Waveguide antenna and radar
By setting solder resist parts and positioning post holes on the radiating layer of the waveguide antenna and using the surface tension of the molten solder paste for precise alignment, the problem of insufficient positioning accuracy in the multi-layer structure of the waveguide antenna is solved, and the welding quality and radar performance are improved.
Patent Information
- Application Number
- CN202520512884.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-23
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-23
AI Technical Summary
The existing waveguide antenna multilayer structure has insufficient reflow soldering positioning accuracy, which leads to warping problems, affecting batch consistency and radar performance.
Solder mask sections are set on the radiation layer as reference marks. Combined with the gap fit between the positioning posts and positioning holes, precise alignment is achieved through the surface tension of the solder paste during the reflow soldering process, simplifying the soldering process and reducing stress concentration.
This improved the positioning accuracy and welding quality of the waveguide antenna, enhanced structural stability and signal transmission performance, and met the reliability requirements of automotive electronics.
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Figure CN223911858U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of waveguide antenna, especially a waveguide antenna and radar. BACKGROUND
[0002] With the development trend of "intelligent driving equality", 2025 will be the first year of large-scale landing of automatic driving. As one of the important sensors of automatic driving, the detection distance, field of view angle, detection precision and detection stability of millimeter wave radar are the most critical indicators. The mainstream scheme in the prior art is still a microstrip antenna scheme, and the mainstream trend of the future industry will switch to waveguide antennas to improve the performance of intelligent driving perception systems (millimeter wave radars).
[0003] Among them, the waveguide antenna is composed of a multi-layer structure, and the current combination mode between the multi-layer structure is hot riveting, ultrasonic welding, laser welding and reflow soldering. Among them, the warping problem and positioning accuracy problem of reflow soldering have always been the core problems in the industry that lead to the inconsistency of waveguide antennas. The positioning accuracy of reflow soldering will directly affect the performance of the waveguide antenna. UTILITY MODEL CONTENT
[0004] The utility model aims to provide a kind of waveguide antenna and radar, to solve the technical problem of the positioning accuracy of reflow soldering of the multi-layer structure of waveguide antenna in prior art.
[0005] In the first aspect, the utility model provides a kind of waveguide antenna, comprising:
[0006] Radiation layer, the radiation layer has first surface, the first surface of preset position is formed with solder resist part, soldering area is formed in the solder resist part;
[0007] Signal transmission layer, the signal transmission layer is stacked along first direction with the radiation layer, the signal transmission layer has second surface, the second surface is oppositely arranged with the first surface, and the second surface is formed with clearance space with the first surface;
[0008] Soldering tin layer, be located in the clearance space, the soldering tin layer has first end and second end along the first direction, the first end of the soldering tin layer is connected to the soldering area, and the second end of the soldering tin layer is connected to the second surface.
[0009] A kind of waveguide antenna as described above, preferably, positioning part is equipped on the radiation layer, positioning cooperation part is equipped on the signal transmission layer, and the positioning part and the positioning cooperation part form clearance positioning cooperation.
[0010] The waveguide antenna as claimed in any one of the preceding claims, wherein preferably one of the positioning portion and the positioning mating portion comprises a positioning post, the other of the positioning portion and the positioning mating portion comprises a positioning hole, and the positioning post is gap-fitted in the positioning hole.
[0011] The waveguide antenna as claimed in any one of the preceding claims, wherein preferably the positioning post comprises a first positioning post and a second positioning post, the positioning hole comprises a first positioning hole and a second positioning hole, the first positioning post and the first positioning hole are circular in cross section, and the second positioning post and the second positioning hole are waist-shaped in cross section.
[0012] The waveguide antenna as claimed in any one of the preceding claims, wherein preferably the first positioning post and the second positioning post are distributed at two corner ends of a diagonal line of the radiating layer, and the first positioning hole and the second positioning hole are distributed at two corner ends of a diagonal line of the signal transmission layer.
[0013] The waveguide antenna as claimed in any one of the preceding claims, wherein preferably a side of the signal transmission layer facing the radiating layer is provided with a protrusion, the protrusion has a first end and a second end along the first direction, the first end of the protrusion is connected to the signal transmission layer, and the second surface is formed at the second end of the protrusion.
