Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus capable of improving cooling performance. The substrate processing apparatus includes: a processing container; a mounting table which is provided inside the processing container, has a first contact surface, and is configured so as to be rotatable; a refrigeration device having a second contact surface and configured to be liftable; a rotating device that rotates the mounting table; and a lifting device that lifts and lowers the refrigeration device and can thermally connect and disconnect the second contact surface and the first contact surface, the refrigeration device comprising: a refrigerator; and a cold transfer member, one end of which is thermally connected to the refrigerator and the other end of which has the second contact surface, the volume of the cold transfer member being larger than the volume of the mounting table.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus. Background Art

[0002] Patent Document 1 discloses a holding device that cools an object to be processed in a vacuum chamber and rotatably holds the object to be processed. The holding device is characterized by including: a stage on which the object to be processed is placed; a rotation driving member that supports the stage so as to be rotatable; and a cooling member that cools the stage. The stage surface on which the object to be processed is placed is set as the upper surface. The rotation driving member includes: a cylindrical rotating shaft body that is installed through the wall surface of the vacuum chamber via a first vacuum seal; a connecting member that connects the upper end portion of the rotating shaft body to the lower surface of the stage so as to define a space below the stage; and a driving motor that drives the rotating shaft body to rotate. The cooling member includes: a cooling plate that is disposed in the space below the stage so as to face the lower surface of the stage with a gap therebetween; a heat transfer shaft body that is inserted into the rotating shaft body and abuts against the lower surface of the cooling plate; and a refrigerator that cools the heat transfer shaft body.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Publication No. 6559347 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] One aspect of the present disclosure provides a substrate processing apparatus with improved cooling performance.

[0008] Solutions to the Problems

[0009] According to one aspect of the present disclosure, there is provided a substrate processing apparatus including: a processing container; a stage disposed in the processing container, having a first contact surface and configured to be rotatable; a refrigeration device having a second contact surface and configured to be movable up and down; a rotation device that rotates the stage; and a lifting device that moves the refrigeration device up and down, capable of thermally connecting and separating the second contact surface from the first contact surface. The refrigeration device includes: a refrigerator; and a heat transfer member having one end thermally connected to the refrigerator and having the second contact surface at the other end, the volume of the heat transfer member being larger than the volume of the stage.

[0010] Effects of the Invention

[0011] According to one aspect of the present disclosure, it is possible to provide a substrate processing apparatus with improved cooling performance. Brief Description of the Drawings

[0012] Figure 1 This is a cross-sectional view showing an example of the structure when the stage of the substrate processing apparatus according to one embodiment rotates.

[0013] Figure 2 This is a partially enlarged cross-sectional view showing an example of the structure when the stage rotates and is cooled.

[0014] Figure 3 This is an example of a perspective view of the stage.

[0015] Figure 4 This is an example of a schematic diagram illustrating the power supply structure for supplying power to the holding disk electrode.

[0016] Figure 5 This is an example of a schematic cross-sectional view of the electrode introduction portion.

[0017] Explanation of Reference Numerals

[0018] W, substrate; 1, substrate processing apparatus; 10, processing container; 10S, internal space; 20, stage; 21, electrostatic holding disk; 21a, holding disk electrode; 21b, electrode introduction portion; 21s, first contact surface; 22, shielding member; 30, refrigeration device; 31, refrigerator; 32, refrigeration heat medium; 32a, head portion; 32b, rod portion; 32s, second contact surface; 40, rotation device; 49, bracket; 50, lifting device; 60, slip ring; 63, wiring; 631, power supply line; 631a, conductive wire; 631b, insulating tube; 631c, terminal portion; 71, first reflection member; 71a, cylindrical portion; 71b, annular portion; 71c, cylindrical portion; 72, second reflection member; 73, heat insulating member; 74, heat insulating member; 80, control device; 81, temperature sensor; 82, temperature sensor. Detailed Embodiment

[0019] Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are assigned to the same structural parts, and there are cases where repeated explanations are omitted.

