Integrated construction method and system of integrated LED chip and light guide rod

Abstract

The invention provides an integrated construction method and system of an integrated LED chip and a light guide rod. Through a light guide incident plane, light source light is guided into a short-optical-path light guide column, the light guide optical path is shortened, and guided light is emitted to an illumination space to form a circular light cone; lED light source enhancement and uniform light mixing are carried out through the ultra-thin circular ring connection optical core, and the ultra-thin circular ring connection optical core and the conductive circuit are integrally packaged; the substrate mechanism is connected through the plastic non-light-transmitting shell and the protective shell, light guide protection is carried out, and the plastic non-light-transmitting shell and the electronic circuit substrate are connected; the low-haze frosted sheet and the ultra-thin circular ring connection optical core are connected and integrated, the optical path is shortened, the lighting effect and the luminous flux are enhanced, and the LED chip and the light guide rod are integrated to achieve high-light-effect light-mixing uniform circular light illumination.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic control signal processing lighting, and more specifically, the present invention relates to a method and system for integrally constructing an integrated LED chip and a light guide rod. Background Art

[0002] The improvement of the light efficiency and luminous flux of LED light sources is a very crucial technology in the lighting field; how to shorten the optical path of the light source in the light guide medium and control the light cone emitted into the lighting space; how to further improve the uniform mixing of light of LED light sources and the circuit integration; how to conduct light guide protection and light scattering and color closing; how to reduce the haze of the frosted sheet and improve the light mixing, enhance the light efficiency and luminous flux, and achieve uniform circular light illumination with high light efficiency of mixed light, etc. are still problems to be solved; therefore, it is necessary to propose a method and system for integrally constructing an integrated LED chip and a light guide rod to at least partially solve the problems existing in the prior art. Summary of the Invention

[0003] A series of simplified concepts are introduced in the Summary of the Invention section, which will be further described in detail in the Detailed Description section; the Summary of the Invention section of the present invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0004] To at least partially solve the above problems, the present invention provides a method for integrally constructing an integrated LED chip and a light guide rod, including:

[0005] S10, introducing the light of the light source into a short optical path light guide column through a light guide incident surface, shortening the light guide optical path, and guiding the light to be emitted into the lighting space to form a circular light cone;

[0006] S20, enhancing the uniform mixing of the LED light source through an ultra-thin circular ring connecting optical core, and integrally packaging it with the conductive circuit;

[0007] S30, conducting light guide protection and connecting the plastic non-light-transmitting housing and the electronic circuit board through a plastic non-light-transmitting housing and a protective housing connecting the substrate mechanism;

[0008] S40, connecting and integrally integrating through a low-haze frosted sheet and an ultra-thin circular ring connecting optical core, reducing the optical path, enhancing the light efficiency and luminous flux, and achieving uniform circular light illumination with high light efficiency of mixed light for the integrated LED chip and the light guide rod.

[0009] Preferably, S10 includes:

[0010] S101, introducing the light of the light source into a short optical path light guide column through a light guide incident surface;

[0011] S102. Conduct the light from the light source to the light - guiding emission surface through a short - optical - path light - guiding column, shortening the light - guiding optical path and reducing the light - guiding optical - path loss. The short - optical - path light - guiding column includes: a short - optical - path circular light - guiding column, a short - optical - path multi - polygon light - guiding column, or a short - optical - path combined light - guiding column. The short - optical - path combined light - guiding column is formed by combining a cylinder and a prism column, adapting to the type of light - source chip and the type of frosted sheet.

[0012] S103. Through the light - guiding emission surface, emit the light guided by the short - optical - path light - guiding column into the lighting space.

[0013] Preferably, S20 includes:

[0014] S201. Enhance the uniform mixing of the LED light source through the close arrangement of the ultra - thin circular ring - connected optical cores.

[0015] S202. Integrally package the ultra - thin circular ring - connected optical core and the conductive circuit through the chip packaging layer.

[0016] The ultra - thin circular ring - connected optical core includes: an ultra - thin LED chip group, a chip mounting layer, an adjacent spacer strip group, a light - mixing reflection ring, and a chip packaging layer. The ultra - thin LED chip group includes multiple groups of basic - color ultra - thin LED chips, which are mounted on the chip mounting layer. The basic - color ultra - thin LED chips are arranged as a circular integrated chip group with the straight edges of the fan - shaped basic - color LED chips adjacent to each other. The light - emitting surface is thinned, replacing the triangular arrangement of the square three - primary - color LED chips. The multiple groups of basic - color ultra - thin LED chips have multiple colors or color combinations, and the brightness of each group of basic - color ultra - thin LED chips is controlled separately. The adjacent spacer strip group includes multiple insulating partition strips to isolate adjacent fan - shaped basic - color LED chips. The light - mixing reflection ring is arranged outside the circular integrated chip group, and the reflection surface is an inward - concave reflective surface, reflecting part of the light of the LED chips to the center of the circle, forming the reflection and superposition of the basic - color light to enhance the light - mixing uniformity, light efficiency, and luminous flux. The chip packaging layer integrally packages the LED chip group and the conductive circuit.

[0017] Preferably, S30 includes:

[0018] S301. Conduct light protection by hermetically wrapping the trapezoidal cylinder of the trapezoidal - cylinder short - range light - guiding group with a plastic non - light - transmitting shell.

[0019] S302. Connect the plastic non - light - transmitting shell and the electronic - circuit substrate through a protective - shell connection - to - substrate mechanism.

