Display panel, display panel preparation method and display device

Abstract

The invention discloses a display panel, a display panel preparation method and a display device.The display panel comprises a light-emitting area and a non-light-emitting area, and the display panel preparation method comprises the steps that a substrate layer is provided; a color film layer is arranged on the substrate layer; depositing and forming a flat layer on one side, opposite to the substrate layer, of the color film layer; and carrying out thinning process treatment on the flat layer at least partially located in the light-emitting region. According to the display panel, the flat layer at least partially located in the light-emitting area is thinned, the flat layer at least partially located in the light-emitting area can be removed on the premise that the flat effect of the flat layer is guaranteed, and therefore the distance between the light-emitting layer and the color film layer is shortened, and light leakage is reduced.

Description

Technical Field

[0001] This application relates to the field of display panels, and particularly to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] A backlight module is mainly applied to various types of liquid crystal display devices, such as laptop computers, flat-panel TVs, mobile phones, automotive instrument panels, billboards, airport terminal displays, and so on. The function of the backlight module is to evenly illuminate the backlight onto the display panel to improve the brightness and color vividness of the image. However, the existing backlight module has serious light leakage problems that need to be solved urgently. Summary of the Invention

[0003] The purpose of this application is to provide a display panel, a method for manufacturing a display panel, and a display device.

[0004] According to the first aspect of the embodiments of this application, a display panel is provided. The display panel has a light-emitting area and a non-light-emitting area, and the display panel includes:

[0005] A substrate layer;

[0006] A color filter layer, which is disposed above the substrate layer;

[0007] A planarization layer, which is disposed on a side of the color filter layer facing away from the substrate layer;

[0008] The planarization layer includes a light-emitting planar portion, the light-emitting planar portion is disposed corresponding to the light-emitting area, and the light-emitting planar portion is located above the color filter layer in the thickness direction of the display panel. The thickness of the light-emitting planar portion is greater than or equal to 0.4 um and less than or equal to 4 um.

[0009] In some embodiments, a positive projection of the light-emitting planar portion onto the substrate layer is located within a positive projection of the color filter layer onto the substrate layer.

[0010] In some embodiments, the thickness of the color filter layer is greater than the thickness of the light-emitting planar portion.

[0011] In some embodiments, the planarization layer further includes an edge planar portion, the edge planar portion is disposed corresponding to the non-light-emitting area, and the thickness of the edge planar portion is greater than the thickness of the light-emitting planar portion, or the thickness of the edge planar portion is equal to the thickness of the light-emitting planar portion.

[0012] In some embodiments, when the thickness of the edge planar portion is greater than the thickness of the light-emitting planar portion, the thickness of the light-emitting planar portion is less than one-half of the thickness of the edge planar portion.

[0013] In some embodiments, the display panel further includes an anode hole disposed on the flat layer, and a positive projection of the anode hole on the substrate layer is located within a positive projection of the light-emitting flat portion on the substrate layer, or the positive projection of the anode hole on the substrate layer is located within a positive projection of the edge flat portion on the substrate layer.

[0014] In some embodiments, when the thickness of the edge flat portion is greater than the thickness of the light-emitting flat portion, a transition slope is included between the light-emitting flat portion and the edge flat portion, and a slope of the transition slope is less than or equal to 90°.

[0015] In some embodiments, the slope of the transition slope is less than or equal to 75°.

[0016] In some embodiments, the display panel further includes a pixel definition layer covering a side of the transition slope facing away from the substrate layer.

[0017] In some embodiments, a thickness of the pixel definition layer covering the transition slope is greater than or equal to 0.5 μm and less than or equal to 3 μm.

[0018] In some embodiments, the display panel further includes a pixel definition layer covering a side of the flat layer facing away from the substrate layer, and the pixel definition layer has a pixel opening area, and a positive projection of the pixel opening area on the substrate layer is located within a positive projection of the light-emitting flat portion on the substrate layer.

[0019] In some embodiments, the pixel definition layer further includes a pixel thickness area, and a positive projection of the pixel thickness area on the substrate layer and a positive projection of the light-emitting flat portion on the substrate layer are at least partially overlapped.

