Waveguide antenna plate polishing equipment and method

Abstract

The invention relates to the technical field of waveguide antennas, and particularly discloses waveguide antenna plate polishing equipment and method. The problem that in the prior art, polishing uniformity is poor is solved. Comprising a rack, a polishing station and a polishing assembly, and the polishing station can clamp a waveguide antenna plate and has at least two-degree-of-freedom movement; the polishing assembly is arranged on one side of the polishing station through the mounting assembly and can make contact with the surface of the plate in the vertical direction. The polishing station rotates through the rotating assembly, and the supporting frame moves based on the first moving assembly. And the position of the polishing assembly is adjusted through the second moving assembly, and the polishing assembly is hung on a rotatable second carrying frame so as to achieve high-precision polishing of different areas. And an automatic feeding assembly is further arranged and comprises a grabbing part and a conveying mechanism, and the production efficiency is improved. The polishing method comprises the steps of feeding, fixing, position adjusting and polishing according to preset parameters. According to the equipment and the method, automatic polishing is realized, the uniformity is improved, and the processing quality of the waveguide antenna plate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of waveguide antennas, and in particular to a waveguide antenna plate polishing device and method. Background Art

[0002] As a key component for high-frequency signal transmission, the surface quality of waveguide antenna plates has a decisive influence on the propagation efficiency and stability of signals. In many application scenarios such as microwave communications, radar systems, and satellite communications, the surface finish of waveguide antenna plates is required to be extremely high, in order to ensure that the signal can be transmitted with the highest efficiency and minimize reflection losses, thereby ensuring the performance and reliability of the communication system.

[0003] Traditional polishing methods mostly use manual or semi-automatic methods, such as manual grinding or simple unidirectional mechanical polishing. However, these methods are difficult to ensure uniformity during the polishing process, resulting in local rough areas on the surface of the plate. These uneven surfaces will affect the propagation of electromagnetic waves in the waveguide antenna, resulting in signal attenuation and uneven reflection, and ultimately reducing the working performance of the antenna. Existing polishing equipment usually uses fixed or single-axis mobile polishing methods, which can only be processed in one direction and cannot efficiently cover the entire plate surface, resulting in low polishing efficiency. For large-sized waveguide antenna plates, traditional methods often require multiple adjustments and repeated processing, which increases production time and cost. Since the traditional polishing process is highly dependent on manual labor, there are human errors during the operation process, resulting in inconsistent polishing quality of different batches of plates. In addition, manual operation is easily affected by subjective experience and is difficult to accurately control. Especially in applications with high-precision polishing requirements, this method is difficult to meet the needs.

[0004] The patent "A Waveguide Antenna Plate Polishing Device" (publication number CN113752152B, hereinafter referred to as Prior Art 1) discloses a waveguide antenna plate polishing device. Prior Art 1 mainly innovates on the problems of low polishing efficiency, easy deformation and uneven roughness of plate surfaces in the manufacture of microwave communication devices. Its core technologies may include optimized mechanical structure design (such as adaptive polishing heads, multi-axis linkage control systems), precise pressure adjustment modules to maintain polishing uniformity, and special fixture systems to ensure stable fixation of the plate to avoid processing deformation. The device may improve polishing accuracy and consistency through automated processes (such as servo drive, sensor feedback), and combine special abrasives or process parameters to adapt to the ultra-smooth surface required for high-frequency signal transmission.

[0005] However, there are still some limitations in the prior art 1. For example, although the prior art 1 proposes an adaptive polishing head and multi-axis linkage control, when processing waveguide antenna plates, it may still face problems such as unreasonable polishing path planning and uneven polishing pressure distribution. Summary of the invention

[0006] In view of this, an embodiment of the present invention provides a waveguide antenna plate polishing device and method to solve the problem in the prior art that the polishing uniformity of the waveguide antenna plate cannot be guaranteed during the polishing operation, resulting in uneven signal reflection of the waveguide antenna plate.

