Test preparation device and test preparation method of integrated circuit

Abstract

The invention discloses a test preparation device and method for an integrated circuit, and the device comprises a carrying platform, a man-machine interaction module, a control module, a drive module, a positioning adaption module, and a positioning locking module, and the carrying platform is used for placing a tested sample; the man-machine interaction module is used for inputting a preparation instruction, and the preparation instruction at least comprises a tested sample type of a tested sample; the control module is used for controlling the driving module to act according to the preparation instruction; the driving module is used for driving the positioning adaptation module to act according to the preparation instruction; the positioning adaptation module is used for determining appearance parameters of the tested sample according to the type of the tested sample; the positioning locking module is used for locking the tested sample according to the appearance parameters of the tested sample, and after locking is completed, the tested sample is prepared before welding, so that integrated circuit weldability test preparation can be rapidly completed, the operation difficulty is reduced, and the preparation success rate is improved.

Description

Technical Field

[0001] This application belongs to the field of preparation technology, and particularly relates to a test preparation device and method for integrated circuits. Background Art

[0002] For the solderability test of integrated circuits packaged by ball grid array (BGA) and column grid array (CGA), and other tests that require stencil preparation, the preparation process is to design and manufacture a stencil according to the size and layout of the leads of the test piece, and use the stencil to print solder in the same pattern as the leads of the test piece onto the substrate according to the lead layout. After removing the stencil, the test piece is placed on the printed solder.

[0003] There are many uncontrollable factors in the preparation process. Among them, during the stencil removal process, due to uneven force on the stencil and the adhesiveness of the solder, it is very difficult to ensure that the substrate and the stencil do not displace in other directions except the separation direction during the separation process, resulting in damage to the printed solder pattern; during the process of matching the leads of the integrated circuit with the printed solder pattern, since the number of leads is dozens at least and hundreds or thousands at most, it is very difficult to ensure the match with the printed pattern by pure hand; and it is very easy to touch the printed solder during the matching process, resulting in an incomplete printed pattern, thus causing the preparation process to fail and the success rate to be very low. How to avoid the incomplete printed pattern caused by the printed solder during the preparation process, thus causing the preparation process to fail, is an urgent problem to be solved at present. Summary of the Invention

[0004] This application aims to provide a test preparation device and method for integrated circuits to solve the deficiencies in the prior art, and the technical problems to be solved by this application are achieved through the following technical solutions.

[0005] In the first aspect, an embodiment of this application provides a test preparation device for integrated circuits, and the device includes: a carrier stage, a human-machine interaction module, a control module, a driving module, a positioning and adaptation module, and a positioning and locking module, where,

[0006] The carrier stage is used to place the test sample;

[0007] The human-machine interaction module is used to input preparation instructions, where the preparation instructions at least include the type of the test sample of the test sample;

[0008] The control module is used to control the driving module to act according to the preparation instructions;

[0009] The driving module is used to drive the positioning and adaptation module to act according to the preparation instructions;

[0010] The positioning and adaptation module is used to determine the shape parameters of the test sample according to the type of the test sample;

[0011] The positioning and locking module is used to lock the test sample according to the shape parameters of the test sample, and after the locking is completed, preparation before welding is performed on the test sample.

[0012] Optionally, the device further includes an acquisition module, and the acquisition module is used to judge the test sample after the preparation before welding is completed.

[0013] Optionally, the acquisition module is an electron microscope.

[0014] Optionally, the human-machine interaction module is an HMI touch screen.

[0015] Optionally, the positioning and adapting module includes: a fixed frame, a servo motor, and an electromagnetic release unit;

[0016] The fixed frame is used to fix the test sample;

[0017] The servo motor is located on the opposite side of the fixed frame and is used to adjust the size of the fixed frame;

[0018] The electromagnetic release unit is used to lock and unlock each component.

[0019] Optionally, a substrate, a test sample, and a stencil are sequentially placed on the fixed frame from bottom to top.

[0020] Optionally, the positioning and locking module includes: a power generation component, an elastic component, and a moving component. Among them, the power generation component is located outside the elastic component, and the moving component is arranged at the top of the elastic component.

[0021] Optionally, the power generation component is a coil, and the elastic component is a spring.

