Motor controller structure and electric vehicle

Abstract

The invention provides a motor controller structure and an electric vehicle, and relates to the technical field of motor equipment. The motor controller structure comprises a PCB embedded power module, a heat dissipation mechanism, a bus capacitor and a copper bar assembly. The PCB embedded power module comprises a power module chip, a ceramic substrate and a PCB, the power module chip is installed on the first surface of the ceramic substrate, and the power module chip and the ceramic substrate are installed on the PCB in an embedded mode; the heat dissipation mechanism and the PCB are installed in a matched mode, the second surface of the ceramic substrate makes contact with the heat dissipation mechanism, the copper bar assembly comprises a plurality of copper bars, and the bus capacitor is electrically connected with the power module chip through the copper bars. According to the motor controller structure, the loop stray inductance can be reduced, and the technical effects of reducing loss and improving system efficiency are achieved.

Description

Technical Field

[0001] The present application relates to the technical field of motor equipment, and in particular, to a motor controller structure and an electric vehicle. Background Art

[0002] The motor controller is a component in the "three-electricity technology" of the electrified powertrain of new energy electric vehicles, and generally consists of a power module, a power drive module, and a control module. According to the characteristics of electric vehicles themselves and complex operating conditions, there are high requirements for motor controllers; they should have excellent motor torque and speed control capabilities, high efficiency, and high power density. Power devices, as the core components of motor controllers, determine the power performance, power density, and cost of the entire vehicle.

[0003] Currently, in the existing heat dissipation solutions for encapsulated or potted IGBT modules and SiC modules, the liner in the direct copper plating uses a ceramic substrate, which is generally AL 2 O 3 or Si 3 N 4 . After copper plating on the upper and lower surfaces of the ceramic substrate, the upper surface copper plating is welded to the chip, and the lower surface copper plating is welded to the copper bottom plate; in this heat dissipation method, the ceramic substrate is used to conduct the heat generated by the chip during operation to the copper bottom plate, and then the heat is transferred to the water flow through the copper bottom plate. The power terminals are led out from the copper busbar and connected by screw fastening or laser welding. In this heat dissipation structure, the power terminal circuit is relatively long, the stray inductance is relatively large, and when combined with the flat or stacked layout of bus capacitors, it is difficult to improve the power density and has a greater impact on the system efficiency. Summary of the Invention

[0004] The purpose of the present application is to provide a motor controller structure and an electric vehicle, which can reduce the loop stray inductance and achieve the technical effects of reducing losses and improving system efficiency.

[0005] In a first aspect, the present application provides a motor controller structure, including a PCB embedded power module, a heat dissipation mechanism, bus capacitors, and a copper busbar assembly;

[0006] The PCB embedded power module includes a power module chip, a ceramic substrate, and a PCB board. The power module chip is installed on the first surface of the ceramic substrate, and the power module chip and the ceramic substrate are embedded in the PCB board;

[0007] The heat dissipation mechanism is matched and installed with the PCB board, and the second surface of the ceramic substrate is in contact with the heat dissipation mechanism. The copper busbar assembly includes a plurality of copper busbars, and the bus capacitors are electrically connected to the power module chip through the copper busbars.

[0008] In the above implementation process, the motor controller structure provided by the embodiments of the present application uses the structure of a PCB-embedded power module. By embedding the power module chip in the PCB board, after leading out the connection path of the power module chip from the PCB board, the electrical connection between the power module chip and the bus capacitor is realized through a copper bar, making the connection path between the power module chip and the bus capacitor more compact, thereby minimizing the length of the power loop as much as possible and making the stray inductance of the power loop small. At the same time, a heat dissipation mechanism is used, and the second surface of the ceramic substrate contacts the heat dissipation mechanism, so as to dissipate heat from the power module chip through the heat dissipation mechanism, avoid the accumulation of heat in the power module chip, and reduce losses. Therefore, this motor controller structure can reduce the stray inductance of the loop, achieve the technical effects of reducing losses and improving system efficiency.