[0020] In this specification, directions such as parallel, right angle, orthogonal, horizontal, vertical, up and down, left and right, etc. allow deviations to the extent that the effects of the embodiments are not impaired. The shape of the corners is not limited to a right angle and may be rounded in an arcuate shape. Parallel, right angle, orthogonal, horizontal, vertical, circle, coincidence may also include substantially parallel, substantially right angle, substantially orthogonal, substantially horizontal, substantially vertical, substantially circle, substantially coincidence.

[0021] [Substrate Processing Apparatus]

[0022] Use Figure 1and Figure 2 An example of a substrate processing apparatus 1 according to an embodiment is described. Figure 1 It is a cross-sectional view showing a structure of an example when the stage 20 of the substrate processing apparatus 1 according to an embodiment rotates. Figure 2 It is a partially enlarged cross-sectional view showing a structure of an example when the stage 20 rotates and is cooled. Figure 2 (a) thereof shows a case when the stage 20 rotates. Figure 2 (b) thereof shows a case when the stage 20 is cooled.

[0023] In addition, the substrate processing apparatus 1 can be, for example, a CVD (Chemical Vapor Deposition) apparatus, an ALD (Atomic Layer Deposition) apparatus that supplies a processing gas into the processing container 10 to perform a desired process (such as a film forming process, etc.) on the substrate W. Alternatively, it can be a PE-CVD (Plasma-Enhanced Chemical Vapor Deposition) apparatus, a PE-ALD (Plasma-Enhanced Atomic Layer Deposition) apparatus that generates a plasma of a processing gas in the processing container 10 to perform a desired process on the substrate W. Further, the substrate processing apparatus 1 can be, for example, a PVD apparatus that supplies a processing gas into the processing container 10 and sputters a target provided in the processing container 10 to apply a desired process (such as a film forming process, etc.) to the substrate W.

[0024] The substrate processing apparatus 1 includes a processing container 10, a stage 20 for placing the substrate W inside the processing container 10, a refrigeration device 30, a rotation device 40 for rotating the stage 20, and a lifting device 50 for lifting the refrigeration device 30. A stage 20 for placing the substrate W is provided inside the processing container 10. In addition, the substrate processing apparatus 1 includes a control device 80 for controlling various devices such as the refrigeration device 30, the rotation device 40, and the lifting device 50.

[0025] The processing container 10 forms an internal space 10S. The processing container 10 is configured to reduce the pressure of its internal space 10S to an ultra-high vacuum by operating an exhaust device (not shown) such as a vacuum pump. In addition, the processing container 10 is configured to supply a desired gas for substrate processing via a gas supply pipe (not shown) communicating with a processing gas supply device (not shown).

[0026] The mounting stage 20 is formed of a material with relatively high thermal conductivity (e.g., Cu). The mounting stage 20 includes an electrostatic chucking plate 21. The electrostatic chucking plate 21 has a chucking plate electrode 21a embedded in a dielectric film. The substrate processing apparatus 1 includes a slip ring 60 for supplying power to the chucking plate electrode 21a of the rotating mounting stage 20. A predetermined potential is applied to the chucking plate electrode 21a via the slip ring 60 and the wiring 63. With this structure, the substrate W can be adsorbed and held on the mounting surface by the electrostatic chucking plate 21, and the substrate W can be fixed to the upper surface (mounting surface) of the mounting stage 20. In addition, the mounting stage 20 has a first contact surface 21s (see Figure 2 ) that abuts against the cryogenic heat medium 32 on the surface (lower surface) opposite to the mounting surface (upper surface) on which the substrate W is mounted. The first contact surface 21s is, for example, a flat surface.

[0027] In addition, a shielding member 22 is provided on the radially outer side of the electrostatic chucking plate 21. The shielding member 22 is used to prevent film adhesion to the rotating device 40 and the like when film formation processing or the like is performed on the substrate W mounted on the mounting stage 20. The shielding member 22 is a ring-shaped member and is supported on the electrostatic chucking plate 21 via an adiabatic member 74 described later. That is, the shielding member 22 rotates together with the mounting stage 20 by the rotating device 40.

