Display module

Abstract

The invention provides a display module, which comprises a substrate, a light-emitting element, a packaging layer and an electromagnetic shielding structure, the surface of the packaging layer is provided with a conductive layer made of nano-silver, the peripheral sides of the packaging layer and the substrate are provided with a grounding layer made of copper, and the conductive layer and the grounding layer can be matched with each other to form an omnibearing and multi-layer electromagnetic shielding system. Wherein the conductive layer can reflect part of incident electromagnetic waves on the surface of the packaging layer, so that electromagnetic energy entering the display module is greatly reduced, and high-frequency electromagnetic interference such as wireless communication signals from the outside is effectively blocked; and the grounding layer made of the copper material can play a role in supplementing and strengthening shielding on the peripheral side surface, and the grounding layer can quickly guide a small amount of electromagnetic waves entering the display module to the ground, so that the intensity of interference signals is further reduced. The conductive layer and the grounding layer work cooperatively, so that the normal display effect of the display module is guaranteed, and the user experience is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display module. Background Art

[0002] As a key component, display modules are widely used in various products such as mobile phones, computers, tablets, and televisions. With the rapid development of electronic technology, the functions of display modules are constantly enhanced and the integration is increasing, which makes them face more severe electromagnetic interference (EMI) problems.

[0003] Electromagnetic interference will not only affect the normal display effect of the display module itself, causing flickering, stripes, color distortion and other phenomena on the screen, but may also interfere with the normal operation of other surrounding electronic components and reduce the performance and reliability of the entire device.

[0004] Therefore, effective electromagnetic shielding becomes a key technology to ensure the stable operation of the display module. Summary of the invention

[0005] The object of the present invention is to provide a display module with stable and effective electromagnetic shielding.

[0006] To achieve the above object, the present invention provides a display module, comprising:

[0007] A substrate, two opposite surfaces of which in a thickness direction are respectively a first surface and a second surface;

[0008] A plurality of light-emitting elements are provided, and the plurality of light-emitting elements are arranged at intervals on the first surface of the substrate;

[0009] An encapsulation layer, disposed on the first surface of the substrate and covering the outside of the light-emitting element;

[0010] An electromagnetic shielding structure comprises a conductive layer and a grounding layer; the conductive layer is arranged on the outer surface of the packaging layer opposite to the first surface, and the grounding layer is arranged on the outer peripheral side of the packaging layer and the substrate; the conductive layer is transparent, and the material of the conductive layer is nanosilver; the material of the grounding layer is copper, and the grounding layer is used to connect to an external grounding terminal.

[0011] In some embodiments of the present application, the two ends of the grounding layer in the thickness direction of the substrate are respectively a first end and a second end, the end surface of the first end extends outwardly beyond or is flush with the surface of the conductive layer facing away from the packaging layer, and the second end is arranged close to the second surface of the substrate, and the outer peripheral side edge of the conductive layer is in contact with the inner surface of the grounding layer.

[0012] In some embodiments of the present application, the electromagnetic shielding structure further includes a reinforcing member, which is disposed at the connection between the conductive layer and the grounding layer and can fill the gap at the junction of the conductive layer and the grounding layer.

[0013] In some embodiments of the present application, the reinforcing member includes a flexible matrix and metal particles disposed inside the matrix, and the matrix is epoxy resin; the metal particles are used to contact the conductive layer and the grounding layer to form a conductive path.

[0014] In some embodiments of the present application, the reinforcing member is a woven mesh structure formed by metal wires, and the two side edges of the reinforcing member are respectively connected to the conductive layer and the grounding layer.

[0015] In some embodiments of the present application, the reinforcing member includes a main body portion in a frame structure and a metal layer disposed on the main body portion, and the metal layer is formed with a protruding extension portion; the extension portion can extend into the conductive layer and the grounding layer to form a conductive path.

[0016] In some embodiments of the present application, the conductive layer is a grid structure formed by nano silver wires.

[0017] In some embodiments of the present application, the sheet resistance of the conductive layer is not greater than 1 ohm per square, and the light transmittance of the conductive layer is greater than or equal to 90%.

