 220, and a guide rail 230. The frame 210 has the shape of a rectangular parallelepiped with a hollow interior and is disposed between the loading port 100 and the buffer module 300. The frame 210 of the transfer module 200 may be disposed at a height lower than the frame 310 of the buffer module 300. The transfer robot 220 and the guide rail 230 are disposed within the frame 210. The transfer robot 220 is provided such that the hand 221 for directly handling the substrate S can move and rotate in the first direction Y, the second direction X, and the third direction Z. The transfer robot 220 includes a hand 221, an arm 222, a support member 223, and a base 224. The hand 221 is fixedly mounted on the arm 222. The arm 222 has an elastic structure and a rotatable structure. The support member 223 is disposed such that its longitudinal direction corresponds to the third direction Z. The arm 222 is coupled to the support member 223 so as to be able to move along the support member 223. The support member 223 is fixedly connected to the base 224. The guide rail 230 is disposed such that its longitudinal direction corresponds to the second direction X. The base 224 is coupled to the guide rail 230 so as to be able to move linearly along the guide rail 230. In addition, although not shown, the frame 210 is also provided with an opener for opening and closing the door of the wafer carrier C.

[0037] The buffer module 300 includes a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 has the shape of a rectangular parallelepiped with a hollow interior and is disposed between the indexing module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed from below in the third direction Z. The first buffer 320 is located at a height corresponding to the coating module 401 of the coating and developing module 400, and the second buffer 330 and the cooling chamber 350 are located at a height corresponding to the developing module 402 of the coating and developing module 400. The first buffer robot 360 is positioned to be spaced apart from the second buffer 330, the cooling chamber 350, and the first buffer 320 by a predetermined distance in the second direction X. The first buffer 320 and the second buffer 330 each temporarily store a plurality of substrates S. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed in the housing 331 and are spaced apart from each other in the third direction Z. One substrate S is disposed on each support 332. The housing 331 has openings in the direction where the indexing robot 220 is provided and in the direction where the first buffer robot 360 is provided, such that the indexing robot 220 and the first buffer robot 360 can load the substrate S into the supports 332 within the housing 331 or unload the substrate S from the supports 332. The first buffer 320 has a structure substantially similar to that of the second buffer 330. However, the housing 321 of the first buffer 320 has openings in the direction where the first buffer robot 360 is provided and in the direction where the coating component robot 432 located in the coating module 401 is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. In an example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 332 provided in the first buffer 320.

[0038] The first buffer robot 360 transfers the substrate S between the first buffer 320 and the second buffer 330, as Figure 3As shown. The first buffer robot 360 includes a hand 361, an arm 362, and a support 363. The hand 361 is fixedly mounted on the arm 362. The arm 362 has a flexible structure such that the hand 361 can move in the second direction X. The arm 362 is coupled to the support 363 such that it can linearly move along the support 363 in the third direction Z. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support 363 may be arranged to be longer in the upward or downward direction than this. The first buffer robot 360 may be arranged such that the hand 361 can be driven on two axes only in the second direction X and the third direction Z.

[0039] The cooling chamber 350 cools each substrate S, as Figure 4 shown. The cooling chamber 350 includes a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate S is disposed and a cooling unit 353 for cooling the substrate S. Various methods (such as cooling using cooling water or cooling using a thermoelectric device) may be used as the cooling unit 353. In addition, the cooling chamber 350 may include a lift pin assembly for positioning the substrate S on the cooling plate 352. The housing 351 has openings in the direction where the indexing robot 220 is provided and in the direction where the developing part robot is provided, such that the indexing robot 220 and the developing part robot provided in the developing module 402 can load the substrate S onto the cooling plate 352 or unload the substrate S from the cooling plate 352. In addition, the cooling chamber 350 may include a door for opening and closing the above-mentioned openings.