[0007] In a first aspect, an embodiment of the present invention provides a waveguide antenna plate polishing device, comprising a frame and a polishing station and a polishing assembly arranged on the frame; the waveguide antenna plate is clamped by the polishing station and can be rotated based on the polishing station; the polishing assembly is arranged on one side of the fixture through an installation assembly, and can perform vertical contact polishing operations based on the installation assembly and the top of the waveguide antenna plate clamped on the fixture; wherein the polishing station can carry the waveguide antenna plate and can move with at least two degrees of freedom; wherein the polishing assembly is provided with a polishing medium for polishing the waveguide antenna plate, and the polishing medium has at least two degrees of freedom of movement based on the polishing assembly.

[0008] Preferably, the polishing station is arranged on a support frame and can be rotated by a rotating component arranged on the support frame; the support frame is arranged on a first moving component and can move to both sides of the frame based on the moving component; wherein the rotating component includes a first motor and a turntable connected to the first motor, and the polishing station is arranged on the turntable.

[0009] Preferably, the mounting assembly includes a second movable assembly and a first carrier arranged on the second movable assembly; the first carrier is provided with a second carrier that can rotate based on the first carrier; the polishing assembly is suspended on the second carrier and can move toward or away from the polishing station based on the second carrier and / or the second movable assembly.

[0010] Preferably, the automatic loading assembly also includes a movable bracket and a grabbing portion that moves based on the movable bracket through a guide rail; the movable bracket is arranged adjacent to the polishing station, and is used to grab the waveguide antenna plate in the feeding area of ​​the frame to the polishing station, or to grab the polished waveguide antenna plate from the polishing station to the discharging area of ​​the frame; wherein the grabbing portion includes at least one pair, which are respectively used for the grabbing operations of feeding and discharging the waveguide antenna plate.

[0011] Preferably, the grasping portion includes a grasping frame connected to the guide rail via a slider; a suction cup for grasping the waveguide antenna plate is provided at the bottom of the grasping frame; the suction cup is installed on the grasping frame via an adsorption adjustment plate, and at least two pairs of suction cups are provided; the two pairs of suction cups form a rectangular grasping area through the positional relationship between adjacent suction cups.

[0012] Preferably, it also includes a feeding assembly and a discharging assembly arranged on both sides of the automatic loading assembly; the discharging assembly and the feeding assembly are arranged in the same manner.

[0013] Preferably, the feeding assembly includes a material rack and conveying rollers arranged at both ends of the material rack; a plurality of rotating rollers arranged at intervals are also arranged between the conveying rollers at both ends of the material rack, and both the conveying rollers and the rotating rollers can rotate based on the material rack;

[0014] The conveying roller and the rotating roller are provided with a feeding belt.

[0015] In a second aspect, a method for polishing a waveguide antenna plate is provided, comprising:

[0016] S1: conveying the waveguide antenna plate to be polished to the polishing station through the feeding assembly;

[0017] S2: fixing the waveguide antenna plate to a polishing station;

[0018] S3: adjusting the position of the polishing assembly so that it is directly above the waveguide antenna plate;

[0019] S4: performing composite polishing operation according to preset polishing parameters.

[0020] Preferably, S4 includes:

[0021] The first motor drives the turntable to rotate the waveguide antenna plate at a first speed;

[0022] The polishing assembly is controlled to periodically reciprocate along the radial direction of the plate by the second moving assembly;

[0023] The vertical contact pressure between the polishing medium and the plate is dynamically adjusted based on preset pressure parameters.

[0024] Preferably, the S4 further includes:

[0025] According to the feedback of the surface roughness of the plate, the proportional relationship between the first rotation speed and the moving speed of the polishing component is adjusted in real time;

[0026] Increase the lateral movement frequency in the outer edge area of ​​the plate and increase the rotation speed in the inner circle area.

