Probe card test system and test method

Abstract

The embodiment of the invention discloses a probe card testing system and a probe card testing method. The probe card test system comprises a top plate, a bottom plate, a fixed disc, a temperature control structure, a moving mechanism and a rack, the bottom plate is installed on the rack, the fixing disc is installed on the bottom plate and used for fixing a probe card, and the temperature control structure is installed on the fixing disc and used for adjusting the temperature of the fixing disc; and conductive structures which are in one-to-one correspondence with probes on the probe card are arranged on the top plate and the bottom plate. According to the embodiment of the invention, by fixing the probe card once, the test work in various environments can be completed, so that the measurement efficiency of the probe card is remarkably improved; according to the test system, the two ends of each probe are provided with corresponding conductive structures which abut against the probe, so that each probe can obtain an independent and accurate measurement value, and the measurement data accuracy of each probe is improved.

Description

Technical Field

[0001] This application relates to the technical field of probe card testing, and particularly to a probe card testing system and a testing method. Background Art

[0002] In the semiconductor industry, the packaging and testing link plays a crucial role. Usually, a probe card is used as a bridge between the chip and the tester. After the probes in the probe card are pressed down by a certain distance, an elastic force will be generated to cut through the metal layer of the chip test pins, so as to conduct a conduction test. When the probes are at a certain pressing height, if the generated elastic force is too large, the chip will be damaged and defects will be introduced; if the generated elastic force is too small, stable contact cannot be achieved, resulting in poor testing.

[0003] In order to ensure that the elastic force of the probes is within the specified range, it is necessary to conduct an elastic force test before the probes are inserted into the probe card. At present, a manual operation method is adopted. A high-power microscope is used to observe the relative position of the extension rod of the force measuring device and the probe to be tested, and then the distance is manually adjusted to make them approach. By observing the numerical fluctuation of the force measuring device, it is determined whether the probe is in contact with the force measuring rod. If in contact, the value is cleared, the height value of the force measuring device is adjusted to calculate the pressing amount, and the elastic force values corresponding to different pressing amounts are measured.

[0004] In view of the disadvantages of manual operation of the force measurement, such as time-consuming, slow measurement efficiency, small number of probes measured, large data value fluctuations, and inability to conduct low-temperature environment tests. Summary of the Invention

[0005] This application aims to solve at least one of the technical problems existing in the prior art. For this purpose, this application provides a probe card testing system and a testing method to solve the problems of low testing efficiency and inaccurate measurement data of the probes of the probe card.

[0006] In a first aspect, this application provides a probe card testing system, including: a top plate, a bottom plate, a fixing plate, a temperature control structure, a moving mechanism, and a frame;

[0007] The bottom plate is installed on the frame, the fixed end of the moving mechanism is connected to the frame, the movable end of the moving mechanism is connected to the top plate, the fixing plate is installed on the bottom plate and is used to fix the probe card, and the temperature control structure is installed on the fixing plate and is used to adjust the temperature of the fixing plate;

[0008] Conductive structures corresponding one by one to the probes on the probe card are arranged on both the top plate and the bottom plate, and every two corresponding conductive structures are located in the same circuit, and pressure sensors are provided on the conductive structures on the top plate and / or the bottom plate.

[0009] Based on the probe card testing system, the probe card can be fixed by the fixing plate. Then, all the probes on the probe card can be clamped and pressured by the top plate and the bottom plate to achieve the test of the elastic force values of multiple probes at different downward displacements. Through the setting of the conductive structure, a test environment in the conductive state can be added for the probes. The temperature control structure set on the fixing plate can add a test environment for the probes under three temperatures, namely high temperature, low temperature, and normal temperature. The conductive structure and the temperature control structure can provide more test environments for the probes. By fixing the probe card once, the test work under multiple environments can be completed, thus significantly improving the measurement efficiency of the probe card. The testing system can also ensure that each probe can obtain a separate and accurate measurement value by setting corresponding conductive structures against both ends of each probe, improving the accuracy of the measurement data of each probe.

[0010] Optionally, the testing system further includes an alignment component. The alignment component includes a marking point on the probe card and a positioning machine. The positioning machine is installed on the top plate or the frame, and the marking point is within the shooting range of the positioning machine.

[0011] Furthermore, based on the above alignment component, after the probe card is fixed on the bottom plate, by continuously fine-tuning the top plate, it can be ensured that all the conductive structures on the top plate, all the conductive structures on the bottom plate, and all the probes are aligned one by one.

