Server device and mainboard module thereof

Abstract

The invention discloses a server device and a mainboard module thereof. The server device comprises a case, a bracket, a fan assembly and an air guide frame. The case comprises a supporting frame and a transverse partition plate. The supporting frame divides the internal space of the case into a front area and a rear area. The transverse partition plate divides the front area into an upper layer area and a lower layer area. The bracket is located within the rear region. The fan assembly comprises a fan frame and a fan array, the fan frame is located on the bracket, and a flow dividing space is formed between the fan frame and the supporting frame. The fan array is provided with a plurality of fan units in a fan frame. The air guide frame is connected with the fan frame and the supporting frame, divides the flow dividing space into an upper flow channel and a lower flow channel and divides the fan array area into an upper part and a lower part. The upper portion defines the range of the upper flow channel, the lower portion defines the range of the lower flow channel, and the number of the fan units covered by the upper portion is different from the number of the fan units covered by the lower portion. According to the scheme, the heat dissipation airflow with the matching degree can be provided for different areas with obviously different heat dissipation requirements, and the overall heat dissipation efficiency is improved by fully passing through high-energy-consumption elements.

Description

Technical Field

[0001] The present invention relates to a server device, and more particularly to a server device with a wind guide frame. Background Art

[0002] With the continuous improvement and refinement of current cloud technologies, servers are all moving towards a high-frequency and high-speed data processing mode. Therefore, the heat dissipation efficiency of servers is crucial. Generally speaking, servers use the cooling air flow generated by fans to dissipate heat from high-power-consuming components inside the servers, such as central processing units, memories, and expansion cards.

[0003] However, in order to make reasonable use of the internal space, the high-power-consuming components in the server are inevitably located above and below the internal space, resulting in the difficulty of concentrating the cooling air flow generated by the fans to the high-power-consuming components, and the overall heat dissipation efficiency cannot be effectively improved.

[0004] It can be seen that the above technologies obviously still have inconveniences and defects, which are urgent problems to be solved in this industry. Summary of the Invention

[0005] An object of the present invention is to provide a server device and its motherboard module to solve the difficulties mentioned in the above prior art.

[0006] An embodiment of the present invention provides a server device. The server device includes a chassis, a bracket, a power motherboard, a fan assembly, and a wind guide frame. The chassis includes a cover, a box body, a support frame, and a horizontal partition. The cover covers the box body and together with the box body defines an internal space. The support frame connects the box body and the cover and divides the internal space into a front area and a rear area. The horizontal partition connects the box body and the support frame and divides the front area into an upper layer area and a lower layer area. The bracket is located in the rear area, and the power motherboard is located on the bottom surface of the bracket. The fan assembly includes a fan frame and a fan array. The fan frame is fixed on the bracket and together with the box body, the cover, and the support frame defines a flow splitting space that connects the upper layer area and the lower layer area. The fan array includes a plurality of fan units. These fan units are stacked in sequence in the fan frame along the normal direction of the bottom surface of the bracket and are electrically connected to the power motherboard. The wind guide frame includes a partition. The partition connects the fan assembly and the support frame and divides the flow splitting space into an upper flow channel and a lower flow channel, and divides the fan array into an upper part and a lower part. The upper part defines the scope of the upper flow channel, the lower part defines the scope of the lower flow channel, and the number of these fan units covered by the upper part is different from the number of these fan units covered by the lower part.

[0007] According to one or more embodiments of the present invention, the above-mentioned server device further includes a first electronic module, at least one second electronic module, and a backplane module. The first electronic module is removably located in the upper layer area. The second electronic module is removably located in the lower layer area. The backplane module is fixed to the support frame and electrically connects the first electronic module, the second electronic module, and the power supply main board.

[0008] According to one or more embodiments of the present invention, in the above-mentioned server device, the first electronic module includes a first carrier plate, at least one first electronic device, and two air blocking members. The first carrier plate is removably located in the upper layer area and defines a first accommodation space communicating with the upstream flow channel. The first electronic device is fixed in the first accommodation space. These air blocking members are respectively fixed to two opposite inner walls of the first carrier plate to limit the first accommodation space.