[0014] The waveguide antenna as claimed in any one of the preceding claims, wherein preferably the solder layer coincides with a projection of the protrusion along the first direction.
[0015] The waveguide antenna as claimed in any one of the preceding claims, wherein preferably the solder resist portions are provided in plurality, and the plurality of solder resist portions are distributed on the first surface.
[0016] In a second aspect, the utility model provides a radar, the radar includes preceding waveguide antenna.
[0017] Compared with the prior art, the utility model discloses a solder resist portion is arranged on the radiating layer, the solder resist portion serves as a reference mark, which helps to more accurately align the radiating layer and the signal transmission layer during soldering, and by accurately controlling the position and shape of the solder resist portion, the alignment between the radiating layer and the signal transmission layer can be ensured to be more accurate, thereby meeting the high-precision positioning requirement of the radiating layer and the signal transmission layer of the waveguide antenna. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 is the top view of the waveguide antenna provided by the utility model embodiment;
[0019] Figure 2 is the partial side view of the waveguide antenna provided by the utility model embodiment;
[0020] Figure 3It is a waveguide antenna preparation process flow diagram provided by the embodiment of the utility model.
[0021] Mark explanation:
[0022] 10-radiation layer, 11-first surface, 12-soldering part, 121-soldering area, 13-first positioning column, 14-second positioning column, 15-radiation gap;
[0023] 20-signal transmission layer, 21-second surface, 22-protrusion;
[0024] 30-soldering layer;
[0025] 100-waveguide antenna;
[0026] D1-first direction. Specific implementation
[0027] The embodiment described below with reference to the drawings is exemplary and is only used to explain the utility model and cannot be explained as the limitation of the utility model.
[0028] In the prior art, the waveguide antenna uses interference positioning to improve the positioning accuracy between multiple layers, but interference positioning generates a large stress, which further increases the deformation and warping of the waveguide antenna, affects the overall performance of the radar and cannot be mass-produced.
[0029] In order to reduce the deformation and warping, the waveguide antenna uses a jig to press the multi-layer structure when reflow soldering, which introduces new stress, causes uneven tin thickness after reflow soldering, and cannot control the consequences such as tin overflow, and cannot fundamentally solve the technical problem of batch deformation and warping of the waveguide antenna.
[0030] Based on the above analysis of the prior art, it can be known that the existing waveguide antenna cannot meet the stringent reliability requirements of automobile electronics, therefore, the embodiment of the present application provides a waveguide antenna to solve the technical problem of positioning accuracy of the waveguide antenna multi-layer structure reflow soldering in the prior art.
[0031] As shown in Figure 1 and Figure 2 The embodiment of the utility model provides a waveguide antenna 100, which comprises a radiation layer 10, a signal transmission layer 20 and a soldering layer 30, wherein:
[0032] The radiation layer 10 is directly interacted with external electromagnetic waves in the waveguide antenna 100, and is used for converting signals from the signal transmission layer 20 into electromagnetic waves and radiating the electromagnetic waves, or receiving external electromagnetic waves and converting the electromagnetic waves into electrical signals and transmitting the electrical signals to the signal transmission layer 20. The radiation layer 10 is provided with a radiation gap 15, and the radiation gap 15 can resonate with electromagnetic waves, so that the signals can be effectively radiated or received. Preferably, the radiation layer 10 is integrally formed by using a plastic material, and a metal plating layer is plated on the surface of the radiation layer 10. The metal plating layer can make the radiation layer 10 have good electrical conductivity, so that the effective transmission and conversion of signals can be realized, and the metal plating can also ensure the light weight of the product.