[0012] Optionally, the positioning machine is arranged on the periphery of the top plate.

[0013] Furthermore, when the positioning machine is arranged on the periphery of the top plate, the positioning machine can be closer to the marking point, improving the positioning accuracy of the positioning machine.

[0014] Optionally, the positioning machine is a high-precision camera, and the positioning machine is used to detect whether the top plate is aligned with the probe card or to detect whether the end heights of all the probes on the probe card meet the requirements.

[0015] Furthermore, based on the above positioning machine, the detection for both alignment and needle grinding can be carried out simultaneously, thus simplifying the structure and reducing the cost.

[0016] Optionally, each conductive structure is provided with a groove, and the groove is used to limit the end of the probe.

[0017] Furthermore, based on the above conductive structure, the arc surface or inclined surface of the groove can limit and guide the end of the probe, so as to provide a more stable and reliable clamping state when testing the probe, and avoid the lateral slip of the probe on the horizontal plane and its detachment from the conductive structure when the probe is elastically compressed.

[0018] Optionally, the temperature control structure includes a heating component and a cooling component, and the heating component and the cooling component are respectively used to heat the probe to a first set temperature and cool the probe to a second set temperature.

[0019] Optionally, the moving mechanism includes an x-axis translation mechanism, a y-axis translation mechanism, a z-axis lifting mechanism, and a z-axis rotation mechanism. The fixed end of the x-axis translation mechanism is connected to the frame, the fixed end of the y-axis translation mechanism is connected to the moving end of the x-axis translation mechanism, the fixed end of the z-axis lifting mechanism is connected to the moving end of the y-axis translation mechanism, the fixed end of the z-axis rotation mechanism is connected to the moving end of the z-axis lifting mechanism, and the rotating end of the z-axis rotation mechanism is connected to the top plate.

[0020] Furthermore, based on the above moving mechanism, the z-axis lifting mechanism can be used to press the probe of the probe card by the top plate. With the cooperation of the x-axis translation mechanism and the y-axis translation mechanism, not only can the position of the top plate be adjusted, but also the reciprocating movement of the needle grinding plate on the horizontal plane can be realized, so as to complete the needle grinding work. With the z-axis rotation mechanism, the angle of the top plate can be finely adjusted, making the alignment accuracy between the top plate and the probe card higher and the adjustment more flexible.

[0021] Optionally, the test system further includes a needle grinding plate, and the needle grinding plate is detachably installed on the top plate.

[0022] Alternatively, the top plate is detachably connected to the rotating end of the z-axis rotation mechanism, and the needle grinding plate is detachably connected to the rotating end of the z-axis rotation mechanism.

[0023] In a second aspect, the present application provides a method for testing a probe card, including the following steps:

[0024] S1. Install the probe card on the fixed disk;

[0025] S2. Install the needle grinding plate on the top plate or the z-axis rotation mechanism, and perform needle grinding. After the needle grinding is completed, remove the needle grinding plate;

[0026] S3. Align the top plate with the probe card by using the moving mechanism and the alignment component;

[0027] S4. Use the temperature control structure to adjust the probe card to the first set temperature or the second set temperature, and maintain the set time, or keep the probe card at normal temperature and maintain the set time;

[0028] S5. Energize the conductive structure or keep it in a de-energized state;

[0029] S6. Control the movement of the moving end of the z-axis lifting mechanism to make the top plate approach the bottom plate, and detect the magnitude of the elastic force value of the probe under different pressing amounts.

[0030] Based on the above test method, by fixing the probe card once, the test work in multiple environments can be completed, thus significantly improving the measurement efficiency of the probe card; this test method can also ensure that each probe can obtain a separate and accurate measurement value and improve the measurement data accuracy of each probe by setting corresponding conductive structures at both ends of each probe to abut against it.

[0031] Optionally, step S6 is specifically as follows: control the z-axis lifting mechanism to drive the top plate to descend until all the probes are in contact with the conductive structures on the top plate and then stop. Then, control the z-axis lifting mechanism to drive the top plate to descend, and use the pressure sensor to measure the elastic force value of the probe at different downward displacements.

[0032] Furthermore, based on the above moving mechanism, the z-axis lifting mechanism can first descend to a position where the top plate is in contact with the probes of the probe card and pause for a certain period of time, and then control the top plate to descend to test the elastic force value of the probes at different downward displacements, which can reduce the impact caused by the impact formed at the moment when the top plate contacts the probes. It should be understood that the value recorded by the pressure sensor can take the part after the top plate contacts the probes and pauses for a certain period of time, so as to further improve the data accuracy of the elastic force value test.

