A processing method for a solid-state lead battery plate

Abstract

The present application relates to the technical field of battery processing, and in particular to a method for processing a solid-state lead battery plate. The method includes grid preparation, paste preparation, plate forming, curing treatment, quality screening, drying, formation, and drying. The quality screening step includes: controlling the plate processing equipment to apply a cyclic thermal load to the cured plate and obtaining detection data in real time; determining the bonding strength between the grid and the paste and the distribution uniformity of the paste in the grid according to the detection data; determining whether to perform drying according to the bonding strength and the distribution uniformity. By determining the bonding strength between the grid and the paste, it is ensured that the plate is not easily detached or separated during use, improving the stability and lifespan of the solid-state lead battery. By determining the distribution uniformity of the paste in the grid, it is judged whether the paste is evenly distributed on the grid, improving the consistency of the local resistivity of the solid-state lead battery and enhancing the performance of the solid-state lead battery.

Description

Technical Field

[0001] This application relates to the technical field of battery processing, and in particular to a method for processing solid lead battery plates. Background Art

[0002] As an important type of battery, solid lead batteries are widely used in fields such as electric vehicles, energy storage systems, and backup power supplies. Among them, the plate composed of a grid and lead paste is one of the core components. The distribution density of the conductive phase (lead powder and hard carbon) in the lead paste directly affects the local resistivity of the solid lead battery, thereby affecting the efficiency and stability of the solid lead battery.

[0003] Traditional quality inspection methods usually rely on manual inspection or simple mechanical and mechanical tests. This method not only has low accuracy but also cannot monitor the quality of the plates in real time and comprehensively. Therefore, how to ensure the bonding strength between the grid and the lead paste and the uniform distribution of the lead paste has become the key in the production process of solid lead battery plates. Summary of the Invention

[0004] This application provides a method for processing solid lead battery plates to solve the above problems.

[0005] In a first aspect, this application provides a method for processing solid lead battery plates, including grid preparation, lead paste preparation, plate forming, curing treatment, quality screening, drying, formation, and baking. The steps of the quality screening include:

[0006] Controlling the plate processing equipment to apply cyclic thermal loads to the cured plates and obtaining detection data in real time;

[0007] According to the detection data, determining the bonding strength between the grid and the lead paste and the distribution uniformity of the lead paste in the grid;

[0008] According to the bonding strength and the distribution uniformity, determining whether to perform baking;

[0009] The determination of the distribution uniformity of the lead paste in the grid includes: determining the distribution uniformity of the lead paste according to the proportion of the resistance value mutation region in the surface resistance data;

[0010] The determination of the bonding strength between the grid and the lead paste includes: determining the bonding strength according to the relative standard deviation of the contact resistance in the interface impedance data.

[0011] Through this solution, by applying cyclic thermal loads to the solidified electrode plates, the changes of the electrode plates during the cyclic thermal loads are determined, such as thermal expansion, shrinkage, cracks, etc., so as to evaluate the heat resistance and fatigue resistance of the electrode plates, which helps to ensure the stability and reliability of the electrode plates during actual use. Obtaining detection data such as surface resistance data and interface impedance data in real time helps to evaluate the distribution uniformity of the lead paste and the bonding strength between the grid and the lead paste, so as to determine whether the quality of the electrode plates meets the requirements. By determining the bonding strength between the grid and the lead paste and judging whether the bonding strength meets the preset quality standard, it is ensured that the electrode plates are not prone to falling off or separating during use, thereby improving the stability and service life of the solid-state lead battery. By determining the distribution uniformity of the lead paste in the grid and judging whether the lead paste is evenly distributed on the grid, the consistency of the local resistivity of the solid-state lead battery is improved, and the performance of the solid-state lead battery is improved.

[0012] Optionally, determining the bonding strength between the grid and the lead paste and the distribution uniformity of the lead paste in the grid according to the detection data includes:

[0013] Analyze the detection data to determine the surface resistance data and the interface impedance data;

[0014] Determine the distribution uniformity of the lead paste in the grid according to the surface resistance data;

[0015] Determine the bonding strength between the grid and the lead paste according to the interface impedance data.

[0016] Through this solution, obtaining the surface resistance data helps to reflect the conductive performance of the lead paste on the grid. Obtaining the interface impedance data helps to reflect the electrical characteristics of the contact interface between the grid and the lead paste. Determining the distribution uniformity effectively improves the performance and service life of the solid-state lead battery. By establishing an equivalent circuit model, such as interface contact resistance, capacitance, etc., it helps to evaluate the bonding strength between the grid and the lead paste. According to the bonding strength between the grid and the lead paste, it is determined that relatively low interface contact impedance data usually indicates good bonding strength, and relatively high interface contact impedance data indicates poor bonding strength or defects.

[0017] Optionally, the real-time acquisition of the detection data includes:

[0018] Obtain the electrode plate fixing signal; analyze the electrode plate fixing signal to determine whether to start the measurement;

[0019] If it is determined to start the measurement, determine the boundary position of the grid through laser alignment marking;

[0020] Based on the boundary position, control the probe array to descend to a preset height and obtain the force feedback of the probe array at the preset height;

[0021] Analyze the force feedback to determine whether the contact forces between all the probes in the probe array and the plate surface are consistent;

[0022] If they are consistent, obtain the detection data in real time.

