Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a second circuit board, a supporting piece and an electric connection assembly. The first circuit board and the second circuit board are stacked and arranged at an interval, and the first circuit board and the second circuit board are electrically connected through the electric connection assembly. The supporting piece is arranged between the first circuit board and the second circuit board and welded to the first circuit board and the second circuit board. In this way, an electric connection structure for electrically connecting the first circuit board and the second circuit board does not need to be arranged in the supporting piece, the supporting piece can be made to be small, meanwhile, the electric connection assembly can adopt a part with a small structure, the size of the supporting piece can be reduced, more installation space can be reserved for electronic components, and the installation cost is reduced. Therefore, the space utilization rate of the first circuit board and the second circuit board can be improved to a certain extent.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] In recent years, with the continuous improvement of the performance of electronic devices such as mobile phones, the camera module has been continuously enlarged, the battery has become larger, and the layout space of the mobile phone motherboard has become increasingly tense. In order to make full use of the motherboard layout space, the currently common solution is to increase the layout area by adding a sandwich or four-layer structure of a frame board and a daughter board on the motherboard. However, using the above method will cause problems such as low space utilization rate of the motherboard. Summary of the Invention

[0003] This application provides a circuit board assembly and an electronic device, which improves the problem of low space utilization rate of the existing motherboard.

[0004] To achieve the above object, this application adopts the following technical solutions:

[0005] In a first aspect, a circuit board assembly is provided. The circuit board assembly includes a first circuit board, a second circuit board, a support member, and an electrical connection component. The first circuit board and the second circuit board are stacked and spaced apart, and the first circuit board and the second circuit board are electrically connected through the electrical connection component. The support member is disposed between the first circuit board and the second circuit board. In this way, there is no need to provide an electrical connection structure for electrically connecting the first circuit board and the second circuit board in the support member. First, the support member can be made smaller; second, the connection reliability requirements between the support member and the first circuit board and the second circuit board are reduced, and fasteners and the dimensions for providing mounting holes for the fasteners can be omitted; third, the communication points of the first circuit board and the second circuit board do not need to be dispersed on the support member and can be concentrated together, so that the electrical connection component 4 can adopt smaller components. In this way, both the volume of the support member can be reduced, and more installation space can be reserved for electronic components, thereby improving the space utilization rate of the first circuit board and the second circuit board to a certain extent.

[0006] In some embodiments, a first shielding cover is provided on a surface of the second circuit board facing away from the first circuit board. The first shielding cover is soldered to the second circuit board through a high-temperature solder paste, and the support member is soldered to the second circuit board through a low-temperature solder paste. In this way, the flatness of the secondary soldering surface of the second circuit board (i.e., the two board surfaces of the second circuit board) can meet the requirements, and the soldering effects of the second circuit board with the first shielding cover and the support member are both good.

[0007] In some embodiments, the support member is disposed around at least part of the space between the first circuit board and the second circuit board, and the electrical connection component is located outside the space surrounded by the support member. This can enable the support member to have a good supporting effect on different regions of the second circuit board, and the electrical connection component is located outside the space surrounded by the support member, facilitating the installation and disassembly of the electrical connection component.

[0008] In some embodiments, at least part of the support member is made of a shielding material, and the support member, the first circuit board, and the second circuit board enclose a shielding space. This can enable the support member and the first circuit board and the second circuit board to form a sealed cavity to shield the electronic components installed between the first circuit board and the second circuit board, so that the electronic components installed between the first circuit board and the second circuit board do not have electromagnetic interference with the electronic components installed in other regions, making the function of the circuit board assembly stable.

[0009] In some embodiments, the support member is provided with a strengthening structure for strengthening the mechanical strength of the support member. This can improve the mechanical strength of the support member to a certain extent so that the supporting strength of the support member can meet the usage requirements.

[0010] In some embodiments, the strengthening structure connects at least two side walls of the support member, and the strengthening structure is disposed in contact with the first circuit board or the second circuit board. This can reduce the risk of collapse of the part of the first circuit board and / or the second circuit board in contact with the strengthening structure during use.

[0011] In some embodiments, the strengthening structure includes a first connecting member, a second connecting member, and a third connecting member. The first connecting member connects the first side wall and the second side wall of the support member disposed opposite to each other in the first direction, the second connecting member connects the first connecting member and the third side wall of the support member disposed at an angle to the first side wall, and the third connecting member connects the first connecting member and the fourth side wall of the support member disposed opposite to the third side wall. With this structure of the strengthening structure, the structure is simple, and the connection of two sets of opposite side walls can be realized, making the overall structure of the support member stable.

[0012] In some embodiments, the second connecting member and the third connecting member are arranged in a staggered manner. This can enable the arrangement of the second connecting member and the third connecting member to be determined according to the layout of the electronic components without the need for symmetric arrangement.

[0013] In some embodiments, the electrical connection component includes a flexible connector, and the flexible connector is electrically connected to the first circuit board and the second circuit board respectively. Thus, during installation, the flexible connector can be bent arbitrarily according to the installation environment, thereby improving the convenience of installing the electrical connection component to a certain extent.

[0014] In some embodiments, the flexible connector is electrically connected to the first circuit board and / or the second circuit board by welding. This can make the installation method of the flexible connector simple and the number of components required for the circuit board assembly small.

[0015] In some embodiments, the electrical connection assembly further includes a first connector, the first connector is fixedly installed on the first circuit board, and the flexible connector is electrically connected to the first circuit board through the first connector. This facilitates the connection between the flexible connector and the first circuit board and can improve the assembly efficiency of the electrical connection assembly and the first circuit board to a certain extent.

[0016] In some embodiments, the electrical connection assembly further includes a second connector, the second connector is fixedly installed on the second circuit board, and the flexible connector is electrically connected to the second circuit board through the second connector. This facilitates the connection between the flexible connector and the second circuit board and can improve the assembly efficiency of the electrical connection assembly and the second circuit board to a certain extent.

[0017] In some embodiments, the area of the figure enclosed by the outer contour of the second circuit board is larger than the area of the figure enclosed by the outer contour of the support member. The outer walls of the second circuit board, the first circuit board, and the support member enclose a first accommodation space communicating with the external space, providing an installation space for the corresponding structures or electronic components installed on the first circuit board and located on one side of the shielding space, thereby realizing the rational utilization of the component layout space of the first circuit board.

[0018] In some embodiments, the circuit board assembly further includes a first electronic component, the first electronic component is installed on the first circuit board, and at least part of the first electronic component is located in the first accommodation space. The first electronic component is generally a passive device, and at least part of its height is less than the height of the gap between the first circuit board and the second circuit board and can be inserted into the first accommodation space. By adopting this solution, the rational utilization of the component layout area of the first circuit board can be realized.