[0033] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:

[0034] The probe card can be fixed by the fixing plate, and then all the probes on the probe card can be clamped and pressed by the top plate and the bottom plate to realize the elastic force value test of multiple probes at different downward displacements; through the setting of the conductive structure, a test environment in the conductive state can be added for the probes, and the temperature control structure provided on the fixing plate can add a test environment for the probes under three temperatures, namely high temperature, low temperature, and normal temperature. The conductive structure and the temperature control structure can provide more test environments for the probes. By fixing the probe card once, the test work in multiple environments can be completed, thus significantly improving the measurement efficiency of the probe card; this test system can also ensure that each probe can obtain a separate and accurate measurement value and improve the measurement data accuracy of each probe by setting corresponding conductive structures at both ends of each probe to abut against it.

[0035] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Referring to the accompanying drawings, the disclosure of the present application will become more understandable. It is easy for those skilled in the art to understand that: these drawings are only for the purpose of illustration and are not intended to limit the protection scope of the present application. In addition, similar numbers in the figures are used to represent similar components, where:

[0037] Figure 1 It is a schematic structural diagram of the front side of the probe card test system according to an embodiment of the present application;

[0038] Figure 2 It is a schematic structural diagram of the side of the probe card test system according to an embodiment of the present application;

[0039] Figure 3 It is a bottom view of the top plate in the probe card test system according to an embodiment of the present application;

[0040] Figure 4 It is a side view of the top plate in the probe card test system according to an embodiment of the present application;

[0041] Figure 5 It is a schematic structural diagram of the probe card according to an embodiment of the present application;

[0042] Figure 6 It is a cross-sectional view of the probe card according to an embodiment of the present application;

[0043] Figure 7 It is Figure 1 a partial enlarged view of the position A in

[0044] Figure 8 It is Figure 2 a partial enlarged view of the position B in

[0045] Figure 9 It is a flowchart of the probe card test method according to an embodiment of the present application.

[0046] Explanation of reference numerals

[0047] 11. Top plate; 12. Bottom plate; 13. Fixed plate; 14. Frame; 151. X-axis translation mechanism; 152. Y-axis translation mechanism; 153. Z-axis lifting mechanism; 154. Z-axis rotation mechanism; 2. Conductive structure; 3. Positioning machine; 4. Probe card. Detailed implementation manners

[0048] Some embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present application and are not intended to limit the protection scope of the present application.

[0049] Currently, the manual operation method is adopted. The relative position between the extending rod of the dynamometer and the probe to be tested is observed using a high-power microscope, and then the distance is manually adjusted to make them close. Whether the probe contacts the dynamometer rod is determined by observing the numerical fluctuation of the dynamometer. If they contact, the value is cleared, the height value of the dynamometer is adjusted to calculate the pressing amount, and the corresponding elastic force values at different pressing amounts are measured.

[0050] In view of the disadvantages of manual force measurement, such as time-consuming, slow measurement efficiency, small number of measurement probes, large fluctuation of data values, and inability to perform low-temperature environment tests.

[0051] Based on this, the present application provides a probe card test system and a test system, which can fix the probe card through a fixing plate, and then use the top plate and the bottom plate to clamp and press all the probes on the probe card, so as to realize the elastic force value test of multiple probes at different pressing amounts; through the setting of the conductive structure, a test environment in the conductive state can be added to the probes, and the temperature control structure arranged on the fixing plate can add a test environment for the probes under three temperatures, namely high temperature, low temperature, and normal temperature. The conductive structure and the temperature control structure can provide more test environments for the probes. By fixing the probe card once, the test work under various environments can be completed, thus significantly improving the measurement efficiency of the probe card; the test system can also ensure that each probe can obtain a separate and accurate measurement value by arranging corresponding conductive structures at both ends of each probe to abut against it, improving the measurement data accuracy of each probe.

[0052] The following will specifically elaborate on the present application through specific embodiments.