[0027] The waveguide antenna plate polishing device and method provided by the present invention have the following beneficial effects:

[0028] In the present invention, the waveguide antenna plate is rotated and vertically polished so that the entire plate surface is polished evenly to avoid local roughness affecting signal propagation. The polishing assembly and the polishing station both have at least two degrees of freedom of movement, which can achieve multi-angle and uniform polishing operations. In addition, through high-precision polishing, the microscopic concave-convex on the plate surface is reduced, the surface flatness is improved, and the signal reflection instability caused by uneven surface roughness is reduced. The coordination of the rotating assembly and the moving assembly can ensure fast and efficient polishing operations, reduce unnecessary pauses, and improve overall processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the following is a brief introduction to the drawings required for use in the embodiment of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0030] Figure 1 It is a schematic diagram of the structure of a waveguide antenna plate polishing device;

[0031] Figure 2 It is a schematic diagram of the structure of the polishing station;

[0032] Figure 3 This is a structural diagram of the polishing station from another angle;

[0033] Figure 4 It is a schematic diagram of the structure of the installation components;

[0034] Figure 5 This is a structural diagram of the installation component from another angle;

[0035] Figure 6 It is a structural schematic diagram of the automatic feeding component;

[0036] Figure 7 is a schematic diagram of the structure of the feed assembly;

[0037] Parts and numbers in the picture:

[0038] 100-rack;

[0039] 200- waveguide antenna plate;

[0040] 310-polishing station, 320-support frame, 330-rotating assembly, 331-first motor, 332-turntable, 333-first moving assembly, 334-coupling, 335-driving motor, 336-guide rail frame, 341-moving rail, 342-connecting block, 343-moving seat, 344-bearing seat, 345-nut seat, 346-screw;

[0041] 410-polishing component, 411-polishing medium;

[0042] 500-installation assembly, 510-second moving assembly, 520-first carrier, 521-articulated seat, 522-driving wheel, 523-driven wheel, 524-second motor, 525-transmission belt, 530-second carrier, 531-third motor, 532-driving gear, 533-rack, 534-sliding seat, 535-track block;

[0043] 600-automatic feeding assembly, 610-movable bracket, 611-guide rail, 612-slider, 620-grabbing part, 621-grabbing frame, 623-adsorption adjustment plate, 624-suction cup, 625-fourth motor, 626-feeding belt, 627-transmission seat;

[0044] 710-feeding assembly, 711-material rack, 712-conveying roller, 713-rotating roller, 714-feeding belt, 720-discharging assembly. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other, all within the protection scope of the present invention.

[0046] Example 1

[0047] See also Figure 1 The embodiment of the present invention provides a waveguide antenna plate polishing device. In the current technical field, the waveguide antenna plate 200 often faces a challenge when performing a polishing operation, that is, it is impossible to ensure the uniformity of the polishing process. The existence of this problem causes the uniformity of the signal reflection of the waveguide antenna plate 200 to be affected during use, which may affect the overall performance of the waveguide antenna. In this embodiment, an innovative solution is proposed to significantly improve the uniformity of the polishing process of the waveguide antenna plate 200.

[0048] In this example, see Figure 1-Figure 5 The polishing equipment includes a frame 100, a polishing station 310 and a polishing assembly 410 arranged on the frame 100; the waveguide antenna plate 200 is clamped by the polishing station 310 and can be rotated based on the polishing station 310; the polishing assembly 410 is arranged on one side of the fixture through the mounting assembly 500, and can perform vertical contact polishing operation based on the mounting assembly 500 and the top of the waveguide antenna plate 200 clamped on the fixture; the polishing assembly 410 performs vertical contact polishing operation during the rotation of the polishing station 310, which can ensure that the polishing assembly 410 and the waveguide antenna plate 200 are in uniform contact during polishing, avoiding the problem of poor signal reflection caused by uneven polishing. At the same time, the polishing assembly 410 can flexibly adjust the polishing position and strength through the setting of the mounting assembly 500, further improving the uniformity and efficiency of polishing. In addition, the design of the polishing station 310 enables the waveguide antenna plate 200 to be stably clamped and rotated, thereby ensuring the stability and reliability of the polishing operation.

[0049] Among them, the polishing station 310 can carry the waveguide antenna plate 200 and move with at least two degrees of freedom; the polishing component 410 is provided with a polishing medium 411 for polishing the waveguide antenna plate 200, and the polishing medium 411 has at least two degrees of freedom of movement based on the polishing component 410; so that the waveguide antenna plate 200 can be polished in all directions, further improving the comprehensiveness and quality of the polishing operation.