[0018] In some embodiments of the present application, the impedance of the grounding layer is not greater than 0.1 ohm per square, and the thickness of the grounding layer is 1 μm - 50 μm.

[0019] In some embodiments of the present application, the electromagnetic shielding structure further includes a composite layer, which is disposed on the second surface of the substrate, and the material of the composite layer is a copper-graphene composite material; the thickness of the composite layer is 1 μm - 100 μm.

[0020] As can be seen from the above technical solutions, the beneficial effects of the present invention are as follows: The display module of the present invention includes a substrate, a light-emitting element, a packaging layer, and an electromagnetic shielding structure. A conductive layer made of nano silver is provided on the surface of the packaging layer, and a grounding layer made of copper is provided on the outer peripheral sides of the packaging layer and the substrate. The conductive layer and the grounding layer can cooperate with each other to form an all-round and multi-level electromagnetic shielding system. Among them, the conductive layer can reflect part of the incident electromagnetic waves on the surface of the packaging layer, greatly reducing the electromagnetic energy entering the interior of the display module and effectively blocking high-frequency electromagnetic interference such as wireless communication signals from the outside world; while the grounding layer made of copper can play a role in supplementing and strengthening the shielding on the circumferential side, and the grounding layer can quickly guide a small amount of electromagnetic waves entering the interior of the display module to the ground, further reducing the intensity of the interference signal. The conductive layer and the grounding layer work together to ensure the normal display effect of the display module and improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of the display module of the present invention.

[0022] Figure 2 is Figure 1 a schematic structural diagram of the conductive layer and the grounding layer in the display module shown.

[0023] The description of the reference numerals is as follows: 100, display module; 10, substrate; 11, first surface; 12, second surface; 20, light-emitting element; 30, packaging layer; 40, electromagnetic shielding structure; 41, conductive layer; 42, grounding layer; 43, composite layer; 50, pad; 60, solder paste. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments, all of which do not depart from the scope of the present invention, and the descriptions and illustrations therein are for illustrative purposes in nature and not for limiting the present invention.

[0025] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of the direction or position relationship (such as up, down, left, right, front, and back, etc.) is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the positions shown in the drawings, these descriptions are appropriate. If the description of the positions of these elements changes, then the indication of these directions also changes accordingly.

[0026] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0027] Referring to Figure 1 , some embodiments of this application provide a display module 100, which has stable and effective electromagnetic shielding performance, can prevent the leakage of electromagnetic radiation and the entry of external electromagnetic interference, ensure the normal display of the display screen, and avoid phenomena such as screen flickering, stripes, and color distortion.

[0028] The display module 100 of this application includes a substrate 10, a light-emitting element 20, a packaging layer 30, and an electromagnetic shielding structure 40. Among them, the opposite two surfaces in the thickness direction of the substrate 10 are a first surface 11 and a second surface 12 respectively. A plurality of light-emitting elements 20 are provided, and the plurality of light-emitting elements 20 are arranged at intervals on the first surface 11 of the substrate 10. The packaging layer 30 is disposed on the first surface 11 of the substrate 10 and covers the outside of the light-emitting element 20. The electromagnetic shielding structure 40 includes a conductive layer 41 and a grounding layer 42. The conductive layer 41 is disposed on the outer surface of the packaging layer 30 opposite to the first surface 11, and the grounding layer 42 is provided around the outer periphery of the packaging layer 30 and the substrate 10. The conductive layer 41 is transparently provided, and the material of the conductive layer 41 is nano silver. The material of the grounding layer 42 is copper, and the grounding layer 42 is used to connect to an external grounding terminal.

[0029] In some embodiments of this application, the substrate 10 may be a flat substrate, a multi-layer circuit board substrate, or a multi-layer circuit board substrate with a driving IC. Among them, the opposite two surfaces in the thickness direction of the substrate 10 are a first surface 11 and a second surface 12 respectively.

[0030] In some examples, a plurality of pads 50 are provided on the first surface 11 of the substrate 10, and the plurality of pads 50 are arranged at intervals on the first surface 11. The pads 50 are used for soldering and connecting the respective light-emitting elements 20, and the light-emitting elements 20 can be soldered to the pads 50 through solder paste 60.

