Heat source assembly and heat exchange system

Abstract

The invention relates to the technical field of heat exchange, and discloses a heat source assembly which comprises a heat source groove and one or more electrocaloric spraying heat exchange assemblies arranged in the heat source groove, the heat source groove comprises a hot working medium outlet and a cold working medium outlet, and each electrocaloric spraying heat exchange assembly comprises an electrocaloric refrigerating device for alternately generating heat and cold; and the spraying assembly is used for spraying the heat exchange working medium to the surface of the electrocaloric refrigeration device, so that the heat exchange working medium exchanges heat with the electrocaloric refrigeration device. When the electrocaloric refrigeration device generates heat, the inclination control piece controls the electrocaloric refrigeration device to incline towards the hot working medium outlet, so that the hot working medium after heat exchange flows out of the hot working medium outlet. And when the electrocaloric refrigeration device generates cooling capacity, the inclination control piece controls the electrocaloric refrigeration device to incline towards the cold working medium outlet, so that the cold working medium after heat exchange flows out from the cold working medium outlet. According to the heat source assembly disclosed by the invention, the heat exchange effect on the electrocaloric refrigeration device is improved. The invention further discloses a heat exchange system.

Description

Technical Field

[0001] This application relates to the field of heat exchange technology, for example, to a heat source assembly and a heat exchange system. Background Art

[0002] Currently, in traditional refrigeration technology based on compressor cycles, since it is difficult to miniaturize compressors to meet the refrigeration requirements of highly integrated microelectronic devices, at the same time, the large use of refrigerants will also cause environmental problems such as ozone layer depletion and greenhouse effect. Therefore, there is an urgent need for a new type of refrigeration technology to replace traditional refrigeration technology.

[0003] When an electric field is applied to or removed from an electrocaloric material, the electrocaloric material will exhibit endothermic or exothermic phenomena, that is, the electrocaloric effect. Electrocaloric refrigeration devices are a new type of refrigeration technology based on the electrocaloric effect of electrocaloric materials, which do not need to use compressors and refrigerants required by traditional refrigeration technology, delaying the generation of the greenhouse effect, and at the same time avoiding environmental pollution problems caused by ozone layer depletion and refrigerant leakage.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] Currently, for the existing structures of electrocaloric refrigeration devices, it is necessary to separate the heat and cold of the electrocaloric refrigeration devices in order to utilize the heat and cold. However, the separation effect of the heat and cold of the existing electrocaloric refrigeration devices is poor, thus reducing the utilization effect of the heat and cold of the electrocaloric refrigeration devices.

[0006] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of this application, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0007] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a general review, nor is it intended to identify key / important elements or delineate the protection scope of these embodiments, but rather serves as a preface to the subsequent detailed description.

[0008] The embodiments of the present disclosure provide a heat source assembly and a heat exchange system, which adopt the method of spraying heat exchange working medium to separate the heat and cold generated by the electrocaloric refrigeration device, improving the separation effect of the heat and cold generated by the electrocaloric refrigeration device, and further improving the utilization effect of the heat and cold generated by the electrocaloric refrigeration device.

[0009] In some embodiments, a heat source assembly includes a heat source tank and one or more electrocaloric spray heat exchange assemblies disposed in the heat source tank. The heat source tank includes a hot working fluid outlet and a cold working fluid outlet. The electrocaloric spray heat exchange assembly includes: an electrocaloric refrigeration device that alternately generates heat and cold, the electrocaloric refrigeration device including opposite first and second ends; a spray assembly disposed above the electrocaloric refrigeration device for spraying a heat exchange working fluid onto the surface of the electrocaloric refrigeration device to effect heat exchange between the heat exchange working fluid and the electrocaloric refrigeration device; and an inclination control member for controlling the inclination of the electrocaloric refrigeration device. Wherein, when the electrocaloric refrigeration device generates heat, the inclination control member controls the electrocaloric refrigeration device to incline towards the hot working fluid outlet so that the heat exchange working fluid after heat exchange flows out from the hot working fluid outlet; when the electrocaloric refrigeration device generates cold, the inclination control member controls the electrocaloric refrigeration device to incline towards the cold working fluid outlet so that the heat exchange working fluid after heat exchange flows out from the cold working fluid outlet.

[0010] In some embodiments, a heat exchange system includes the heat source assembly as described above.

[0011] The heat source assembly and the heat exchange system provided by the embodiments of the present disclosure can achieve the following technical effects:

[0012] The heat source assembly provided by the embodiments of the present disclosure includes a heat source tank and one or more electrocaloric spray heat exchange assemblies disposed in the heat source tank, and the electrocaloric refrigeration device can be formed in an inclined state under the control of the inclination control member. When the electrocaloric refrigeration device generates heat, the inclination control member controls the electrocaloric refrigeration device to incline towards the hot working fluid outlet side so that the heat exchange working fluid after heat exchange with the electrocaloric refrigeration device flows out from the hot working fluid outlet; when the electrocaloric refrigeration device generates cold, the inclination control member controls the electrocaloric refrigeration device to incline towards the cold working fluid outlet side so that the heat exchange working fluid after heat exchange with the electrocaloric refrigeration device flows out from the cold working fluid outlet.

[0013] It can be seen that the heat source assembly provided by the embodiments of the present disclosure uses the method of spraying a heat exchange working fluid onto the surface of the electrocaloric refrigeration device to effect heat exchange on the electrocaloric refrigeration device. At the same time, by controlling the inclined state of the electrocaloric refrigeration device, the heat exchange working fluid and the cold working fluid after heat exchange with the electrocaloric refrigeration device can be respectively led out, improving the heat exchange effect of the heat and cold generated by the electrocaloric refrigeration device, and thus being beneficial to improving the utilization effect of the heat and cold generated by the electrocaloric refrigeration device.

[0014] The above general description and the following description are only exemplary and explanatory and are not intended to limit the present application. Description of the Drawings

[0015] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and among them:

[0016] Figure 1 It is a schematic structural diagram of a heat source component provided by an embodiment of the present disclosure;

[0017] Figure 2 It is a schematic structural diagram of another heat source component provided by an embodiment of the present disclosure;

[0018] Figure 3 It is a schematic structural diagram of another heat source component provided by an embodiment of the present disclosure;

[0019] Figure 4 It is a schematic structural diagram of another heat source component provided by an embodiment of the present disclosure;

[0020] Figure 5 It is a schematic diagram of a heat exchange system provided by an embodiment of the present disclosure;

[0021] Figure 6 It is a schematic structural diagram of a piezoelectric functional film layer in an electrocaloric element provided by an embodiment of the present disclosure;

[0022] Figure 7 It is a schematic structural diagram of an electrocaloric element provided by an embodiment of the present disclosure;

[0023] Figure 8 It is a flowchart of a preparation method of an electrocaloric element provided by an embodiment of the present disclosure;

[0024] Figure 9 It is a schematic structural diagram of an electrocaloric refrigeration chip provided by an embodiment of the present disclosure;

[0025] Figure 10 It is a schematic diagram of an electrocaloric element in an electrocaloric refrigeration chip being attached to a heat receiving end;

[0026] Figure 11 It is a schematic diagram of an electrocaloric element in an electrocaloric refrigeration chip being attached to a cold receiving end.

[0027] Reference numerals:

[0028] 1: First electrode layer; 11: Electrocaloric refrigeration electrode region; 12: Piezoelectric drive electrode region; 13: Electrode gap;

[0029] 2: Second electrode layer;

[0030] 3: Third electrode layer;

[0031] 4: Piezoelectric functional film layer; 41: Piezoelectric displacement unit; 42: Piezoelectric refrigeration unit; 431: First through - division gap; 432: First through - piezoelectric displacement unit; 433: Second through - division gap;

[0032] 5: Substrate layer;

[0033] 100: Electric card component;

[0034] 201: First clamping skeleton; 202: Second clamping skeleton; 203: First bending gap; 204: Second bending gap; 205: Support skeleton;

[0035] 300: Heat receiving end;

[0036] 400: Cold receiving end;

[0037] 500: Heat source tank; 501: Heat working fluid outlet; 502: Cold working fluid outlet; 503: Working fluid inlet; 510: Spraying assembly; 511: Spraying pipe; 512: Nozzle; 520: Electrocaloric refrigeration device; 521: First end of electrocaloric refrigeration device; 522: Second end of electrocaloric refrigeration device; 530: Inclined support; 531: First diversion groove; 5311: First diversion bottom wall; 5312: First diversion side wall; 532: Second diversion groove; 5321: Second diversion bottom wall; 5322: Second diversion side wall; 540: Heat source tank inlet pipeline; 541: First pump body;

[0038] 600: Heat end heat exchanger; 610: First working fluid inlet pipeline; 620: First working fluid outlet pipeline; 621: First check valve;

[0039] 700: Cold end heat exchanger; 710: Second working fluid inlet pipeline; 720: Second working fluid outlet pipeline; 721: Second check valve. Detailed implementation manners

[0040] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for reference and illustration purposes only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, numerous details are provided to give a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be shown in a simplified manner to simplify the drawings.