[0019] In some embodiments, the area of the figure enclosed by the outer contour of the second circuit board is smaller than the area of the figure enclosed by the outer contour of the support member. The side wall of the second circuit board and the side of the support member facing away from the first circuit board enclose a second accommodation space communicating with the external space. The setting of the second accommodation space facilitates more flexible use of the space on the circuit board assembly to avoid other devices such as NFC (Near Field Communication) devices. In this solution, the structure of the support member is as shown in the figure. The part of the support member covered by the second circuit board can be provided with a hollow, and the other parts are of a continuous structure. In this way, the shielding effect of the closed space enclosed by the support member, the first circuit board, and the second circuit board can be better, and the weight of the support member can be smaller, and the space occupied by the support member in the shielding space is smaller, so that the second circuit board can have a larger component layout space.

[0020] In some embodiments, the circuit board assembly further includes a second electronic component. The second electronic component is electrically connected to the first circuit board through a first electrical connector, and at least a part of the second electronic component is located in the second accommodation space. This can achieve the stacked arrangement of the second electronic component and the support member, reduce the occupation of the layout area of the first circuit board, and is beneficial to the miniaturized design of the circuit board assembly.

[0021] In some embodiments, the first electrical connector includes a flexible connector. The flexible connector can be directly soldered to the first circuit board or electrically connected to the first circuit board through a connector. This enables the first electrical connector to be bent arbitrarily according to the positions of the second electronic component and the first circuit board, thereby improving the convenience of connecting the second electronic component and the first circuit board.

[0022] In some embodiments, the second electronic component includes a near-field communication device, which enables the circuit board assembly to have a short-distance high-frequency wireless communication function.

[0023] In some embodiments, the circuit board assembly further includes a second shielding cover mounted on the first circuit board, and the second shielding cover is located on one side of the support member. This can enable the installation of active electronic components on the first circuit board to be unrestricted by the size and installation position of the support member, making the functions of the circuit board assembly more comprehensive.

[0024] In some embodiments, a support platform is formed by the part of the second shielding cover facing away from the first circuit board and the part of the support member facing away from the first circuit board that extends beyond the second circuit board. When the size of the second electronic component is relatively large, in addition to the part of the support member that extends beyond the second circuit board, support can also be achieved through the second shielding cover, so that different regions of the second electronic component can be stably supported.

[0025] In some embodiments, a first avoidance structure is provided on the second circuit board and penetrates the second circuit board along the thickness direction of the second circuit board. The provision of the first avoidance structure enables electronic components located outside the circuit board assembly to occupy a part of the area of the second circuit board, making the circuit board assembly more widely applicable.

[0026] In some embodiments, the circuit board assembly further includes a third electronic component. The third electronic component is located in the first avoidance structure and is electrically connected to the second circuit board through an electrical connector. The third electronic component can adopt a device with a relatively large thickness, which can reduce the overall height of the circuit board assembly and facilitate the miniaturized design of the circuit board assembly.

[0027] In some embodiments, the second electrical connector includes a flexible connector. The flexible connector can be directly soldered to the second circuit board or electrically connected to the second circuit board through a connector. This enables the second electrical connector to be bent arbitrarily according to the positions of the third electronic component and the second circuit board, thereby improving the convenience of connecting the third electronic component to the second circuit board.

[0028] In some embodiments, the third electronic component includes a camera module, which can enable the circuit board assembly to have a camera function to be applicable to more application scenarios.

[0029] In some embodiments, the support member includes a main body portion and a branch portion. The main body portion is disposed around at least part of the space between the first circuit board and the second circuit board, and the branch portion closes the opening of the first avoidance structure facing the first circuit board. In this way, even if the first avoidance structure is provided, it will not have an adverse effect on the shielding effect of the shielding space.

[0030] In some embodiments, the branch portion is connected to the main body portion through an intermediate connection portion. This can make the support member an integral whole, enabling overall movement and installation, and can make the support member have a better supporting effect on the second circuit board.

[0031] In some embodiments, there are multiple intermediate connection portions and they are disposed around the branch portion. This can enable different regions of the branch portion to be stably connected to the main body portion, making the overall structure of the support member stable and having a better supporting effect on the second circuit board.

[0032] In some embodiments, the support member includes a first connection portion connected to the surface of the first circuit board, a second connection portion connected to the surface of the second circuit board, and a third connection portion connecting the first connection portion and the second connection portion. This can make the contact area between the support member and the first circuit board and the second circuit board larger, making the connection between the support member and the first circuit board and the second circuit board stable.

[0033] In some embodiments, the first circuit board is provided with a second avoidance structure penetrating itself in the thickness direction, and the second avoidance structure is used for the electronic component installed on the side of the second circuit board facing the first circuit board to pass through. The provision of the second avoidance structure can enable the size of the fourth electronic component located on the side of the second circuit board facing the first circuit board to be unrestricted by the space height between the first circuit board and the second circuit board, making the circuit board assembly more widely applicable.

[0034] In some embodiments, a fourth electronic component is provided on one side of the second circuit board facing the first circuit board. The thickness of the fourth electronic component is greater than the height of the gap between the second circuit board and the first circuit board, and the fourth electronic component extends to the side of the first circuit board away from the second circuit board through the second avoidance structure. The fourth electronic component can be an electronic component with a relatively large thickness, such as a camera module, a motor, a speaker, etc. This can make the overall thickness of the circuit board assembly smaller and the functions more comprehensive.

[0035] In some embodiments, the first circuit board is the main board and the second circuit board is the secondary board. This can make full use of the layout space of the main board, increase the layout area of the main body, and is beneficial to the miniaturization design of the electronic device.

[0036] In some embodiments, the support member is a thin-walled structure, which can make the volume of the support member smaller, occupy less space, and have a larger shielding space, so that more electronic components can be installed in the shielding space, which is beneficial to the miniaturization design of the electronic device.

[0037] In some embodiments, the support member is an integrally formed structure and is a metal part. This makes the structure of the support member stable and has good mechanical strength.