[0031] Among them, the area on the first surface 11 of the substrate 10 where the pads 50 are provided is a metal area for soldering the light-emitting elements 20. The surface of the pads 50 can be surface-treated, such as tin plating, gold plating, etc. These surface treatment layers can prevent the pads 50 from oxidizing, improve the wettability of the solder, and make the soldering more firm.

[0032] The solder paste 60 is a paste-like material formed by mixing tin alloy powder and flux. When soldering the light-emitting element 20 to the substrate 10, the solder paste 60 can be printed on the pads 50 of the substrate 10 first. The tin alloy powder in the solder paste 60 melts during the subsequent heating process, filling the gap between the pins of the light-emitting element 20 and the pads 50 to achieve electrical connection and mechanical fixation.

[0033] The light-emitting element 20 in the display module 100 is the core component for realizing image display, and works in cooperation with other components by being soldered to the substrate 10 to achieve the display of image screens. The light-emitting element 20 may include, but is not limited to, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), and micro light-emitting diodes (Mini-LEDs), etc.

[0034] Among them, an LED is a semiconductor light-emitting device composed of a P-type semiconductor and an N-type semiconductor. When current passes through, electrons and holes recombine at the PN junction, and the excess energy is released in the form of light. Different semiconductor materials and doping elements will produce light of different colors.

[0035] The light emission of an OLED utilizes the electroluminescence characteristics of organic materials. When current passes through, the injected electrons and holes combine in the organic material layer, exciting organic molecules to generate singlet excitons, and the excitons release energy in the form of light when returning to the ground state. According to different organic materials, light emission of various colors such as red, green, and blue can be achieved, thereby realizing full-color display.

[0036] The light-emitting principle of Mini-LED is the same as that of traditional LEDs, and light is emitted through the recombination of electrons and holes in semiconductor materials. The chip size of Mini-LED is smaller, generally between 50μm - 200μm, which is significantly reduced compared to traditional LED chips.

[0037] Moreover, compared with mainstream display technologies such as OLED and LCD, Mini-LED has higher brightness, resolution, and color saturation, lower power consumption, longer lifespan, and faster response speed.

[0038] In some embodiments of the present application, a packaging layer 30 is further provided on the first surface 11 of the substrate 10. The packaging layer 30 covers the outside of the light-emitting element 20 and is used to protect the light-emitting element 20 and improve the overall display performance of the display module 100.

[0039] In some examples, the packaging layer 30 can be formed by epoxy resin encapsulation. During the actual production of the display module 100, the epoxy resin can be coated on the surface of the light-emitting element 20 in a liquid form, and then cured by heating to form the packaging layer 30 on the first surface 11 of the substrate 10.

[0040] After curing, the epoxy resin has a relatively high hardness, which can provide reliable mechanical protection for the light-emitting element 20, effectively resist external impacts, vibrations and frictions, and reduce the damage of the light-emitting element 20 caused by physical damage. Moreover, the epoxy resin has good chemical stability, can prevent the erosion of moisture, oxygen and other corrosive gases or liquids to the light-emitting element 20, and extend the service life of the light-emitting element 20. In addition, the epoxy resin has good light transmittance, and can achieve color conversion by adding phosphors, etc., and can adjust and optimize the light while ensuring the normal light emission of the light-emitting element 20, improving the color effect and uniformity of the display.

[0041] In some examples, the encapsulation layer 30 can be formed by silicone encapsulation. The silicone encapsulation can adopt methods such as drop gluing, potting or molding. In some small display modules 100, the liquid silicone can be precisely dropped on the surface of the light-emitting element 20 by drop gluing, and then cured and formed at a certain temperature to form the encapsulation layer 30 on the first surface 11 of the substrate 10. For larger-sized display modules 100, the potting or molding process can be used to fill the silicone into the entire area to be encapsulated, ensuring that the light-emitting element 20 is completely wrapped.