[0050] Specifically, see Figure 2 and Figure 3The two-degree-of-freedom movement of the waveguide antenna plate 200 carried by the polishing station 310 may include rotation and translation. Such a composite movement mode can ensure that all parts of the plate surface can be evenly polished. At the same time, the polishing medium 411 on the polishing assembly 410 also has at least two degrees of freedom of movement, such as moving closer to or away from the polishing station 310 and swinging in the horizontal direction. Such a design not only increases the contact area between the polishing medium 411 and the plate surface, but also makes the polishing operation more flexible and adaptable to waveguide antenna plates 200 of different shapes and sizes. The realization of all-round polishing greatly reduces the polishing dead angle, improves the polishing efficiency and polishing quality, makes the surface of the waveguide antenna plate 200 smoother, and the signal reflection performance is more excellent, avoiding the problem of uneven signal reflection.

[0051] Furthermore, the polishing station 310 is disposed on a support frame 320 and can be rotated by a rotating component 330 disposed on the support frame 320; the support frame 320 is disposed on a first moving component 333 and can move to both sides of the frame 100 based on the moving component.

[0052] See also Figure 2 and Figure 3 The driving principle of the first moving component 333 is screw drive, including a guide rail 611 frame 336 and a moving track 341 arranged on the guide rail 611 frame 336, and a moving seat 343 is provided on the guide rail 611 frame 336, which is slidably connected to the moving track 341 through a connecting block 342; bearing seats 344 are provided at both ends of the guide rail 611 frame 336, and a screw 346 is also provided to rotate based on the bearing seat 344, and the screw 346 is connected to the driving motor 335 arranged at one end of the guide rail 611 frame 336 through a coupling 334; and a nut seat 345 that can move in the guide rail 611 frame 336 is also provided on the screw 346, and the moving seat 343 is arranged on the nut seat 345. The movement principle of the first moving component 333 is

[0053] When the driving motor 335 is started, the screw 346 is driven to rotate through the coupling 334. Since the screw 346 is fixed by the bearing seat 344 and can rotate freely therein, and the nut seat 345 is threadedly matched with the screw 346, when the screw 346 rotates, the nut seat 345 will perform linear motion along the axial direction of the screw 346. This linear motion is transmitted to the moving seat 343 through the connecting block 342, so that the moving seat 343 can slide on the guide rail 611 frame 336 along the moving track 341. Such a design allows the polishing station 310 to achieve precise linear movement through the first moving assembly 333, thereby ensuring the accuracy of the polishing operation position.

[0054] For further information, see Figure 4 and Figure 5 The rotating assembly 330 includes a first motor 331 and a turntable 332 connected to the first motor 331, and the polishing station 310 is arranged on the turntable 332; the first motor 331 is connected to the turntable 332 through a coupling 334, so that the turntable 332 can rotate around its center point during the polishing operation. When the first motor 331 is started and drives the turntable 332 to rotate through the coupling 334, the polishing station 310 rotates with the turntable 332, thereby driving the waveguide antenna plate 200 to rotate. By controlling the rotation speed of the first motor 331, the polishing operation can be further controlled to ensure the stability and consistency of the polishing quality.

[0055] Furthermore, the installation assembly 500 includes a second moving assembly 510 and a first carrier 520 disposed on the second moving assembly 510; hinge seats 521 are respectively disposed on both sides of the first carrier 520, and the second carrier 530 is disposed on the first carrier 520 through the hinge seats 521 and can rotate based on the first carrier 520. A driven wheel 523 is fixedly connected to the hinge seat 521 on one side of the first carrier 520; the first carrier 520 is also provided with a second motor 524 and a driving wheel 522 on the output shaft of the second motor 524, and the driving wheel 522 and the driven wheel 523 are connected by a transmission belt 525 to realize the flipping movement of the second carrier 530.

