Magnetic type pressing device for thin sheet of coating equipment

Abstract

The invention relates to a magnetic type pressing device for a thin sheet of coating equipment, which comprises at least one sheet pressing device, and the sheet pressing device comprises a rotating element; the pressing needle assembly comprises a main body part, the front part of the main body part is provided with a pressing needle used for pressing and releasing the sheet, and the rear part of the main body part is fixedly connected with the rotating element; the first magnetic element is fixedly installed above the main body part, the first magnetic element is attracted by magnetic force below the main body part to enable the pressing needle assembly to be in a closed state, and the first magnetic element is repelled by magnetic force outside the magnetic attraction type pressing device to enable the pressing needle assembly to be in an open state. The magnetic type pressing device not only meets the pressing requirements of vertical type coating equipment sheets, but also meets the pressing requirements of horizontal type coating equipment sheets and coating equipment sheets at other angles.

Description

Technical Field

[0001] The present invention belongs to the technical field of coating equipment, and more specifically, relates to a magnetic suction type pressing device for a thin sheet of coating equipment. Background Art

[0002] Crystalline silicon cells, as a photovoltaic cell carefully made of high-purity silicon materials, have the core function of efficiently converting abundant solar energy into electrical energy. This feature makes them widely used in solar power generation systems and various photovoltaic products. With the continuous innovation and progress of crystalline silicon cell technology, the entire industry is moving steadily towards large size and thinness. This transformation has not only promoted the rapid development of intelligent manufacturing and automated production, but also significantly improved production efficiency.

[0003] However, the trend towards larger size and thinner wafers also brings a series of challenges. As silicon wafers become more fragile, how to fix them firmly and reduce interference has become a problem that needs to be solved urgently. In addition, the surface of the silicon wafer needs to be kept clean for film formation, and any scratches or covering on the surface may have an adverse effect on the performance of the final product. Therefore, reducing surface contact and covering becomes a crucial consideration when fixing silicon wafers.

[0004] At present, coating machines generally adopt a horizontal design, in which silicon wafers are arranged horizontally in silicon wafer slots and limited by gravity. However, this design will cause a significant problem during the coating process: the silicon powder generated during coating can easily fall onto the silicon wafer, which has a negative impact on the film formation of the silicon wafer, thereby reducing the conversion efficiency of the silicon wafer. In order to solve this problem, the silicon wafer slot of the horizontal coating machine needs to adopt a hollow design, retaining only supports on all sides to reduce contact with the silicon wafer, but this design is prone to cause another problem: thin silicon wafers are prone to warping or even detaching from the silicon wafer slot in the absence of sufficient support. What's more tricky is that the method of limiting silicon wafers solely by gravity cannot be applied to vertical coating machines.

[0005] Therefore, it is urgent to design a thin film pressing device that can overcome the above-mentioned defects. Summary of the invention

[0006] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a magnetic suction clamping device for thin films of coating equipment, so as to solve the problem of clamping silicon wafers of vertical coating machines. The present invention provides a solution and idea for fixing and clamping ultra-thin, fragile, vertical silicon wafers, which has wide compatibility, that is, it can be compatible with the compression of silicon wafers of different sizes and thicknesses, and can be compatible with the compression of silicon wafers placed vertically, horizontally, and at other placement angles.

[0007] In order to solve the above technical problems or achieve the above objectives, the present invention adopts the following technical solutions:

[0008] According to an aspect of the present invention, there is provided a magnetic pressing device for a thin film of a coating device, including at least one pressing device, and the pressing device includes:

[0009] A rotating element;

[0010] A pressing needle assembly, the pressing needle assembly includes a main body part, a pressing needle for pressing and releasing the thin film is arranged at the front part of the main body part, and the rear part is fixedly connected with the rotating element;

[0011] A first magnetic element, the first magnetic element is fixedly installed above the main body part, and the pressing needle assembly is in a closed state by the magnetic attraction below the main body part, and the pressing needle assembly is in an open state by the magnetic repulsion outside the magnetic pressing device.