[0022] Optionally, the control module is a PLC controller, and the control module is used to power on and off under different conditions, and control the unlocking and locking of the positioning and adapting module and the positioning and locking module.

[0023] In a second aspect, an embodiment of the present application provides a test preparation method, which is applied to any integrated circuit test preparation device in the first aspect. The method includes:

[0024] Place the test sample on the carrier table of the integrated circuit test preparation device;

[0025] Input a preparation instruction to the control module through the human-machine interaction module, and the preparation instruction at least includes the type of the test sample of the test sample;

[0026] According to the preparation instructions, control the driving module to act, so that the driving module drives the positioning and adapting module to determine the shape parameters of the sample under test according to the type of the sample under test, match the positioning and adapting module with the lead-out terminal pattern, record the coordinates, and print the lead-out terminal pattern on the substrate;

[0027] Lock the sample under test according to the shape parameters of the sample under test. After the locking is completed, perform the preparation before welding on the sample under test.

[0028] The embodiments of the present application include the following advantages:

[0029] The test preparation device and method for integrated circuits provided by the embodiments of the present application. The device includes: a carrier table, a human-computer interaction module, a control module, a driving module, a positioning and adapting module, and a positioning and locking module. Among them, the carrier table is used to place the sample under test; the human-computer interaction module is used to input preparation instructions, where the preparation instructions at least include the type of the sample under test; the control module is used to control the driving module to act according to the preparation instructions; the driving module is used to drive the positioning and adapting module to act according to the preparation instructions; the positioning and adapting module is used to determine the shape parameters of the sample under test according to the type of the sample under test; the positioning and locking module is used to lock the sample under test according to the shape parameters of the sample under test. After the locking is completed, perform the preparation before welding on the sample under test, which can quickly complete the solderability test preparation of ball grid array (BGA) and column grid array (CGA) packaged integrated circuits, and reduce the operation difficulty and improve the preparation success rate. Description of the Drawings

[0030] In order to more clearly illustrate the embodiments of the present application or the existing technical solutions, the following will briefly introduce the drawings required for the description of the embodiments or the existing technical solutions. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0031] Figure 1 It is a schematic structural diagram of a test preparation device for an integrated circuit in an embodiment of the present application;

[0032] Figure 2 It is a schematic structural diagram of another test preparation device for an integrated circuit in an embodiment of the present application;

[0033] Figure 3 It is a schematic structural diagram of an electromagnetic release unit in an embodiment of the present application;

[0034] Figure 4It is a schematic structural diagram of a positioning and locking module in an embodiment of the present application;

[0035] Figure 5 It is a schematic flowchart of a test preparation method for an integrated circuit of the present application;

[0036] Reference numerals:

[0037] 1 - Human - machine interaction module; 2 - Positioning and adaptation module; 3 - Substrate; 4 - Carrier stage;

[0038] 5 - Servo motor; 6 - Electromagnetic release device; 7 - Electron microscope; 8 - Fixed frame;

[0039] 9 - Positioning and locking module; 10 - Moving part; 11 - Return spring; 12 - Coil. Detailed implementation manners

[0040] To make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with specific embodiments and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0041] Referring to Figure 1 , a schematic structural diagram of a test preparation device for an integrated circuit of the present application is shown. The device includes: a carrier stage, a human - machine interaction module 1, a control module, a driving module 4, a positioning and adaptation module 1, and a positioning and locking module 8. Among them,

[0042] The carrier stage 4 is used to place the test sample;

[0043] The human - machine interaction module 1 is used to input preparation instructions, where the preparation instructions at least include the type of the test sample of the test sample;

[0044] The control module is used to control the driving module to act according to the preparation instructions;

[0045] The driving module 4, that is, the servo motor, is used to drive the positioning and adaptation module to act according to the preparation instructions;

[0046] The positioning and adaptation module 2 is used to determine the shape parameters of the test sample according to the type of the test sample;

[0047] The positioning and locking module 8 is used to lock the test sample according to the shape parameters of the test sample. After the locking is completed, preparation before welding the test sample is carried out.