[0053] Refer to Figures 1 to 8 As shown, this embodiment provides a probe card test system, including: a top plate 11, a bottom plate 12, a fixing plate 13, a temperature control structure, a moving mechanism, and a frame 14; the bottom plate 12 is installed on the frame 14, the fixed end of the moving mechanism is connected to the frame 14, the movable end of the moving mechanism is connected to the top plate 11, the fixing plate 13 is installed on the bottom plate 12 and is used to fix the probe card 4, the temperature control structure is installed on the fixing plate 13 and is used to adjust the temperature of the fixing plate 13; conductive structures 2 corresponding to the probes on the probe card 4 are arranged on both the top plate 11 and the bottom plate 12, and every two corresponding conductive structures 2 are located in the same circuit, and pressure sensors are arranged on the conductive structures 2 on the top plate 11 and / or the bottom plate 12; it should be understood that the conductive structures 2 can be arranged in a matrix or a circular array, and the conductive structures 2 can specifically be structures such as copper columns, silver columns, and copper sheets.

[0054] The probe card testing system provided by this embodiment can fix the probe card 4 through the fixing plate 13. Then, by using the top plate 11 and the bottom plate 12, all the probes on the probe card 4 can be clamped and pressed to realize the test of the elastic force values of multiple probes at different pressing amounts. Through the setting of the conductive structure 2, a test environment in the conductive state can be added for the probes. The temperature control structure provided on the fixing plate 13 can add a test environment for the probes under three temperatures, namely high temperature, low temperature, and normal temperature. The conductive structure 2 and the temperature control structure can provide more test environments for the probes. By fixing the probe card 4 once, the test work under multiple environments can be completed, thus significantly improving the measurement efficiency of the probe card. The testing system can also ensure that each probe can obtain a separate and accurate measurement value by providing corresponding conductive structures 2 at both ends of each probe to abut against it, improving the accuracy of the measurement data of each probe.

[0055] Continue to refer to Figure 1 and Figure 2 As shown, the testing system further includes an alignment component. The alignment component includes a marking point located on the probe card 4 and a positioning machine 3. The positioning machine 3 is installed on the top plate 11 or the frame 14, and the marking point is within the shooting range of the positioning machine 3.

[0056] Furthermore, based on the above alignment component, after the probe card 4 is fixed on the bottom plate 12, by continuously fine-tuning the top plate 11, it can be ensured that all the conductive structures 2 on the top plate 11, all the conductive structures 2 on the bottom plate 12, and all the probes are aligned one by one.

[0057] Continue to refer to Figure 1 As shown, the positioning machine 3 is arranged on the periphery of the top plate 11. It should be understood that the positioning machine 3 needs to be arranged close to the top plate 11 without affecting the extrusion work of the top plate 11 on the probes.

[0058] Furthermore, when the positioning machine 3 is arranged on the periphery of the top plate 11, the positioning machine can be closer to the marking point, improving the positioning accuracy of the positioning machine 3.

[0059] Optionally, the positioning machine 3 is a high-precision camera. The positioning machine 3 is used to detect whether the top plate 11 and the probe card 4 are aligned, or to detect whether the end height values of all the probes on the probe card 4 meet the requirements. Among them, the positioning machine 3 can be movably connected to the top plate 11 or the frame 14. Specifically, it can be connected through another moving mechanism or rotating mechanism. When the shooting direction of the positioning machine 3 is parallel to the vertical direction, the alignment detection between the top plate 11 and the probe card 4 is carried out. When the shooting direction of the positioning machine 3 forms a certain angle with the vertical direction, the end height values of the probes are detected.

[0060] Furthermore, based on the above-mentioned positioning machine 3, it is possible to detect both alignment and needle grinding operations simultaneously, thereby simplifying the structure and reducing costs.

[0061] In some embodiments, each conductive structure 2 is provided with a groove for limiting the end of the probe. The groove can specifically be an arc-shaped groove or a tapered groove. Among them, the bottom of the arc-shaped groove abuts against the end of the probe.

[0062] Furthermore, based on the above-mentioned conductive structure 2, the arc-shaped surface or inclined surface of the groove can limit and guide the end of the probe, thereby providing a more stable and reliable clamping state during probe testing, and preventing the probe from slipping laterally on the horizontal plane and detaching from the conductive structure 2 when it is elastically compressed.

[0063] In some embodiments, the temperature control structure includes a heating component and a cooling component. The heating component and the cooling component are respectively used to heat the probe to a first set temperature and cool the probe to a second set temperature. Specifically, the heating component can be a resistance wire, and the cooling component can be regulated by laying a liquid nitrogen pipeline in cooperation with the resistance wire. Among them, the first set temperature and the second set temperature can be 150°C and -40°C respectively, and can be specifically set according to actual needs.