[0012] In an embodiment of the present invention, the magnetic pressing device further includes:

[0013] A base, an installation seat and a second magnetic element are arranged on the base, and two pressing devices are installed on the base. The directions of the pressing needles of the two pressing devices are opposite. Each pressing device is provided with a corresponding rotating element, and the rotating element is installed in the installation seat. The second magnetic element generates a magnetic attraction with the first magnetic element to make the pressing needle assembly in a closed state.

[0014] In an embodiment of the present invention, a third magnetic element is arranged outside the magnetic pressing device. The third magnetic element is arranged on a bottom plate, and a power source is connected below the bottom plate. The power source drives the bottom plate and the third magnetic element to move closer to and away from the magnetic pressing device. The third magnetic element generates a magnetic repulsion with the first magnetic element to make the pressing needle assembly in an open state.

[0015] In an embodiment of the present invention, the magnetic pressing device further includes:

[0016] A base, a second magnetic element is arranged on the base, and two pressing devices are installed on the base. The two pressing devices share a rotating element. The second magnetic element generates a magnetic attraction with the first magnetic element to make the pressing needle assembly in a closed state.

[0017] In an embodiment of the present invention, the magnetic pressing device includes two pressing devices. The rotating element includes a magnetic rotating element. The two pressing devices are fixedly installed on the magnetic rotating element. The directions of the pressing needles of the two pressing devices are opposite. The magnetic rotating element generates a magnetic attraction with the first magnetic element to make the pressing needle assembly in a closed state.

[0018] In an embodiment of the present invention, the magnetic adsorption pressing device includes two pressing sheet devices. The pressing needles of the two pressing sheet devices are in opposite directions. The two pressing sheet devices share a rotating element. A fourth magnetic element extends below the main body part of the pressing needle assembly. The fourth magnetic element generates a magnetic attraction with the first magnetic element to keep the pressing needle assembly in a closed state.

[0019] In an embodiment of the present invention, at least one magnetic adsorption pressing device is arranged on both the long side and the short side of the thin sheet. Each magnetic adsorption pressing device includes two pressing sheet devices with opposite pressing needle directions.

[0020] In an embodiment of the present invention, the magnetic adsorption pressing device is used in combination with a cylindrical pin. At least one magnetic adsorption pressing device is arranged on the long side of the thin sheet. Each magnetic adsorption pressing device includes two pressing sheet devices with opposite pressing needle directions, and the short side of the thin sheet is limited by a cylindrical pin.

[0021] In an embodiment of the present invention, the magnetic adsorption pressing device is used in combination with a cylindrical pin and a snap pin. One long side of the thin sheet is provided with a magnetic adsorption pressing device, the other long side is limited by a snap pin, and the short side of the thin sheet is limited by a cylindrical pin.

[0022] In an embodiment of the present invention, the magnetic adsorption pressing device presses the thin sheet of a vertical coating device, a horizontal coating device or a coating device at other angles.

[0023] The technical solution provided by the present invention has the following advantages compared with the prior art:

[0024] The magnetic adsorption pressing device of the present invention not only meets the pressing requirements of the thin sheet of the vertical coating device, but also meets the pressing requirements of the thin sheet of the horizontal coating device and the thin sheet of the coating device at other angles. The structural principle of the magnetic adsorption pressing device of the present invention is simple, with strong applicability and expandability, and can well meet thin sheets of different sizes and different arrangement methods. The magnetic adsorption pressing device of the present invention has a small covering area and a small contact area for the thin sheet. The magnetic adsorption pressing device of the present invention occupies a small space. The present invention has great compatibility with errors in the processing and installation of the thin sheet groove. The present invention can reduce the pollution of the thin sheet groove, thereby improving the coating conversion efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present invention, and are used together with the specification to explain the principles of the present invention.