[0041] The terms "first", "second", etc. in the description and claims of the embodiments of the present disclosure and the above accompanying drawings are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data may be interchanged under appropriate circumstances so as to describe the embodiments of the present disclosure here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0042] In the embodiments of the present disclosure, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and their embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation. Moreover, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0043] In addition, the terms "arranged", "connected", "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0044] Unless otherwise specified, the term "plurality" means two or more.

[0045] The term "and / or" is a description of the associated relationship of an object, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B these three relationships.

[0046] It should be noted that, without conflict, the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other.

[0047] The embodiments of the present disclosure provide a heat source assembly. As Figures 1 to 4 shown.

[0048] An embodiment of the present disclosure provides a heat source assembly, including a heat source tank 500 and one or more electrocaloric spray heat exchange assemblies disposed in the heat source tank 500. The heat source tank 500 includes a hot working fluid outlet 501 and a cold working fluid outlet 502. The electrocaloric spray heat exchange assembly includes an electrocaloric refrigeration device 520, a spray assembly 510, and an inclination control member. The electrocaloric refrigeration device 520 alternately generates heat and cold, and the electrocaloric refrigeration device 520 includes opposite first and second ends 521 and 522; the spray assembly 510 is disposed above the electrocaloric refrigeration device 520 and is configured to spray a heat exchange working fluid onto the surface of the electrocaloric refrigeration device 520 to enable heat exchange between the heat exchange working fluid and the electrocaloric refrigeration device 520; the inclination control member is configured to control the inclination of the electrocaloric refrigeration device 520. Wherein, when the electrocaloric refrigeration device 520 generates heat, the inclination control member controls the electrocaloric refrigeration device 520 to incline towards the hot working fluid outlet 501, so that the heat exchange working fluid after heat exchange flows out from the hot working fluid outlet 501; when the electrocaloric refrigeration device 520 generates cold, the inclination control member controls the electrocaloric refrigeration device 520 to incline towards the cold working fluid outlet 502, so that the heat exchange working fluid after heat exchange flows out from the cold working fluid outlet 502.

[0049] The electrocaloric effect is a thermal effect of a ferroelectric material under an electric field, which releases heat when an electric field is applied and absorbs heat when the electric field is removed. The electrocaloric refrigeration device 520 is a refrigeration device based on the electrocaloric effect. When the electrocaloric refrigeration device 520 releases heat, the heat exchange working fluid is sprayed onto the surface of the electrocaloric refrigeration device 520, and the heat of the electrocaloric refrigeration device 520 is taken away by the evaporation and heat absorption of the heat exchange working fluid; similarly, when the electrocaloric refrigeration device 520 absorbs heat, that is, generates cold, the heat exchange working fluid is sprayed onto the surface of the electrocaloric refrigeration device 520, and the cold of the electrocaloric refrigeration device 520 is taken away by the condensation of the heat exchange working fluid.

[0050] In the heat source assembly provided by the embodiment of the present disclosure, the spray assembly is used to spray the heat exchange working fluid onto the surface of the electrocaloric refrigeration device 520 to enable heat and cold exchange between the heat exchange working fluid and the electrocaloric refrigeration device 520. The heat exchange working fluid can quickly take away the heat or cold generated by the electrocaloric refrigeration device 520 in a short time; and, the heat exchange working fluid is evenly distributed on the surface of the electrocaloric refrigeration device 520, avoiding the hot spot problem generated by the electrocaloric refrigeration device 520; at the same time, after the heat exchange working fluid is sprayed onto the surface of the electrocaloric refrigeration device 520, it can quickly absorb or release heat to quickly take away the heat or cold on the surface of the electrocaloric refrigeration device 520, thereby quickly adjusting the temperature of the electrocaloric refrigeration device 520 and preventing the electrocaloric refrigeration device 520 from overheating or overcooling, and improving the service life of the electrocaloric refrigeration device 520. It can be seen that the heat source assembly provided by the embodiment of the present disclosure can enable effective, rapid, and sufficient heat or cold exchange between the heat exchange working fluid and the electrocaloric refrigeration device 520, which is beneficial to the subsequent utilization of the exchanged heat or cold.

[0051] The spraying assembly 510 is disposed above the electrocaloric refrigeration device 520 and sprays the heat exchange working fluid onto the surface of the electrocaloric refrigeration device 520 in a generally top-to-bottom direction. Optionally, the surface of the electrocaloric refrigeration device 520 is coated with a hydrophilic coating, which improves the heat exchange effect between the heat exchange working fluid and the electrocaloric refrigeration device 520. Optionally, the supporting surface of the electrocaloric refrigeration device 520 is coated with a hydrophobic coating to prevent the retention of heat exchange working fluid droplets and affect the next cycle.

[0052] Meanwhile, the heat source assembly provided in the embodiment of the present disclosure further includes an inclination control member for controlling the inclination of the electrocaloric refrigeration device 520. When the electrocaloric refrigeration device 520 generates heat, after the heat exchange working fluid sprayed onto the surface of the electrocaloric refrigeration device 520 exchanges heat with the electrocaloric refrigeration device 520, the temperature rises and it becomes a hot working fluid. At this time, the electrocaloric refrigeration device 520 is controlled to incline towards the hot working fluid outlet 501 side of the heat source tank 500, so that the hot working fluid obtained after heat exchange flows towards the hot working fluid outlet 501 of the heat source tank 500 and flows out from the hot working fluid outlet 501, so as to utilize the heat exchanged by the heat exchange working fluid subsequently; when the electrocaloric refrigeration device 520 generates cold, after the heat exchange working fluid sprayed onto the surface of the electrocaloric refrigeration device 520 exchanges cold with the electrocaloric refrigeration device 520, the temperature drops and it becomes a cold working fluid. At this time, the electrocaloric refrigeration device 520 is controlled to incline towards the cold working fluid outlet 502 side of the heat source tank 500, so that the cold working fluid obtained after cold exchange flows towards the cold working fluid outlet 502 of the heat source tank 500 and flows out from the cold working fluid outlet 502, so as to utilize the cold exchanged by the heat exchange working fluid subsequently.

[0053] Optionally, the electrocaloric refrigeration device 520 includes opposite first end 521 and second end 522. When the electrocaloric refrigeration device 520 inclines towards the hot working fluid outlet 501, the inclination state of the electrocaloric refrigeration device 520 can be that the first end 521 drops while the second end 522 rises, as Figure 4 shown. When the electrocaloric refrigeration device 520 inclines towards the cold working fluid outlet 502, the inclination state of the electrocaloric refrigeration device 520 can be that the second end 522 drops while the first end 521 rises, as Figures 1 to 3 shown.

[0054] Optionally, a length direction of the electrocaloric refrigeration device 520 is formed between the first end 521 and the second end 522 of the electrocaloric refrigeration device.

[0055] Optionally, the electrocaloric refrigeration device 520 includes opposite first end and second end, and also includes a first side wall and a second side wall between the first end and the second end. Side walls are provided on both the first side wall and the second side wall, so that the heat exchange working fluid sprayed onto the surface of the electrocaloric refrigeration device 520 can stay on the surface between the electrocaloric refrigerations for a certain time, so as to improve the heat exchange effect between the heat exchange working fluid and the surface of the electrocaloric refrigeration device 520.

[0056] Optionally, the heat exchange method of the electrocaloric spray heat exchange component provided by the embodiments of the present disclosure may be as follows: When the electrocaloric refrigeration device 520 generates heat, control the spray component 510 to spray the heat exchange working medium on the surface of the electrocaloric refrigeration device 520, and control the electrocaloric refrigeration device 520 to maintain a horizontal state for a certain period of time. After the heat exchange between the heat exchange working medium and the electrocaloric refrigeration device 520 is completed, the tilt control member controls the first end of the electrocaloric refrigeration device 520 to lower and the second end to rise, so that the electrocaloric refrigeration device 520 tilts towards the heat working medium outlet 501, and the heat exchange heat working medium flows out from the heat working medium outlet 501 of the heat source tank 500; When the electrocaloric refrigeration device 520 generates cold, control the spray component 510 to spray the heat exchange working medium on the surface of the electrocaloric refrigeration device 520, and control the electrocaloric refrigeration device 520 to maintain a horizontal state for a certain period of time. After the heat exchange working medium and the electrocaloric refrigeration device 520 complete the cold quantity exchange, the tilt control member controls the second end of the electrocaloric refrigeration device 520 to lower and the first end to rise, so that the electrocaloric refrigeration device 520 tilts towards the cold working medium outlet 502, and the cold working medium after the cold quantity exchange flows out from the cold working medium outlet 502 of the heat source tank 500.