[0023] Through this solution, obtain the plate fixing signal indicating whether the plate is correctly fixed on the detection platform through a sensor, ensuring the stability and accuracy of the plate during the detection process. Analyze the plate fixing signal to ensure that the plate is firmly fixed without displacement or loosening. If the plate fixing signal shows that the plate is well fixed, start the measurement. The accuracy of the laser alignment marks helps in positioning the probe array. According to the grid boundary position of the grid marked by the laser, control the probe array to descend to a preset height to ensure that the probe array accurately aligns with the grid for measurement. When the probe array descends to the preset height, obtaining the force feedback between the probe and the plate surface helps to ensure that the contact between the probe and the plate surface is uniform and appropriate. If the contact forces of all the probes are within the preset acceptable threshold and there are no significant differences, it is considered that the contact between the probe and the plate surface is uniform and appropriate. Once it is confirmed that the contact forces are consistent, start obtaining the detection data in real time, which helps to evaluate the uniformity of the paste distribution and the bonding strength between the grid and the paste.

[0024] Optionally, the step of "if they are consistent, obtain the detection data in real time" includes:

[0025] Divide the plate into grid cells according to a preset grid spacing to obtain a number of plate cells;

[0026] Control the probe array to detect the resistance between any adjacent plate cells to determine the resistance value between any adjacent plate cells;

[0027] Determine the sheet resistance data based on the resistance value;

[0028] Obtain the grid structure information, analyze the grid structure information, and determine the grid nodes;

[0029] Using EIS measurement, control the probe array to detect each grid node, and determine the impedance slope according to the detection results;

[0030] Determine the impedance slope as the interfacial impedance data, and determine the sheet resistance data and the interfacial impedance data as the detection data.

[0031] With this solution, grid processing helps to perform multi-point and uniform resistance measurements on the electrode plates, ensuring that the resistance detection covers the surface of the electrode plates and improving the comprehensiveness and accuracy of the detection. By measuring the resistance values between adjacent units, the conductivity of the lead paste is evaluated to ensure its uniform distribution on the electrode plates. The surface resistance data reflects the conductivity of the lead paste on the grid, which helps to determine whether the preparation and coating processes of the lead paste are qualified. Obtaining the structural information of the grid helps with the interface impedance measurement, ensuring that the probe array accurately aligns with the grid nodes. The determination of the grid nodes ensures that the EIS measurement covers the grid, providing comprehensive interface impedance data. Through the EIS measurement, interface impedance data is obtained, providing the electrical characteristics of the contact interface between the grid and the lead paste and evaluating the bonding strength. The impedance slope reflects the electrical characteristics of the contact interface between the grid and the lead paste, providing quantitative data on the bonding strength and helping to determine whether the bonding between the grid and the lead paste is tight. Determining the detection data helps with the comprehensive evaluation of the quality of the electrode plates, providing data support for production adjustment and optimization.

[0032] Optionally, determining the uniformity of the distribution of the lead paste in the grid according to the surface resistance data includes:

[0033] Determining the mutation region according to the surface resistance data;

[0034] Obtaining the area of the electrode plate, and determining the proportion of the mutation region according to the area of the electrode plate and the preset grid spacing;

[0035] Determining the uniformity of the distribution of the lead paste in the grid according to the resistance value and the proportion of the mutation region.

[0036] With this solution, the mutation region is determined, and corresponding measures are taken to optimize the manufacturing process of the electrode plates, improving the performance and service life of the solid-state lead battery. The area of the electrode plate helps to calculate the proportion of the mutation region, quantifying the degree of non-uniform distribution of the lead paste and providing data support for evaluating the quality and performance of the electrode plates. If the proportion of the mutation region is low and the change in the resistance value is small, it is considered that the distribution of the lead paste is relatively uniform; otherwise, it indicates that the distribution of the lead paste is non-uniform. If the bonding strength of the electrode plates or the uniformity of the distribution of the lead paste is unqualified, it will lead to accelerated shedding after use. Determining the uniformity of the distribution of the lead paste in the grid helps to ensure the quality and stability of the solid-state lead battery, providing a basis for optimizing the production process.

[0037] Optionally, determining the bonding strength between the grid and the lead paste according to the interface impedance data includes:

[0038] Determining the interface contact resistance of each grid node according to the resistance value;

[0039] Calculating the relative standard deviation between the grid and the lead paste according to the impedance slope;

[0040] Based on the relative standard deviation, determine the bonding strength between the grid and the paste according to the interfacial contact resistance.

[0041] Through this solution, the interfacial contact resistance reflects the electrical characteristics between the grid and the paste. The impedance slope reflects the electrical characteristics of the contact interface between the grid and the paste, which helps to evaluate the bonding strength. Calculating the relative standard deviation helps to quantify the volatility of the interfacial contact resistance. A smaller relative standard deviation indicates a higher and more uniform bonding strength. Determining the bonding strength helps to improve the performance and service life of the solid-state lead battery, and at the same time helps to ensure the quality and stability of the solid-state lead battery.

[0042] Optionally, controlling the probe array to detect the resistance of any adjacent plate units and determine the resistance value between any adjacent plate units includes:

[0043] When controlling the probe array to detect the resistance of any adjacent plate units, determine the detection position of the probe array according to the preset grid spacing;

[0044] After controlling the probe array to detect the resistance of any adjacent plate units according to the detection position, obtain the resistance detection result;

[0045] According to the detection result, determine the outer probe position and the inner probe position;

[0046] Based on the outer probe position, analyze the detection result to determine the constant DC current;

[0047] Based on the inner probe position, analyze the detection result to determine the inner local voltage difference;

[0048] According to the constant DC current and the inner local voltage difference, determine the resistance value between any adjacent plate units.

