Testing device for arm sleeve of semiconductor chip transfer robot

Abstract

The invention discloses a testing device for an arm sleeve of a semiconductor chip transfer robot, and relates to the technical field of robots, the testing device comprises a testing platform, a controller and a grabbing module, the grabbing module is connected with the controller through a signal line, the controller is installed on the left side of the outer wall of the testing platform, and the grabbing module is installed on the upper side of the outer wall of the testing platform. The grabbing module comprises a storage box, a lifting rod, a rotating shaft, a first moving assembly and a grabbing motor, the lifting rod, the rotating shaft and the first moving assembly are connected with the grabbing motor through a connecting shaft, and the grabbing motor is connected with the controller through a signal line. By installing the grabbing module, the multi-scene grabbing simulation function is achieved, the problems that the environment interferes with the test result, the adjustment time is long and the test scene is single are solved, different test scenes can be set, the coverage range of grabbing test is widened, manual intervention is reduced, and the test efficiency and the test precision are improved.

Description

Technical Field

[0001] The invention relates to the technical field of robots, and in particular to a testing device for an arm cover of a semiconductor chip handling robot. Background Art

[0002] Semiconductor chip manufacturing involves thousands of steps, and wafer transfer must be completed in an ultra-clean environment. Manual operations are prone to contamination and are inefficient, which has led to the demand for automated handling equipment. The gripping force, vibration suppression, and positioning accuracy of the handling robot arm directly affect the wafer breakage rate and yield rate, so its performance indicators need to be verified by precision testing equipment; Traditional test benches are mostly fixed in height or angle, and cannot simulate multi-station switching or dynamic conveyor belt offset scenarios in the production line, resulting in incomplete verification of the grasping strategy. At the same time, the layout of the grasping scene relies on manual arrangement, which consumes manpower and reduces detection efficiency.

[0003] Patent CN118906092B discloses a fatigue testing device for a robotic arm. The above patent achieves the reduction of a large number of sensors while ensuring the test effect, thereby reducing costs and improving the stability of test results.

[0004] When testing the robotic arm, the above patent grabs the material block and moves it back and forth on the right platform and the left platform, which can simulate the real load of the robotic arm in the actual application scenario, making the test effect of the robotic arm more accurate. At the same time, a single left distance sensor can obtain the displacement deviation of different parts of the robotic arm, which reduces the cost and improves the stability of the test results. There is room for optimization in the layout of the test scene.

[0005] To this end, the present application proposes a testing device for a semiconductor chip handling robot arm set with multi-scenario grasping simulation. Summary of the invention

[0006] The object of the present invention is to provide a testing device for a semiconductor chip handling robot arm cover to solve the technical problem proposed in the above background technology that the test scene is single and relies on manual arrangement.

[0007] To achieve the above object, the present invention provides the following technical solution: a test device for a semiconductor chip handling robot arm set, comprising a test platform, a controller and a grabbing module, wherein the grabbing module is connected to the controller via a signal line; A controller is installed on the left side of the outer wall of the test platform, and a grabbing module is installed on the upper side of the outer wall of the test platform; The grabbing module comprises: a storage box, a lifting rod, a rotating shaft, a first moving assembly and a grabbing motor, wherein the lifting rod, the rotating shaft and the first moving assembly are connected to the grabbing motor via a connecting shaft, and the grabbing motor is connected to the controller via a signal line; A storage box is installed on the upper part of the inner wall of the test platform, a first moving component is installed on the front side of the outer wall of the storage box, a rotating shaft is installed on the lower side of the outer wall of the first moving component, a lifting rod is installed on the lower side of the outer wall of the rotating shaft, and a grabbing motor is installed on the lower side of the outer wall of the storage box.

[0008] Preferably, the grabbing module further includes a collection component, which includes: a visual sensor, a temperature sensor, a humidity sensor, a water tank, a nozzle, a switching valve and a fan, the visual sensor is connected to the controller through a signal line, the temperature sensor and the humidity sensor are connected to the switching valve through a signal line, the nozzle is connected to the water tank and the adaptation box through the switching valve, and the fan is connected to the grabbing motor through a connecting shaft; A temperature sensor is installed on the upper side of the outer wall of the test platform, a humidity sensor is installed on the right side of the outer wall of the temperature sensor, a visual sensor is installed on the lower side of the outer wall of the temperature sensor, a water tank is installed on the rear side of the outer wall of the test platform, a switching valve is installed on the upper side of the outer wall of the water tank, a fan is installed on the right side of the outer wall of the water tank, and a nozzle is installed on the upper side of the outer wall of the switching valve.

[0009] Preferably, an adaption module is installed on the right side of the outer wall of the grabbing module, and the adaption module is connected to the controller via a signal line; The adaptation module includes: an adaptation box, a heating unit, a refrigeration unit, a humidity unit and an electromagnetic unit, the heating unit and the refrigeration unit are connected to the temperature sensor through a signal line, the humidity unit is connected to the humidity sensor through a signal line, the humidity unit is connected to the water tank through a pipeline, and the electromagnetic unit is connected to the controller through a signal line; An adaptation box is installed on the right side of the outer wall of the grabbing module, a heating unit is installed on the rear side of the outer wall of the adaptation box, a refrigeration unit is installed on the upper side of the outer wall of the heating unit, a refrigeration unit is installed on the right side of the outer wall of the heating unit, and an electromagnetic unit is installed on the upper side of the outer wall of the adaptation box.