[0057] Optionally, the number of electrocaloric spray heat exchange components in the heat source tank 500 may be multiple. When multiple electrocaloric spray heat exchange components are simultaneously arranged in the heat source tank 500, the multiple spray components 510 in the heat source tank 500 can simultaneously perform spray heat exchange for their corresponding multiple electrocaloric refrigeration devices 520, improving the total amount of heat and cold generated by the heat source tank 500 through heat exchange.

[0058] Optionally, the heat source tank 500 further includes a first diversion groove 531 and a second diversion groove 532.

[0059] The first diversion groove 531 connects the first end 521 of the electrocaloric refrigeration device to the heat working medium outlet 501 of the heat source tank 500, and is used to divert the heat working medium to the heat working medium outlet 501. The second diversion groove 532 connects the second end 522 of the electrocaloric refrigeration device to the cold working medium outlet 502 of the heat source tank 500, and is used to divert the cold working medium to the cold working medium outlet 502.

[0060] Optionally, the first diversion channel 531 includes a first diversion bottom wall 5311 and a first diversion side wall 5312. The first diversion bottom wall 5311 is in communication with the hot working fluid outlet 501. The first diversion side wall 5312 extends upward from the first diversion bottom wall 5311. Moreover, the first diversion side wall 5312 is disposed at the first end 521 of the electrocaloric refrigeration device, and is configured to divert the hot working fluid flowing obliquely from the first end to the hot working fluid outlet 501. The second diversion channel 532 includes a second diversion bottom wall 5321 and a second diversion side wall 5322. The second diversion bottom wall 5321 is in communication with the cold working fluid outlet 502. The second diversion side wall 5322 extends upward from the second diversion bottom wall 5321. Moreover, the second diversion side wall 5322 is disposed at the second end 522 of the electrocaloric refrigeration device, and is configured to divert the cold working fluid flowing obliquely from the second end to the cold working fluid outlet 502.

[0061] When the electrocaloric refrigeration device 520 generates heat, the tilting control member controls the first end 521 of the electrocaloric refrigeration device to lower and the second end 522 to raise. Also, the first end 521 of the electrocaloric refrigeration device abuts against the first diversion side wall 5312, so that the hot working fluid flowing out from the first end can smoothly flow into the first diversion channel 531, as Figure 4 shown. When the electrocaloric refrigeration device 520 generates cold, the tilting control member controls the second end 522 of the electrocaloric refrigeration device to lower and the first end 521 to raise. Also, the second end 522 of the electrocaloric refrigeration device abuts against the second diversion side wall 5322, so that the cold working fluid flowing out from the second end can smoothly flow into the second diversion channel 532, as Figures 1 to 3 shown.

[0062] When multiple electrocaloric spray heat exchange assemblies are provided in the heat source tank 500, the first diversion bottom walls 5311 of the multiple electrocaloric spray heat exchange assemblies converge at the bottom of the heat source tank 500, and converge the hot working fluid to the hot working fluid outlet 501; similarly, the second diversion bottom walls 5321 of the multiple electrocaloric spray heat exchange assemblies converge at the bottom of the heat source tank 500, and converge the cold working fluid to the cold working fluid outlet 502.

[0063] Optionally, the electrocaloric refrigeration device 520 includes a spray surface for spray heat exchange with the heat exchange working fluid, and a support surface opposite to the spray surface. Among them, the tilting control member includes a tilting support member 530, which is disposed on the support surface of the electrocaloric refrigeration device 520.

[0064] The tilting control member includes a tilting support member 530 disposed on the support surface of the electrocaloric refrigeration device 520 to support the electrocaloric refrigeration device 520 in an inclined state. Optionally, the shape of the tilting support member 530 is a triangular pyramid, as Figures 1 to 4As shown, a groove connected to the inclined support member 530 is provided on the support surface of the electrocaloric refrigeration device 520. Optionally, the inclined support member 530 is disposed in the middle of the support surface of the electrocaloric refrigeration device 520, that is, in the middle between the first end and the second end of the electrocaloric refrigeration device 520. This is beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the hot working fluid outlet 501 side, and is also beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the cold working fluid outlet 502 side.

[0065] Optionally, the set height of the inclined support member 530 is higher than the heights of the first diversion sidewall 5312 and the second diversion sidewall 5322.

[0066] The set height of the inclined support member 530 can be understood as the height at which the inclined support member 530 and the electrocaloric refrigeration device 520 play a supporting role. The height of the first diversion sidewall 5312 can be understood as the height of the topmost end of the first diversion sidewall 5312, and the height of the second diversion sidewall 5322 can be understood as the height of the topmost end of the second diversion sidewall 5322. In the embodiments of the present disclosure, the set height of the inclined support member 530 is higher than the height of the first diversion sidewall 5312, and the set height of the inclined support member 530 is higher than the height of the second diversion sidewall 5322, as Figures 1 to 4 shown, forming a structure similar to a seesaw. This is beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the hot working fluid outlet 501 side, and is also beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the cold working fluid outlet 502 side.

[0067] Optionally, the tilt control member further includes a first electromagnetic element and a second electromagnetic element. The first electromagnetic element is disposed on the first diversion sidewall 5312 and is used to attract the first end 521 of the electrocaloric refrigeration device; the second electromagnetic element is disposed on the second diversion sidewall 5322 and is used to attract the second end 522 of the electrocaloric refrigeration device.

[0068] Optionally, when the electrocaloric refrigeration device 520 generates heat, control the first electromagnetic element of the tilt control member to attract the first end 521 of the electrocaloric refrigeration device. At the same time, control the second electromagnetic element of the tilt control member to repel the second end 522 of the electrocaloric refrigeration device, so that the first end 521 of the electrocaloric refrigeration device is lowered and the second end 522 is raised, thereby causing the electrocaloric refrigeration device 520 to tilt towards the hot working fluid outlet 501 side. When the electrocaloric refrigeration device 520 generates cold, control the first electromagnetic element of the tilt control member to repel the first end 521 of the electrocaloric refrigeration device. At the same time, control the second electromagnetic element of the tilt control key to attract the second end 522 of the electrocaloric refrigeration device, so that the second end 522 of the electrocaloric refrigeration device is lowered and the first end 521 is raised, thereby causing the electrocaloric refrigeration device 520 to tilt towards the cold working fluid outlet 502 side.

[0069] Optionally, the electromagnetic force of the electromagnetic elements at both ends of the electrocaloric refrigeration device 520 can be periodically discharged, and the inclination of the electrocaloric refrigeration device 520 can be synchronously controlled with the discharge of the electrocaloric refrigeration device 520.

[0070] Optionally, the first electromagnetic element is arranged at the top of the first diversion side wall 5312, and the second electromagnetic element is arranged at the top of the second diversion side wall 5322.

[0071] Optionally, the spraying assembly 510 includes a spraying pipe 511 and a plurality of nozzles 512 arranged on the spraying pipe 511. The plurality of nozzles 512 are sequentially arranged along the length direction of the electrocaloric refrigeration device 520.

[0072] As described above, the length direction is between the first end and the second end of the electrocaloric refrigeration device 520. The plurality of nozzles 512 of the spraying assembly 510 are evenly arranged along the length direction, improving the uniformity of the spraying of the heat exchange working medium on the surface of the electrocaloric refrigeration device 520 by the spraying assembly 510.

[0073] The embodiment of the present disclosure also provides a heat exchange system including the foregoing heat source assembly. As Figure 5 shown.

[0074] The heat exchange system provided by the embodiment of the present disclosure includes a heat source assembly, a hot end heat exchanger 600, and a cold end heat exchanger 700. The heat source assembly includes a heat source tank 500 and one or more electrocaloric spraying heat exchange assemblies arranged in the heat source tank 500. The heat source tank 500 includes a hot working medium outlet 501 and a cold working medium outlet 502. The hot end heat exchanger 600 is connected to the hot working medium outlet 501 through a first working medium circulation pipeline, and the cold end heat exchanger 700 is connected to the cold working medium outlet 502 through a second working medium circulation pipeline. Among them, the electrocaloric spraying heat exchange assembly includes an electrocaloric refrigeration device 520 and a spraying assembly 510. The electrocaloric refrigeration device 520 alternately generates heat and cold; the spraying assembly 510 is used to spray a heat exchange working medium on the surface of the electrocaloric refrigeration device 520, so that the heat exchange working medium exchanges heat with the electrocaloric refrigeration device 520. When the electrocaloric refrigeration device 520 generates heat, the heat exchange hot working medium flows out from the hot working medium outlet 501; when the electrocaloric refrigeration device 520 generates cold, the heat exchange cold working medium flows out from the cold working medium outlet 502.