[0020] In some embodiments, in a first direction, a length of the light-emitting flat portion is less than a length of the color filter layer, and the light-emitting flat portion is located directly above the color filter layer in a thickness direction, and the first direction is perpendicular to the thickness direction.

[0021] According to a second aspect of embodiments of the present application, there is provided a method for manufacturing a display panel for manufacturing the display panel described in the above embodiments, including:

[0022] Providing a substrate layer;

[0023] Disposing a color filter layer on the substrate layer;

[0024] Depositing and forming a flat layer on a side of the color filter layer facing away from the substrate layer;

[0025] A thickness of the flat layer at least partially located in the light-emitting area is less than a thickness of the flat layer corresponding to the non-light-emitting area.

[0026] According to a third aspect of the embodiments of the present application, a display device is provided, and the display device includes a display panel as described in any one of the above embodiments.

[0027] By performing a thinning process on at least a part of the planarization layer located in the light-emitting region of the display panel of the present application, at least a part of the planarization layer located in the light-emitting region can be removed on the premise of ensuring the planarization effect of the planarization layer, thereby shortening the distance between the light-emitting layer and the color filter layer, and further reducing light leakage. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic structural diagram of the display panel according to the present application.

[0030] Figure 2 It is a partial schematic structural diagram of the display panel according to the present application.

[0031] Figure 3 It is a schematic diagram of the manufacturing process of an embodiment of the display panel according to the present application.

[0032] Figure 4 It is a schematic diagram of the manufacturing process of another embodiment of the display panel according to the present application.

[0033] Figure 5 It is a schematic structural diagram of the display panel according to an embodiment of the present application before thinning.

[0034] Figure 6 It is a schematic structural diagram of the display panel according to an embodiment of the present application after thinning.

[0035] Figure 7 It is a schematic structural diagram of the display panel according to an embodiment of the present application after another thinning.

[0036] Figure 8 It is a schematic structural diagram of the display panel according to an embodiment of the present application after yet another thinning.

[0037] Figure 9 It is a flowchart of the manufacturing process of an embodiment of the display panel according to the present application.

[0038] Figure 10 It is a flowchart of the manufacturing process of an embodiment of the display panel according to the present application.

[0039] Description of the Reference Numerals:

[0040] Display panel 10

[0041] Substrate layer 100

[0042] Driver circuit film layer 200

[0043] Control contact 210

[0044] Protective layer 300

[0045] Color filter layer 400

[0046] Flat layer 500

[0047] Anode hole 510

[0048] Light-emitting flat part 520

[0049] Edge flat part 530

[0050] Transition slope 540

[0051] Anode layer 600

[0052] Light-emitting layer 700

[0053] Cathode layer 800

[0054] Mask plate 900

[0055] First region 910

[0056] Second region 920

[0057] Third region 930

[0058] Pixel definition layer 1000

[0059] Pixel opening area 1000a

[0060] Pixel thickness area 1000b

[0061] Photoresist 1100

[0062] First direction H Detailed implementation mode

[0063] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0064] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meanings as understood by those of ordinary skill in the art to which this application pertains. The words such as "a" or "an" used in the specification and claims of this application do not denote a limitation of quantity but rather mean that there is at least one. "Plurality" means two or more. Words such as "comprising" or "including" mean that the elements or items appearing before "comprising" or "including" cover the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections and may include electrical connections, whether direct or indirect. Words such as "upper" and / or "lower" are for convenience only and are not limited to a position or a spatial orientation. The singular forms of "a", "the" and "said" used in the specification and appended claims of this application are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0065] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C" and includes the following combinations of A, B, and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0066] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0067] The use of "suitable for" or "configured to" in this specification means open and inclusive language that does not exclude devices suitable for or configured to perform additional tasks or steps.

[0068] The triangles, rectangles, trapezoids, pentagons, or hexagons, etc. used in the specification and claims of this application are not strictly defined and can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc. There can be some small deformations due to tolerances, and there can be chamfers, rounded edges, and deformations, etc.

[0069] The "about" used in the specification and claims of this application means that the boundaries are not strictly defined and allow values within the ranges of process and measurement errors.

[0070] In an exemplary embodiment, as Figure 1As shown, the display panel 10 includes film layers such as a substrate layer 100, a driving circuit film layer 200, a color filter film layer 400, a planarization layer 500, an anode layer 600, a pixel definition layer 1000, a light-emitting layer 700, and a cathode layer 800.