[0048] Such as Figure 1 and Figure 2As shown in the figure, the human-machine interaction module includes an HMI (Human Machine Interface). HMI is the abbreviation of Human Machine Interface, which means "human-machine interface", also known as the human-machine interface. It is the medium for interaction and information exchange. The human-machine interface (also known as the user interface or the user interface) is the medium for interaction and information exchange between the system and the user. It realizes the conversion between the internal form of information and the form that humans can accept. The human-machine interface exists in all fields that participate in human-machine information exchange. It is a digital device that connects industrial control devices such as programmable logic controllers (PLCs), frequency converters, DC speed controllers, and instruments, displays information on a display screen, and writes working parameters or inputs operation commands through an input unit (such as a touch screen, keyboard, mouse, etc.) to achieve information interaction between humans and machines. It consists of two parts: hardware and software. The human-machine interface product consists of two parts: hardware and software. The hardware part includes a processor, a display unit, an input unit, a communication interface, a data storage unit, etc. Among them, the performance of the processor determines the performance level of the HMI product, and it is the core unit of the HMI.

[0049] In the embodiment of the present application, the test sample is placed on the carrier table. A fixed frame is installed on the carrier table. A substrate is placed on the frame, the test sample is placed on the substrate, and a stencil is placed on the test sample.

[0050] The user can input the type of the test sample to be tested and the corresponding shape parameters of the sample type on the human-machine interaction module. The human-machine interaction module sends the preparation instruction to the control module. The control module is used to drive the positioning and adaptation module to act, that is, to drive the positioning and adaptation module to determine the shape parameters of the test sample according to the type of the test sample. Specifically, the fixing device for fixing the test sample is adjusted to a suitable size, and the test sample is locked by the positioning and locking module. After the locking is completed, the preparation before welding of the test sample is carried out.

[0051] The test preparation device for integrated circuits provided by the embodiment of the present application includes: a carrier table, a human-machine interaction module, a control module, a driving module, a positioning and adaptation module, and a positioning and locking module. Among them, the carrier table is used to place the test sample; the human-machine interaction module is used to input the preparation instruction, where the preparation instruction at least includes the type of the test sample to be tested; the control module is used to control the driving module to act according to the preparation instruction; the driving module is used to drive the positioning and adaptation module to act according to the preparation instruction; the positioning and adaptation module is used to determine the shape parameters of the test sample according to the type of the test sample; the positioning and locking module is used to lock the test sample according to the shape parameters of the test sample. After the locking is completed, the preparation before welding of the test sample is carried out, which can quickly complete the solderability test preparation of ball grid array (BGA) and column grid array (CGA) packaged integrated circuits and reduce the operation difficulty and improve the preparation success rate.

[0052] Another embodiment of the present application further supplements the test preparation device for the integrated circuit provided in the above embodiment.

[0053] Optionally, the device further includes an acquisition module, which is used to judge the test sample after preparation before welding.

[0054] Optionally, the acquisition module is an electron microscope 6.

[0055] Optionally, the human-machine interaction module is an HMI touch screen.

[0056] Such as Figure 1 and Figure 2 As shown, the embodiment of the present application is a PLC-controlled automatic integrated circuit solderability test preparation device, mainly including a PLC, an HMI touch screen, a servo motor 5, a carrier table 4, an automatic positioning and locking device 9, an integrated circuit adapter device, and an electron microscope 7. The core components from bottom to top are: a carrier table, a locking device, a substrate 3, a stencil, an integrated circuit adapter device, and a microscope.

[0057] Optionally, the positioning and adaptation module includes: a fixed frame 8, a servo motor 5, and an electromagnetic release device (unit) 6;

[0058] The fixed frame 8 is used to fix the test sample;

[0059] The servo motor 5 is located on the opposite side of the fixed frame and is used to adjust the size of the fixed frame;

[0060] The electromagnetic release unit 6 is used to lock and unlock each component.

[0061] Such as Figure 3 As shown, the automatic locking device has an internal electromagnetic mechanism that can lock and unlock each structural unit during the process controlled by the PLC, and the integrated circuit adapter device can be driven by a servo motor to achieve three-axis six-direction free movement.

[0062] Optionally, the substrate, the test sample, and the stencil are sequentially placed on the fixed frame from bottom to top.

[0063] Optionally, the positioning and locking module 9 includes: a power generation component, an elastic component, and a moving component. Among them, the power generation component is located outside the elastic component, and the moving component 10 is arranged on the top of the elastic component.