[0028] Here, the shielding member 22 is formed in a structure that covers the rotating device 40 and the like below the mounting stage 20 with respect to the processing gas and the plasma of the processing gas. Or, the shielding member 22 is formed in a structure that covers the rotating device 40 and the like below the mounting stage 20 from the perspective of the target that releases sputtering particles. Therefore, the surface area of the shielding member 22 is formed to be relatively large, and the temperature is likely to rise due to radiant heat input from the target, the side wall of the processing chamber 10, and the like.

[0029] An adiabatic member 74 is provided between the mounting stage 20 (electrostatic chucking plate 21) and the shielding member 22. The adiabatic member 74 can be made of a resin material with a relatively low thermal conductivity (e.g., PTFE: polytetrafluoroethylene, etc.). Thereby, the heat input from the shielding member 22 to the mounting stage 20 is suppressed, and the cooling performance of the mounting stage 20 can be improved.

[0030] In addition, the case where the adiabatic member 74 is provided between the mounting stage 20 (electrostatic chucking plate 21) and the shielding member 22 has been described, but it is not limited thereto. There may also be an adiabatic structure between the mounting stage 20 (electrostatic chucking plate 21) and the shielding member 22 that suppresses heat conduction between the mounting stage 20 and the shielding member 22. For example, it may be a structure in which the mounting stage 20 and the shielding member 22 are set to point contact using pins instead of surface contact, thereby reducing the contact area and suppressing heat conduction.

[0031] The cooling device 30 is configured to be able to contact and separate from the lower part of the mounting table 20, and is used to cool the mounting table 20 (electrostatic chuck 21). The cooling device 30 is constituted by stacking a cooler 31 and a cooling heat medium 32. In addition, the cooling heat medium 32 can also be referred to as a heat transfer member. The cooler 31 holds the cooling heat medium 32 and cools the upper surface of the cooling heat medium 32 to an extremely low temperature. From the viewpoint of cooling capacity, the cooler 31 is preferably of the GM (Gifford-McMahon) cycle type. One end (lower side) of the cooling heat medium 32 is fixed on and thermally connected to the cooler 31, and the upper part of the cooling heat medium 32 is accommodated inside the processing container 10. At the other end (upper side) of the cooling heat medium 32, there is a second contact surface 32s. The cooling heat medium 32 is formed of a material with relatively high thermal conductivity (such as Cu), and its outer shape is substantially cylindrical. The cooling heat medium 32 is arranged such that its center coincides with the central axis CL of the mounting table 20.

[0032] The cooling heat medium 32 has a head portion 32a and a rod portion 32b. The head portion 32a is a portion having a second contact surface 32s (see Figure 2 ) that abuts against the first contact surface 21s of the mounting table 20, and is a portion that expands radially more than the rod portion 32b. The rod portion 32b is a portion that thermally connects the head portion 32a to the cooler 31.

[0033] Here, the mounting table 20 and the cooling heat medium 32 are formed of a material with relatively high thermal conductivity (such as Cu). The volume of the cooling heat medium 32 is preferably larger than the volume of the mounting table 20. In addition, the heat capacity of the cooling heat medium 32 is preferably larger than the heat capacity of the mounting table 20. Thereby, it is possible to ensure that the cooling heat medium 32 has a relatively large heat capacity, and suppress the temperature change of the cooling heat medium 32 caused by the input of radiant heat from the side wall of the processing container 10 etc. and the heat transfer from the mounting table 20 to the cooling heat medium 32 when they are in contact.

[0034] In addition, the volume of the head portion 32a of the cooling heat medium 32 is preferably larger than the volume of the rod portion 32b of the cooling heat medium 32. In addition, the heat capacity of the head portion 32a of the cooling heat medium 32 is preferably larger than the heat capacity of the rod portion 32b of the cooling heat medium 32. Thereby, it is possible to ensure that the head portion 32a of the cooling heat medium 32 in contact with the mounting table 20 has a relatively large heat capacity, and suppress the temperature change of the cooling heat medium 32 caused by the input of radiant heat from the side wall of the processing container 10 etc. and the heat transfer from the mounting table 20 to the cooling heat medium 32 when they are in contact.