[0033] In the embodiments of the utility model, the radiation layer 10 has a first surface 11, the first surface 11 is a side surface of the radiation layer 10 facing the signal transmission layer 20, a solder mask part 12 is formed at a preset position of the first surface 11, the preset position of the first surface 11 is a position set in advance, and the preset position corresponds to a positioning position. The solder mask part 12 can be used as a reference mark, which helps to more accurately align the radiation layer 10 and the signal transmission layer 20. By accurately controlling the position and shape of the solder mask part 12, the alignment between the radiation layer 10 and the signal transmission layer 20 can be ensured to be more accurate, so that the high-precision positioning requirement of the radiation layer 10 and the signal transmission layer 20 of the waveguide antenna 100 can be met.
[0034] By using the solder mask part 12 as the alignment reference, the welding process can be more automated and standardized, so that the production efficiency can be improved. The operator or the automatic equipment can quickly identify the position of the solder mask part 12, so that consistent high-precision alignment standards can be achieved in the production process of each waveguide antenna 100, and the overall quality and reliability of the product can be improved.
[0035] The solder mask part 12 is formed with a welding area 121, the solder mask part 12 can effectively control the welding position, limit the flow range of the welding material (such as solder), make the welding process more controllable, reduce the possibility of welding deviation, avoid affecting other areas during the welding process, cause short circuit or unnecessary welding, and the solder mask part 12 can also protect other electronic elements or conductive paths on the radiation layer 10, and prevent high temperature or solder from causing damage to them during the welding process.
[0036] Preferably, a plurality of solder mask parts 12 are arranged on the first surface 11. The plurality of solder mask parts 12 can provide a plurality of reference points for more accurately aligning the radiation layer 10 and the signal transmission layer 20, reducing the error that may occur due to a single reference point, and improving the alignment accuracy in the welding process. Meanwhile, the dispersed distribution of the plurality of solder mask parts 12 can ensure the uniform distribution of the welding areas 121 on the first surface 11, so that the welding quality can be improved, the stress concentration that may occur during the welding process can be reduced, and the stability and reliability of the welding points can be improved.
[0037] The signal transmission layer 20 is responsible for transmitting electromagnetic wave signals inside the waveguide antenna 100, and can transmit the received signals from the input end of the antenna to the radiation layer 10 or transmit the signals received by the radiation layer 10 to the output end of the antenna. In this process, the signal transmission layer 20 ensures the integrity and stability of the signals and avoids signal attenuation, distortion or interference during transmission.
[0038] The signal transmission layer 20 is stacked along the first direction D1 with the radiation layer 10, and the signal transmission layer 20 has a second surface 21 opposite to the first surface 11. Preferably, the second surface 21 is parallel to the first surface 11, and a gap space is formed between the second surface 21 and the first surface 11. The gap space is used to accommodate the solder layer 30 or other connecting material, and ensures the electrical connection between the signal transmission layer 20 and the radiation layer 10.
[0039] The solder layer 30 is arranged in the gap space, and the solder layer 30 is a metal layer for soldering, which ensures the electrical connection between the radiation layer 10 and the signal transmission layer 20. The solder layer 30 has a first end and a second end along the first direction D1. The first end of the solder layer 30 is connected to the soldering area 121, and the second end of the solder layer 30 is connected to the second surface 21. Through the stacking structure and soldering connection, the waveguide antenna 100 can achieve high integration, which is suitable for use in devices with limited space.
[0040] The solder of the solder layer 30 is preferably tin paste. The solder joint formed by the tin paste can maintain good signal transmission performance, ensure stable connection between the radiation layer 10 and the signal transmission layer 20, and has good signal transmission and conduction performance. At the same time, it can reduce the power loss of the signal at the connection, so that the waveguide antenna 100 can more effectively radiate and receive signals, thereby improving the communication quality.
[0041] Compared with the positioning method of the multi-layer waveguide antenna in the prior art by interference positioning, in the embodiments provided by the utility model, the positioning between the radiation layer 10 and the signal transmission layer 20 is realized by gap cooperation, and the position of the radiation layer 10 and the signal transmission layer 20 is corrected by the surface tension of the tin paste after melting in the reflow soldering process.
[0042] Specifically, the radiation layer 10 is provided with a positioning part, and the signal transmission layer 20 is provided with a positioning matching part. The positioning part and the positioning matching part form a gap positioning cooperation. Before reflow soldering, the radiation layer 10 and the signal transmission layer 20 are preliminarily aligned through the gap positioning cooperation of the positioning part and the positioning matching part, and a certain space is left for the flow of the two layers during the reflow soldering process.