[0038] In a second aspect, an electronic device is provided, including the circuit board assembly in each of the above embodiments. This electronic device can, to a certain extent, reduce the manufacturing cost and improve the space utilization rate of the circuit boards in the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic cross-sectional structure diagram of a circuit board assembly in the related art;

[0040] Figure 2 is a schematic partial structure diagram of an electronic device in the related art;

[0041] Figure 3 is a schematic side view structure diagram of an electronic device in the related art;

[0042] Figure 4 is a schematic structure diagram of a circuit board assembly provided in an embodiment of the present application;

[0043] Figure 5 is Figure 4 a schematic front view structure diagram of the circuit board assembly shown;

[0044] Figure 6 is Figure 5 a cross-sectional view of a partial structure shown along Figure 5 line A-A in;

[0045] Figure 7 is Figure 6 a partial enlarged schematic diagram at position A in;

[0046] Figure 8 It is a schematic diagram of a partial cross-sectional structure of a circuit board assembly provided in an embodiment of the present application;

[0047] Figure 9 It is a schematic diagram of a partial cross-sectional structure of a circuit board assembly provided in another embodiment of the present application;

[0048] Figure 10 It is a schematic diagram of a partial cross-sectional structure of a circuit board assembly provided in another embodiment of the present application;

[0049] Figure 11 It is a schematic diagram of a support member in a circuit board assembly provided in another embodiment of the present application;

[0050] Figure 12 It is a schematic diagram of a cross-sectional structure of a circuit board assembly provided in another embodiment of the present application;

[0051] Figure 13 It is a schematic diagram of a circuit board assembly provided in another embodiment of the present application;

[0052] Figure 14 is Figure 13 a schematic diagram of the support member in;

[0053] Figure 15 It is a schematic diagram of a circuit board assembly provided in another embodiment of the present application;

[0054] Figure 16 is Figure 15 a partial schematic diagram of a circuit board assembly provided, and the second circuit board is not shown in the figure;

[0055] Figure 17 It is a schematic diagram of a cross-sectional structure of a circuit board assembly provided in another embodiment of the present application.

[0056] Explanation of reference numerals:

[0057] 100’, main board; 200’, sub-board; 300’, frame board; 400’, electronic component; 500’, shielding cover; 600’, screw;

[0058] 10, support device; 20, battery; 30, circuit board assembly; 40, screen assembly;

[0059] 100, First circuit board; 110, Second avoidance structure; 200, Second circuit board; 210, First avoidance structure; 300, Support member; 310, Main body portion; 320, Branch portion; 330, First connection portion; 340, Second connection portion; 350, Third connection portion; 360, Third avoidance structure; 370, Intermediate connection portion; 400, Electrical connection assembly; 410, Flexible connector; 420, First connector; 430, Second connector; 500, First shielding cover; 510, High-temperature solder paste; 520, Low-temperature solder paste; 600, Second shielding cover; 700, First electronic component; 710, Second electronic component; 720, Third electronic component; 730, Fourth electronic component; 740, First electrical connection member; 750, Second electrical connection member; 800, Shielding space; 801, First accommodation space; 802, Second accommodation space; 900, Reinforcement structure; 910, First connection member; 920, Second connection member; 930, Third connection member. Detailed implementation manners

[0060] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application, but should not be construed as limiting the present application.

[0061] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

[0062] For the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. For example, the first limiting portion and the second limiting portion are only used to distinguish different limiting portions, and do not limit their sequence. Those skilled in the art can understand that the terms "first", "second", etc. do not limit the quantity and execution order, and the terms "first", "second", etc. do not necessarily limit differences.

[0063] It should be noted that in this application, words such as "in one embodiment" or "for example" are used to give examples, illustrations or explanations. Any embodiment or design described as "in one embodiment" or "for example" in this application should not be construed as being more preferred or having more advantages than other embodiments or designs. Rather, the use of words such as "in one embodiment" or "for example" is intended to present relevant concepts in a specific manner.

[0064] In this application, unless otherwise clearly specified and defined, terms such as "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0065] In order to make the purpose, technical solutions and advantages of this application more clear, the following further details this application in conjunction with the accompanying drawings and embodiments.

[0066] In recent years, with the continuous improvement of the performance of electronic devices such as mobile phones, the camera module has been continuously enlarged and the battery has become larger and larger, and the layout space of the main board of the electronic device has become increasingly tense. As Figure 1 shown, in the related art, in order to make full use of the layout space of the main board 100', the common solution is to add a sandwich structure or a four-layer structure of a frame board 300' and a sub-board 200' on the main board 100' to increase the layout area of the main board 100'. Among them, the structure in which one of the circuit boards of the main board 100' and the sub-board 200' is single-sidedly populated is called a sandwich structure, as Figure 1 shown; the structure in which both the main board 100' and the sub-board 200' are double-sidedly populated is called a four-layer structure.

[0067] In the above scheme, the main board 100' and the sub-board 200' are usually welded and fixed by the frame board 300', wherein the frame board 300', the main board 100' and the sub-board 200' form a closed cavity to achieve a shielding effect, and the main board 100' and the sub-board 200' are fixed and communicated through the welding points on the frame board 300'. However, the processing cost of the frame board 300' using this scheme is relatively high, and in order to ensure the communication between the sub-board 200' and the main board 100', the welding reliability of the frame board 300' is relatively high. Generally, screws 600' are added around the frame board 300' to lock the three boards of the main board 100', the sub-board 200' and the frame board 300' together, and it is also necessary to increase the welding area of ​​the frame board 300' to ensure the reliability of welding, which causes a lot of area waste, the space utilization rate of the main board 100' is not very high, and the production cost is high.

[0068] To improve the above problems, an embodiment of the present application provides a circuit board assembly, which includes a first circuit board, a second circuit board, a support member, and an electrical connection assembly. The first circuit board and the second circuit board are stacked and spaced apart. The first circuit board and the second circuit board are electrically connected through the electrical connection assembly. The support member is disposed between the first circuit board and the second circuit board, and is welded to the first circuit board and the second circuit board, respectively. In this way, there is no need to provide an electrical connection structure that electrically connects the first circuit board and the second circuit board in the support member, so that the support member can be made smaller, and the electrical connection assembly can use components with smaller structures, which can not only reduce the volume of the support member, but also reserve more installation space for electronic components, thereby improving the space utilization of the first circuit board and the second circuit board to a certain extent.

[0069] The above-mentioned circuit board assembly can be used in electronic devices, and the above-mentioned electronic devices can be smart watches, mobile phones, laptop computers, etc.

[0070] For ease of explanation and understanding, the following description takes a mobile phone as an example of an electronic device.

[0071] like Figure 2 and Figure 3 As shown, the mobile phone generally includes a support device 10, and a battery 20, a circuit board assembly 30, and a screen assembly 40, etc., which are all arranged on the support device 10. Among them, the support device 10 may include one or more frames. When the support device 10 includes multiple frames, two adjacent frames can be rotatably connected to the same shaft cover through a shaft structure. The ends of the two adjacent frames close to the shaft structure can rotate around the shaft structure, so that the ends of the two frames away from the shaft structure can be relatively close or relatively away, so that the mobile phone can present different states such as folding or unfolding accordingly.

[0072] The screen component 40 generally covers one side of the support device 10 and can be a flexible screen or a rigid screen, which can be determined according to specific usage requirements. For example, when the support device 10 includes multiple frames and can present different states such as folding or unfolding, the screen component 40 can be a flexible screen, so that when the state of the support device 10 changes, the shape of the screen component 40 can also fold or unfold accordingly with the change in the position between adjacent frames; when the support device 10 includes only one frame, the screen component 40 can be a rigid screen.

[0073] The number of batteries 20 can be determined according to usage needs. For example, one or more batteries 20 can be provided on each frame. The batteries 20 and the screen component 40 are generally electrically connected to the circuit board assembly 30 to ensure the normal operation of the electronic device.