[0049] Through this solution, determining the detection position helps to ensure that the probe array evenly covers the entire plate area, improving the comprehensiveness and accuracy of detection. The positioning of the probe array ensures that the probe array accurately aligns with each detection position, improving the measurement accuracy. Obtaining the resistance value between adjacent plate units helps to evaluate the conductivity of the paste. Obtaining the detection result helps to calculate the resistance value. Obtaining the resistance detection result helps to evaluate the uniformity of the paste distribution in the grid, and at the same time helps to improve the overall performance and service life of the solid-state lead battery. Determining the outer probe position and the inner probe position helps to evaluate the bonding strength between the grid and the paste. Determining the constant DC current helps to ensure the stability of the current and evaluate the conductivity of the paste. Determining the inner local voltage difference helps to obtain the resistance value of the paste. Calculating the resistance value provides a basis for optimizing the production process.

[0050] Optionally, applying a cyclic thermal load to the solidified electrode plate includes:

[0051] Obtaining the residual stress distribution after the electrode plate is solidified;

[0052] According to the residual stress distribution, dynamically adjust the temperature rise rate and the number of cycles of the thermal load for the cyclic thermal load.

[0053] Through this solution, obtaining the residual stress distribution after the electrode plate is solidified helps to identify the stress concentration areas and the overall stress distribution in the electrode plate, providing a basis for thermal load adjustment. Analyzing the detected residual stress distribution data to identify the impact of residual stress on the performance of the electrode plate provides data support for optimizing the thermal load. By adjusting the temperature rise rate and the number of cycles, the risk of residual stress concentration is reduced, and the mechanical stability and electrochemical performance of the electrode plate are improved. Through the cyclic thermal load, the mechanical properties and electrochemical performance of the electrode plate are further improved, and the residual stress is reduced.

[0054] Optionally, in the EIS measurement, controlling the probe array to detect each grid node, and determining the impedance slope according to the detection result includes:

[0055] Obtaining the content of the silane coupling agent in the lead paste composition;

[0056] Analyzing the deviation between the content of the silane coupling agent and the preset content range;

[0057] According to the deviation, adjust the AC signal frequency range of the EIS measurement.

[0058] Through this solution, determining the content of the silane coupling agent in the lead paste provides basic data for deviation value analysis and EIS measurement adjustment. According to the deviation value, evaluate the accuracy and consistency of the content of the silane coupling agent. By adjusting the EIS measurement, improve the accuracy and reliability of the EIS measurement, so as to more accurately evaluate the impact of the content of the silane coupling agent on the performance of the solid-state lead battery electrode plate.

[0059] Optionally, after determining whether to perform drying according to the bonding strength and the distribution uniformity, it further includes:

[0060] If the bonding strength or the distribution uniformity is unqualified, determine the defect type information according to the surface resistance data and the interface impedance data;

[0061] According to the defect type information, determine the electrode plate pressure parameter and / or the lead paste stirring parameter.

[0062] Through this solution, if the plate combination strength or the uniformity of the paste distribution is unqualified, it will lead to faster shedding after use. Determine the defect type information to provide a basis for adjusting the plate pressure parameters and the paste mixing parameters. Analyze the defect causes, identify the root causes leading to the defects, and provide guidance for adjusting the process parameters. By adjusting the plate pressure parameters, improve the combination strength between the grid and the paste and reduce the defects. By adjusting the paste mixing parameters, improve the uniformity of the paste and reduce the defects. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0064] Figure 1 FIG. is a schematic diagram of an application scenario provided by an embodiment of the present application;

[0065] Figure 2 FIG. is a flowchart of a method for processing a solid-state lead battery plate provided by an embodiment of the present application; DETAILED DESCRIPTION OF THE EMBODIMENTS

[0066] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0067] In addition, the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after, unless otherwise specified.

[0068] The following will further describe the embodiments of the present application in detail with reference to the drawings of the specification.

[0069] Traditional quality inspection methods usually rely on manual inspection or simple mechanical mechanics tests. This method not only has low accuracy but also cannot monitor the quality of the plates in real time and comprehensively. Therefore, how to ensure the combination strength between the grid and the paste and the uniform distribution of the paste has become the key in the production process of solid-state lead battery plates.

[0070] Based on this, the present application provides a method for processing a solid-state lead battery plate, including grid preparation, paste preparation, plate forming, curing treatment, quality screening, drying, forming, and drying. The steps of the quality screening include: controlling the plate processing equipment to apply a cyclic thermal load to the cured plate and obtaining detection data in real time; determining the bonding strength between the grid and the paste and the distribution uniformity of the paste in the grid according to the detection data; and determining whether to perform drying according to the bonding strength and the distribution uniformity. By applying a cyclic thermal load to the cured plate, the changes of the plate during the cyclic thermal load process, such as thermal expansion, shrinkage, cracks, etc., are determined, so as to evaluate the heat resistance and fatigue resistance of the plate, which helps to ensure the stability and reliability of the plate in actual use. Obtaining detection data such as surface resistance data and interface impedance data in real time helps to evaluate the distribution uniformity of the paste and the bonding strength between the grid and the paste, so as to judge whether the quality of the plate meets the requirements. By determining the bonding strength between the grid and the paste, it is judged whether the bonding strength meets the preset quality standard, so as to ensure that the plate is not easily detached or separated during use, and improve the stability and life of the solid-state lead battery. By determining the distribution uniformity of the paste in the grid, it is judged whether the paste is evenly distributed on the grid, so as to improve the consistency of the local resistivity of the solid-state lead battery and improve the performance of the solid-state lead battery.

[0071] Figure 1 This is a schematic diagram of an application scenario provided by the present application. When processing battery plates, the method provided by the present application is applied. Specifically, the method provided by the present application is applied to any server. The server interacts with the plate processing equipment to control the plate processing equipment to apply a cyclic thermal load to the cured plate and obtain detection data in real time, which is used to evaluate the distribution uniformity of the paste, the bonding strength between the grid and the paste, and the distribution uniformity of the paste in the grid, improve the production accuracy, and improve the performance of the solid-state lead battery.

