Method and system for bonding and curing non-metallic and metallic materials based on variable frequency microwaves

Abstract

The present invention discloses a variable-frequency microwave-based bonding and curing method and system for bonding non-metallic and metallic materials. The method comprises: obtaining the non-metallic material to be bonded, the metallic material, and the adhesive; applying and activating the adhesive to the non-metallic and metallic materials to enhance the adhesive's permeability and adhesion; and alternately curing the bonded non-metallic and metallic materials using variable-frequency microwave technology, controlling the ambient atmosphere during the curing process, and performing a cooling process after curing. The embodiments of the present invention can effectively improve the performance of the adhesive, thereby achieving a stronger bonding effect and better overall material performance.

Description

Technical Field

[0001] The present invention belongs to the field of bonding technology, and in particular to a bonding and curing method and system between non-metallic and metallic materials based on variable frequency microwaves. Background Art

[0002] With the rapid development of industry, the application of non-metallic and metallic materials is becoming increasingly widespread, especially in high-tech fields such as aerospace, automotive manufacturing, and electronics. The combination of these materials can achieve lighter and stronger designs while improving the overall performance of products. However, the differences in the physical and chemical properties of non-metallic and metallic materials lead to many challenges in the bonding process, such as insufficient bond strength, thermal expansion mismatch, and poor durability. These challenges have prompted researchers to seek more efficient and reliable methods to improve bonding performance to meet the growing needs of industry.

[0003] Traditional gluing and curing methods rely primarily on thermal or chemical reactions, which often require long curing times and can easily generate internal stress during the curing process, leading to material deformation. Furthermore, these methods have high environmental requirements and are easily affected by factors such as humidity and temperature, which can affect the bonding effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a method and system for bonding and curing non-metallic and metallic materials based on variable frequency microwaves to address the deficiencies in the prior art, effectively improve the performance of the adhesive, and thus achieve stronger bonding effects and better overall material performance.

[0005] One embodiment of the present application provides a method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves, the method comprising:

[0006] Obtaining non-metallic materials, metal materials and adhesives to be bonded;

[0007] Apply and activate adhesive to the non-metallic and metallic materials to be bonded to enhance the permeability and adhesion of the adhesive;

[0008] Utilize variable frequency microwave technology to alternately solidify the bonded non-metallic and metallic materials, control the ambient atmosphere during the solidification process, and perform cooling after solidification.

[0009] Optionally, obtaining the non-metallic material, the metal material, and the adhesive to be bonded includes:

[0010] Surface treatment of non-metallic materials to be bonded, using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive;

[0011] Coating the surface of the metal material to be bonded with a microwave absorbing coating composed of a conductive polymer or metal oxide with a thickness of 5-20 microns to enhance the absorption of microwave energy;

[0012] An adhesive with adjustable viscosity and strong bonding is obtained, wherein the adhesive comprises a polymer matrix and precious metal nanoparticles to form a composite material with improved thermal conductivity and mechanical strength. A controllable phase change material is added to the adhesive to cause a phase change in the range of 40°C to 60°C, thereby providing dynamic temperature control during the curing stage.

[0013] Optionally, the adhesive coating and activation of the non-metallic material and the metal material to be bonded includes:

[0014] Apply the adhesive evenly to the contact surface between non-metal and metal, with the coating thickness controlled between 100-500 microns, and use high-pressure spray technology to ensure uniform coating;

[0015] A first low-frequency microwave is used for preliminary activation after coating to heat the adhesive to a softening temperature within 10-30 seconds, wherein the first low-frequency microwave is 915 MHz and the softening temperature is 80°C to 100°C.

[0016] Optionally, the use of variable frequency microwave technology to alternately solidify the bonded non-metallic material and the metal material includes:

[0017] Initial curing was performed at a frequency of 2.45 GHz for 5 minutes, with the microwave power set to 30 W / cm² to promote rapid curing of the adhesive and its interaction with the metal surface;

[0018] Switch to a frequency of 1.2 GHz for 3 minutes and control the temperature of the curing area between 50°C and 70°C to take advantage of the properties of the phase change material, adjust the curing kinetics, and prevent stress concentration;

[0019] Finally, a second low-frequency microwave is used and maintained for 15 minutes to stabilize the curing effect and ensure uniform distribution of stress between the non-metallic and metallic materials, wherein the second low-frequency microwave is 850 MHz.

[0020] Optionally, the environmental atmosphere control is performed during the curing process, and the cooling treatment is performed after the curing is completed, including:

[0021] During the curing process, argon or nitrogen protective atmosphere is used to create a low-oxygen environment to reduce the oxidation reaction on the metal surface while maintaining the stability of the adhesive;

[0022] Monitor and adjust the temperature and humidity during the curing process, maintaining the temperature between 20°C and 25°C and the humidity between 40% and 60% to ensure optimal conditions for the gluing process;

[0023] After the curing is completed, a slow cooling process is carried out, and the temperature is controlled at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden drop in temperature.

[0024] Another embodiment of the present application provides a variable frequency microwave-based bonding and curing system between non-metallic and metallic materials, the system comprising:

[0025] An acquisition module, used for acquiring non-metallic materials, metallic materials and adhesives to be bonded;

[0026] Gluing module, used to apply and activate adhesive to non-metallic materials and metal materials to be glued, so as to enhance the permeability and adhesion of the adhesive;

[0027] The curing module is used to alternately cure the bonded non-metallic materials and metallic materials using variable frequency microwave technology, control the ambient atmosphere during the curing process, and perform cooling after the curing is completed.

[0028] Yet another embodiment of the present application provides a storage medium, wherein the storage medium stores a computer program, wherein the computer program is configured to execute any of the above methods when run.