[0020] The protective - shell connection - to - substrate mechanism includes: a substrate clamping claw, a substrate connection part, and a shell connection part. The substrate clamping claw is arranged at one end of the substrate connection part and is clamped into the clamping interface arranged on the electronic - circuit substrate through the substrate clamping claw. The other end of the substrate connection part is provided with the shell connection part. The shell connection part is hermetically and non - light - transmittingly connected to the plastic non - light - transmitting shell.

[0021] Preferably, S400 includes:

[0022] S401. Through a low haze frosted sheet, the light emitted by the ultra-thin circular ring-connected optical core is scattered through the frosted surface and introduced into the light guide rod.

[0023] S402. Integrate the low haze frosted sheet and the ultra-thin circular ring-connected optical core into one body, reduce the optical path, enhance the light effect and luminous flux, and achieve uniform mixing of strong light effects in the integrated LED chip and light guide rod for circular light illumination.

[0024] The present invention provides a system for integrally constructing an LED chip and a light guide rod, including:

[0025] A trapezoidal cylindrical short-range light guide subsystem. Through the light guide incident surface, the light source light is introduced into the short optical path light guide column, shortening the light guide optical path. The light guide is emitted into the illumination space to form a circular light cone.

[0026] A circular ring-connected chip subsystem. Through the ultra-thin circular ring-connected optical core, the LED light source is enhanced for uniform mixing of light, and is integrally packaged with the conductive circuit.

[0027] A light guide protection housing subsystem. Through the plastic non-light-transmitting housing and the protection housing connecting substrate mechanism, light guide protection is carried out and the plastic non-light-transmitting housing and the electronic circuit substrate are connected.

[0028] A light core fitting and integrated subsystem. Through the low haze frosted sheet and the ultra-thin circular ring-connected optical core, connection and integration are carried out, the optical path is reduced, the light effect and luminous flux are enhanced, and uniform mixing of strong light effects in the integrated LED chip and light guide rod for circular light illumination is achieved.

[0029] Preferably, the trapezoidal cylindrical short-range light guide subsystem includes:

[0030] A light guide incident module. Through the light guide incident surface, the light source light is introduced into the short optical path light guide column.

[0031] A short-range light guide trapezoidal circular body module. Through the short optical path light guide column, the light source light is conducted to the light guide emission surface, shortening the light guide optical path and reducing the light guide optical path loss. The short optical path light guide column includes: a short optical path circular light guide column or a short optical path multi-polygonal light guide column or a short optical path combined light guide column. The short optical path combined light guide column is formed by combining a cylinder and a prism column to adapt to the light source chip type and the frosted sheet type.

[0032] A light guide emission module. Through the light guide emission surface, the light guide of the short optical path light guide column is emitted into the illumination space.

[0033] Preferably, the circular ring-connected chip subsystem includes:

[0034] An ultra-thin circular ring-connected light source module. Through the close connection arrangement of the ultra-thin circular ring-connected optical core, the LED light source is enhanced for uniform mixing of light.

[0035] Ring-connected optical chip packaging module, which integrally packages the ultra-thin circular ring-connected optical core and the conductive circuit through the chip packaging layer.

[0036] The ultra-thin circular ring-connected optical core includes: an ultra-thin LED chip group, a chip mounting layer, an adjacent spacer strip group, a light mixing reflection ring, and a chip packaging layer; the ultra-thin LED chip group includes multiple groups of base-color ultra-thin LED chips, which are mounted on the chip mounting layer; the base-color ultra-thin LED chips are arranged in a circular integrated chip group with the straight edges of the fan-shaped base-color LED chips adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of the square three-primary-color LED chips; the multiple groups of base-color ultra-thin LED chips have multiple colors or color combinations, and the brightness of each group of base-color ultra-thin LED chips is controlled separately; the adjacent spacer strip group includes multiple insulating dividing strips to isolate adjacent fan-shaped base-color LED chips; the light mixing reflection ring is arranged outside the circular integrated chip group, and the reflection surface is an inwardly concave reflective surface, which reflects part of the light of the LED chips to the center of the circle, forming the reflection and superposition of the base-color light to enhance the light mixing uniformity, light effect, and luminous flux; the chip packaging layer integrally packages the LED chip group and the conductive circuit.

[0037] Preferably, the light guide and protection housing subsystem includes:

[0038] The light guide and protection cavity module conducts light guide and protection by enclosing and wrapping the trapezoidal cylinder of the trapezoidal cylinder short-range light guide group with a plastic non-transparent housing.

[0039] The protection housing connection module connects the plastic non-transparent housing and the electronic circuit board through the protection housing connection substrate mechanism.

[0040] The protection housing connection substrate mechanism includes: a substrate clamping claw, a substrate connection part, and a housing connection part; the substrate clamping claw is arranged at one end of the substrate connection part and is clamped in the card interface arranged on the electronic circuit board through the substrate clamping claw; the other end of the substrate connection part is provided with the housing connection part; the housing connection part is hermetically connected to the plastic non-transparent housing in a light-tight manner.

[0041] Preferably, the optical core fitting and integrated subsystem includes:

[0042] The frosted light guide connection module scatters and guides the light emitted by the ultra-thin circular ring-connected optical core through the frosted surface into the light guide rod through a low-haze frosted sheet.