[0010] Preferably, a fixing module is installed on the front side of the outer wall of the test platform, and the fixing module is connected to the controller via a signal line; The fixing module includes: a fixing platform, an interface, a buckle and a second moving component. The second moving component is connected to the controller through a signal line, and the buckle is connected to the grabbing motor through a connecting shaft. A second movable assembly is installed on the front side of the outer wall of the test platform, a fixed platform is installed on the front side of the outer wall of the second movable assembly, a buckle is installed on the upper side of the outer wall of the fixed platform, and an interface is installed on the upper side of the outer wall of the buckle.

[0011] Preferably, a vibration component is installed on the lower side of the outer wall of the fixing platform, and the vibration component is connected to the controller through a signal line; The vibration assembly includes: a spring, a connector, a vibration table and a buffer pad, and the connector and the vibration table are connected to the controller through a signal line; A buffer pad is installed on the lower side of the outer wall of the fixed platform, a vibration platform is installed on the lower side of the outer wall of the buffer pad, a spring is installed on the lower side of the outer wall of the vibration platform, and a connector is installed in the middle of the outer wall of the vibration platform.

[0012] Preferably, a loading unit is installed in the middle of the inner wall of the storage box, and the loading unit includes: a push rod, a slide slot, an opening and closing valve and a counter, the push rod is connected to the grabbing motor through a connecting shaft, and the opening and closing valve and the counter are connected to the controller through a signal line; A push rod is installed at the middle of the inner wall of the test platform, a slide groove is installed on the front side of the outer wall of the push rod, an opening and closing valve is installed on the front side of the outer wall of the slide groove, and a counter is installed on the rear side of the outer wall of the opening and closing valve.

[0013] Preferably, the first moving assembly comprises: a first slide rail, a first pulley, a first fixture, a storage platform and a tension sensor, the first pulley is connected to the grabbing motor via a connecting shaft, and the first fixture and the tension sensor are connected to the controller via a signal line; A first slide rail is installed on the upper side of the outer wall of the storage box, a first pulley is installed on the upper side of the outer wall of the first slide rail, a storage table is installed on the upper side of the outer wall of the first pulley, a first fixer is installed on the upper side of the outer wall of the storage table, and a tension sensor is installed on the lower side of the outer wall of the storage table.

[0014] Preferably, an opening and closing unit is provided inside the adaptation box, and the opening and closing unit comprises: an infrared sensor, a guide rail, a telescopic shaft and a positioning member, the infrared sensor is connected to the controller through a signal line, and the telescopic shaft is connected to the grabbing motor through a connecting shaft; A guide rail is installed at the lower part of the inner wall of the adaptation box, a telescopic shaft is installed at the upper side of the outer wall of the guide rail, an infrared sensor is installed at the left side of the outer wall of the adaptation box, and a positioning piece is installed at the lower side of the outer wall of the adaptation box.

[0015] Preferably, the electromagnetic unit comprises: an electromagnetic generator and an electromagnetic inductor, and the electromagnetic generator and the electromagnetic inductor are connected to the controller via a signal line; An electromagnetic inductor is installed on the upper side of the outer wall of the adaptation box, and an electromagnetic generator is installed in the middle of the outer wall of the electromagnetic inductor.

[0016] Preferably, the second moving assembly comprises: a second slide rail, a second pulley, a second fixer and a positioner, the positioner is connected to the second fixer via a signal line, and the second pulley is connected to the grabbing motor via a connecting shaft; A second slide rail is installed on the lower side of the outer wall of the fixed module, a second pulley is installed on the upper side of the outer wall of the second slide rail, a second fixer is installed on the upper side of the outer wall of the second slide rail, and a positioner is installed on the rear side of the outer wall of the fixed platform.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes the function of multi-scenario grabbing simulation by installing a grabbing module, solves the problems of environmental interference test results, long adjustment time and single test scenario, can set different test scenarios, broaden the coverage of grabbing test, reduce manual intervention, and improve test efficiency and test accuracy; 2. The present invention realizes the function of gradient changing the test environment by installing an adaptation module, solves the problem that the arm cuff is deformed due to rapid switching of environmental conditions and affects the accuracy of the test results, can accurately capture nonlinear responses, avoid errors caused by large environmental changes, reduce the loss of the arm cuff, and improve test efficiency; 3. The present invention realizes the function of quickly replacing the arm cuff by installing a fixed module, solves the problems of insufficient interface standardization, cumbersome calibration process and reliance on manual intervention, is compatible with arm cuffs of different specifications, reduces operation complexity, improves replacement efficiency and reduces maintenance costs; 4. The present invention realizes the function of automatically adjusting the vibration frequency by installing a vibration module, thereby solving the problems of high vibration test cost, low degree of operation automation and low environmental adaptability, and can broaden the frequency band of vibration suppression, avoid shock absorption failure caused by load changes, improve test coverage, and extend the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a side structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the structure of the acquisition component of the present invention; Figure 4 It is a schematic diagram of the adaptation module structure of the present invention; Figure 5 It is a schematic diagram of the structure of the vibration component of the present invention; Figure 6 It is a schematic diagram of the structure of the feeding unit of the present invention; Figure 7 It is a schematic structural diagram of the first moving assembly and the second moving assembly of the present invention; Figure 8 It is a schematic diagram of the opening and closing unit structure of the present invention.