[0056] The polishing assembly 410 is suspended on the second carrier 530 through a sliding seat 534, the moving seat 343 is slidably connected to the track block 535 on the second carrier 530, and a rack 533 is provided on the sliding seat 534; a third motor 531 is provided on the top of the second carrier 530, and a driving gear 532 provided on the output shaft of the third motor 531 is transmission-connected to the rack 533. When the third motor 531 is started, the driving gear 532 rotates and meshes with the rack 533, thereby driving the sliding seat 534 to slide along the track block 535. This arrangement allows the polishing assembly 410 to be flexibly moved on the second carrier 530 to adapt to waveguide antenna plates 200 of different sizes and shapes, ensuring that the polishing operation can fully and evenly cover the entire plate surface.

[0057] Furthermore, the structural configuration of the second moving component 510 is consistent with that of the first moving component 333 .

[0058] Furthermore, the polishing assembly 410 can move toward or away from the polishing station 310 based on the second carrier 530 and / or the second moving assembly 510 .

[0059] See also Figure 4 and Figure 5 When in use, the polishing station 310 is moved to a preset position through the first moving assembly 333; the polishing assembly 410 is moved close to the polishing station 310 through the second moving assembly 510, and the second carrier 530 is rotated based on the first carrier 520 through the rotation connection between the first carrier 520 and the second carrier 530, so that the polishing station 310 moves to the top of the polishing station 310, and the position of the polishing assembly 410 is fine-tuned so that the polishing assembly 410 can be accurately aligned with the area to be polished of the waveguide antenna plate 200 to achieve vertical contact. Subsequently, the first motor 331 is started, and the turntable 332 drives the polishing station 310 and the waveguide antenna plate 200 to start rotating, ensuring that the polishing operation can evenly and efficiently cover the entire area to be polished. During the polishing process, the rhythm and strength of the polishing operation can be accurately controlled by controlling the rotation speed of the first motor 331 and the rotation speed of the drive motor 335, thereby further ensuring the stability and consistency of the polishing quality.

[0060] See also Figure 1 and Figure 6In this embodiment, the polishing device further includes an automatic loading assembly 600, which includes a mobile bracket 610 and a grabbing part 620 that moves based on the mobile bracket 610 through a guide rail 611; the mobile bracket 610 is arranged adjacent to the polishing station 310, and is used to grab the waveguide antenna plate 200 in the feeding area of ​​the frame 100 to the polishing station 310, or grab the polished waveguide antenna plate 200 from the polishing station 310 to the unloading area of ​​the frame 100; transmission seats 627 are respectively provided at both ends of the mobile bracket 610, and a fourth motor 625 for driving the transmission seats 627 is also provided, and the transmission seats 627 at both ends of the mobile bracket 610 are connected by a feeding belt 626; the grabbing part 620 includes at least one pair, which are respectively used for the feeding and unloading of the waveguide antenna plate 200. The pair of the grabbing parts 620 are fixedly connected to the feeding belt 626 at intervals. When in use, by starting the fourth motor 625, the transmission seat 627 and the feeding belt 626 are driven to move, so that a pair of gripping parts 620 can reciprocate along the guide rail 611 on the movable bracket 610. When the waveguide antenna plate 200 needs to be polished, the gripping part 620 located in the feeding area will accurately grab the waveguide antenna plate 200 on the rack 100 and transport it to the polishing station 310. Once the polishing operation is completed, the gripping part 620 located in the discharging area will grab the polished waveguide antenna plate 200 from the polishing station 310 and transport it to the discharging area on the rack 100 for storage. The design of this automatic feeding assembly 600 not only improves the automation degree of the polishing equipment, but also significantly improves the efficiency of the polishing operation. At the same time, the spacing and fixed connection of the pair of gripping parts 620 ensure the stability and accuracy of the gripping operation, and further ensure the polishing quality.

[0061] Furthermore, the feeding belt 626 can only move partially, not in a full circle, and during the polishing operation, the gripping part 620 is in a safe position to avoid collision or interference with other parts. This design ensures that the feeding belt 626 will not make unnecessary contact with other parts of the polishing equipment during the transmission process, thereby preventing possible damage or failure. At the same time, the setting of the gripping part 620 in a safe position not only protects the gripping part 620 itself from damage by debris or splashes that may be generated during the polishing operation, but also ensures the safety of the operator and reduces the risk of accidents.