[0064] Optionally, the power generation component is a coil 12, and the elastic component is a spring, that is, a return spring 11.

[0065] Such as Figure 4As shown, the locking and adapting are two independent structural units with different functions. Locking realizes the locking and unlocking of each unit during the process. The adapting device adjusts its own structure through motor drive according to the outer dimensions of the test sample. The servo motor is used to drive the adapting mechanism, the carrier table is used to move between different workstations, and the electron microscope is used to inspect the prepared state.

[0066] Optionally, the control module is a PLC controller. The control module is used for power on and off under different conditions, and controls the unlocking and locking of the positioning and adapting module and the positioning and locking module.

[0067] The PLC controls the on and off of the locking device coil under different conditions to achieve unlocking and locking.

[0068] Figure 5 It is a schematic flow chart of the test preparation method for the integrated circuit provided by the embodiment of the present application. As Figure 5 shown, the method further includes:

[0069] Place the test sample on the carrier table of the test preparation device for the integrated circuit;

[0070] Input a preparation instruction to the control module through the human-machine interaction module. The preparation instruction at least includes the type of the test sample of the test sample;

[0071] According to the preparation instruction, control the drive module to act, so that the drive module drives the positioning and adapting module to determine the outer shape parameters of the test sample according to the type of the test sample, match the positioning and adapting module with the lead-out terminal pattern, record the coordinates, and print the lead-out terminal pattern on the substrate;

[0072] Lock the test sample according to the outer shape parameters of the test sample. After the locking is completed, perform the preparation before welding on the test sample.

[0073] Specifically, the schematic flow chart of the test preparation method for the integrated circuit provided by the embodiment of the present application includes:

[0074] Step 1: Obtain the outer dimensions of the integrated circuit;

[0075] Step 2: Input parameters to the PLC through the HMI, and the integrated circuit adapting device adjusts its structure according to the parameters;

[0076] Step 3: Place the integrated circuit into the integrated circuit adapting device;

[0077] Step 4: The integrated circuit adapting device matches with the lead-out terminal pattern and records the coordinates;

[0078] Step 5: Print the lead-out terminal pattern on the substrate. The lead-out terminal pattern is a solder paste pattern that is the same size and arrangement as the lead-out terminals of the test integrated circuit.

[0079] Step 6: The PLC controls the automatic locking device to unlock.

[0080] Step 7: The carrier table and the integrated circuit adapter device move to the next work station.

[0081] Step 8: The automatic locking device locks the carrier table and the integrated circuit adapter device.

[0082] Step 9: The integrated circuit adapter device releases the integrated circuit.

[0083] Step 10: The carrier table moves to the next work station.

[0084] Step 11: Check whether the preparation meets the requirements through an electron microscope.

[0085] Specifically, in the embodiment of the present application, parameters are input to the PLC through the HMI according to the shapes of different types of test samples, and then the positioning and adaptation module matches the appropriate size according to the test samples, and automatically adjusts to complete the shape matching of the test samples. The carrier table, the automatic locking device, and the integrated circuit adapter device cooperate with each other, restricting the stencil to move only in the vertical direction of the substrate, thereby avoiding damage to the printed solder during the stencil removal process.

[0086] By adjusting the relative positions of the integrated circuit adapter device and the substrate, the leads of the integrated circuit are kept relatively fixed with respect to the printed opening pattern on the stencil and the position of the substrate, ensuring that the integrated circuit does not shift during placement, and making the leads and the solder printing pattern fully match. The preparation process is observed in real time through an electron microscope, and the prepared finished products are observed and judged.

[0087] The test preparation method provided by the embodiment of the present application, the device includes: a carrier table, a human-machine interaction module, a control module, a driving module, a positioning and adaptation module, and a positioning and locking module. Among them, the carrier table is used to place the test sample; the human-machine interaction module is used to input preparation instructions, where the preparation instructions at least include the type of the test sample of the test sample; the control module is used to control the driving module to act according to the preparation instructions; the driving module is used to drive the positioning and adaptation module to act according to the preparation instructions; the positioning and adaptation module is used to determine the shape parameters of the test sample according to the type of the test sample; the positioning and locking module is used to lock the test sample according to the shape parameters of the test sample, and after the locking is completed, the preparation before welding the test sample is carried out, which can quickly complete the solderability test preparation of ball grid array (BGA) and column grid array (CGA) packaged integrated circuits, and reduce the operation difficulty and improve the preparation success rate.

