A half-silicon wafer coating equipment and its feeding and discharging method

Abstract

The application discloses a kind of half silicon wafer coating equipment and its feeding and discharging method, belong to silicon wafer coating equipment technical field;The equipment includes two robots, four groups of double transmission runway, two independent feeding channels and two independent discharging channels, each robot respectively interfaces the group of variable pitch of double half piece feeding buffer and double half piece discharging buffer and feeds and discharges, and the silicon wafer of good process is transferred to double half piece discharging buffer variable pitch by robot and is transferred to double transmission runway and is transferred to discharging channel, and the silicon wafer of unprocessed process is transferred to double half piece feeding buffer variable pitch by feeding channel and is fed by robot.This application provides a kind of half silicon wafer coating equipment and its feeding and discharging method, improves the automation degree and efficiency of silicon wafer processing, reduces the battery efficiency loss caused by cutting, and meets the specific needs of half silicon wafer production.By precisely controlling the interaction of robot and variable pitch buffer, efficient, stable transfer and processing of silicon wafer are realized.

Description

Technical Field

[0001] This invention belongs to the technical field of silicon wafer coating equipment, and particularly relates to a half-wafer silicon wafer coating equipment and its loading and unloading method. Background Technology

[0002] During the dicing process after printing, edge damage to silicon wafers can reduce the power generation efficiency of solar cells. To improve cell efficiency, dicing silicon wafers into two pieces before processing has become a trend. In automated half-wafer coating, to meet the requirements of wafer insertion performance and production capacity, two half-wafers need to be combined and simultaneously loaded and unloaded from the basket, while the robot only needs to insert and pick up one half-wafer at a time. This requires a variable pitch buffer capable of simultaneously receiving and sending two half-wafers, and a single robot needs two sets of variable pitch buffers for loading and unloading, one in use and one on standby, switching back and forth to ensure uninterrupted robot operation and no impact on production capacity.

[0003] However, existing technologies suffer from issues such as wafer deformation, graphite boat deformation, and chuck precision when handling half-wafers, making it difficult to load and unload two wafers simultaneously. Furthermore, compared to whole-wafer equipment, half-wafer equipment has half the capacity, failing to meet the ever-increasing process capacity demands. Summary of the Invention

[0004] To address the problems existing in the prior art, this application provides a half-wafer coating equipment and its loading and unloading method, which improves the automation level and efficiency of silicon wafer processing, while reducing waiting time and breakage risk during operation, and meets higher production capacity requirements.

[0005] The technical solution is as follows:

[0006] On one hand, a half-wafer silicon wafer coating equipment is provided, including two robots, four sets of dual-transfer tracks, two independent loading channels and two independent unloading channels. One end of the dual-transfer tracks is connected to a variable pitch channel, and the other end is connected to either the loading channel or the unloading channel. The dual-transfer tracks are driven by a single power source to simultaneously transport two half-wafer silicon wafers. The robots load or unload one half-wafer silicon wafer at a time. During the loading and unloading process, the silicon wafers are loaded and unloaded in an alternating manner. Each robot is connected to a set of variable pitch channels of the dual-wafer loading buffer and the dual-wafer unloading buffer for loading and unloading. Processed silicon wafers on the boat positioning platform are transferred by robots to the variable pitch of the dual-wafer unloading buffer and then transferred to the dual-transfer tracks. The silicon wafers on the dual-transfer tracks are transported out through the unloading channels. Unprocessed silicon wafers are transported through the loading channels to the variable pitch of the dual-wafer loading buffer and then transferred by robots to the graphite boat on the boat positioning platform.

[0007] A further technical solution involves a lifting mechanism on the variable pitch buffer bit, which transfers the silicon wafer on the variable pitch bit to the dual transmission track.