[0071] Among them, the substrate layer 100 is the bottom layer of the display panel 10, usually made of materials such as glass or plastic. The substrate layer 100 can provide support and protection for the display panel 10. In some display technologies, the substrate layer 100 can also serve as a carrier for electrodes or gratings. The driving circuit film layer 200 is an important part of the display screen. It is located above the substrate layer 100 and is responsible for controlling the switching of pixels and brightness adjustment. The driving circuit film layer 200 is usually composed of a group of thin-film circuits, which can achieve signal transmission and processing. The color filter film layer 400 is the color filter of the display panel 10. It is usually located above the driving circuit film layer 200. The color filter film layer 400 can filter white light into three primary color lights of red, green, and blue, thereby realizing color display. The planarization layer 500 covers the color filter film layer 400 and the driving circuit film layer 200. The anode layer 600 is usually located above the color filter film layer 400. It is the positive electrode of the display panel 10 and is responsible for providing a positive voltage to the pixels. The anode layer 600 is usually made of a transparent conductive material, such as indium tin oxide (ITO). The pixel definition layer 1000 is usually used to define the attributes of each pixel in the image, such as color, transparency, etc. The pixel definition layer 1000 can be regarded as the basic building unit of the image, which describes the specific characteristics and attributes of each pixel in the image. The light-emitting layer 700 is the light-emitting part of the display panel 10. It is located between the pixel definition layers 1000. The light-emitting layer 700 is used to simulate the light emitted by an object or a light source to produce a light-emitting effect. The cathode layer 800 is usually located above the light-emitting layer 700. It is the negative electrode of the display panel 10 and is responsible for providing a negative voltage to the pixels. The cathode layer 800 is usually made of tungsten or other materials and can emit electron beams.

[0072] After the driving circuit film layer 200 and the color filter film layer 400 are fabricated, in order to make them flat, an organic film with good leveling property, the planarization layer 500, is needed to fill the step difference. Generally, the greater the step difference, the greater the film thickness of the planarization layer 500. The film thickness of the planarization layer 500 is usually above 4um. Refer to Figure 1 As shown, the distance from the light-emitting layer 700 to the color filter film layer 400 is large, and thus the light on the side of the light-emitting layer 700 is easily leaked. In Figure 1 the light leaked from the side of the light-emitting layer 700 can leak out of the display panel 10 along the arrow direction in the figure.

[0073] Refer to Figure 6 、 Figure 7 and Figure 8As shown in the figure, the present application also proposes a display panel 10, including: a substrate layer 100, a color filter layer 400, and a planarization layer 500. The display panel 10 further includes a light-emitting area and a non-light-emitting area. The color filter layer 400 is disposed above the substrate layer 100; the planarization layer 500 is disposed on a side of the color filter layer 400 facing away from the substrate layer 100; the planarization layer 500 includes a light-emitting planar portion 520, the light-emitting planar portion 520 is disposed corresponding to the light-emitting area, and the light-emitting planar portion 520 is located above the color filter layer 400 in the thickness direction of the display panel 10, and the thickness of the light-emitting planar portion 520 is greater than or equal to 0.4um and less than or equal to 4um. At the same time, an anode layer 600 corresponding to the color filter layer 400 is disposed on a side of the planarization layer 500 facing away from the substrate layer 100; a light-emitting layer 700 is disposed on a side of the anode layer 600 facing away from the substrate layer 100; a cathode layer 800 is disposed on a side of the light-emitting layer 700 facing away from the substrate layer 100.

[0074] Generally, the thickness of the planarization layer 500 needs to be greater than 4um to better achieve the planarization effect of the planarization layer 500. Therefore, the thickness of the light-emitting planar portion 520 is set to be greater than or equal to 0.4um and less than or equal to 4um here, that is, the light-emitting planar portion 520 is thinned by a thinning process.

[0075] Reference Figure 1 、 Figure 6 and Figure 7 As shown in the figure, because the thickness of the light-emitting planar portion 520 is thinner than that of the planarization layer 500 with a normal thickness, the light-emitting layer 700 located on the light-emitting planar portion 520 is closer to the color filter layer 400 in thickness, so that the color filter layer 400 can transmit more light emitted by the light-emitting layer 700, thereby reducing the light leakage of the light-emitting layer 700.