[0043] Unlike the reflow soldering process in the prior art, the radiation layer 10 and the signal transmission layer 20 provided by the embodiment of the present application do not need to be pressed by a jig during the reflow soldering process, thereby simplifying the soldering process, reducing the dependence on the jig, and thus reducing the production cost and the process complexity. In the reflow soldering process, the radiation layer 10, the tin paste, and the signal transmission layer 20 enter the reflow furnace, the tin paste melts and wets the soldering area 121 of the solder resist part 12 and the signal transmission layer 20, forming a soldering point. During this process, the tin paste forms a surface tension after melting. This surface tension can automatically correct the positional deviation between the radiation layer 10 and the signal transmission layer 20, position the radiation layer 10 and the signal transmission layer 20, automatically correct the slight positional deviation, and ensure the high-precision alignment between the radiation layer 10 and the signal transmission layer 20.
[0044] One of the positioning part and the positioning matching part includes a positioning column, and the other includes a positioning hole, the positioning column is clearance-fitted in the positioning hole. Before soldering, the radiation layer 10 and the signal transmission layer 20 can be preliminarily aligned through the positioning column and the positioning hole, and the clearance-fitted positioning mode can leave a certain space for the radiation layer 10 and the signal transmission layer 20 to move and correct the alignment during the reflow soldering process.
[0045] In a feasible implementation, the positioning column is arranged on the radiation layer 10, and the positioning hole is arranged at the corresponding position of the signal transmission layer 20. Those skilled in the art can also arrange the positioning hole on the radiation layer 10 and the positioning column at the corresponding position of the signal transmission layer 20. This design can also achieve high-precision alignment, and the specific selection depends on the actual manufacturing process and design requirements, which are not limited herein.
[0046] To further improve the positioning accuracy and reliability, the positioning column includes a first positioning column 13 and a second positioning column 14, and the positioning hole includes a first positioning hole (not shown) and a second positioning hole (not shown). The cross sections of the first positioning column 13 and the first positioning hole are circular, and the cross sections of the second positioning column 14 and the second positioning hole are waist-shaped. The circular structure has the same symmetry in all directions, and thus can provide a relatively loose alignment tolerance, facilitating rapid assembly. The waist-shaped structure has different sizes in two principal axes, and thus can provide a more stringent alignment tolerance, ensuring the accurate alignment of the radiation layer 10 and the signal transmission layer 20 in the key direction.
[0047] Referring to FIG. 1, Figure 1 The first positioning column 13 and the second positioning column 14 are distributed at two corner ends of the diagonal line of the radiation layer 10, ensuring the symmetry and stability of the positioning column on the radiation layer 10. The first positioning hole and the second positioning hole are distributed at two corner ends of the diagonal line of the signal transmission layer 20, ensuring the symmetry and stability of the positioning hole on the signal transmission layer 20.
[0048] By distributing the positioning columns and positioning holes at the two corner ends of the diagonal line, high-precision alignment of the radiating layer 10 and the signal transmission layer 20 in two main directions can be ensured, welding defects caused by position deviation can be effectively reduced, and welding quality can be improved. Meanwhile, the diagonally distributed positioning columns and positioning holes can provide more stable structural support, reduce deformation or displacement caused by local stress concentration, and help improve the overall structural stability and reliability of the waveguide antenna 100.
[0049] In the embodiments provided by the utility model, as shown in Figure 2 the side of the signal transmission layer 20 facing the radiating layer 10 is provided with a protrusion 22, the protrusion 22 has a first end and a second end along the first direction D1, the first end of the protrusion 22 is connected with the signal transmission layer 20, the second surface 21 is formed at the second end of the protrusion 22, and a gap space is formed between the protrusion 22 and the radiating layer 10. The design of the protrusion 22 can ensure uniform distribution and flow of the solder paste during the welding process, thereby improving the welding quality, ensuring the stability and reliability of the welding points, and providing a physical reference point to ensure that the radiating layer 10 and the signal transmission layer 20 can be accurately aligned during the welding process, thereby reducing the positioning error caused by the displacement between the layers. Meanwhile, the protrusion 22 can provide better mechanical support to enhance the stability and reliability of the structure of the entire waveguide antenna 100.