[0043] The core column connection and integration module connects and integrates the low-haze frosted sheet and the ultra-thin circular ring-connected optical core, reduces the optical path, enhances the light effect and luminous flux, and conducts the integrated high-light-effect light mixing and uniform circular light illumination of the LED chip and the light guide rod.

[0044] Compared with the prior art, the present invention has at least the following beneficial effects:

[0045] An integrated construction method and system of an LED chip and a light guide rod. Through the light guide incident surface, the light source light is introduced into the short light path light guide column to shorten the light guide path. The light guide is emitted into the lighting space to form a circular light cone. The LED light source is enhanced and uniformly mixed with light through an ultra-thin circular connecting optical core and is integrally packaged with the conductive circuit. Through the plastic non-light-transmitting housing and the protective housing connecting the substrate mechanism, light guide protection is carried out and the plastic non-light-transmitting housing and the electronic circuit substrate are connected. Through the low haze frosted sheet and the ultra-thin circular connecting optical core, they are integrally connected, reducing the light path, enhancing the light effect and luminous flux, and realizing the integrated high light effect and uniform circular light illumination of the LED chip and the light guide rod.

[0046] An integrated construction method and system of an LED chip and a light guide rod according to the present invention. Other advantages, objectives and features of the present invention will be partially reflected by the following description and partially understood by those skilled in the art through the research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0048] Figure 1 It is a diagram of an embodiment of an integrated construction system of an LED chip and a light guide rod according to the present invention.

[0049] Figure 2 It is a diagram of another embodiment of an integrated construction system of an LED chip and a light guide rod according to the present invention.

[0050] Figure 3 It is a diagram of an embodiment of the application of an integrated construction system and method of an LED chip and a light guide rod according to the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0051] The following further describes the present invention in detail with reference to the drawings and embodiments, so that those skilled in the art can implement it according to the specification. As shown in the figure, the present invention provides an integrated construction method of an LED chip and a light guide rod, including:

[0052] S10. Through the light guide incident surface, the light source light is introduced into the short light path light guide column to shorten the light guide path. The light guide is emitted into the lighting space to form a circular light cone.

[0053] S20. The LED light source is enhanced and uniformly mixed with light through an ultra-thin circular connecting optical core and is integrally packaged with the conductive circuit.

[0054] S30. Through the plastic non-light-transmitting housing and the protective housing connecting the substrate mechanism, light guide protection is carried out and the plastic non-light-transmitting housing and the electronic circuit substrate are connected.

[0055] S40, it is integrated through a low haze matte sheet and an ultra-thin circular connecting optical core, reducing the optical path, enhancing the light effect and luminous flux, and achieving integrated strong light effect and uniform circular light illumination of the LED chip and the light guide rod.

[0056] The principle and effect of the above technical solution are as follows: The present invention provides a method for integrally constructing an LED chip and a light guide rod, including: guiding the light source light into the short optical path light guide column 10 through the light guiding incident surface, shortening the light guiding optical path, guiding the light to the illumination space, and forming a circular light cone; enhancing the uniform mixing of light of the LED light source through the ultra-thin circular connecting optical core 20 and integrally packaging it with the conductive circuit; connecting the plastic non-light-transmitting housing 30 and the protective housing to the substrate mechanism to conduct light protection and connect the plastic non-light-transmitting housing and the electronic circuit substrate; integrating through the low haze matte sheet 40 and the ultra-thin circular connecting optical core, reducing the optical path, enhancing the light effect and luminous flux, and achieving integrated strong light effect and uniform circular light illumination of the LED chip and the light guide rod.

[0057] In one embodiment, S10 includes:

[0058] S101, guiding the light source light into the short optical path light guide column through the light guiding incident surface;

[0059] S102, conducting the light source light to the light guiding emission surface through the short optical path light guide column, shortening the light guiding optical path, and reducing the light guiding optical path loss; the short optical path light guide column includes: a short optical path circular light guide column or a short optical path multi-polygonal light guide column or a short optical path combined light guide column; the short optical path combined light guide column is formed by combining a cylinder and a prism column, adapting to the light source chip type and the matte sheet type;

[0060] S103, emitting the light guided by the short optical path light guide column to the illumination space through the light guiding emission surface.

[0061] The principle and effect of the above technical solution are as follows: guiding the light source light into the short optical path light guide column through the light guiding incident surface; conducting the light source light to the light guiding emission surface through the short optical path light guide column, shortening the light guiding optical path, and reducing the light guiding optical path loss; the short optical path light guide column includes: a short optical path circular light guide column or a short optical path multi-polygonal light guide column or a short optical path combined light guide column; the short optical path combined light guide column is formed by combining a cylinder and a prism column, adapting to the light source chip type and the matte sheet type; emitting the light guided by the short optical path light guide column to the illumination space through the light guiding emission surface; emitting the light in the short optical path light guide column to the illumination space through the light guiding emission surface includes: setting the light guiding emission surface as a circular light emission surface, setting the circular light emission surface at the light emission end of the short optical path light guide column, emitting the light in the short optical path light guide column to the illumination space, forming a circular light cone in the illumination space and a circular light spot on the direct illumination surface.

[0062] In one embodiment, S20 includes:

[0063] S201, enhance the uniform mixing of LED light sources through the close arrangement of the ultra-thin circular ring-connected optical cores.

[0064] S202, integrally package the ultra-thin circular ring-connected optical cores and conductive circuits through the chip encapsulation layer.