[0075] An embodiment of the present disclosure provides a heat exchange system including the aforementioned heat source assembly. The heat exchange system includes a heat source assembly, and the heat source assembly includes a heat source tank 500, in which an electrocaloric spray heat exchange assembly is provided. The electrocaloric refrigeration device 520 in the electrocaloric spray heat exchange assembly can alternately generate heat and cold. When the electrocaloric refrigeration device 520 generates heat, the heat transfer medium in the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520. After the exchange, the heat transfer medium carrying heat flows out from the heat transfer medium outlet of the heat source tank and enters the hot end heat exchanger 600 through the first working medium circulation pipeline, so that the heat can be utilized or dissipated in the hot end heat exchanger 600; similarly, when the electrocaloric refrigeration device 520 generates cold, the heat transfer medium in the heat source tank 500 exchanges cold with the electrocaloric refrigeration device 520. After the exchange, the cold working medium carrying cold flows out from the cold working medium outlet of the heat source tank and enters the cold end heat exchanger 700 through the second working medium circulation pipeline, so that the cold can be utilized or dissipated in the cold end heat exchanger 700.

[0076] For the heat exchange system provided by the embodiment of the present disclosure, the heat source assembly and the hot end heat exchanger 600 form a closed internal heat circulation system through the first working medium circulation pipeline, and the heat source assembly and the cold end heat exchanger 700 form a closed internal cold circulation system through the second working medium circulation pipeline. It can be seen that the heat exchange system provided by the embodiment of the present disclosure includes both an internal heat circulation system and an internal cold circulation system, and can recycle the heat and cold alternately generated by the electrocaloric refrigeration device 520.

[0077] Optionally, the hot end heat exchanger 600 or the cold end heat exchanger 700 can be a finned tube heat exchanger, a microchannel heat exchanger or other heat exchangers commonly used in refrigeration equipment, air conditioners or other household electrical appliances. The embodiment of the present disclosure does not limit the specific structural form of the hot end heat exchanger 600 or the cold end heat exchanger 700 too much.

[0078] Optionally, when multiple electrocaloric spray heat exchange assemblies are provided in the heat source tank 500 of the heat source assembly, after the heat transfer medium enters through the working medium inlet 503 of the heat source tank 500, it is split to enter multiple spray assemblies 510 respectively.

[0079] Optionally, the heat exchange system further includes a heat source tank inlet pipeline 540, and the heat source tank inlet pipeline 540 is connected to the working medium inlet 503 of the heat source tank.

[0080] The heat exchange system includes a heat source tank inlet pipeline 540 disposed at the inlet of the working medium in the heat source tank, which can return the heat exchange working medium after heat exchange through the hot end heat exchanger 600 or the cold end heat exchanger 700 to the heat source tank for the next cycle. When the electrocaloric refrigeration device 520 generates heat, the heat exchange working medium after heat exchange carries heat, enters the first working medium circulation pipeline through the hot working medium outlet, and enters the hot end heat exchanger 600. After releasing the heat in the hot end heat exchanger 600, it flows back to the heat source tank 500 through the heat source tank inlet pipeline 540, thus completing a heat cycle; when the electrocaloric refrigeration device 520 generates cold, the heat exchange working medium after heat exchange carries cold, enters the second working medium circulation pipeline through the cold working medium outlet, and enters the cold end heat exchanger 700. After releasing the cold in the cold end heat exchanger 700, it flows back to the heat source tank 500 through the heat source tank inlet pipeline 540, thus completing a cold cycle.

[0081] Optionally, a first pump body 541 is provided on the heat source tank inlet pipeline 540. The first pump body 541 can be used to pressurize and pump the heat exchange working medium in the heat source tank inlet pipeline 540 into the heat source tank 500. In this way, the flow rate of the heat exchange working medium flowing into the heat source tank 500 is increased, and the heat exchange effect between the heat exchange working medium and the electrocaloric refrigeration device 520 is improved.

[0082] Optionally, the first working medium circulation pipeline includes a first working medium inlet pipeline 610 connected to the inlet of the hot end heat exchanger 600 and a first working medium outlet pipeline 620 connected to the outlet of the hot end heat exchanger 600. Among them, the first working medium inlet pipeline 610 is connected to the hot working medium outlet 501, and the first working medium outlet pipeline 620 is connected to the heat source tank inlet pipeline 540; the second working medium circulation pipeline includes a second working medium inlet pipeline 710 connected to the inlet of the cold end heat exchanger 700 and a second working medium outlet pipeline 720 connected to the outlet of the cold end heat exchanger 700. Among them, the second working medium inlet pipeline 710 is connected to the cold working medium outlet 502, and the second working medium outlet pipeline 720 is connected to the heat source tank inlet pipeline 540.

[0083] Optionally, with the hot - end heat exchanger 600 as the division, the first working fluid circulation pipeline includes a first working fluid inlet pipeline 610 and a first working fluid outlet pipeline 620. The heat - carrying heat - exchange working fluid flowing out of the heat source tank 500 enters the hot - end heat exchanger 600 through the first working fluid inlet pipeline 610. After the heat - exchange working fluid dissipates heat in the hot - end heat exchanger 600, it flows back into the heat source tank 500 through the first working fluid outlet pipeline 620 and the heat source tank inlet pipeline 540 in sequence; similarly, with the cold - end heat exchanger 700 as the division, the second working fluid circulation pipeline includes a second working fluid inlet pipeline 710 and a second working fluid outlet pipeline 720. The cold - carrying heat - exchange working fluid flowing out of the heat source tank 500 enters the cold - end heat exchanger 700 through the second working fluid outlet pipeline 720. After the heat - exchange working fluid dissipates cold in the cold - end heat exchanger 700, it flows back into the heat source tank 500 through the second working fluid outlet pipeline 720 and the heat source tank inlet pipeline 540 in sequence.

[0084] Optionally, a first check valve 621 is provided on the first working fluid outlet pipeline 620, and the conducting direction of the first check valve 621 is from the outlet of the hot - end heat exchanger 600 to the heat source tank inlet pipeline 540; a second check valve 721 is provided on the second working fluid outlet pipeline 720, and the conducting direction of the second check valve 721 is from the outlet of the cold - end heat exchanger 700 to the heat source tank inlet pipeline 540.

[0085] In this way, the heat - exchange working fluid after heat - exchange in the hot - end heat exchanger 600 can flow back into the heat source tank 500 through the first check valve 621, and the heat - exchange working fluid after heat - exchange in the cold - end heat exchanger 700 can flow back into the heat source tank 500 through the second check valve 721, preventing the reverse flow of the heat - exchange working fluid.

[0086] Optionally, the heat - exchange system provided in the embodiments of the present disclosure further includes a control unit, configured to control the tilting control member to tilt the electro - caloric refrigeration device 520 towards the hot working fluid outlet 501 when the electro - caloric refrigeration device 520 generates heat, so that the heat - exchanged hot working fluid flows out from the hot working fluid outlet 501; when the electro - caloric refrigeration device 520 generates cold, control the tilting control member to tilt the electro - caloric refrigeration device 520 towards the cold working fluid outlet 502, so that the heat - exchanged cold working fluid flows out from the cold working fluid outlet 502.

[0087] When an electric field is applied, the electrocaloric refrigeration device 520 releases heat. The heat transfer working fluid sprayed into the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520 and then heats up to become a hot working fluid, which takes away the heat released by the electrocaloric refrigeration device 520. At this time, the tilt control member is controlled to tilt the electrocaloric refrigeration device towards the hot working fluid outlet, so that the heat-exchanged hot working fluid flows out from the hot working fluid outlet, and then the heated hot working fluid enters the hot-end heat exchanger 600 through the first working fluid circulation pipeline. When the electric field is released, the electrocaloric refrigeration device 520 releases cold. The heat transfer working fluid sprayed into the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520 and then cools down to become a cold working fluid, which takes away the cold released by the electrocaloric refrigeration device 520. At this time, the tilt control member is controlled to tilt the electrocaloric refrigeration device towards the cold working fluid outlet, so that the heat-exchanged cold working fluid flows out from the cold working fluid outlet, and then the cooled cold working fluid enters the cold-end heat exchanger 700 through the second working fluid circulation pipeline.

