A test module and a test system

Abstract

A test module and a test system, which relate to the technical field of semiconductor lasers. By arranging a light blocking sheet between the detection light and the laser module, the test module blocks the detection light from irradiating onto the highly reflective solder, avoiding the detection light being reflected from the solder and then returning to the cavity surface of the laser chip through the detection light light source optical path, thereby improving the measurement accuracy; by optimizing and defining the shape of the light blocking sheet and its relative position with respect to the laser chip, the influence on the detection light received by the laser chip due to the addition of the light blocking sheet is reduced, further improving the measurement accuracy; in addition, in the test system including the above test module, by setting a spatial position adjustment module, the relative position between the light blocking sheet and the laser module is adjustable, so that the light blocking sheet can adapt to the cavity surface measurement of different laser modules, effectively ensuring the test accuracy of the test system, broadening the adaptation range of the test module for the laser module, and greatly promoting the industrial application of the test system.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor lasers, and particularly relates to a test module and a test system. Background Art

[0002] Measuring the facet temperature of a semiconductor laser is crucial for thermal management, performance optimization, reliability assessment, fault diagnosis, research on thermal lens effect, material research, and process improvement, which helps to improve the device performance and reliability. The thermal reflection method is an effective technique for measuring the facet temperature of a semiconductor laser, with advantages such as non-contact, high resolution, and fast response, and it is widely used in research and development, testing, and fault analysis.

[0003] It should be noted that a layer of metal is generally plated around the front surface of the existing common COS heat sink, which can drain the molten solder to the front surface of the heat sink, thereby improving the packaging yield of the chip. However, in a semiconductor laser facet temperature test device based on CCD imaging thermal reflection technology, there are inevitable reflections in the optical path, which will cause the actual beam irradiating the facet to be the sum of the ideal beam and the reflected beam. In addition, in actual operation, due to the high reflectivity and high thermal reflection coefficient of the indium solder layer for the detection beam, the intensity of this reflected beam is high and variable, which will seriously affect the measurement accuracy of the chip facet temperature. Summary of the Invention

[0004] The purpose of the present application is to provide a test module and a test system to meet the requirements of low reflectivity and high accuracy in chip facet testing.

[0005] An embodiment of the present application provides a test module, which includes:

[0006] A laser module, the laser module includes a laser chip and a heat sink, the laser chip is attached to the heat sink to form an interface, and a solder overflow area is provided on a first side of the heat sink close to the detection light;

[0007] A light blocking plate, the solder overflow area is located between the light blocking plate and the heat sink, and the light blocking plate is used to block the detection light from irradiating the solder overflow area.

[0008] Further, in a preferred embodiment of the present invention, the distance from the point on the light blocking plate closest to the interface to the optical axis plane of the laser chip parallel to the interface is H, the vertical divergence angle of the laser beam emitted by the laser chip is γ, the distance between the first side of the heat sink and the second side of the laser chip close to the detection light is x, the conical surface of the spatial region corresponding to γ is the divergence angle boundary surface, and the distance between the point on the top surface of the light blocking plate closest to the divergence angle boundary surface and the first side of the heat sink is y, and the H, γ, x, and y satisfy:

[0009] (y - x) / tanγ / 2 < H。

[0010] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface is a flat top surface. When the detection light irradiates the flat top surface of the light shield, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface.

[0011] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface is set as an inclined top surface, the inclined top surface faces the detection light, and the top end of the inclined top surface is flush with the joint surface;

[0012] The complementary angle of the angle between the inclined top surface and the joint surface is β, and the complementary angle of the angle formed by the connection line between the bottommost light point far from the detection light optical axis of the detection light and the topmost point of the light shield and the joint surface is α, and β < α.

[0013] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface includes an inclined surface and a flat surface in sequence along the direction from far away from the first side to close to the first side;

[0014] When the detection light irradiates the flat surface of the light shield, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface.

[0015] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface includes an inclined surface part, the inclined surface part faces the detection light, and the complementary angle of the angle between the inclined surface part and the joint surface is β, and β and γ satisfy:

[0016] β < 90° - γ / 2.

[0017] Further, in a preferred embodiment of the present invention, an absorbent material and / or blackening treatment is provided on the surface of the light shield for blocking the detection light.

[0018] Further, in a preferred embodiment of the present invention, a curved surface structure is provided on the surface of the light shield for blocking the detection light, so that when the detection light irradiates the curved surface structure, the detection light will be reflected outside the main light path.

[0019] An embodiment of the present application further provides a test system, which includes the aforementioned test module.

[0020] Further, in a preferred embodiment of the present invention, the test system further includes a heat dissipation platform and a spatial position adjustment module for adjusting the relative positions of the light shielding sheet and the laser module. The spatial position adjustment module is disposed in the test module and mounted on the heat dissipation platform.