[0076] Further, as shown in reference Figure 6 the thickness of the color filter layer 400 is greater than the thickness of the light-emitting planar portion 520. When the thickness of the light-emitting planar portion 520 is less than the thickness of the color filter layer 400, the light-emitting layer 700 is close enough to the color filter layer 400 in thickness, thereby reducing the light leakage of the light-emitting layer 700.

[0077] Preferably, in this embodiment, the thickness of the light-emitting planar portion 520 is thinned to between 1 / 3 and 1 / 2 of the thickness of the original planarization layer 500. The inventor has found through a large number of experiments that within this range, on the one hand, the light-emitting planar portion 520 can meet the basic planarization effect of the planarization layer 500, and on the other hand, it can also meet the requirement that the light-emitting layer 700 is closer to the color filter layer 400, so that the color filter layer 400 can transmit more light emitted by the light-emitting layer 700, thereby achieving the effect of reducing the light leakage of the light-emitting layer 700.

[0078] In one embodiment, referring to Figure 5 As shown, the positive projection of the light-emitting flat portion 520 on the substrate layer 100 is located within the positive projection of the color filter layer 400 on the substrate layer 100. With such an arrangement, the light-emitting layer 700 located in the light-emitting flat portion 520 can be directly aligned with the color filter layer 400, thereby avoiding light leakage caused by the light not exiting from the color filter layer 400 due to the offset between the light-emitting flat portion 520 and the color filter layer 400.

[0079] In one embodiment, referring to Figure 6 and Figure 7 As shown, the flat layer 500 further includes an edge flat portion 530, the edge flat portion 530 is provided corresponding to the non-light-emitting region, and the thickness of the edge flat portion 530 is equal to the thickness of the light-emitting flat portion 520. In this case, a mask plate 900 as shown in Figure 3 is provided. The advantage of setting the thickness of the edge flat portion 530 to be equal to the thickness of the light-emitting flat portion 520 is that after the flat layer 500 is thinned, the layer of the flat layer 500 for arranging the anode layer 600 is flat, so no additional setting is required compared to the previous manufacturing process.

[0080] In one embodiment, referring to Figure 7 As shown, the thickness of the edge flat portion 530 is greater than the thickness of the light-emitting flat portion 520. In this case, a mask plate 900 as shown in Figure 4 is provided. The advantage of setting the thickness of the edge flat portion 530 to be greater than the thickness of the light-emitting flat portion 520 is that, on the one hand, only part of the flat portion needs to be thinned to ensure the effectiveness of the flat portion, and on the other hand, it can provide position positioning for the subsequent arrangement of the anode layer 600, light-emitting layer 700, and cathode layer 800.

[0081] In this embodiment, referring to Figure 7 As shown, when the thickness of the edge flat portion 530 is greater than the thickness of the light-emitting flat portion 520, there is a transition slope 540 between the light-emitting flat portion 520 and the edge flat portion 530, and the slope of the transition slope 540 is less than or equal to 90°. Here, the thickness of the light-emitting flat portion 520 can be set to be less than half of the thickness of the edge flat portion 530. With such an arrangement, the height difference between the light-emitting flat portion 520 and the edge flat portion 530 can be made sufficiently obvious, and thus it is easy to arrange components such as the anode layer 600 and light-emitting layer 700 located on the light-emitting flat portion 520. Moreover, the display panel 10 further includes an anode layer 600, and the anode layer 600 is provided on the light-emitting flat portion 520 and extends to the edge flat portion 530.

[0082] Referring to Figure 7As shown, since the anode layer 600 needs to be disposed on the transition slope 540, and anodes are generally made of materials such as indium tin oxide (ITO), if the slope is relatively large, the anode layer 600 is likely to break, thereby affecting the display effect of the display panel 10. Setting the slope of the transition slope 540 to be less than or equal to 90° can effectively reduce the risk of breakage of the anode layer 600.

[0083] Preferably, the slope of the transition slope 540 is less than or equal to 75°. Within this range, the anode layer 600 is basically free of the risk of breakage, and the functions of the anode layer 600 itself can be well realized.