[0064] Continue to refer to Figure 1 and Figure 2 As shown, the moving mechanism includes an x-axis translation mechanism 151, a y-axis translation mechanism 152, a z-axis lifting mechanism 153, and a z-axis rotation mechanism 154. The fixed end of the x-axis translation mechanism 151 is connected to the frame 14, the fixed end of the y-axis translation mechanism 152 is connected to the moving end of the x-axis translation mechanism 151, and the fixed end of the z-axis lifting mechanism 153 is connected to the moving end of the y-axis translation mechanism 152. Among them, the x-axis and the y-axis are two mutually perpendicular extension directions in the horizontal direction. The fixed end of the z-axis rotation mechanism 154 is connected to the moving end of the z-axis lifting mechanism 153, and the rotating end of the z-axis rotation mechanism 154 is connected to the top plate 11. Among them, the rotating end of the z-axis rotation mechanism 154 rotates around an axis parallel to the vertical direction.

[0065] In some embodiments, the moving mechanism further includes a grating ruler, so as to ensure that the precision of the x-axis translation mechanism 151, the y-axis translation mechanism 152, and the z-axis lifting mechanism 153 is controlled within ±0.1 μm, and the rotation angle precision of the z-axis rotation mechanism 154 is controlled within ±0.01°.

[0066] Further, based on the above-mentioned moving mechanism, the z-axis lifting mechanism 153 can be used to apply pressure to the probes of the probe card 4 by the top plate 11. By the cooperation of the x-axis translation mechanism 151 and the y-axis translation mechanism 152, not only can the position of the top plate 11 be adjusted, but also the reciprocating movement of the needle grinding plate on the horizontal plane can be achieved, thereby completing the needle grinding work. By using the z-axis rotation mechanism 154, the angle of the top plate 11 can be finely adjusted, so that the alignment accuracy between the top plate 11 and the probe card 4 is higher and the adjustment is more flexible.

[0067] Optionally, the test system further includes a needle grinding plate, which is detachably mounted on the top plate 11, or the top plate 11 is detachably connected to the rotating end of the z-axis rotation mechanism 154, and the needle grinding plate is detachably connected to the rotating end of the z-axis rotation mechanism 154.

[0068] Continue to refer to Figures 1 to 9 As shown, in the second aspect, the present application provides a method for testing a probe card, including the following steps:

[0069] S1. Install the probe card 4 on the fixed disk 13;

[0070] S2. Install the needle grinding plate on the top plate 11 or the z-axis rotation mechanism 154, and perform needle grinding. After the needle grinding is completed, remove the needle grinding plate;

[0071] S3. Align the top plate 11 with the probe card 4 by using the moving mechanism and the alignment component;

[0072] S4. Adjust the probe card 4 to the first set temperature or the second set temperature by using the temperature control structure and maintain the set time, or keep the probe card 4 at room temperature and maintain the set time;

[0073] S5. Energize the conductive structure 2 or keep it in a de-energized state;

[0074] S6. Control the movement of the movable end of the z-axis lifting mechanism 153 to make the top plate 11 approach the bottom plate 12, and detect the magnitude of the elastic force value of the probe under different pressing amounts.

[0075] Based on the above test method, by fixing the probe card 4 once, the test work under multiple environments can be completed, thereby significantly improving the measurement efficiency of the probe card; this test method can also ensure that each probe can obtain a separate and accurate measurement value by providing corresponding conductive structures 2 at both ends of each probe to abut against it, improving the measurement data accuracy of each probe.

[0076] Optionally, step S6 specifically is to control the z-axis lifting mechanism 153 to drive the top plate 11 to descend until all the probes are in contact with the conductive structure 2 on the top plate 11 and then stop. The specific stop time can be adjusted according to actual requirements. Then, control the z-axis lifting mechanism 153 to drive the top plate 11 to descend, and use the pressure sensor to measure the elastic force values of the probes at different downward displacements.

[0077] Furthermore, based on the above-mentioned moving mechanism, the z-axis lifting mechanism 153 can be first lowered to a position where the top plate 11 is in contact with the probes of the probe card 4 and paused for a certain period of time, and then control the top plate 11 to descend to test the elastic force values of the probes at different downward displacements, which can reduce the impact caused by the impact formed at the moment when the top plate 11 comes into contact with the probes. It should be understood that the values recorded by the pressure sensor can be taken from the part after the top plate 11 contacts the probes and pauses for a certain period of time, so as to further improve the data accuracy of the elastic force value test.