[0021] Further, in a preferred embodiment of the present invention, the spatial position adjustment module includes a first adjustment module and a second adjustment module;

[0022] The first adjustment module is used to adjust the light shielding sheet and the laser module to approach or move away from each other. The first adjustment module includes a first motor and a first moving member. The light shielding sheet is fixedly connected to the first moving member. The first motor is fixed to the heat dissipation platform. The first motor drives the first moving member to move, thereby driving the light shielding sheet to approach or move away from the laser module;

[0023] The second adjustment module includes a limiting component and a second motor. The limiting component at least includes a moving limiting member; the moving limiting member is detachably and fixedly connected to the laser module. The second motor is mounted on the heat dissipation platform. The second motor drives the moving limiting member to move, thereby driving the laser module to move in a plane perpendicular to the optical axis of the detection light.

[0024] The technical solutions in the embodiments of the present application can achieve the following technical effects:

[0025] The test module provided by the embodiment of the present application, by arranging a light shielding sheet between the detection light and the laser module to block the detection light from irradiating on the highly reflective solder in the solder overflow area, avoids the detection light from being reflected by the solder and then returning to the cavity surface of the laser chip through the detection light source optical path, thereby improving the measurement accuracy; by optimizing and defining the shape of the light shielding sheet, the influence on the detection light received by the laser chip due to the addition of the light shielding sheet is reduced, ensuring the measurement accuracy;

[0026] Further, by combining the characteristics of the designed shape of the light shielding sheet and the reasonable configuration of the relative position between the light shielding sheet and the laser chip, the setting of the light shielding sheet not only does not affect the detection light from irradiating on the laser chip, but also does not affect the emitted light of the laser chip, thereby further ensuring the measurement accuracy; in addition, by performing a curved surface design, an absorbent material setting, and / or a blackening treatment on the surface of the light shielding sheet for blocking the detection light, it effectively avoids the light shielding sheet from reflecting the detection light back to the original detection light optical path and then reflecting it to the laser chip, thereby further improving the measurement accuracy of the test module.

[0027] Furthermore, the test system provided by the embodiments of the present application can adjust the relative position between the light blocking sheet and the laser module by setting a spatial position adjustment module, so that the light blocking sheet can adapt to the cavity surface measurement of different laser modules. Thus, on the basis of effectively ensuring the test accuracy of the test system, the adaptation range of the test module for the laser module is broadened, which greatly promotes the industrial application of the test system.

[0028] Other features and advantages of the present application will be described in the following specification, and some of them will become obvious from the specification or be understood by implementing the technical solutions of the present application. The objectives and other advantages of the present application can be achieved and obtained through the structures and / or processes specifically pointed out in the specification, claims, and drawings. Brief Description of the Drawings

[0029] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, objectives, and advantages of the present application will become more obvious:

[0030] Figure 1 is a schematic diagram of the temperature measurement principle based on the photo-thermal reflection technology in the present application;

[0031] Figure 2 is a schematic diagram of the laser cavity surface temperature tester based on the photo-thermal reflection technology in the present application;

[0032] Figure 3a is a schematic diagram of the structure of a laser device in the prior art;

[0033] Figure 3b is a COS imaging image in the prior art;

[0034] Figure 3c is a schematic diagram of the formation principle of related concepts such as non-shadow area, penumbra area, and umbra area;

[0035] Figure 4 is a schematic diagram of the structure of the test module in the first embodiment of the present application;

[0036] Figure 5 is a schematic top view of the test system in the first embodiment of the present application;

[0037] Figure 6 is a schematic top view of the light blocking sheet of the test module in the second embodiment of the present application;

[0038] Figure 7 is a schematic diagram of the structure of the test module in the third embodiment of the present application;

[0039] Figure 8 is a schematic diagram of the structure of the test module in the fourth embodiment of the present application;

[0040] Figure 9 It is a schematic structural diagram of the test module in the fifth embodiment of the present application;

[0041] Figure 10 It is a schematic structural diagram of the test module in the sixth embodiment of the present application.