[0072] Specific implementation manners can refer to the following embodiments.

[0073] Figure 2 This is a flowchart of a method for processing a solid-state lead battery plate provided by an embodiment of the present application. Among them, all steps of processing the solid-state lead battery plate include grid preparation, paste preparation, plate forming, curing treatment, quality screening, drying, forming, and drying. In this embodiment, the steps of quality screening are expanded, and it can be applied to the server in the above scenario. As Figure 2 shown, the method includes:

[0074] S201. Control the plate processing equipment to apply a cyclic thermal load to the cured plate and obtain detection data in real time;

[0075] Curing can be to evenly coat the prepared lead paste on the grid and perform heat treatment under certain temperature and pressure conditions, so that the lead paste tightly adheres to the grid, forming a plate electrode with a certain shape and strength.

[0076] Cyclic thermal loading can be to apply a series of thermal cycling treatments on the cured plate electrode to simulate the temperature changes under actual use conditions, so as to test the performance and stability of the plate electrode under thermal stress.

[0077] The detection data can be plate electrode data such as surface resistance data and interface impedance data obtained through electrochemical impedance spectroscopy.

[0078] Specifically, according to the characteristics of the plate electrode and the expected use environment, set the cyclic thermal loading parameters such as the number of cycles, temperature range, and temperature rise rate. Use the heat treatment equipment in the plate electrode processing equipment to heat the cured plate electrode to the set high temperature and then cool it to the low temperature, repeating the cyclic thermal loading. During the cyclic thermal loading process, obtain the detection data of the plate electrode in real time through electrochemical impedance spectroscopy.

[0079] S202. According to the detection data, determine the bonding strength between the grid and the lead paste and the distribution uniformity of the lead paste on the grid;

[0080] The grid can be the part made of metal or alloy in the solid-state lead battery plate electrode that plays a supporting and conductive role.

[0081] The lead paste can be the component part in the solid-state lead battery plate electrode composed of lead powder, lead silicate, sodium silicate, hard carbon, silane coupling agent, glass fiber filaments, sulfuric acid, etc.

[0082] The bonding strength can be the adhesion strength between the grid and the lead paste.

[0083] The distribution uniformity can be the distribution situation of the lead paste on the grid.

[0084] Specifically, through the detection data, determine the surface resistance data and interface impedance data. By analyzing the surface resistance data, judge the distribution uniformity of the lead paste on the grid. By analyzing the interface impedance data, determine the bonding strength between the grid and the lead paste.

[0085] S203. According to the bonding strength and distribution uniformity, determine whether to perform drying.

[0086] S204. Determine the distribution uniformity of the lead paste on the grid, including: determine the distribution uniformity of the lead paste according to the proportion of the resistance value mutation region in the surface resistance data;

[0087] S205. Determine the bonding strength between the grid and the lead paste, including: determine the bonding strength according to the relative standard deviation of the contact resistance in the interface impedance data.

[0088] Specifically, based on the performance requirements, life expectancy of the solid-state lead battery, and empirical data during the production process, a quality standard is preset. The bonding strength and distribution uniformity are compared with the preset quality standard. According to the comparison results, it is determined whether to perform drying.

[0089] Through this solution, by applying cyclic thermal loads to the cured electrode plates, the changes in the electrode plates during the cyclic thermal load process, such as thermal expansion, contraction, cracks, etc., are determined, thereby evaluating the heat resistance and fatigue resistance of the electrode plates, which helps to ensure the stability and reliability of the electrode plates during actual use. Real-time acquisition of detection data such as surface resistance data and interfacial impedance data helps to evaluate the distribution uniformity of the lead paste and the bonding strength between the grid and the lead paste, thereby determining whether the quality of the electrode plate meets the requirements. By determining the bonding strength between the grid and the lead paste and judging whether the bonding strength meets the preset quality standard, it is ensured that the electrode plate is not prone to falling off or separating during use, improving the stability and life of the solid-state lead battery. By determining the distribution uniformity of the lead paste in the grid and judging whether the lead paste is evenly distributed on the grid, the consistency of the local resistivity of the solid-state lead battery is improved, and the performance of the solid-state lead battery is improved.

[0090] In some embodiments, the detection data is analyzed to determine the surface resistance data and the interfacial impedance data; according to the surface resistance data, the distribution uniformity of the lead paste in the grid is determined; according to the interfacial impedance data, the bonding strength between the grid and the lead paste is determined.

[0091] The interfacial impedance data can be obtained by electrochemical impedance spectroscopy and reflects the electrical characteristics of the contact interface between the grid and the lead paste.

[0092] The surface resistance data can be obtained by a resistance measuring instrument and reflects the electrical conductivity of the lead paste on the grid.

[0093] Specifically, based on the detection data, the electrode plate is measured at multiple points by a resistance measuring instrument to obtain the surface resistance data. The electrochemical impedance spectroscopy is used to measure the impedance of the grid nodes to obtain the interfacial impedance data. According to the surface resistance data, the distribution uniformity of the lead paste in the grid is evaluated by statistical analysis methods. The interfacial impedance data is fitted through the electrochemical impedance spectroscopy to establish an equivalent circuit model. The interfacial impedance data is input into the equivalent circuit model to determine the bonding strength between the grid and the lead paste.

[0094] Through this solution, obtaining the sheet resistance data helps to reflect the conductivity of the paste on the grid. Obtaining the interface impedance data helps to reflect the electrical characteristics of the contact interface between the grid and the paste. Determining the uniformity of distribution can effectively improve the performance and service life of the solid-state lead battery. By establishing an equivalent circuit model, such as the interface contact resistance, capacitance, etc., it helps to evaluate the bonding strength between the grid and the paste. According to the bonding strength between the grid and the paste, it is determined that relatively low interface contact impedance data usually indicates good bonding strength, while relatively high interface contact impedance data indicates poor bonding strength or defects.

