LED lamp based on superconducting heat pipe and manufacturing process of LED lamp

Abstract

The invention discloses an LED lamp based on a superconductive heat pipe and a manufacturing process of the LED lamp. The LED lamp comprises a heat conductor which is a VC vapor chamber or a heat pipe; an LED lamp bead is installed on the front portion of the heat conductor in a tightly attached mode and connected with a wire, and an insulating coating is coated between the wire and the outer surface of the heat conductor. The heat conductor is locally connected with the heat dissipation piece; and the PCB on which the lead is positioned is printed on the surface of the insulating coating. The LED lamp has the technical effects and advantages that through the optimal design of the heat dissipation structure, the heat conductor adopts the VC vapor chamber or the heat pipe, so that the heat dissipation effect is greatly improved, the LED lamp beads are continuously kept at a relatively low environment temperature, and the performance of the LED lamp beads cannot be degraded due to long-time heating. Therefore, the service life of the lamp is prolonged, and light attenuation is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamps, and more specifically to an LED lamp based on a super heat pipe and its manufacturing process. Background Art

[0002] Existing vehicles widely use LED lamps as headlamps. However, in order to achieve a relatively high brightness, the power of LED lamps is often relatively large, resulting in a large amount of heat generation. Currently, most LEDs are formed by aluminum profiles + NC machining. The heat dissipation effect of such a structure is not good. In order to enhance the heat dissipation effect, a lot of heat dissipation structures are usually added, resulting in an increase in the volume of the LED lamp, a complication of the production process, and an increase in production costs. Summary of the Invention

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides an LED lamp based on a super heat pipe.

[0004] The technical solution of the present invention is as follows:

[0005] On the one hand, the present invention provides an LED lamp based on a super heat pipe, including a heat conducting body, and the heat conducting body is a VC heat spreader or a heat pipe; an LED lamp bead is closely attached and installed at the front part of the heat conducting body, the LED lamp bead is connected with a wire, and an insulating coating is coated between the wire and the outer surface of the heat conducting body; a part of the heat conducting body is connected with a heat dissipating member.

[0006] The PCB board where the wire is located is printed on the surface of the insulating coating.

[0007] The outer surface of the PCB board is coated with an insulating paint layer.

[0008] Two LED lamp beads are provided and are respectively closely attached to both side surfaces at the front part of the heat conducting body.

[0009] There is a capillary structure layer inside the heat pipe, and the capillary structure layer is a porous structure formed by sintering copper powder.

[0010] One end of the heat conducting body is embedded inside the heat dissipating member, and a heat dissipating fan is installed at the end of the heat dissipating member.

[0011] A stamping connector is installed on the heat dissipating member, and the stamping connector is used for connecting with a lamp housing.

[0012] Multiple groups of heat sink fin structures are provided on the surface of the heat dissipating member.

[0013] The heat dissipating member is composed of two symmetrical sub-heat dissipating members buckled together.

[0014] On the other hand, the present invention can provide a manufacturing process of an LED lamp based on a super heat pipe, including:

[0015] 1. Processing and forming the heat conducting body, i.e., a VC heat spreader or a heat pipe;

[0016] 2. Coat an insulating coating at the position on the outer surface of the heat conductor where the PCB board needs to be printed.

[0017] 3. Press the LED lamp beads tightly against the front-end surface of the heat conductor and fix them tightly.

[0018] 4. Print the PCB board of the LED on the surface of the insulating coating.

[0019] 5. Insert the rear end of the heat conductor into the heat sink and fix it.

[0020] 6. Install a cooling fan at the end of the heat sink.

[0021] Furthermore, the LED lamp beads and the heat conductor are connected by a tight-fitting process, including but not limited to soldering with solder paste or AB glue.

[0022] Furthermore, before inserting the rear end of the heat conductor into the heat sink and fixing it, the following steps are also included: coat an insulating paint layer on the outer surface of the PCB board.

[0023] Furthermore, the heat sink is formed by die-casting process.

[0024] Technical effects and advantages of the present invention:

[0025] Through the optimized design of the heat dissipation structure, the heat conductor adopts a VC heat pipe or a heat pipe, which greatly improves the heat dissipation effect, enables the LED lamp beads to continuously maintain a relatively low ambient temperature, and will not cause its performance attenuation due to long-term heating. Thereby, the service life of the lamp is extended, and there will be no light attenuation.

[0026] The structure of the present invention is reasonably designed, making the preparation faster and the production efficiency higher. Description of the drawings

[0027] Figure 1 It is a schematic structural diagram of the whole of the present invention;

[0028] Figure 2 It is a schematic structural diagram after removing the fan housing and the stamping connector;

[0029] Figure 3 It is Figure 2 A schematic structural diagram from another perspective;

[0030] Figure 4 It is a schematic connection diagram of the heat conductor and the heat sink. Specific embodiments

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] Embodiment 1

[0033] As Figures 1 to 4 shown, an LED lamp based on a super heat pipe includes a heat conducting body 1, and the heat conducting body is a VC heat spreader or a heat pipe; an LED lamp bead 2 is closely attached and installed at the front part of the heat conducting body 1, the LED lamp bead is connected with a wire 3, and an insulating coating is coated between the wire 3 and the outer surface of the heat conducting body 1; a part of the heat conducting body is connected with a heat dissipating member 4. VC (Vapor Chamber) is an efficient heat conduction component with a capillary structure on its inner wall.

