Substrate conveyance apparatus

Abstract

The substrate conveying apparatus includes: a pair of guide rails that guide both ends in a left-right direction of a substrate conveyed in a conveying direction; a plurality of rollers which are provided at a carrying-in position where the pair of guide rails carry in the substrate so as to be rotatable about a central axis in the vertical direction, and which guide the substrate to be carried between the pair of guide rails; and a buffer part for buffering impact when the substrate is in contact with the outer peripheral surface of the roller.

Description

Technical Field

[0001] The present invention relates to a substrate transfer device. Background Art

[0002] The substrate transfer device is applicable to a substrate processing machine and is used for transferring substrates on a production line. The following structure is disclosed in Patent Document 1: A pair of guide rails guide both ends in the width direction of a substrate to be transferred, and rotation of a conveyor belt disposed below the pair of guide rails causes the substrate to move in the transfer direction.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2014 - 123597 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In such a substrate transfer device, when a substrate is loaded from the upstream side in the transfer direction of the substrate, due to a positional deviation in the width direction of the substrate, the front end of the substrate may collide with the guide rail. When applying a substrate with low application strength to the substrate operation, there is a concern that the substrate may be deformed due to the collision with the guide rail.

[0008] An object of the present specification is to provide a substrate transfer device that alleviates the impact applied to the substrate when loading the substrate and prevents deformation of the substrate caused by transfer.

[0009] Means for Solving the Problems

[0010] The present specification discloses a substrate transfer device including: a pair of guide rails that guide both ends in the width direction of a substrate transferred in the transfer direction; a plurality of rollers rotatably provided about a central axis in the vertical direction at a loading position where the substrate is loaded into the pair of guide rails, and guiding the substrate to be transferred between the pair of guide rails; and a buffer portion that alleviates the impact when the substrate contacts the outer peripheral surface of the roller.

[0011] In the present specification, the technical idea of changing "the substrate transfer device according to any one of Technical Solutions 1 to 4" to "the substrate transfer device according to any one of Technical Solutions 1 to 5" in Technical Solution 6 at the initial stage of the application, the technical idea of changing "the substrate transfer device according to any one of Technical Solutions 1 to 4" to "the substrate transfer device according to any one of Technical Solutions 1 to 7" in Technical Solution 8 at the initial stage of the application, and the technical idea of changing "the substrate transfer device according to any one of Technical Solutions 1 to 4" to "the substrate transfer device according to any one of Technical Solutions 1 to 9" in Technical Solution 10 at the initial stage of the application are also disclosed.

[0012] Effect of the Invention

[0013] According to such a structure, the impact when the substrate contacts the outer peripheral surface of the roller is alleviated, so that deformation of the substrate during substrate loading can be prevented, etc. Description of the Drawings

[0014] Figure 1 It is a schematic diagram showing the structure of a component mounter to which a substrate handling device is applied.

[0015] Figure 2 It is a perspective view of the main part of the substrate handling device.

[0016] Figure 3 It is a side view of the substrate handling device.

[0017] Figure 4 It is from Figure 3 Top view of the buffer part observed from the IV direction.

[0018] Figure 5 It is Figure 4 Side view observed from the V direction in

[0019] Figure 6 It is a perspective view of the buffer part showing the deformation mode. Detailed Description of the Invention

[0020] The substrate handling device will be described with reference to the drawings. In the present embodiment, an example of a mode in which the substrate handling device is applied to a component mounter as a substrate processing machine is illustrated. It should be noted that as the substrate processing machine to which the substrate handling device can be applied, it is not limited to the component mounter, and any substrate processing machine that performs a predetermined substrate processing on the substrate can be used, and various processing machines such as a solder printer and a substrate inspection machine can be adopted.

[0021] 1. Structure of the Component Mounter 10

[0022] The component mounter 10 constitutes a production line for substrate products together with a variety of substrate processing machines including other component mounters 10, for example. The substrate processing machines constituting the above production line may include a solder printer, a substrate inspection machine, a reflow oven, etc.