[0074] The circuit board assembly generally includes multiple circuit boards and electronic components provided on each circuit board. Generally, electronic components are provided on each circuit board, and the type and number of electronic components can be determined according to the usage needs of the electronic device.

[0075] Please refer to Figure 4 As shown, an embodiment of the present application provides a circuit board assembly 30. The circuit board assembly 30 includes a first circuit board 100, a second circuit board 200, a support 300, and an electrical connection assembly 400. The first circuit board 100 and the second circuit board 200 are stacked and spaced apart. The first circuit board 100 and the second circuit board 200 are electrically connected through the electrical connection assembly 400. The support 300 is disposed between the first circuit board 100 and the second circuit board 200.

[0076] In this embodiment, electronic components can be installed on both the first circuit board 100 and the second circuit board 200. Electronic components can be installed on only one surface of the first circuit board 100 and one surface of the second circuit board 200, or electronic components can be installed on both surfaces of the first circuit board 100 and / or both surfaces of the second circuit board 200, which can be specifically selected according to usage needs. It can be understood that when electronic components are installed on both surfaces of the first circuit board 100 and both surfaces of the second circuit board 200, the electronic components located on the surface of the first circuit board 100 facing the second circuit board 200 and the electronic components located on the surface of the second circuit board 200 facing the first circuit board 100 need to be arranged in a staggered manner so that the interval between the first circuit board 100 and the second circuit board 200 does not need to be too large.

[0077] The support member 300 can be an integrally formed structure or a split structure. When the support member 300 is an integrally formed structure, it can be a metal part. When the support member 300 is a split structure, the parts of the support member 300 used to connect to the first circuit board 100 and the second circuit board 200 can be metal components, and the other parts can be non-metal components; or the support member 300 is composed of multiple components made of the same material. For example, the support member 300 has two parts with the same structure, which are respectively arranged on both sides of the second circuit board 200, or the support member 300 has more than three components, which are arranged around the space interval between the first circuit board 100 and the second circuit board 200. Specifically, it can be selected according to the usage needs and is not uniquely limited here.

[0078] The support member 300 can be welded to the first circuit board 100 and the second circuit board 200 respectively, or can be connected to the first circuit board 100 and the second circuit board 200 respectively by means of gluing, clamping, etc., specifically depending on the usage needs.

[0079] The electrical connection component 400 can be composed of one component, such as a metal part, a wire, etc. that are welded to the first circuit board 100 and the second circuit board 200 respectively, or can be composed of multiple components. For example, the electrical connection component 400 can include connectors mounted on the first circuit board 100 and the second circuit board 200, and electrical connection members connecting the two connectors. The above electrical connection members can be metal parts, wires, etc.

[0080] The circuit board assembly 30 provided by the embodiment of the present application is provided with a support member 300 that supports and connects the first circuit board 100 and the second circuit board 200, and an electrical connection component 400 that electrically connects the first circuit board 100 and the second circuit board 200. In this way, there is no need to provide an electrical connection structure in the support member 300 that electrically connects the first circuit board 100 and the second circuit board 200. On the one hand, the support member 300 can be made smaller; on the other hand, the connection reliability requirements between the support member 300 and the first circuit board 100 and the second circuit board 200 are reduced, and fasteners and the dimensions for providing mounting holes for the fasteners can be omitted; on the third hand, the communication points of the first circuit board 100 and the second circuit board 200 do not need to be dispersed on the support member 300 and can be concentrated together, so that the electrical connection component 400 can adopt components with a smaller structure. In this way, both the volume of the support member 300 can be reduced, and more installation space can be reserved for electronic components, thereby improving the space utilization rate of the first circuit board 100 and the second circuit board 200 to a certain extent.

[0081] In some embodiments, such as Figure 4 and Figure 5As shown, at least one electronic component and a first shielding cover 500 are provided on the side of the second circuit board 200 facing away from the first circuit board 100, and at least one of the electronic components provided on the side of the second circuit board 200 facing away from the first circuit board 100 is an active device, and the first shielding cover 500 covers the active device therein. The first shielding cover 500 is generally welded to the second circuit board 200. Also, since the side of the second circuit board 200 facing the first circuit board 100 needs to be welded to the support member 300, metal parts are welded to both opposite surfaces of the second circuit board 200. In order to ensure good welding effects between the second circuit board 200, the first shielding cover 500, and the support member 300, and the flatness meets the preset requirements, as Figure 6 and Figure 7 shown, the first shielding cover 500 is welded to the second circuit board 200 through a high-temperature solder paste 510, and the support member 300 is welded to the second circuit board 200 through a low-temperature solder paste 520. Among them, the low-temperature solder paste 520 refers to a solder paste whose welding temperature is lower than the melting temperature of the solder paste, such as bismuth-based solder paste, indium-based solder paste, etc.; the high-temperature solder paste 510 refers to a solder paste whose welding temperature is lower than the melting temperature of the solder paste, such as Sn96 solder paste, etc. By adopting the solution provided in this embodiment, the flatness of the secondary welding surfaces (i.e., the two surfaces of the second circuit board 200) of the second circuit board 200 can meet the requirements, and the welding effects between the second circuit board 200, the first shielding cover 500, and the support member 300 can be good.

[0082] As described above, the support member 300 can be arranged in various ways. In order to enable the support member 300 to stably support the second circuit board 200, in some embodiments, as Figure 6 shown, the support member 300 is arranged to surround at least part of the space between the first circuit board 100 and the second circuit board 200. The electrical connection component 400 is located outside the space surrounded by the support member 300.

[0083] The support member 300 is arranged to surround at least part of the space between the first circuit board 100 and the second circuit board 200, which means that the support member 300 can select a larger-sized body according to the usage needs and be arranged around the outer periphery of the space between the first circuit board 100 and the second circuit board 200. In this way, the formed shielding space 800 can also select a smaller-sized body and be arranged around a part of the space between the first circuit board 100 and the second circuit board 200.

[0084] By installing the support member 300 in the manner provided in this embodiment, the support effect of the support member 300 on different regions of the second circuit board 200 can be good, and the electrical connection component 400 is located outside the space surrounded by the support member 300, which is convenient for the installation and disassembly of the electrical connection component 400.

[0085] In addition to the supporting function, the above-mentioned support member 300 can also be added with other functions according to the usage requirements to improve the functionality of the support member 300 and make the structure of the circuit board assembly more compact. For example, Figure 6 As shown, in some embodiments, at least a part of the support member 300 is made of a shielding material, and the support member 300 and the first circuit board 100 and the second circuit board 200 enclose a shielding space 800.

[0086] The shielding material is a material capable of shielding electromagnetic signals, such as conductive copper foil, conductive foam, conductive gasket, conductive cloth, etc.