[0009] Further, the PCB-embedded power module further includes a drive control chip, and the drive control chip is installed on the PCB board. The power module chip is provided with an emitter, a collector, and a gate. The PCB board is provided with a positive electrode pad, a negative electrode pad, and a midpoint pad. The emitter is electrically connected to the positive electrode pad, the collector is electrically connected to the negative electrode pad and / or the midpoint pad, and the positive electrode pad and the negative electrode pad are respectively electrically connected to the positive electrode and the negative electrode of the bus capacitor, and the gate is electrically connected to the drive control chip.

[0010] In the above implementation process, by arranging the drive control chip on the PCB board, the power part (small power module chip) and the control part (drive control chip) are integrated on the PCB board, and a layout with a short path and a compact structure is adopted to minimize the path of the control loop between the small power module chip and the drive control chip, making the interference of the control loop small and further improving the system efficiency.

[0011] Further, the copper bar assembly includes an interconnection copper bar and a midpoint AC output copper bar. The positive electrode and the negative electrode of the bus capacitor are respectively electrically connected to the positive electrode pad and the negative electrode pad through the interconnection copper bar, and the midpoint AC output copper bar is electrically connected to the midpoint pad.

[0012] Further, the PCB board is further provided with a drive control pad, and the drive control chip is electrically connected to the gate through the drive control pad.

[0013] Further, the PCB-embedded power module further includes a drive resistor, and the drive resistor is installed on the PCB board and is electrically connected to the drive control chip.

[0014] In the above implementation process, a small drive resistor can be selected for the drive resistor, so as to reduce the loss of the control loop and improve the system efficiency.

[0015] Furthermore, the PCB board is provided with copper-clad channels, and the copper-clad channels are electrically connected to the emitter, collector and gate of the power module chip respectively.

[0016] In the above implementation process, the power module chip is embedded in the PCB board. By using laser micro-hole copper deposition technology, a copper-plated channel can be established to lead out the emitter, collector and gate of the power module chip and electrically connect them to the various pads set on the PCB board.

[0017] Furthermore, the bus capacitor is installed in matching relationship with the heat dissipation mechanism.

[0018] In the above implementation process, the bus capacitor will also generate heat during operation. The bus capacitor can be installed in a matching manner with the heat dissipation mechanism, leaving the surface of the bus capacitor in contact with the surface of the heat dissipation mechanism. The heat dissipation mechanism can be used to dissipate the heat from the bus capacitor to improve the operating stability of the motor controller structure.

[0019] Furthermore, the heat dissipation mechanism is provided with a heat dissipation water channel, and at least one heat dissipation tooth is provided in the heat dissipation water channel.

[0020] In the above implementation process, heat dissipation teeth that can expand the heat dissipation area are arranged in the heat dissipation water channel, and the heat of the chip is taken away by the flowing coolant, thereby effectively improving the heat dissipation efficiency of the heat dissipation mechanism.

[0021] Furthermore, the first surface and the second surface of the ceramic substrate are provided with copper-clad surfaces.

[0022] In a second aspect, the present application provides an electric vehicle, comprising the motor controller structure described in any one of the first aspects.

[0023] Other features and advantages disclosed in the present application will be described in the following description, or some features and advantages can be inferred or determined without doubt from the description, or can be learned by implementing the above-mentioned technology disclosed in the present application.

[0024] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1Structural schematic diagram of the motor controller structure provided by the embodiment of the present application;

[0027] Figure 2 Structural schematic diagram of the PCB embedded power module provided by the embodiment of the present application.

[0028] Reference numerals: PCB embedded power module 100; ceramic substrate 110; copper-clad surface 111; PCB board 120; positive electrode pad 121; negative electrode pad 122; midpoint pad 123; drive control pad 124; drive control chip 130; drive resistor 131; heat dissipation mechanism 200; bus capacitor 300; copper bar assembly 400; interconnecting copper bar 410; midpoint AC output copper bar 420. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Usually, the components of the embodiments of the present application described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application to be protected, but only represents the selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0030] In the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0031] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to specific circumstances.