[0023] 1-1. Substrate Handling Device 11

[0024] As Figure 1 shown, the component mounter 10 is provided with a substrate handling device 11. The substrate handling device 11 sequentially transports the substrate 91 in the transport direction and positions the substrate 91 at a predetermined position in the machine. The detailed structure of the substrate handling device 11 will be described later.

[0025] 1-2. Component Supply Device 12

[0026] The component mounting machine 10 is equipped with a component supply device 12. The component supply device 12 supplies components to be mounted on the substrate 91. The component supply device 12 respectively sets feeders 122 in a plurality of slots 121. For example, a tape feeder that feeds a carrier tape containing a plurality of components and supplies the components in a pickable manner is applied in the feeder 122.

[0027] 1-3. Component transfer device 13

[0028] The component mounting machine 10 is equipped with a component transfer device 13. The component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the substrate 91. The component transfer device 13 includes a head drive device 131, a moving stage 132, a mounting head 133, and a suction nozzle 134. The head drive device 131 moves the moving stage 132 in the horizontal directions (X direction and Y direction) through a linear motion mechanism. The mounting head 133 is detachably fixed to the moving stage 132 by a clamping member (not shown) and is arranged to be movable in the horizontal direction within the machine.

[0029] The mounting head 133 rotatably and liftably supports a plurality of suction nozzles 134. The suction nozzle 134 is a holding member that picks up and holds the components supplied by the feeder 122. The suction nozzle 134 adsorbs the components supplied by the feeder 122 through the supplied negative pressure air. As the holding member mounted on the mounting head 133, chucks that hold the components by gripping can be adopted.

[0030] 1-4. Component camera 14, substrate camera 15

[0031] The component mounting machine 10 is equipped with a component camera 14 and a substrate camera 15. The component camera 14 and the substrate camera 15 are digital imaging devices having imaging components such as CMOS. The component camera 14 and the substrate camera 15 perform imaging based on a control signal and transmit the image data obtained through this imaging. The component camera 14 is configured to be able to image the components held by the suction nozzle 134 from below. The substrate camera 15 is arranged on the moving stage 132 so as to be able to move in the horizontal direction integrally with the mounting head 133. The substrate camera 15 is configured to be able to image the substrate 91 from above.

[0032] 1-5. Control device 16

[0033] The component mounting machine 10 is equipped with a control device 16. The control device 16 mainly consists of a CPU, various memories, and control circuits. Various data such as control programs for the control of the mounting process are stored in the control device 16. The control program is data that represents the mounting positions, mounting angles, and component types of the components to be mounted on the substrate 91 in a predetermined mounting sequence.

[0034] The control device 16 controls the operation of the mounting head 133 based on information output from various sensors, image processing results, control programs, etc. during the mounting process. Thus, the positions and angles of the plurality of suction nozzles 134 supported by the mounting head 133 are controlled. As a result, the components held by the suction nozzles 134 are mounted at predetermined mounting positions indicated by the control program at predetermined mounting angles.

[0035] 2. Structure of the substrate transport device 11

[0036] The substrate transport device 11 transports the substrate 91 that has been transported to the upstream end of the transport path by the substrate transport device or the external transport device along the transport path and transports it to a predetermined stop position. The predetermined stop position of the substrate 91 is set, for example, at the center of the transport direction of the transport path. The substrate 91 positioned at the stop position is subjected to component mounting processing by the component transfer device 13. After the mounting processing is completed, the substrate transport device 11 transports the substrate 91 from the stop position to the downstream end ( Figure 1 and carry it out of the machine.

[0037] 2-1. Guide rail 20

[0038] The substrate transport device 11 includes a pair of guide rails 20 that form a transport path for the substrate 91. The pair of guide rails 20 are arranged along the transport direction ( Figure 2 From lower left to upper right, Figure 3 The width direction of the substrate 91 to be transported (the direction perpendicular to the transport direction) Figure 1 The up and down direction, Figure 3 The pair of guide rails 20 are provided on the upper sides of a pair of support plates 25 that are erected from the upper surface of the base 19 and are arranged in parallel and separated from each other. The mutual separation distance of the pair of guide rails 20 is set corresponding to the width dimension of the substrate 91. The separation distance is configured to be variable by sliding the support plate 25 on the upper surface of the base 19.