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 The front view of the magnetic adsorption type pressing device structure of a thin film for a coating device provided by an embodiment of the present invention is shown;

[0028] Figure 2 Shown is Figure 1 the left view of the magnetic adsorption type pressing device structure of

[0029] Figure 3 Shown is Figure 1 the schematic diagram of the action principle structure of the magnetic adsorption type pressing device for pressing and releasing a silicon wafer;

[0030] Figure 4 Shown is the use of Figure 1 the schematic diagram of a layout structure of the magnetic adsorption type pressing device for pressing a silicon wafer;

[0031] Figure 5 Shown is the use of Figure 1 the schematic diagram of another layout structure of the magnetic adsorption type pressing device for pressing a silicon wafer;

[0032] Figure 6 Shown is the use of Figure 1 the schematic diagram of a layout structure of the magnetic adsorption type pressing device and a cylindrical pin for jointly pressing a silicon wafer;

[0033] Figure 7 Shown is the use of Figure 1 the schematic diagram of a layout structure of the magnetic adsorption type pressing device, cylindrical pin and snap pin for jointly pressing a silicon wafer;

[0034] Figure 8 Shown is Figure 7 the left view of the structure of the snap pin for pressing the silicon wafer used in

[0035] Figure 9 The front view of the magnetic adsorption type pressing device structure of a thin film for a coating device provided by another embodiment of the present invention is shown;

[0036] Figure 10 The front view of the magnetic adsorption type pressing device structure of a thin film for a coating device provided by still another embodiment of the present invention is shown;

[0037] Figure 11 The front view of the magnetic adsorption type pressing device structure of a thin film for a coating device provided by still another embodiment of the present invention is shown.

[0038] Among them, 1. The first magnetic element; 2. The rotating shaft seat; 3. The rotating shaft; 4. The second magnetic element; 5. The base; 6. The pressing needle; 7. The silicon wafer groove; 8. The third magnetic element; 9. The silicon wafer; 10. The bottom plate; 11. The power source; 12. The magnetic rotating shaft; 13. The long rotating shaft; 14. The fourth magnetic element; 15. The pressing device; 16. The pressing needle assembly; 17. The main body part; 18. The cylindrical pin; 19. The snap pin. Specific embodiments

[0039] In order to more clearly understand the above objects, features and advantages of the present invention, the embodiments of the present invention will be further described below. It should be noted that, without conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0040] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present invention, rather than all the embodiments.

[0041] As Figure 1-11 shown, the present invention provides a magnetic adsorption type pressing device for thin films of a coating device, including at least one pressing device 15, and the pressing device 15 includes:

[0042] A rotating element (for example, the rotating shaft 3, the long rotating shaft 13 or the magnetic rotating shaft 12);

[0043] A pressing needle assembly 16, the pressing needle assembly 16 includes a main body part 17, a pressing needle 6 for pressing and releasing the thin film is arranged at the front part of the main body part 17, and the rear part is fixedly connected with the rotating element (for example, the rotating shaft 3, the long rotating shaft 13 or the magnetic rotating shaft 12);

[0044] The first magnetic element 1, the first magnetic element 1 is fixedly installed above the main body part 17, and the pressing needle assembly 16 is in the closed state by the magnetic attraction below the main body part 17, and the pressing needle assembly 16 is in the open state by the magnetic repulsion outside the magnetic adsorption type pressing device.

[0045] The magnetic adsorption type pressing device of the present invention not only meets the pressing requirements of thin films of vertical coating devices, but also meets the pressing requirements of thin films of horizontal coating devices and thin films of coating devices at other angles. The structural principle of the magnetic adsorption type pressing device of the present invention is simple, has strong applicability and strong expansibility, and can well meet thin films of different sizes and different arrangement methods. The magnetic adsorption type pressing device of the present invention has a small covering area and a small contact area for the thin film, and the magnetic adsorption type pressing device of the present invention occupies a small space.

[0046] In the above embodiments of the present invention, as Figure 1-2As shown, the magnetic attraction pressing device further includes:

[0047] A base 5, on which a mounting seat (for example, a rotating shaft seat 2) and a second magnetic element 4 are provided, and two pressing devices 15 are mounted on the base 5. The needles 6 of the two pressing devices 15 are in opposite directions, and each pressing device 15 is respectively provided with a corresponding rotating element, for example, a rotating shaft 3. The rotating shaft 3 is mounted in the corresponding rotating shaft seat 2. The second magnetic element 4 generates a magnetic attraction with the first magnetic element 1 to keep the needle assembly 16 in a closed state. In the structure shown in this embodiment, the first magnetic element 1 can preferably but not limitedly be a high-temperature magnet, and the second magnetic element 4 can preferably but not limitedly be an electromagnet or a permanent magnet.