[0040] In the coating module 401, before and after the resist coating process, a process of applying a photosensitive liquid (e.g., photoresist) onto the substrate S and a heat treatment process (e.g., heating and cooling) on the substrate S are performed. The coating module 401 has a coating chamber 410, a baking chamber section 500, and a transfer chamber 430. The coating chamber 410, the transfer chamber 430, and the baking chamber section 500 are sequentially arranged in the second direction X. That is, with respect to the transfer chamber 430, the coating chamber 410 is disposed on one side of the transfer chamber 430, and the baking chamber section 500 is disposed on the other side of the transfer chamber 430. A plurality of coating chambers 410 are provided, and a plurality of coating chambers 410 are provided in each of the first direction Y and the third direction Z. The baking chamber section 500 includes a plurality of baking chambers 510, and a plurality of baking chambers 510 are provided in each of the first direction Y and the third direction Z. The transfer chamber 430 is positioned in the first direction Y to be parallel to the first buffer 320 of the buffer module 300. A coating component robot 432 and a guide rail 433 are located inside the transfer chamber 430. The transfer chamber 430 has a substantially rectangular shape. The coating component robot 432 transfers the substrate S between the baking chamber 510, the coating chamber 410, and the first buffer 320 of the buffer module 300.

[0041] The guide rail 433 is positioned such that its longitudinal direction is parallel to the first direction Y. The guide rail 433 guides the coating component robot 432 to linearly move in the first direction Y. The coating component robot 432 has a hand 434, an arm 435, a support 436, and a base 437, as Figure 5 shown. The hand 434 is fixedly mounted on the arm 435. The arm 435 has an elastic structure such that the hand 434 can move in the horizontal direction. The support 436 is provided such that its longitudinal direction corresponds to the third direction Z. The arm 435 is coupled to the support 436 such that the arm 435 can linearly move along the support 436 in the third direction Z. The support 436 is fixedly coupled to the base 437, and the base 437 is coupled to the guide rail 433 such that the base 437 can move along the guide rail 433.

[0042] The coating chambers 410 may all have the same structure, but the types of chemical solutions used in each coating chamber 410 may be different from each other. The chemical solution may be a chemical solution for forming a photoresist film or an anti-reflection film. The following refers to Figure 6 a substrate processing apparatus including the coating chamber 410.

[0043] The baking chamber 510 has a support unit 511 in the internal processing space and a heater 512 built in the support unit 511. When the substrate S is disposed on the support unit 511, the coating component robot 432 performs heat treatment on the substrate S. For example, before applying photoresist, the baking chamber 510 performs a pre-baking process in which the substrate S is heated to a predetermined temperature to remove organic substances or moisture from the surface of the substrate S, a soft-baking process is performed after applying the photoresist to the substrate S, and after each heat treatment, a cooling process for cooling the substrate S is performed.

[0044] The interface module 600 connects the coating and developing module 400 to an external exposure apparatus 700. The interface module 600 includes an interface frame 610, a first interface buffer 620, a second interface buffer 630, and a transfer robot 640. The transfer robot 640 transfers the substrates transferred to the first interface buffer 620 and the second interface buffer 630 to the external exposure apparatus 700 after the coating and development of the substrates are completed. The first interface buffer 620 and the second interface buffer 630 include a housing 621 and a support 622, and the transfer robot 640 and the coating component robot 432 load / unload the substrate S onto / from the support 622.

[0045] Hereinafter, the structure of a substrate processing apparatus including a processing chamber will be described in detail. As an example, the processing chamber provided to the coating and developing module will be described. The processing chamber may be a chamber for forming a film (e.g., a protective film or an antireflection film) on a substrate. In addition, the processing chamber may be a chamber for supplying a developing solution to a substrate to develop the substrate.

[0046] Figure 6 is a cross-sectional view showing the inside of a substrate processing apparatus according to an embodiment of the present disclosure.

[0047] Reference Figure 6 , the substrate processing apparatus 1000 may include a processing chamber 1100, a support unit 1200, a nozzle unit 1300, and an exhaust device 1400.

[0048] The processing chamber 1100 is set to have a rectangular cylindrical shape with an internal space. An opening (not shown) may be formed on one side of the processing chamber 1100. The opening can be used as a passage through which the substrate S is loaded or unloaded. A door (not shown) is installed in the opening, and the door can open and close the opening. The fan filter unit 1110 may be disposed on the upper wall of the processing chamber 1100 to supply a downward air flow to the internal space. The fan filter unit 1110 may include a fan for introducing external air into the internal space and a filter for filtering the external air. A plurality of fan filter units 1110 may be respectively arranged above the plurality of bowls 1410. A plurality of support units 1200 and a plurality of nozzle units 1300 may be disposed in the internal space of the processing chamber 1100.