[0009] According to one or more embodiments of the present invention, in the above-mentioned server device, the lower layer area includes a plurality of accommodation slots. The second electronic module includes a plurality of second electronic modules. These second electronic modules are arranged side by side in these accommodation slots, and each second electronic module includes a second carrier plate and at least one second electronic device. The second carrier plate is removably located in one of the accommodation slots and defines a second accommodation space communicating with the downstream flow channel. The second electronic device is fixed in the second accommodation space.

[0010] According to one or more embodiments of the present invention, in the above-mentioned server device, the air guiding frame further includes a separating column. The separating column connects the separating plate and the bracket, and connects the fan frame and the support frame, so that the downstream flow channel is divided into two flow channel areas. These flow channel areas respectively and independently communicate with these accommodation slots and respectively point to these fan units covered by the lower part.

[0011] According to one or more embodiments of the present invention, in the above-mentioned server device, the air guiding frame includes a first handle, the first handle is located in the upstream flow channel and is fixed to the separating plate. The main board module further includes two lugs and a second handle, and these lugs protrude in a direction away from the power supply main board together. The second handle connects these lugs and is arranged opposite to the first handle.

[0012] According to one or more embodiments of the present invention, in the above-mentioned server device, the fan array includes a plurality of vertical fan modules. These vertical fan modules are arranged side by side in the fan frame in sequence along the long axis direction of the support frame, and each vertical fan module includes a columnar frame. A part of these fan units are stacked in the columnar frame in sequence along the normal direction.

[0013] An embodiment of the present invention provides a motherboard module. The motherboard module includes a bracket, a power motherboard, a fan assembly, and a wind guide frame. The power motherboard is located on the bottom surface of the bracket. The fan assembly includes a fan frame, a fan array, and a abutting gasket. The fan frame is located on the power motherboard. The fan array includes a plurality of fan units. These fan units are stacked in sequence in the fan frame along the normal direction of the bottom surface of the bracket and are electrically connected to the power motherboard. The abutting gasket is fixed to the outer side surface of the fan frame and divides these fan units of the fan array into an upper part and a lower part. The number of these fan units covered by the upper part is different from the number of these fan units covered by the lower part, and the long axis direction of the abutting gasket is orthogonal to the normal direction. The wind guide frame is connected to the abutting gasket and extends obliquely outward from the abutting gasket to divert the air flow of these fan units covered by the upper part and the air flow of these fan units covered by the lower part.

[0014] According to one or more embodiments of the present invention, in the above-mentioned motherboard module, the wind guide frame includes a partition board, a first handle, and at least one bracket. One side of the partition board is connected to the abutting gasket. The brackets are respectively connected to the partition board and the bracket, and the first handle is fixed to the side of the partition board facing away from the power motherboard. The bracket also includes two lugs and a second handle. These lugs protrude together in a direction away from the power motherboard, and the second handle is fixedly connected to these lugs and is arranged opposite to the first handle.

[0015] According to one or more embodiments of the present invention, in the above-mentioned motherboard module, the wind guide frame further includes a partition column. The partition column is respectively connected to the partition board, the bracket, and the fan assembly, so that the space between the partition board and the bracket is divided into two flow channel areas, and one of the flow channel areas points to one of the fan units.

[0016] In this way, through the above architecture, the server device and its motherboard module of this case can enable the fan assembly to provide a matching degree of cooling air flow for different areas with significantly different cooling requirements, so that it can fully pass through high-power-consuming components, thereby effectively improving the overall cooling efficiency.

[0017] The above is only used to elaborate on the problems to be solved by the present invention, the technical means for solving the problems, and the effects produced by them, etc. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the description of the accompanying drawings is as follows:

[0019] Figure 1 A three-dimensional view of a server device according to an embodiment of the present invention;

[0020] Figure 2 For Figure 1Exploded view of the server device;

[0021] Figure 3 is Figure 1 A cross-sectional view taken along line AA in;

[0022] Figure 4 is Figure 1 A cross-sectional view taken along line BB in;

[0023] Figure 5 is Figure 1 A cross-sectional view taken along line CC in;

[0024] Figure 6 is Figure 5 A partial enlarged view of region M of;

[0025] Figure 7 An enlarged view of the first electronic module of this embodiment;

[0026] Figure 8 An enlarged view of the second electronic module of this embodiment.