[0065] The ultra-thin circular ring-connected optical core includes: an ultra-thin LED chip group, a chip mounting layer, an adjacent spacer group, a light mixing reflection ring, and a chip encapsulation layer; the ultra-thin LED chip group includes multiple groups of base-color ultra-thin LED chips, which are mounted on the chip mounting layer; the base-color ultra-thin LED chips are arranged as a circular integrated chip group with the straight edges of the fan-shaped base-color LED chips adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of the square three-primary-color LED chips; multiple groups of base-color ultra-thin LED chips have multiple colors or color combinations, and the brightness of each group of base-color ultra-thin LED chips is controlled individually; the adjacent spacer group includes multiple insulating dividing strips to isolate adjacent fan-shaped base-color LED chips; the light mixing reflection ring is arranged outside the circular integrated chip group, and the reflection surface is a concave reflective surface, which reflects part of the light of the LED chips to the center of the circle, forming the reflection and superposition of the base-color light to enhance the uniformity, light efficiency, and luminous flux of the light mixing; the chip encapsulation layer integrally packages the LED chip group and the conductive circuit.

[0066] The principle and effect of the above technical solution are: enhance the uniform mixing of LED light sources through the close arrangement of the ultra-thin circular ring-connected optical cores; integrally package the ultra-thin circular ring-connected optical cores and conductive circuits through the chip encapsulation layer. The ultra-thin circular ring-connected optical core includes: an ultra-thin LED chip group 021, a chip mounting layer 022, an adjacent spacer group 023, a light mixing reflection ring 024, and a chip encapsulation layer 025; the ultra-thin LED chip group includes multiple groups of base-color ultra-thin LED chips, which are mounted on the chip mounting layer; the base-color ultra-thin LED chips are arranged as a circular integrated chip group with the straight edges of the fan-shaped base-color LED chips adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of the square three-primary-color LED chips; multiple groups of base-color ultra-thin LED chips have multiple colors or color combinations, and the brightness of each group of base-color ultra-thin LED chips is controlled individually; the adjacent spacer group includes multiple insulating dividing strips to isolate adjacent fan-shaped base-color LED chips; the light mixing reflection ring is arranged outside the circular integrated chip group, and the reflection surface is a concave reflective surface, which reflects part of the light of the LED chips to the center of the circle, forming the reflection and superposition of the base-color light to enhance the uniformity, light efficiency, and luminous flux of the light mixing; the chip encapsulation layer integrally packages the LED chip group and the conductive circuit.

[0067] In one embodiment, S30 includes:

[0068] S301, conduct light guiding protection by hermetically wrapping the trapezoidal cylinder of the trapezoidal cylinder short-range light guiding group with a plastic non-light-transmitting housing.

[0069] S302. Connect the substrate mechanism through the protective shell to connect the plastic non-transparent shell and the electronic circuit substrate;

[0070] The protective shell connection substrate mechanism includes: a substrate clamping claw, a substrate connection part, and a shell connection part; the substrate clamping claw is arranged at one end of the substrate connection part and is clamped in the clamping interface arranged on the electronic circuit substrate through the substrate clamping claw; the shell connection part is arranged at the other end of the substrate connection part; the shell connection part is hermetically connected to the plastic non-transparent shell in a light-tight manner.

[0071] The principle and effect of the above technical solution are: conduct light protection by enclosing the trapezoidal cylinder of the trapezoidal cylinder short-range light guide group with a plastic non-transparent shell; connect the plastic non-transparent shell and the electronic circuit substrate through the protective shell connection substrate mechanism; the protective shell connection substrate mechanism includes: a substrate clamping claw, a substrate connection part, and a shell connection part; the substrate clamping claw is arranged at one end of the substrate connection part and is clamped in the clamping interface arranged on the electronic circuit substrate through the substrate clamping claw; the shell connection part is arranged at the other end of the substrate connection part; the shell connection part is hermetically connected to the plastic non-transparent shell in a light-tight manner; a uniform reflective layer is coated on the fitting surface between the inner layer of the plastic non-transparent shell and the light guide column; significantly reduce the light absorption of the plastic material and reflect the light leakage on the side of the light guide column body back into the light path of the light guide column again, significantly enhancing the light effect of the light path; the middle of the plastic non-transparent shell is a multi-layer structure, and the compression density of the plastic material gradually decreases from the inner layer to the outer layer, and the outer layer forms a microporous honeycomb structure; the inner layer has a higher light and heat absorption rate and thermal conductivity for the light guide column, and dissipates heat layer by layer to the outer layer. The microporous honeycomb structure on the outer layer significantly increases the surface area of the outer layer, and the heat dissipation performance is significantly improved; longitudinal and transverse fine channels are arranged outside the microporous honeycomb structure to communicate adjacent microporous honeycombs, and the longitudinal and transverse fine channels promote the accelerated flow of longitudinal and transverse micro-airflows on the surface, significantly improving the heat dissipation efficiency..

[0072] In one embodiment, S400 includes:

[0073] S401. Pass the light emitted by the ultra-thin circular ring-connected light core through the low haze frosted sheet and scatter it into the light guide rod through the frosted surface;

[0074] S402. Connect and integrate the low haze frosted sheet and the ultra-thin circular ring-connected light core into one body, reduce the optical path, enhance the light effect and luminous flux, and perform integrated high light effect and uniform circular light illumination of the LED chip and the light guide rod.