[0049] The support unit 1200 can support the substrate S in the internal space of the bowl 1410. In addition, the support unit 1200 can rotate the substrate S in the internal space of the bowl 1410. The support unit 1200 may include a support plate 1210, a drive shaft 1220, and a drive member 1230. The upper surface of the support plate 1210 may be set to a circular shape. The diameter of the support plate 1210 may be smaller than the diameter of the substrate S. The support plate 1210 is set to support the substrate S by vacuum pressure. Optionally, the support plate 1210 may have a mechanical clamping structure for supporting the substrate S. The drive shaft 1220 may be coupled to the center of the bottom surface of the support plate 1210, and a drive member 1230 for providing a rotational force to the drive shaft 1220 may be provided to the drive shaft 1220. The drive member 1230 may be a motor.

[0050] The nozzle unit 1300 may supply a chemical solution onto the substrate S. The nozzle unit 1300 may include a first nozzle 1310 and a second nozzle 1320. A plurality of first nozzles 1310 may be provided, and the plurality of first nozzles 1310 may supply a chemical solution to the substrate S provided to each support unit 1200. The first nozzles 1310 may be provided to supply the same type of chemical solution. According to an embodiment, the first nozzle 1310 may supply a rinse solution for cleaning the substrate S. For example, the rinse solution may be water. In another embodiment, the first nozzle 1310 may supply a removal solution for removing a photoresist from an edge region of the substrate S. For example, the removal solution may be a thinner. The first nozzle 1310 may rotate between a processing position and a standby position about its rotation axis. The processing position may be a position where the chemical solution is discharged onto the substrate S, and the standby position may be a position where the chemical solution waits in a first standby port 1311 between the processing units when the chemical solution is not discharged from the first nozzle 1310. The second nozzle 1320 supplies a processing solution to the substrate S provided to the support unit 1200. The processing solution may be a photoresist. The second nozzle 1320 may move along a guide between a first processing position, a second processing position, a third processing position, and a standby position. The first to third processing positions may be positions for supplying the processing solution to the substrate S supported by the plurality of support units 1200. The standby position may be a position where the photoresist waits in a second standby port 1321 located between the processing units when the photoresist is not discharged from the second nozzle 1320. Although not shown in the figure, a lifting drive member for adjusting the relative height of the support plate 1210 and the bowl 1410 may be provided.

[0051] The exhaust device 1400 may include a bowl 1410, an exhaust duct 1420, and a discharge duct 1430.

[0052] Here, a plurality of bowls 1410 may be arranged in the processing chamber 1100. Each of the plurality of bowls 1410 may have an internal space 1410a, and the internal space 1410a may be provided such that its upper portion is open.

[0053] In addition, a plurality of exhaust ducts 1420 may be arranged to be respectively installed in the plurality of bowls 1410. Each of the plurality of exhaust ducts 1420 may be connected to an integrated duct 1440 through a discharge duct 1430. Based on the arrangement direction of the plurality of exhaust ducts 1420, the integrated duct 1440 may be provided on one side. That is, the integrated duct 1440 may be provided such that its length direction is parallel to the arrangement direction of the plurality of exhaust ducts 1420. The integrated duct 1440 may include a decompression member 1441 that provides a fluid pressure for exhaust. For example, the decompression member 1441 may be a pump or a fan.

[0054] Meanwhile, before describing the exhaust device of the present disclosure in detail, the following describes the exhaust device of the prior art with reference to Figure 1 the accompanying drawings.