[0042] Silicone has good flexibility, can effectively buffer external stress, and reduce stress damage to the light-emitting element 20 caused by thermal expansion and contraction or mechanical vibration. Moreover, the light transmittance of silicone is usually above 90%, which can maximize the light transmission of the light-emitting element 20, reduce light loss, and improve the brightness of the display module 100. At the same time, silicone has good high-temperature resistance, can withstand higher working temperatures, and is suitable for encapsulating light-emitting elements 20 with high brightness and large heat generation. In addition, silicone also has good weather resistance, can be used for a long time under different environmental conditions, and ensure the stability of the display module 100.

[0043] In other examples, the encapsulation layer 30 can be formed by organic material encapsulation, which is mainly applied to the display module 100 in which the light-emitting element 20 is an organic light-emitting diode (OLED). Among them, the organic material can be an organic thin film material and an organic-inorganic composite thin film material.

[0044] When encapsulating with an organic thin film material, one or more organic thin films can be formed on the surface of the OLED light-emitting element 20 through technologies such as vacuum evaporation and solution spin coating. When encapsulating the light-emitting element 20 with an organic-inorganic composite thin film material, the organic material and the inorganic material are combined. First, an inorganic oxide thin film is deposited, and then an organic polymer thin film is coated thereon to form a composite encapsulation structure on the first surface 11 of the substrate 10, thereby effectively encapsulating the light-emitting element 20.

[0045] Encapsulating the light-emitting element 20 with an organic material can effectively prevent moisture and oxygen from damaging the light-emitting element 20, reducing the luminous efficiency and service life. The organic encapsulation material can form a dense protective film on the surface of the light-emitting element 20 to prevent harmful substances from invading. Moreover, the organic material has good flexibility and is suitable for encapsulating the flexible display module 100, meeting the requirements of the display module 100 in application scenarios such as foldable and bendable. In addition, the optical properties of the organic material can be adjusted to optimize the light output effect of the display module 100 and improve the display contrast and color saturation.

[0046] Furthermore, in some embodiments of the present application, the display module 100 may further include an electromagnetic shielding structure 40, and the electromagnetic shielding structure 40 includes a conductive layer 41 and a grounding layer 42.

[0047] Among them, the electromagnetic shielding structure 40 includes a conductive layer 41 and a grounding layer 42. The conductive layer 41 is disposed on the outer surface of the encapsulation layer 30 opposite to the first surface 11, and the grounding layer 42 is disposed around the outer periphery of the encapsulation layer 30 and the substrate 10. The conductive layer 41 is transparent, and the material of the conductive layer 41 is nano silver. The material of the grounding layer 42 is copper, and the grounding layer 42 is used to connect to an external grounding terminal.

[0048] For the display module 100 of the present application, a conductive layer 41 made of nano silver is provided on the surface of the encapsulation layer 30, and a grounding layer 42 made of copper is provided on the outer periphery of the encapsulation layer 30 and the substrate 10. The conductive layer 41 and the grounding layer 42 can cooperate with each other to form an all-round and multi-level electromagnetic shielding system. Among them, the conductive layer 41 can reflect part of the incident electromagnetic wave on the surface of the encapsulation layer 30, greatly reducing the electromagnetic energy entering the interior of the display module 100 and effectively blocking high-frequency electromagnetic interference such as wireless communication signals from the outside world; while the grounding layer 42 made of copper can play a supplementary and strengthening shielding role on the side surface. The grounding layer 42 can quickly guide a small amount of electromagnetic waves entering the interior of the display module 100 to the ground, further reducing the intensity of the interference signal. The conductive layer 41 and the grounding layer 42 work together to ensure the normal display effect of the display module 100 and improve the user experience.

[0049] In some examples, the conductive layer 41 is made of nano silver material, and the sheet resistance of the conductive layer 41 is not greater than 1 ohm per square, and the light transmittance is greater than or equal to 90%, so as to effectively reflect the incident electromagnetic wave while avoiding affecting the display of the light-emitting element 20 and ensuring the clarity and brightness of the display screen.