[0008] A further technical solution involves a rotary variable pitch buffer with two double-half-wafer loading buffers or two double-half-wafer unloading buffers. A fully loaded unprocessed silicon wafer is loaded from one double-half-wafer loading buffer, rotated 180°, and inserted by a robot into a graphite boat on the wafer insertion channel of the boat positioning platform. The other empty double-half-wafer loading buffer continues loading. The robot then removes processed silicon wafers from the graphite boat on the wafer insertion channel of the boat positioning platform and transfers them to a double-half-wafer unloading buffer. The loaded double-half-wafer unloading buffer is then rotated 180° and transferred out, while the other empty double-half-wafer unloading buffer continues loading.

[0009] A further technical solution involves a six-axis robot equipped with a suction cup, which is formed by stacking several blades.

[0010] Further technical solutions include PL testing, PE testing, and detection of hidden cracks during material feeding.

[0011] In a further technical solution, the device is also equipped with an NG channel.

[0012] A further technical solution involves a boat positioning platform equipped with two insert channels and a graphite boat positioning runway.

[0013] On the other hand, a method for loading and unloading a half-wafer silicon wafer coating equipment is provided, applied to the aforementioned half-wafer silicon wafer coating equipment. This method includes:

[0014] Unprocessed silicon wafers are transferred from the basket fixture into the main machine for coating process through two independent feeding channels, while processed silicon wafers are transferred out through two independent unloading channels.

[0015] The first loading channel transfers unprocessed silicon wafers to the first robot, which then transfers them to the boat positioning platform. From there, they are transferred to the main machine for the coating process. The second loading channel transfers the silicon wafers to the second robot for loading.

[0016] The first robot transfers the finished graphite boat from the boat positioning platform to the double half-sheet unloading buffer, then to the double transmission runway, and then through the second transmission runway to the third unloading channel. The second robot then transfers the finished graphite boat to the fourth unloading channel.

[0017] A further technical solution involves using dual transport tracks to simultaneously transport two half-wafers of silicon.

[0018] A further technical solution is to have the robot load or unload one and a half silicon wafers at a time.

[0019] The technical solution includes at least the following technical effects:

[0020] 1. Each robot connects to both a double-half-wafer loading buffer and a double-half-wafer unloading buffer, matching the capacity of a six-axis robot. Through a rotary variable-pitch buffer, which rotates 180°, wafers can be loaded on one side while being unloaded on the other, enabling rapid wafer transfer and further improving processing efficiency. The configuration of two robots, each responsible for the individual loading and unloading of a single half-wafer in a single slot, meets the capacity requirements of the process equipment. Compared to two automated systems handling one mainframe, this approach requires less space and is less costly. The combination of two robots and two sets of variable-pitch buffers significantly improves wafer processing efficiency, effectively doubling the mainframe's capacity.

[0021] 2. Compared to loading and unloading two half-sheets together using a graphite boat suction cup controlled by a six-axis robot, loading and unloading a single half-sheet is less likely to result in fragmentation and scratches.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the invention. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 This is a top view of a half-wafer silicon wafer coating apparatus according to a preferred embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the loading and unloading section of a half-wafer silicon wafer coating equipment according to a preferred embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the loading and unloading section of a half-wafer silicon wafer coating equipment from another perspective of a preferred embodiment of the present invention.

[0027] Figure 4 for Figure 1 The motion trajectory diagram of the loading and unloading equipment for half-silicon wafer coating;

[0028] Figure 5 for Figure 3 The motion trajectory diagram of loading and unloading half-silicon wafers in the silicon wafer coating equipment;

