Three-dimensional splicing structure of millimeter wave receiving front end

Abstract

A three-dimensional splicing structure of a millimeter wave receiving front end comprises a bottom plate and an upper brace, and further comprises a power supply module, a local oscillator module, an AGC module and a radio frequency module which are limited and fixed between the bottom plate and the upper brace, the secondary power supply module and the signal interconnection module are respectively arranged at two sides of the power supply module, the local oscillator module, the AGC module and the radio frequency module. By means of reasonable arrangement of component structures, miniaturization is achieved on the whole, interconnection cables between all modules and components can be omitted or shortened, interconnection between all modules of the receiving front end is achieved, the integration degree of products is greatly improved, the design complexity of the receiving front end is greatly reduced, electric fitting steps of the products are simplified, and large-scale production is facilitated; meanwhile, the size and the weight are further reduced, the size is reduced to 0.6 kg from 1.5 kg in the prior art, and the size is reduced to about 30% of that of the original design.

Description

Technical Field

[0001] The present invention belongs to the technical field of millimeter wave technology, and particularly relates to a three-dimensional plug-in structure of a millimeter wave receiving front end. Background Art

[0002] Millimeter wave (Millimbtbr wavb, mmWavb) refers to an electromagnetic wave with a wavelength between 1 millimeter and 10 millimeters, corresponding to a frequency range of 30 GHz to 300 GHz. In practical applications, electromagnetic waves with a frequency above 24 GHz are usually also classified as millimeter waves. It is located between microwaves and far-infrared waves, thus combining the characteristics of both bands. Millimeter waves have the advantages of high bandwidth, capable of supporting ultra-high-speed data transmission and large-capacity communication networks; high resolution, capable of providing high-precision detection and recognition capabilities in imaging and radar applications; and high directivity, which is beneficial for realizing directional communication and precise target positioning. As a high-frequency electromagnetic wave, millimeter waves have the advantages of high bandwidth, high resolution, and high directivity, and have a large number of applications in the fields of communication, radar, remote sensing, imaging, and radio astronomy.

[0003] With the continuous development of satellite technology in China, the application frequency band of satellites has been continuously improved, and it has been upgraded from the L band to the millimeter wave band. To achieve high sensitivity for receiving electromagnetic signals in the millimeter wave band, higher requirements such as lower noise figure, greater power gain, and wider frequency bandwidth are put forward for the receiving front end. At the same time, due to the limited load-bearing capacity and load-carrying capacity of the payload platform, while having high radio frequency performance requirements for the product, higher requirements are also put forward for the low power consumption, light weight, and small volume of the product.

[0004] In the past, the receiving front ends used in satellite applications were limited by the progress of technology during product design, mainly using discrete devices and PCB circuit boards. Usually, the products were designed with a combined installation method. The functional integration degree of each functional circuit in the product itself was low, and the integration degree of systematic layout was low. The products had large volume and heavy weight. The interconnection of low-frequency signals and radio frequency signals between circuits usually used cable routing and connector plug-in interconnection. However, the signal frequency in the millimeter wave band is relatively higher than that of microwave signals. The connection and assembly between its components, the interconnection state, and the cable length have a great impact on the transmission performance of radio frequency signals, with very high requirements. Moreover, as the frequency increases, the number of connections has an increasing impact on the radio frequency performance of the product. Summary of the Invention

[0005] Aiming at the above problems, the purpose of the present invention is to provide a three-dimensional plug-in structure of a millimeter wave receiving front end, so as to solve the problems of high power consumption, large volume, heavy weight, and poor performance of existing products.

[0006] To achieve the above purpose, the technical solutions adopted by the present invention include:

[0007] A three-dimensional plug-in structure of a millimeter-wave receiving front end, including a bottom plate and a pull-up bar, further including a power module, a local oscillator module, an AGC module, and a radio frequency module that are limited and fixed between the bottom plate and the pull-up bar. The power module is electrically connected to the local oscillator module, the AGC module, and the radio frequency module. There is a signal connection between the local oscillator module and the AGC module, and between the AGC module and the radio frequency module;

[0008] It further includes a secondary power supply module provided on one side of the power module, the local oscillator module, the AGC module, and the radio frequency module. The secondary power supply module is structurally matched with the power module, the local oscillator module, the AGC module, and the radio frequency module and is electrically connected to all of them;

[0009] It further includes a signal interconnection module provided on the other side of the power module, the local oscillator module, the AGC module, and the radio frequency module. The signal interconnection module is electrically connected to the power module, and there is a signal connection between the signal interconnection module and the local oscillator module, the AGC module, and the radio frequency module.

[0010] Preferably, a micro-distance low-frequency socket is connected in series on the side of the power module, the local oscillator module, the AGC module, and the radio frequency module close to the secondary power supply module, and 4 mating plugs are connected between the micro-distance low-frequency socket and the secondary power supply module.

[0011] Preferably, the model of the micro-distance low-frequency socket is J30JMI-13ZKS19, and the model of the mating plug is J30J IA-13TJN31.