[0032] In addition, the terms "installed", "set up", "provided with", "connected", and "linked" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or a point connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, components, or parts (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, components, or parts. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0034] Generally, in the application of motor controllers, power devices form a three-phase bridge. By controlling the upper and lower tubes of the three phases to switch in a certain phase sequence in turn, the DC input voltage is converted and controlled into an alternating current with a certain frequency and voltage amplitude, and then a three-phase asynchronous motor or a permanent magnet synchronous motor is driven to provide power for an electric vehicle.

[0035] The potential for improving the efficiency, power density, etc. of motor controllers using traditional Si-MOSFET discrete devices is already very limited. Therefore, IGBTs and SiCs using module packaging, which can greatly improve various performances, have been widely used. With the continuous increasing requirements for high power density and efficiency, the packaging method has become a weakness in improving the power density and efficiency of IGBTs and SiC power modules in power modules. Therefore, a better heat dissipation structure needs to be found currently.

[0036] In the existing heat dissipation solutions for hermetically sealed or plastic-sealed IGBT modules and SiC modules, the liner in the direct copper plating uses a ceramic substrate, generally Al 2 O 3 or Si 3 N 4 . After copper plating on the upper and lower surfaces of the ceramic substrate, the chip is soldered to the copper plating on the upper surface, and the copper plating on the lower surface is soldered to the copper bottom plate; in this heat dissipation method, the ceramic substrate is used to conduct the heat generated by the chip during operation to the copper bottom plate, and then the heat is transferred to the water flow through the copper bottom plate. The power terminals are led out from the copper busbar and connected by screw fastening or laser welding. In this heat dissipation structure, the power terminal circuit is relatively long, the stray inductance is relatively large, and when combined with the flat or stacked layout of bus capacitors, it is very difficult to improve the power density and has a greater impact on the system efficiency.

[0037] To solve the above-mentioned technical problems, the embodiments of this application provide a motor controller structure and an electric vehicle, which can be applied to the system improvement process of motor controllers; please refer toFigure 1 and Figure 2 , Figure 1 is a schematic structural diagram of the motor controller structure provided by the embodiment of the present application, Figure 2 is a schematic structural diagram of the PCB embedded power module provided by the embodiment of the present application; the motor controller structure includes a PCB embedded power module 100, a heat dissipation mechanism 200, a bus capacitor 300, and a copper bar assembly 400;

[0038] Exemplarily, the PCB embedded power module 100 includes a power module chip, a ceramic substrate 110, and a PCB board 120. The power module chip is installed on the first surface of the ceramic substrate 110, and the power module chip and the ceramic substrate 110 are embedded and installed in the PCB board 120;

[0039] Exemplarily, the power module chip can be welded and installed on the ceramic substrate 110, and the power module chip and the ceramic substrate 110 are integrally embedded and installed in the PCB board 120;

[0040] Optionally, both surfaces (the first surface and the second surface) of the ceramic substrate 110 are copper-clad. The power module chip is installed on the first surface of the ceramic substrate 110 and can be covered with a material with high thermal conductivity and low coefficient of thermal expansion to ensure that the heat generated during the operation of the power module chip can be conducted to the ceramic substrate in time, and to ensure that the PCB embedded power module 100 will not undergo obvious deformation, thus ensuring the operation stability of the system.

[0041] Exemplarily, the power module chips in the embodiments of the present application can be of types such as FRD and IGBT; among them, FRD (Fast Recovery Diode) is a semiconductor diode with good switching characteristics and short reverse recovery time, and is mainly used in electronic circuits such as switching power supplies, PWM pulse width modulators, and frequency converters as a high-frequency rectifier diode, a freewheeling diode, or a damping diode; IGBT (Insulate-Gate Bipolar Transistor) combines the advantages of a power transistor (Giant Transistor, GTR) and a power field effect transistor (PowerMOSFET), has good characteristics, and has a wide range of application fields.