[0087] By adopting the solution provided in this embodiment, the support member 300 and the first circuit board 100 and the second circuit board 200 can form a sealed cavity to shield the electronic components installed between the first circuit board 100 and the second circuit board 200, so that there is no electromagnetic interference between the electronic components installed between the first circuit board 100 and the second circuit board 200 and the electronic components installed in other areas, and the function of the circuit board assembly 30 is stable.

[0088] On the basis of the above-mentioned embodiments, in order to further increase the layout space of the first circuit board and the second circuit board, for example, Figure 7 As shown, in some embodiments, the support member 300 is a thin-walled structure. In this way, the volume of the support member 300 can be smaller, the occupied space is smaller, the shielding space 800 is larger, and more electronic components can be installed in the shielding space 800, which is beneficial to the miniaturization design of the electronic device.

[0089] The above-mentioned electrical connection component 400 has various setting methods. In some embodiments, the electrical connection component 400 may include a plurality of rigid connectors. In other embodiments, for example, Figure 8 As shown, the electrical connection component 400 may include a flexible connector 410. The flexible connector 410 is electrically connected to the first circuit board 100 and the second circuit board 200 respectively. The flexible connector 410 may be a flexible metal part, a flexible cable, or other flexible electrical connection parts. By adopting the structure provided in this embodiment, the electrical connection component 400 can be bent randomly according to the installation environment during installation, so that the installation convenience of the electrical connection component 400 can be improved to a certain extent.

[0090] The above flexible connector 410 can be directly electrically connected to the first circuit board 100 and / or the second circuit board 200, or can be electrically connected to the first circuit board 100 and / or the second circuit board 200 through a connector, as long as it can increase the layout area of the first circuit board 100 and the second circuit board 200. That is, there are three ways for the flexible connector 410 to be electrically connected to the first circuit board 100 and the second circuit board 200: First, both ends of the flexible connector 410 are directly electrically connected to the first circuit board 100 and the second circuit board 200 respectively, as shown in Figure 8 ; Second, one end of the flexible connector 410 is directly electrically connected to one of the first circuit board 100 and the second circuit board 200, and the other end is electrically connected to the other circuit board of the first circuit board 100 and the second circuit board 200 through a connector, as shown in Figure 9 ; Third, both ends of the flexible connector 410 are electrically connected to the first circuit board 100 and the second circuit board 200 through connectors respectively, as shown in Figure 10 .

[0091] When the flexible connector 410 is directly connected to the first circuit board 100 and / or the second circuit board 200, the flexible connector 410 can be electrically connected to the first circuit board 100 and / or the second circuit board 200 by welding. For example, the flexible connector 410 can adopt an FPC (Free Pascal Compiler, flexible circuit board) connector and can be directly welded to the first circuit board 100 and / or the second circuit board 200 by using a FOB (FPC on Board, referring to the welding technology that combines soft and hard boards) laser welding method. This can make the installation method of the flexible connector 410 simple and the number of components required for the circuit board assembly 30 small.

[0092] When the flexible connector 410 is electrically connected to the first circuit board 100 and / or the second circuit board 200 through a connector, a first connector 420 can be installed on the first circuit board 100 such that the flexible connector 410 is electrically connected to the first circuit board 100 through the first connector 420; a second connector 430 can also be installed on the second circuit board 200 such that the flexible connector 410 is electrically connected to the second circuit board 200 through the second connector 430. This facilitates the connection of the flexible connector 410 to the first circuit board 100 and / or the second circuit board 200 and can improve the assembly efficiency to a certain extent. The structures of the above-mentioned first connector 420 and second connector 430 can be the same or different, which can be determined according to specific usage requirements. In some embodiments, both the first connector 420 and the second connector 430 are BTB (Board-to-Board) connectors. The above-mentioned board-to-board connectors can adopt connectors such as ZIF (Zero Insertion Force), which can be selected according to specific usage needs. The BTB connector has excellent electrical performance, mechanical performance, and environmental performance.

[0093] As Figure 11 shown, in some embodiments, the support member 300 includes a first connection portion 330 that is surface-connected to the first circuit board 100, a second connection portion 340 that is surface-connected to the second circuit board 200, and a third connection portion 350 that connects the first connection portion 330 and the second connection portion 340.

[0094] This can make the contact area between the support member 300 and the first circuit board 100 and the second circuit board 200 larger, making the connection between the support member 300 and the first circuit board 100 and the second circuit board 200 stable.

[0095] To make the structure of the support member 300 stable and have good mechanical strength, the support member 300 can be an integrally formed structure and a metal part. In this way, the first circuit board 100 and the second circuit board 200 are fixed by welding with the metal part. Compared with the two being fixed by the frame board 300', the reliability of the connection structure between the first circuit board 100 and the second circuit board 200 can be improved to a certain extent, the utilization rate of the layout area of the first circuit board 100 and the second circuit board 200 can be increased, and the manufacturing cost of the circuit board assembly 30 can be reduced to a certain extent.

[0096] On the basis of the above embodiments, to make the shielding effect of the shielding space formed by the support member 300 and the first circuit board 100 and the second circuit board 200 better, in some embodiments, the support member 300 is welded to the first circuit board 100 and the second circuit board 200 respectively.

[0097] In some embodiments, the support member may be a stainless-steel shielding frame or a cupronickel shielding cover, which is used to fix the auxiliary board and shield the components between the first circuit board and the second circuit board at the same time. The first circuit board and the second circuit board are connected and communicate with each other through a flexible circuit board, thereby improving the problems of poor reliability, low area utilization rate, and high cost existing in the connection and communication between the first circuit board and the second circuit board through the frame board.

[0098] On the basis of the above embodiments, in order to improve the support strength of the support member 300, as Figure 11 shown, in some embodiments, a reinforcing structure 900 is provided on the support member 300, and the reinforcing structure 900 is used to enhance the mechanical strength of the support member 300. The reinforcing structure 900 may be a reinforcing bar, a reinforcing block, etc. welded to the support member 300, or a convex portion integrally formed on the support member 300, etc., which can be determined according to actual use needs. By adopting the solution provided in this embodiment, the mechanical strength of the support member 300 can be improved to a certain extent, so that the support strength of the support member 300 can meet the use requirements.

[0099] The above-mentioned reinforcing structure 900 can be arranged in various ways. In some embodiments, the reinforcing structure 900 is connected to at least two side walls of the support member 300. And the reinforcing structure 900 is arranged in a manner that it fits the first circuit board 100 or the second circuit board 200. The reinforcing structure 900 in this embodiment may include at least one connecting member. When the reinforcing structure 900 has only one connecting member, the connecting member can connect at least two side walls of the support member 300. When the reinforcing structure 900 includes multiple connecting members, one end of each connecting member can be connected to one of the side walls of the support member 300, and the other end of each connecting member can be connected to other connecting members. By adopting the solution provided in this embodiment for the reinforcing structure 900, the risk of collapse of the part where the first circuit board 100 and / or the second circuit board 200 contacts the connecting member during use can be reduced.