[0019] In the figure: 1. Test platform; 2. Controller; 3. Fixing platform; 4. Vibration assembly; 5. Adaptation box; 6. Storage platform; 7. Electromagnetic unit; 8. Storage box; 9. Lifting rod; 10. Rotating shaft; 11. Grasping motor; 12. Visual sensor; 13. Temperature sensor; 14. Humidity sensor; 15. Water tank; 16. Nozzle; 17. Switching valve; 18. Fan; 19. Heating unit; 20. Refrigeration unit; 21. Humidity unit; 22. Interface; 23. Buckle; 2 4. Spring; 25. Connector; 26. Vibration table; 27. Buffer pad; 28. Push rod; 29. ​​Slide groove; 30. Opening and closing valve; 31. Counter; 32. First slide rail; 33. First pulley; 34. First fixture; 35. Tension sensor; 36. Infrared sensor; 37. Guide rail; 38. Telescopic shaft; 39. Positioning piece; 40. Electromagnetic generator; 41. Electromagnetic inductor; 42. Second slide rail; 43. Second pulley; 44. Second fixture; 45. Positioner. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3, Figure 6 and Figure 7 , a test device for a semiconductor chip handling robot arm set, comprising a test platform 1, a controller 2 and a grab module, wherein the grab module is connected to the controller 2 via a signal line; A controller 2 is installed on the left side of the outer wall of the test platform 1, and a grabbing module is installed on the upper side of the outer wall of the test platform 1; The grabbing module includes: a storage box 8, a lifting rod 9, a rotating shaft 10, a first moving assembly and a grabbing motor 11, wherein the lifting rod 9, the rotating shaft 10 and the first moving assembly are connected to the grabbing motor via a connecting shaft, and the grabbing motor 11 is connected to the controller 2 via a signal line; A storage box 8 is installed on the upper part of the inner wall of the test platform 1, a first moving assembly is installed on the front side of the outer wall of the storage box 8, a rotating shaft 10 is installed on the lower side of the outer wall of the first moving assembly, a lifting rod 9 is installed on the lower side of the outer wall of the rotating shaft 10, and a grabbing motor 11 is installed on the lower side of the outer wall of the storage box 8; The grabbing module also includes a collection component, which includes: a visual sensor 12, a temperature sensor 13, a humidity sensor 14, a water tank 15, a nozzle 16, a switching valve 17 and a fan 18. The visual sensor 12 is connected to the controller 2 through a signal line, the temperature sensor 13 and the humidity sensor 14 are connected to the switching valve 17 through a signal line, the nozzle 16 is connected to the water tank 15 and the adaptation box 5 through the switching valve 17, and the fan 18 is connected to the grabbing motor 11 through a connecting shaft; A temperature sensor 13 is installed on the upper side of the outer wall of the test platform 1, a humidity sensor 14 is installed on the right side of the outer wall of the temperature sensor 13, a visual sensor 12 is installed on the lower side of the outer wall of the temperature sensor 13, a water tank 15 is installed on the rear side of the outer wall of the test platform 1, a switching valve 17 is installed on the upper side of the outer wall of the water tank 15, a fan 18 is installed on the right side of the outer wall of the water tank 15, and a nozzle 16 is installed on the upper side of the outer wall of the switching valve 17; A loading unit is installed in the middle of the inner wall of the storage box 8, and the loading unit includes: a push rod 28, a slide slot 29, an opening and closing valve 30 and a counter 31. The push rod 28 is connected to the grabbing motor 11 through a connecting shaft, and the opening and closing valve 30 and the counter 31 are connected to the controller 2 through a signal line; A push rod 28 is installed in the middle of the inner wall of the test platform 1, a slide groove 29 is installed on the front side of the outer wall of the push rod 28, an opening and closing valve 30 is installed on the front side of the outer wall of the slide groove 29, and a counter 31 is installed on the rear side of the outer wall of the opening and closing valve 30; The first moving assembly includes: a first slide rail 32, a first pulley 33, a first fixture 34, a storage platform 6 and a tension sensor 35, the first pulley 33 is connected to the grab motor 11 through a connecting shaft, and the first fixture 34 and the tension sensor 35 are connected to the controller 2 through a signal line; A first slide rail 32 is installed on the upper side of the outer wall of the storage box 8, a first pulley 33 is installed on the upper side of the outer wall of the first slide rail 32, a storage platform 6 is installed on the upper side of the outer wall of the first pulley 33, a first fixture 34 is installed on the upper side of the outer wall of the storage platform 6, and a tension sensor 35 is installed on the lower side of the outer wall of the storage platform 6; Further, after the operator places the transport robot arm cover, the controller 2 controls the temperature sensor 13 and the humidity sensor 14 to detect the temperature and humidity of the environment, and transmits the information to the controller 2. The controller 2 compares the received temperature and humidity information with the preset temperature range of 20°C to 25°C and the humidity range of 30% to 50% to ensure that the ambient temperature and humidity are within the set range. After confirming that the temperature and humidity of the test environment are within the set range, the controller 2 opens the opening and closing valve 30 to control the grabbing motor 11 to drive the push rod 28 to push the SEMI standard test piece for grabbing test stored in the storage box 8 from the slide 29 to the storage table 6, and the number of SEMI standard test pieces placed on the storage table 6 is recorded by the counter 31. After completion, the standard test piece is fixed on the storage table 6 by the first fixer 34. The controller 2 controls the grabbing motor 11 to drive the first pulley 33 to move the storage table 6 on the first slide rail 32 to perform a grabbing test on the arm cover. The controller 2 controls the lifting rod 9 to raise the storage table 6 to different heights. The controller 2 controls the rotating The moving shaft 10 turns the storage table 6 to different angles, controls the first moving component to move the storage table 6 to different positions, and the controller 2 controls the opening and closing valve 30 to open. The grasping motor 11 drives the push rod 28 to push the test piece in the storage box 8 out of the slide slot 29, and the counter 31 records the number of test pieces placed on the storage table 6, and transmits the information to the controller 2, and performs a grasping test on the arm sleeve. During the test, the first fixer 34 is controlled to fix and unfix the SEMI standard test piece on the storage table 6. When fixed, the tension that the arm sleeve can generate is tested by the tension sensor 35 under the storage table 6. In the unfixed state, the visual sensor 12 is used to record the process of the arm sleeve grasping the SEMI standard test piece, and the information is transmitted to the controller 2. The controller 2 analyzes the grasping process of the arm sleeve, realizes the function of multi-scenario grasping simulation, solves the problems of environmental interference test results, long adjustment time and single test scenario, can set different test scenarios, broaden the coverage of grasping test, reduce manual intervention, and improve test efficiency and test accuracy.