[0088] It should be noted that the above detailed description is exemplary and is intended to provide further illustration of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0089] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprising" and / or "including" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0090] It should be noted that the terms "first", "second", etc. in the description and claims of the present application and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that these terms can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0091] In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0092] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "above", etc. may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the figures. For example, if the device in the figure is inverted, the device described as "above" or "over" other devices or structures will then be positioned "below" or "beneath" other devices or structures. Thus, the exemplary term "above" can include both the orientation of "above" and "below". The device can also be positioned in other different ways, such as rotated 90 degrees or in other orientations, and the corresponding explanations for the spatial relative descriptions used herein will be made.

[0093] In the foregoing detailed description, reference has been made to the accompanying drawings, which form a part hereof. In the drawings, like numerals typically identify like components, unless the context indicates otherwise. The illustrated embodiments described in the detailed description, the drawings, and the claims are not meant to be limiting. Other embodiments may be used and other changes may be made without departing from the spirit or scope of the subject matter presented herein.

[0094] The foregoing is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, various modifications and variations can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An integrated circuit test preparation device, characterized in that: The device comprises: a carrier platform, a human-machine interaction module, a control module, a drive module, a positioning adaptation module and a positioning locking module, wherein: The carrier platform is used to place the tested sample; The human-computer interaction module is used to input a preparation instruction, wherein the preparation instruction at least includes a test sample type of the test sample; The control module is used to control the driving module to perform actions according to the preparation instructions; The driving module is used to drive the positioning adaptation module to act according to the preparation instruction; The positioning adaptation module is used to determine the shape parameters of the tested sample according to the type of the tested sample; The positioning and locking module is used to lock the tested sample according to the shape parameters of the tested sample, and after the locking is completed, the tested sample is prepared before welding.

2. The test preparation device for integrated circuit according to claim 1, characterized in that: The device also includes a collection module, which is used to judge the tested sample after the preparation before welding is completed.

3. The test preparation device for integrated circuit according to claim 2, characterized in that: The acquisition module is an electron microscope.

4. The test preparation device for integrated circuit according to claim 1, characterized in that: The human-computer interaction module is an HMI touch screen.

5. The test preparation device for integrated circuit according to claim 1, characterized in that: The positioning adaptation module includes: a fixed frame, a servo motor and an electromagnetic release unit; The fixed frame is used to fix the tested sample; The servo motor is located on the opposite side of the fixed frame and is used to adjust the size of the fixed frame; The electromagnetic release unit is used to lock and unlock various components.

6. The test preparation device for integrated circuit according to claim 5, characterized in that: The fixed frame is sequentially placed with a substrate, a sample to be tested and a screen from bottom to top.

7. The test preparation device for integrated circuit according to claim 1, characterized in that: The positioning and locking module comprises: a power generation component, an elastic component and a moving component, wherein the power generation component is located outside the elastic component, and the moving component is arranged on the top of the elastic component.

8. The test preparation device for integrated circuit according to claim 7, characterized in that: The power generation component is a coil, and the elastic component is a spring.

9. The test preparation device for integrated circuit according to claim 1, characterized in that: The control module is a PLC controller, and the control module is used to turn on and off the power under different conditions to control the unlocking and locking of the positioning adapter module and the positioning locking module.

10. A test preparation method, characterized in that: The method applied to the test preparation device of the integrated circuit as claimed in any one of claims 1 to 9 comprises: Placing the test sample on a carrier of the test preparation device for the integrated circuit; Inputting a preparation instruction to the control module through the human-computer interaction module, wherein the preparation instruction at least includes the test sample type of the test sample; According to the preparation instruction, the driving module is controlled to act so that the driving module drives the positioning adapter module to determine the shape parameters of the tested sample according to the type of the tested sample, matches the positioning adapter module with the lead-out terminal pattern, records the coordinates, and prints the lead-out terminal pattern on the substrate; The tested sample is locked according to the appearance parameters of the tested sample, and after the locking is completed, the tested sample is prepared before welding.

Images