[0035] In addition, the volume of the head 32a of the cryogenic heat medium 32 is preferably larger than the volume of the mounting table 20. In addition, the heat capacity of the head 32a of the cryogenic heat medium 32 is preferably larger than the heat capacity of the mounting table 20. Thereby, it is possible to ensure that the heat capacity of the head 32a of the cryogenic heat medium 32 in contact with the mounting table 20 is large, and suppress the temperature change of the cryogenic heat medium 32 caused by the input of radiant heat from the side wall of the processing container 10 or the like and the heat transfer from the mounting table 20 to the cryogenic heat medium 32 when in contact with the mounting table 20.

[0036] A first reflecting member 71 is provided around the cryogenic heat medium 32. The first reflecting member 71 reflects the radiant heat from the side wall of the processing container 10 or the like and prevents the radiant heat from being input to the cryogenic heat medium 32. The first reflecting member 71 is made of a metallic material such as stainless steel (SUS) or aluminum. The surface of the first reflecting member 71 is subjected to a mirror finish to reflect the radiant heat from the side wall of the processing container 10 or the like. In addition, a plating treatment (for example, gold plating treatment, nickel plating treatment, etc.) may be performed on the surface of the first reflecting member 71. In addition, a plating treatment (for example, nickel plating treatment, etc.) is performed on the surfaces of the refrigerator 31 and the cryogenic heat medium 32 to reflect the radiant heat. Thereby, the temperature rise of the cryogenic heat medium 32 due to the radiant heat is suppressed, and the cooling performance of the mounting table 20 is improved.

[0037] The first reflecting member 71 has a cylindrical portion 71a covering the side of the refrigerator 31 and the rod portion 32b, a ring portion 71b covering the lower side of the head 32a, and a cylindrical portion 71c covering the side of the head 32a. In addition, the ring portion 71b may be connected to the cylindrical portion 71a on the inner diameter side and to the cylindrical portion 71c on the outer diameter side. In addition, the cylindrical portion 71a, the ring portion 71b, and the cylindrical portion 71c may each be configured as an independent component.

[0038] In addition, the first reflecting member 71 may be fixed to the processing container 10, or may be supported by a refrigerator support portion 53 or the like so as to be lifted and lowered together with the refrigerator device 30 by a lifting device 50.

[0039] In addition, the mounting table 20 is supported by a rotating device 40 so as to be rotatable. The rotating device 40 includes a rotation driving device 41, a fixed shaft 45, a rotating shaft 44, a housing 46, magnetic fluid seals 47, 48, and a bracket 49.

[0040] The rotation driving device 41 is a direct drive motor having a rotor 42 and a stator 43. The rotor 42 has a substantially cylindrical shape extending coaxially with the rotating shaft 44 and is fixed to the rotating shaft 44. The stator 43 has a substantially cylindrical shape with an inner diameter larger than the outer diameter of the rotor 42. The rotation driving device 41 may be a method other than a direct drive motor, or may be a method including a servo motor and a conveyor belt.

[0041] The rotating shaft 44 has a substantially cylindrical shape that extends coaxially with the central axis CL of the mounting table 20. A fixed shaft 45 is provided inside the rotating shaft 44 in the radial direction. The fixed shaft 45 has a substantially cylindrical shape that extends coaxially with the central axis CL of the mounting table 20. A housing 46 is provided outside the rotating shaft 44 in the radial direction. The housing 46 has a substantially cylindrical shape that extends coaxially with the central axis CL of the mounting table 20 and is fixed to the processing container 10.

[0042] In addition, a magnetic fluid seal 47 is provided between the outer peripheral surface of the fixed shaft 45 and the inner peripheral circle of the rotating shaft 44. The magnetic fluid seal 47 supports the rotating shaft 44 so as to be rotatable relative to the fixed shaft 45, and seals between the outer peripheral surface of the fixed shaft 45 and the inner peripheral circle of the rotating shaft 44, thereby separating the internal space 10S of the processing container 10 that can be decompressed from the external space of the processing container 10. In addition, a magnetic fluid seal 48 is provided between the inner peripheral surface of the housing 46 and the outer peripheral circle of the rotating shaft 44. The magnetic fluid seal 48 supports the rotating shaft 44 so as to be rotatable relative to the housing 46, and seals between the inner peripheral surface of the housing 46 and the outer peripheral circle of the rotating shaft 44, thereby separating the internal space 10S of the processing container 10 that can be decompressed from the external space of the processing container 10. Thus, the rotating shaft 44 is supported by the fixed shaft 45 and the housing 46 so as to be rotatable. In addition, a cooling heat medium 32 penetrates inside the fixed shaft 45 in the radial direction. Further, a substantially cylindrical first reflecting member 71 (cylindrical portion 71a) is disposed between the fixed shaft 45 and the cooling heat medium 32.