[0078] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0079] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0080] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A probe card testing system, characterized in that: include: A top plate (11), a bottom plate (12), a fixed plate (13), a temperature control structure, a moving mechanism and a frame (14); The bottom plate (12) is mounted on the frame (14), the fixed end of the moving mechanism is connected to the frame (14), the movable end of the moving mechanism is connected to the top plate (11), the fixed plate (13) is mounted on the bottom plate (12) and is used to fix the probe card (4), and the temperature control structure is mounted on the fixed plate (13) and is used to adjust the temperature of the fixed plate (13); The top plate (11) and the bottom plate (12) are both provided with conductive structures (2) corresponding one to one with the probes on the probe card (4), and every two corresponding conductive structures (2) are located in the same loop. Pressure sensors are provided on the conductive structures (2) on the top plate (11) and / or the bottom plate (12).

2. The probe card testing system according to claim 1, characterized in that: The test system also includes an alignment component, which includes a marking point located on the probe card (4) and a positioning machine (3). The positioning machine (3) is installed on the top plate (11) or the frame (14), and the marking point is located within the shooting range of the positioning machine (3).

3. The probe card testing system according to claim 2, characterized in that: The positioning machine (3) is arranged on the peripheral side of the top plate (11).

4. The probe card testing system according to claim 3, characterized in that: The positioning machine (3) is a high-precision camera, and the positioning machine (3) is used to detect whether the top plate (11) is aligned with the probe card (4), or to detect whether the end height values ​​of all probes on the probe card (4) meet the requirements.

5. The probe card testing system according to claim 1, characterized in that: Each of the conductive structures (2) is provided with a groove, and the groove is used to limit the end of the probe.

6. The probe card testing system according to claim 1, characterized in that: The temperature control structure comprises a heating component and a cooling component, wherein the heating component and the cooling component are respectively used to heat the probe to a first set temperature and to cool the probe to a second set temperature.

7. The probe card testing system according to claim 1, characterized in that: The moving mechanism comprises an x-axis translation mechanism (151), a y-axis translation mechanism (152), a z-axis lifting mechanism (153) and a z-axis rotation mechanism (154); the fixed end of the x-axis translation mechanism (151) is connected to the frame (14); the fixed end of the y-axis translation mechanism (152) is connected to the movable end of the x-axis translation mechanism (151); the fixed end of the z-axis lifting mechanism (153) is connected to the movable end of the y-axis translation mechanism (152); the fixed end of the z-axis rotation mechanism (154) is connected to the movable end of the z-axis lifting mechanism (153); and the rotating end of the z-axis rotation mechanism (154) is connected to the top plate (11).

8. The probe card testing system according to claim 7, characterized in that: The testing system further comprises a grinding plate, which is detachably mounted on the top plate (11). Alternatively, the top plate (11) is detachably connected to the rotating end of the z-axis rotating mechanism (154), and the needle grinding plate is detachably connected to the rotating end of the z-axis rotating mechanism (154).

9. A probe card testing method using the testing system according to any one of claims 1 to 8, characterized in that: The steps include: S1, installing a probe card (4) on a fixing plate (13); S2, mounting the needle grinding plate on the top plate (11) or the z-axis rotating mechanism (154), and performing needle grinding. After the needle grinding is completed, the needle grinding plate is removed; S3, using a moving mechanism and an alignment component to align the top plate (11) with the probe card (4); S4, using the temperature control structure to adjust the probe card (4) to a first set temperature or a second set temperature and maintain it for a set time, or to keep the probe card (4) at a normal temperature and maintain it for a set time; S5, energizing the conductive structure (2), or keeping it in an energized state; S6, controlling the movement of the movable end of the z-axis lifting mechanism (153) to move the top plate (11) closer to the bottom plate (12), and detecting the elastic force values ​​of the probe under different downward pressure amounts.

10. The probe card testing method according to claim 9, characterized in that: Specifically, step S6 comprises controlling the z-axis lifting mechanism (153) to drive the top plate (11) to descend until all probes are in contact with the conductive structure (2) on the top plate (11) and then stopping, and then controlling the z-axis lifting mechanism (153) to drive the top plate (11) to descend, and using a pressure sensor to measure the elastic force value of the probe under different downward pressure amounts.

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