[0088] Optionally, the heat transfer working fluid is an insulating heat-conducting liquid, including single-phase fluorinated liquid, phase-changeable fluorinated cooling liquid, or transformer insulating heat-conducting oil, etc.

[0089] The embodiment of the present disclosure also provides a household electrical appliance including the foregoing heat exchange system. The household electrical appliance may include an air conditioner to heat the room by using the heat dissipated by the hot-end heat exchanger 600 of the heat exchange system, or to cool the room by using the cold dissipated by the cold-end heat exchanger 700 of the heat exchange system. Optionally, the household electrical appliance may also include refrigeration equipment such as a refrigerator, a freezer, or a display cabinet, to cool the inside of the refrigeration equipment by using the cold dissipated by the cold-end heat exchanger 700 of the heat exchange system.

[0090] The embodiment of the present disclosure also provides an electrocaloric refrigeration device applicable to any one of the foregoing electrocaloric spraying assemblies, heat exchange systems, or household electrical appliances.

[0091] The electrocaloric refrigeration device includes an electrocaloric refrigeration chip, and the electrocaloric refrigeration chip includes an electrocaloric element, a heat receiving end, and a cold receiving end. The electrocaloric element includes a first electrode layer, a second electrode layer, and a piezoelectric functional film layer. The piezoelectric functional film layer is disposed between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. The piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement. The heat receiving end is used to receive the heat of the electrocaloric element, and the cold receiving end is used to receive the cold of the electrocaloric element.

[0092] Currently, existing electrocaloric refrigeration systems need to design a movable heat transfer structure to move between the cold end and the hot end in cooperation with the application / release of the electric field, so as to achieve the separation of heat and cold. The heat transfer structure cannot be integrated with the electrocaloric refrigeration working fluid, has a large thermal resistance, and the heat exchange efficiency is low.

[0093] The embodiment of the present disclosure provides an electrocaloric element.

[0094] An embodiment of the present disclosure discloses an electrocaloric element 100. A piezoelectric displacement region is directly formed by partitioning in a piezoelectric film layer of the electrocaloric element 100. The electrocaloric element 100 is driven to move through the piezoelectric displacement region for heat transfer. The electrocaloric element 100 integrates a thermal switch form, improving the heat exchange efficiency.

[0095] Combined with Figure 6 and Figure 7 As shown, an embodiment of the present disclosure provides an electrocaloric element 100, including a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. Among them, the piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement.

[0096] The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4 disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region. By applying a voltage to the first electrode layer 1 and the second electrode layer 2, an electric field is formed between the first electrode layer 1 and the second electrode layer 2, and different functional regions of the piezoelectric functional film layer 4 correspondingly achieve different functional effects. When a positive electric field is simultaneously applied to the piezoelectric refrigeration region and the piezoelectric displacement region, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, resulting in a positive displacement and heat release; when the electric field applied to the piezoelectric refrigeration region stops and a reverse electric field is applied to the piezoelectric displacement region, the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, and the piezoelectric displacement region undergoes a reverse displacement due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reverse displacement. Through different functional partitions of the piezoelectric functional film layer 4, opposite displacements occur during heat release and heat absorption of the electrocaloric effect, effectively realizing heat separation and improving the heat exchange efficiency. The piezoelectric functional film layer 4 of the electrocaloric element 100 is partitioned to include a piezoelectric displacement region, enabling the electrocaloric element 100 to integrate a thermal switch form and avoiding a large resistance caused by an externally provided movable heat transfer structure.

[0097] Optionally, a square-wave periodic electric field is applied to the piezoelectric displacement region.

[0098] Optionally, the first electrode layer 1 includes a platinum electrode, and / or the second electrode layer 2 includes a platinum electrode, and / or the third electrode layer 3 includes a platinum electrode.

[0099] Optionally, the piezoelectric refrigeration region includes one or more piezoelectric refrigeration units 42; the piezoelectric displacement region includes one or more piezoelectric displacement units 41.

[0100] When the piezoelectric refrigeration region includes a piezoelectric refrigeration unit 42 and the piezoelectric displacement region includes a piezoelectric displacement unit 41, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are arranged adjacent to each other. When the piezoelectric refrigeration region absorbs heat, the piezoelectric displacement region drives the piezoelectric refrigeration region to displace in the reverse direction. When the piezoelectric refrigeration region includes a plurality of piezoelectric refrigeration units 42 and the piezoelectric displacement region includes a plurality of piezoelectric displacement units 41, by setting the relative positions of the plurality of piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, when the piezoelectric refrigeration region absorbs heat, the piezoelectric displacement region can better drive the piezoelectric functional film layer 4 to displace in the reverse direction, thereby realizing the separation of the heat release and heat absorption positions of the electrocaloric element 100.

[0101] Optionally, the piezoelectric refrigeration region includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement region includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array.

[0102] The arrangement of the plurality of piezoelectric refrigeration units 42 in an array can make the heat release or heat absorption of each part of the electrocaloric element 100 balanced, which is convenient for heat dissipation during heat release or heat entry during heat absorption. The arrangement of the plurality of piezoelectric displacement units 41 in an array can make the force for the piezoelectric displacement region to drive the electrocaloric element 100 to displace in the reverse direction be evenly applied to the electrocaloric element 100 when the piezoelectric refrigeration region of the electrocaloric element 100 absorbs heat, so that each part of the electrocaloric element 100 displaces in the reverse direction synchronously, which is convenient for the electrocaloric element 100 to contact the heat transfer medium.

[0103] Optionally, the piezoelectric refrigeration region includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are arranged at intervals. The piezoelectric displacement region includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are arranged at intervals.

[0104] The arrangement of two adjacent piezoelectric refrigeration units 42 at intervals among the plurality of piezoelectric refrigeration units 42 can balance the heat release or heat absorption of each part of the electrocaloric element 100, which is convenient for heat dissipation during heat release or heat entry during heat absorption. On this basis, other functional modules, such as piezoelectric displacement units 41, can be arranged between two adjacent piezoelectric refrigeration units 42. Similarly, the arrangement of two adjacent piezoelectric displacement units 41 at intervals among the plurality of piezoelectric displacement units 41 can evenly apply the force for the piezoelectric displacement region to drive the electrocaloric element 100 to displace in the reverse direction to the electrocaloric element 100 when the piezoelectric refrigeration region of the electrocaloric element 100 absorbs heat. On this basis, other functional modules, such as piezoelectric refrigeration units 42, can be arranged between two adjacent piezoelectric displacement units 41.

[0105] Optionally, the piezoelectric refrigeration units 42 and the piezoelectric displacement units 41 are alternately arranged at intervals with each other.

[0106] A plurality of piezoelectric refrigeration units 42 and a plurality of piezoelectric displacement units 41 are alternately arranged at intervals with respect to each other. When the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 moves in the reverse direction to drive the adjacent piezoelectric refrigeration unit 42 to move in the reverse direction, so that the electrocaloric element 100 moves in the reverse direction and has a high flatness after displacement, facilitating the heat transfer between the electrocaloric element 100 and the heat transfer medium.

[0107] Optionally, the piezoelectric refrigeration region includes a first piezoelectric refrigeration unit 42, and the piezoelectric displacement region includes a first piezoelectric displacement unit 41 adjacent to the first piezoelectric refrigeration unit 42. Among them, the length of the first piezoelectric refrigeration unit 42 is greater than or equal to the length of the first piezoelectric displacement unit 41; or, the width of the first piezoelectric refrigeration unit 42 is greater than or equal to the width of the first piezoelectric displacement unit 41; or, the area of the first piezoelectric refrigeration unit 42 is greater than or equal to the area of the first piezoelectric displacement unit 41.

[0108] The piezoelectric functional film layer 4 is a thin film layer structure, and the length, width or area can be understood as dimensions. Therefore, it can be understood that the size of the adjacent first piezoelectric refrigeration unit 42 is larger than that of the first piezoelectric displacement unit 41, thereby increasing the heat release or absorption amount of the electrocaloric element 100.

[0109] Optionally, the piezoelectric functional film layer 4 includes a first piezoelectric functional surface and a second piezoelectric functional surface opposite to the first piezoelectric functional surface. Among them, the first piezoelectric functional surface includes a piezoelectric refrigeration region and a piezoelectric displacement region, and the second piezoelectric functional surface only includes a piezoelectric refrigeration region.