[0043] A bracket 49 is provided between the rotating shaft 44 and the mounting table 20 in the vertical direction, and is configured to transmit the rotation of the rotating shaft 44 to the mounting table 20.

[0044] In addition, a heat insulating member 73 is provided between the mounting table 20 (electrostatic chucking disk 21) and the bracket 49. The heat insulating member 73 can use a resin material with a low thermal conductivity (such as PTFE, etc.). Thereby, the heat input from the bracket 49 to the mounting table 20 is suppressed, and the cooling performance of the mounting table 20 can be improved.

[0045] In addition, the case where the heat insulating member 73 is provided between the mounting table 20 (electrostatic chucking disk 21) and the bracket 49 has been described, but it is not limited thereto. There may also be a heat insulating structure between the mounting table 20 (electrostatic chucking disk 21) and the bracket 49 that suppresses heat conduction between the mounting table 20 and the bracket 49. For example, it may be a structure in which the mounting table 20 and the bracket 49 are set to be in point contact using pins instead of surface contact, thereby reducing the contact area and suppressing heat conduction.

[0046] On the inner peripheral side of the support 49, a substantially cylindrical second reflecting member 72 is provided. The second reflecting member 72 reflects radiant heat from the side wall of the processing container 10 or the like, and prevents the radiant heat from being input into the refrigerating heat medium 32. In particular, the upper surface of the head 32a of the refrigerating heat medium 32 becomes the second contact surface 32s that abuts against the mounting table 20 and is not covered by the first reflecting member 71. The second reflecting member 72 prevents radiant heat from the side wall of the processing container 10 or the like from being incident on the second contact surface 32s of the refrigerating heat medium 32. In addition, the second reflecting member 72 suppresses the input of radiant heat from the lower surface side of the mounting table 20. The second reflecting member 72 is made of a metallic material such as stainless steel (SUS) or aluminum. The surface of the second reflecting member 72 is subjected to a mirror finish. In addition, the surface of the second reflecting member 72 may be subjected to a plating treatment (for example, gold plating treatment, nickel plating treatment, etc.). Thereby, the temperature rise of the refrigerating heat medium 32 caused by radiant heat is suppressed, and the cooling performance of the mounting table 20 is improved.

[0047] In addition, the second reflecting member 72 may be fixed to the mounting table 20 and / or the support 49 and supported to rotate together with the mounting table 20 by the rotating device 40. In addition, as Figure 1 shown, the diameter of the second reflecting member 72 may be larger than the diameter of the cylindrical portion 71c of the first reflecting member 71, and at least a part of the first reflecting member 71 may enter the cylindrical second reflecting member 72.

[0048] With the above structure, when the rotor 42 of the rotation driving device 41 rotates, the rotating shaft 44, the support 49, and the mounting table 20 rotate relative to the refrigerating heat medium 32 in the X1 direction (refer to Figure 1 ).

[0049] In addition, the refrigerating device 30 is supported by a lifting device 50 so as to be liftable. The lifting device 50 includes a cylinder 51, a link mechanism 52, a refrigerating device support portion 53, a linear guide 54, a fixing portion 55, and a bellows 56.

[0050] The cylinder 51 is a mechanical device that uses air pressure to make the rod move linearly. The link mechanism 52 converts the linear motion of the rod of the cylinder 51 into the lifting motion of the refrigerating device support portion 53. In addition, the link mechanism 52 has a lever structure with one end connected to the cylinder 51 and the other end connected to the refrigerating device support portion 53. Thereby, a large pushing force can be generated with a small thrust of the cylinder 51. The refrigerating device support portion 53 supports the refrigerating device 30 (the refrigerator 31, the refrigerating heat medium 32). In addition, the moving direction of the refrigerating device support portion 53 is guided by the linear guide 54 in the lifting direction.