[0042] Exemplarily, the heat dissipation mechanism 200 is installed in a matching manner with the PCB board 120, and the second surface of the ceramic substrate 110 is in contact with the heat dissipation mechanism 200. The copper bar assembly 400 includes a plurality of copper bars, and the bus capacitor 300 is electrically connected to the power module chip through the copper bars.

[0043] Exemplarily, the bus capacitor 300 is electrically connected to the power module chip through the copper bars to realize the power loop of the power module chip.

[0044] In some embodiments, the motor controller structure provided by the embodiments of the present application uses the structure of a PCB-embedded power module. By embedding the power module chip in the PCB board 120, after leading out the connection path of the power module chip from the PCB board 120, the electrical connection between the power module chip and the bus capacitor 300 is realized through a copper bar, making the connection path between the power module chip and the bus capacitor 300 more compact, thereby minimizing the length of the power loop as much as possible and reducing the stray inductance of the power loop; at the same time, a heat dissipation mechanism 200 is used, and the second surface of the ceramic substrate 110 is in contact with the heat dissipation mechanism 200, so as to dissipate heat from the power module chip through the heat dissipation mechanism 200, avoid the accumulation of heat of the power module chip, and reduce losses; thus, this motor controller structure can reduce the stray inductance of the loop and achieve the technical effects of reducing losses and improving system efficiency.

[0045] Exemplarily, the PCB-embedded power module further includes a drive control chip 130, and the drive control chip 130 is installed on the PCB board 120. The power module chip is provided with an emitter, a collector and a gate. The PCB board 120 is provided with a positive electrode pad 121, a negative electrode pad 122 and a midpoint pad 123. The emitter is electrically connected to the positive electrode pad 121, the collector is electrically connected to the negative electrode pad 122 and / or the midpoint pad 123, and the positive electrode pad 121 and the negative electrode pad 122 are respectively electrically connected to the positive electrode and the negative electrode of the bus capacitor 300, and the gate is electrically connected to the drive control chip 130.

[0046] Exemplarily, by arranging the drive control chip 130 on the PCB board 120, the power part (the small power module chip) and the control part (the drive control chip) are integrated on the PCB board 120, adopting a layout with a short path and a compact structure, minimizing the path of the control loop between the small power module chip and the drive control chip as much as possible, making the interference of the control loop small, and further improving the system efficiency.

[0047] Exemplarily, the copper bar assembly 400 includes an interconnection copper bar 410 and a midpoint AC output copper bar 420. The positive electrode and the negative electrode of the bus capacitor 300 are respectively electrically connected to the positive electrode pad 121 and the negative electrode pad 122 through the interconnection copper bar 410, and the midpoint AC output copper bar 420 is electrically connected to the midpoint pad 123.

[0048] Exemplarily, the PCB board 120 is further provided with a drive control pad 124, and the drive control chip 130 is electrically connected to the gate through the drive control pad 124.

[0049] Exemplarily, the PCB-embedded power module further includes a drive resistor 131, and the drive resistor 131 is installed on the PCB board 120 and is electrically connected to the drive control chip 130.

[0050] Exemplarily, a small driving resistor may be selected as the driving resistor 131 , thereby reducing the loss of the control loop and improving the system efficiency.

[0051] Exemplarily, the PCB board 120 is provided with copper-plated channels, and the copper-plated channels are electrically connected to the emitter, collector and gate of the power module chip respectively.

[0052] Exemplarily, the power module chip is embedded in the PCB board 120. By using laser micro-hole copper deposition technology, a copper-plated channel can be established to lead out the emitter, collector and gate of the power module chip and electrically connect them to various pads set on the PCB board 120.

[0053] Exemplarily, the bus capacitor 300 is installed in matching with the heat dissipation mechanism 200 .