[0042] Icons: 1 - Probe light; 2 - Sample under test; 3 - Objective lens; 4 - Dichroic mirror; 5 - Focusing lens; 6 - Beam splitter; 7 - Filter; 8 - Imaging lens; 9 - CCD camera; 10 - Test system; 11 - Laser beam; 12 - Phase-locked signal generator; 14 - Solder; 15 - Non-shadow area; 16 - Penumbra area; 162 - Half-shadow area; 17 - Umbra area; 100 - Laser module; 101 - Heat sink platform; 110 - Laser chip; 112 - Second side; 114 - Optical axis plane of the laser chip; 115 - Junction surface; 116 - Divergence angle boundary surface; 120 - Heat sink; 122 - First side; 130 - Light blocking plate; 140 - Solder overflow area; 150 - Spatial position adjustment module; 152 - First adjustment module; 1522 - First micro-control motor; 1524 - First moving part; 154 - Second adjustment module; 1541 - Fixed limit part; 1542 - Limit component; 1543 - Moving limit part; 1544 - Second micro-control motor; 230 - Second light blocking plate; 330 - Third light blocking plate; 430 - Fourth light blocking plate; 530 - Fifth light blocking plate; 630 - Sixth light blocking plate. Detailed implementation manners

[0043] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related invention, rather than limiting the invention. Additionally, it should be noted that for the sake of description, only the parts related to the relevant invention are shown in the drawings.

[0044] Illustrative laser test system

[0045] For current laser tests, it is a common laser test scenario to measure the temperature of the laser cavity surface using the temperature measurement principle of the photothermal reflection technique. It should be noted that the test module and test system provided by the present application include but are not limited to the measurement of the laser cavity surface temperature.

[0046] In order to enable those skilled in the art to clearly understand the solution of the present application, the following takes the measurement of the laser cavity surface temperature as an example to elaborate on the brief principle of the thermal reflection measurement method and the corresponding system.

[0047] As Figure 1As shown in the figure, it is a schematic diagram of the temperature measurement principle based on the photo-thermal reflection technology. When the temperature of the sample to be measured changes, due to the shift of the band gap and the change of the broadening parameter, the dielectric function of the material changes, resulting in the change of the sample reflectivity. When the temperature change value is small, the temperature change value (ΔT) and the reflectivity change value (ΔR) approximately show a linear relationship, as shown in the following formula (1).

[0048] (1)

[0049] In formula (1), ΔR / R is the reflectivity change caused by the temperature change, ΔT is the temperature change, and K is the thermoreflectance coefficient, which is a constant.

[0050] Furthermore, as Figure 2 shown in the figure, it is a schematic diagram of the laser cavity surface temperature tester based on the photo-thermal reflection technology. The system of this temperature tester mainly consists of a microscopic imaging system, an image acquisition system, and a data processing system. Among them, the laser beam 11 emitted by the laser ( Figure 2 refers to LD, Laser Diode, that is, the laser diode) is reflected by the objective lens 3 and the dichroic mirror 4, and the detection light 1 emitted from the LED (Light Emitting Diode, that is, the light-emitting diode) passes through the focusing lens 5, the beam splitter 6, the dichroic mirror 4, and the objective lens 3 and is focused on the cavity surface of the laser chip, and the detection light 1 reflected by the cavity surface is focused on the CCD camera 9 through the objective lens 3, the dichroic mirror 4, the beam splitter 6, the filter 7, and the imaging lens 8 and is recorded. It should be noted that the reflectivity change of the sample cannot be directly obtained by this temperature tester system, and it can be indirectly represented by the gray value of the image. Generally, the laser is controlled to be "ON" and "OFF" and batch imaging is carried out through the lock-in signal generator 12 to improve the test accuracy.

[0051] However, it should be emphasized that in actual work, as Figure 3a shown in the figure, due to the solder 14 being drained to the front surface of the heat sink 120 close to the detection light 1 during the COS packaging, and the high reflectivity of the solder layer, a large amount of detection light 1 will be reflected back to the original optical path, and this beam of light can be reflected back to the cavity surface again by the objective lens 3, the dichroic mirror 4, etc.; and due to the change of the solder temperature during the "ON" and "OFF" processes of the laser, the intensity of this beam of light is variable, and finally, in addition to the detection light 1 with a fixed intensity, there is also a reflected light beam from the solder layer irradiating the cavity surface, and the intensity of this beam of light is relatively strong and cannot be ignored. Figure 3b The direct imaging image of the typical COS by the temperature tester system in the prior art is shown in Figure 3bIt can be seen that the solder layer region reflects light strongly. Therefore, in the prior art, the high reflectivity of the solder layer will cause a large amount of detection light 1 to be reflected back to the original optical path and be re-reflected back to the cavity surface by the objective lens 3, dichroic mirror 4, etc. Moreover, the intensity of the light beams reflected back to the original optical path varies, seriously affecting the measurement accuracy of the cavity surface temperature of the laser chip 110.

[0052] For the convenience of description and to make the solution of the present application easy to understand for those skilled in the art, it should be noted that in the test module provided in the present application, the applicant introduces the objective lens 3 and the corresponding detection light 1 for the schematic illustration in the test scenario; the front surface of the heat sink 120 close to the detection light 1 is defined as the first side surface of the heat sink 120; the front surface of the laser chip 110 close to the detection light 1 is defined as the second side surface of the laser chip 110. In addition, it should also be noted that in the field of laser chip testing, there is usually solder 14 drained on the first side surface, and the space area occupied by the solder 14 covering the first side surface is defined as the solder overflow area in the present application; the second side surface is the side surface where the laser chip 110 emits the laser light source.