[0095] In some embodiments, a plate fixing signal is obtained; the plate fixing signal is analyzed to determine whether to start the measurement; if it is determined to start the measurement, the boundary position of the grid is determined by laser alignment marking; based on the boundary position, the probe array is controlled to descend to a preset height, and the force feedback of the probe array at the preset height is obtained; the force feedback is analyzed to determine whether the contact forces between all the probes in the probe array and the plate surface are consistent; if they are consistent, the detection data is obtained in real time.

[0096] The plate fixing signal can be a confirmation signal received after the plate is fixed to the detection platform, indicating that the plate has been correctly fixed and the detection process can start.

[0097] Starting the measurement can be an instruction to start the detection after confirming that the plate fixing signal is correct.

[0098] The laser alignment marking can be using a laser device to mark on the plate to determine the boundary position of the grid.

[0099] The boundary position can be the edge position of the grid determined by laser alignment marking on the plate.

[0100] The probe array can be an array composed of multiple probes for performing multi-point measurements on the plate.

[0101] The preset height can be the height at which the probe array descends to the plate surface preset during the detection process. It is pre-stored in the server and called when in use.

[0102] The force feedback can be the contact force data obtained through the sensor on the plate processing equipment when the probe array contacts the plate surface.

[0103] The probe can be a single measurement element in the probe array for contacting the plate surface and performing resistance or impedance measurements.

[0104] The plate surface can be the outer surface of the plate.

[0105] The contact force can be the interaction force between the probe and the plate surface.

[0106] Specifically, fix the electrode plate to the detection platform to obtain the electrode plate fixing signal. Analyze the electrode plate fixing signal to determine that the electrode plate is correctly fixed, so as to determine whether to start the measurement. If it is determined to start the measurement, use the laser alignment marking technology to accurately determine the boundary position of the grid. According to the boundary position, control the probe array to descend to a preset height at a preset path and a preset speed. When the probe array reaches the preset height, obtain the force feedback between the probe and the surface of the electrode plate through the sensor. Analyze the force feedback of all probes in the probe array, and compare the differences between the probes through statistical analysis methods. Set the acceptable threshold of the contact force according to the electrode plate material and detection requirements. Compare the force feedback with the preset acceptable threshold to determine whether the contact force between all probes in the probe array and the surface of the electrode plate is consistent. If the contact force of all probes is within the preset acceptable threshold and there is no significant difference, it is determined that the contact force between the probe and the surface of the electrode plate is consistent. Once the contact force consistency is determined, obtain the detection data in real time.

[0107] Through this solution, obtain the electrode plate fixing signal indicating whether the electrode plate is correctly fixed on the detection platform through the sensor, ensuring the stability and accuracy of the electrode plate during the detection process. Analyze the electrode plate fixing signal to ensure that the electrode plate is firmly fixed without displacement or loosening. If the electrode plate fixing signal shows that the electrode plate is well fixed, start the measurement. The accuracy of the laser alignment marking helps the probe array to be positioned. According to the grid boundary position marked by the laser, control the probe array to descend to the preset height to ensure that the probe array accurately aligns with the grid for measurement. When the probe array descends to the preset height, obtain the force feedback between the probe and the surface of the electrode plate, which helps to ensure that the contact between the probe and the surface of the electrode plate is uniform and appropriate. If the contact force of all probes is within the preset acceptable threshold and there is no significant difference, it is considered that the contact between the probe and the surface of the electrode plate is uniform and appropriate. Once the contact force consistency is confirmed, start to obtain the detection data in real time, which helps to evaluate the distribution uniformity of the lead paste and the bonding strength between the grid and the lead paste.

[0108] In some embodiments, the electrode plate is processed into a grid according to a preset grid spacing to obtain a number of electrode plate units; control the probe array to detect the resistance between any adjacent electrode plate units to determine the resistance value between any adjacent electrode plate units; determine the surface resistance data according to the resistance value; obtain the grid structure information, analyze the grid structure information to determine the grid nodes; use EIS measurement to control the probe array to detect each grid node, and determine the impedance slope according to the detection result; determine the impedance slope as the interface impedance data, and determine the surface resistance data and the interface impedance data as the detection data.

[0109] The electrode plate can be one of the core components composed of a grid and lead paste in a solid-state lead battery.

[0110] The preset grid spacing can be the distance between adjacent grids preset when dividing the grid on the electrode plate. It is stored in the server in advance and called when in use.

[0111] The electrode plate unit can be a unit in the grid divided on the electrode plate.

[0112] Adjacent electrode plate units can be two adjacent electrode plate units.

[0113] The resistance value can be the resistance between any adjacent electrode plate units measured by the probe array.

[0114] The grid structure information can be the structural information such as the shape, size, and node positions of the grid.

[0115] The grid node can be the position on the grid where the current flows through.

[0116] The EIS measurement can be an electrochemical impedance spectroscopy measurement used to evaluate electrode materials and battery performance technologies.

[0117] The detection result can be the impedance data of the grid nodes detected by the probe array during the EIS measurement process.

[0118] The impedance slope can be the rate of change of the impedance value with respect to frequency in the EIS measurement result.