[0012] Preferably, both sides of the power module, the local oscillator module, the AGC module, and the radio frequency module are fixed to the secondary power supply module and the signal interconnection module respectively through fixed shafts.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] (1) For the three-dimensional plug-in structure of a millimeter-wave receiving front end of the present invention, through reasonable setting of the component structure, the overall realization of miniaturization can save or shorten the interconnection cables between each module and component, simplify the interconnection between each module of the receiving front end, greatly improve the integration degree of the product, greatly reduce the design complexity of the receiving front end, simplify the product electrical installation steps, and is conducive to large-scale production; at the same time, it further reduces the volume and weight, from the existing 1.5 Kg to 0.6 kg, and the volume is reduced to about 30% of the original design.

[0015] (2) For the three-dimensional plug-in structure of a millimeter-wave receiving front end of the present invention, through reasonable setting of the component structure, the cooperation of the micro-distance low-frequency socket and the mating plug can achieve the ability of quick plugging and unplugging and replacement.

[0016] (3) The three-dimensional plug-in structure of a millimeter-wave receiving front-end of the present invention, through reasonable setting of component structures, meets the high sensitivity requirements for receiving electromagnetic signals in the millimeter-wave band, and puts forward requirements for the receiving front-end such as lower noise figure, greater power gain, and wider frequency bandwidth. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings are used to provide further understanding of the present invention and constitute a part of the specification, and are used together with the following specific embodiments to explain the present invention, but do not constitute a limitation to the present invention. In the drawings:

[0018] Figure 1 is a schematic structural diagram of the three-dimensional plug-in structure of the millimeter-wave receiving front-end of the present invention;

[0019] Figure 2 is Figure 1 a schematic structural diagram of the signal transmission component in;

[0020] Figure 3 is Figure 1 the echo loss curve of the signal interconnection module in.

[0021] Each label in the figure represents:

[0022] 0 housing, 1 power supply module, 2 local oscillator module, 3 AGC module, 4 RF module, 5 secondary power supply module, 6 signal interconnection module;

[0023] a base plate, b pull-up bar. SPECIFIC EMBODIMENTS

[0024] The invention is not limited to the following specific embodiments, and all equivalent transformations made on the basis of the technical solution of the present application fall within the protection scope of the present invention.

[0025] It should be noted that the directional terms mentioned in this article are all consistent with the specific directions on the paper surface in the specification drawings or the corresponding directions in the space shown in the drawings; all components and devices in the present invention, unless otherwise specified, all adopt the components and devices known in the prior art.

[0026] Embodiment

[0027] The present embodiment discloses a three-dimensional splicing structure of a millimeter wave receiving front end, including a bottom plate a and an upper pull bar b, and also including a power module 1, a local oscillator module 2, an AGC module 3 and a radio frequency module 4 which are limited and fixed between the bottom plate a and the upper pull bar b, the power module 1 is electrically connected to the local oscillator module 2, the AGC module 3 and the radio frequency module 4, and the local oscillator module 2 and the AGC module 3 and the radio frequency module 4 are all signal connected; it also includes a secondary power supply module 5 arranged on one side of the power module 1, the local oscillator module 2, the AGC module 3 and the radio frequency module 4, the secondary power supply module 5 matches the power module 1, the local oscillator module 2, the AGC module 3 and the radio frequency module 4 in structure and is all electrically connected; it also includes a signal interconnection module 6 arranged on the other side of the power module 1, the local oscillator module 2, the AGC module 3 and the radio frequency module 4, the signal interconnection module 6 is electrically connected to the power module 1, and the signal interconnection module 6 is signal connected to the local oscillator module 2, the AGC module 3 and the radio frequency module 4;

[0028] Its functions are as follows: the RF module 4 realizes the frequency conversion and amplification functions of the RF signal, the local oscillator module 2 adopts a comb spectrum generating circuit and a phase-locked frequency multiplication circuit to provide the RF module with the local oscillator signal required for frequency conversion, the AGC module 3 is used to stabilize the output level of the signal after frequency conversion to a constant value required by the system, and the power supply module provides secondary power for each module of the millimeter wave receiving front end; each module is limited and fixed between the bottom plate a and the upper pull bar b, and the secondary power supply module 5 is inserted from the side into the four modules of the power supply module 1, the local oscillator module 2, the AGC module 3 and the RF module 4, which plays the role of fastening and interconnecting the power supply motherboard and the side. When a module needs to be replaced, it only needs to loosen the fastening screws and unplug the secondary power supply module 6 to take out the module to be replaced; the signal interconnection module 6 is used to transmit the local oscillator signal to the RF module, and at the same time, the structural parts of the signal interconnection module can be used as a connecting and fixing device to fix the local oscillator module, the AGC module and the RF module together;

[0029] The plug-in design of the present invention makes the structural design miniaturized, can save or shorten the interconnection cables between modules and components, simplify the interconnection between the modules of the receiving front end, greatly improve the integration of the product, greatly reduce the complexity of the receiving front end design, simplify the product electrical installation steps, and facilitate large-scale production; at the same time, it further reduces the volume and weight, from the existing 1.5Kg to 0.6kg, and the volume is reduced to about 30% of the original design.