[0084] In one embodiment, the display panel 10 further includes an anode hole 510 disposed on the flat layer 500. The orthographic projection of the anode hole 510 on the substrate layer 100 is located within the orthographic projection of the light-emitting flat portion 520 on the substrate layer 100, or the orthographic projection of the anode hole 510 on the substrate layer 100 is located within the orthographic projection of the edge flat portion 530 on the substrate layer 100.

[0085] Based on the above settings, the anode hole 510 can be disposed on the light-emitting flat portion 520 or the edge flat portion 530, so that it is not affected by the size of the light-emitting flat portion 520 or the edge flat portion 530 in the first direction H, thereby ensuring the stability of the connection of the anode layer 600.

[0086] In one embodiment, as Figure 8 shown, the light-emitting flat portion 520 can also be enlarged corresponding to the anode layer 600, so that the anode layer 600 is laid on the light-emitting flat portion 520, and there is no need for the anode layer 600 to climb the slope, thereby avoiding the risk of breakage of the anode layer 600 due to climbing the slope.

[0087] In one embodiment, referring to Figure 5 、 Figure 6 and Figure 7 shown, the display panel 10 further includes a pixel definition layer 1000, and the pixel definition layer 1000 covers the side of the transition slope 540 facing away from the substrate layer 100.

[0088] Through the above settings, the pixel definition layer 1000 can define pixels within the area of the light-emitting flat portion 520, thereby facilitating the subsequent setting of the light-emitting layer 700 and the anode layer 600. In addition, the pixel definition layer 1000 can also be set to black to block light from leaking out from the side, thereby reducing the occurrence of light leakage.

[0089] Further, referring to Figure 7 shown, the thickness d of the pixel definition layer 1000 covering the transition slope 540 is greater than or equal to 0.5 um and less than or equal to 3 um.

[0090] With the above settings, on the one hand, since the pixel definition layer 1000 is partially protrudingly disposed between the anode layer 600 and the light-emitting layer 700, it is difficult for the pixel definition layer 1000 to separate from the transition slope 540, thus ensuring the stability of the pixel definition layer 1000 in defining pixels. On the other hand, the pixel definition layer 1000 can be set to black, and when its thickness is within the above range, light leakage from the side can be substantially blocked, thereby reducing the occurrence of light leakage.

[0091] In one embodiment, referring to Figure 1 As shown, the pixel definition layer 1000 covers the side of the flat layer 500 facing away from the substrate layer 100, and the pixel definition layer 1000 has a pixel opening area 1000a. The orthographic projection of the pixel opening area 1000a onto the substrate layer 100 is located within the orthographic projection of the light-emitting flat portion 520 onto the substrate layer 100. With such a setting, it can be ensured that the pixel opening area 1000a and the light-emitting flat portion 520 are correspondingly arranged, so as to ensure that the light emitted by the light-emitting layer 700 located on the light-emitting flat portion 520 passes through the color filter layer 400 to the greatest extent.

[0092] Furthermore, continuing to refer to Figure 1 As shown, the pixel definition layer 1000 further includes a pixel thickness area 1000b. The orthographic projection of the pixel thickness area 1000b onto the substrate layer 100 overlaps at least partially with the orthographic projection of the light-emitting flat portion 520 onto the substrate layer 100. In this way, a part of the pixel thickness area 1000b is disposed above the light-emitting flat portion 520, and the light-emitting layer 700 can be defined and protected to the greatest extent.

[0093] In one embodiment, the length of the light-emitting flat portion 520 is less than the length of the color filter layer 400, and the light-emitting flat portion 520 is located directly above the color filter layer 400 in the thickness direction. The first direction H is perpendicular to the thickness direction.

[0094] By setting the length of the light-emitting flat portion 520 to be less than the length of the color filter layer 400 and the light-emitting flat portion 520 being located directly above the color filter layer 400 in the thickness direction, the light-emitting flat portion 520 can be completely within the range of the color filter layer 400. Therefore, the light-emitting layer 700 disposed thereon is necessarily disposed above the color filter layer 400, thereby ensuring the correspondence between the color filter layer 400 and the light-emitting layer 700.