[0029] Yet another embodiment of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute any of the above methods.

[0030] Compared with the existing technology, the present invention provides a method for bonding and curing non-metallic and metal materials based on variable frequency microwaves, which obtains non-metallic materials, metal materials and adhesives to be bonded; applies adhesive to and activates the non-metallic materials and metal materials to be bonded to enhance the permeability and adhesion of the adhesive; uses variable frequency microwave technology to alternately cure the bonded non-metallic materials and metal materials, controls the environmental atmosphere during the curing process, and performs cooling treatment after the curing is completed, thereby effectively improving the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive material performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A hardware structure block diagram of a computer terminal for a method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves provided in an embodiment of the present invention;

[0032] Figure 2A schematic flow chart of a method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves provided in an embodiment of the present invention;

[0033] Figure 3 A schematic structural diagram of a variable frequency microwave-based bonding and curing system between non-metallic and metallic materials provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0034] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0035] The embodiment of the present invention first provides a method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves. The method can be applied to electronic devices such as computer terminals, specifically ordinary computers.

[0036] The following describes it in detail by taking running on a computer terminal as an example. Figure 1 The hardware structure block diagram of a computer terminal for a method of bonding and curing non-metallic and metallic materials based on variable frequency microwaves provided by an embodiment of the present invention. Figure 1 As shown, the computer device includes a processor, a memory, and a network interface connected via a system bus, wherein the memory may include a non-volatile storage medium and an internal memory.

[0037] The non-volatile storage medium can store an operating system and a computer program. The computer program includes program instructions, which, when executed, can enable the processor to execute any variable frequency microwave-based bonding and curing method between non-metallic and metallic materials.

[0038] The processor is used to provide computing and control capabilities and support the operation of the entire computer equipment.

[0039] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor, the processor can execute any one of the frequency-converting microwave-based bonding and curing methods between non-metallic and metallic materials.

[0040] The network interface is used for network communication, such as sending assigned tasks, etc. Those skilled in the art will understand that Figure 1 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0041] It should be understood that the processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0042] See also Figure 2 The embodiment of the present invention provides a method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves, which may include the following steps:

[0043] S201, obtaining non-metallic materials, metal materials and adhesives to be bonded;

[0044] In the present invention, obtaining the non-metallic material, metal material and adhesive to be bonded is the first step in the entire bonding and curing method. This process involves selecting suitable materials to ensure the performance and reliability of the final product. Non-metallic materials generally include plastics, composite materials or glass fibers, while metal materials include aluminum, steel, copper, etc. According to application requirements, it is crucial to select materials with excellent mechanical properties, heat resistance and corrosion resistance. In addition, the selection of adhesives is also very critical, and their properties and functions will directly affect the bonding performance, such as adhesion, temperature resistance and hydrolytic stability. Therefore, considering the physical and chemical properties of the materials and their respective application scenarios, suitable materials to be bonded and adhesives are selected to lay the foundation for subsequent steps.

[0045] Effective implementation of this stage ensures that the materials used have excellent properties and compatibility, providing a foundation for the subsequent gluing process. Through reasonable material selection, subsequent problems caused by material mismatches, such as insufficient bonding strength and thermal expansion mismatch, can be reduced, thereby improving the reliability and durability of the gluing interface. In addition, optimizing the material ratio and properties will also provide better conditions for the subsequent curing process, thereby enhancing the bonding effect between the materials and ensuring that the final product can maintain its performance under extreme conditions. Therefore, obtaining suitable non-metallic materials, metal materials and adhesives is a key link in the entire process, and its importance cannot be ignored.

[0046] Specifically, the non-metallic material to be bonded can be surface treated by using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive;

[0047] During the bonding process, the surface properties of non-metallic materials are crucial to the adhesion performance of the adhesive. Surface treatment of non-metallic materials, such as plasma cleaning or chemical etching, effectively removes surface contaminants and oxide layers, significantly increasing the material's surface energy. This process provides a better adhesion foundation for the adhesive, allowing it to penetrate deeper into the material's microstructure and form a strong bond. Increasing the surface energy of non-metallic materials directly enhances the adhesion of the adhesive, thereby increasing the strength and stability of the entire bonded structure. This step is crucial to ensuring a good bond between non-metallic and metallic materials, helping to improve the overall performance and durability of the product, especially when subjected to external stress or temperature fluctuations.

[0048] Before beginning surface treatment, a preliminary inspection of the non-metallic materials to be bonded is required to ensure that there is no visible surface dirt, grease, or oxide layers. For polymer materials, for example, they are first placed in a plasma cleaning device. This device can adjust the gas type and flow rate, for example, using a mixture of argon and oxygen, to create a suitable plasma environment. The appropriate power and treatment time are then set, typically between 100-200 watts for approximately 5-10 minutes, depending on the properties of the material. After treatment, the non-metallic surface is cleaned and activated, significantly increasing its surface energy, allowing for better adhesion of the subsequent adhesive.

[0049] Selecting the right solution is crucial in chemical etching techniques. For some polymers, hydrofluoric acid can effectively etch their surfaces. Place the material in the prepared hydrofluoric acid solution and soak for 5-15 minutes, depending on the material's corrosion resistance. Throughout the process, ensure the material is operated in a well-ventilated area and wear protective equipment for safety. After etching, rinse the material with deionized water to remove any residual chemicals and then blow dry with nitrogen or compressed air. This not only removes surface contaminants but also creates a microscopic roughness, further improving the adhesion of the adhesive.

[0050] Finally, the treated non-metallic material needs to be glued together quickly to prevent further contamination. After treatment, it is recommended that the material be stored in dust-proof bags or sealed containers, and in an environment with limited humidity and temperature to minimize oxidation. This series of steps ensures the non-metallic material's surface is in optimal condition, laying a solid foundation for the subsequent gluing process.