[0050] Nano silver has excellent electrical conductivity and there are a large number of free electrons inside it. When external electromagnetic waves are incident on the conductive layer 41 on the top surface of the display module 100, according to the principle of electromagnetic induction, the free electrons in the conductive layer 41 will generate directional movement under the action of the electromagnetic wave electric field, forming an induced current. The magnetic field generated by this induced current is opposite to the magnetic field direction of the incident electromagnetic wave, and the two interfere with each other, thereby canceling part of the energy of the electromagnetic wave and reflecting most of the incident electromagnetic waves back, effectively blocking these high-frequency signals from entering the display module 100 and avoiding interference with the internal circuit and the light-emitting element 20, ensuring the clarity and stability of the display screen.

[0051] Combined Figure 2 As shown, in some embodiments of the present application, the conductive layer 41 can be a grid structure formed by nano silver wires. When external electromagnetic waves are incident on the grid-structured conductive layer 41, according to the principle of electromagnetic induction, the free electrons in the nano silver wires will quickly generate directional movement under the action of the electromagnetic wave electric field, forming an induced current.

[0052] The grid structure of the conductive layer 41 can provide multiple interconnected conductive paths for the induced current, further optimizing the reflection performance to significantly reduce the electromagnetic energy entering the interior of the display module 100, reducing the impact of external electromagnetic interference on the internal circuit and components, ensuring the normal operation of the display module 100, and improving the display quality.

[0053] In some examples, the nano silver wires of the conductive layer 41 can form a square grid. The square grid is simple to manufacture. While ensuring the electromagnetic shielding effect, it also has unique advantages in the light scattering characteristics and can effectively improve the display effect of the display module 100.

[0054] In some examples, the nano silver wires of the conductive layer 41 can form a hexagonal grid. The hexagonal grid has a high space utilization rate and good electrical conductivity. The setting of the hexagonal grid makes the connection between the nano silver wires closer and the current transmission smoother. At the same interweaving density of the nano silver wires, the resistance of the conductive layer 41 with a hexagonal grid is relatively low, having better electromagnetic shielding performance.

[0055] It should be noted that in other examples, the grid structure of the conductive layer 41 can also be set into other shapes according to actual usage requirements, such as triangular grids, circular grids, irregular grids, etc. In addition, according to specific application requirements, the grid spacing can be precisely adjusted to achieve a balance between the electrical conductivity and light transmittance of the display module. In display devices with higher requirements for light transmittance, the grid spacing of the conductive layer 41 in the display module 100 can be appropriately increased; while in display devices with strict requirements for electromagnetic shielding, a smaller grid spacing needs to be selected to ensure good electrical conductivity.

[0056] When the display module 100 of the present application is actually manufactured, the conductive layer 41 can form a grid structure on the surface of the encapsulation layer 30 by inkjet printing.

[0057] Specifically, inkjet printing is adopted and nano-silver ink is used to print on the surface of the encapsulation layer 30 to form the conductive layer 41 with a grid structure covering the surface of the encapsulation layer 30. The conductive layer 41 with a nano-silver wire grid structure formed by inkjet printing can provide a uniform and continuous conductive path on the surface of the encapsulation layer 30.

[0058] Among them, the nano-silver particles can be interconnected after curing to form an efficient conductive network, which can meet the requirements of the display module 100 for electromagnetic shielding performance, and the display module 100 has effective and stable electromagnetic shielding. Moreover, the grid structure of the inkjet-printed conductive layer 41 can fit well with the encapsulation layer 30. When the encapsulation layer 30 is bent or stretched, the conductive layer 41 can maintain good flexibility and stability, and is not prone to breakage or detachment, effectively ensuring the overall structural stability of the display module 100. In addition, the nano-silver ink has high transparency after curing, will not have an obvious impact on the optical performance of the display module 100, and the design of the grid structure can optimize the propagation and scattering of light, improving the contrast and brightness uniformity of the display module 100.

[0059] Furthermore, in some embodiments of the present application, the electromagnetic shielding structure 40 may further include a grounding layer 42, and the grounding layer 42 is disposed around the outer peripheral sides of the encapsulation layer 30 and the substrate 10 to cooperate with the conductive layer 41 to further enhance the electromagnetic shielding performance of the display module 100.