[0034] Furthermore, the PCB board where the wire is located is printed on the surface of the insulating coating by printing.

[0035] Furthermore, the outer surface of the PCB board 9 is coated with an insulating paint layer.

[0036] Furthermore, two LED lamp beads are provided and are respectively closely attached to both side surfaces at the front part of the heat conducting body.

[0037] Furthermore, there is a capillary structure layer inside the heat pipe, and the capillary structure layer is a porous structure formed by sintering copper powder.

[0038] Furthermore, one end of the heat conducting body 1 is embedded inside the heat dissipating member 4, and a heat dissipating fan 5 is installed at the end of the heat dissipating member. There is a fan housing 7 outside the fan, and a hole for the wire 8 to pass through is provided on the fan housing 7.

[0039] Furthermore, a stamping connector 6 is installed on the heat dissipating member 4, and the stamping connector is used to connect with the lamp housing.

[0040] Furthermore, multiple groups of heat sink fin structures 41 are provided on the surface of the heat dissipating member.

[0041] Furthermore, the heat dissipating member 4 is composed of two symmetric sub - heat dissipating members 42 buckled together.

[0042] Embodiment 2

[0043] A manufacturing process for an LED lamp based on a super heat pipe includes:

[0044] 1. Processing and forming the heat conducting body, i.e., the VC heat spreader or the heat pipe;

[0045] 2. Coat an insulating coating on the position of the outer surface of the heat conductor where the PCB board needs to be printed.

[0046] 3. Press the LED lamp beads tightly against the front-end surface of the heat conductor and fix them tightly.

[0047] 4. Print the PCB board of the LED on the surface of the insulating coating.

[0048] 5. Embed the rear end of the heat conductor into the heat sink and fix it.

[0049] 6. Install a cooling fan at the end of the heat sink.

[0050] Furthermore, the LED lamp beads are connected to the heat conductor by a tight-fitting process, including but not limited to soldering with solder paste or AB glue.

[0051] Furthermore, before embedding the rear end of the heat conductor into the heat sink and fixing it, the following steps are also included: coat an insulating paint layer on the outer surface of the PCB board.

[0052] Furthermore, the heat sink is formed by die-casting process.

[0053] The heat of the LED lamp is transferred to the die-cast heat sink through the heat conductor, and then through the cooling fan, forced air convection is formed, which will take away the heat and bring it outside. At the same time, the heat sink has a large surface area, which also improves the heat dissipation efficiency.

[0054] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An LED lamp based on a superconducting heat pipe, characterized in that: It includes a heat conductor, which is a VC temperature equalizer or a heat pipe; an LED lamp bead is tightly installed on the front of the heat conductor, the LED lamp bead is connected with a wire, and an insulating coating is coated between the wire and the outer surface of the heat conductor; the heat conductor is partially connected to a heat sink.

2. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: The PCB board where the conductor is located is printed on the surface of the insulating coating.

3. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: The outer surface of the PCB is coated with an insulating paint layer.

4. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: Two LED lamp beads are provided, which are respectively closely attached to the two side surfaces of the front part of the heat conductor.

5. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: A capillary structure layer is provided inside the heat pipe, and the capillary structure layer is a porous structure formed by sintering copper powder.

6. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: One end of the heat conductor is embedded in the heat sink, and a heat dissipation fan is installed at the end of the heat sink.

7. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: A stamping connector is installed on the heat sink, and the stamping connector is used to be connected to the lamp housing.

8. The LED lamp based on a superconducting heat pipe according to claim 1, characterized in that: The surface of the heat sink is provided with a plurality of heat sink structures; the heat sink is composed of two semi-symmetrical sub-heat sinks which are buckled together.

9. A process for manufacturing LED lamps based on superconducting heat pipes, characterized in that: include: Processing and shaping the heat conductor, i.e., VC temperature averaging plate or heat pipe; Apply an insulating coating on the outer surface of the thermal conductor where the PCB needs to be printed; Place the LED lamp bead close to the front end surface of the heat conductor and fix it tightly; Print the LED PCB board onto the insulating coating surface; The rear end of the heat conductor is embedded in the heat sink and fixed; Install a cooling fan at the end of the heat sink.

10. The process for manufacturing an LED lamp based on a superconducting heat pipe according to claim 9, characterized in that: The LED lamp bead and the heat conductor are connected by a tight-fitting process, including but not limited to solder paste welding or AB glue; the heat sink is formed by a die-casting process; before the rear end of the heat conductor is embedded in the heat sink and fixed, the following steps are also included: an insulating paint layer is applied to the outer surface of the PCB board.

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