[0110] The piezoelectric functional film layer 4 is a thin film layer structure with a thickness. Taking the thin film layer including a first sub-film layer and a second sub-film layer that are bonded to each other as an example. The first piezoelectric functional surface corresponds to the first sub-film layer and includes a piezoelectric refrigeration region and a piezoelectric displacement region; the second piezoelectric functional surface corresponds to the second sub-film layer and only includes a piezoelectric refrigeration region without a piezoelectric displacement region. Regarding the first sub-film layer and the second sub-film layer as a whole, that is, the piezoelectric functional film layer 4 forms a piezoelectric displacement region embedded structure. The piezoelectric displacement region embedded structure increases the size of the piezoelectric refrigeration region in the piezoelectric functional film layer 4, thereby increasing the heat release or absorption amount of the electrocaloric element 100.

[0111] Optionally, a distinguishing gap for distinguishing between these two functional unit regions is provided between the adjacent piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41. Setting the distinguishing gap can partition the functional unit regions to realize the electrocaloric effect excited by the piezoelectric refrigeration unit 42 and the piezoelectric effect excited by the piezoelectric displacement unit 41 without mutual influence.

[0112] Optionally, the distinguishing gap is in a strip shape, a grid shape or an irregular shape. It can be understood that the shape of the distinguishing gap is not specifically limited, as long as it can separate the two functional units on both sides of the distinguishing gap to realize different functional unit partitions.

[0113] Optionally, the distinguishing gap is an air gap.

[0114] Optionally, the distinguishing gap includes a first distinguishing gap, a second distinguishing gap, and a third distinguishing gap arranged in sequence. Wherein, a first piezoelectric refrigeration unit 42 is arranged between the first distinguishing gap and the second distinguishing gap, and a first piezoelectric displacement unit 41 is arranged between the second distinguishing gap and the third distinguishing gap.

[0115] It can be understood that they are arranged in sequence as the first distinguishing gap, the first piezoelectric refrigeration unit 42, the second distinguishing gap, the first piezoelectric displacement unit 41, and the third distinguishing gap, that is, a distinguishing gap is provided between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 to avoid mutual influence between different functional units.

[0116] Optionally, the distinguishing gap includes an etched distinguishing gap formed by etching. The distinguishing gap is formed by etching, with a simple process, and enables the electrocaloric element 100 to integrate different functional units of the electrocaloric effect and the piezoelectric effect simultaneously.

[0117] Optionally, the piezoelectric displacement region includes a through-type piezoelectric displacement unit 41. Wherein, the through-type piezoelectric displacement unit 41 includes a first through distinguishing gap 431 and a second through distinguishing gap 433, and both the first through distinguishing gap 431 and the second through distinguishing gap 433 penetrate through the piezoelectric film layer; and, a first through piezoelectric displacement unit 432 is arranged between the first through distinguishing gap 431 and the second through distinguishing gap 433.

[0118] Figure 7 Shown is the electrocaloric element 100 including the through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through distinguishing gap 431, a first through piezoelectric displacement unit 432, and a second through distinguishing gap 433 arranged in sequence, and Figure 7 as shown in, the first through distinguishing gap 431 and the second through distinguishing gap 433 have the same height as the first through piezoelectric displacement unit 432, that is, both the first through distinguishing gap 431 and the second through distinguishing gap 433 penetrate through the piezoelectric film layer. Such a setting can avoid the mutual influence between the first through piezoelectric displacement unit 432 and the adjacent piezoelectric refrigeration units 42 on both sides. Moreover, by setting the piezoelectric displacement region as the through-type piezoelectric displacement unit 41, the piezoelectric displacement region and the piezoelectric refrigeration region can share the second electrode layer 2, and in the preparation method, only the first electrode layer 1 needs to be etched for the preparation of the electrode layer, without secondary etching of the electrode layer.

[0119] Specifically, a positive voltage is applied to the first electrode layer 1 and the second electrode layer 2, and a positive electric field is formed between the first electrode layer 1 and the second electrode layer 2. At this time, the electrocaloric displacement region and the electrocaloric refrigeration region of the piezoelectric functional film layer 4 simultaneously excite the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces in the positive direction and releases heat. After that, the electrocaloric refrigeration electrode region 11 in the first electrode layer 1 is powered off, that is, the electric field corresponding to the electrocaloric refrigeration region is removed, and the electrocaloric refrigeration region excites the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric drive electrode region 12 in the first electrode layer 1 and the second electrode layer 2, and a reverse electric field is formed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric displacement region excites the piezoelectric effect to displace in the reverse direction. The electrocaloric element 100 releases heat and displaces in the positive direction, absorbs heat and displaces in the reverse direction, realizing heat separation.

[0120] Optionally, the electrocaloric element 100 further includes a base layer 5. The base layer 5 is disposed below the second electrode layer 2.

[0121] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. The base layer 5 is disposed below the second electrode layer 2 of the electrocaloric element 100, which can support the thin film structure and provide an operation platform during preparation. The setting of the base layer 5 can also maintain the flatness of the electrocaloric element 100, so that the electrocaloric element 100 can be close to the heat transfer medium when transferring heat.

[0122] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electrocaloric refrigeration electrode region 11 and a piezoelectric drive electrode region 12. Among them, the electrocaloric refrigeration electrode region 11 corresponds to the electrocaloric refrigeration region, and the piezoelectric drive electrode region 12 corresponds to the piezoelectric displacement region. A positive electric field is applied to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region and the electrocaloric refrigeration region to displace in the first direction; or, the electric field of the electrocaloric refrigeration motor region is removed, and the electrocaloric refrigeration region of the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region to drive the electrocaloric refrigeration region that absorbs heat to displace in the second direction.

[0123] Corresponding to the two different functional units of the electrocaloric refrigeration region and the piezoelectric displacement region, different electric fields need to be applied to the electrodes to excite different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated into an electrocaloric refrigeration electrode region 11 corresponding to the electrocaloric refrigeration region and a piezoelectric drive electrode region 12 corresponding to the piezoelectric displacement region, and different electric fields are applied to the electrocaloric refrigeration electrode region 11 and the second electrode layer 2 and the piezoelectric drive electrode region 12 and the second electrode layer 2 to realize the excitation of different functional effects.

[0124] Optionally, the electrode gap 13 is correspondingly arranged with the distinguishing gap.

[0125] Optionally, the electrode gap 13 communicates with the distinguishing gap to form a through-type gap. The electrode gap 13 corresponds to the distinguishing gap, so that when different electric fields are applied to different regions of the first electrode layer 1, different functional effects can be excited in the functional regions corresponding to the electrode regions. Further, the communication between the electrode gap 13 and the distinguishing gap enables adjacent different functional units to be independent of each other.

[0126] The embodiments of the present disclosure provide a method for manufacturing an electrocaloric element.

[0127] In some embodiments, as shown in Figure 8 the method for manufacturing the electrocaloric element 100 includes:

[0128] S301, depositing a second electrode layer 2 on the base layer 5;

[0129] S302, depositing a piezoelectric film layer on the second electrode layer 2;

[0130] S303, depositing a first electrode layer 1 on the piezoelectric film layer;

[0131] S304, etching the first electrode layer 1 and the piezoelectric film layer to obtain the electrocaloric element 100. Among them, the electrocaloric element 100 is the aforementioned electrocaloric element 100.

[0132] Optionally, the piezoelectric film layer includes a piezoelectric ceramic film layer.

[0133] The electrocaloric effect is a thermal effect of ferroelectric materials under an electric field, where heat is released when an electric field is applied and heat is absorbed when the electric field is removed. The ferroelectric thin film is excited by applying a high electric field through the electrodes on both sides to generate a periodic electrocaloric effect. The research on solid-state electrocaloric refrigeration materials can be divided into three categories: inorganic, organic, and inorganic-organic composite materials. Among them, inorganic materials mainly focus on the lead-containing reference system of lead zirconate titanate-based piezoelectric ceramics (PZT), and their geometric forms mainly include bulk ceramics, thin films, thick films, and multi-layer thick films. The piezoelectric film layer disclosed in the embodiments of the present disclosure includes a piezoelectric ceramic film layer, that is, an inorganic ferroelectric material.

[0134] On the one hand, compared with organic ferroelectric materials that require a high voltage (such as kilovolt-level voltage) to excite the electrocaloric effect, inorganic ferroelectric materials require a smaller voltage (such as hundred-volt-level voltage) to excite the electrocaloric effect. Moreover, a high voltage is likely to break down the thin film, resulting in a short service life of the electrocaloric element 100, while a low voltage extends the service life of the electrocaloric element 100.