[0060] Among them, the grounding layer 42 is made of copper, and the grounding layer 42 is used to connect to an external grounding terminal. For example, the grounding layer 42 can be connected to the FPC grounding terminal through conductive silver paste.

[0061] The grounding layer 42 provides a low-impedance conduction path for electromagnetic interference signals. When an electromagnetic interference signal reaches the grounding layer 42, whether it leaks from inside the display module 100 or enters the inside of the display module 100 from the external environment, the grounding layer 42 can quickly guide these interference signals to the ground, thereby effectively enhancing the electromagnetic shielding performance of the display module 100.

[0062] In some examples, the impedance of the grounding layer 42 is not greater than 0.1 ohm per square. Such a setting can not only provide a good discharge path for electromagnetic interference signals, but also make the current spread more evenly into the ground, reducing the potential gradient; in addition, the low-impedance grounding layer 42 can also reduce the amplitude of ground bounce noise, keep the potential difference between the light-emitting element 20 and the ground within an allowable range, ensure the normal logical function of the light-emitting element 20, and improve the overall stability and anti-interference ability of the display module 100.

[0063] In some examples, the thickness of the grounding layer 42 can be 1 μm - 50 μm. This setting helps to form a stable electromagnetic shielding environment. Within this thickness range, the grounding layer 42 can have a good shielding effect on electromagnetic interference of different frequencies. Especially for high-frequency interference, it can effectively reduce its impact on the internal circuit of the display module 100, improve the quality of the display screen, and reduce interference phenomena such as flicker and stripes.

[0064] Moreover, the grounding layer 42 within this thickness range can provide a certain mechanical support and protection for the internal components of the display module 100. It can enhance the structural strength of the peripheral side of the display module 100, making it not easily deformed or damaged when subjected to external impact or vibration, thereby protecting the internal light-emitting elements 20 and circuits.

[0065] In addition, the grounding layer 42 within this thickness range does not affect the splicing connection between the display modules 100. During splicing, the grounding layer 42 can adapt to the dimensional deviation between the modules through slight deformation or compression, enabling the modules to fit together better, ensuring the tightness and accuracy of the splicing, ensuring seamless connection of the display screen after splicing, and improving the overall quality of the entire display module 100 after splicing.

[0066] In some embodiments of the present application, the grounding layer 42 has a cylindrical structure and surrounds the outer peripheral sides of the encapsulation layer 30 and the substrate 10.

[0067] The two ends of the grounding layer 42 in the thickness direction of the substrate 10 are respectively a first end and a second end. The end face of the first end extends outward or is flush with the surface of the conductive layer 41 facing away from the encapsulation layer 30, and the second end is disposed close to the second surface 12 of the substrate 10. The outer peripheral side edge of the conductive layer 41 abuts against the inner surface of the grounding layer 42.

[0068] The abutting setting of the conductive layer 41 and the grounding layer 42 can help to form a more effective electromagnetic shielding structure 40. When there is electromagnetic interference in the outside world, the conductive layer 41 can sense these interference signals and introduce the interference current into the grounding layer 42 through the abutting with the grounding layer 42, thereby generating a reverse magnetic field to cancel the external magnetic field, enhancing the electromagnetic shielding effect on the internal circuit, reducing the influence of electromagnetic interference on the normal operation of the circuit, improving the electromagnetic compatibility of the display module 100, ensuring the clarity and stability of the display screen, and avoiding problems such as image interference and flicker.

[0069] Moreover, the outer peripheral edge of the conductive layer 41 abuts against the inner surface of the grounding layer 42, which can increase the mechanical bonding force between the two, enabling them to better support and fix each other. When the display module 100 is subjected to external impact or vibration, this abutting structure can reduce the relative displacement and looseness between the conductive layer 41 and the grounding layer 42, improve the stability and reliability of the display module 100, and prevent problems such as poor electrical connection or performance degradation caused by structural looseness.