[0048] In the above embodiment of the present invention, as Figure 3 shown, a third magnetic element 8 is provided outside the magnetic attraction pressing device. The third magnetic element 8 is provided on a bottom plate 10. A power source 11 is connected below the bottom plate 10. The power source 11 drives the bottom plate 10 and the third magnetic element 8 to move closer to and away from the magnetic attraction pressing device. The third magnetic element 8 generates a magnetic repulsion with the first magnetic element 1 to keep the needle assembly 16 in an open state. In the structure shown in this embodiment, the first magnetic element 1 can preferably but not limitedly be a high-temperature magnet, the third magnetic element 8 can preferably but not limitedly be a neodymium iron boron magnet, and the power source 11 is not limited to cylinders, motors, electric cylinders, etc.

[0049] In the above embodiment of the present invention, as Figure 9 shown, the magnetic attraction pressing device further includes:

[0050] A base 5, on which a second magnetic element 4 is provided, and two pressing devices 15 are mounted on the base 5. The needles 6 of the two pressing devices 15 are in opposite directions, and the two pressing devices 15 share a rotating element, for example, a long rotating shaft 13. The second magnetic element 4 generates a magnetic attraction with the first magnetic element 1 to keep the needle assembly 16 in a closed state. In the structure shown in this embodiment, the first magnetic element 1 can preferably but not limitedly be a high-temperature magnet, and the second magnetic element 4 can preferably but not limitedly be an electromagnet or a permanent magnet.

[0051] In the above embodiment of the present invention, as Figure 10 shown, the rotating element includes a magnetic rotating element, for example, a magnetic rotating shaft 12. Two pressing devices 15 are fixedly mounted on the magnetic rotating shaft 12. The needles 6 of the two pressing devices 15 are in opposite directions. The magnetic rotating shaft 12 generates a magnetic attraction with the first magnetic element 1 to keep the needle assembly 16 in a closed state. In the structure shown in this embodiment, the first magnetic element 1 can preferably but not limitedly be a high-temperature magnet.

[0052] In the above embodiment of the present invention, as Figure 11As shown in the figure, the magnetic adsorption pressing device includes two pressing plate devices 15. The directions of the pressing needles 6 of the two pressing plate devices 15 are opposite. The two pressing plate devices 15 share a rotating element, for example, a long rotating shaft 13. Below the main body part 17 of the pressing needle assembly 16 of the pressing plate device 15, an extended fourth magnetic element 14 is provided. The fourth magnetic element 14 generates magnetic attraction with the first magnetic element 1 to make the pressing needle assembly 16 in a closed state. In the structure shown in this embodiment, the first magnetic element 1 can preferably but not limitedly be a high-temperature magnet, and the fourth magnetic element 14 can preferably but not limitedly be an electromagnet or a permanent magnet.

[0053] In the above embodiment of the present invention, as Figure 4-5 shown, at least one magnetic adsorption pressing device is arranged on both the long side and the short side of the thin sheet (for example, the silicon wafer 9). Each magnetic adsorption pressing device includes two pressing plate devices 15 with opposite directions of the pressing needles 6.

[0054] In the above embodiment of the present invention, as Figure 6 shown, the magnetic adsorption pressing device is used in combination with the cylindrical pin 18. At least one magnetic adsorption pressing device is arranged on the long side of the thin sheet (for example, the silicon wafer 9). Each magnetic adsorption pressing device includes two pressing plate devices 15 with opposite directions of the pressing needles 6, and the short side of the thin sheet (for example, the silicon wafer 9) is limited by the cylindrical pin 18.

[0055] In the above embodiment of the present invention, as Figure 7-8 shown, the magnetic adsorption pressing device is used in combination with the cylindrical pin 18 and the snap pin 19. One long side of the thin sheet (for example, the silicon wafer 9) is provided with the magnetic adsorption pressing device, the other long side is limited by the snap pin 19, and the short side of the thin sheet (for example, the silicon wafer 9) is limited by the cylindrical pin 18.

[0056] In the above embodiment of the present invention, the magnetic adsorption pressing device presses the thin sheets of vertical coating equipment, horizontal coating equipment or other angular coating equipment.