[0075] The principle and effect of the above technical solution are as follows: Through a low haze frosted sheet, the light emitted by the ultra-thin circular ring-connected optical core is scattered through the frosted surface and introduced into the light guide rod; the low haze frosted sheet and the ultra-thin circular ring-connected optical core are integrated and connected together to reduce the optical path, enhance the light effect and luminous flux, and realize the integrated high light effect and uniform mixed light circular light illumination of the LED chip and the light guide rod; the haze of the low haze frosted sheet is reduced and the transparency is increased compared with the existing frosted sheet; the integration of the low haze frosted sheet and the ultra-thin circular ring-connected optical core to reduce the optical path, enhance the light effect and luminous flux, and the integrated high light effect and uniform mixed light circular light illumination of the LED chip and the light guide rod includes: attaching one side of the low haze frosted sheet to the light guide incident surface, and connecting the other side of the low haze frosted sheet with the encapsulation surface of the ultra-thin circular ring-connected optical core to realize the integrated connection, reduce the optical path, enhance the light effect and luminous flux, and form a high light effect and uniform mixed light circular light illumination system with reduced optical path, enhanced light effect and luminous flux for the integrated LED chip and light guide rod, and realize the integrated high light effect and uniform mixed light circular light illumination of the LED chip and the light guide rod.

[0076] The present invention provides a system for integrally constructing an LED chip and a light guide rod, including:

[0077] A trapezoidal cylindrical short-range light guide subsystem, through the light guide incident surface, introduces the light source light into the short light path light guide column, shortens the light guide light path, and the light is emitted to the illumination space to form a circular light cone;

[0078] A circular ring-connected chip subsystem, through the ultra-thin circular ring-connected optical core, enhances the uniform mixed light of the LED light source and is integrally packaged with the conductive circuit;

[0079] A light guide protection housing subsystem, through the plastic non-light-transmitting housing and the protection housing connecting substrate mechanism, conducts light guide protection and connects the plastic non-light-transmitting housing and the electronic circuit substrate;

[0080] A light core fitting and integrated subsystem, through the low haze frosted sheet and the ultra-thin circular ring-connected optical core, is integrally connected and integrated to reduce the optical path, enhance the light effect and luminous flux, and realize the integrated high light effect and uniform mixed light circular light illumination of the LED chip and the light guide rod.

[0081] The principles and effects of the above technical solution are as follows: The present invention provides a system for integrally constructing an LED chip and a light guide rod, including: a trapezoidal cylindrical short-range light guide subsystem, which guides the light from the light source into the short light path light guide column 10 through the light guide incident surface, shortens the light guide path, and guides the light to the lighting space to form a circular light cone; a circular ring-connected chip subsystem, which enhances the uniform mixing of light of the LED light source through the ultra-thin circular ring-connected optical core 20 and is integrally packaged with the conductive circuit; a light guide protection housing subsystem, which conducts light guide protection and connects the plastic non-light-transmitting housing and the electronic circuit board through the plastic non-light-transmitting housing 30 and the protection housing connection substrate mechanism; a light core fitting and integral integration subsystem, which is integrally connected through the low haze frosted sheet 40 and the ultra-thin circular ring-connected optical core, reduces the light path, enhances the light effect and luminous flux, and integrally integrates the LED chip and the light guide rod for strong light effect, uniform light mixing and circular light illumination.

[0082] In one embodiment, the trapezoidal cylindrical short-range light guide subsystem includes:

[0083] A light guide incident module, which guides the light from the light source into the short light path light guide column through the light guide incident surface;

[0084] A short-range light guide trapezoidal cylinder module, which conducts the light from the light source to the light guide emission surface through the short light path light guide column, shortens the light guide path, and reduces the light guide path loss; the short light path light guide column includes: a short light path circular light guide column or a short light path multi-sided light guide column or a short light path combined light guide column; the short light path combined light guide column is formed by combining a cylinder and a prism column, and adapts to the type of light source chip and the type of frosted sheet;

[0085] A light guide emission module, which guides the light from the short light path light guide column to the lighting space through the light guide emission surface.

[0086] The principles and effects of the above technical solution are as follows: The trapezoidal cylindrical short-range light guide subsystem includes: a light guide incident module, which guides the light from the light source into the short light path light guide column through the light guide incident surface; a short-range light guide trapezoidal cylinder module, which conducts the light from the light source to the light guide emission surface through the short light path light guide column, shortens the light guide path, and reduces the light guide path loss; the short light path light guide column includes: a short light path circular light guide column or a short light path multi-sided light guide column or a short light path combined light guide column; the short light path combined light guide column is formed by combining a cylinder and a prism column, and adapts to the type of light source chip and the type of frosted sheet; a light guide emission module, which guides the light from the short light path light guide column to the lighting space through the light guide emission surface; guiding the light in the short light path light guide column to the lighting space through the light guide emission surface includes: the light guide emission surface is set as a circular light emission surface, and the circular light emission surface is arranged at the light emission end of the short light path light guide column, and the light in the short light path light guide column is emitted to the lighting space, forming a circular light cone in the lighting space and a circular light spot on the direct illumination surface.

[0087] In one embodiment, the circular ring-connected chip subsystem includes:

[0088] Ultra-thin circular ring-connected light source module, through the close connection arrangement of ultra-thin circular ring-connected optical cores, performs enhanced uniform light mixing of LED light sources;

[0089] Ring-connected optical chip packaging module, through the chip packaging layer, integrally packages the ultra-thin circular ring-connected optical core and the conductive circuit.