[0119] Specifically, according to the size of the electrode plate and the detection requirements, the preset grid spacing is set. Using tools, the electrode plate is divided into several electrode plate units according to the preset grid spacing. According to the electrode plate grid division, the probe array is accurately positioned at the positions between adjacent electrode plate units. Using the probes in the probe array, resistance measurements are made on adjacent electrode plate units. After the probe array contacts the electrode plate surface and stabilizes, the resistance value between any adjacent electrode plate units is determined. According to the resistance value between adjacent electrode plate units, the surface resistance data is calculated. Using laser scanning technology, the grid structure information is obtained. The grid structure information is analyzed to identify the grid nodes. Through the EIS measurement, the voltage response of each grid node is detected by controlling the probe array. According to the voltage response, the impedance of each grid node is calculated. The impedance slopes at different frequencies are analyzed to determine the impedance slope of the impedance changing with frequency. The impedance slopes of each grid node obtained through the EIS measurement are integrated to form the interface impedance data. The surface resistance data obtained through the resistance measurement is integrated to form the surface resistance data. The interface impedance data and the surface resistance data are combined to form the final detection data.

[0120] Through this solution, grid processing helps to perform multi-point and uniform resistance measurements on the electrode plates, ensuring that the resistance detection covers the surface of the electrode plates and improving the comprehensiveness and accuracy of the detection. By measuring the resistance values between adjacent units, the conductivity of the lead paste is evaluated to ensure its uniform distribution on the electrode plates. The surface resistance data reflects the conductivity of the lead paste on the grid, which helps to determine whether the preparation and coating processes of the lead paste are qualified. Obtaining the structural information of the grid helps with the measurement of the interfacial impedance, ensuring that the probe array accurately aligns with the grid nodes. The determination of the grid nodes ensures that the EIS measurement covers the grid, providing comprehensive interfacial impedance data. Through the EIS measurement, interfacial impedance data is obtained, providing the electrical characteristics of the contact interface between the grid and the lead paste and evaluating the bonding strength. The impedance slope reflects the electrical characteristics of the contact interface between the grid and the lead paste, providing quantitative data on the bonding strength, which helps to determine whether the bonding between the grid and the lead paste is tight. Determining the detection data helps with the comprehensive evaluation of the quality of the electrode plates, providing data support for production adjustment and optimization.

[0121] In some embodiments, according to the surface resistance data, the mutation region is determined; the area of the electrode plate is obtained, and according to the area of the electrode plate and the preset grid spacing, the proportion of the mutation region is determined; according to the resistance value and the proportion of the mutation region, the distribution uniformity of the lead paste in the grid is determined.

[0122] The mutation region can be a region where the surface resistance value of the electrode plate shows a significant change.

[0123] The area of the electrode plate can be the total surface area of the electrode plate, which can be in square centimeters (cm²).

[0124] The proportion of the mutation region can be the ratio of the area of the mutation region to the area of the electrode plate.

[0125] Specifically, statistical analysis is performed on the surface resistance data. According to the results of the statistical analysis, mutation regions with resistance values significantly higher or lower than the average are identified. A measuring tool is used to obtain the area of the electrode plate. The surface of the electrode plate is divided into several electrode plate units using the preset grid spacing. The total number of electrode plate units on the surface of the electrode plate is calculated through the area of the electrode plate. The electrode plate units covered by the mutation region are determined through visual inspection. According to the electrode plate units covered by the mutation region and the area of the electrode plate, the proportion of the mutation region is determined. According to historical data and industry standards, a standard for evaluating the distribution uniformity of the lead paste is established. The resistance value and the proportion of the mutation region are compared with the evaluation standard to determine the distribution uniformity of the lead paste in the grid.

[0126] Through this solution, the mutation region is determined, and corresponding measures are taken to optimize the manufacturing process of the electrode plate, improving the performance and service life of the solid-state lead battery. The electrode plate area helps calculate the proportion of the mutation region, quantify the degree of uneven distribution of the lead paste, and provide data support for evaluating the quality and performance of the electrode plate. If the proportion of the mutation region is low and the change in resistance value is small, it is considered that the distribution of the lead paste is relatively uniform; otherwise, it indicates that the distribution of the lead paste is uneven. Determining the uniformity of the lead paste distribution in the grid helps ensure the quality and stability of the solid-state lead battery and provides a basis for optimizing the production process.

[0127] In some embodiments, according to the resistance value, the interface contact resistance of each grid node is determined; according to the impedance slope, the relative standard deviation between the grid and the lead paste is calculated; based on the relative standard deviation and according to the interface contact resistance, the bonding strength between the grid and the lead paste is determined.

[0128] The interface contact resistance can be the resistance between the grid and the lead paste on the contact surface.

[0129] The relative standard deviation can be a ratio used to measure the consistency of the interface contact resistance.

[0130] Specifically, according to the resistance value, using EIS measurement, each grid node is probed to obtain interface impedance data. The interface impedance data is analyzed to determine the interface contact resistance of each grid node. According to the EIS measurement, the impedance slope of each grid node is calculated. According to the impedance slope, the relative standard deviation between the grid and the lead paste is calculated. Combining the relative standard deviation and the interface contact resistance, the bonding strength between the grid and the lead paste is evaluated.

[0131] Through this solution, the interface contact resistance reflects the electrical characteristics between the grid and the lead paste. The impedance slope reflects the electrical characteristics of the contact interface between the grid and the lead paste, which helps evaluate the bonding strength. Calculating the relative standard deviation helps quantify the volatility of the interface contact resistance. A small relative standard deviation indicates high and uniform bonding strength. Determining the bonding strength helps improve the performance and service life of the solid-state lead battery and also helps ensure the quality and stability of the solid-state lead battery.

[0132] In some embodiments, when controlling the probe array to perform resistance detection on any adjacent electrode plate units, according to the preset grid spacing, the detection positions of the probe array are determined; after controlling the probe array to perform resistance detection on any adjacent electrode plate units according to the detection positions, the resistance detection results are obtained; according to the detection results, the outer probe positions and the inner probe positions are determined; based on the outer probe positions, the detection results are analyzed to determine the constant DC current; based on the inner probe positions, the detection results are analyzed to determine the inner local voltage difference; according to the constant DC current and the inner local voltage difference, the resistance value between any adjacent electrode plate units is determined.