[0062] Furthermore, the grasping portion 620 includes a grasping frame 621 connected to the guide rail 611 through a slider 612; a suction cup 624 for grasping the waveguide antenna plate 200 is provided at the bottom of the grasping frame 621; the suction cup 624 is installed on the grasping frame 621 through an adsorption adjustment plate 623, and at least two pairs of suction cups 624 are provided; the two pairs of suction cups 624 form a rectangular grasping area through the positional relationship between adjacent suction cups 624.

[0063] During use, the operator can control the movement of the grabbing frame 621 on the guide rail 611 to accurately position the suction cup 624 above the waveguide antenna plate 200. Subsequently, the suction cup 624 firmly absorbs the plate by generating negative pressure to ensure that the plate will not slip or be damaged during the grabbing and transportation process. The design of the rectangular grabbing area not only improves the stability and carrying capacity of the grabbing part 620, but also makes the grabbing operation more flexible and adaptable, and can cope with waveguide antenna plates 200 of different sizes and shapes. After the plate is transported to the discharge area, the suction cup 624 puts down the plate by releasing the negative pressure, completing the entire grabbing and transportation process. This design not only improves the degree of automation of the polishing operation, but also significantly improves the operation efficiency and safety.

[0064] In this example, see Figure 1 and Figure 7 The polishing equipment further includes a feeding assembly 710 and a discharging assembly 720 disposed on both sides of the automatic loading assembly 600; the discharging assembly 720 and the feeding assembly 710 are configured in the same manner.

[0065] Furthermore, the feeding assembly 710 includes a material rack 711 and conveying rollers 712 arranged at both ends of the material rack 711; a plurality of rotating rollers 713 arranged at intervals are also provided between the conveying rollers 712 at both ends of the material rack 711, and both the conveying rollers 712 and the rotating rollers 713 can rotate based on the material rack 711; and a feeding belt 714 is provided on the conveying rollers 712 and the rotating rollers 713.

[0066] During use, the operator places the waveguide antenna plate 200 to be polished on the material rack 711, and the plate is then driven by the feeding belt 714 and moves forward along the rotation direction of the conveying roller 712 and the rotating roller 713. The setting of the feeding belt 714 ensures the smooth conveying of the plate during the feeding process, and avoids the problem of plate damage or inaccurate positioning caused by unstable conveying. The interval setting of the conveying roller 712 and the rotating roller 713 not only ensures the stability of the plate during the conveying process, but also makes the structure of the entire feeding assembly 710 more compact and occupies less space. At the same time, this design facilitates the adjustment and optimization of the conveying path to adapt to plates of different sizes and shapes. When the plate is conveyed to the specified position, the grabbing part 620 of the automatic feeding assembly 600 will start, and the plate will be accurately grabbed and transported to the polishing area for polishing according to the preset program. The entire feeding process has a high degree of automation, without manual intervention, which greatly improves the work efficiency and accuracy.

[0067] Furthermore, the discharging and feeding of the two gripping parts 620 are performed simultaneously, and after the discharging is completed, the gripping parts 620 move to the safe area on one side of the mobile bracket 610 to wait for the next gripping instruction. This design not only improves the continuity of the polishing operation, but also ensures the safety of the gripping parts 620 during the movement process, avoiding collision or damage caused by misoperation or failure. At the same time, the design of the mobile bracket 610 enables the gripping parts 620 to move flexibly between the polishing area and the safe area, further improving the flexibility and adaptability of the entire automatic loading assembly 600.

[0068] Example 2

[0069] See also Figure 1-Figure 7 , an embodiment of the present invention provides a waveguide antenna plate polishing method, comprising:

[0070] S1: The waveguide antenna plate 200 to be polished is transported to the polishing station 310 through the feeding assembly 710 .

[0071] The gripping part 620 can simultaneously realize the feeding and discharging operations, place the waveguide antenna plate 200 to be processed on the polishing station 310, and grab the waveguide antenna plate 200 polished on the polishing station 310 to the discharging area, so that the feeding and discharging can be carried out simultaneously. This operation method greatly shortens the polishing cycle and improves the overall production efficiency. In addition, the design of the gripping part 620 fully considers the characteristics and polishing requirements of the waveguide antenna plate 200, ensures the stability and accuracy of the gripping process, avoids damage to the plate during transportation, and ensures the polishing quality.