[0051] Coating the surface of the metal material to be bonded with a microwave absorbing coating composed of a conductive polymer or metal oxide with a thickness of 5-20 microns to enhance the absorption of microwave energy;

[0052] The primary purpose of applying a microwave-absorbing coating is to increase the metal's energy absorption capacity during microwave curing. This coating, typically composed of a conductive polymer or metal oxide, effectively absorbs microwave energy and converts it into heat, helping to improve the curing efficiency and quality of the adhesive. In terms of coating thickness control, choosing a thickness of 5-20 microns can avoid affecting the mechanical properties of the metal while ensuring good absorption. Applying a microwave-absorbing coating to the metal surface effectively improves the uniformity and speed of heating during microwave curing, allowing the adhesive to reach the required curing temperature in a shorter period of time. This technology not only improves production efficiency but also effectively reduces stress concentration caused by uneven temperatures, thereby enhancing the overall mechanical properties and long-term reliability of the product.

[0053] The microwave-absorbing coating process begins by preparing the required conductive polymer solution or metal oxide powder. For example, conductive polymers such as polypyrrole (PPy) or polyaniline (PANI) are dissolved in a suitable solvent to form a uniform coating solution. The metal material then undergoes pretreatment, such as a simple cleaning to remove surface contaminants and ensure proper adhesion. The coating can then be evenly applied to the metal surface by spraying, dipping, or brushing, ensuring a controlled coating thickness of 5-20 microns.

[0054] During the spraying process, ensure the appropriate distance between the spray gun and the metal surface—typically 15-30 cm—to avoid excessively thick or uneven coatings. Applying multiple thin sprays not only ensures even distribution of the coating but also helps control thickness. For example, spray a thin layer first, then allow it to dry before applying a second coat until the desired thickness is reached. Throughout the entire process, pay attention to the effects of ambient temperature and humidity to ensure proper adhesion and performance during the drying process.

[0055] After coating, the metal material needs to be cured in an oven to improve the coating's adhesion and stability. Setting an appropriate oven temperature, such as 80-120°C for 30 minutes to one hour, helps remove solvent from the coating and strengthens its bond to the metal substrate. After curing, performance testing, such as microwave absorption testing, is required to ensure the coating's full performance during the subsequent curing process.

[0056] An adhesive with adjustable viscosity and strong bonding is obtained, wherein the adhesive comprises a polymer matrix and precious metal nanoparticles to form a composite material with improved thermal conductivity and mechanical strength. A controllable phase change material is added to the adhesive to cause a phase change in the range of 40°C to 60°C, thereby providing dynamic temperature control during the curing stage.

[0057] The key to this step is to prepare a special adhesive whose composite material structure not only provides excellent bonding properties, but also has good thermal conductivity and mechanical strength. By introducing precious metal nanoparticles, these particles can enhance the overall thermal management capabilities of the adhesive due to their excellent thermal conductivity. At the same time, the added controllable phase change material can provide the necessary temperature regulation during the curing process, so that the adhesive can maintain the optimal bonding state when the temperature changes. The design of this adhesive can achieve dynamic temperature control during the curing stage, thereby improving the adaptability of the adhesive during the curing process and reducing the stress caused by rapid temperature changes. In addition, the enhanced thermal conductivity and mechanical strength enable the final product to exhibit better performance under stress and heat, adapting to more demanding application environments.

[0058] In the initial stage of adhesive preparation, a suitable polymer matrix, such as epoxy or polyurethane, is selected, as these materials typically exhibit high curing properties and strength. The polymer matrix is then added to a container in a specific proportion. Precious metal nanoparticles, such as gold or silver, are then gradually added and uniformly mixed using an ultrasonic mixer. This process requires a controlled nanoparticle concentration, typically 1% to 5% of the matrix, to ensure optimal performance of the final adhesive without compromising its fluidity.

[0059] After the matrix and nanoparticles are mixed, a controllable phase change material is added to further enhance the thermal management properties of the adhesive. The choice of controllable phase change material can be determined based on the application requirements; commonly used ones include paraffin-based or salt-based phase change materials. These phase change materials can be dissolved or dispersed in a small amount of solvent before being gradually added to the adhesive to ensure even distribution. After mixing, sufficient stirring should be performed to prevent clumping. This not only ensures the adhesive's ability to regulate temperature during the curing phase but also improves its overall strength and thermal conductivity.

[0060] Finally, the mixed adhesive undergoes viscosity testing and curing performance evaluation to confirm its suitability for practical applications. In the laboratory, viscosity can be tested using equipment such as a rotational viscometer to ensure good fluidity at room temperature for easy coating and application. Once performance is confirmed to meet requirements, small-scale trial bonding experiments can be conducted to observe curing performance under different temperature conditions, ensuring that the expected strong bond and dynamic temperature control can be achieved in practical applications.

[0061] S202, applying and activating adhesive to the non-metallic material and the metal material to be bonded to enhance the permeability and adhesion of the adhesive;

[0062] The application and activation of adhesives are crucial steps in the bonding of non-metallic and metallic materials. This process involves applying an appropriate adhesive to the contact surfaces of the non-metallic and metallic materials and enhancing the adhesive's properties through a specific activation technique. This enhances the adhesive's permeability, allowing it to better penetrate the microscopic pores of the contacting surfaces, thereby improving its adhesion. Furthermore, activation allows the adhesive to reach its softening temperature more quickly, improving its fluidity and ensuring even distribution across the contacting surfaces.