[0057] In addition, the above embodiment of the present invention is used in photovoltaic automatic production line equipment, but is not limited to being used in photovoltaic automatic production equipment, nor is it limited to being used in new energy industry equipment, and is not limited to being used in other automatic equipment.

[0058] The above technical solutions of the present invention will be described and described in detail below through specific embodiments.

[0059] Embodiment 1

[0060] As Figure 1-2 shown, a magnetic adsorption pressing device for a thin sheet of coating equipment includes a base 5 and two pressing plate devices 15 arranged on the base 5. Figure 1 and 2, a tablet pressing device 15 in a closed state and another tablet pressing device 15 in an open state are shown. In this embodiment, a rotating shaft seat 2 and a second magnetic element 4 (electromagnet) are provided on the base 5, each tablet pressing device 15 includes a rotating shaft 3, a pressing needle assembly 16 and a first magnetic element 1 (high temperature magnet), the pressing needle assembly 16 includes a main body 17, the front part of the main body 17 is provided with a pressing needle 6 for pressing and releasing the thin sheet, and the rear part is fixedly connected to the rotating shaft 3; the first magnetic element 1 is fixedly installed above the main body 17, the first magnetic element 1 generates magnetic attraction with the second magnetic element 4 below the main body 17 (magnetic attraction is generated between the high temperature magnet and the electromagnet) to make the pressing needle assembly 16 in a closed state, and the pressing needle assembly 16 is in an open state by magnetic repulsion outside the magnetic suction type pressing device. The pressing needles 6 of the two tablet pressing devices 15 are in opposite directions, and each tablet pressing device 15 is provided with a corresponding rotating shaft 13, and the corresponding rotating shaft 13 is installed in the corresponding rotating shaft seat 2.

[0061] like Figure 1-3 As shown, when the silicon wafer 9 is placed in the silicon wafer slot 7, the above-mentioned clamping device (especially the pressing device 15) remains in the open state. After the placement is completed, the clamping device is kept in the closed state by the attraction of the first magnetic element 1 and the second magnetic element 4. At this time, the third magnetic element 8 (neodymium iron boron magnet) arranged outside the clamping device is away from the clamping device, and no magnetic repulsion is generated. Therefore, the clamping device clamps the silicon wafer 9 and remains in the closed state. Shaking, acceleration and deceleration during the coating process are all maintained to keep the silicon wafer 9 from escaping from the silicon wafer slot 7. After the coating is completed, the third magnetic element 8 arranged outside the clamping device is brought close to the clamping device, as shown in FIG. Figure 3 As shown, the third magnetic element 8 disposed on the base plate 10 is driven to approach the clamping device through the movement of the power source 11. At this time, a magnetic repulsive force is generated between the third magnetic element 8 and the first magnetic element 1 to overcome the attractive force between the first magnetic element 1 and the second magnetic element 4 so that the clamping device is opened and the silicon wafer 9 is removed, completing a cycle.

[0062] In the structure shown in the above embodiment, Figure 3 As shown, the base 5 is fixed to the edge of the silicon wafer slot 7 by screws or rivets. The base 5 and the silicon wafer slot 7 need to be kept at a certain distance, and the base 5 is limited by the sink on the silicon wafer slot 7. The base 5 is the basis of the clamping device and the basis for the rotation of the tablet pressing device 15 or the pressing needle assembly 16.

[0063] In the structure shown in the above embodiment, Figure 1-3As shown, a first magnetic element 1 (high-temperature magnet) is connected above the main body portion 17 of the needle pressing assembly 16. Under the action of magnetic force, it is attracted to the second magnetic element 4 (electromagnet) on the base 5, realizing the closed state of the needle pressing assembly 16 or the needle 6. At the same time, the second magnetic element 4 can mechanically limit the needle 6 to avoid over-pressing the needle 6 and thus crushing the silicon wafer 9.