[0070] In some embodiments of the present application, the electromagnetic shielding structure 40 may further include a reinforcing member, which is disposed at the connection between the conductive layer 41 and the grounding layer 42 and can fill the gap at the junction of the conductive layer 41 and the grounding layer 42.

[0071] The arrangement of the reinforcing member can effectively solve the problem of electromagnetic leakage caused by the gap formed between the conductive layer 41 and the grounding layer 42 due to factors such as assembly and external impact force, and further improve the electromagnetic shielding performance of the display module 100.

[0072] In some examples, the reinforcing member may include a flexible matrix and metal particles disposed inside the matrix, and the matrix is epoxy resin. The metal particles are used to contact the conductive layer 41 and the grounding layer 42 to form a conductive path.

[0073] Among them, the matrix made of epoxy resin has good elasticity and flexibility, and can adapt to the gaps of different shapes and sizes between the conductive layer 41 and the grounding layer 42. The metal particles inside the matrix can be silver particles, copper particles, etc., and they are filled inside the matrix, enabling the reinforcing member to have conductivity.

[0074] The metal particles in the reinforcing member can fully contact each other and with the conductive layer 41 and the grounding layer 42 to form a continuous conductive path, providing a better conductive basis for electromagnetic shielding, thereby effectively improving the overall electromagnetic shielding performance of the display module 100.

[0075] In some examples, the reinforcing member is a woven mesh structure formed by metal wires, and the two side edges of the reinforcing member are respectively connected to the conductive layer 41 and the grounding layer 42.

[0076] The reinforcing member of this structural form is woven by metal wires, with a simple manufacturing method, high conductivity and certain elasticity. This woven structure enables the reinforcing member to absorb vibration and impact to a certain extent while ensuring the conductive performance, further enhancing the connection stability.

[0077] In practical applications, the shape and size of the reinforcement are customized according to the size and shape of the possible gap formed between the conductive layer 41 and the grounding layer 42. Commonly seen shapes include sheet-like, strip-like, circular, etc. The reinforcement can closely adhere to the connection between the conductive layer 41 and the grounding layer 42 to ensure the continuity of electromagnetic shielding.

[0078] In some examples, the reinforcement may include a main body portion in a frame structure and a metal layer provided on the main body portion. The metal layer is formed with protruding extension portions, and the extension portions can extend into the conductive layer 41 and the grounding layer 42 to form a conductive path.

[0079] The main body portion can be in a frame structure, and it can be made of lightweight materials such as plastics to reduce weight and cost. The surface of the main body portion can be metallized, such as by electroplating, electroless plating and other methods, to form a metal layer, and the metal layer can achieve the functions of conduction and electromagnetic shielding.

[0080] The main body portion is arranged at the connection between the conductive layer 41 and the grounding layer 42, and the extension portions formed on the metal layer can extend into the conductive layer 41 and the grounding layer 42, so that the reinforcement forms a tight fit with the conductive layer 41 and the grounding layer 42, thereby further enhancing the stability and electromagnetic shielding performance of the entire system.

[0081] Furthermore, in some embodiments of the present application, the electromagnetic shielding structure 40 may further include a composite layer 43, and the composite layer 43 is arranged on the second surface 12 of the substrate 10.

[0082] In some examples, the material of the composite layer 43 can be a copper-graphene composite material, and the composite layer 43 can be formed on the second surface 12 of the substrate 10 by magnetron sputtering using the copper-graphene composite material.

[0083] On the one hand, the composite layer 43 on the second surface 12 of the substrate 10 can serve as an additional shielding layer to reflect and absorb again a small amount of electromagnetic interference that penetrates through the conductive layer 41 and the grounding layer 42; on the other hand, the presence of graphene increases the surface resistance of the composite layer 43, causing the electromagnetic interference signal to be reflected and scattered multiple times on the surface of the composite layer 43, effectively absorbing and attenuating the residual electromagnetic interference, further consuming electromagnetic energy, thereby improving the overall electromagnetic shielding effect of the display module 100.