[0054] For example, the bus capacitor 300 will also generate heat during operation. The bus capacitor can be installed in a matching manner with the heat dissipation mechanism 200 so that the surface of the bus capacitor 300 is in contact with the surface of the heat dissipation mechanism. The heat dissipation mechanism 200 can be used to dissipate the heat from the bus capacitor 300, thereby improving the operating stability of the motor controller structure.

[0055] Optionally, the heat dissipation mechanism 200 is disposed between the ceramic substrate 110 and the bus capacitor 300 .

[0056] In some embodiments, the bus capacitor 300 may be a thin film capacitor core; it should be noted that when the bus capacitor 300 is matched with the heat dissipation mechanism 200 and installed, the bus capacitor 300 needs to be insulated.

[0057] Exemplarily, the heat dissipation mechanism 200 is provided with a heat dissipation water channel, and at least one heat dissipation tooth is provided in the heat dissipation water channel.

[0058] For example, heat dissipation teeth that can expand the heat dissipation area are provided in the heat dissipation water channel, and the heat of the chip is taken away by the flowing coolant, thereby effectively improving the heat dissipation efficiency of the heat dissipation mechanism.

[0059] Exemplarily, the first surface and the second surface of the ceramic substrate 110 are provided with copper-clad surfaces 111 .

[0060] Exemplarily, the present application also provides an electric vehicle, comprising Figure 1 and Figure 2 The motor controller structure shown.

[0061] In some implementation scenarios, the motor controller structure provided in the embodiments of the present application is achieved by welding a power module chip to a double-sided copper-clad ceramic substrate, and then covering the power module chip with a material having high thermal conductivity and low thermal expansion coefficient; Figure 1The lower surface shown) is exposed so that it is integrally embedded in the PCB board. Then, using the laser microvia copper deposition technology, the emitter layer of the power module chip is connected to the copper-plated channel in the PCB board and guided to the negative pad and the midpoint pad through the copper-plated channel of the PCB board. The collector of the power module chip is connected to the first surface of the ceramic substrate (such as Figure 1 the upper surface shown), and then it is led out to the positive pad through the copper-plated channel of the PCB board. The gate of the power module chip is connected to the drive control trace (connected to the drive control chip) in the PCB board;

[0062] Among them, the drive circuit is laid out on the PCB board and the drive control chip is soldered, so as to integrate the power part (power module chip) and the control part (drive control chip) on the PCB board; in addition, the power part is close to the bus capacitor and is directly connected to the power pad led out from the PCB board; in order to dissipate heat from the power module chip, the heat dissipation mechanism is soldered or silver-sintered on the second surface of the ceramic substrate. The heat dissipation mechanism is provided with a heat dissipation water channel, and there are heat dissipation teeth in the heat dissipation water channel to expand the heat dissipation area, and then the heat of the power module chip is taken away by the flowing coolant;

[0063] Since the bus capacitor also generates heat during operation, after the bus capacitor is insulated, the surface of the bus capacitor can be in contact with the surface of the heat dissipation water channel, and the bus capacitor is cooled by the heat dissipation water channel.

[0064] Exemplarily, in combination with Figure 1 and Figure 2 shown, the motor controller structure provided by the embodiment of the present application uses the structure of the PCB-embedded power module. By embedding the power module chip in the PCB board, the gate part of the power module chip is connected to the control circuit (drive control chip) in the PCB board. The collector and emitter of the power module chip are connected to the bus capacitor through the copper-plated channel and the placement pad, that is, the positive and negative poles of the bus capacitor are connected to the pads of the power module chip. Using the heat dissipation water channel to dissipate heat from the power module chip, the relevant circuit of the motor controller can be formed and its function can be realized;

[0065] Thus, by improving the structure layout scheme of the traditional power device, canceling the screw fastening scheme of the power terminal, adopting a layout with a short path and a compact structure, minimizing the length of the power loop and the path of the control loop as much as possible, the motor controller structure has a small stray inductance in the power loop and a small interference in the control loop; by using a new power module structure, by embedding the power module chip in the PCB board, connecting the control part to the control circuit in the PCB board, leading out the power part through copper-plating and pads, using the heat dissipation water channel to dissipate heat from the chip, and connecting the bus capacitor to the pads of the power part with the shortest possible trace;