[0072] S2: Fixing the waveguide antenna plate 200 to the polishing station 310;

[0073] Furthermore, the polishing station 310 firmly fixes the waveguide antenna plate 200 through magnetic clamping to prevent the polishing effect from being affected by the movement or shaking of the plate during the polishing process. The design of the magnetic clamping not only ensures the stability of the polishing, but also facilitates the rapid release of the plate after the polishing is completed, thereby realizing an efficient automated operation process. In addition, the polishing station 310 is also equipped with a precise adjustment mechanism, which can be fine-tuned according to the specific size and polishing requirements of the waveguide antenna plate 200 to ensure the accuracy and consistency of the polishing operation.

[0074] S3: adjusting the position of the polishing assembly 410 so that it is directly above the waveguide antenna plate 200;

[0075] S4: performing composite polishing operation according to preset polishing parameters.

[0076] The first motor 331 drives the turntable 332 to rotate the waveguide antenna plate 200 at a preset speed, and the second moving component 510 controls the polishing component 410 to periodically reciprocate along the radial direction of the plate; the vertical contact pressure between the polishing medium 411 and the plate is dynamically adjusted based on the preset pressure parameters.

[0077] Further, the S4 includes:

[0078] The first motor 331 drives the turntable 332 to rotate the waveguide antenna plate at a first rotation speed.

[0079] The first motor 331 drives the turntable to rotate the waveguide antenna plate at a first rotation speed, thereby achieving precise rotation control and ensuring that the waveguide antenna plate can maintain a stable rotation speed during the processing, thereby achieving the expected processing effect.

[0080] The polishing assembly is controlled by the second moving assembly 510 to periodically reciprocate along the radial direction of the plate.

[0081] The second moving assembly 510 is used to control the polishing assembly to periodically reciprocate along the radial direction of the plate. This reciprocating motion can ensure that the polishing assembly evenly covers the entire surface of the plate, thereby achieving a comprehensive and uniform polishing effect.

[0082] The vertical contact pressure between the polishing medium and the plate is dynamically adjusted based on preset pressure parameters.

[0083] The vertical contact pressure between the polishing medium and the plate is dynamically adjusted based on the preset pressure parameters. By real-time monitoring and adjusting the pressure parameters, the pressure during the polishing process is always in the optimal state to obtain the ideal polishing effect.

[0084] Furthermore, the S4 further includes:

[0085] According to the feedback of the surface roughness of the plate, the proportional relationship between the first rotation speed and the moving speed of the polishing component is adjusted in real time.

[0086] Increase the lateral movement frequency in the outer edge area of ​​the plate and increase the rotation speed in the inner circle area.

[0087] In this embodiment, the motion parameters of the polishing process can be dynamically optimized according to the actual roughness of the plate surface. In the outer edge area of ​​the plate, the polishing effect may not be as good as that in the central area due to the edge effect. Therefore, by increasing the lateral movement frequency, it can be ensured that the outer edge area is fully polished. In the inner circle area, increasing the rotation speed helps to speed up the polishing efficiency while maintaining the consistency of the polishing quality. This practice of adjusting the polishing strategy in real time according to the surface condition of the plate can significantly improve the polishing efficiency and polishing quality, making the polishing process of the waveguide antenna plate more intelligent and adaptive.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A waveguide antenna plate polishing device, comprising a frame (100) and a polishing station (310) and a polishing assembly (410) arranged on the frame (100); characterized in that: The waveguide antenna plate (200) is clamped by the polishing station (310) and can be rotated based on the polishing station (310); the polishing assembly (410) is arranged on one side of the fixture through the mounting assembly (500), and can perform vertical contact polishing operations based on the mounting assembly (500) and the top of the waveguide antenna plate (200) clamped on the fixture; The polishing station (310) can carry the waveguide antenna plate (200) to move with at least two degrees of freedom; The polishing component (410) is provided with a polishing medium (411) for polishing the waveguide antenna plate (200), and the polishing medium (411) has at least two degrees of freedom of movement based on the polishing component (410).