[0055] In the exhaust device 10 of the related art, the gas G flowing into the bowl 11 is discharged to the lower side of the bowl 11. To this end, an exhaust pipe 12 is connected to the lower part of the bowl 11, and the exhaust pipe 12 has a structure communicating with the bowl 11 through an exhaust portion 11a formed in the lower part of the bowl 11. When the chemical solution is discharged onto the substrate through the nozzle unit, the support unit provided inside the bowl 11 rotates the substrate. As a result of the rotation of the substrate due to the support unit, a swirling flow of the gas G occurs in the inner space of the bowl 11. If the flow rate of the swirling gas G increases in this way, the gas G cannot be discharged smoothly to the exhaust pipe 12 connected to the lower part of the bowl 11. In order to discharge the swirling gas G smoothly from the bowl 11, the gas G must flow smoothly downward toward the exhaust pipe 12, but its vertically erected exhaust portion 11a generates a significant flow resistance, hindering smooth exhaust. That is, in order for the gas G to pass through the exhaust portion 11a, the gas G flows upward along the outer surface of the exhaust portion 11a and then bends downward to flow into the interior of the exhaust portion 11a. However, due to the flow of the gas G, a significant flow resistance is generated.

[0056] As a result, the exhaust efficiency in the bowl 11 is reduced, and vortices are generated, which causes a problem that the substrate is not uniformly processed during processing.

[0057] Figure 7 and Figure 8 are perspective views of the exhaust device of the substrate processing apparatus showing Figure 6 the exhaust device of Figure 9 and Figure 10 are sectional views of the exhaust device showing Figure 7 and Figure 8 the exhaust device of

[0058] In addition, Figure 11 is a cutaway perspective view of the exhaust device showing Figure 7 and Figure 8 the exhaust device of Figure 12 and Figure 11 is an enlarged view of part A of

[0059] Referring to the drawings, the exhaust device 1400 according to an embodiment of the present disclosure is configured to discharge the gas G in the bowl 1410 without suddenly changing the flow direction in order to overcome the above problems of the related art. That is, the exhaust device 1400 of the present disclosure employs a structure in which the gas G in the bowl 1410 is discharged in the horizontal direction (i.e., laterally) by using centrifugal force.

[0060] Specifically, in the present disclosure, the bowl 1410 of the exhaust device 1400 is disposed around the support unit, and the exhaust pipe 1420 is installed in the side portion 1411 of the bowl 1410. That is, the exhaust pipe 1420 is configured to surround the side portion 1411 of the bowl 1410 while being connected to the side portion 1411 of the bowl 1410 to discharge the gas G that rotates due to the lateral rotation of the support unit in the bowl 1410. Therefore, in the exhaust device 1400 of the present disclosure, the gas G rotating in the bowl 1410 is laterally discharged to the exhaust pipe 1420 by centrifugal force without suddenly changing the flow direction, thereby minimizing the flow resistance to improve the exhaust efficiency and further forming a compact structure.

[0061] A plurality of communication holes 1411a are formed in the side portion 1411 of the bowl 1410, and the exhaust pipe 1420 is formed to communicate with the bowl 1410 through the plurality of communication holes 1411a. That is, the bowl 1410 and the exhaust pipe 1420 can communicate with each other through the plurality of communication holes 1411a. In addition, the plurality of communication holes 1411a are arranged to be spaced apart from each other in the circumferential direction of the bowl 1410, and thus, during rotation, the gas G inside the bowl 1410 uniformly flows to the exhaust pipe 1420 through the plurality of communication holes 1411a.

[0062] In addition, the plurality of communication holes 1411a can be formed to be spaced upward from the inner lower surface of the bowl 1410. That is, the plurality of communication holes 1411a are formed at a certain height of the side portion 1411 of the bowl 1410, rather than at the lower side of the bowl 1410, so that the chemical solution L and the gas G flowing into the bowl 1410 can be separated. In other words, the chemical solution L that has flowed into the interior of the bowl 1410 cannot pass through the communication holes 1411a and accumulates at the bottom of the bowl 1410 and is then discharged through a discharge pipe (not shown) connected to the lower portion of the bowl 1410. In addition, the gas G flowing into the interior of the bowl 1410 passes through the communication holes 1411a and flows to the exhaust pipe 1420.

[0063] In addition, the inner lower surface of the bowl 1410 can be formed to be inclined downward from the side portion 1411 of the bowl 1410. In other words, the inner lower surface of the bowl 1410 can have a structure that is inclined downward in a direction away from the communication holes 1411a. This inclined structure is used to guide the chemical solution L that has flowed into the interior of the bowl 1410 away from the communication holes 1411a.