[0063] This coating and activation method not only enhances the adhesive's adhesion but also significantly improves the overall bonding performance. The enhanced adhesive, after coating, is better able to adapt to the surface characteristics of different materials, particularly when non-metallic materials have low surface energy, which often results in poor bonding. By improving its permeability and fluidity, the adhesive forms a stronger bond at the interface between the non-metallic and metal, thereby enhancing the mechanical properties and durability of the final product, which is crucial for improving the overall performance and service life of the material.

[0064] Specifically, the adhesive can be evenly coated on the contact surface between the non-metal and the metal, with the coating thickness controlled between 100-500 microns, and high-pressure spray technology is used to ensure uniform coating;

[0065] In this step, uniform coating of the adhesive is crucial. First, the adhesive is evenly sprayed in an atomized form on the contact surface of the non-metallic material and the metal material through high-pressure spray technology. This spray technology can ensure that the adhesive is quickly dispersed to the contact surface during the coating process, avoiding differences in bonding strength caused by uneven coating. During the coating process, the coating thickness of the adhesive needs to be strictly controlled between 100-500 microns. This range can not only ensure that good bonding is formed between the bonded materials, but also will not cause various problems in the curing process due to excessively thick coating. Uniform adhesive coating is the basis for ensuring the bonding between non-metallic and metal materials, and good coating quality directly affects the mechanical properties and durability after bonding. This step can effectively avoid problems such as poor bonding and stress concentration caused by uneven coating, thereby improving the reliability and safety of the product. By controlling the coating thickness, uneven curing process and residual internal stress caused by excessively thick adhesive can also be avoided, further improving the adaptability and service life of the material.

[0066] In this step, the adhesive must first be prepared. To ensure an efficient and uniform spraying process, the viscosity of the adhesive must be moderate. Typically, amino resins or polyurethane adhesives are commonly used, as they can form a high-strength bond after curing. The adhesive is placed in the liquid storage tank of the high-pressure spray device, and the setting of the adjustment device is used to ensure that its spraying pressure is within the appropriate range, generally set between 0.5-1.5 MPa. The specific value is adjusted appropriately according to the characteristics of the adhesive and the model of the nozzle.

[0067] Next, ensure the spray equipment's nozzle is clean and unobstructed to avoid uneven application. For contact surfaces between non-metallic and metallic materials, first clean and treat these surfaces to remove oil and dust, ensuring adequate contact between the adhesive and the substrate. After cleaning, use high-pressure spray equipment to evenly apply the adhesive to the contact surface, maintaining a controlled thickness of 100-500 microns. To achieve this, choose from various spray patterns, such as cross-spray or circular spray, to ensure full coverage of the contact surface.

[0068] After spraying, the adhesive coating must be inspected for thickness. This can be accomplished with a non-contact laser thickness gauge, ensuring that each coated area is within the specified thickness range. If localized excess or deficiency is detected, additional spraying or re-application can be performed as needed. Maintaining the stability and accuracy of the spraying equipment is crucial to adhesive coating quality. Regular equipment inspection and calibration ensures consistent, even, and precise adhesive application throughout the production process.

[0069] A first low-frequency microwave is used for preliminary activation after coating to heat the adhesive to a softening temperature within 10-30 seconds, wherein the first low-frequency microwave is 915 MHz and the softening temperature is 80°C to 100°C.

[0070] In this step, the adhesive is initially activated using a first low-frequency microwave, rapidly heating it to its softening temperature in a short period of time. This activation method utilizes the penetrating properties of microwaves to uniformly heat the interior of the adhesive, thereby accelerating its softening process and improving its fluidity. Within this temperature range, the viscosity of the adhesive decreases significantly, allowing it to better fill the tiny gaps between contact surfaces, enhancing the adhesive's adhesion and permeability, and resulting in a more ideal final bonding effect. Through initial activation, the fluidity and bonding ability of the adhesive are significantly improved, laying a good foundation for the subsequent curing process. This process effectively increases the mutual contact area between the materials, thereby enhancing the strength and tolerance of the bond. At the same time, rapid and uniform heating can also reduce potential damage caused by temperature differential stress, improve the overall bonding quality, ensure that the material exhibits excellent mechanical properties and stability during use, and provide a reliable solution for a variety of applications.

[0071] During the first low-frequency microwave activation step, first place the adhesive-coated non-metallic and metallic materials within the microwave activation equipment's operating area. Before starting, ensure the equipment is in proper working order. This can be confirmed by checking the microwave transmitter's frequency and power parameters. Set the frequency to 915 MHz and adjust the microwave power based on the material and adhesive characteristics; a range of 50W to 200W is generally recommended. After starting the equipment, adjust its height and angle to ensure even microwave coverage across all coated surfaces.

[0072] During the activation process, ensure the activation time is controlled between 10 and 30 seconds. Microwave heating utilizes the vibration of water molecules and free radicals within the adhesive to rapidly increase the temperature. Monitor temperature changes during this process. It is recommended to use an infrared thermometer to monitor the adhesive's temperature in real time to ensure it reaches the set softening point (80°C to 100°C). This rapid and uniform heating method positively promotes the adhesive's internal fluidity and adhesion, effectively improving its permeability and enabling it to better fill gaps between contact surfaces.

[0073] If the adhesive fails to reach the desired softening temperature in time, equipment parameters may need to be adjusted, such as increasing microwave power or extending heating time. However, some adhesives are sensitive to temperature, so adjustments must be made to avoid overheating, which could lead to adhesive decomposition or performance degradation. Throughout the entire process, it is important to maintain environmental stability to prevent external fluctuations from affecting the heating process, ensuring uniform and appropriate activation of the adhesive.