[0053] Test module

[0054] An embodiment of the present application provides a test module, which includes a laser module. The laser module includes a laser chip and a heat sink. The laser chip is attached to the heat sink to form an interface surface. A solder overflow area is provided on the first side surface of the heat sink close to the detection light;

[0055] and further includes a light blocking sheet. The solder overflow area is located between the light blocking sheet and the heat sink. The light blocking sheet is used to block the detection light from irradiating the solder overflow area. It should be noted that in the embodiment of the present application, the detection light refers to the detection light emitted by the LED and passing through the focusing lens 5, beam splitter 6, dichroic mirror 4, and objective lens 3 in sequence (see Figure 2 ); by setting a light blocking sheet between the detection light and the laser module to block the detection light from irradiating the highly reflective solder in the solder overflow area, it is possible to prevent the detection light from being reflected by the solder and then returning to the cavity surface of the laser chip through the detection light source optical path, thereby improving the measurement accuracy. It should be emphasized that in other embodiments of the present invention, it is not limited that the solder overflow area must be completely filled with the drained solder. The solder overflow area may also have no solder or only partially drained solder.

[0056] Further, in a possible implementation, the distance from the point on the light-shielding plate closest to the interface plane to the light axis plane of the laser chip parallel to the interface plane is H, the vertical divergence angle of the laser beam emitted by the laser chip is γ, the distance between the first side surface of the heat sink and the second side surface of the laser chip close to the detection light is x, the conical surface of the spatial region corresponding to γ is the divergence angle boundary surface, and the distance between the point on the top surface of the light-shielding plate closest to the divergence angle boundary surface and the first side surface of the heat sink is y. The H, γ, x, and y satisfy: (y - x) / tan(γ / 2) < H. It should be noted that the above-mentioned light axis plane of the laser chip specifically refers to the plane parallel to the interface plane where the laser light axis is located; the second side surface of the above-mentioned laser chip, that is, the side surface where the laser chip emits the laser beam, is usually simply referred to as the light-emitting surface of the laser chip in the technical field. In addition, the reason for limiting (y - x) / tan(γ / 2) < H in the embodiments of the present application is that the laser emitted by the laser chip has a vertical divergence angle, and the light-shielding plate may affect the laser emission (for example, the top of the light-shielding plate may block the laser emitted by the laser chip). Therefore, by limiting (y - x) / tan(γ / 2) < H, the influence of the light-shielding plate on the laser emission can be avoided, thereby ensuring the accuracy of the test.

[0057] Further, in a possible implementation, the top surface of the light-shielding plate close to the interface plane is a flat top surface. When the detection light irradiates the flat top surface of the light-shielding plate, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the interface plane. Preferably, the light-shielding plate is perpendicular to the interface plane, and the thickness direction of the light-shielding plate is perpendicular to the first side surface of the heat sink, and the light-shielding plate is attached to the solder in the solder overflow area. It should be noted that by limiting the top boundary line of the semi-shadow area to coincide with the interface plane, it can be ensured that during the process of the light-shielding plate blocking the detection light, the light incident amount of the detection light entering the cavity surface of the laser chip is not affected, thereby ensuring the accuracy of the measurement. It should be emphasized that in order to facilitate those skilled in the art to understand the semi-shadow area described in the present application, the applicant combines Figure 3c to elaborate on the relevant concepts and principles in detail as follows:

[0058] Non-shadow area 15: For the irradiated point on the irradiated surface, all point light sources in the light source can irradiate this irradiated point, and the area formed by these irradiated points constitutes the non-shadow area 15;

[0059] Penumbra area 16: For the irradiated point on the irradiated surface, some point light sources in the light source can irradiate this irradiated point, and some point light sources in the light source cannot irradiate this irradiated point due to obstruction. The area formed by these irradiated points constitutes the penumbra area 16, that is, the semi-shadow area described in the present application;

[0060] Full shadow area 17: For the irradiated point on the irradiated surface, all point light sources in the light source cannot irradiate this irradiated point;

[0061] Shadow area: For the irradiated point on the irradiated surface, at least some of the point light sources in the light source cannot irradiate this irradiated point. The shadow area includes the penumbra area 16 and the full shadow area 17.