[0027]

Symbol Explanation

[0028] 10: Server device

[0029] 100: Chassis

[0030] 110, 111: Cover

[0031] 120: Box body

[0032] 121: Bottom plate

[0033] 122: Side plate

[0034] 123: Internal space

[0035] 130: Support frame

[0036] 131: Front region

[0037] 132: Rear region

[0038] 133: Abutment flange

[0039] 140: Transverse partition

[0040] 150: Spacing

[0041] 151: Upper layer area

[0042] 152: Lower layer area

[0043] 153: Accommodation groove

[0044] 160: Rear cover

[0045] 200: First electronic module

[0046] 210: First carrier plate

[0047] 211: First plate body

[0048] 212: First side plate

[0049] 213: Opening

[0050] 214: Second side plate

[0051] 215: Inner wall surface

[0052] 220: First accommodating space

[0053] 230: Wind blocking member

[0054] 231: Channel

[0055] 240: First electronic device

[0056] 300: Second electronic module

[0057] 310: Second carrier plate

[0058] 320: Second accommodating space

[0059] 330: Second electronic device

[0060] 400: Backplane module

[0061] 500: Main board module

[0062] 510: Bracket

[0063] 511: Bottom surface

[0064] 512: Lug

[0065] 513: Second handle

[0066] 520: Power main board

[0067] 600: Fan assembly

[0068] 610: Fan frame

[0069] 611: Abutted gasket

[0070] 620: Vertical fan module

[0071] 621: Columnar frame

[0072] 624: Fan unit

[0073] 630: Fan array

[0074] 631: Upper part

[0075] 632: Lower part

[0076] 700: Air guide frame

[0077] 710: Partition board

[0078] 720: Bracket

[0079] 730: Horizontal part

[0080] 731: Narrow groove

[0081] 732: Convex wing

[0082] 733: Flow-through gap

[0083] 740: Longitudinal part

[0084] 750: Partition column

[0085] 760: Flow channel area

[0086] 761: Sub-flow channel

[0087] 770: First handle

[0088] AA, BB, CC: Line segment

[0089] M: Area

[0090] F: Front port

[0091] R: Rear port

[0092] S: Shunt space

[0093] S1: Upper flow channel

[0094] S2: Lower flow channel

[0095] X, Y, Z: Axis Detailed implementation manners

[0096] Multiple embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details are not used to limit the present invention. That is to say, in one embodiment of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.

[0097] Figure 1 Is a perspective view of a server device 10 according to an embodiment of the present invention. Figure 2 Is Figure 1 An exploded view of the server device 10. Figure 3 IsFigure 1 A cross-sectional view taken along line AA. As Figures 1 to 3 shown, in this embodiment, the server device 10 includes a chassis 100, a first electronic module 200, two second electronic modules 300, a backplane module 400, and a main board module 500. The chassis 100 includes two covers 110, 111, a box body 120, a support frame 130, and a transverse partition 140. These covers 110, 111 respectively cover the box body 120, such that these covers 110, 111 and the box body 120 together define an internal space 123. In this embodiment, for example, the box body 120 includes a bottom plate 121, two side plates 122, and a rear cover 160. These side plates 122 are respectively located on two opposite long sides of the bottom plate 121 and both extend in a common direction (such as the Z-axis), such that the box body 120 has a front port F and a rear port R opposite to each other, and the rear cover 160 covers the rear port R. The covers 110, 111 are opposite to the bottom plate 121 and cover onto these side plates 122, such that the covers 110, 111, the bottom plate 121, and these side plates 122 together define the above-mentioned internal space 123. The support frame 130 is located inside the internal space 123, commonly connecting the covers 110, 111 and the bottom plate 121 and these side plates 122 of the box body 120, and partitioning the internal space 123 into a front region 131 and a rear region 132. The transverse partition 140 is located inside the internal space 123, connecting the support frame 130 and these side plates 122 of the box body 120, and partitioning the front region 131 into an upper layer area 151 and a lower layer area 152. The long axis direction of the box body 120 (such as the X-axis) is parallel to the long axis direction of the transverse partition 140 (such as the X-axis), and the long axis directions of the support frames 130 (such as the Y-axis) are orthogonal to each other.