[0090] The ultra-thin circular ring-connected optical core includes: an ultra-thin LED chip group, a chip mounting layer, an adjacent spacer strip group, a light mixing reflection ring, and a chip packaging layer; the ultra-thin LED chip group includes multiple groups of base-color ultra-thin LED chips, which are mounted on the chip mounting layer; the base-color ultra-thin LED chips are arranged as a circular integrated chip group with the straight edges of fan-shaped base-color LED chips adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary-color LED chips; multiple groups of base-color ultra-thin LED chips have multiple colors or color combinations, and the brightness of each group of base-color ultra-thin LED chips is controlled individually; the adjacent spacer strip group includes multiple insulating partition strips to isolate adjacent fan-shaped base-color LED chips; the light mixing reflection ring is arranged outside the circular integrated chip group, and the reflection surface is an inwardly concave reflective surface, reflecting part of the LED chip light to the center of the circle, forming a superposition of base-color light reflections to enhance the light mixing uniformity, light efficiency, and luminous flux; the chip packaging layer integrally packages the LED chip group and the conductive circuit.

[0091] The principle and effect of the above technical solution are as follows: The circular ring-connected chip subsystem includes: an ultra-thin circular ring-connected light source module, through the close connection arrangement of ultra-thin circular ring-connected optical cores, performs enhanced uniform light mixing of LED light sources; a ring-connected optical chip packaging module, through the chip packaging layer, integrally packages the ultra-thin circular ring-connected optical core and the conductive circuit; the ultra-thin circular ring-connected optical core includes: an ultra-thin LED chip group, a chip mounting layer, an adjacent spacer strip group, a light mixing reflection ring, and a chip packaging layer; the ultra-thin LED chip group includes multiple groups of base-color ultra-thin LED chips, which are mounted on the chip mounting layer; the base-color ultra-thin LED chips are arranged as a circular integrated chip group with the straight edges of fan-shaped base-color LED chips adjacent to each other, and the light-emitting surface is thinned, replacing the triangular arrangement of square three-primary-color LED chips; multiple groups of base-color ultra-thin LED chips have multiple colors or color combinations, and the brightness of each group of base-color ultra-thin LED chips is controlled individually; the adjacent spacer strip group includes multiple insulating partition strips to isolate adjacent fan-shaped base-color LED chips; the light mixing reflection ring is arranged outside the circular integrated chip group, and the reflection surface is an inwardly concave reflective surface, reflecting part of the LED chip light to the center of the circle, forming a superposition of base-color light reflections to enhance the light mixing uniformity, light efficiency, and luminous flux; the chip packaging layer integrally packages the LED chip group and the conductive circuit.

[0092] In one embodiment, the light guide and protection housing subsystem includes:

[0093] The light guide and protection cavity module conducts light guide and protection by hermetically wrapping the trapezoidal cylinder of the trapezoidal cylinder short-range light guide group with a plastic non-transparent housing.

[0094] The protective housing connection module connects the plastic non-translucent housing and the electronic circuit board through the protective housing connection substrate mechanism;

[0095] The protective housing connection substrate mechanism includes: a substrate clamping claw, a substrate connection part, and a housing connection part; the substrate clamping claw is arranged at one end of the substrate connection part and is clamped in the clamping interface arranged on the electronic circuit board through the substrate clamping claw; the housing connection part is arranged at the other end of the substrate connection part; the housing connection part is hermetically connected to the plastic non-translucent housing in a light-tight manner.

[0096] The principle and effect of the above technical solution are as follows: The light guide protective housing subsystem includes: a light guide protection cavity module that conducts light protection by enclosing and wrapping the trapezoidal cylinder of the trapezoidal cylinder short-range light guide group with a plastic non-translucent housing; a protective housing connection module that connects the plastic non-translucent housing and the electronic circuit board through the protective housing connection substrate mechanism; the protective housing connection substrate mechanism includes: a substrate clamping claw, a substrate connection part, and a housing connection part; the substrate clamping claw is arranged at one end of the substrate connection part and is clamped in the clamping interface arranged on the electronic circuit board through the substrate clamping claw; the housing connection part is arranged at the other end of the substrate connection part; the housing connection part is hermetically connected to the plastic non-translucent housing in a light-tight manner; a uniform reflective layer is coated on the fitting surface between the inner layer of the plastic non-translucent housing and the light guide column; significantly reduce the light absorption of the plastic material and reflect the light leakage on the side of the light guide column body back into the light path of the light guide column again, significantly enhancing the light effect of the light path; the middle of the plastic non-translucent housing is a multi-layer structure, and the compression density of the plastic material gradually decreases from the inner layer to the outer layer, and the outer layer forms a microporous honeycomb structure; the inner layer has a higher light and heat absorption rate and thermal conductivity for the light guide column, and dissipates heat layer by layer to the outer layer. The microporous honeycomb structure on the outer layer significantly increases the surface area of the outer layer, and the heat dissipation performance is significantly improved; longitudinal and transverse fine channels are arranged outside the microporous honeycomb structure to communicate adjacent microporous honeycombs, and the longitudinal and transverse fine channels promote the accelerated flow of longitudinal and transverse micro-airflows on the surface, significantly improving the heat dissipation efficiency.