[0062] Further, in some embodiments of the present application, the top surface of the light blocking sheet close to the joint surface is provided as an inclined top surface, the inclined top surface faces the detection light, and the top end of the inclined top surface is flush with the joint surface; in addition, the complementary angle of the included angle between the inclined top surface and the joint surface is β, the complementary angle of the included angle formed by the connection line between the bottommost light point far from the detection light optical axis of the detection light and the topmost point of the light blocking sheet and the joint surface is α, and β < α. Optionally, the light blocking sheet is attached to the solder in the solder overflow area. It should be noted that by defining that the top end of the inclined top surface is flush with the joint surface, the possible penumbra area can be eliminated, and by defining β < α, it can be ensured that the detection light entering the cavity surface of the laser chip will not be blocked by the inclined top surface of the light blocking sheet, thereby ensuring the accuracy of the measurement.

[0063] Further, in some embodiments of the present application, the top surface of the light blocking sheet close to the joint surface sequentially includes an inclined surface and a flat surface along the direction from far away from the first side to close to the first side; when the detection light irradiates the flat surface of the light blocking sheet, a penumbra area is formed in the solder overflow area, and the top boundary line of the penumbra area coincides with the joint surface. It should be noted that there are two beneficial effects in setting the top surface of the light blocking sheet as two parts, namely an inclined surface and a flat surface, along the detection light direction in the embodiments of the present application: First, the inclined surface part is used to minimize the blockage of the detection light to the laser chip cavity surface by the light blocking sheet; Second, the flat surface part is used to avoid and prevent the detection light from penetrating the light blocking sheet and affecting the light shielding effect of the light blocking sheet on the solder overflow area.

[0064] Further, in some preferred embodiments of the present application, the top surface of the light blocking sheet close to the joint surface includes an inclined surface part, the inclined surface part faces the detection light, and the complementary angle of the included angle between the inclined surface part and the joint surface is β, and β and γ satisfy: β < 90° - γ / 2. It should be noted that by preferably defining that β and γ satisfy the relationship of β < 90° - γ / 2, it can not only ensure that during the laser emission process of the laser chip, the laser will not be blocked by the top surface of the light blocking sheet due to the vertical divergence angle problem, but also ensure that the detection light entering the cavity surface of the laser chip will not be blocked by the top surface of the light blocking sheet, thereby greatly improving the accuracy of the test.

[0065] Further, in some embodiments of the present application, an absorbing material and / or a blackening treatment are provided on the surface of the light-shielding sheet for blocking the detection light; wherein, optionally, the absorbing material may be a matte rubber, magnesium fluoride, or a paint containing silica, etc., and the blackening treatment may be attaching a black flocked cloth to the surface of the light-shielding sheet that needs to block the detection light. Preferably, an absorbing material and a blackening treatment are provided on the surface of the light-shielding sheet for blocking the detection light. It should be noted that by providing the absorbing material and performing the blackening treatment on the surface of the light-shielding sheet for blocking the detection light, the reflection of the detection light by the light-shielding sheet during the process of blocking the detection light can be minimized, thereby reducing the influence on the detection light received by the cavity surface of the laser chip and further ensuring the accuracy of the test. In addition, it should also be noted that since the surface of the light-shielding sheet provided in the embodiments of the present application for blocking the detection light will vary with the different top surface shape structures and the different relative positions with respect to the laser module, the embodiments of the present application do not specifically limit the position of the surface of the light-shielding sheet that needs to be provided with the absorbing material and the blackening treatment. Instead, based on the functional requirements of the light-shielding sheet with different structural types and different relative position relationships in actual use for blocking the detection light, the absorbing material is provided on the surface of the light-shielding sheet and the blackening treatment is performed. Of course, in other embodiments of the present application, at least one optionally preferred embodiment is that the absorbing material is provided on all surfaces of the light-shielding sheet and the blackening treatment is performed on it.

[0066] Further, in some preferred embodiments of the present application, a curved surface structure is provided on the surface of the light-shielding sheet for blocking the detection light, so that when the detection light irradiates on the curved surface structure, the detection light will be reflected outside the main optical path (this main optical path refers to the optical path of the detection light passing through the path of "beam splitter 6 - dichroic mirror 4 - objective lens 3"). It should be noted that in order to further reduce the reflection of the detection light by the light-shielding sheet back to the original detection light optical path and then back to the laser chip, which affects the measurement accuracy, the applicant preferably sets the surface of the light-shielding sheet for blocking the detection light as a curved surface structure, thereby maximizing the elimination of the influence of the possible light reflection of the light-shielding sheet on the measurement of the laser chip.

[0067] An embodiment of the present application also provides a test system, which includes the aforementioned test module. It should be noted that by configuring the test module in the test system, the accuracy and precision of the test system when testing the laser chip can be greatly improved, and it has broad application prospects.