[0051] The fixing part 55 is fixed to the lower surface of the fixing shaft 45. A substantially cylindrical bellows 56 surrounding the refrigerator 31 is provided between the lower surface of the fixing part 55 and the upper surface of the refrigerator device support part 53. The bellows 56 is a metal bellows structure body that can expand and contract freely in the vertical direction. Thus, the fixing part 55, the bellows 56, and the refrigerator device support part 53 seal between the inner peripheral surface of the fixing shaft 45 and the outer circumference of the refrigeration heat medium 32, separating the internal space 10S of the pressure-reducing and freely processable container 10 from the external space of the process container 10. In addition, the lower surface side of the refrigerator device support part 53 is adjacent to the external space of the process container 10, and the area surrounded by the bellows 56 in the upper surface side of the refrigerator device support part 53 is adjacent to the internal space 10S of the process container 10.

[0052] The substrate processing apparatus 1 has a slip ring 60 made of metal below the rotating shaft 44 and the housing 46 to supply a DC voltage (DC voltage, direct current voltage) to the holding disk electrode 21a.

[0053] The slip ring 60 has a rotating body 61 including a metal ring and a fixed body 62 including a brush. The rotating body 61 has a substantially cylindrical shape extending coaxially with the rotating shaft 44 and is fixed to the lower surface of the rotating shaft 44. The fixed body 62 has a substantially cylindrical shape with an inner diameter slightly larger than the outer diameter of the rotating body 61 and is fixed to the lower surface of the housing 46. The slip ring 60 is electrically connected to a DC power supply (not shown), and supplies the power supplied from the DC power supply to the wiring 63 via the brush of the fixed body 62 and the metal ring of the rotating body 61. With this structure, torsions or the like are not generated in the wiring 63, and a potential can be imparted to the holding disk electrode 21a from the DC power supply. In addition, the structure of the slip ring 60 may also be a structure other than the brush structure, for example, a non-contact power supply structure, a structure having components with a mercury-free specification, or a structure of a conductive liquid.

[0054] An upper part of the processing container 10 has a cathode part (not shown) configured to be disposed opposite to the mounting table 20 and sputter a plurality of targets. The power supply connected to the cathode part may be either a DC (direct current) power supply or an RF (high frequency) power supply, or both a DC power supply and an RF power supply, but is not limited thereto. At least either a DC voltage or an RF voltage can be applied to the cathode part from the DC power supply and / or the high frequency power supply.

[0055] The control device 80 is a computer, for example, and includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device, and controls the operation of the substrate processing device 1. The control device 80 can control the substrate processing device 1 by means of wired or wireless communication or the like.

[0056] When performing a desired process on the substrate W, as Figure 1 , Figure 2 shown in (a) of, the control device 80 controls the lifting device 50 (cylinder 51) to separate the mounting table 20 from the cryogenic heat medium 32, and controls the rotating device 40 (rotary drive device 41) to rotate the mounting table 20 on which the substrate W is mounted. In addition, the shielding member 22 and the second reflecting member 72 also rotate together with the mounting table 20. Thereby, the in-plane uniformity of the substrate processing (e.g., film forming process, etc.) of the substrate W can be improved.

[0057] In addition, when cooling the mounting table 20 and the substrate W mounted on the mounting table 20, as Figure 2 shown in (b) of, the control device 80 stops the rotating device 40 (rotary drive device 41) to stop the rotation of the mounting table 20, and controls the lifting device 50 (cylinder 51) to thermally connect the mounting table 20 to the cryogenic heat medium 32. Thereby, the substrate W mounted on the mounting table 20 can be cooled.

[0058] [Control of Refrigerator]

[0059] Next, Figure 2 the control of the refrigerator 31 will be described. In addition, in the following description, the case where the control device 80 controls the refrigerator 31 is described, but it is not limited thereto. It may also be configured such that a controller (not shown) for controlling the refrigerator 31 is provided in the refrigerator 31.