[0095] Such as Figure 2 、 Figure 3 、 Figure 4 and Figure 8 、 Figure 9 、 Figure 10As shown, the present application also provides a method for manufacturing the above display panel 10. The display panel 10 includes a light-emitting region and a non-light-emitting region. The manufacturing method further includes the following steps:

[0096] Step S1: Provide a substrate layer 100;

[0097] Step S2: Provide a color filter layer 400 on the substrate layer 100;

[0098] Step S3: Deposit and form a planarization layer 500 on a side of the color filter layer 400 facing away from the substrate layer 100;

[0099] Step S4: Perform a thinning process on at least a part of the planarization layer 500 located in the light-emitting region.

[0100] After the above manufacturing process, it may further include:

[0101] Step S5: Provide an anode layer 600 corresponding to the color filter layer 400 on a side of the planarization layer 500 facing away from the substrate layer 100;

[0102] Step S6: Provide a light-emitting layer 700 on a side of the anode layer 600 facing away from the substrate layer 100;

[0103] Step S7: Provide a cathode layer 800 on a side of the light-emitting layer 700 facing away from the substrate layer 100.

[0104] As Figure 5 and Figure 6 shown, through the above steps, on the premise of ensuring the planarization effect of the planarization layer 500, at least a part of the planarization layer 500 located in the light-emitting region can be removed, thereby shortening the distance between the light-emitting layer 700 and the color filter layer 400, and further enabling the light of the light-emitting layer 700 to mainly emit from the color filter layer 400. Therefore, the light leakage of the light-emitting layer 700 is reduced.

[0105] Further, referring to Figure 5 、 Figure 6 and Figure 7 shown, performing a thinning process on at least a part of the planarization layer 500 located in the light-emitting region includes: performing a thinning process on the entire planarization layer 500 as shown in Figure 6 , or performing a thinning process on the planarization layer 500 located in the light-emitting region as shown in Figure 7 .

[0106] With the above settings, when the entire flat layer 500 is thinned, on the one hand, the distance between the light-emitting layer 700 and the color film layer 400 can be shortened while ensuring the flatness effect of the flat layer 500. On the other hand, the display panel 10 can be made thinner, thus saving the internal space of the device and allowing designers to have more space for other components such as batteries and heat dissipation systems, thereby improving the overall performance and functions. Thinning the flat layer 500 located in the light-emitting area can reduce only the thinned area compared to thinning the entire flat layer 500, thus ensuring the reliability of the flat layer 500. In addition, thinning only the flat layer 500 located in the light-emitting area can enable better positioning of the subsequently provided anode layer 600, light-emitting layer 700, and cathode layer 800.

[0107] In one embodiment, the thickness of the thinned flat layer 500 is greater than or equal to 0.4 um. To normally achieve the flatness effect of the flat layer 500, a certain thickness of the flat layer 500 needs to be achieved during deposition. Therefore, it is not possible to directly deposit a flat layer 500 with a smaller thickness to achieve the thinning effect. The thickness of the conventional flat layer 500 is generally 4 um ± 0.2 um. Considering its etching uniformity of ±10%, at least 0.4 um of allowance needs to be reserved to ensure that it will not be etched through the flat layer 500 and damage the color film layer 400 located below it. Therefore, in this embodiment, the thickness of the thinned flat layer 500 is set to be greater than or equal to 0.4 um, which can prevent the color film layer 400 from being damaged.

[0108] In one embodiment, before the color film layer 400 is provided on the substrate layer 100, after the substrate layer 100 is provided, it further includes: forming a driving circuit film layer 200 and a protective layer 300 on the substrate layer 100, the protective layer 300 covering the control contacts 210 on the driving circuit film layer 200 and being located between the substrate layer 100 and the color film layer 400; before at least part of the flat layer 500 is thinned, after the flat layer 500 is deposited on the side of the color film layer 400 facing away from the substrate layer 100 by a deposition process, it further includes: punching the flat layer 500 to form an anode hole 510 penetrating the flat layer 500, the anode hole 510 being located above the control contacts 210; one end of the anode hole 510 communicates with the protective layer 300; while at least part of the flat layer 500 is thinned, the part of the protective layer 300 communicating with the anode hole 510 is punched.