[0066] In summary, the motor controller structure provided by the embodiments of the present application has at least the following beneficial effects:

[0067] 1. By shortening the power trace, the system stray inductance is reduced, which is beneficial to reducing the voltage stress of the chip. A small driving resistor can be selected to reduce losses and improve the system efficiency;

[0068] 2. Shortening the power terminal trace reduces the system volume and improves the system power density.

[0069] In all embodiments of the present application, "large" and "small" are relative, "many" and "few" are relative, and "upper" and "lower" are relative. For the expression methods of such relative terms, the embodiments of the present application will not elaborate further.

[0070] It should be understood that throughout the specification, the phrases "in this embodiment", "in the embodiments of the present application", or "as an optional implementation" mean that specific features, structures, or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, the phrases "in this embodiment", "in the embodiments of the present application", or "as an optional implementation" that appear throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present application.

[0071] In various embodiments of the present application, it should be understood that the magnitudes of the sequence numbers of the above processes do not necessarily mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0072] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all of them should be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A motor controller structure, characterized in that: Including PCB embedded power module, heat dissipation mechanism, busbar capacitor and copper busbar assembly; The PCB embedded power module comprises a power module chip, a ceramic substrate and a PCB board, wherein the power module chip is mounted on a first surface of the ceramic substrate, and the power module chip and the ceramic substrate are embedded and mounted on the PCB board; The heat dissipation mechanism is matched and installed with the PCB board, and the second surface of the ceramic substrate is in contact with the heat dissipation mechanism. The copper busbar assembly includes a plurality of copper busbars, and the busbar capacitor is electrically connected to the power module chip through the copper busbars.

2. The motor controller structure according to claim 1, characterized in that: The PCB embedded power module also includes a drive control chip, which is installed on the PCB board, wherein the power module chip is provided with an emitter, a collector and a gate, and the PCB board is provided with a positive electrode pad, a negative electrode pad and a midpoint pad, the emitter is electrically connected to the positive electrode pad, the collector is electrically connected to the negative electrode pad and / or the midpoint pad, and the positive electrode pad and the negative electrode pad are electrically connected to the positive electrode and the negative electrode of the bus capacitor respectively, and the gate is electrically connected to the drive control chip.

3. The motor controller structure according to claim 2, characterized in that: The copper busbar assembly includes an interconnected copper busbar and a midpoint AC output copper busbar. The positive electrode and the negative electrode of the busbar capacitor are electrically connected to the positive electrode pad and the negative electrode pad respectively through the interconnected copper busbar, and the midpoint AC output copper busbar is electrically connected to the midpoint pad.

4. The motor controller structure according to claim 2, characterized in that: The PCB board is also provided with a driving control pad, and the driving control chip is electrically connected to the gate via the driving control pad.

5. The motor controller structure according to claim 2, characterized in that: The PCB embedded power module further includes a driving resistor, which is mounted on the PCB board and is electrically connected to the driving control chip.

6. The motor controller structure according to claim 1 or 2, characterized in that: The PCB board is provided with copper-clad channels, and the copper-clad channels are electrically connected to the emitter, collector and gate of the power module chip respectively.

7. The motor controller structure according to claim 1, characterized in that: The bus capacitor is installed in matching with the heat dissipation mechanism.

8. The motor controller structure according to claim 1 or 7, characterized in that: The heat dissipation mechanism is provided with a heat dissipation water channel, and at least one heat dissipation tooth is provided in the heat dissipation water channel.

9. The motor controller structure according to claim 1, characterized in that: The first surface and the second surface of the ceramic substrate are provided with copper-clad surfaces.

10. An electric vehicle, characterized in that: The invention comprises a motor controller structure as claimed in any one of claims 1 to 9.

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