[0100] As Figure 11 shown, in some embodiments, the reinforcing structure 900 includes a first connecting member 910, a second connecting member 920, and a third connecting member. The first connecting member 910 connects the first side wall and the second side wall of the support member 300 that are oppositely arranged in the first direction. The first direction mentioned here can be the length direction, the width direction, or other directions of the support member 300, which can be determined according to actual use needs. The second connecting member 920 connects the first connecting member 910 and the third side wall of the support member 300 that forms an angle with the first side wall. The third connecting member 930 connects the first connecting member 910 and the fourth side wall of the support member 300 that is opposite to the third side wall.

[0101] The first connecting member 910 can be an integrally formed structure or composed of multiple components, which can be specifically determined according to the usage requirements. The second connecting member 920 can be an integrally formed structure or composed of multiple components, which can be specifically determined according to the usage requirements. The third connecting member 930 can be an integrally formed structure or composed of multiple components, which can be specifically determined according to the usage requirements. The structures of the first connecting member 910, the second connecting member 920, and the third connecting member 930 can be the same or different, which can be specifically determined according to the usage requirements.

[0102] The reinforcing structure 900 adopts the structure provided in this embodiment, with a simple structure, which can realize the connection of two sets of oppositely arranged side walls, making the overall structure of the support member 300 stable.

[0103] Since the electronic components on the first circuit board 100 and the second circuit board 200 are generally set according to the usage requirements, the number, type, etc. of the electronic components generally located on both sides of the first connecting member 910 are generally different, that is, the structures on both sides of the first connecting member 910 are different. In order to meet different usage environments, in some embodiments, the second connecting member 920 and the third connecting member are arranged in a dislocation manner.

[0104] The dislocation arrangement means that the second connecting member 920 and the third connecting member 930 are not on the same straight line, that is, the connection area between the second connecting member 920 and the first connecting member 910 and the connection area between the third connecting member 930 and the first connecting member 910 are not on the same straight line. In this way, the arrangements of the second connecting member 920 and the third connecting member 930 can be determined according to the layout of the electronic components without the need for symmetric arrangement.

[0105] As Figure 12 shown, in some embodiments, the area of the figure enclosed by the outer contour of the second circuit board 200 can be larger than the area of the figure enclosed by the outer contour of the support member 300. In this way, the outer walls of the second circuit board 200, the first circuit board 100, and the support member 300 can enclose a first accommodation space 801 communicating with the external space, providing an installation space for the corresponding structures or electronic components installed on the first circuit board 100 and located on one side of the shielding space 800, so as to realize the reasonable utilization of the component layout space of the first circuit board 100.

[0106] In some embodiments, the circuit board assembly 30 further includes a first electronic component 700. The first electronic component 700 is installed on the first circuit board 100, and at least part of the first electronic component 700 is located in the first accommodation space 801.

[0107] The first electronic component 700 is generally a passive device, and at least part of its height is less than the height of the gap between the first circuit board 100 and the second circuit board 200, and it can be inserted into the first accommodation space 801. By adopting the solution provided in this embodiment, the reasonable utilization of the component layout area of the first circuit board 100 can be realized.

[0108] As Figure 13 shown, in some other embodiments, the area of the figure enclosed by the outer contour of the second circuit board 200 is smaller than the area of the figure enclosed by the outer contour of the support member 300. A second accommodation space 802 communicating with the external space is formed by the side wall of the second circuit board 200 and the side of the support member 300 facing away from the first circuit board 100. The setting of the second accommodation space 802 facilitates the more flexible use of the space on the circuit board assembly 30 to avoid other devices such as NFC (Near Field Communication) devices. In this solution, the structure of the support member 300 is as Figure 14 shown. The part of the support member 300 covered by the second circuit board can be provided with a hollow-out structure, and the other parts can be of a continuous structure. In this way, the shielding effect of the closed space formed by the support member 300, the first circuit board and the second circuit board can be better, and the weight of the support member 300 can be smaller, and the shielding space occupied by the support member 300 can be smaller, so that the second circuit board can have a larger component layout space.

[0109] In some embodiments, the circuit board assembly 30 further includes a second electronic component 710. The second electronic component 710 is electrically connected to the first circuit board 100 through a first electrical connector 740, and at least part of the second electronic component 710 is located in the second accommodation space 802.

[0110] The first electrical connector 740 can be a flexible connector or a rigid connector, which can be specifically determined according to the installation position and electrical connection method of the second electronic component 710. The second electronic component 710 is generally a passive electronic component, and at least part of it can be placed in the second accommodation space 802. By adopting the solution provided in this embodiment, the stacked arrangement of the second electronic component 710 and the support member 300 can be realized, reducing the occupation of the component layout area of the first circuit board 100, which is beneficial to the miniaturized design of the circuit board assembly 30.

[0111] Since the second electronic component 710 is located on the side of the support member 300 away from the first circuit board 100, the second electronic component 710 is at least partially spaced apart from the first circuit board 100. To facilitate the electrical connection between the second electronic component 710 and the first circuit board 100, in some embodiments, the first electrical connector 740 includes a flexible connector. The flexible connector can be directly soldered to the first circuit board 100 or electrically connected to the first circuit board 100 through a connector. This allows the first electrical connector 740 to be bent arbitrarily according to the positions of the second electronic component 710 and the first circuit board 100, thereby improving the convenience of connecting the second electronic component 710 to the first circuit board 100. The above-mentioned second electronic component 710 can be a near-field communication device, enabling the circuit board assembly 30 to have a short-distance high-frequency wireless communication function.

[0112] In addition to the position where the support member 300 is located, active electronic components can also be provided at other positions on the first circuit board 100. That is, the circuit board assembly 30 can further include a second shielding cover 600 mounted on the first circuit board 100, and the second shielding cover 600 is located on one side of the support member 300. This can enable the installation of active electronic components on the first circuit board 100 to be unrestricted by the size and installation position of the support member 300, making the functions of the circuit board assembly 30 more comprehensive.

[0113] To make more reasonable use of the layout space of the circuit board assembly 30, in some embodiments, a support platform is formed by the part of the side of the second shielding cover 600 away from the first circuit board 100 and the part of the side of the support member 300 away from the first circuit board 100 that extends beyond the second circuit board 200. When the size of the above-mentioned second electronic component 710 is relatively large, in addition to the part of the support member 300 that extends beyond the second circuit board 200, support can also be achieved through the second shielding cover 600, so that different regions of the second electronic component 710 can be stably supported.