[0074] S203, using variable frequency microwave technology to alternately cure the bonded non-metallic material and the metal material, controlling the ambient atmosphere during the curing process, and performing a cooling process after the curing is completed.

[0075] Variable-frequency microwave technology is used to alternately cure the bonded non-metallic and metal materials. This approach aims to optimize the adhesive's curing process by adjusting the microwave frequency and curing time. Specifically, the curing process is divided into three stages: initial curing, temperature adjustment, and final curing. Each stage involves applying microwaves of varying frequencies to the bonded material, enabling the adhesive to effectively interact with the metal surface during the curing process and forming a uniform, stable bond layer at the bonded interface. This approach not only increases the curing speed but also improves the overall material performance, ensuring a high-strength bond between the non-metallic and metal materials.

[0076] By using variable-frequency microwave technology for alternating curing of adhesive materials, the bonding effect is significantly improved, stress concentration between materials is reduced, and the overall reliability and durability of the materials are enhanced. Variable-frequency microwaves provide a flexible heating method, allowing curing conditions to be adjusted according to the needs of different stages, thereby creating an optimal curing environment. This is of great significance for improving the product's performance stability and its ability to operate under high loads and extreme environments, especially in aerospace, automotive, and other high-tech applications, ensuring the long-term safety of the product.

[0077] Specifically, variable frequency microwave technology is used to alternately cure the bonded non-metallic and metallic materials. Initial curing can be performed at a frequency of 2.45 GHz for 5 minutes, with the microwave power set to 30 W / cm² to promote rapid curing of the adhesive and its interaction with the metal surface.

[0078] During the alternating curing of the bonded non-metallic and metallic materials, a preliminary curing phase is performed at a frequency of 2.45 GHz for 5 minutes, with a microwave power setting of 30 W / cm². This phase utilizes microwaves of this specific frequency to accelerate the curing process of the adhesive and promote good interaction between the adhesive and the metal surface. High-frequency microwaves effectively excite the molecules within the adhesive, rapidly moving them through the softening zone and into the curing phase. During this process, the metal surface temperature is monitored to ensure it does not exceed the thermal failure temperature of the material. Furthermore, the adhesive temperature changes during the curing process are monitored to ensure that the designed curing characteristics are achieved.

[0079] During the initial curing phase, the microwave curing equipment must be configured and the appropriate parameters set. Before operation, ensure that the equipment's microwave generator is operating normally and stably generating a 2.45 GHz frequency signal. Next, place the bonded non-metallic and metallic materials in the microwave chamber, ensuring they are positioned for even microwave distribution. After starting the equipment, set the microwave power to 30 W / cm² and the curing time to 5 minutes on the control panel. A real-time monitoring system monitors the adhesive's temperature to ensure that overheating or localized hypothermia occurs during the curing process.

[0080] During operation, special attention must be paid to the surface condition of the bonding material. Due to the high thermal conductivity of metal materials, microwave excitation may cause the metal surface to heat up rapidly. Therefore, an infrared thermometer should be used to monitor the metal surface temperature to ensure it remains within a safe range. If the temperature exceeds the designed range, microwave transmission should be immediately stopped, power settings adjusted, or cooling measures implemented. Furthermore, cooling liquid can be placed in the curing tank to help control the temperature and prevent material damage due to overheating.

[0081] After the initial curing step, the adhesive should be tested for curing effectiveness. Tensile or shear tests can be used to assess the bond strength and ensure that the bond will meet expected performance standards during the subsequent curing step. Recording the initial curing temperature and time parameters provides data for subsequent process optimization and equipment adjustments.

[0082] Switch to a frequency of 1.2 GHz for 3 minutes and control the temperature of the curing area between 50°C and 70°C to take advantage of the properties of the phase change material, adjust the curing kinetics, and prevent stress concentration;

[0083] After the initial curing is completed, the frequency is switched to 1.2GHz for the second stage of curing, which lasts for 3 minutes. This stage aims to utilize the characteristics of the phase change material to regulate the temperature during the curing process and prevent potential damage due to stress concentration. Within this frequency range, microwaves can more effectively penetrate the interior of the material and promote the phase change process of the phase change material, thereby providing flexibility and adaptability of the material under load, making the overall curing process more balanced and stable. By switching the microwave frequency at this stage, the thermal properties of the phase change material can be effectively utilized to regulate the temperature of the bonding area. Stress concentration caused by excessively high or uneven temperature distribution is avoided, ensuring the formation of a good bonding interface between non-metallic and metallic materials, significantly improving the durability and reliability of the product. Compared with the single-frequency curing method, this process significantly enhances the toughness of the material and reduces the risk of cracking that may occur during use. Especially in harsh operating environments, it can fully demonstrate its excellent fatigue resistance.

[0084] During the second stage of curing, the microwave device parameters must be reconfigured, adjusting the frequency to 1.2 GHz and setting the duration to 3 minutes. To ensure effective microwave penetration, the material placement in the curing area is appropriately adjusted, such as spacing the materials appropriately to ensure uniform microwave coverage. After starting the equipment, the temperature in the bonding area is monitored in real time, using temperature monitoring equipment to ensure that the curing area remains between 50°C and 70°C to ensure optimal performance of the phase change material.

[0085] During this process, if the temperature is detected to exceed a preset range, the microwave power needs to be adjusted immediately, the excitation intensity reduced, or cooling methods introduced. For example, airflow can be introduced into the curing chamber to remove excess heat and ensure that the temperature during the curing process remains within a safe range. At the same time, the environment should be kept stable to prevent adverse effects on the curing process such as air flow and humidity changes.

[0086] After curing, the bonding performance of the material is evaluated again. The microstructure of the bonded layer is checked to ensure that there are no bubbles or defects. The temperature and time data of this stage are recorded to provide a reference for further improvement of the curing process.