[0133] The detection position can be the specific position where the probe array contacts the plate surface.

[0134] The resistance detection result can be the local voltage difference inside measured by the probe array.

[0135] The outer probe position can be the probe position located at the boundary position of adjacent plate units.

[0136] The inner probe position can be the probe position located inside adjacent plate units.

[0137] The constant DC current can be the stable current applied to adjacent plate units through the outer probes.

[0138] The local voltage difference inside can be the voltage difference inside adjacent plate units measured by the inner probes.

[0139] Specifically, when controlling the probe array to perform resistance detection on any adjacent plate units, use a preset grid spacing to divide the plate surface into several plate units. Determine the detection positions of the probe array on the plate according to the grid division and positioning device. Use an accurate positioning device to move the probe array to the determined detection positions, apply a constant DC current to the adjacent plate units through the probe array, and measure the voltage difference between the probes when passing the current. Determine the resistance detection result according to the voltage difference. Analyze the detection result to determine the outer probe positions located at the boundary positions of adjacent units and the inner probe positions located inside adjacent plate units. Based on the detection results of the outer probe positions, determine the constant DC current passing through the adjacent plate units. Based on the detection results of the inner probe positions, determine the local voltage difference inside the adjacent plate units. According to the constant DC current and the local voltage difference inside, use Ohm's law to calculate the resistance value between any adjacent plate units.

[0140] Through this solution, determining the detection positions helps ensure that the probe array evenly covers the entire plate area, improving the comprehensiveness and accuracy of detection. The positioning of the probe array ensures that the probe array accurately aligns with each detection position, improving the measurement accuracy. Obtaining the resistance value between adjacent plate units helps evaluate the conductive performance of the paste. Obtaining the detection results helps calculate the resistance value. Obtaining the resistance detection results helps evaluate the uniformity of the paste distribution in the grid, and at the same time helps improve the overall performance and service life of the solid-state lead battery. Determining the outer probe positions and the inner probe positions helps evaluate the bonding strength between the grid and the paste. Determining the constant DC current helps ensure the stability of the current and evaluate the conductive performance of the paste. Determining the local voltage difference inside helps obtain the resistance value of the paste. Calculating the resistance value provides a basis for optimizing the production process.

[0141] In some embodiments, obtain the residual stress distribution after the curing of the electrode plate; according to the residual stress distribution, dynamically adjust the temperature rise rate and the number of cycles of the thermal load to cycle the thermal load.

[0142] The residual stress distribution can be a stress distribution generated due to reasons such as processing and heat treatment.

[0143] The thermal load can be the heat or temperature change applied to the electrode plate.

[0144] The temperature rise rate can be the rate of change of the temperature of the electrode plate with time during the thermal load process.

[0145] The number of cycles can be the number of repetitions of the heating and cooling processes during the thermal load process.

[0146] Specifically, use a stress detection device to detect the cured electrode plate to obtain the residual stress distribution. Analyze the detected residual stress distribution data, and according to the analysis result of the residual stress distribution, dynamically adjust the temperature rise rate and the number of cycles of the thermal load. Apply a cyclic thermal load to the electrode plate according to the adjusted temperature rise rate and the number of cycles.

[0147] Through this solution, obtaining the residual stress distribution after the curing of the electrode plate helps to identify the stress concentration areas and the overall stress distribution in the electrode plate, providing a basis for thermal load adjustment. Analyze the detected residual stress distribution data to identify the influence of the residual stress on the performance of the electrode plate, providing data support for optimizing the thermal load. By adjusting the temperature rise rate and the number of cycles, reduce the risk of residual stress concentration, improve the mechanical stability and electrochemical performance of the electrode plate. Through the cyclic thermal load, further improve the mechanical properties and electrochemical performance of the electrode plate and reduce the residual stress.

[0148] In some embodiments, obtain the content of the silane coupling agent in the lead paste; analyze the deviation between the content of the silane coupling agent and the preset content range; according to the deviation, adjust the AC signal frequency range of the EIS measurement.

[0149] The content of the silane coupling agent can be the mass or volume ratio of the silane coupling agent in the lead paste.

[0150] The preset content range can be the ideal range of the content of the silane coupling agent preset during the production process. It is stored in the server in advance and is called when used.

[0151] The deviation can be the difference between the content of the silane coupling agent and the preset content range.

[0152] The AC signal frequency range can be the frequency range of the AC signal used in the EIS measurement.

[0153] Specifically, use a chemical analysis device to detect the paste and obtain the content of the silane coupling agent. Determine the preset content range of the silane coupling agent according to the production standard and the battery performance requirements. Compare the detected content of the silane coupling agent with the preset content range and calculate the deviation value. Evaluate the deviation value of the silane coupling agent content to determine the degree of deviation. According to the degree of deviation, dynamically adjust the AC signal frequency range of the EIS measurement.

[0154] Through this solution, determine the content of the silane coupling agent in the paste, providing basic data for deviation value analysis and EIS measurement adjustment. According to the deviation value, evaluate the accuracy and consistency of the silane coupling agent content. By adjusting the EIS measurement, improve the accuracy and reliability of the EIS measurement, so as to more accurately evaluate the influence of the silane coupling agent content on the performance of the solid lead battery plate.

[0155] In some embodiments, if the bonding strength or distribution uniformity is unqualified, determine the defect type information according to the surface resistance data and the interface impedance data; according to the defect type information, determine the plate pressure parameter and / or the paste stirring parameter.

[0156] The defect type information may be specific problems regarding the unqualified bonding strength of the plate or the uneven distribution of the paste.