[0039] 2-2. Driving unit 30

[0040] The substrate conveying device 11 includes a driving unit 30 for conveying the substrate 91 in the conveying direction. The driving unit 30 includes a pair of conveyor belts 31, a plurality of pulleys, and a driving motor 37. The conveyor belt 31 is formed into an endless loop and is arranged along the guide rail 20. The conveyor belt 31 is guided by the upper surface of the belt guide 21 extending in the conveying direction on the inner side of the pair of guide rails 20 facing each other. Both sides of the substrate 91 in the conveying direction are placed on the upper surface of the pair of conveyor belts 31.

[0041] like Figure 3As shown, the conveyor belt 31 engages with a pair of front and rear conveying guide pulleys 32, a plurality of auxiliary pulleys 33, a driving pulley 34, and a tension pulley 35. The tension pulley 35 applies tension to the conveyor belt 31 to prevent slack. The driving pulley 34 is supported to rotate integrally with the drive shaft 36. The drive shaft 36 extends orthogonally to the conveying direction and is fixed to the centers of a pair of driving pulleys 34 respectively. The drive shaft 36 is rotationally driven from a drive motor 37 via a gear mechanism.

[0042] The drive motor 37 is, for example, a pulse motor that is controlled by input of drive pulses. The drive motor 37 rotates the drive shaft 36 and rotates a pair of conveyor belts 31 via a pair of driving pulleys 34. Thereby, the pair of conveyor belts 31 rotate synchronously, holding and conveying the substrate 91 placed on its upper surface. The drive motor 37 rotates forward by a predetermined angle by input of a positive pulse (a drive pulse of positive polarity) and rotates backward by a predetermined angle by input of a negative pulse (a drive pulse of negative polarity). By the forward or backward rotation of the drive motor 37 by a predetermined angle, the conveyor belt 31 rotates forward or backward by a predetermined unit distance.

[0043] 2-3. Support device 40

[0044] The substrate conveying device 11 includes a support device 40. The support device 40 is disposed below the stop position of the substrate 91, and the support device 40 supports the substrate 91 from below by a plurality of support pins 41. The plurality of support pins 41 are erected on the upper surface of a rectangular plate-shaped support plate 42. The plurality of support pins 41 are appropriately adjusted in type, number of uses, and arrangement positions according to the type of the substrate 91 to be conveyed. The support plate 42 is configured to be movable up and down relative to the base 19. The support plate 42 is lifted and driven by an actuator 43 such as a fluid pressure cylinder.

[0045] The support device 40 operates after the substrate 91 is conveyed to the stop position and stops. Specifically, the support device 40 raises the support plate 42 by the operation of the actuator 43. As the support plate 42 rises, the support pins 41 push the substrate 91 upward. Thereby, the substrate 91 is clamped and positioned between the upper part of the guide rail 20 and the support pins 41. In this way, the support device 40 functions as a clamping device in the substrate conveying device 11.

[0046] After the component mounting process is completed, the support device 40 lowers the support plate 42 by the operation of the actuator 43. As the support plate 42 descends, the support pins 41 move away from the substrate 91 downward. Thereby, the clamping state of the substrate 91 is released, and the substrate 91 is placed on the conveyor belt 31 again. The substrate 91 becomes in a state where it can be conveyed to the downstream end of the conveying path and carried out of the machine.

[0047] 2-4. Substrate sensors 381-383

[0048] The substrate transfer device 11 includes a plurality of substrate sensors 381 - 383 that are arranged at different positions in the transfer direction and detect the presence or absence of a substrate 91 on the transfer path. The first substrate sensor 381 is arranged such that the upstream end of the transfer path where the conveyor belt 31 functions as a transfer means is the detection position. The second substrate sensor 382 is arranged such that the stop position set at the center of the transfer path is the detection position. The third substrate sensor 383 is arranged such that the downstream end of the transfer path is the detection position. The substrate sensors 381 - 383 have the same structure as each other and can be, for example, an optical sensor composed of a light projecting part and a light receiving part, etc.