[0087] Finally, a second low-frequency microwave is used and maintained for 15 minutes to stabilize the curing effect and ensure uniform distribution of stress between the non-metallic and metallic materials, wherein the second low-frequency microwave is 850 MHz.

[0088] Finally, after curing is complete, a second low-frequency microwave treatment (850 MHz) is applied for 15 minutes to stabilize the curing effect. This stage ensures the stability and uniformity of the cured adhesive during long-term use. The 850 MHz low-frequency microwaves reactivate the molecules in the adhesive, densifying the internal structure of the bonded layer and reducing stress concentration caused by temperature differences, thus ensuring the final material connection. The prolonged action of the low-frequency microwaves in this stage effectively eliminates any internal stresses, promoting complete curing of the adhesive and enhancing the strength and toughness of the bonded interface. Especially after exposure to high temperatures or mechanical shock, the evenly distributed microwave excitation helps the material maintain its mechanical properties, reducing the risk of delamination and fracture. This process not only provides a higher safety margin for the product but also significantly extends the material's service life, ensuring its reliability in high-performance applications.

[0089] During the final curing stage, the microwave equipment must first be set to a frequency of 850 MHz and a duration of 15 minutes. The material should be positioned appropriately within the curing area to ensure even microwave exposure. After starting the microwave equipment, the temperature of the curing area must be monitored to ensure it remains within the optimal range to further stabilize the adhesive.

[0090] To maintain optimal curing results, it's recommended to incorporate a temperature monitoring system during the curing process to ensure no abnormal temperature fluctuations. Operators should continuously monitor the bondline, particularly at edges and joints, to prevent defects caused by bubbles or internal stress buildup. If any abnormal temperature fluctuations are detected during the curing process, the microwave power should be adjusted or the curing time extended to ensure a smooth curing process.

[0091] Finally, after curing is complete, strength testing and microstructural inspection are recommended to evaluate the performance and structural integrity of the bonded layer to ensure the stability and reliability of the bonded material in subsequent applications. This data not only provides a basis for the quality control of the finished product, but also provides a practical reference for subsequent process improvements.

[0092] Specifically, the ambient atmosphere is controlled during the curing process and a cooling treatment is performed after the curing is completed. During the curing process, an argon or nitrogen protective atmosphere can be used to create a low-oxygen environment to reduce the oxidation reaction on the metal surface while maintaining the stability of the adhesive.

[0093] During the curing process, an argon or nitrogen protective atmosphere is used to create a low-oxygen environment, minimizing oxidation on the metal surface while maintaining the chemical stability of the adhesive. As inert gases, argon and nitrogen effectively isolate oxygen from the outside air, preventing metal oxidation at high temperatures and ensuring that the bonded surfaces remain unaffected by oxides during the curing process. This control strategy not only improves the adhesion between the metal and the adhesive but also enhances the bond strength after curing, thereby enhancing the performance and service life of the final product. Implementing a low-oxygen environment significantly improves the bond quality between metal and non-metallic materials, preventing bond failure due to oxidation. Furthermore, maintaining an argon or nitrogen protective atmosphere helps enhance the adhesive's stability and necessary temperature control capabilities during the curing process, ensuring that the final bonded joint exhibits excellent fatigue resistance and long-term reliability. This is crucial for bonding materials in demanding industries such as aerospace and automotive.

[0094] During the curing process, an argon or nitrogen protective atmosphere is used to create a low-oxygen environment, reducing oxidation reactions on the metal surface while maintaining the stability of the adhesive. This operation first requires the establishment of a closed atmosphere system within the curing chamber to prevent the ingress of external air. The atmosphere system can be equipped with a flow meter and control valve to adjust the inflow of argon or nitrogen as needed. Next, a gas replacement test is conducted to ensure that the preset low-oxygen environment has been achieved inside the cavity before curing begins. During the gas replacement process, the purity of the protective gas can be confirmed by visual or odor detection systems to ensure that it meets the predetermined standards.

[0095] During the curing process, oxygen sensors are used to continuously monitor the oxygen concentration in the protective atmosphere, ensuring it remains below 0.1%. If monitoring indicates an increase in oxygen concentration, the gas flow rate must be quickly adjusted or an alternate gas source must be used to ensure that the adhesive applied to metal surfaces and non-metallic materials does not fail due to oxidation during curing. Furthermore, an alarm system can be configured to automatically sound an alarm if oxygen concentration exceeds a safe threshold, prompting operators to take prompt action.

[0096] Finally, after curing is complete, maintain a low-oxygen environment for a period of time to enhance the stability and performance of the adhesive. This delay ensures that the metal no longer undergoes oxidation, allowing the adhesive to fully cure and achieve optimal bonding. All monitoring data should be recorded in real time to facilitate subsequent analysis and refinement of process parameters for even greater bonding performance and material safety.

[0097] Monitor and adjust the temperature and humidity during the curing process, maintaining the temperature between 20°C and 25°C and the humidity between 40% and 60% to ensure optimal conditions for the gluing process;

[0098] Monitor and adjust the temperature and humidity during the curing process, maintaining the temperature between 20°C and 25°C and the humidity between 40% and 60% to ensure optimal conditions for the bonding process. Temperature and humidity are important factors affecting adhesive performance and are crucial for ensuring uniform curing and avoiding bubbles and defects. Precise environmental control provides ideal reaction conditions for the adhesive during the curing process, allowing it to fully realize its properties. Strict monitoring and regulation of ambient temperature and humidity effectively improves adhesive adhesion and cure uniformity, reducing fluctuations in cure quality caused by environmental changes. This not only helps improve the strength and durability of the final joint but also ensures reliable bonding between materials when used in high-humidity or high-temperature environments. Therefore, this control measure has important industrial applications, particularly in the manufacture of high-performance composite materials and structural components, improving overall process consistency and product quality.