[0109] Based on the above operations, the thinning process of the flat layer 500 and the punching process of the protective layer 300 are carried out simultaneously, thus saving the manufacturing process of the display panel 10 and further saving the time of the manufacturing process.

[0110] Further, in this embodiment, the same mask 900 is used for the thinning process of at least part of the flat layer 500 and the punching process of the protective layer 300.

[0111] The process of thinning at least part of the flat layer 500 is as follows: First, a photoresist 1100 is coated on the flat layer 500; Second, the photoresist 1100 above the part of the flat layer 500 to be removed is exposed using the mask 900; Third, the flat layer 500 corresponding to the exposed part of the photoresist 1100 is removed. The function of the mask 900 is to transfer the pattern to a specific area on the substrate by irradiating light onto the photosensitive material and performing photolithography using the pattern on the mask plate. The photoresist 1100 can convert light energy into chemical or physical changes, and transfer the pattern on the mask to the photoresist 1100 layer through photolithography technology. When light irradiates the photoresist 1100, the photoresist 1100 undergoes chemical reactions or physical changes, forming exposed areas and unexposed areas. In this way, during the etching process, the photoresist 1100 in the exposed areas is removed or changed to achieve the required pattern transfer. In the above procedure, using the same mask 900 for the thinning process of the flat layer 500 and the punching process of the protective layer 300 can reduce the number of times the mask 900 is used, thus avoiding switching and manufacturing multiple masks 900, and further saving manufacturing time and costs.

[0112] In this embodiment, as Figure 3 shown, the mask 900 includes a first region 910 and a second region 920. The first region 910 and the second region 920 are light-transmitting, and the light transmittance of the first region is greater than that of the second region. The first region 910 corresponds to the anode hole 510, and the second region 920 corresponds to the entire flat layer 500. It should be noted that for the region with a larger light transmittance, the corresponding thinning rate will be faster, and vice versa.

[0113] The part to be removed is exposed using the mask 900. The specific process is to use light on one end of the mask 900 facing away from the flat layer 500. The light passes through the first region 910 and the second region 920 and shines on the photoresist 1100 of the part to be removed, so that a chemical reaction or physical change will occur to the photoresist 1100, and then react with the protective layer 300 and the flat layer 500 below it. The user can adjust the thinning thickness of the flat layer 500 and the drilling rate of the protective layer 300 by adjusting the light transmittance of the first region 910 and the second region 920, so that the thinning process and the drilling process are completed simultaneously. For example, control the light transmittance of the first region 910 to be 100% and the light transmittance of the second region 920 to be 50%. Or, control the light transmittance of the first region 910 to be 100% and the light transmittance of the second region 920 to be 30%.

[0114] In this embodiment, as Figure 4 shown, the mask 900 can also be set to include a first region 910, a second region 920, and a third region 930. The first region 910 and the second region 920 are set to be light-transmitting, the third region 930 is set to be non-light-transmitting. The first region 910 corresponds to the anode hole 510, the second region 920 corresponds to the flat layer 500 located in the light-emitting region, and the third region 930 corresponds to the flat layer 500 located in the non-light-emitting region. As described above, the exposure of the part to be removed using the mask 900 will not be elaborated.

[0115] An embodiment of the present application also proposes a display device, which includes the display panel 10 described in the above embodiment. Since this display device includes the display panel 10 described in the above embodiment, the functions and advantages of this display panel 10 are also possessed by this display device. This display device can be an electronic device with a display function such as a mobile phone, a computer, a tablet computer, etc.

[0116] In the present application, the structural embodiment and the method embodiment can complement each other when there is no conflict.

[0117] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more aspects thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. Additionally, in the above detailed description, various features may be grouped together to simplify the present application. This should not be construed as an intention that features of an unclaimed application are necessary for any claim. On the contrary, the subject matter of the present application may be less than all of the features of a particular exemplary embodiment of the application. Thus, the following claims are hereby incorporated into the detailed description by way of example or illustration, where each claim stands on its own as a separate exemplary embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the present application should be determined with reference to the appended claims and the full scope of equivalents to which those claims are entitled.