[0114] Such as Figure 15As shown, in some embodiments, a first avoidance structure 210 is provided on the second circuit board 200 and penetrates the second circuit board 200 in the thickness direction of the second circuit board 200. The first avoidance structure 210 can be disposed in the middle area of the second circuit board 200, and at this time, the first avoidance structure 210 can be a through hole; the first avoidance structure 210 can also be disposed in the edge area of the second circuit board 200, and at this time, the first avoidance structure 210 can be a notch; it is also possible that the first avoidance structure 210 is disposed both in the middle area of the second circuit board 200 and in the edge area of the second circuit board 200, and at this time, the first avoidance structure 210 includes both a through hole and a notch. The setting of the first avoidance structure 210 enables electronic components located outside the circuit board assembly 30 to occupy a part of the area of the second circuit board 200, making the circuit board assembly 30 more widely applicable.

[0115] In some embodiments, the circuit board assembly 30 further includes a third electronic component 720. The third electronic component 720 is located within the first avoidance structure 210, and the third electronic component 720 is electrically connected to the second circuit board 200 through an electrical connector.

[0116] The third electronic component 720 can adopt a device with a larger thickness, which can reduce the overall height of the circuit board assembly 30 and facilitate the miniaturization design of the circuit board assembly 30.

[0117] In some embodiments, the second electrical connector 750 can include a flexible connector. The flexible connector can be directly soldered to the second circuit board 200 or electrically connected to the second circuit board 200 through a connector. This enables the second electrical connector 750 to be bent arbitrarily according to the positions of the third electronic component 720 and the second circuit board 200, thereby improving the convenience of connecting the third electronic component 720 and the second circuit board 200.

[0118] In some embodiments, the third electronic component 720 can include a camera module or other devices such as a speaker, which can be determined according to specific usage requirements. When the third electronic component 720 includes a camera module, the circuit board assembly 30 can have a camera function to be applicable to more application scenarios.

[0119] For embodiments having a shielding space 800, in order to ensure that the setting of the first avoidance structure 210 does not have an adverse effect on the shielding effect of the shielding space 800, such as Figure 16As shown, in some embodiments, the support member 300 includes a main body portion 310 and a branch portion 320. The main body portion 310 is disposed around at least a part of the space between the first circuit board 100 and the second circuit board 200, and the branch portion 320 closes the opening of the first avoidance structure 210 facing the first circuit board 100. Among them, the branch portion 320 can be connected to the main body portion 310 or to the second circuit board 200, which can be determined according to actual use needs. In this way, even if the first avoidance structure 210 is provided, it will not have an adverse effect on the shielding effect of the shielding space 800.

[0120] In some embodiments, the branch portion 320 is connected to the main body portion 310 through an intermediate connection portion 370. The intermediate connection portion 370 can be a rod structure, a block structure, a sheet structure, etc., which can be determined according to the support strength and the installation needs of electronic components. By adopting the solution provided in this embodiment, the support member 300 can be an integral body, enabling integral movement and installation, and having a better support effect on the second circuit board 200.

[0121] In some embodiments, there are multiple intermediate connection portions 370 and they are disposed around the branch portion 320. In this way, different regions of the branch portion 320 can be stably connected to the main body portion 310, making the overall structure of the support member 300 stable and having a better support effect on the second circuit board 200.

[0122] As Figure 17 shown, in some embodiments, the first circuit board 100 is provided with a second avoidance structure 110 that penetrates itself in the thickness direction. The second avoidance structure 110 is used for the electronic components installed on the side of the second circuit board 200 facing the first circuit board 100 to pass through.

[0123] The second avoidance structure 110 can be disposed in the middle area of the first circuit board 100. At this time, the second avoidance structure 110 can be a through hole; the second avoidance structure 110 can also be disposed in the edge area of the first circuit board 100. At this time, the second avoidance structure 110 can be a notch; it is also possible that the second avoidance structure 110 is disposed both in the middle area and the edge area of the first circuit board 100. At this time, the second avoidance structure 110 includes both a through hole and a notch. The setting of the second avoidance structure 110 can make the size of the electronic components located on the side of the second circuit board 200 facing the first circuit board 100 not limited by the space height between the first circuit board 100 and the second circuit board 200, making the circuit board assembly 30 more widely applicable.

[0124] In some embodiments, a fourth electronic component 730 is provided on one side of the second circuit board 200 facing the first circuit board 100. The thickness of the fourth electronic component 730 is greater than the height of the gap between the second circuit board 200 and the first circuit board 100. The fourth electronic component 730 extends to the side of the first circuit board 100 away from the second circuit board 200 through the second avoidance structure 110.

[0125] The fourth electronic component 730 can be an electronic component with a relatively large thickness, such as a camera module, a motor, a speaker, etc. This can make the overall thickness of the circuit board assembly 30 smaller and have comprehensive functions.

[0126] In some embodiments, the first circuit board 100 is the main board and the second circuit board 200 is the secondary board.

[0127] Generally, some electronic components are provided on both the main board and the secondary board. The electronic components provided on the main board may include an SoC (System on Chip), a UFS (Universal Flash Storage), and a CAM (Computer Aided Manufacturing). The electronic components provided on the secondary board may include a USB (Universal Serial Bus) interface, a SIM (Subscriber Identity Module) card, etc. The above USB interface can adopt a type-A interface, a type-B interface, a type-C interface or other types of interfaces according to the usage requirements, and there is no unique limitation here. Of course, other electronic components can also be provided on the main board and the secondary board according to the usage requirements, which are specifically determined according to the usage requirements.

[0128] The following process can be adopted to manufacture the circuit board assembly 30 provided in the embodiments of the present application:

[0129] First, the preparation of the auxiliary board is carried out. Through the SMT (Surface Mount Technology) process, laser engraving barcodes, printing solder paste, SPI (Serial Peripheral Interface), chip mounting, pre-furnace AOI (Automated Optical Inspection), reflow soldering, post-furnace AOI, FVMI (Force Current Measure Voltage), and automatic board splitting are sequentially performed on the auxiliary board and then it is put into the main board for soldering. At the same time, operations such as printing solder paste and SPI are carried out on the main board. After that, the auxiliary board is installed on the support member 300 through the chip mounting process, and then pre-furnace AOI, reflow soldering, post-furnace AOI, FVMI, pasting MIC (microphone) protection mylar (a tough polyester polymer), pasting paper barcodes, DBC-2000D board-level testing, CBT-1600E panel calibration, CBA1-1600D panel calibration, NQBT-QA-IT, T-side (front side) Underfill, applying thermal conductive gel, fastening the shielding cover (T-side), and automatic board splitting are carried out until the circuit board assembly 30 is prepared.

[0130] That is, after the SMT soldering process of the auxiliary board is carried out first, the secondary SMT soldering process is carried out on the main board to install the auxiliary board on the main board, and there is no manual operation in the middle to ensure manufacturability.

[0131] By adopting the solution provided in this embodiment, the layout space of the main board can be fully utilized, the layout area of the main body can be increased, which is beneficial to the miniaturization design of the electronic device.