[0157] The plate pressure parameter may be a pressure parameter used to control the bonding of the grid and the paste during the plate processing.

[0158] The paste stirring parameter may be a parameter used to control the mixing uniformity of the paste during the paste preparation process.

[0159] Specifically, if the bonding strength or distribution uniformity is unqualified, analyze the electrical characteristics of the plate according to the surface resistance data and the interface impedance data to determine the defect type information. According to the defect type information, analyze the cause of the defect. If the defect type information indicates that the plate pressure is the cause of the problem, adjust the plate pressure parameter according to the defect type information. If the defect type information indicates that the paste stirring is the cause of the problem, adjust the paste stirring parameter according to the defect type information.

[0160] Through this solution, determine the defect type information, providing a basis for adjusting the plate pressure parameter and the paste stirring parameter. Analyze the cause of the defect, identify the root cause of the defect, and provide guidance for adjusting the process parameters. By adjusting the plate pressure parameter, improve the bonding strength between the grid and the paste and reduce the defects. By adjusting the paste stirring parameter, improve the uniformity of the paste and reduce the defects.

Claims

1. A processing method for a solid-state lead battery plate, including grid preparation, paste preparation, plate forming, curing treatment, quality screening, drying, forming and baking, characterized in that, The steps of the quality screening include: Controlling the plate processing equipment to apply cyclic thermal loads to the cured plates and obtaining detection data in real time; Determining the bonding strength between the grid and the paste and the distribution uniformity of the paste in the grid according to the detection data; Determining whether to perform drying according to the bonding strength and the distribution uniformity; The determining the distribution uniformity of the paste in the grid includes: determining the distribution uniformity of the paste according to the proportion of the resistance value mutation regions in the surface resistance data; The determining the bonding strength between the grid and the paste includes: determining the bonding strength according to the relative standard deviation of the contact resistance in the interface impedance data.

2. The method according to claim 1, wherein The determining the bonding strength between the grid and the paste and the distribution uniformity of the paste in the grid according to the detection data includes: Analyzing the detection data to determine the surface resistance data and the interface impedance data; Determining the distribution uniformity of the paste in the grid according to the surface resistance data; Determining the bonding strength between the grid and the paste according to the interface impedance data.

3. The method according to claim 1, wherein The obtaining detection data in real time includes: Obtaining the plate fixing signal; analyzing the plate fixing signal to determine whether to start measurement; If it is determined to start measurement, determining the boundary position of the grid by laser alignment marking; Based on the boundary position, controlling the probe array to descend to a preset height and obtaining the force feedback of the probe array at the preset height; Analyzing the force feedback to determine whether the contact forces between all the probes in the probe array and the plate surface are consistent; If they are consistent, obtaining the detection data in real time.

4. The method according to claim 3, wherein The if they are consistent, obtaining the detection data in real time includes: Performing grid processing on the plates according to a preset grid spacing to obtain a number of plate units; Controlling the probe array to perform resistance detection on any adjacent plate units to determine the resistance value between any adjacent plate units; Determining the surface resistance data according to the resistance value; Obtaining the grid structure information, analyzing the grid structure information to determine the grid nodes; Using EIS measurement, controlling the probe array to detect each grid node, and determining the impedance slope according to the detection result; Determining the impedance slope as the interface impedance data, and determining the surface resistance data and the interface impedance data as the detection data.

5. The method according to claim 4, characterized in that, The determining the distribution uniformity of the paste according to the proportion of the resistance value mutation regions in the surface resistance data includes: Determining the mutation regions according to the surface resistance data; Obtaining the plate area, and determining the proportion of the mutation regions according to the plate area and the preset grid spacing; Determining the distribution uniformity of the paste in the grid according to the resistance value and the proportion of the mutation regions.

6. The method according to claim 4, wherein The determining the bonding strength according to the relative standard deviation of the contact resistance in the interface impedance data includes: Determining the interface contact resistance of each grid node according to the resistance value; Calculating the relative standard deviation between the grid and the paste according to the impedance slope; Based on the relative standard deviation, determining the bonding strength between the grid and the paste according to the interface contact resistance.

7. The method according to claim 4, characterized in that, The controlling the probe array to perform resistance detection on any adjacent plate units to determine the resistance value between any adjacent plate units includes: When controlling the probe array to perform resistance detection on any adjacent plate units, determine the detection positions of the probe array according to the preset grid spacing; After controlling the probe array to perform resistance detection on any adjacent plate units according to the detection positions, obtain the resistance detection results; Determine the outer probe positions and the inner probe positions according to the detection results; Based on the outer probe positions, analyze the detection results to determine the constant DC current; Based on the inner probe positions, analyze the detection results to determine the inner local voltage difference; Determine the resistance value between any adjacent plate units according to the constant DC current and the inner local voltage difference.

8. The method according to claim 1, characterized in that The applying cyclic thermal loads to the cured plates includes: Obtain the residual stress distribution after the plates are cured; According to the residual stress distribution, dynamically adjust the temperature rise rate and the number of cycles of the thermal loads for the cyclic thermal loads.

9. The method according to claim 4, wherein The using EIS measurement to control the probe array to detect each grid node and determine the impedance slope according to the detection results includes: Obtain the content of the silane coupling agent in the lead paste composition; Analyze the deviation of the content of the silane coupling agent from the preset content range; According to the deviation, adjust the AC signal frequency range of the EIS measurement.

10. The method according to claim 2, characterized in that, After determining whether to perform drying according to the bonding strength and the distribution uniformity, it further includes: If the bonding strength or the distribution uniformity is unqualified, determine the defect type information according to the surface resistance data and the interface impedance data; Determine the plate pressure parameters and / or the lead paste stirring parameters according to the defect type information.

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