[0030] At the same time, the structure of the present invention also meets the high sensitivity of electromagnetic signal reception in the millimeter wave frequency band, and puts forward requirements such as lower noise coefficient, greater power gain and wider frequency bandwidth for the receiving front end. Figure 2 This is the gain change curve of the millimeter wave receiving front end from -25℃ to +60℃, such as Figure 3Through simulation design, the signal interconnection module 6 has a return loss of less than -20 dB below 35 GHz and an insertion loss of less than 0.5 dB, which can well meet the application requirements.

[0031] In the secondary power supply module 5 disclosed in this embodiment, not only power is provided for each module, but also a gain temperature compensation circuit composed of a second-order resistor network is integrated, which can ensure that the gain change of the millimeter-wave receiving front end does not exceed 1 dB in the range of -25°C to +60°C.

[0032] The signal interconnection module 6 disclosed in this embodiment uses an aluminum housing with a silver plating on the surface, and a 50-ohm microstrip line designed with a 6002 high-frequency microwave substrate is used as the transmission path of the local oscillator signal. The microstrip line is bonded to the aluminum housing of the signal interconnection module using conductive adhesive, and can cover the local oscillator signal in the frequency band from DC to 35 GHz. While transmitting the local oscillator signal, the housing of the signal interconnection module connects the radio frequency module, the local oscillator module, and the AGC module together through screws, and also plays a role in fastening the combined structure of the receiving front end.

[0033] On the side of the power supply module 1, the local oscillator module 2, the AGC module 3, and the radio frequency module 4 close to the secondary power supply module 5, a micro-distance low-frequency socket is connected. Four mating plugs are connected between the micro-distance low-frequency socket and the secondary power supply module 5, which can achieve the ability of quick plugging and unplugging replacement. The model of the mating plug is J30J IA-13TJN31, one end of which is welded to the PCB board inside the secondary power supply module 5, and the other end of the plug can be directly disassembled and installed with the micro-distance low-frequency socket J30JMI-13ZKS19 of the power supply module 1, the local oscillator module 2, the AGC module 3, and the radio frequency module 4. After installation, the combined five structures are fastened with the nuts reserved on the housing and PCB of the secondary power supply module 5.

[0034] Both sides of the power supply module 1, the local oscillator module 2, the AGC module 3, and the radio frequency module 4 are fixed to the secondary power supply module 5 and the signal interconnection module 6 through fixed shafts. The fixed shafts in this embodiment can be selected as screws or bolts.

[0035] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept scope of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

[0036] In addition, it should be noted that, in the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination methods.

[0037] In addition, any combination can be made among the various different embodiments disclosed in this solution, as long as it does not violate the idea of this disclosure, and it should equally be regarded as the content invented by this disclosure.

Claims

1. A three-dimensional splicing structure of a millimeter wave receiving front end, characterized in that: It comprises a bottom plate (a) and an upper pull bar (b), and also comprises a power module (1), a local oscillator module (2), an AGC module (3) and a radio frequency module (4) which are fixed between the bottom plate (a) and the upper pull bar (b); the power module (1) is electrically connected to the local oscillator module (2), the AGC module (3) and the radio frequency module (4); the local oscillator module (2) is signal connected to the AGC module (3) and the AGC module (3) is signal connected to the radio frequency module (4); It also includes a secondary power supply module (5) arranged on one side of the power supply module (1), the local oscillator module (2), the AGC module (3) and the radio frequency module (4); the secondary power supply module (5) is structurally matched with the power supply module (1), the local oscillator module (2), the AGC module (3) and the radio frequency module (4), and they are all electrically connected; It also comprises a signal interconnection module (6) arranged on the other side of the power module (1), the local oscillator module (2), the AGC module (3) and the radio frequency module (4); the signal interconnection module (6) is electrically connected to the power module (1), and the signal interconnection module (6) is signal-connected to the local oscillator module (2), the AGC module (3) and the radio frequency module (4).

2. The three-dimensional splicing structure of the millimeter wave receiving front end according to claim 1, characterized in that: The power module (1), the local oscillator module (2), the AGC module (3) and the radio frequency module (4) are connected to a macro low-frequency socket on one side close to the secondary power supply module (5), and four plug-in connectors are connected between the macro low-frequency socket and the secondary power supply module (5).

3. The three-dimensional splicing structure of the millimeter wave receiving front end according to claim 2, characterized in that: The model of the macro low-frequency socket is J30JMI-13ZKS19, and the model of the mating plug is J30JIA-13TJN31.

4. The three-dimensional splicing structure of the millimeter wave receiving front end according to any one of claims 1 to 3, characterized in that: Both sides of the power module (1), the local oscillator module (2), the AGC module (3) and the radio frequency module (4) are respectively fixed to the secondary power supply module (5) and the signal interconnection module (6) via fixed shafts.

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