[0024] Example 2: Please refer to Figure 1 , Figure 2 , Figure 7 and Figure 8 A test device for a semiconductor chip handling robot comprises a test platform 1, a controller 2 and a grabbing module, wherein the grabbing module is connected to the controller 2 via a signal line; A controller 2 is installed on the left side of the outer wall of the test platform 1, and a grabbing module is installed on the upper side of the outer wall of the test platform 1; The grabbing module includes: a storage box 8, a lifting rod 9, a rotating shaft 10, a first moving assembly and a grabbing motor 11, wherein the lifting rod 9, the rotating shaft 10 and the first moving assembly are connected to the grabbing motor via a connecting shaft, and the grabbing motor 11 is connected to the controller 2 via a signal line; A storage box 8 is installed on the upper part of the inner wall of the test platform 1, a first moving assembly is installed on the front side of the outer wall of the storage box 8, a rotating shaft 10 is installed on the lower side of the outer wall of the first moving assembly, a lifting rod 9 is installed on the lower side of the outer wall of the rotating shaft 10, and a grabbing motor 11 is installed on the lower side of the outer wall of the storage box 8; An adaptation module is installed on the right side of the outer wall of the grabbing module, and the adaptation module is connected to the controller 2 via a signal line; The adaptation module includes: an adaptation box 5, a heating unit 19, a refrigeration unit 20, a humidity unit 21 and an electromagnetic unit 7, the heating unit 19 and the refrigeration unit 20 are connected to the temperature sensor 13 through a signal line, the humidity unit 21 is connected to the humidity sensor 14 through a signal line, the humidity unit 21 is connected to the water tank 15 through a pipeline, and the electromagnetic unit 7 is connected to the controller 2 through a signal line; An adaption box 5 is installed on the right side of the outer wall of the grab module, a heating unit 19 is installed on the rear side of the outer wall of the adaption box 5, a refrigeration unit 20 is installed on the upper side of the outer wall of the heating unit 19, a refrigeration unit 20 is installed on the right side of the outer wall of the heating unit 19, and an electromagnetic unit 7 is installed on the upper side of the outer wall of the adaption box 5; The electromagnetic unit 7 includes: an electromagnetic generator 40 and an electromagnetic inductor 41, and the electromagnetic generator 40 and the electromagnetic inductor 41 are connected to the controller 2 through a signal line; An electromagnetic inductor 41 is installed on the upper side of the outer wall of the adaptation box 5, and an electromagnetic generator 40 is installed in the middle of the outer wall of the electromagnetic inductor 41; An opening and closing unit is provided inside the adaptation box 5, and the opening and closing unit includes: an infrared sensor 36, a guide rail 37, a telescopic shaft 38 and a positioning member 39, the infrared sensor 36 is connected to the controller 2 through a signal line, and the telescopic shaft 38 is connected to the grabbing motor 11 through a connecting shaft; A guide rail 37 is installed at the lower part of the inner wall of the adaptation box 5, a telescopic shaft 38 is installed at the upper side of the outer wall of the guide rail 37, an infrared sensor 36 is installed at the left side of the outer wall of the adaptation box 5, and a positioning member 39 is installed at the lower side of the outer wall of the adaptation box 5; Further, after completing the grabbing test, by canceling the fixing effect of the second fixer 44 on the fixing platform 3, the grabbing motor 11 drives the second pulley 43 to move on the second slide rail 42, and moves the fixing platform 3 into the adaptation box 5 to perform an environmental adaptability test. When the fixing platform 3 arrives in front of the adaptation box 5, the infrared sensor 36 senses the arrival of the fixing platform 3, controls the grabbing motor 11 to drive the telescopic shaft 38 to open the adaptation box 5, stops moving the fixing platform 3 after the positioner 45 senses the positioning member 39, and controls the telescopic shaft 38 to restore the adaptation box 5 to a closed state. Subsequently, the temperature sensor 13, the humidity sensor 14 and the electromagnetic sensor 41 are used to collect information on the environmental conditions in the adaptation box 5, and the information is transmitted to the controller 2. The controller 2 adjusts the environment according to the current environment in the adaptation box 5 to keep the temperature at 20°C, the humidity at 30%, and the environment without electromagnetic interference. Subsequently, the refrigeration unit 20 is controlled to cool the inside of the adaptation box 5. After the temperature drops to -40°C, the heating unit 1 is used to cool the inside of the adaptation box 5. 9 gradually increases the temperature to 150°C, then controls the refrigeration unit 20 to lower the temperature to 20°C, maintains the humidity and electromagnetic interference unchanged during the temperature adjustment process to perform a grasping test, after completing the temperature test, controls the temperature and electromagnetic interference unchanged, gradually increases the humidity in the adaptation box 5 to 98% through the humidity unit 21 and then reduces it to 20% to perform a grasping test, after completing the humidity test, adjusts the humidity to 30%, maintains the temperature and humidity unchanged, changes the electromagnetic intensity range in the adaptation box 5 to 3V / m~10V / m through the electromagnetic generator 40 to perform a grasping test, records the test results through the visual sensor 12 and the tension sensor 35 in the adaptation box 5, and transmits the test results to the controller 2 for analysis, realizing the function of gradient changing the test environment, solving the problem that the arm cuff is deformed due to rapid switching of environmental conditions and affecting the accuracy of the test results, being able to accurately capture nonlinear responses, avoiding errors caused by large environmental changes, reducing the loss of the arm cuff, and improving the test efficiency.