[0098] Figure 4 For Figure 1 a cross-sectional view taken along line BB. As Figures 2 to 4 shown, the main board module 500 includes a bracket 510, a power main board 520, a fan assembly 600, and a wind guide frame 700. The bracket 510 is located in the rear region 132, and the power main board 520 is located on the bottom surface 511 of the bracket 510. In this embodiment, the bracket 510 is fixed to the bottom plate 121 of the box body 120, and the power main board 520 is placed flat on the bottom surface 511 of the bracket 510 (such as the X-Y plane), and the above-mentioned support frame 130 passes through the power main board 520 and is locked to the bracket 510. The fan assembly 600 is located on the power main board 520, and the wind guide frame 700 connects the support frame 130 and the fan assembly 600. A diversion space S ( Figure 3 ) is commonly defined among the fan assembly 600, the support frame 130, the covers 110, 111, and these side plates 122 of the box body 120, and the diversion space S communicates with the upper layer area 151 and the lower layer area 152.

[0099] The first electronic module 200 is removably located in the upper layer area 151, which means that the first electronic module 200 can enter and exit the upper layer area 151 from the front port F. These second electronic modules 300 are respectively removably located in the lower layer area 152. More specifically, the lower layer area 152 is divided into a plurality of (such as 2) receiving slots 153 by a space 150 ( Figure 2 ), and each second electronic module 300 is removably installed in one of the receiving slots 153, which means that each second electronic module 300 can enter and exit the receiving slot 153 of the lower layer area 152 from the front port F. The backplane module 400 is fixed on the support frame 130 and is electrically connected to the first electronic module 200, the second electronic module 300 and the power supply main board 520.

[0100] As Figure 2 shown in Figure 3 , the fan assembly 600 includes a fan frame 610 and a plurality of vertical fan modules 620. The fan frame 610 is located on the bracket 510, and the long axis direction (such as the Y axis) of the fan frame 610 is parallel to the long axis direction (such as the Y axis) of the support frame 130. In this embodiment, the fan frame 610 is fixed to the power supply main board 520, the bracket 510 and the side plates 122 of the box body 120 by screws, and the diversion space S is jointly defined between the fan frame 610, the support frame 130, the cover body 111 and the side plates 122 of the box body 120 ( Figure 3 ).

[0101] Figure 5 is Figure 1 a cross-sectional view taken along the line CC in Figure 2 shown in Figure 5 . As

[0102] shown in Figure 5 , these vertical fan modules 620 are arranged side by side in sequence along the long axis direction (such as the Y axis) of the support frame 130 in the fan frame 610. Each vertical fan module 620 is pluggable in the fan frame 610 and is electrically connected to the power supply main board 520. The vertical fan module 620 includes a columnar frame 621 and a plurality of fan units 624. These fan units 624 are stacked in sequence in the columnar frame 621 along the normal direction (such as the Z axis) of the bottom surface 511 of the bracket 510 and are electrically connected to the power supply main board 520.

[0102] It should be understood that since all the fan units 624 of all the vertical fan modules 620 in the fan frame 610 can be regarded as arranged in the fan frame 610 in an array manner (such as 4X8), therefore, all the fan units 624 in the fan frame 610 are also called a fan array 630 ( Figure 5 ).

[0103] As Figure 2 shown in Figure 5As shown, a cushioning gasket 611 is covered on the outer side surface of the fan frame 610. The cushioning gasket 611 extends in the long axis direction of the support frame 130 (such as the Y-axis). In other words, the long axis direction (such as the Y-axis) of the cushioning gasket 611 is parallel to the long axis direction (such as the Y-axis) of the fan frame 610, and the length of the cushioning gasket 611 is similar to the length of the fan frame 610. The position of the cushioning gasket 611 on the fan frame 610 can divide these fan units 624 of the fan array 630 into an upper part 631 and a lower part 632( Figure 5 ). The upper part 631 defines the range of the upstream flow path S1, the lower part 632 defines the range of the downstream flow path S2, and the number of these fan units 624 covered by the upper part 631 is different from the number of these fan units 624 covered by the lower part 632.