[0049] 2 - 5. Buffer unit 50

[0050] The substrate transfer device 11 forms a transfer path for the substrate 91 that constitutes a production line with the above-described structure, and performs the transfer and positioning of the substrate 91 along the transfer path. The substrate transfer device 11 cooperates with an external transfer device adjacent on the upstream side to transfer the substrate 91. At this time, when the substrate 91 is carried in from the upstream side, due to the positional deviation in the width direction of the substrate 91, the front end of the substrate 91 may collide with the guide rail 20. When a substrate 91 with low strength is used in the mounting process, there is a concern that the substrate may be deformed due to the collision with the guide rail 20.

[0051] Here, depending on the type of mounting process, the substrate 91 sometimes uses a glass substrate with a thickness Ns of 1 mm or less. When transferring such a substrate 91, it is necessary to perform transfer control so that the outer edge does not break due to the impact applied to the substrate 91. On the other hand, for example, considering reducing the transfer speed sufficiently, this becomes a main cause for reducing the overall production efficiency in such transfer control.

[0052] Therefore, the substrate transfer device 11 of the present embodiment adopts a structure that can mitigate the impact applied to the substrate 91 when the substrate 91 is carried in. Specifically, the substrate transfer device 11 includes a buffer unit 50 arranged at the upstream end of the guide rail 20. Thereby, the substrate transfer device 11 prevents deformation and breakage of the substrate 91 caused by transfer. In addition, in the present embodiment, since the buffer unit 50 is composed of components that are symmetric in the direction orthogonal to the transfer direction when viewed from above, only one of the components is shown enlarged in Figures 4 - 6 the figure.

[0053] 3. Detailed structure of buffer unit 50

[0054] 3 - 1. Multiple rollers 51

[0055] As Figure 2 shown, the buffer unit 50 includes multiple rollers 51. As Figure 4 and Figure 5As shown, the roller 51 is provided at the loading position P1 of the pair of guide rails 20 for loading the substrate 91 in a manner that it can rotate about the central axis Ar in the vertical direction. When the roller 51 comes into contact with the substrate 91 to be transported, it receives an external force from the substrate 91 and rotates about the central axis Ar. Then, as shown by the thick arrow in Figure 4 the roller 51 moves the substrate 91 along the outer peripheral surface 511 of the roller 51 toward the center side in the width direction of the transport path ( Figure 4 the lower side of

[0056] ), and guides the substrate 91 between the pair of guide rails 20. The roller 51 has an outer ring 52 and an inner ring 53. The outer ring 52 forms the outer peripheral surface 511 that contacts the substrate 91. In the present embodiment, the outer ring 52 constitutes a buffer portion that alleviates the impact when the substrate 91 contacts the outer peripheral surface 511 of the roller 51. The outer ring 52 as the buffer portion is formed of a material having a lower hardness than the substrate 91. As described above, when the substrate 91 is a glass substrate, the outer ring 52 is formed of a material such as resin or rubber. The inner ring 53 is concentric with the outer ring 52 and is configured to be fitted to the inner peripheral surface of the outer ring 52 and capable of rotating integrally. The inner ring 53 is formed in a cylindrical shape and is formed of a material such as metal having a higher hardness than the outer ring 52.

[0057] 3-2. A pair of arms 54

[0058] As shown in Figure 2 , the buffer unit 50 includes a pair of arms 54. The arms 54 are respectively fixed to the loading position P1 of the guide rails 20 and are formed to extend toward the upstream side in the transport direction of the substrate 91 ( Figure 4 and Figure 5 the left and right directions of

[0059] ). The arms 54 support the roller 51 configured as described above so that it can rotate about the central axis Ar. Specifically, the arm 54 has a shaft support portion 541 that supports the roller 51 by fastening a mounting bolt passing through the inner ring 53 of the roller 51 to the arm main body. With such a structure, the roller 51 can be replaced according to the type of the substrate 91 and the like. The arm 54 is detachably fixed to the upper surface of the guide rail 20 by two fixing bolts 55.

[0060] The roller 51 having the outer ring 52 as the buffer portion as described above is arranged at the following position by disposing the arm 54 at a predetermined position of the guide rail 20. Specifically, as shown in Figure 5 , the roller 51 is arranged such that the entire thickness Ns of the substrate 91 transported in the vertical direction is within the vertical width of the roller 51. According to such a structure, the contact area between the roller 51 and the substrate 91 can be increased, and as a result, the impact applied to the substrate 91 can be further alleviated.