[0135] On the other hand, inorganic thin-film ferroelectric materials have a large adiabatic temperature change and a wide ferroelectric phase transition temperature range, so refrigeration applications with a wide temperature range and a large temperature difference can be achieved. At the same time, the synthesis process of low-temperature crystallized ferroelectric thin films can be compatible with semiconductor microelectromechanical (CMOS / MEMs) processes, realizing the integration of the piezoelectric functional film layer 4 in the electrocaloric element 100 on the base layer 5 (such as a silicon wafer), and the substrate can be removed by means of lithography to achieve a larger self-temperature change.

[0136] Optionally, the piezoelectric ceramic film layer includes a lead zirconate titanate-based piezoelectric ceramic film layer.

[0137] Optionally, the piezoelectric ceramic film layer includes a lead lanthanum zirconate titanate ceramic film layer.

[0138] Ferroelectric dielectrics such as lead zirconate titanate-based piezoelectric ceramic film layers (PZT) or lead lanthanum zirconate titanate ceramic film layers (PLZT) have both piezoelectricity and electrocaloric effect at the same time. Therefore, the same material can be used in the piezoelectric displacement region and the piezoelectric refrigeration region and deposited on the same layer. Only by controlling the different electric fields applied by the electrode layer can the function be distinguished.

[0139] Optionally, the thickness of the deposited piezoelectric film layer is greater than or equal to 8 μm and less than or equal to 20 μm.

[0140] Optionally, etching the first electrode layer 1 and the piezoelectric film layer includes: etching the first electrode layer to obtain an electrode gap 13; performing through-etching on the piezoelectric film layer to obtain a through-separation gap, as well as a piezoelectric refrigeration unit 42 and a through-type piezoelectric displacement unit 41 located between the through-separation gaps.

[0141] Optionally, the base layer 5 includes a silicon wafer.

[0142] Optionally, before depositing the second electrode layer 2 on the base layer 5, it further includes: oxidizing the surface of the silicon wafer to obtain a silicon-on-insulator substrate; performing hydrogen implantation on the silicon-on-insulator substrate to reduce the thickness of the silicon-on-insulator substrate; bonding the oxide layer of the silicon-on-insulator substrate to the substrate silicon. The substrate silicon has a large thickness and serves to provide mechanical support for the silicon-on-insulator substrate, facilitating subsequent operations on the base layer 5.

[0143] Optionally, after etching the first electrode layer 1 and the piezoelectric film layer, it further includes: removing the substrate silicon and the oxide layer and thinning the silicon wafer. Among them, the substrate silicon and the oxide layer are removed by mechanical thinning, and the thickness of the thinned silicon wafer is greater than or equal to 8 μm and less than or equal to 13 μm.

[0144] Optionally, the piezoelectric film layer is deposited by the sol-gel method.

[0145] The electrocaloric refrigeration chip disclosed in the embodiments of the present disclosure has a piezoelectric film layer of the electrocaloric element 100 directly partitioned to form a piezoelectric displacement region, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 releases heat and fits against the heat receiving end 300, and absorbs heat and fits against the cold quantity receiving end 400. The electrocaloric refrigeration chip has a self-integrated hot and cold separation structure, enhancing stability.

[0146] Combined with Figures 9 to 11 As shown, the embodiments of the present disclosure provide an electrocaloric refrigeration chip, including an electrocaloric element 100, a clamping framework, a heat receiving end 300, and a cold quantity receiving end 400. The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. Among them, the piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement. The clamping framework includes a first clamping framework 201 clamped to the first side of the first end of the electrocaloric element 100, and a second clamping framework 202 clamped to the second side of the first end of the electrocaloric element 100. The heat receiving end 300 is disposed on the side of the first clamping framework 201 for receiving the heat of the electrocaloric element 100. The cold quantity receiving end 400 is disposed on the side of the second clamping framework 202 for receiving the cold quantity of the electrocaloric element 100.

[0147] The electrocaloric refrigeration chip includes an electrocaloric element 100. The piezoelectric film layer of the electrocaloric element 100 is directly partitioned to form a piezoelectric displacement region, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region. At the same time, a heat receiving end 300 and a cold quantity receiving end 400 are respectively disposed on both sides of the electrocaloric element 100, and the first end of the electrocaloric element 100 is clamped to the clamping framework. When a positive electric field is applied to both the piezoelectric refrigeration region and the piezoelectric displacement region simultaneously, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, undergoes a positive displacement and releases heat, and the clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 fits against the heat receiving end 300, as Figure 10 . When the application of the electric field to the piezoelectric refrigeration region stops and a reverse electric field is applied to the piezoelectric displacement region, the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, the piezoelectric displacement region undergoes a reverse displacement due to the piezoelectric effect, and further drives the piezoelectric functional film layer 4 to undergo a reverse displacement. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 fits against the cold quantity receiving end 400, as Figure 11 . The electrocaloric refrigeration chip has a self-integrated hot and cold separation structure, enhancing stability.

[0148] It can be understood that the electrocaloric element 100 in the electrocaloric refrigeration chip is the electrocaloric element 100 in the form of an internally integrated thermal switch as described above.

[0149] Optionally, the electrocaloric element 100 further includes a base layer 5 disposed below the second electrode layer 2. Among them, the first clamping framework 201 is disposed on the first electrode layer 1 of the electrocaloric element 100, and the second clamping framework 202 is disposed on the base layer 5 of the electrocaloric element 100.

[0150] The piezoelectric functional film layer 4, the first electrode layer 1, and the second electrode layer 2 are combined to form a thin-film structure. A base layer 5 is disposed below the second electrode layer 2 of the electrocaloric element 100 to support the thin-film structure. The setting of the base layer 5 can also maintain the flatness of the electrocaloric element 100, enabling the electrocaloric element 100 to be close to the heat transfer medium during heat transfer. Correspondingly, the first clamping framework 201 is disposed above the first electrode layer 1 of the electrocaloric element 100, and the second clamping framework 202 is disposed below the base layer 5 of the electrocaloric element 100.

[0151] Optionally, a first bending gap 203 is provided between the first side of the electrocaloric element 100 and the heat receiving end 300. Among them, the first bending gap 203 is used for the first side of the electrocaloric element 100 to bend towards the heat receiving end 300 and fit with the heat receiving end 300. And / or, a second bending gap 204 is provided between the second side of the electrocaloric element 100 and the cold receiving end 400. Among them, the second bending gap 204 is used for the second side of the electrocaloric element 100 to bend towards the cold receiving end 400 and fit with the cold receiving end 400.

[0152] The settings of the first bending gap 203 and the second bending gap 204 increase the volume of the electrocaloric refrigeration chip. The thickness of the first bending gap 203, the thickness of the electrocaloric element 100, plus the thickness of the second bending gap 204 is the distance between the heat receiving end 300 and the cold receiving end 400, increasing the separation distance between the cold and heat of the electrocaloric element 100, which is convenient for the electrocaloric refrigeration chip to be actually applied to household appliances.

[0153] Optionally, the first electrode layer 1 includes a first clamping portion disposed at the end for clamping with the first clamping framework 201, and a first fitting portion extending along the first clamping portion. Among them, the first bending gap 203 is provided between the first fitting portion and the heat receiving end 300. And / or, the base layer 5 includes a second clamping portion disposed at the end for clamping with the second clamping framework 202, and a second fitting portion extending along the second clamping portion. Among them, the second bending gap 204 is provided between the second fitting portion and the cold receiving end 400.

[0154] The first electrode layer 1 includes a first clamping portion and a first fitting portion extending along the first clamping portion. Among them, the first clamping portion is located at the end of the first electrode layer 1. The first clamping portion is used to fit with the first clamping skeleton 201. The position where the first clamping skeleton 201 is arranged is between the first clamping portion and the heat receiving end 300. The first clamping skeleton 201 not only plays a role in clamping the first side of the end portion of the electrocaloric element 100, but also plays a role in supporting the electrocaloric element 100 to construct the first bending gap 203. Similarly, the base layer 5 includes a second clamping portion and a second fitting portion extending along the second clamping portion. Among them, the second clamping portion is located at the end of the base layer 5. The second clamping portion is used to fit with the second clamping skeleton 202. The position where the second clamping skeleton 202 is arranged is between the second clamping portion and the cold receiving end 400. The second clamping skeleton 202 not only plays a role in clamping the second side of the end portion of the electrocaloric element 100, but also plays a role in supporting the electrocaloric element 100 to construct the second bending gap 204.

[0155] Optionally, the electrocaloric refrigeration chip further includes a support skeleton 205. The support skeleton 205 is supported between the heat receiving end 300 and the cold receiving end 400, and the support skeleton 205 is arranged at the second end of the electrocaloric element 100.