2. A waveguide antenna plate polishing device according to claim 1, characterized in that: The polishing station (310) is arranged on a support frame (320) and can be rotated by a rotating assembly (330) arranged on the support frame (320); The support frame (320) is arranged on the first moving component (333), and can move to both sides of the frame (100) based on the moving component; The rotating assembly (330) comprises a first motor (331) and a turntable (332) connected to the first motor (331), and the polishing station (310) is arranged on the turntable (332).

3. The waveguide antenna plate polishing device according to claim 1, characterized in that: The installation assembly (500) comprises a second moving assembly (510) and a first carrier (520) arranged on the second moving assembly (510); The first carrier (520) is provided with a second carrier (530) which can rotate based on the first carrier (520); The polishing assembly (410) is suspended on the second carrier (530) and can move toward or away from the polishing station (310) based on the second carrier (530) and / or the second moving assembly (510).

4. The waveguide antenna plate polishing device according to claim 1, characterized in that: The automatic loading assembly (600) also includes a movable bracket (610) and a gripping portion (620) that moves based on the movable bracket (610) via a guide rail (611); The movable bracket (610) is disposed adjacent to the polishing station (310) and is used to grab the waveguide antenna plate (200) in the feeding area of ​​the frame (100) to the polishing station (310), or to grab the polished waveguide antenna plate (200) from the polishing station (310) to the discharging area of ​​the frame (100); The grasping portion (620) comprises at least one pair, which are respectively used for grasping operations of feeding and discharging the waveguide antenna plate (200).

5. The waveguide antenna plate polishing device according to claim 4, characterized in that: The grabbing portion (620) comprises a grabbing frame (621) connected to the guide rail (611) via a slider (612); The bottom of the grabbing frame (621) is provided with a suction cup (624) for grabbing the waveguide antenna plate (200); The suction cups (624) are mounted on the grabbing frame (621) via an adsorption adjustment plate (623), and at least two pairs of the suction cups (624) are provided; The two pairs of suction cups (624) form a rectangular gripping area through the positional relationship between adjacent suction cups (624).

6. The waveguide antenna plate polishing device according to claim 4, characterized in that: It also includes a feeding assembly (710) and a discharging assembly (720) arranged on both sides of the automatic feeding assembly (600); The discharging assembly (720) and the feeding assembly (710) are configured in the same manner.

7. A waveguide antenna plate polishing device according to claim 6, characterized in that: The feeding assembly (710) comprises a material rack (711) and conveying rollers (712) arranged at two ends of the material rack (711); A plurality of rotating rollers (713) are provided between the conveying rollers (712) at both ends of the material rack (711), and the conveying rollers (712) and the rotating rollers (713) can both rotate based on the material rack (711); A feeding belt (714) is provided on the conveying roller (712) and the rotating roller (713).

8. A method for polishing a waveguide antenna plate, characterized in that: include: S1: conveying the waveguide antenna plate (200) to be polished to the polishing station (310) through the feeding assembly (710); S2: fixing the waveguide antenna plate (200) to a polishing station (310); S3: adjusting the position of the polishing assembly (410) so that it is located directly above the waveguide antenna plate (200); S4: performing composite polishing operation according to preset polishing parameters.

9. A waveguide antenna plate polishing method according to claim 8, characterized in that: The S4 includes: The first motor (331) drives the turntable (332) to rotate the waveguide antenna plate (200) at a first rotation speed; Controlling the polishing assembly (410) to periodically reciprocate along the radial direction of the plate by means of a second moving assembly (510); The vertical contact pressure between the polishing medium (411) and the plate is dynamically adjusted based on a preset pressure parameter.

10. A waveguide antenna plate polishing method according to claim 8, characterized in that: The S4 further comprises: According to the feedback of the surface roughness of the plate, the proportional relationship between the first rotation speed and the moving speed of the polishing component (410) is adjusted in real time; Increase the lateral movement frequency in the outer edge area of ​​the plate and increase the rotation speed in the inner circle area.

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