[0099] Monitor and adjust the temperature and humidity during the curing process, maintaining the temperature between 20°C and 25°C and the humidity between 40% and 60% to ensure optimal conditions for the gluing process. This step requires equipping the curing equipment with temperature and humidity sensors and control devices to ensure real-time monitoring of environmental conditions throughout the curing process. Furthermore, the system should include automatic adjustment capabilities to ensure that changes in temperature or humidity are adjusted to the set values.

[0100] Specifically, if the temperature is low, heating elements such as hot air circulators or infrared heating tubes can be used to quickly raise the ambient temperature to the standard range. If the humidity is low, a protective humidity generator can be used to spray humidification into the curing chamber. In complex application scenarios, it is recommended to use a PID controller to make temperature and humidity regulation more precise and stable, ensuring that the entire gluing process is not affected by environmental changes.

[0101] Furthermore, recording and analyzing monitoring data is crucial. Operators should regularly review data records to identify potential abnormal patterns and make timely adjustments to prevent temperature and humidity fluctuations from negatively impacting adhesive performance. To improve monitoring effectiveness, automated systems can be introduced to analyze data using computer software and generate regular reports to facilitate informed decision-making during future bonding operations.

[0102] After the curing is completed, a slow cooling process is carried out, and the temperature is controlled at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden drop in temperature.

[0103] After the solidification is completed, a slow cooling process is carried out, and the temperature is controlled at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden drop in temperature. Slow cooling is one of the key process steps. Its main purpose is to eliminate the thermal stress inside the material caused by rapid cooling, and to ensure that the bonding interface between the non-metallic and metal materials remains stable after solidification and is not prone to cracking. Through slow cooling, the internal stress of the solidified joint can be evenly released during temperature changes, especially in the case of uneven thermal expansion and contraction, and the risk of stress concentration in certain sections can be minimized. This processing step helps to improve the service life and safety of the material, especially in application environments with strict requirements and large workload changes. This temperature control is one of the key processes for high-performance products, which can effectively ensure that the connection between non-metallic and metal materials is firm and reliable.

[0104] After curing is complete, a slow cooling process is performed, maintaining a controlled cooling rate of 10°C / min to avoid internal stress in the material caused by sudden temperature drops. To achieve this, the curing equipment must be equipped with an advanced cooling system that can adjust the cooling rate according to the temperature of the curing material. Specifically, after curing, a reasonable cooling cycle and temperature curve must be set based on the properties and thickness of the material to ensure that the material gradually adapts to the ambient temperature.

[0105] During the cooling phase, water or air cooling can be used. For thicker joints, water cooling is generally recommended due to its higher heat exchange efficiency, allowing the set cooling rate to be achieved in a shorter time. During the cooling process, it is important to monitor not only the surface temperature of the material but also the internal temperature to ensure that the temperature gradient remains within a reasonable range during the cooling process. This prevents internal stress caused by temperature differences from affecting the stability and strength of the material.

[0106] Finally, it is recommended to conduct mechanical testing of the material after cooling is complete to ensure that no cracks or other defects have occurred during the slow cooling process. This can be demonstrated through various methods, such as tensile testing and shear testing. The test results will be used to analyze the effectiveness of the cooling method and provide feedback for future production. If the test does not meet the expected standards, the cooling strategy will need to be optimized to ensure the quality of the bonding and the performance of the material in the next production run.

[0107] It can be seen that the non-metallic materials, metal materials and adhesives to be bonded are obtained; the adhesive is applied and activated to the non-metallic materials and metal materials to be bonded to enhance the permeability and adhesion of the adhesive; the non-metallic materials and metal materials after bonding are alternately cured using variable frequency microwave technology, the environmental atmosphere is controlled during the curing process, and cooling treatment is performed after the curing is completed, thereby effectively improving the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive material performance.

[0108] Another embodiment of the present invention provides a non-metallic and metallic material bonding and curing system based on variable frequency microwaves, see Figure 3 , the system may include:

[0109] An acquisition module 301 is used to acquire non-metallic materials, metallic materials, and adhesives to be bonded;

[0110] The gluing module 302 is used to apply and activate the adhesive to the non-metallic material and the metal material to be glued, so as to enhance the permeability and adhesion of the adhesive;

[0111] The curing module 303 is used to alternately cure the bonded non-metallic material and the metallic material using variable frequency microwave technology, control the ambient atmosphere during the curing process, and perform cooling after the curing is completed.

[0112] It can be seen that the non-metallic materials, metal materials and adhesives to be bonded are obtained; the adhesive is applied and activated to the non-metallic materials and metal materials to be bonded to enhance the permeability and adhesion of the adhesive; the non-metallic materials and metal materials after bonding are alternately cured using variable frequency microwave technology, the environmental atmosphere is controlled during the curing process, and cooling treatment is performed after the curing is completed, thereby effectively improving the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive material performance.

[0113] An embodiment of the present invention further provides a storage medium storing a computer program, wherein the computer program is configured to execute the steps of any one of the above method embodiments when running.

[0114] Specifically, in this embodiment, the above-mentioned storage medium may be configured to store a computer program for performing the following steps:

[0115] S201, obtaining non-metallic materials, metal materials and adhesives to be bonded;

[0116] S202, applying and activating adhesive to the non-metallic material and the metal material to be bonded to enhance the permeability and adhesion of the adhesive;

[0117] S203, using variable frequency microwave technology to alternately cure the bonded non-metallic material and the metal material, controlling the ambient atmosphere during the curing process, and performing a cooling process after the curing is completed.