[0025] Example 3: Please refer to Figure 1 , Figure 2 and Figure 7 , a test device for a semiconductor chip handling robot, wherein a fixing module is installed on the front side of the outer wall of the test platform 1, and the fixing module is connected to the controller 2 through a signal line; The fixing module includes: a fixing platform 3, an interface 22, a buckle 23 and a second moving component. The second moving component is connected to the controller 2 via a signal line, and the buckle 23 is connected to the grabbing motor 11 via a connecting shaft. A second moving assembly is installed on the front side of the outer wall of the test platform 1, a fixed platform 3 is installed on the front side of the outer wall of the second moving assembly, a buckle 23 is installed on the upper side of the outer wall of the fixed platform 3, and an interface 22 is installed on the upper side of the outer wall of the buckle 23; The second moving assembly includes: a second slide rail 42, a second pulley 43, a second fixer 44 and a positioner 45, the positioner 45 is connected to the second fixer 44 through a signal line, and the second pulley 43 is connected to the grabbing motor 11 through a connecting shaft; A second slide rail 42 is installed on the lower side of the outer wall of the fixed module, a second pulley 43 is installed on the upper side of the outer wall of the second slide rail 42, a second fixture 44 is installed on the upper side of the outer wall of the second slide rail 42, and a positioner 45 is installed on the rear side of the outer wall of the fixed platform 3; Furthermore, when testing multiple arm sleeves, after starting the test or completing an arm sleeve test, the operator controls the grabbing motor 11 through the controller 2 to drive the second pulley 43 to move the fixed platform 3 to the grab module, and fixes the fixed platform 3 through the second fixer 44. The operator releases the fixation between the interface 22 and the arm sleeve through the buckle 23, removes the arm sleeve that has been tested, and replaces it with the arm sleeve that needs to be tested. After placement, it is re-fixed through the buckle 23. When the arm sleeve and the interface 22 are not compatible, the connection between the interface 22 and the fixed platform 3 is cancelled through the buckle 23, and the interface 22 that the arm sleeve is compatible with is placed on the fixed platform 3, and the interface 22 and the fixed platform 3 are fixed through the buckle 23. By placing the arm sleeve on the interface 22 and fixing it with the buckle 23, the function of quickly replacing the arm sleeve is realized, which solves the problems of insufficient standardization of the interface 22, cumbersome calibration process and reliance on manual intervention. It can be compatible with arm sleeves of different specifications, reduces the complexity of operation, improves replacement efficiency, and reduces maintenance costs.