[0118] The present application describes exemplary embodiments with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions is exaggerated for clarity. Thus, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Accordingly, exemplary embodiments should not be construed as being limited to the shapes of the regions shown in the present application, but rather include shape deviations caused by, for example, manufacturing. For example, an etched region shown as rectangular will generally have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0119] In describing some embodiments, the expressions “coupled” and “connected” and their derivatives may be used. For example, in describing some embodiments, the term “connected” may be used to indicate that two or more components have direct physical or electrical contact with each other. Also, for example, in describing some embodiments, the term “coupled” may be used to indicate that two or more components have direct physical or electrical contact with each other. However, the term “coupled” or “communicatively coupled” may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0120] In the present application, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms “a plurality of” and “several” refer to two or more, unless otherwise clearly defined.

[0121] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the disclosed content of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include well-known common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and examples are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the following claims.

[0122] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A display panel, the display panel comprising a light-emitting region and a non-light-emitting region, characterized in that, comprising: a substrate layer; a color filter layer disposed above the substrate layer; a planarization layer disposed on a side of the color filter layer facing away from the substrate layer; the planarization layer includes a light-emitting planar portion corresponding to the light-emitting region, and the light-emitting planar portion is located above the color filter layer in the thickness direction of the display panel, and the thickness of the light-emitting planar portion is greater than or equal to 0.4um and less than or equal to 4um.

2. The display panel according to claim 1, characterized in that, a positive projection of the light-emitting planar portion onto the substrate layer is located within a positive projection of the color filter layer onto the substrate layer.

3. The display panel according to claim 1, characterized in that, the thickness of the color filter layer is greater than the thickness of the light-emitting planar portion.

4. The display panel according to claim 1, characterized in that, the planarization layer further includes an edge planar portion corresponding to the non-light-emitting region, the thickness of the edge planar portion is greater than the thickness of the light-emitting planar portion, or the thickness of the edge planar portion is equal to the thickness of the light-emitting planar portion.

5. The display panel according to claim 4, characterized in that, when the thickness of the edge planar portion is greater than the thickness of the light-emitting planar portion, the thickness of the light-emitting planar portion is less than one-half of the thickness of the edge planar portion.

6. The display panel according to claim 4, characterized in that, when the thickness of the edge planar portion is greater than the thickness of the light-emitting planar portion, a transition slope is included between the light-emitting planar portion and the edge planar portion, and a slope of the transition slope is less than or equal to 90°.

7. The display panel according to claim 6, characterized in that, the slope of the transition slope is less than or equal to 75°.

8. The display panel according to claim 6, characterized in that, the display panel further includes an anode hole disposed on the planarization layer, a positive projection of the anode hole onto the substrate layer is located within a positive projection of the light-emitting planar portion onto the substrate layer, or a positive projection of the anode hole onto the substrate layer is located within a positive projection of the edge planar portion onto the substrate layer.

9. The display panel according to claim 6, characterized in that, the display panel further includes a pixel definition layer covering a side of the transition slope facing away from the substrate layer.

10. The display panel according to claim 9, characterized in that, a thickness of the pixel definition layer covering the transition slope is greater than or equal to 0.5um and less than or equal to 3um.

11. The display panel according to claim 1, characterized in that, the display panel further includes a pixel definition layer covering a side of the planarization layer facing away from the substrate layer, and the pixel definition layer has a pixel opening region, and a positive projection of the pixel opening region onto the substrate layer is located within a positive projection of the light-emitting planar portion onto the substrate layer.

12. The display panel according to claim 11, characterized in that, The pixel definition layer further includes a pixel thickness region, and a positive projection of the pixel thickness region on the substrate layer and a positive projection of the light-emitting flat portion on the substrate layer are at least partially overlapped.

13. The display panel according to claim 1, wherein, in a first direction perpendicular to the thickness direction, a length of the light-emitting flat portion is less than a length of the color filter layer, and the light-emitting flat portion is directly above the color filter layer in the thickness direction.

14. A method for manufacturing a display panel, for manufacturing the display panel according to any one of claims 1-13, wherein, it includes: providing a substrate layer; forming a color filter layer on the substrate layer; depositing a flat layer on a side of the color filter layer facing away from the substrate layer; a thickness of the flat layer at least partially located in the light-emitting region is less than a thickness of the flat layer corresponding to the non-light-emitting region.

15. A display device, wherein, the display device includes the display panel according to any one of claims 1-13.

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