[0097] In one embodiment, the optical core fitting integrated subsystem includes:

[0098] The frosted light guide connection module scatters and guides the light emitted by the ultra-thin circular ring-connected optical core through the frosted surface into the light guide rod through a low-haze frosted sheet;

[0099] The core column connection integration module connects the low-haze frosted sheet and the ultra-thin circular ring-connected optical core into an integrated unit, reduces the optical path, enhances the light effect and light flux, and integrates the LED chip and the light guide rod into a high-light-effect and uniformly mixed light circular illumination.

[0100] The principles and effects of the above technical solution are as follows: The optical core bonding integrated subsystem includes: a frosted light guide connection module, which scatters and guides the light emitted by the ultra-thin circular ring-connected optical core through the frosted surface into the light guide rod through a low haze frosted sheet; a core column connection integrated module, which integrates the low haze frosted sheet and the ultra-thin circular ring-connected optical core into one body, reduces the optical path, enhances the light effect and luminous flux, and realizes the integrated high light effect and uniform circular light illumination of the LED chip and the light guide rod; the haze of the low haze frosted sheet is lower and the transparency is higher than that of the existing frosted sheet; integrating the low haze frosted sheet and the ultra-thin circular ring-connected optical core into one body, reducing the optical path, enhancing the light effect and luminous flux, and realizing the integrated high light effect and uniform circular light illumination of the LED chip and the light guide rod includes: mounting one side of the low haze frosted sheet on the light guide incident surface, connecting the other side of the low haze frosted sheet with the encapsulation surface of the ultra-thin circular ring-connected optical core, integrating them into one body, reducing the optical path, enhancing the light effect and luminous flux, forming a high light effect and uniform circular light illumination system with reduced optical path, enhanced light effect and luminous flux for the integrated LED chip and light guide rod, and realizing the integrated high light effect and uniform circular light illumination of the LED chip and the light guide rod.

[0101] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and embodiments. It can be fully applied to various fields suitable for the present invention. For those familiar with the field, additional modifications can be easily made. Therefore, without departing from the general concept defined by the claims and the equivalent scope, the present invention is not limited to the specific details and the illustrated examples here.

Claims

1. A method for integrating an LED chip and a light guide rod, characterized in that: include: S10, guiding the light from the light source into a short optical path light guide column through the light guide incident surface, shortening the light guide optical path, and emitting the light into the lighting space to form a circular light cone; S20 uses an ultra-thin circular ring-connected optical core to enhance the uniform light mixing of LED light sources and integrates it with the conductive circuit in an integrated package; S30, connecting the plastic non-light-transmitting shell and the protective shell to the substrate mechanism, performing light guide protection and connecting the plastic non-light-transmitting shell and the electronic circuit substrate; S40 is integrated through low-fog frosted sheets and ultra-thin circular ring-connected optical cores to shorten the optical path, enhance light efficiency and luminous flux, and integrate LED chips and light guide rods to provide strong light efficiency, mixed light, and uniform circular light illumination.

2. The method for constructing an integrated LED chip and a light guide rod according to claim 1, characterized in that: S10 includes: S101, guiding the light from the light source into a short optical path light guide column through a light guide incident surface; S102, transmitting the light from the light source to the light guide emission surface through a short optical path light guide column, shortening the light guide optical path and reducing the light guide optical path loss; the short optical path light guide column includes: a short optical path circular light guide column or a short optical path multi-corner light guide column or a short optical path combined light guide column; the short optical path combined light guide column is formed by combining a circular column and a prism column, and is suitable for the type of light source chip and the type of frosted sheet; S103, emitting light from the short optical path light guide column to the lighting space through the light guide emission surface.

3. The method for constructing an integrated LED chip and a light guide rod according to claim 1, characterized in that: The S20 includes: S201, through the close connection and arrangement of ultra-thin circular ring-connected optical cores, LED light sources are enhanced and evenly mixed; S202, integrating and packaging the ultra-thin circular ring-connected optical core and the conductive circuit through the chip packaging layer. The ultra-thin circular ring-connected optical core includes: an ultra-thin LED chipset, a chip mounting layer, an adjacent spacing band group, a mixed light reflection ring and a chip packaging layer; the ultra-thin LED chipset includes multiple groups of primary color ultra-thin LED chips mounted on the chip mounting layer; the primary color ultra-thin LED chips are arranged as a circular integrated chipset with fan-block primary color LED chips arranged in a straight-edge adjacent combination, and the light-emitting surface is thinned to replace the square three-primary color LED chips arranged in a herringbone shape; the multiple groups of primary color ultra-thin LED chips have multiple colors or color combinations, and each group of primary color ultra-thin LED chips controls the brightness separately; the adjacent spacing band group includes multiple insulating dividing bands to isolate adjacent fan-block primary color LED chips; the mixed light reflection ring is arranged outside the circular integrated chipset, and the reflection surface is a concave reflective surface, which reflects part of the LED chip light to the center of the circle, forming a superposition of primary color light reflection to enhance the uniformity of mixed light, light efficiency and luminous flux; the chip packaging layer integrates the LED chipset and the conductive circuit into one package.

4. The method for constructing an integrated LED chip and a light guide rod according to claim 1, characterized in that: S30 includes: S301, light guide protection is performed by enclosing and wrapping the trapezoidal cylinder of the trapezoidal cylinder short-range light guide group with a plastic non-light-transmissive shell; S302, connecting the plastic non-light-transmitting housing and the electronic circuit substrate through a protective shell connecting substrate mechanism; The protective shell connecting substrate mechanism includes: a substrate clamping claw, a substrate connecting part and a shell connecting part; the substrate clamping claw is arranged at one end of the substrate connecting part, and is clamped in a card interface arranged on the electronic circuit substrate through the substrate clamping claw; the shell connecting part is arranged at the other end of the substrate connecting part; the shell connecting part is light-proof and sealed to connect the plastic non-light-proof shell.