[0104] In this embodiment, the number of these fan units 624 covered by the upper part 631 of the fan assembly 600 is greater than the number of these fan units 624 covered by its lower part 632. That is to say, the air flow rate that these fan units 624 covered by the upper part 631 of the fan assembly 600 can extract from the upper layer area 151 is greater than the air flow rate that these fan units 624 covered by its lower part 632 can extract from the lower layer area 152, so as to provide a matching degree of cooling air flow for different areas with significantly different cooling requirements, enabling it to fully pass through the high-energy-consuming components, thereby effectively improving the overall cooling efficiency.

[0105] As Figures 3 to 5 shown, the air guide frame 700 includes a partition plate 710 and at least one support frame 720. The partition plate 710 is obliquely connected to the fan frame 610 and the support frame 130, and divides the diversion space S into an upstream flow path S1 and a downstream flow path S2. The upstream flow path S1 is respectively connected to the upper layer area 151 and the fan frame 610, and the downstream flow path S2 is respectively connected to the lower layer area 152 and the fan frame 610. The support frame 720 is located in the downstream flow path S2, and is respectively connected to the partition plate 710 and the bracket 510 and supports the partition plate 710 for supporting the partition plate 710.

[0106] More specifically, as Figure 3 and Figure 5 shown, a cushioning flange 133 protrudes outward from the outer side surface of the support frame 130 facing the fan assembly 600( Figure 4 ). The two opposite long sides of the partition plate 710 respectively abut against the cushioning gasket 611 and the cushioning flange 133 to divert the air flow of the fan units 624 covered by the upper part 631 and the air flow of the fan units 624 covered by the lower part 632.

[0107] More specifically, as Figure 3 and Figure 4As shown, the air guide frame 700 further includes a partition column 750, and there are a plurality (e.g., 2) of brackets 720. The two opposite ends of the partition column 750 are respectively fixedly connected to the partition plate 710 and the bracket 510, and the two opposite sides of the partition column 750 are respectively fixedly connected to the fan frame 610 and the support frame 130, so that the downstream channel S2 is separated by the partition column 750 into two channel areas 760, and these channel areas 760 are respectively independently connected to these accommodation grooves 153. Each bracket 720 is located in one of the channel areas 760 and connects the bottom surface 511 of the partition plate and the bottom surface 511 of the bracket 510, and these brackets 720 and the partition column 750 further divide these channel areas 760 into a plurality of sub-channels 761, and one of the sub-channels 761 is aligned or pointed at two of the fan units 624 together, so that the air flow passing through the sub-channel 761 can be more smoothly sent into the corresponding fan unit 624.

[0108] In addition, further, as Figure 3 shown in Figure 5 each bracket 720 is U-shaped and includes a transverse portion 730 and two longitudinal portions 740. One side of the transverse portion 730 is locked to the bottom surface 511 of the partition plate 710, and these longitudinal portions 740 extend from the two opposite ends of the transverse portion 730 and in the direction of the bracket 510. The transverse portion 730 is locked to the bottom surface 511 of the partition plate 710, and one end of each longitudinal portion 740 away from the transverse portion 730 is locked to the bracket 510.

[0109] In addition, Figure 6 FIG. Figure 5 is a partial enlarged view of the region M in Figure 6 As shown, one side of the transverse portion 730 facing the partition plate 710 has a long and narrow groove 731 and a plurality of convex wings 732. The partition plate 710 covers the transverse portion 730 and the long and narrow groove 731, and these convex wings 732 protrude from the bottom of the long and narrow groove 731 at intervals and divide the long and narrow groove 731 into a plurality of flow gaps 733. In this way, the transverse portion 730 is provided with the long and narrow groove 731 and the convex wings 732, which can not only bring specific structural strength at a specific thickness, but also enhance the passage of air flow, thereby providing heat dissipation efficiency.