[0061] In addition, as shown in Figure 5As shown, the roller 51 is disposed upstream of the upstream end Eb of the conveyor belt 31 in the conveyance direction of the substrate 91. Thus, the buffer unit 50 can correct the posture of the substrate 91 (correct the offset in the width direction) before the substrate 91 is placed on the conveyor belt 31. In addition, by disposing the roller 51 upstream of the upstream end Eb, buffering with the conveyor belt 31 can be prevented, and the installation height of the roller 51 can be set, improving the degree of freedom of installation.

[0062] Also, as Figure 5 shown, the roller 51 is disposed such that the portion 31A of the conveyor belt 31 that supports the substrate 91 in the vertical direction is within the vertical width of the roller 51. The above-mentioned "portion 31A that supports the substrate 91" corresponds to the portion of the endless conveyor belt 31 within the section that supports the substrate 91, that is, the portion that extends in the conveyance direction and is supported by a pair of conveyance guide pulleys 32. Moreover, the roller 51 is disposed such that the entire thickness Nb of this portion 31A is within the vertical width of the roller 51.

[0063] According to such a structure, the lower end of the roller 51 is located below the upper surface of the portion 31A of the conveyor belt 31 that supports the substrate 91. Thus, compared with a structure in which, for example, the lower end of the roller 51 is located above the upper surface of the conveyor belt 31 in the vertical direction and there is a gap between the roller 51 and the conveyor belt 31, the substrate 91 can be prevented from being caught between the roller 51 and the conveyor belt 31, and the conveyance process of the substrate 91 can be made more stable.

[0064] 4. Modified Forms of the Embodiment

[0065] 4-1. Regarding the Buffer Unit 50

[0066] In the embodiment, the buffer unit 50 includes a roller 51 and an arm 54, and the roller 51 has a soft outer ring 52 as a buffer portion. In contrast, the substrate conveyance device 11 may also adopt a structure in which the roller 51 is made movable to mitigate the impact applied to the substrate 91.

[0067] Specifically, as Figure 6 shown, in addition to the roller 51 and the arm 54, the buffer unit 150 further includes a rotary mechanism 60 disposed between the arm 54 and the guide rail 20. The rotary mechanism 60 includes a bracket 61 fixed to the guide rail 20. The bracket 61 supports the arm 54 so as to be rotatable about a rotation axis At serving as a vertical axis. The bracket 61 restricts the rotation of the arm 54 by omitting a stopper (not shown) so that the arm 54 rotates within a predetermined angular range Ra.

[0068] In addition, the rotating mechanism 60 resets the arm 54 by omitting a spring (not shown) so that the arm 54 is at the initial angle in a load-free state. The elastic force imparted to the arm 54 by the spring is set such that the arm 54 rotates when the substrate 91 contacts the roller 51. In this way, the rotating mechanism 60 constitutes a buffer unit that mitigates the impact applied to the substrate 91 by retracting the roller 51 by utilizing the impact when the substrate 91 contacts the outer peripheral surface 511 of the roller 51.

[0069] According to such a configuration, when the substrate 91 contacts the roller 51, due to the external force received by the roller 51, the arm 54 rotates against the elastic force of the spring, and the roller 51 temporarily moves backward. Thereby, the impact applied to the substrate 91 is mitigated. After that, when the substrate 91 is transported to the downstream side in the transport direction, the external force received by the roller 51 from the substrate 91 decreases, and it gradually returns to the initial angle. Along with this, the posture of the substrate 91 can be corrected (the offset in the width direction is corrected), and the substrate 91 can be introduced into the upstream end of the guide rail 20.

[0070] In addition, in the buffer unit 150 having such a rotating mechanism 60, a soft outer ring 52 can also be used for the outer ring 52 of the roller 51 to achieve further buffering. Further, in the above-described manner, the arm 54 is configured to rotate around the rotation axis At to retract the roller 51 to the outside of the guide rail 20 (the outside in the width direction of the substrate 91). In contrast, as the buffer unit, it is only necessary to mitigate the impact by retracting the roller 51 in a direction intersecting the central axis Ar. For example, it can also be configured such that the roller 51 in contact with the substrate 91 temporarily retracts to the downstream side in the transport direction.