[0060] As Figure 2 shown in (a) of and Figure 2 shown in (b) of, a temperature sensor 81 is provided at the head 32a of the cryogenic heat medium 32. In addition, a temperature sensor 82 is provided on the mounting table 20. The temperature sensor 81 is connected to the control device 80 in a manner capable of wired communication. The temperature sensor 82 is connected to the control device 80 in a manner capable of wireless communication. In addition, the temperature sensor 82 may also be connected to the control device 80 via the slip ring 60.

[0061] As Figure 2As shown in (a) of [], when the mounting table 20 rotates, the mounting table 20 is separated from the refrigerating heat medium 32. The control device 80 performs feedback control on the refrigerator 31 in such a way that the temperature of the head 32a of the refrigerating heat medium 32 detected by the temperature sensor 81 becomes a specified target temperature. For example, the value obtained by subtracting a specified temperature from the target temperature T of the mounting table 20 is set as the target temperature T of the head 32a 20 (e.g., T 32a = T 32a − 3 [°C]). The control device 80 performs feedback control on the refrigerator 31 based on the detected temperature T of the temperature sensor 81 20 and the target temperature T of the head 32a 81 . In addition, the control device 80 monitors the temperature of the mounting table 20 detected by the temperature sensor 82. 32a

[0062] As Figure 2 shown in (b) of [], when the mounting table 20 is cooled, the mounting table 20 abuts against the refrigerating heat medium 32. The control device 80 performs feedback control on the refrigerator 31 in such a way that the temperature of the mounting table 20 detected by the temperature sensor 82 becomes a specified target temperature. For example, the control device 80 sets the target temperature T of the head 32a based on the detected temperature T of the temperature sensor 82 82 and the target temperature T of the mounting table 20 20 . Then, the control device 80 performs feedback control on the refrigerator 31 based on the detected temperature T of the temperature sensor 81 32a and the target temperature T of the head 32a 81 . 32a

[0063] In this way, by disposing the temperature sensor 81 at a position close to the mounting table 20 and at the head 32a of the refrigerating heat medium 32 that is in thermal contact with the mounting table 20 during cooling, the refrigerator 31 can quickly respond to the temperature change of the head 32a. Thereby, the temperature of the mounting table 20 can be well controlled. In addition, since the head 32a is not a part that rotates together with the mounting table 20, the control device 80 and the temperature sensor 81 can be connected in a wired manner. Thereby, temperature detection can be performed with high precision.

[0064] [Power supply structure for supplying power to the holding disk electrode]

[0065] Next, Figures 3 to 5 a power supply structure for supplying power to the holding disk electrode 21a will be described. Figure 3 is an example of a perspective view of the mounting table 20. Figure 4 is an example of a schematic diagram for explaining the power supply structure for supplying power to the holding disk electrode 21a. Figure 5 is an example of a cross-sectional schematic diagram of the electrode introduction portion 21b.​​

[0066] As Figure 3 shown, the mounting table 20 has an electrode introduction portion 21b for introducing electric power into the holding disk electrode 21a. Here, the electrode introduction portion 21b is provided on the side surface of the mounting table 20.

[0067] As Figure 4 shown, a power supply line 631 extending from the wiring 63 is connected to the electrode introduction portion 21b. With such a structure, it is possible to ensure a relatively large contact area between the first contact surface 21s of the mounting table 20 and the second contact surface 32s of the cryogenic heat medium 32 (the head 32a). That is, in the contact region where the first contact surface 21s and the second contact surface 32s are in contact, there is no portion where the first contact surface 21s and the second contact surface 32s are not in contact inside, and the first contact surface 21s and the second contact surface 32s can be in surface contact over the entire surface. Thereby, the first contact surface 21s of the mounting table 20 and the second contact surface 32s of the cryogenic heat medium 32 are in thermal contact, and the cooling performance during cooling of the mounting table 20 can be improved.