5. The method for constructing an integrated LED chip and a light guide rod according to claim 1, characterized in that: S400 includes: S401, through the low haze frosted sheet, the light emitted by the ultra-thin circular ring-connected optical core is scattered through the frosted surface and introduced into the light guide rod; S402 integrates the low-haze frosted sheet and the ultra-thin circular ring-connected optical core to shorten the optical path, enhance the light effect and luminous flux, and integrate the LED chip and the light guide rod to achieve strong light effect, mixed light and uniform circular light illumination.

6. A system for integrating LED chips and light guide rods, characterized in that: include: The trapezoidal cylindrical short-range light guide subsystem guides the light from the light source into the short-range light guide column through the light guide incident surface, shortens the light guide path, and guides the light into the lighting space to form a circular light cone; The circular ring chip subsystem uses an ultra-thin circular ring optical core to enhance the uniform light mixing of the LED light source and integrates it with the conductive circuit. The light-guiding protection shell subsystem performs light-guiding protection and connects the plastic non-light-transmitting shell and the electronic circuit substrate through the plastic non-light-transmitting shell and the protective shell connecting substrate mechanism; The optical core bonding integrated subsystem is integrated through the low-haze frosted sheet and the ultra-thin circular ring optical core to shorten the optical path, enhance the light effect and luminous flux, and integrate the LED chip and the light guide rod to achieve strong light effect, mixed light and uniform circular light illumination.

7. The integrated LED chip and light guide rod construction system according to claim 6, characterized in that: Trapezoidal cylindrical short-range light guide system, comprising: A light guide incident module, which guides the light from the light source into the short optical path light guide column through the light guide incident surface; The short-path light-guiding ladder round module transmits the light from the light source to the light-guiding emission surface through a short-path light-guiding column, shortens the light-guiding path, and reduces the light-guiding path loss; the short-path light-guiding column includes: a short-path circular light-guiding column or a short-path multi-ribbed light-guiding column or a short-path combined light-guiding column; the short-path combined light-guiding column is formed by combining a cylinder and a ribbed column, and is suitable for the type of light source chip and the type of frosted sheet; The light guide emission module guides and emits the short-path light guide column into the lighting space through the light guide emission surface.

8. The integrated LED chip and light guide rod construction system according to claim 6, characterized in that: Circular ring chip subsystem, including: Ultra-thin circular ring-connected light source module, through the close connection and arrangement of ultra-thin circular ring-connected optical cores, LED light source is enhanced and evenly mixed; The ring-connected optical chip packaging module integrates the ultra-thin circular ring-connected optical core and the conductive circuit into one package through the chip packaging layer. The ultra-thin circular ring-connected optical core includes: an ultra-thin LED chipset, a chip mounting layer, an adjacent spacing band group, a mixed light reflection ring and a chip packaging layer; the ultra-thin LED chipset includes multiple groups of primary color ultra-thin LED chips mounted on the chip mounting layer; the primary color ultra-thin LED chips are arranged as a circular integrated chipset with fan-block primary color LED chips arranged in a straight-edge adjacent combination, and the light-emitting surface is thinned to replace the square three-primary color LED chips arranged in a herringbone shape; the multiple groups of primary color ultra-thin LED chips have multiple colors or color combinations, and each group of primary color ultra-thin LED chips controls the brightness separately; the adjacent spacing band group includes multiple insulating dividing bands to isolate adjacent fan-block primary color LED chips; the mixed light reflection ring is arranged outside the circular integrated chipset, and the reflection surface is a concave reflective surface, which reflects part of the LED chip light to the center of the circle, forming a superposition of primary color light reflection to enhance the uniformity of mixed light, light efficiency and luminous flux; the chip packaging layer integrates the LED chipset and the conductive circuit into one package.

9. The integrated LED chip and light guide rod construction system according to claim 6, characterized in that: Light guide protection housing subsystem, including: The light guide protection cavity module is enclosed and wrapped by a plastic non-light-transmissive shell outside the trapezoidal cylinder of the trapezoidal cylindrical short-range light guide group to provide light guide protection; A protective shell connection module connects the plastic non-light-transmitting shell and the electronic circuit substrate through a protective shell connection substrate mechanism; The protective shell connecting substrate mechanism includes: a substrate clamping claw, a substrate connecting part and a shell connecting part; the substrate clamping claw is arranged at one end of the substrate connecting part, and is clamped in a card interface arranged on the electronic circuit substrate through the substrate clamping claw; the shell connecting part is arranged at the other end of the substrate connecting part; the shell connecting part is light-proof and sealed to connect the plastic non-light-proof shell.

10. The integrated LED chip and light guide rod construction system according to claim 6, characterized in that: Optical core bonding integrated subsystem, including: The frosted light guide connection module uses a low-fog frosted sheet to scatter the light emitted by the ultra-thin circular ring-connected optical core into the light guide rod through the frosted surface; The core column connection integrated module connects and integrates the low-haze frosted sheet and the ultra-thin circular ring optical core, shortens the optical path, enhances the light effect and luminous flux, and integrates the LED chip and the light guide rod to achieve strong light effect, mixed light and uniform circular light illumination.

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