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. First robot loading and unloading section; 1-1. First six-axis robot; 1-2. Suction cup; 1-3. Graphite boat positioning track; 1-4. First insert channel; 1-5. Second insert channel; 1-6. First variable pitch; 1-7. Second variable pitch; 1-8. First transfer track; 1-9. Second transfer track; 1-10. Third transfer track; 1-11. Fourth transfer track; 1-12. First set of double half-wafer unloading buffer; 1-13. Second set of double half-wafer unloading buffer; 1-14. First set of double half-wafer unloading buffer 1. Sheet feeding buffer; 1-15. Second group of double half-sheet feeding buffer; 2. Second robot loading and unloading section; 2-1. Second six-axis robot; 2-2. Third variable pitch; 2-3. Fourth variable pitch; 3. PL detection; 4. PE detection; 5. NG rejection position; 6. NG position; 7. Feeding hidden crack detection; 8. Secondary assembly position; 9. First feeding channel; 10. Second feeding channel; 11. First NG channel; 12. Second NG channel; 13. First unloading channel; 14. Second unloading channel. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0032] This embodiment provides a half-wafer silicon wafer coating equipment employing dual robots. Each robot is responsible for the individual loading and unloading of a single half-wafer in a single tank. Each robot connects to a set of variable-pitch buffers for both half-wafer loading and unloading, with one robot in use and one on standby to ensure continuous operation and minimize production capacity disruption. The equipment features dual loading and unloading channels. During loading and unloading, silicon wafers are loaded and unloaded in an alternating manner to optimize the production process and reduce waiting time. Unprocessed silicon wafers are transferred from the loading channel to the robot via a basket fixture, then from the robot to the boat positioning platform, and finally to the main machine for coating. Processed silicon wafers are transferred by the robot to the variable-pitch platform, and then from the variable-pitch platform to the dual-transfer track via a lifting mechanism for final delivery. During loading and unloading, quality control is performed on the silicon wafers using PL (Plastic Pulse) testing, PE (Polymer Surface Inspection) testing, and microcrack detection to ensure that only qualified silicon wafers proceed to the next stage. For silicon wafers that fail inspection (NG), the system will reject them and perform appropriate processing. The combination of two robots and two sets of variable pitch buffers doubles the main unit's throughput, significantly improving silicon wafer processing efficiency.

[0033] like Figures 1-5As shown, a half-wafer silicon wafer coating equipment includes two robots, four sets of dual-transfer tracks, two independent loading channels and two independent unloading channels. One end of each dual-transfer track is connected to a variable pitch channel, and the other end is connected to either the loading or unloading channel. The dual-transfer tracks are driven by a single power source to simultaneously transport two half-wafers. Each robot loads or unloads one half-wafer at a time. During loading and unloading, the silicon wafers are loaded and unloaded in an alternating manner. Each robot is connected to a set of variable pitch channels of the dual-wafer loading buffer and the dual-wafer unloading buffer for loading and unloading. Finished silicon wafers on the boat positioning platform are transferred by robots to the variable pitch of the dual-wafer unloading buffer and then to the dual-transfer tracks. The silicon wafers on the dual-transfer tracks are transported out through the unloading channels. Unfinished silicon wafers are transported through the loading channels to the variable pitch of the dual-wafer loading buffer and then transferred by robots to the graphite boat on the boat positioning platform.

[0034] like Figure 2 and Figure 3 The half-wafer coating equipment shown features a wafer loading and unloading section. A six-axis robot is mounted on the boat positioning platform. This robot is equipped with specialized suction cups 1-2, resembling blades stacked together, used to pick up silicon wafers from the graphite boat. The movement of the suction cups 1-2 is gas-controlled, ensuring accurate wafer adsorption and removal from the graphite boat. The boat positioning platform has two wafer insertion channels and a graphite boat positioning track. Finished silicon wafers are transported to the insertion channels, where the six-axis robot's suction cups remove the finished half-wafers and transfer them to a variable-pitch dual-wafer unloading buffer. A lifting mechanism then transfers them to the dual transport track, where the finished wafers are transported out. The variable-pitch buffer uses a four-bar linkage module with a motor to control the wafer's vertical movement, achieving precise wafer positioning. The dual transport track simultaneously transports two half-wafers, and is driven by a single power source.

[0035] like Figure 2 , Figure 3 and Figure 5 As shown in this embodiment, a rotary variable pitch design is used to solve the waiting problem when the robot interacts with the variable pitch. While interacting with the robot, the variable pitch buffer rotates 180°, allowing the other side to lift and lower independently to load / unload silicon wafers, thus enabling continuous processing of silicon wafers.