[0026] Example 4: Please refer to Figure 1 , Figure 2 and Figure 4 , a test device for a semiconductor chip handling robot, comprising a test platform 1, a controller 2 and a grabbing module, wherein the grabbing module is connected to the controller 2 via a signal line; A controller 2 is installed on the left side of the outer wall of the test platform 1, and a grabbing module is installed on the upper side of the outer wall of the test platform 1; The grabbing module includes: a storage box 8, a lifting rod 9, a rotating shaft 10, a first moving assembly and a grabbing motor 11, wherein the lifting rod 9, the rotating shaft 10 and the first moving assembly are connected to the grabbing motor via a connecting shaft, and the grabbing motor 11 is connected to the controller 2 via a signal line; A storage box 8 is installed on the upper part of the inner wall of the test platform 1, a first moving assembly is installed on the front side of the outer wall of the storage box 8, a rotating shaft 10 is installed on the lower side of the outer wall of the first moving assembly, a lifting rod 9 is installed on the lower side of the outer wall of the rotating shaft 10, and a grabbing motor 11 is installed on the lower side of the outer wall of the storage box 8; A vibration component 4 is installed on the lower side of the outer wall of the fixing platform 3, and the vibration component 4 is connected to the controller 2 through a signal line; The vibration assembly 4 includes: a spring 24, a connector 25, a vibration table 26 and a buffer pad 27, and the connector 25 and the vibration table 26 are connected to the controller 2 through a signal line; A buffer pad 27 is installed on the lower side of the outer wall of the fixing platform 3, a vibration platform 26 is installed on the lower side of the outer wall of the buffer pad 27, a spring 24 is installed on the lower side of the outer wall of the vibration platform 26, and a connector 25 is installed in the middle of the outer wall of the vibration platform 26; Furthermore, during the grasping test of the arm cuff, the high-frequency vibration energy generated during the grasping process is absorbed by the buffer pad 27, the medium and low-frequency vibration energy is neutralized by the spring 24, and the vibration table 26 offsets the vibration generated during the grasping process by actively applying reverse vibration, thereby broadening the frequency of vibration suppression during the test. During the vibration scene simulation, the vibration table 26 can apply a variety of vibration modes to the fixed table 3 to simulate the various complex vibration environments that may occur in the arm cuff during the grasping and transportation of chips. Within the vibration frequency range of 1Hz to 100Hz, the vibration frequency is gradually increased. In this process, the controller 2 controls the grasping module to provide grasping tests of different scenarios for the arm cuff, and records the grasping process of the arm cuff under the vibration scenario through the visual sensor 12 and the tension sensor 35 for analysis, thereby realizing the function of automatically adjusting the vibration frequency, solving the problems of high cost of vibration testing, low degree of operation automation and low environmental adaptability, broadening the frequency band of vibration suppression, avoiding shock absorption failure caused by load changes, improving the coverage of the test, and extending the service life of the device.

[0027] Example 5: Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , a test device for a semiconductor chip handling robot, the grabbing module also includes a collection component, the collection component includes: a visual sensor 12, a temperature sensor 13, a humidity sensor 14, a water tank 15, a nozzle 16, a switching valve 17 and a fan 18, the visual sensor 12 is connected to the controller 2 through a signal line, the temperature sensor 13 and the humidity sensor 14 are connected to the switching valve 17 through a signal line, the nozzle 16 is connected to the water tank 15 and the adaptation box 5 through the switching valve 17, and the fan 18 is connected to the grabbing motor 11 through a connecting shaft; A temperature sensor 13 is installed on the upper side of the outer wall of the test platform 1, a humidity sensor 14 is installed on the right side of the outer wall of the temperature sensor 13, a visual sensor 12 is installed on the lower side of the outer wall of the temperature sensor 13, a water tank 15 is installed on the rear side of the outer wall of the test platform 1, a switching valve 17 is installed on the upper side of the outer wall of the water tank 15, a fan 18 is installed on the right side of the outer wall of the water tank 15, and a nozzle 16 is installed on the upper side of the outer wall of the switching valve 17; An adaptation module is installed on the right side of the outer wall of the grabbing module, and the adaptation module is connected to the controller 2 via a signal line; The adaptation module includes: an adaptation box 5, a heating unit 19, a refrigeration unit 20, a humidity unit 21 and an electromagnetic unit 7, the heating unit 19 and the refrigeration unit 20 are connected to the temperature sensor 13 through a signal line, the humidity unit 21 is connected to the humidity sensor 14 through a signal line, the humidity unit 21 is connected to the water tank 15 through a pipeline, and the electromagnetic unit 7 is connected to the controller 2 through a signal line; An adaption box 5 is installed on the right side of the outer wall of the grab module, a heating unit 19 is installed on the rear side of the outer wall of the adaption box 5, a refrigeration unit 20 is installed on the upper side of the outer wall of the heating unit 19, a refrigeration unit 20 is installed on the right side of the outer wall of the heating unit 19, and an electromagnetic unit 7 is installed on the upper side of the outer wall of the adaption box 5; Furthermore, when the arm cuff is subjected to a grasping test in the grasping module, the test environment of the grasping module needs to be adjusted to ensure that the environment does not interfere with the test results. At this time, the temperature in the adaptation box 5 is adjusted by controlling the heating unit 19 or the refrigeration unit 20 on the rear side of the outer wall of the adaptation box 5, the nozzle 16 and the adaptation box 5 are connected through the switching valve 17, and the fan 18 is driven to rotate by the grasping motor 11, so that the hot air or cold air in the adaptation box 5 flows from the nozzle 16 to the grasping module through the switching valve 17, and the temperature of the test environment is adjusted, so that the test device can test two or more arm cuffs at the same time, and the arm cuff in the adaptation box 5 is subjected to environmental adaptation. When the temperature test is performed, the hot and cold air in the adaptation box 5 can be used to adjust the temperature of the grabbing module, which improves the test efficiency and energy utilization rate. At the same time, the nozzle 16 and the water tank 15 are connected through the switching valve 17 to adjust the humidity. When the arm cuff enters the adaptation box 5 for adaptation test, when the humidity in the adaptation box 5 is adjusted, the water tank 15 and the humidity unit 21 are connected through the switching valve 17. The humidity unit 21 takes water from the water tank 15 when humidifying the inside of the adaptation box 5, and flows the generated water into the water tank 15 through a pipe when dehumidifying, thereby realizing the rational use of resources, avoiding waste of resources, and reducing the detection cost.