[0050] Further, the solder layer 30 coincides with the projection of the protrusion 22 along the first direction D1. When viewed from the first direction D1, the solder layer 30 and the protrusion 22 completely overlap in space, ensuring that the solder layer 30 can accurately cover the area of the protrusion 22 during the welding process, thereby realizing stable connection between the radiating layer 10 and the signal transmission layer 20.
[0051] After the solder paste is melted, surface tension is formed, which can automatically correct the position deviation between the radiating layer 10 and the signal transmission layer 20. The surface tension enables the solder paste to automatically flow to the lowest energy state in the molten state, thereby ensuring uniform distribution of the solder paste in the welding area 121, enhancing the connection strength between the radiating layer 10 and the signal transmission layer 20, improving the stability and reliability of the welding points, and thereby improving the performance of the entire waveguide antenna 100.
[0052] The embodiments of the utility model also provide a preparation method for welding and fixing the radiating layer 10 and the signal transmission layer 20 of the waveguide antenna 100, the radiating layer 10 is provided with a positioning column, the signal transmission layer 20 is provided with a positioning hole and a protrusion 22, as shown in Figure 3 the method comprises the following steps:
[0053] Step S101: printing a solder resist part 12 on the first surface 11 of the radiation layer 10, and forming a soldering area 121 in the solder resist part 12.
[0054] Step S102: forming a bump 22 on the side of the signal transmission layer 20 facing the radiation layer 10, and coating the second surface 21 of the bump 22 with tin paste.
[0055] Step S103: inserting the positioning column on the radiation layer 10 into the positioning hole of the signal transmission layer 20 for initial positioning, and the tin paste on the bump 22 adheres to the soldering area 121 in the solder resist part 12.
[0056] Step S104: reflow soldering the radiation layer 10 and the signal transmission layer 20, and the tin paste on the bump 22 melts to form a solder layer 30, and the surface tension after the tin paste melts corrects the position of the radiation layer 10 and the signal transmission layer 20.
[0057] The preparation method provided by the embodiment of the utility model ensures the high-precision alignment and reliable electrical connection of the radiation layer 10 and the signal transmission layer 20 of the waveguide antenna 100 through the above steps, not only improves the welding quality and enhances the structural stability, but also optimizes the signal transmission path.
[0058] The embodiment of the utility model also provides a radar, which comprises the waveguide antenna 100, and the waveguide antenna 100 is provided with the solder resist part 12 on the radiation layer 10, and the solder resist part 12 serves as a reference mark, which helps to more accurately align the radiation layer 10 and the signal transmission layer 20 in the welding process, and through the accurate control of the position and shape of the solder resist part 12, the alignment between the radiation layer 10 and the signal transmission layer 20 can be ensured to be more accurate, thereby meeting the high-precision positioning requirement of the radiation layer 10 and the signal transmission layer 20 of the waveguide antenna 100 and improving the overall performance of the radar.
[0059] The above embodiment according to the drawings has explained the structure, features and effect of the utility model in detail, and the above description is only the preferred embodiment of the utility model, but the utility model is not limited to the drawings, any change or modification made according to the concept of the utility model, or the equivalent embodiment of equivalent change, as long as it is within the scope of the utility model.
Claims
1. A waveguide antenna, characterized by, The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
2. The waveguide antenna of claim 1, wherein, The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
3. The waveguide antenna of claim 2, wherein, The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
4. The waveguide antenna of claim 3, wherein, The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
5. The waveguide antenna of claim 4, wherein, The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
6. The waveguide antenna of claim 1, wherein: The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
7. The waveguide antenna of claim 6, wherein: The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
8. The waveguide antenna of claim 1, wherein, The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8.
9. A radar, characterized by The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. The radar comprises the waveguide antenna as claimed in any one of claims 1 to 8. 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