[0068] Further optionally, in some embodiments of the present application, the test system further includes a heat dissipation table and a spatial position adjustment module for adjusting the relative positions of the light shielding sheet and the laser module. The spatial position adjustment module is disposed in the test module and mounted on the heat dissipation table. It should be noted that by setting the spatial position adjustment module, the relative positions between the light shielding sheet and the laser module can be adjusted, so that the light shielding sheet can adapt to the cavity surface measurement of different laser modules. Thus, on the basis of effectively ensuring the test accuracy of the test system, the adaptation range of the test module to the laser module is broadened, which greatly promotes the industrial application of the test system.

[0069] More specifically, in a possible implementation manner of the present application, the spatial position adjustment module includes a first adjustment module and a second adjustment module; wherein, the first adjustment module is used to adjust the light shielding sheet and the laser module to approach or move away from each other. The first adjustment module includes a first motor and a first moving member. The light shielding sheet is fixedly connected to the first moving member. The first motor is fixed on the heat dissipation table and is adjustably linked to the first moving member, so that when the first motor drives the first moving member to move, the light shielding sheet is driven to approach or move away from the laser module.

[0070] The second adjustment module includes a limiting component and a second motor. The limiting component at least includes a moving limiting member; the moving limiting member is detachably and fixedly connected to the laser module. The second motor is mounted on the heat dissipation table and is adjustably linked to the moving limiting member, so that when the second motor drives the moving limiting member to move, the laser module is driven to move in a plane perpendicular to the optical axis of the detection light. It should be noted that preferably, the first motor and the second motor in the embodiments of the present application can use micro-control motors capable of realizing the corresponding functions, so as to achieve the effect of accurately controlling the relative position of the light shielding sheet; in addition, preferably, in order to limit the extreme positions of the laser module in the X and Y directions when being adjusted, the limiting component further includes a fixed limiting member. The fixed limiting member is fixed on the heat dissipation table. The fixed limiting member and the moving limiting member form a U-shaped space for accommodating the laser module, and the opening of the U-shaped space faces the detection light; when the laser module is adjusted to approach the extreme position in the X and / or Y direction, the laser module will abut against the inner wall of the fixed limiting member and be restricted from moving, so that the laser module is more stably limited.

[0071] It should be emphasized that the test system provided in the embodiments of the present application is only one of the enumerated in numerous embodiments. In other embodiments of the present application, it is not limited to the specific structural features of the above-mentioned spatial position adjustment module provided in the embodiments of the present application. It may also be other spatial position adjustment modules, as long as it can achieve the relative position adjustment between the light shielding plate and the laser module, so that the light shielding plate can adapt to the cavity surface measurement of different laser modules and ensure the test accuracy of the test system. For example, in other embodiments of the present application, an adjustment device of a micrometer can also be used to replace the corresponding first motor and second motor. Embodiment

[0072] As Figure 4 shown, this embodiment provides a test module, which includes a light shielding plate 130 and a laser module 100 to be tested. The laser module 100 includes a laser chip 110 and a heat sink 120. The laser chip 110 is attached to the heat sink 120 to form a joint surface 115. A solder overflow area 140 is provided on a first side surface 122 of the heat sink 120 close to the detection light 1; the solder overflow area 140 is located between the light shielding plate 130 and the heat sink 120, and the light shielding plate 130 is used to block the detection light 1 from irradiating the solder overflow area 140.

[0073] Furthermore, the top surface of the light shielding plate 130 close to the joint surface 115 is a flat top surface, and the flat top surface is located below the joint surface 115. When the detection light 1 irradiates the flat top surface of the light shielding plate 130, a semi-shadow area 162 is formed in the solder overflow area 140, and the top boundary line of the semi-shadow area 162 coincides with the joint surface 115. In addition, the distance from the point on the light shielding plate 130 closest to the joint surface 115 to the optical axis surface 114 of the laser chip is H, the vertical divergence angle of the laser beam emitted by the laser chip 110 is γ, the distance between the first side surface 122 of the heat sink 120 and the second side surface 112 of the laser chip 110 close to the detection light 1 is x, the conical surface of the spatial region corresponding to γ is the divergence angle boundary surface 116, and the distance between the point on the top surface of the light shielding plate 130 closest to the divergence angle boundary surface 116 and the first side surface 122 of the heat sink 120 is y. H, γ, x, and y satisfy: (y - x) / tanγ / 2 < H.

[0074] As Figure 5 shown, this embodiment also provides a test system 10, which includes the above-mentioned test module provided in this embodiment, a heat dissipation platform 101, and a spatial position adjustment module 150 for adjusting the relative position between the light shielding plate 130 and the laser module 100. The spatial position adjustment module 150 is configured in the test module and installed on the heat dissipation platform 101; the spatial position adjustment module 150 includes a first adjustment module 152 and a second adjustment module 154.