[0132] This application also provides an electronic device, including the circuit board assembly provided in any of the above embodiments.

[0133] As described above, the electronic device provided in the embodiments of this application can be an electronic device such as a tablet computer, a smart watch, or a notebook computer.

[0134] The electronic device provided in the embodiments of this application, including the circuit board assembly provided in any of the above embodiments, can reduce the manufacturing cost to a certain extent and improve the space utilization rate of the circuit board in the circuit board assembly.

[0135] Finally, it should be noted that the above are only the specific embodiments of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that, it includes a first circuit board, a second circuit board, a support member, and an electrical connection component; the first circuit board and the second circuit board are stacked and spaced apart, and the first circuit board and the second circuit board are electrically connected through the electrical connection component; the support member is disposed between the first circuit board and the second circuit board.

2. The circuit board assembly according to claim 1, characterized in that, a first shielding cover is provided on a surface of the second circuit board facing away from the first circuit board; the first shielding cover is welded to the second circuit board through a high-temperature solder paste, and the support member is welded to the second circuit board through a low-temperature solder paste.

3. The circuit board assembly according to claim 1 or 2, characterized in that, the support member is disposed around at least part of the space between the first circuit board and the second circuit board, and the electrical connection component is located outside the space surrounded by the support member.

4. The circuit board assembly according to claim 3, characterized in that, at least part of the support member is made of a shielding material, and the support member and the first circuit board and the second circuit board enclose a shielding space.

5. The circuit board assembly according to any one of claims 1-4, characterized in that, a strengthening structure is provided on the support member, and the strengthening structure is used to strengthen the mechanical strength of the support member.

6. The circuit board assembly according to claim 5, characterized in that, the strengthening structure connects at least two side walls of the support member, and the strengthening structure is disposed in contact with the first circuit board or the second circuit board.

7. The circuit board assembly according to claim 5, characterized in that, the strengthening structure includes a first connecting member, a second connecting member, and a third connecting member. The first connecting member connects the first side wall and the second side wall of the support member disposed opposite to each other in a first direction. The second connecting member connects the first connecting member and the third side wall of the support member disposed at an angle to the first side wall. The third connecting member connects the first connecting member and the fourth side wall of the support member disposed opposite to the third side wall.

8. The circuit board assembly according to claim 7, characterized in that, the second connecting member and the third connecting member are arranged in a staggered manner.

9. The circuit board assembly according to any one of claims 1-8, characterized in that, the electrical connection component includes a flexible connector, and the flexible connector is electrically connected to the first circuit board and the second circuit board respectively.

10. The circuit board assembly according to claim 9, characterized in that, the flexible connector is electrically connected to the first circuit board and / or the second circuit board by a welding method.

11. The circuit board assembly according to claim 9, characterized in that, the electrical connection component further includes a first connector, the first connector is fixedly installed on the first circuit board, and the flexible connector is electrically connected to the first circuit board through the first connector; And / or, the electrical connection component further includes a second connector, which is fixedly installed on the second circuit board, and the flexible connector is electrically connected to the second circuit board through the second connector.

12. The circuit board assembly according to any one of claims 1-11, wherein, the area of the figure enclosed by the outer contour of the second circuit board is larger than the area of the figure enclosed by the outer contour of the support member, and an outer wall of the second circuit board, the first circuit board and the support member encloses a first accommodation space communicating with the external space.

13. The circuit board assembly according to claim 12, wherein, the circuit board assembly further includes a first electronic component, the first electronic component is installed on the first circuit board, and at least a part of the first electronic component is located in the first accommodation space.

14. The circuit board assembly according to any one of claims 1-13, wherein, the area of the figure enclosed by the outer contour of the second circuit board is smaller than the area of the figure enclosed by the outer contour of the support member; a surface of the support member facing away from the first circuit board and a side wall of the second circuit board enclose a second accommodation space communicating with the external space.

15. The circuit board assembly according to claim 14, wherein, the circuit board assembly further includes a second electronic component, the second electronic component is electrically connected to the first circuit board through a first electrical connector, and at least a part of the second electronic component is located in the second accommodation space.

16. The circuit board assembly according to claim 15, wherein, the first electrical connector includes a flexible connector; and / or, the second electronic component includes a near field communication device.

17. The circuit board assembly according to claim 14, wherein, the circuit board assembly further includes a second shielding cover installed on the first circuit board, and the second shielding cover is located on one side of the support member.

18. The circuit board assembly according to claim 17, wherein, a part of a surface of the second shielding cover facing away from the first circuit board and a part of a surface of the support member facing away from the first circuit board exceeding the second circuit board forms a support platform.

19. The circuit board assembly according to any one of claims 1-18, wherein, the second circuit board is provided with a first avoidance structure penetrating the second circuit board along the thickness direction of the second circuit board.

20. The circuit board assembly according to claim 19, wherein, the circuit board assembly further includes a third electronic component, the third electronic component is located in the first avoidance structure, and the third electronic component is electrically connected to the second circuit board through an electrical connector.

21. The circuit board assembly according to claim 20, wherein, the second electrical connector includes a flexible connector; and / or, the third electronic component includes a camera assembly.

22. The circuit board assembly according to claim 20, wherein, The support member includes a main body portion and a branch portion. The main body portion is disposed around at least a part of the space between the first circuit board and the second circuit board, and the branch portion closes the opening of the first avoidance structure facing the first circuit board.

23. The circuit board assembly according to claim 22, wherein, the branch portion is connected to the main body portion through an intermediate connecting portion.

24. The circuit board assembly according to claim 23, wherein, a plurality of the intermediate connecting portions are provided and are disposed around the branch portion.

25. The circuit board assembly according to any one of claims 1-24, wherein, the support member includes a first connecting portion connected to the surface of the first circuit board, a second connecting portion connected to the surface of the second circuit board, and a third connecting portion connecting the first connecting portion and the second connecting portion.

26. The circuit board assembly according to any one of claims 1-25, wherein, a second avoidance structure penetrating through the first circuit board in the thickness direction is provided on the first circuit board, and the second avoidance structure is used for allowing an electronic component mounted on one side of the second circuit board facing the first circuit board to pass through.

27. The circuit board assembly according to claim 26, wherein, a fourth electronic component is provided on one side of the second circuit board facing the first circuit board, the thickness of the fourth electronic component is greater than the height of the gap between the second circuit board and the first circuit board, and the fourth electronic component extends to the side of the first circuit board away from the second circuit board through the second avoidance structure.

28. The circuit board assembly according to any one of claims 1-27, wherein, the first circuit board is a main board, and the second circuit board is a sub-board; and / or, the support member is a thin-walled structure; and / or, the support member is an integrally formed structure and is a metal part; and / or, the support member is welded to the first circuit board and the second circuit board respectively.

29. An electronic device, wherein, it includes the circuit board assembly according to any one of claims 1-28.

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