[0118] It can be seen that the non-metallic materials, metal materials and adhesives to be bonded are obtained; the adhesive is applied and activated to the non-metallic materials and metal materials to be bonded to enhance the permeability and adhesion of the adhesive; the non-metallic materials and metal materials after bonding are alternately cured using variable frequency microwave technology, the environmental atmosphere is controlled during the curing process, and cooling treatment is performed after the curing is completed, thereby effectively improving the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive material performance.

[0119] An embodiment of the present invention further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any one of the above method embodiments.

[0120] Specifically, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0121] Specifically, in this embodiment, the processor may be configured to execute the following steps through a computer program:

[0122] S201, obtaining non-metallic materials, metal materials and adhesives to be bonded;

[0123] S202, applying and activating adhesive to the non-metallic material and the metal material to be bonded to enhance the permeability and adhesion of the adhesive;

[0124] S203, using variable frequency microwave technology to alternately cure the bonded non-metallic material and the metal material, controlling the ambient atmosphere during the curing process, and performing a cooling process after the curing is completed.

[0125] It can be seen that the non-metallic materials, metal materials and adhesives to be bonded are obtained; the adhesive is applied and activated to the non-metallic materials and metal materials to be bonded to enhance the permeability and adhesion of the adhesive; the non-metallic materials and metal materials after bonding are alternately cured using variable frequency microwave technology, the environmental atmosphere is controlled during the curing process, and cooling treatment is performed after the curing is completed, thereby effectively improving the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive material performance.

[0126] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the scope of implementation of the present invention is not limited to what is shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present invention.

Claims

1. A method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves, characterized in that: The method comprises: Obtaining non-metallic materials, metal materials and adhesives to be bonded; Applying and activating adhesive to the non-metallic and metal materials to be bonded to enhance the permeability and adhesion of the adhesive, including: uniformly applying the adhesive to the contact surface between the non-metallic and metal materials, with the coating thickness controlled between 100-500 microns, using high-pressure spray technology to ensure uniform coating; using a first low-frequency microwave to perform preliminary activation after coating, so that the adhesive is heated to a softening temperature within 10-30 seconds, wherein the first low-frequency microwave is 915 MHz and the softening temperature is 80°C to 100°C; Utilize variable frequency microwave technology to alternately cure the bonded non-metallic and metallic materials, control the ambient atmosphere during the curing process, and perform cooling after curing. This includes: initial curing at a frequency of 2.45 GHz for 5 minutes, with the microwave power set to 30 W / cm 2 , to promote the rapid curing of the adhesive and its interaction with the metal surface; switch to a frequency of 1.2 GHz for 3 minutes, and control the temperature of the curing area between 50°C and 70°C to utilize the characteristics of the phase change material to adjust the curing dynamics and prevent stress concentration; finally, use a second low-frequency microwave for 15 minutes to stabilize the curing effect and ensure uniform distribution of stress between non-metallic and metal materials, wherein the second low-frequency microwave is 850 MHz; during the curing process, use argon or nitrogen as a protective atmosphere to establish a low-oxygen environment to reduce the oxidation reaction on the metal surface while maintaining the stability of the adhesive; monitor and adjust the temperature and humidity during the curing process, wherein the temperature is maintained at 20°C to 25°C and the humidity is maintained between 40% and 60%; after the curing is completed, perform a slow cooling process and control the temperature at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden drop in temperature.

2. The method according to claim 1, characterized in that The step of obtaining the non-metallic material, the metal material and the adhesive to be bonded comprises: Surface treatment of non-metallic materials to be bonded, using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive; Coating the surface of the metal material to be bonded with a microwave absorbing coating composed of a conductive polymer or metal oxide with a thickness of 5-20 microns to enhance the absorption of microwave energy; An adhesive with adjustable viscosity and strong bonding is obtained, wherein the adhesive comprises a polymer matrix and precious metal nanoparticles to form a composite material with improved thermal conductivity and mechanical strength. A controllable phase change material is added to the adhesive to cause a phase change in the range of 40°C to 60°C, thereby providing dynamic temperature control during the curing stage.

3. A variable frequency microwave-based bonding and curing system between non-metallic and metallic materials, used to perform the method according to any one of claims 1 to 2, characterized in that: The system comprises: An acquisition module, used for acquiring non-metallic materials, metallic materials and adhesives to be bonded; Gluing module, used to apply and activate adhesive to non-metallic materials and metal materials to be glued, so as to enhance the permeability and adhesion of the adhesive; The curing module is used to alternately cure the bonded non-metallic materials and metallic materials using variable frequency microwave technology, control the ambient atmosphere during the curing process, and perform cooling after the curing is completed.

4. The system according to claim 3, characterized in that The acquisition module is specifically used to: Surface treatment of non-metallic materials to be bonded, using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive; Coating the surface of the metal material to be bonded with a microwave absorbing coating composed of a conductive polymer or metal oxide with a thickness of 5-20 microns to enhance the absorption of microwave energy; An adhesive with adjustable viscosity and strong bonding is obtained, wherein the adhesive comprises a polymer matrix and precious metal nanoparticles to form a composite material with improved thermal conductivity and mechanical strength. A controllable phase change material is added to the adhesive to cause a phase change in the range of 40°C to 60°C, thereby providing dynamic temperature control during the curing stage.

5. A storage medium, characterized in that: The storage medium stores a computer program, wherein the computer program is configured to execute the method according to any one of claims 1 to 2 when executed.

6. An electronic device comprising a memory and a processor, characterized in that: A computer program is stored in the memory, and the processor is configured to run the computer program to perform the method according to any one of claims 1 to 2.

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