[0068] In addition, as Figure 5 shown, the power supply line 631 has a conductive wire 631a, an insulating tube 631b covering the conductive wire 631a, and a terminal portion 631c. The conductive wire 631a is made of a metal material such as SUS. The insulating tube 631b is made of an insulating material such as PTFE. The terminal portion 631c is provided at one end of the conductive wire 631a and is electrically connected to the conductive wire 631a. In addition, the other end of the power supply line 631 is connected to the wiring 63 and is connected to a power source (not shown) via a slip ring 60.

[0069] The electrode introduction portion 21b has a conductive portion 21b1, an insulating cover 21b2, a fastening bolt 21b3, and an insulating cover 21b4. The conductive portion 21b1 is composed of a conductive member and is in conduction with the holding disk electrode 21a (refer to Figure 4 ). In addition, a concave portion is formed in the conductive portion 21b1, and an internal thread for screwing with the fastening bolt 21b3 is formed in the concave portion. The insulating cover 21b2 is made of an insulating material such as PEEK (polyetheretherketone) and covers the conductive portion 21b1. In addition, a hole portion through which the fastening bolt 21b3 passes is provided in the insulating cover 21b2. The fastening bolt 21b3 is composed of a conductive member and is electrically connected to the terminal portion 631c of the power supply line 631. Thus, the conductive wire 631a of the power supply line 631 is electrically connected to the holding disk electrode 21a via the terminal portion 631c, the fastening bolt 21b3, and the conductive portion 21b1. The insulating cover 21b4 is made of an insulating material such as PEEK and covers the terminal portion 631c and the fastening bolt 21b3.

[0070] In this way, the conductive members (conductive portion 21b1, fastening bolt 21b3) of the electrode introduction portion 21b and the terminal portion 631c of the power supply line 631 are covered by insulating members (insulating cover 21b2, insulating cover 21b4). Thereby, when plasma is generated in the internal space 10S to perform plasma processing on the substrate W, abnormal discharge is prevented from occurring in the conductive members of the electrode introduction portion 21b.

[0071] As described above, the substrate processing apparatus 1 has been described. However, the present disclosure is not limited to the above-described embodiments and the like, and various modifications, improvements, and the like can be made within the scope of the gist of the present disclosure described in the claims.

Claims

1. A substrate processing device, wherein: The substrate processing device comprises: Handling containers; A mounting table, which is disposed in the processing container, has a first contact surface, and is configured to be rotatable; A refrigeration device having a second contact surface and configured to be able to be raised and lowered; a rotating device that rotates the mounting table; and a lifting device that lifts and lowers the refrigeration device so as to thermally connect and separate the second contact surface from the first contact surface, The refrigeration device comprises: Freezer; as well as A cold transfer member, one end of which is thermally connected to the refrigerator and the other end of which has the second contact surface. The volume of the cold transfer member is greater than the volume of the mounting platform.

2. The substrate processing apparatus according to claim 1, wherein: The cold transfer member has a head and a rod, the head having the second contact surface, and the rod thermally connecting the head to the refrigerator. The volume of the head portion of the cold transfer member is greater than the volume of the rod portion of the cold transfer member.

3. The substrate processing apparatus according to claim 1, wherein: The cold transfer member has a head and a rod, the head having the second contact surface, and the rod thermally connecting the head to the refrigerator. The volume of the head of the cold transfer member is greater than the volume of the mounting table.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The first contact surface and the second contact surface are flat surfaces.

5. The substrate processing apparatus according to claim 4, wherein: In the contact region where the first contact surface and the second contact surface are in contact, there is no portion inside where the first contact surface and the second contact surface are not in contact, and the first contact surface and the second contact surface are in contact with each other over the entire surface.

6. The substrate processing apparatus according to claim 4, wherein: The mounting table has an electrostatic holding disk, the electrostatic holding disk having a holding disk electrode and an electrode introduction portion for introducing power to the holding disk electrode. The electrode introduction portion is provided on a side surface of the mounting table.

7. The substrate processing apparatus according to claim 6, wherein: The substrate processing device is a substrate processing device that generates plasma in the processing container to process the substrate. The conductive member of the electrode introduction portion is covered with an insulating member.

8. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The substrate processing apparatus further includes a reflecting member that reflects the radiant heat incident on the cold transfer member.

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