[0156] The first end of the electrocaloric element 100 is clamped by the first clamping skeleton 201 and the second clamping skeleton 202, and the first clamping skeleton 201 and the second clamping skeleton 202 simultaneously support the first end of the electrocaloric refrigeration chip. At the same time, a support skeleton for support is also required to be arranged at the second end of the electrocaloric refrigeration chip. One end of the support skeleton 205 abuts against the heat receiving end 300, and the other end abuts against the cold receiving end 400, thereby supporting the second end of the electrocaloric refrigeration chip.

[0157] Optionally, the second end of the electrocaloric element 100 abuts against the support skeleton 205; or, there is a gap between the second end of the electrocaloric element 100 and the support skeleton 205.

[0158] The second end of the electrocaloric element 100 can abut against the support skeleton 205 or there can be a gap. Combining Figure 10 and Figure 11 As shown, the second end of the electrocaloric element 100 in the electrocaloric refrigeration chip is not fixedly arranged. When the electrocaloric element 100 releases heat, it displaces and fits with the heat receiving end 300. When the electrocaloric element 100 absorbs heat, it displaces and fits with the cold receiving end 400, forming a cantilever beam structure. Compared with the arrangement form of the electrocaloric element 100 where both ends are clamped, the contact area between the electrocaloric element 100 and the heat receiving end 300 or the cold receiving end 400 is larger, and the heat transfer efficiency is improved.

[0159] Optionally, the heat receiving end 300 includes an insulating and heat-conducting layer, and / or the cold receiving end 400 includes an insulating and heat-conducting layer. The heat receiving end 300 and / or the cold receiving end 400 are insulated to prevent loss caused by current leakage of the first electrode layer 1 or the second electrode layer 2. The heat receiving end 300 and / or the cold receiving end 400 are heat-conducting to conduct the heat or cold of the electrocaloric element 100.

[0160] Optionally, the insulating and heat-conducting layer includes aluminum nitride / silicon carbide (AlN / SiC) composite ceramics.

[0161] Optionally, the first clamping skeleton 201, the second clamping skeleton 202, and / or the support skeleton 205 include insulating and heat-insulating skeletons. The heat insulation of each skeleton enables energy to be conducted out from the heat receiving end 300 or the cold receiving end 400, improving the heat and cold separation efficiency of the electrocaloric refrigeration chip.

[0162] Optionally, the insulating and heat-insulating skeleton includes an alumina skeleton.

[0163] In some embodiments, the electrocaloric refrigeration device 520 includes one or more of the foregoing electrocaloric refrigeration chips. Multiple electrocaloric refrigeration chips can increase the heat or cold of the electrocaloric refrigeration device 520, facilitating the application of the electrocaloric refrigeration device 520 in large equipment.

[0164] When the electrocaloric refrigeration device 520 includes multiple electrocaloric refrigeration chips, the multiple electrocaloric refrigeration chips can be arranged in an array. This enables the electrocaloric refrigeration device 520 to release or absorb heat evenly in each part, and the electrocaloric refrigeration device 520 forms a square structure, facilitating the application of the electrocaloric refrigeration device 520 in large equipment.

[0165] Optionally, the first electrode layer 1 is provided with an electrode gap 13. The electrode gap 13 divides the first electrode layer 1 into an electrocaloric refrigeration electrode region 11 and a piezoelectric drive electrode region 12. Among them, the electrocaloric refrigeration electrode region 11 corresponds to the piezoelectric refrigeration region, and the piezoelectric drive electrode region 12 corresponds to the piezoelectric displacement region. The electrocaloric refrigeration device 520 further includes an external power supply, where the external power supply is used to: apply a positive electric field to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region and the piezoelectric refrigeration region to generate displacement in the first direction; or, remove the electric field in the electrocaloric refrigeration electrode region, the piezoelectric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, apply a reverse electric field to the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region to drive the heat-absorbing piezoelectric refrigeration region to generate displacement in the second direction.

[0166] Corresponding to the two different functional units of the piezoelectric refrigeration region and the piezoelectric displacement region, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with electrode gaps 13, so that the first electrode layer 1 is separated to form an electrocaloric refrigeration electrode region 11 corresponding to the piezoelectric refrigeration region and a piezoelectric drive electrode region 12 corresponding to the piezoelectric displacement region, and different electric fields are applied to the electrocaloric refrigeration electrode region 11 and the second electrode layer 2 and the piezoelectric drive electrode region 12 and the second electrode layer 2 to achieve the stimulation of different functional effects. To Figures 9 to 11 illustrate, a positive electric field is applied to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12, so that the piezoelectric displacement region and the piezoelectric refrigeration region generate displacements in the first direction, that is Figure 10 move upward in the figure, the electrocaloric element 100 releases heat and adheres to the heat receiving end 300; the electric field of the electrocaloric refrigeration motor region is removed, the piezoelectric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, a reverse electric field is applied to the piezoelectric drive electrode region 12, so that the piezoelectric displacement region drives the heat-absorbing piezoelectric refrigeration region to generate a displacement in the second direction, that is Figure 11 move downward in the figure, and the electrocaloric element 100 absorbs heat and adheres to the cold quantity receiving end 400.

[0167] The above description and drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural and other changes. Embodiments merely represent possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or substituted for parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A heat source component, characterized in that, it includes a heat source tank and one or more electrocaloric spray heat exchange components arranged in the heat source tank. The heat source tank includes a hot working fluid outlet and a cold working fluid outlet. The electrocaloric spray heat exchange component includes: an electrocaloric refrigeration device that alternately generates heat and cold; a spray component for spraying a heat exchange working fluid onto the surface of the electrocaloric refrigeration device to enable heat exchange between the heat exchange working fluid and the electrocaloric refrigeration device; and, an inclination control member for controlling the inclination of the electrocaloric refrigeration device, wherein when the electrocaloric refrigeration device generates heat, the inclination control member controls the electrocaloric refrigeration device to incline towards the hot working fluid outlet so that the heat-exchanged hot working fluid flows out from the hot working fluid outlet; when the electrocaloric refrigeration device generates cold, the inclination control member controls the electrocaloric refrigeration device to incline towards the cold working fluid outlet so that the heat-exchanged cold working fluid flows out from the cold working fluid outlet.

2. The heat source component according to claim 1, characterized in that, the heat source tank further includes: a first diversion groove for diverting the hot working fluid to the hot working fluid outlet; and, a second diversion groove for diverting the cold working fluid to the cold working fluid outlet.

3. The heat source component according to claim 2, characterized in that, the electrocaloric refrigeration device includes opposite first and second ends, wherein, the first diversion groove includes a first diversion bottom wall communicating with the hot working fluid outlet and a first diversion side wall extending upward from the first diversion bottom wall, and the first diversion side wall is arranged at the first end of the electrocaloric refrigeration device; the second diversion groove includes a second diversion bottom wall communicating with the cold working fluid outlet and a second diversion side wall extending upward from the second diversion bottom wall, and the second diversion side wall is arranged at the second end of the electrocaloric refrigeration device.

4. The heat source component according to claim 3, characterized in that, the electrocaloric refrigeration device includes a spray surface for spray heat exchange with the heat exchange working fluid and a support surface opposite to the spray surface, wherein, the inclination control member includes an inclined support member arranged on the support surface of the electrocaloric refrigeration device.

5. The heat source component according to claim 4, characterized in that, the set height of the inclined support member is higher than the heights of the first diversion side wall and the second diversion side wall.

6. The heat source component according to claim 3, characterized in that, the inclination control member further includes: a first electromagnetic element arranged on the first diversion side wall for attracting the first end of the electrocaloric refrigeration device; and, a second electromagnetic element arranged on the second diversion side wall for attracting the second end of the electrocaloric refrigeration device.

7. The heat source component according to claim 1, characterized in that, the spray component includes a spray pipe and a plurality of spray heads arranged on the spray pipe.

8. The heat source component according to claim 7, characterized in that, the plurality of spray heads are sequentially arranged along the length direction of the electrocaloric refrigeration device.

9. The heat source component according to any one of claims 1 to 8, characterized in that, the electrocaloric refrigeration device includes an electrocaloric refrigeration chip, and the electrocaloric refrigeration chip includes: an electrocaloric element including a first electrode layer, a second electrode layer, and a piezoelectric functional film layer. The piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. The piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement; A heat receiving end, configured to receive the heat of the electrocaloric element; and, A cold receiving end, configured to receive the cold of the electrocaloric element.

10. A heat exchange system, characterized in that, it includes a heat source assembly according to any one of claims 1 to 9.

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