[0110] The air guide frame 700 further includes a first handle 770. The first handle 770 is fixed on the partition plate 710 and is located in the upstream channel S1. The main board module 500 further includes two lugs 512 and a second handle 513. The lugs 512 extend from the two opposite sides of the bracket 510 together in the direction (such as the Z axis) of the cover 111. The second handle 513 connects these lugs 512 and is arranged opposite to the first handle 770. In this way, referring to Figure 3 when the user wants to remove the main board module 500 from the chassis 100, the user can grasp the first handle 770 and the second handle 513 and move the main board module 500 out of the chassis 100.

[0111] Figure 7 This is an enlarged view of the first electronic module 200 of this embodiment. In this embodiment, more specifically, as Figure 3 and Figure 7 , an upper layer area 151 is provided for a first electronic module 200 to be removably installed therein. The first electronic module 200 includes a first carrier plate 210, a plurality of wind blocking members 230, and one or more first electronic devices 240. The first carrier plate 210 is removably located in the upper layer area 151, and the first carrier plate 210 contains a first accommodation space 220 that communicates with an upstream flow channel S1. These first electronic devices 240 are located on the first carrier plate 210 and are fixed in the first accommodation space 220. These wind blocking members 230 are respectively fixed to two opposite inner walls of the first carrier plate 210 and protrude toward each other, thereby restricting the first accommodation space 220.

[0112] Therefore, when the airflow in the first accommodation space 220 is blocked by these wind blocking members 230 and is centrally guided into the upstream flow channel S1, the airflow can quickly send the heat energy of the first electronic device 240 to the fan assembly 600 without swirling or staying in the first carrier plate 210.

[0113] In this embodiment, for example, the first carrier plate 210 includes a first plate body 211, two first side plates 212, and two second side plates 214. The first side plates 212 are opposite to each other, the second side plates 214 are opposite to each other, and the first side plates 212 and the second side plates 214 jointly surround and are adjacent to the first plate body 211 and jointly define the above-mentioned first accommodation space 220. The first electronic device 240 is, for example, an expansion card component (GPU or PCI-e) and is arranged side by side on the first plate body 211. The wind blocking members 230 are respectively located on the inner wall surface 215 of the second side plates 214. In addition, the first electronic module 200 further includes an opening 213. The opening 213 is formed on one of the first side plates 212 closer to the support frame 130, is aligned with the channel 231 between the wind blocking members 230, and the opening 213 and the channel 231 have the same width.

[0114] Figure 8 This is an enlarged view of the second electronic module 300 of this embodiment. More specifically, as Figure 3 and Figure 8 , the second electronic module 300 includes a second carrier plate 310 and one or more second electronic devices 330. The second carrier plate 310 is removably located in one of the accommodation grooves 153, and the second carrier plate 310 has a second accommodation space 320 that communicates with a downstream flow channel S2. The second electronic device 330 is fixed in the second accommodation space 320. The second electronic device 330 is, for example, a transmission unit or a storage unit.

[0115] In some embodiments, the chassis 100 is a rack - type server chassis (Rack) for accommodating the above - mentioned related electronic devices and / or expansion components. The height of the chassis 100 is measured in units of U (1U is equal to 1.75 inches or 44.45 millimeters). The chassis 100 is, for example but not limited to, used to accommodate standard server chassis such as 7U.

[0116] Thus, through the above - mentioned architecture, the server device and its motherboard module of this case can enable the fan assembly to provide a matching degree of cooling air flow for different regions with significantly different cooling requirements, so that it can fully pass through high - energy - consuming components, thereby effectively improving the overall cooling efficiency.

[0117] Finally, in the above - disclosed embodiments, they are not intended to limit the present invention. Any person skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention, and all can be protected by the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.

Claims

1. A server device, characterized in that, comprising: a chassis including a cover, a box body, a support frame and a transverse partition. The cover covers the box body and together with the box body defines an internal space. The support frame connects the box body and the cover and divides the internal space into a front area and a rear area. The transverse partition connects the box body and the support frame and divides the front area into an upper layer area and a lower layer area; a bracket located in the rear area; a power main board located on a bottom surface of the bracket; a fan assembly including a fan frame and a fan array. The fan frame is located on the bracket and together with the cover, the box body and the support frame defines a diversion space connecting the upper layer area and the lower layer area. The fan array includes a plurality of fan units, and the plurality of fan units are stacked in sequence along the normal direction of the bottom surface of the bracket in the fan frame and are electrically connected to the power main board; and a wind guiding frame including a partition board. The partition board connects the fan assembly and the support frame and divides the diversion space into an upper flow channel and a lower flow channel, and divides the plurality of fan units of the fan array into an upper part and a lower part, wherein the upper part defines the range of the upper flow channel, the lower part defines the range of the lower flow channel, and the number of the plurality of fan units covered by the upper part is different from the number of the plurality of fan units covered by the lower part.