[0075] Further specifically, the first adjustment module 152 is used to adjust the light shielding plate 130 and the laser module 100 to move closer to or away from each other (i.e., move in the X direction). The first adjustment module 152 includes a first micro-control motor 1522 and a first moving member 1524. The light shielding plate 130 is fixedly connected to the first moving member 1524. The first micro-control motor 1522 is fixed to the heat dissipation table 101 and is adjustably linked to the first moving member 1524. When the first micro-control motor 1522 drives the first moving member 1524 to move, the light shielding plate 130 is driven to approach or move away from the laser module 100.

[0076] Even more specifically, the second adjustment module 154 includes a limiting component 1542 and a second micro-control motor 1544. The limiting component 1542 includes a fixed limiting member 1541 and a moving limiting member 1543. The fixed limiting member 1541 is fixed to the heat dissipation table 101. The fixed limiting member 1541 and the moving limiting member 1543 form a U-shaped space for accommodating the laser module 100, and the opening of the U-shaped space faces the detection light. The moving limiting member 1543 is detachably and fixedly connected to the laser module 100. The second micro-control motor 1544 is installed on the heat dissipation table 101 and is adjustably linked to the moving limiting member 1543. When the second micro-control motor 1544 drives the moving limiting member 1543 to move, the laser module 100 is driven to move in a plane perpendicular to the optical axis of the detection light (including the Y direction and the direction perpendicular to both X and Y simultaneously). Embodiment

[0077] Please refer to Figure 4 and Figure 6 . This embodiment provides a test module, which is substantially the same as Embodiment 1. The difference is that in the test module provided in this embodiment, an absorbing material ( Figure 6 not shown) is provided on the surface of the second light shielding plate 230 for blocking the detection light 1, and a curved surface structure is provided on the surface of the second light shielding plate 230 for blocking the detection light 1, so that when the detection light 1 irradiates on the curved surface structure, the detection light 1 will be reflected outside the main optical path of the detection light 1. Embodiment

[0078] As Figure 7 shown, this embodiment provides a test module, which is substantially the same as Embodiment 2. The difference is that in the test module provided in this embodiment, the top surface of the third light shielding plate 330 close to the interface 115 is set as an inclined top surface, the inclined top surface faces the detection light 1, and the top end of the inclined top surface is flush with the interface 115.

[0079] In addition, in this embodiment, the complementary angle of the angle between the inclined top surface and the interface 115 is β, and the complementary angle of the angle formed by the connection line between the bottommost light point of the detection light 1 far from the optical axis of the detection light and the topmost point of the third light shielding plate 330 and the interface 115 is α, and β < α. Embodiment

[0080] As Figure 8 shown, this embodiment provides a test module, which is substantially the same as Embodiment Three. The difference is that in the test module provided in this embodiment, the top of the inclined top surface of the fourth light shield 430 is lower than the interface surface 115. When the detection light 1 irradiates the inclined top surface of the fourth light shield 430, a semi-shadow area 462 is formed in the solder overflow area 140. The top boundary line of the semi-shadow area 462 coincides with the interface surface 115, and β and γ satisfy: β < 90° - γ / 2. Embodiment

[0081] As Figure 9 shown, this embodiment provides a test module, which is substantially the same as Embodiment Three. The difference is that the top surface of the fifth light shield 530 close to the interface surface 115 includes an inclined surface and a flat surface in sequence along the direction of the detection light 1; when the detection light 1 irradiates the flat surface of the fifth light shield 530, a semi-shadow area 562 is formed in the solder overflow area 140. The top boundary line of the semi-shadow area 562 coincides with the interface surface 115. Embodiment

[0082] As Figure 10 shown, this embodiment provides a test module, which is substantially the same as Embodiment Five. The difference is that in the test module provided in this embodiment, β corresponding to the sixth light shield 630 and the vertical divergence angle γ of the laser beam emitted by the laser chip 110 satisfy: β < 90° - γ / 2.

[0083] It should be emphasized that in Embodiments Two to Six above, (y - x) / tanγ / 2 < H is satisfied. Since the differences from other embodiments are mainly emphasized in Embodiments Two to Six, (y - x) / tanγ / 2 < H is not described again. In addition, the above are only preferred specific embodiments of the present application. Each embodiment is only used to illustrate the technical solution of the present application rather than a limitation to the present application. Any technical solution that can be obtained by those skilled in the art through logical analysis, reasoning or effective verification based on the concept of the present application should fall within the scope of the present application.