[0064] In the structure shown in the above embodiment, as Figure 1-3 shown, the needle 6 functions to press the silicon wafer 9. A certain gap is reserved between the needle 6 and the silicon wafer 9, which can not only realize pressing and limiting the silicon wafer 9 but also avoid crushing the silicon wafer 9. The needle 6 extends into the area of the silicon wafer 9, which can prevent the silicon wafer 9 from warping and detaching from the silicon wafer groove 7. The rear part or the tail of the main body portion 17 of the needle pressing assembly 16 passes through the rotating shaft 3, enabling the needle pressing assembly 16 or the needle 6 to rotate with the rotation of the rotating shaft 3 to complete the opening and closing actions. The opening and closing angle of the needle 6 is controlled by the length of the rear part or the tail of the main body portion 17 of the needle pressing assembly 16.

[0065] In the structure shown in the above embodiment, as Figure 1-3 shown, the rotating shaft 3 penetrates into the rotating shaft seat 2 on the base 5, and the rotating shaft seat 2 and the base 5 are integrated. At the same time, the sunk wall on the silicon wafer groove 7 limits the rotating shaft 3 to prevent the rotating shaft 3 from falling out of the base 5.

[0066] In the structure shown in the above embodiment, as Figure 3 shown, a third magnetic element 8 (neodymium iron boron magnet) is installed on the bottom plate 10. A power source 11 (the power source preferably uses a cylinder) is installed below the bottom plate 10. The power source 11 drives the bottom plate 10 and the third magnetic element 8 close to the pressing device, generating a repulsive force with the first magnetic element 1 of the pressing device, overcoming the magnetic attraction between the first magnetic element 1 and the second magnetic element 4 to provide power transmission and serving as the power source for the opening of the needle pressing assembly 16 or the needle 6.

[0067] In the closed state of the above magnetic attraction type pressing device of the present invention, the first magnetic element 1 on the main body portion 17 of the needle pressing assembly 16 adsorbs the second magnetic element 4, and at the same time, the second magnetic element 4 limits, making the needle pressing assembly 16 or the needle 6 in the closed state; when it needs to be opened, the third magnetic element 8 approaches the back of the silicon wafer groove 7. Through the principle of like magnets repelling each other, a high-strength repulsive force is generated between the first magnetic element 1 and the third magnetic element 8, overcoming the magnetic attraction between the first magnetic element 1 and the second magnetic element 4, making the needle pressing assembly 16 or the needle 6 in the open state, as Figure 3 shown, the two needles 6 open at the same angle. During the process of opening the needle 6, the magnetic repulsive force between the magnets can eliminate the gaps caused by factors such as installation or processing, enabling the needle 6 to reach the specified position.

[0068] As Figure 4As shown in the figure, a schematic layout diagram of pressing a silicon wafer with the pressing device in the above embodiment is shown. In this layout, two magnetic adsorption pressing devices are arranged along the long side (length) of the silicon wafer 9, and one magnetic adsorption pressing device is arranged along the short side (width) of the silicon wafer 9. Each magnetic adsorption pressing device includes two pressing plate devices 15 with opposite directions of the pressing pins 6, and can press the adjacent silicon wafers 9 simultaneously. As Figure 5 shown, a schematic layout diagram of pressing a silicon wafer with the pressing device in the above embodiment is shown. In this layout, three magnetic adsorption pressing devices are arranged along the long side (length) of the silicon wafer 9, and one magnetic adsorption pressing device is arranged along the short side (width) of the silicon wafer 9. Each magnetic adsorption pressing device includes two pressing plate devices 15 with opposite directions of the pressing pins 6, and can press the adjacent silicon wafers 9 simultaneously. Of course, in other alternative embodiments, the number of magnetic adsorption pressing devices arranged along the long side (length) and the short side (width) of the silicon wafer 9 can be adjusted according to requirements. Each silicon wafer 9 is composed of several pressing devices, and the specific number can be determined by the size and thickness of the silicon wafer 9. Of course, the number of pressing plate devices 15 on the pressing device can also be designed and selected according to actual needs, that is, the pressing device is composed of a single or multiple pressing plate devices 15, etc. Multiple compositions can reduce the number of parts.

[0069] As Figure 6 shown, a schematic layout diagram of jointly pressing a silicon wafer with the Figure 1 magnetic adsorption pressing device and a cylindrical pin is shown. In this layout, three magnetic adsorption pressing devices are arranged along the long side of the silicon wafer 9. Each magnetic adsorption pressing device includes two pressing plate devices 15 with opposite directions of the pressing pins 6, and a cylindrical pin 18 is used for limiting along the short side of the silicon wafer 9. In other alternative embodiments, the design and number of the magnetic adsorption pressing device and the cylindrical pin 18 can be adjusted according to requirements.