[0084] In addition, the composite layer 43 made of the copper-graphene composite material also has good thermal conductivity, so that the composite layer 43 can not only achieve electromagnetic shielding, but also conduct heat, avoiding the accumulation of heat inside the display module 100, and allowing the heat to dissipate from the side of the substrate 10 away from the light-emitting element 20, which not only avoids affecting the light-emitting quality of the light-emitting element 20, but also effectively dissipates heat to ensure the overall stability of the display module 100.

[0085] For the display module of the present application, it includes a substrate, a light-emitting element, a packaging layer, and an electromagnetic shielding structure. A conductive layer made of nano silver is provided on the surface of the packaging layer, and a grounding layer made of copper is provided on the outer peripheral sides of the packaging layer and the substrate. The conductive layer and the grounding layer can cooperate with each other to form an all-round and multi-level electromagnetic shielding system. Among them, the conductive layer can reflect part of the incident electromagnetic waves on the surface of the packaging layer, greatly reducing the electromagnetic energy entering the interior of the display module and effectively blocking high-frequency electromagnetic interference such as wireless communication signals from the outside world; while the grounding layer made of copper can play a role in supplementing and strengthening shielding on the side surface, and the grounding layer can quickly guide a small amount of electromagnetic waves entering the interior of the display module to the ground, further reducing the intensity of the interference signal. The conductive layer and the grounding layer work together to ensure the normal display effect of the display module and improve the user experience.

[0086] Although the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be broadly construed within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A display module, characterized in that: include: A substrate, two opposite surfaces of which in a thickness direction are respectively a first surface and a second surface; A plurality of light-emitting elements are provided, and the plurality of light-emitting elements are arranged at intervals on the first surface of the substrate; An encapsulation layer, disposed on the first surface of the substrate and covering the outside of the light-emitting element; An electromagnetic shielding structure comprises a conductive layer and a grounding layer; the conductive layer is arranged on the outer surface of the packaging layer opposite to the first surface, and the grounding layer is arranged on the outer peripheral side of the packaging layer and the substrate; the conductive layer is transparent, and the material of the conductive layer is nanosilver; the material of the grounding layer is copper, and the grounding layer is used to connect to an external grounding terminal.

2. The display module according to claim 1, characterized in that: The two ends of the grounding layer in the thickness direction of the substrate are respectively a first end and a second end, the end surface of the first end protrudes outwardly or is flush with the surface of the conductive layer away from the packaging layer, and the second end is arranged close to the second surface of the substrate, and the outer peripheral side edge of the conductive layer abuts against the inner surface of the grounding layer.

3. The display module according to claim 2, characterized in that: The electromagnetic shielding structure further includes a reinforcement member, which is disposed at the connection between the conductive layer and the ground layer and can fill a gap at the junction between the conductive layer and the ground layer.

4. The display module according to claim 3, characterized in that: The reinforcing piece comprises a flexible matrix and metal particles arranged inside the matrix, wherein the matrix is ​​epoxy resin; the metal particles are used to contact the conductive layer and the ground layer to form a conductive path.

5. The display module according to claim 3, characterized in that: The reinforcement piece is a woven mesh structure formed by metal wires, and the two side edges of the reinforcement piece are respectively connected to the conductive layer and the grounding layer.

6. The display module according to claim 3, characterized in that: The reinforcement member includes a main body portion in a frame structure and a metal layer arranged on the main body portion, wherein the metal layer is formed with a protruding extension portion; the extension portion can extend into the conductive layer and the grounding layer to form a conductive path.

7. The display module according to claim 1, characterized in that: The conductive layer is a grid structure formed by nano silver wires.

8. The display module according to claim 1, characterized in that: The sheet resistance of the conductive layer is no greater than 1 ohm per square, and the light transmittance of the conductive layer is greater than or equal to 90%.

9. The display module according to claim 1, characterized in that: The impedance of the grounding layer is no more than 0.1 ohm per square, and the thickness of the grounding layer is 1 μm-50 μm.

10. The display module according to claim 1, characterized in that: The electromagnetic shielding structure further includes a composite layer, which is arranged on the second surface of the substrate. The composite layer is made of a copper-graphene composite material. The thickness of the composite layer is 1 μm-100 μm.

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