[0036] This embodiment provides a half-wafer silicon wafer coating equipment loading and unloading process as follows: Unprocessed silicon wafers are transferred from the basket fixture to the main machine through two independent loading channels for coating; processed silicon wafers are transferred out through two independent unloading channels. The first loading channel 9 transfers the unprocessed silicon wafers to the first six-axis robot 1-1, which then transfers them to the boat positioning platform, and from there to the main machine for coating. The second loading channel 10 transfers the silicon wafers to the second six-axis robot 2-1 for loading. The first six-axis robot 1-1 transfers the processed graphite boat from the boat positioning platform to the dual half-wafer unloading buffer, then to the dual transfer track, and finally to the first unloading channel 13. The second six-axis robot 2-1 transfers the processed graphite boat to the second unloading channel 14.

[0037] As attached Figure 4 As shown, unprocessed silicon wafers are transferred from the basket fixture to the main machine for coating via two independent loading channels. The first loading channel (channel 9) transfers the wafers to the first six-axis robot (1-1), which then transfers them to the boat positioning platform. From there, they are transferred to the main machine for coating. The second loading channel (channel 10) transfers the wafers to the second six-axis robot (channel 10). During loading and unloading, the wafers are loaded and unloaded in an alternating manner to optimize the production process and reduce waiting time. Each robot connects to two variable pitch buffers: the first six-axis robot (channel 1-1) connects to the first variable pitch (channels 1-6) and the second variable pitch (channels 1-7), and the second six-axis robot (channel 2-1) connects to the third variable pitch (channels 2-2) and the fourth variable pitch (channels 2-3). Finished silicon wafers are transferred from the wafer insertion channel on the boat positioning platform to the dual half-wafer unloading buffer, then to the dual transfer tracks, and finally transported out. (See attached diagram) Figure 4 and attached Figure 5 As shown, in this embodiment, unprocessed silicon wafers are transferred from the basket fixture to the dual transfer track via the first loading channel 9 (see attached diagram). Figure 5 The third and fourth transfer tracks in the system simultaneously transfer two half-wafers of silicon. The two transfer tracks are driven by a single power source. The two half-wafers of silicon are simultaneously transferred to the second set of double half-wafer loading buffers 1-15 of the second variable pitch 1-7. The second set of double half-wafer loading buffers 1-15 simultaneously loads two half-wafers of silicon. After the second set of double half-wafer loading buffers 1-15 is full, the second variable pitch 1-7 rotates 180° to rotate the second set of double half-wafer loading buffers 1-15, which is full of silicon wafers, to the direction of the docking insertion channel. The first set of double half-wafer loading buffers 1-14 rotates 180° to the direction of docking with the double transfer tracks to continue loading and loading. The suction cup of the first six-axis robot removes the half-wafer from the second set of double half-wafer loading buffers 1-15 and inserts it into the slot of the empty graphite boat on the insertion channel.

[0038] The suction cup of the first six-axis robot 1-1 first picks up half a silicon wafer from the finished graphite boat and places it on the first set of double half-wafer unloading buffers 1-12 on the first variable pitch 1-6. After the first set of double half-wafer unloading buffers 1-12 is full, the first variable pitch 1-6 rotates 180°, and the first set of double half-wafer unloading buffers 1-12 rotates 180° and then docks with the dual transfer tracks (see appendix). Figure 5 (In the second and first transmission tracks), the second set of double half-wafer unloading buffers 1-13 rotates 180° to align with the interfacing channel direction, and the first six-axis robot 1-1 continues to take out the half-wafer of the graphite boat with the finished process and transfer it to the second set of double half-wafer unloading buffers.

[0039] The second six-axis robot 2-1 operates on the same principle as the first robot. The second loading channel transfers unprocessed silicon wafers from the basket fixture to the second robot. The second six-axis robot 2-1 docks with the third variable pitch 2-2 and the fourth variable pitch 2-3. Unprocessed silicon wafers are placed on the loading buffer, while processed silicon wafers are transported back from the unloading buffer. The second six-axis robot 2-1 places the picked-up silicon wafers onto the fourth variable pitch; then, via a lifting mechanism, the silicon wafers are transferred from the variable pitch to the dual transport track, where the processed silicon wafers are transported out.