[0064] In addition, in the present disclosure, the discharge pipe 1430 of the exhaust device 1400 may be formed outward from the exhaust pipe 1420 in the rotation direction of the support unit. If the discharge pipe 1430 has a structure simply formed radially from the exhaust pipe 1420, the gas G rotating inside the exhaust pipe 1420 may not flow smoothly into the discharge pipe 1430. Alternatively, if the discharge pipe 1430 has a structure formed with a reverse rotation direction opposite to the rotation direction of the support unit, the gas G rotating inside the exhaust pipe 1420 may not flow smoothly into the discharge pipe 1430. However, the discharge pipe 1430 of the present disclosure has a structure extending outward from the exhaust pipe 1420 and corresponding to the rotation direction of the support unit, such that the gas G rotating in the exhaust pipe 1420 can flow smoothly into the discharge pipe 1430.

[0065] In addition, the discharge pipe 1430 has a structure formed on one side of the exhaust pipe 1420 in the figure, but is not limited thereto, and although not shown in the figure, the discharge pipe 1430 may be formed on one side and the other side of the exhaust pipe 1420. That is, by adopting a structure in which the discharge pipe 1430 is connected to each of one side and the other side (the one side and the other side being opposite portions of the exhaust pipe 1420) of the exhaust pipe 1420, the flow rate from the exhaust pipe 1420 to the discharge pipe 1430 can be evenly distributed, such that the gas G rotating in the exhaust pipe 1420 can flow more smoothly into the discharge pipe 1430.

[0066] Meanwhile, the exhaust device 1400 of the present disclosure may further include vanes 1421.

[0067] A plurality of vanes 1421 may be provided, and the plurality of vanes 1421 may be arranged to be spaced apart from each other in the exhaust pipe 1420. That is, the plurality of vanes 1421 may be arranged to be spaced apart from each other in the length direction of the exhaust pipe 1420 in the exhaust pipe 1420.

[0068] These vanes 1421 may be formed to incline outward in the rotation direction of the support unit. That is, the vanes 1421 may be arranged in the rotation direction of the support unit, and the rear end portion of the vanes 1421 in the rotation direction may incline outward at an acute angle based on the rotation direction. In other words, the vanes 1421 may be formed in a direction corresponding to the direction in which the rotating gas G receives centrifugal force and flows outward.

[0069] Therefore, the gas G rotating in the internal space 1420a of the exhaust duct 1420 based on the multiple blades 1421 can smoothly pass between the multiple blades 1421 and reach the external space 1420b within the exhaust duct 1420. Conversely, it is difficult for the gas G that has passed through the multiple blades 1421 and is rotating in the external space 1420b within the exhaust duct 1420 to pass between the multiple blades 1421 in the opposite direction and reach the internal space 1420a within the exhaust duct 1420.

[0070] In addition, the blades 1421 can be formed with a streamlined cross-section. This streamlined shape means that the front part of the blade 1421 has a curved shape based on the rotation direction of the gas G and becomes sharper towards the rear. Therefore, although the gas G collides with the multiple blades 1421 when the gas G flows from the internal space 1420a within the exhaust duct 1420 to the external space 1420b based on the multiple blades 1421, the flow resistance caused by the multiple blades 1421 can be minimized.

[0071] Furthermore, the blades 1421 can be configured such that the tilt angle varies. Considering various factors, such as the flow rate and rotation speed of the gas G within the exhaust duct 1420, the blades 1421 can be set at an appropriate tilt angle so that the gas G can flow from the internal space 1420a within the exhaust duct 1420 to the external space 1420b most smoothly based on the multiple blades 1421. To change the tilt angle of the blades 1421, the blades 1421 can be installed to rotate within the exhaust duct 1420 and can be rotated manually or automatically. The specific construction for the rotation of the blades 1421 is not limited by the present disclosure, and any driving construction of the prior art can be used.

[0072] As a result, in the present disclosure, since the exhaust duct 1420 is configured to surround the side portion 1411 of the bowl 1410 while being in communication with the side portion 1411 of the bowl 1410, the gas G rotating inside the bowl 1410 can flow in the lateral direction towards the exhaust duct 1420 without suddenly changing in the flow direction due to centrifugal force, thereby minimizing the flow resistance to improve the exhaust efficiency. And furthermore, a compact structure can be obtained.