2. The server device according to claim 1, characterized in that, further comprising: a first electronic module removably located in the upper layer area; at least one second electronic module removably located in the lower layer area; and a backplane module fixed on the support frame and electrically connected to the first electronic module, the second electronic module and the power main board.

3. The server device according to claim 2, characterized in that, wherein the first electronic module includes: a first carrier plate removably located in the upper layer area and defining a first accommodation space connecting the upper flow channel; and at least one first electronic device fixed in the first accommodation space; and two wind blocking members respectively fixed on two opposite inner walls of the first carrier plate for restricting the first accommodation space.

4. The server device according to claim 2, characterized in that, wherein the lower layer area includes a plurality of accommodation grooves, the second electronic module includes a plurality of second electronic modules, the plurality of second electronic modules are arranged side by side in the plurality of accommodation grooves, and each of the plurality of second electronic modules includes a second carrier plate and at least one second electronic device. The second carrier plate is removably located in one of the plurality of accommodation grooves and defines a second accommodation space connecting the lower flow channel, and the second electronic device is fixed in the second accommodation space.

5. The server device according to claim 4, characterized in that, wherein the wind guiding frame further includes: a partition column connecting the partition board and the bracket and connecting the fan frame and the support frame, so that the lower flow channel is divided into two flow channel areas, the two flow channel areas are respectively and independently connected to the plurality of accommodation grooves and respectively point to the plurality of fan units covered by the lower part.

6. The server device as claimed in claim 1, characterized in that, the air guide frame includes a first handle located within the upstream channel and fixed to the partition plate; and the bracket further includes two lugs and a second handle, the two lugs protruding together in a direction away from the power main board, the second handle connecting the two lugs and being disposed opposite to the first handle.

7. The server device as claimed in claim 1, characterized in that, the fan array includes a plurality of vertical fan modules arranged side by side in sequence along the long axis direction of the support frame within the fan frame, and each of the plurality of vertical fan modules includes a columnar frame, wherein a part of the plurality of fan units are stacked in sequence in the columnar frame along the normal direction.

8. A main board module, characterized in that, comprising: a bracket; a power main board located on a bottom surface of the bracket; a fan assembly, comprising: a fan frame located on the power main board; a fan array including a plurality of fan units, the plurality of fan units being stacked in sequence in the fan frame along a normal direction of the bottom surface of the bracket and electrically connected to the power main board; and a abutting gasket fixed to an outer side surface of the fan frame and dividing the plurality of fan units of the fan array into an upper part and a lower part, the number of the plurality of fan units covered by the upper part being different from the number of the plurality of fan units covered by the lower part, wherein a long axis direction of the abutting gasket is orthogonal to the normal direction; and an air guide frame connected to the abutting gasket and extending obliquely outward from the abutting gasket for diverting the air flow of the plurality of fan units covered by the upper part and the air flow of the plurality of fan units covered by the lower part.

9. The main board module as claimed in claim 8, characterized in that, the air guide frame includes a partition plate, a first handle and at least one bracket, one side of the partition plate being connected to the abutting gasket, the bracket being connected to the partition plate and the bracket respectively, the first handle being fixed to a surface of the partition plate facing away from the power main board; and the bracket further includes two lugs and a second handle, the two lugs protruding together in a direction away from the power main board, and the second handle being fixedly connected to the two lugs and being disposed opposite to the first handle.

10. The main board module as claimed in claim 9, characterized in that, the air guide frame further includes a partition column connecting the partition plate, the bracket and the fan frame, such that the space between the partition plate and the bracket is divided into two flow channel regions, one of the two flow channel regions pointing to a part of the plurality of fan units.

Images