[0028] Working principle: when testing multiple arm sleeves, after starting the test or completing an arm sleeve test, the operator controls the grabbing motor 11 through the controller 2 to drive the second pulley 43 to move the fixed platform 3 to the grabbing module, and fixes the fixed platform 3 through the second fixer 44. The operator releases the fixation between the interface 22 and the arm sleeve through the buckle 23, removes the arm sleeve that has been tested, and replaces it with the arm sleeve that needs to be tested. After placement, it is re-fixed through the buckle 23. When the arm sleeve and the interface 22 are not compatible, the connection between the interface 22 and the fixed platform 3 is cancelled through the buckle 23, and the interface 22 that the arm sleeve is adapted to is placed on the fixed platform 3. The interface 22 and the fixed platform 3 are fixed through the buckle 23, and the arm sleeve is placed on the interface 22 and fixed using the buckle 23; After the operator places the transport robot arm cover, the controller 2 controls the temperature sensor 13 and the humidity sensor 14 to detect the temperature and humidity of the environment, and transmits the information to the controller 2. The controller 2 compares the received temperature and humidity information with the preset temperature range of 20℃~25℃ and the humidity range of 30%~50% to ensure that the ambient temperature and humidity are within the set range. When it is not within the range, the temperature in the adaptation box 5 is adjusted by controlling the heating unit 19 or the refrigeration unit 20 on the rear side of the outer wall of the adaptation box 5, and the nozzle 16 and the adaptation box are connected through the switching valve 17. The grabbing motor 11 drives the fan 18 to rotate, and the hot air or cold air in the adaptation box 5 flows from the nozzle 16 to the grabbing module through the switching valve 17 to adjust the temperature of the test environment. The nozzle 16 and the water tank 15 are connected by the switching valve 17 to adjust the humidity. After confirming that the temperature and humidity of the test environment are within the set range, the controller 2 opens the opening and closing valve 30 to control the grabbing motor 11 to drive the push rod 28 to push the SEMI standard test piece for grabbing test stored in the storage box 8 from the slide 29 to the storage table 6, and the counter 31 records the temperature of the storage table 6. The number of SEMI standard test pieces placed on the platform 6 is determined. After completion, the standard test pieces are fixed on the platform 6 by the first fixture 34. The controller 2 controls the grabbing motor 11 to drive the first pulley 33 to move the platform 6 on the first slide rail 32 to perform a grabbing test on the arm sleeve. The controller 2 controls the lifting rod 9 to raise the platform 6 to different heights. The controller 2 controls the rotating shaft 10 to turn the platform 6 to different angles and controls the first moving assembly to move the platform 6 to different positions. The controller 2 controls the opening and closing valve 30 to open. The grabbing motor 11 drives the push rod 28 to move the storage box 8 The test piece in the slide 29 is pushed out, and the number of test pieces placed on the storage table 6 is recorded by the counter 31, and the information is transmitted to the controller 2, and the arm sleeve is subjected to a grasping test. During the test, the first fixture 34 is controlled to fix and unfix the SEMI standard test piece on the storage table 6. When the test piece is fixed, the tension generated by the arm sleeve is tested by the tension sensor 35 under the storage table 6. When the test piece is fixed, the process of the arm sleeve grasping the SEMI standard test piece is recorded by the visual sensor 12, and the information is transmitted to the controller 2, and the controller 2 analyzes the grasping process of the arm sleeve; After completing the grabbing test, by canceling the fixing effect of the second fixer 44 on the fixing platform 3, the grabbing motor 11 drives the second pulley 43 to move on the second slide rail 42, and moves the fixing platform 3 into the adaptation box 5 to conduct an environmental adaptability test. When the fixing platform 3 arrives in front of the adaptation box 5, the infrared sensor 36 senses the arrival of the fixing platform 3, and controls the grabbing motor 11 to drive the telescopic shaft 38 to open the adaptation box 5. After the positioner 45 senses the positioning member 39, the movement of the fixing platform 3 is stopped, and the telescopic shaft 38 is controlled to restore the adaptation box 5 to a closed state. Subsequently, the environmental conditions in the adaptation box 5 are collected through the temperature sensor 13, the humidity sensor 14 and the electromagnetic sensor 41, and the information is transmitted to the controller 2. The controller 2 adjusts according to the current environment in the adaptation box 5 to keep the temperature at 20°C, the humidity at 30%, and the environment without electromagnetic interference. Subsequently, the refrigeration unit 20 is controlled to cool the inside of the adaptation box 5. When the temperature drops to -40°C Then, the temperature is gradually increased to 150°C by the heating unit 19, and then the refrigeration unit 20 is controlled to reduce the temperature to 20°C. During the temperature adjustment process, the humidity and electromagnetic interference are maintained unchanged for the grasping test. After the temperature test is completed, the temperature and electromagnetic interference are controlled unchanged. The humidity unit 21 is connected to the water tank 15 and the humidity unit 21 through the switching valve 17. The humidity unit 21 takes water from the water tank 15 when humidifying the inside of the adaptation box 5, and flows the generated water into the water tank 15 through the pipeline when dehumidifying. The humidity in the adaptation box 5 is gradually increased to 98% and then reduced to 20% for the grasping test. After the humidity test is completed, the humidity is adjusted to 30%, the temperature and humidity are maintained unchanged, and the electromagnetic intensity range in the adaptation box 5 is changed to 3V / m~10V / m by the electromagnetic generator 40 for the grasping test. The test results are recorded by the visual sensor 12 and the tension sensor 35 in the adaptation box 5, and the test results are transmitted to the controller 2 for analysis; During the grasping test of the arm cuff, the high-frequency vibration energy generated during the grasping process is absorbed by the buffer pad 27, the medium and low-frequency vibration energy is neutralized by the spring 24, and the vibration table 26 offsets the vibration generated during the grasping process by actively applying reverse vibration, thereby broadening the frequency of vibration suppression during the test. During the vibration scene simulation, the vibration table 26 can apply a variety of vibration modes to the fixed table 3 to simulate the various complex vibration environments that may occur in the process of grasping and transporting chips by the arm cuff. In the vibration frequency range of 1Hz to 100Hz, the vibration frequency is gradually increased. In this process, the controller 2 controls the grasping module to provide grasping tests in different scenarios for the arm cuff, and records the grasping process of the arm cuff in the vibration scenario through the visual sensor 12 and the tension sensor 35 for analysis.