[0073] In the present disclosure, since the exhaust duct is configured to surround the side portion of the bowl while being in communication with the side portion of the bowl, the gas rotating inside the bowl can flow in the lateral direction towards the exhaust duct without suddenly changing in the flow direction due to centrifugal force, thereby minimizing the flow resistance to improve the exhaust efficiency, and furthermore, a compact structure can be obtained.

[0074] While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. An exhaust device, comprising: a bowl disposed around a supporting unit that supports and rotates a substrate; an exhaust duct configured to surround a side of the bowl and connected to the side of the bowl; and A discharge duct is formed outside the exhaust duct in a rotation direction of the support unit.

2. The exhaust device according to claim 1, wherein: A plurality of communication holes are formed on the side of the bowl and are spaced apart from each other in a circumferential direction, and the bowl and the exhaust duct are connected through the plurality of communication holes.

3. The exhaust device according to claim 2, wherein: The plurality of communication holes are formed to be spaced apart upward from an inner lower surface of the bowl.

4. The exhaust device according to claim 2, wherein: An inner lower surface of the bowl is formed to be inclined downward from the side of the bowl.

5. The exhaust device according to claim 1, wherein: The discharge ducts are respectively formed on one side and the other side of the exhaust duct. 6 . The exhaust device according to claim 1 , further comprising a plurality of blades arranged to be spaced apart from each other within the exhaust duct and formed to be inclined outwardly in the rotation direction of the support unit.

7. The exhaust device according to claim 6, wherein: The blade has a streamlined cross-section.

8. The exhaust device according to claim 6, wherein: The blades are configured to have a variable pitch angle.

9. A substrate processing device comprising: a processing chamber; a supporting unit that supports and rotates the substrate in the processing chamber; a nozzle unit that discharges a chemical solution toward the substrate; a bowl disposed around the periphery of the support unit; an exhaust duct configured to surround a side of the bowl and connected to the side of the bowl; and A discharge duct is formed outside the exhaust duct in a rotation direction of the support unit.

10. The substrate processing apparatus according to claim 9, wherein: A plurality of communication holes are formed on the side of the bowl and are spaced apart from each other in a circumferential direction, and the bowl and the exhaust duct are connected through the plurality of communication holes.

11. The substrate processing apparatus according to claim 10, wherein: The plurality of communication holes are formed to be spaced apart upward from an inner lower surface of the bowl.

12. The substrate processing apparatus according to claim 10, wherein: An inner lower surface of the bowl is formed to be inclined downward from the side of the bowl.

13. The substrate processing apparatus according to claim 9, wherein: The discharge ducts are respectively formed on one side and the other side of the exhaust duct. 14 . The substrate processing apparatus according to claim 9 , further comprising a plurality of blades arranged to be spaced apart from each other within the exhaust duct and formed to be inclined outwardly in the rotation direction of the support unit.

15. The substrate processing apparatus according to claim 14, wherein: The blade has a streamlined cross-section.

16. The substrate processing apparatus according to claim 14, wherein: The blades are configured to have a variable pitch angle.

17. A substrate processing device comprising: a processing chamber; a supporting unit that supports and rotates the substrate in the processing chamber; a nozzle unit that discharges a chemical solution toward the substrate; a bowl disposed around the periphery of the support unit and having a plurality of communication holes on a side of the bowl, the plurality of communication holes being formed to be spaced apart from each other in a circumferential direction; an exhaust duct configured to surround a side of the bowl and connected to the side of the bowl through the plurality of communication holes; a discharge duct connected to the exhaust duct and formed outside the exhaust duct in a rotation direction of the support unit; as well as A plurality of blades are arranged to be spaced apart from each other in the exhaust duct and are formed to be inclined outward in the rotation direction of the support unit.

18. The substrate processing apparatus according to claim 17, wherein: The plurality of communication holes are formed to be spaced apart upward from the inner lower surface of the bowl, and An inner lower surface of the bowl is formed to be inclined downward from the side of the bowl.

19. The substrate processing apparatus according to claim 17, wherein: The blade has a streamlined cross-section.

20. The substrate processing apparatus according to claim 17, wherein: The blades are configured to have a variable pitch angle.

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