[0084] In summary, for the test module provided in the embodiments of the present application, by arranging a light blocking sheet between the detection light and the laser module to block the detection light from irradiating onto the highly reflective solder, it is avoided that the detection light is reflected from the solder and then returns to the cavity surface of the laser chip through the optical path of the detection light source, thereby improving the measurement accuracy; by optimizing and defining the shape of the light blocking sheet, the influence on the detection light received by the laser chip due to the addition of the light blocking sheet is reduced, ensuring the measurement accuracy; by combining the characteristics of the designed shape of the light blocking sheet and the reasonable configuration of the relative position between the light blocking sheet and the laser chip, the arrangement of the light blocking sheet not only does not affect the detection light from irradiating onto the laser chip, but also does not affect the emitted light of the laser chip, thus further ensuring the measurement accuracy; in addition, by performing a curved surface design, an absorption material setting, and / or a blackening treatment on the surface of the light blocking sheet for blocking the detection light, it is effectively avoided that the light blocking sheet reflects the detection light back to the original optical path of the detection light and then reflects it to the laser chip, thereby further improving the measurement accuracy of the test module. Additionally, for the test system provided in the present application, by arranging a spatial position adjustment module, the relative position between the light blocking sheet and the laser module is adjustable, so that the light blocking sheet can adapt to the cavity surface measurement of different laser modules, thereby broadening the adaptation range of the test module for the laser module on the basis of effectively ensuring the test accuracy of the test system, and greatly promoting the industrial application of the test system.

[0085] For the various embodiments in the present application, the same or similar parts may be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0086] In the various embodiments disclosed in the present application, the expressions "first", "second", "the first" or "the second" used may modify various components without being related to the order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing an element from other elements. For example, the first side and the second side represent different sides, although both are sides.

Claims

1. A test module, characterized in that, It includes: A laser module, the laser module includes a laser chip and a heat sink, the laser chip is attached to the heat sink to form a joint surface, and a solder overflow area is provided on a first side of the heat sink close to the detection light; A light shield, the solder overflow area is located between the light shield and the heat sink, and the light shield is used to block the detection light from irradiating the solder overflow area; The distance from the point on the light shield closest to the joint surface to the optical axis plane of the laser chip parallel to the joint surface is H, the vertical divergence angle of the laser beam emitted by the laser chip is γ, the distance between the first side of the heat sink and the second side of the laser chip close to the detection light is x, the conical surface of the spatial region corresponding to γ is the divergence angle boundary surface, and the distance between the point on the top surface of the light shield closest to the divergence angle boundary surface and the first side of the heat sink is y, and the H, the γ, the x, and the y satisfy: (y - x) / tanγ / 2 < H.

2. The test module according to claim 1, characterized in that The top surface of the light shield close to the joint surface is a flat top surface. When the detection light irradiates the flat top surface of the light shield, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface.

3. The test module according to claim 1, wherein The top surface of the light shield close to the joint surface is set as an inclined top surface, the inclined top surface faces the detection light, and the top end of the inclined top surface is flush with the joint surface; The complementary angle of the angle between the inclined top surface and the joint surface is β, and the complementary angle of the angle formed by the connection line between the bottommost light point of the detection light far from the detection light optical axis and the topmost point of the light shield and the joint surface is α, and β < α.

4. The test module according to claim 1, wherein The top surface of the light shield close to the joint surface includes an inclined surface and a flat surface in sequence along the direction from far away from the first side to close to the first side; When the detection light irradiates the flat surface of the light shield, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface.

5. The test module according to claim 1, wherein The top surface of the light shield close to the joint surface includes an inclined surface part, the inclined surface part faces the detection light, and the complementary angle of the angle between the inclined surface part and the joint surface is β, and the β and the γ satisfy: β < 90° - γ / 2.

6. The test module according to claim 1, wherein, The surface of the light shield for blocking the detection light is provided with an absorbent material and / or is subjected to blackening treatment.

7. The test module according to claim 6, characterized in that, The surface of the light shield for blocking the detection light is provided with a curved surface structure, so that when the detection light irradiates the curved surface structure, the detection light will be reflected outside the main optical path.

8. A test system, characterized in that, It includes the test module according to any one of the preceding claims 1 to 7.

9. The test system according to claim 8, wherein The test system further includes a heat dissipation table and a spatial position adjustment module for adjusting the relative positions of the light shield and the laser module. The spatial position adjustment module is arranged in the test module and installed on the heat dissipation table.

10. The test system according to claim 9, characterized in that, The spatial position adjustment module includes a first adjustment module and a second adjustment module; The first adjustment module is used to adjust the light shielding sheet and the laser module to be closer to or farther away from each other. The first adjustment module includes a first motor and a first moving member. The light shielding sheet is fixedly connected to the first moving member. The first motor is fixed to the heat dissipation table. The first motor drives the first moving member to move, thereby driving the light shielding sheet to be closer to or farther away from the laser module. The second adjustment module includes a limiting component and a second motor. The limiting component at least includes a moving limiting member. The moving limiting member is detachably and fixedly connected to the laser module. The second motor is installed on the heat dissipation table. The second motor drives the moving limiting member to move, thereby driving the laser module to move in a plane perpendicular to the optical axis of the detection light.

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