[0070] As Figure 7-8 shown, a schematic layout diagram of jointly pressing a silicon wafer with the Figure 1 magnetic adsorption pressing device, a cylindrical pin and a snap pin, and a left view of the structure of the snap pin pressing the silicon wafer are shown. In this layout, a magnetic adsorption pressing device is arranged along one long side of the silicon wafer 9. For example, a magnetic adsorption pressing device with one pressing plate device is used, and a snap pin 19 is used for limiting along the other long side, as Figure 8 shown, the snap pin 19 limits the silicon wafer 9 on the silicon wafer groove 7, and a cylindrical pin 18 is used for limiting along the short side of the silicon wafer 9. In other alternative embodiments, the structure of the magnetic adsorption pressing device in this layout structure can be changed according to requirements, and the design and number of the magnetic adsorption pressing device, the cylindrical pin 18 and the snap pin 19 can also be adjusted based on requirements.

[0071] Embodiment 2

[0072] The structure of the pressing device in Embodiment 2 is similar to that in Embodiment 1. The difference is that, as Figure 9 shown, the rotating shaft seat 2 is cancelled on the base 5, and two pressing plate devices 15 are arranged on the base 5. The directions of the pressing needles 6 of the two pressing plate devices 15 are opposite, and the two pressing plate devices 15 share a long rotating shaft 13. The working principle of the pressing device in this Embodiment 2 is similar to that in the above Embodiment 1, and the layout structure of the pressing device for pressing the silicon wafer in this Embodiment 2 is also the same as or similar to that in Embodiment 1.

[0073] Embodiment 3

[0074] The structure of the pressing device in Embodiment 3 is similar to that in Embodiment 1. The difference is that, as Figure 10 shown, the base 5 and the second magnetic element 4 are cancelled, and the rotating shaft 13 and the second magnetic element 4 are combined to form a magnetic rotating shaft 12. As shown in the figure, the rotating element includes two parallel magnetic rotating shafts 12, and two pressing plate devices 15 are fixedly installed on the two magnetic rotating shafts 12. The directions of the pressing needles 6 of the two pressing plate devices 15 are opposite. The working principle of the pressing device in this Embodiment 3 is similar to that in the above Embodiment 1, and the layout structure of the pressing device for pressing the silicon wafer in this Embodiment 3 is also the same as or similar to that in Embodiment 1.

[0075] Embodiment 4

[0076] The structure of the pressing device in Embodiment 4 is similar to that in Embodiment 1. The difference is that, as Figure 11 shown, the base 5 is cancelled. The pressing plate device 15 includes two pressing plate devices 15. The directions of the pressing needles 6 of the two pressing plate devices 15 are opposite. The two pressing plate devices 15 share a long rotating shaft 13. A fourth magnetic element 14 extends below the main body part 17 of the pressing needle assembly 16 of the pressing plate device 15, and when pressing the silicon wafer 9, the fourth magnetic element 14 is directly fixed on the edge of the silicon wafer groove 7. The working principle of the pressing device in this Embodiment 4 is similar to that in the above Embodiment 1, and the layout structure of the pressing device for pressing the silicon wafer in this Embodiment 4 is also the same as or similar to that in Embodiment 1.

[0077] In summary, the structures of the above Embodiments 1-4 are similar. By adopting the pressing device structures of the above Embodiments 1-4, the present invention not only meets the pressing requirements of thin wafers in vertical coating equipment, but also meets the pressing requirements of thin wafers in horizontal coating equipment and thin wafers in coating equipment at other angles. Moreover, the structural principle of the pressing device of the present invention is simple, with strong applicability and expandability, and can well meet thin wafers with different sizes and different arrangement methods. Furthermore, the pressing device of the present invention has a small covering area and a small contact area for the thin wafer; the pressing device of the present invention occupies a small space. And the present invention has great compatibility with errors in the processing and installation of the thin wafer groove. The present invention can reduce the pollution of the thin wafer groove, thereby improving the coating conversion efficiency.