[0040] During the loading and unloading process, silicon wafers are quality controlled using equipment such as PL and PE testing to ensure that only qualified wafers can proceed to the next stage. Unqualified wafers (NG) are rejected by the system and processed accordingly.

[0041] The half-wafer coating equipment and loading / unloading method in this embodiment improve the automation and efficiency of silicon wafer processing, reduce battery efficiency loss caused by cutting, and meet the specific needs of half-wafer production. Through precise control of the interaction between the robot and the variable-pitch buffer, efficient and stable transfer and processing of silicon wafers are achieved.

[0042] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention described herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not invented herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the appended claims.

[0043] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A half-wafer silicon wafer coating equipment, characterized in that: It includes two robots, four sets of double transmission tracks, two independent feeding channels and two independent discharging channels, one end of the double transmission track is connected with the variable pitch, the other end is connected with the feeding channel or the discharging channel, the double transmission track is driven by a power to simultaneously transmit two half-silicon wafers, the robot loads or unloads one half-silicon wafer at a time, the silicon wafers are fed and discharged in an interleaved manner during the feeding and discharging processes, each robot respectively connects with a set of variable pitch of the double half-silicon wafer feeding buffer and the double half-silicon wafer discharging buffer to feed and discharge, the processed silicon wafers on the boat positioning platform are transferred to the double half-silicon wafer discharging buffer variable pitch by the robot and then to the double transmission track, the silicon wafers on the double transmission track are discharged through the discharging channel, the unprocessed silicon wafers are transmitted to the double half-silicon wafer feeding buffer variable pitch through the feeding channel and then transferred to the graphite boat on the boat positioning platform by the robot; The lifting mechanism is arranged on the variable pitch buffer position, and the silicon wafer on the variable pitch is transferred to the double transmission track through the lifting mechanism; The variable pitch is a rotary variable pitch, two double half-silicon wafer feeding buffers or two double half-silicon wafer discharging buffers are arranged on the variable pitch, the full unprocessed silicon wafers are fed from one double half-silicon wafer feeding buffer, the unprocessed silicon wafers are inserted into the graphite boat on the boat positioning platform through the robot by rotating 180°, and the other empty double half-silicon wafer feeding buffer continues to feed; the robot takes out the processed silicon wafers from the graphite boat on the boat positioning platform and transmits them to one double half-silicon wafer discharging buffer, and the full double half-silicon wafer discharging buffer is discharged by rotating 180°, and the other empty double half-silicon wafer discharging buffer continues to load the wafers; The robot is a six-axis robot, and the six-axis robot is provided with a suction cup formed by stacking a plurality of blades.

2. The apparatus according to claim 1, wherein It also includes PL detection, PE detection and feeding crack detection.

3. The apparatus according to claim 2, wherein It is also connected to the NG channel.

4. The apparatus according to claim 1, wherein The boat positioning platform is provided with two wafer insertion channels and a graphite boat positioning track.

5. The half-silicon wafer coating equipment feeding and discharging method according to claim 1 is applied to the half-silicon wafer coating equipment according to claim 1, and characterized in that, The unprocessed silicon wafers are transmitted from the flower basket tooling to the main machine through two independent feeding channels for coating process, and the processed silicon wafers are discharged through two independent discharging channels; The first feeding channel transmits the unprocessed silicon wafers to the first robot, which transmits them to the boat positioning platform and then to the main machine for coating process, and the second feeding channel transmits the silicon wafers to the second robot for feeding; The first robot transfers the processed graphite boat from the boat positioning platform to the double half-silicon wafer discharging buffer, to the double transmission track, and then to the third discharging channel through the brush transmission track, and the second robot transmits the processed graphite boat to the fourth discharging channel.

6. The method of claim 5, wherein the coating the semi-silicon wafer comprises: The double transmission track simultaneously transmits two half-silicon wafers.

7. The method of claim 5, wherein the film coating equipment is a semi-silicon wafer film coating equipment. The robot loads or unloads one half-silicon wafer at a time.

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