[0071] 4-2. Others

[0072] In the embodiment, one roller 51 is arranged on the arm 54. In contrast, a plurality of rollers 51 can also be respectively arranged along the extending direction of the arm 54 on a pair of arms 54. Thereby, during the period of correcting the posture of the substrate 91, the plurality of rollers contact the outer edge of the substrate 91, and the respective external forces applied to the substrate 91 by the plurality of rollers 51 can be reduced.

[0073] In addition, in the embodiment, the substrate 91 is exemplified as a glass substrate. In contrast, the substrate 91 can also be harder than the glass substrate and have a thickness of 1 mm or more. Since the substrate handling device 11 includes the roller 51, the arm 54, and the buffer unit (outer ring 52, rotating mechanism 60), it has the effect of being able to protect the substrate 91 and correct the posture of the substrate 91 without reducing the transport speed. Therefore, it is useful to apply the buffer units 50 and 150 when transporting various substrates 91.

[0074] In the embodiment, the substrate processing machine to which the substrate handling device 11 is applied is a component mounter. In contrast, the substrate handling device 11 can be applied to various substrate processing machines. The same effect is achieved in such a configuration.

[0075] Description of Reference Numerals

[0076] 10: Component Mounting Machine, 11: Substrate Transfer Device, 20: Guide Rail, 21: Belt Guide, 30: Driving Unit, 31: Conveyor Belt, 50, 150: Buffer Unit, 51: Roller, 511: Outer Peripheral Surface, 52: Outer Ring (Buffer Portion), 53: Inner Ring, 54: Arm, 60: Rotary Mechanism (Buffer Portion), 61: Bracket, 91: Substrate, Ar: Central Axis, At: Rotation Axis, Eb: Upstream End, Nb: (Thickness of Conveyor Belt), Ns: (Thickness of Substrate), P1: Loading Position

Claims

1. A substrate handling device, comprising: A pair of guide rails for guiding both ends in the width direction of a substrate being transported in the transport direction; A plurality of rollers provided at the loading position of the pair of guide rails for loading the substrate so as to be rotatable about a central axis in the vertical direction, and guiding the substrate to be transported between the pair of guide rails; and A buffer portion for alleviating the impact when the substrate contacts the outer peripheral surface of the roller.

2. The substrate handling device according to claim 1, wherein, The buffer portion constitutes the outer peripheral surface of the roller respectively, and is formed of a material having a lower hardness than the substrate.

3. The substrate handling device according to claim 2, wherein, The buffer portion is formed of resin or rubber.

4. The substrate handling device according to claim 1, wherein, The buffer portion alleviates the impact by causing the roller to retreat in a direction intersecting the central axis when the substrate contacts the outer peripheral surface of the roller.

5. The substrate handling device according to any one of claims 1 to 4, wherein, The rollers are arranged such that the entire thickness of the substrate being transported in the vertical direction is within the vertical width of the rollers.

6. The substrate handling device according to any one of claims 1 to 4, wherein, The substrate handling device further includes a conveyor belt, which rotates along the pair of guide rails with the substrate placed thereon to transport the substrate in the transport direction, The rollers are arranged upstream of the upstream end of the conveyor belt in the transport direction of the substrate.

7. The substrate handling device according to claim 6, wherein, The rollers are arranged such that the portion of the conveyor belt supporting the substrate in the vertical direction is within the vertical width of the rollers.

8. The substrate handling device according to any one of claims 1 to 4, wherein, The substrate handling device further includes a pair of arms, which are respectively fixed to the loading positions of the pair of guide rails and extend upstream in the transport direction of the substrate, A plurality of the rollers are respectively rotatably supported by the pair of arms.

9. The substrate handling device according to claim 8, wherein, A plurality of the rollers are respectively arranged along the extending direction of the arms on the pair of arms.

10. The substrate handling device according to any one of claims 1 to 4, wherein, The substrate is a glass substrate having a thickness of 1 mm or less.

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