[0078] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to the said process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0079] The above are only embodiments of the present invention, which enable those skilled in the art to understand and implement the present invention. Various modifications to the said embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments described herein, but rather to the broadest scope consistent with the principles and features disclosed herein.

Claims

1. A magnetic suction type pressing device for thin sheets of coating equipment, characterized in that: The invention comprises at least one tablet pressing device, wherein the tablet pressing device comprises: Rotating element; A pressing needle assembly, the pressing needle assembly comprising a main body, a front portion of the main body being provided with a pressing needle for pressing and releasing the sheet, and a rear portion being fixedly connected to the rotating element; The first magnetic element is fixedly mounted above the main body, and the first magnetic element causes the pressing needle assembly to be in a closed state by magnetic attraction at the bottom of the main body, and causes the pressing needle assembly to be in an open state by magnetic repulsion outside the magnetic clamping device.

2. The magnetic suction type pressing device for a thin film coating device according to claim 1 is characterized in that: Also includes: A base, wherein a mounting seat and a second magnetic element are arranged on the base, and two pressing devices are installed on the base, the pressing needles of the two pressing devices are in opposite directions, each pressing device is provided with a corresponding rotating element, and the rotating element is installed in the mounting seat, and the second magnetic element generates magnetic attraction with the first magnetic element to keep the pressing needle assembly in a closed state.

3. The magnetic suction type pressing device for a thin film coating device according to claim 1, characterized in that: A third magnetic element is arranged outside the magnetic clamping device, and the third magnetic element is arranged on the base plate. A power source is connected below the base plate, and the power source drives the base plate and the third magnetic element to move closer to and away from the magnetic clamping device. The third magnetic element generates magnetic repulsion with the first magnetic element to put the pressing needle assembly in an open state.

4. The magnetic suction type pressing device for a thin film coating device according to claim 1, characterized in that: Also includes: A base is provided with a second magnetic element, and two pressing devices are installed on the base, the pressing needles of the two pressing devices are in opposite directions, and the two pressing devices share a rotating element, and the second magnetic element generates magnetic attraction with the first magnetic element to keep the pressing needle assembly in a closed state.

5. The magnetic suction type pressing device for a thin film coating device according to claim 1, characterized in that: The magnetic clamping device includes two pressing devices, and the rotating element includes a magnetic rotating element. The two pressing devices are fixedly mounted on the magnetic rotating element. The pressing needles of the two pressing devices are in opposite directions. The magnetic rotating element generates magnetic attraction with the first magnetic element to keep the pressing needle assembly in a closed state.

6. The magnetic suction type pressing device for a thin film coating device according to claim 1, characterized in that: The magnetic clamping device includes two pressing devices, the pressing needles of the two pressing devices are in opposite directions, and the two pressing devices share a rotating element. A fourth magnetic element extending from the bottom of the main body of the pressing needle assembly is provided, and the fourth magnetic element generates magnetic attraction with the first magnetic element to keep the pressing needle assembly in a closed state.

7. The magnetic suction type pressing device for a thin film coating device according to claim 1, characterized in that: At least one magnetic pressing device is arranged on the long side and the short side of the sheet, and each magnetic pressing device comprises two sheet pressing devices with pressing needles in opposite directions.

8. The magnetic suction type pressing device for a thin film coating device according to claim 1, characterized in that: The magnetic clamping device is used in conjunction with a cylindrical pin, wherein a plurality of the magnetic clamping devices are arranged on the long side of the sheet, each of the magnetic clamping devices comprises two sheet pressing devices with opposite pressing needle directions, and the short side of the sheet is limited by a cylindrical pin.

9. The magnetic suction type pressing device for thin sheets of coating equipment according to claim 1, characterized in that: The magnetic clamping device is used in combination with a cylindrical pin and a snap pin, wherein the magnetic clamping device is arranged on one long side of the thin sheet, the other long side is limited by a snap pin, and the short side of the thin sheet is limited by a cylindrical pin.

10. The magnetic suction type pressing device for thin sheets of coating equipment according to claim 1, characterized in that: The magnetic clamping device is used to clamp thin sheets of vertical coating equipment, horizontal coating equipment or other angle coating equipment.

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