[0029] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A test device for a semiconductor chip handling robot arm set, characterized in that: It comprises a test platform (1), a controller (2) and a grabbing module, wherein the grabbing module is connected to the controller (2) via a signal line; A controller (2) is installed on the left side of the outer wall of the test platform (1), and a gripping module is installed on the upper side of the outer wall of the test platform (1); The grabbing module comprises: a storage box (8), a lifting rod (9), a rotating shaft (10), a first moving assembly and a grabbing motor (11); the lifting rod (9), the rotating shaft (10) and the first moving assembly are connected to the grabbing motor via a connecting shaft; and the grabbing motor (11) is connected to a controller (2) via a signal line; A storage box (8) is installed on the upper part of the inner wall of the test platform (1), a first moving assembly is installed on the front side of the outer wall of the storage box (8), a rotating shaft (10) is installed on the lower side of the outer wall of the first moving assembly, a lifting rod (9) is installed on the lower side of the outer wall of the rotating shaft (10), and a grabbing motor (11) is installed on the lower side of the outer wall of the storage box (8).

2. The testing device for a semiconductor chip handling robot arm set according to claim 1, characterized in that: The grasping module further comprises a collection component, which comprises: a visual sensor (12), a temperature sensor (13), a humidity sensor (14), a water tank (15), a nozzle (16), a switching valve (17) and a fan (18), wherein the visual sensor (12) is connected to the controller (2) via a signal line, the temperature sensor (13) and the humidity sensor (14) are connected to the switching valve (17) via a signal line, the nozzle (16) is connected to the water tank (15) and the adaptation box (5) via the switching valve (17), and the fan (18) is connected to the grasping motor (11) via a connecting shaft; A temperature sensor (13) is installed on the upper side of the outer wall of the test platform (1), a humidity sensor (14) is installed on the right side of the outer wall of the temperature sensor (13), a visual sensor (12) is installed on the lower side of the outer wall of the temperature sensor (13), a water tank (15) is installed on the rear side of the outer wall of the test platform (1), a switching valve (17) is installed on the upper side of the outer wall of the water tank (15), a fan (18) is installed on the right side of the outer wall of the water tank (15), and a nozzle (16) is installed on the upper side of the outer wall of the switching valve (17).

3. The testing device for a semiconductor chip handling robot arm set according to claim 1, characterized in that: An adaptation module is installed on the right side of the outer wall of the grabbing module, and the adaptation module is connected to the controller (2) via a signal line; The adaptation module comprises: an adaptation box (5), a heating unit (19), a refrigeration unit (20), a humidity unit (21) and an electromagnetic unit (7); the heating unit (19) and the refrigeration unit (20) are connected to the temperature sensor (13) via a signal line; the humidity unit (21) is connected to the humidity sensor (14) via a signal line; the humidity unit (21) is connected to the water tank (15) via a pipeline; and the electromagnetic unit (7) is connected to the controller (2) via a signal line; An adaptation box (5) is installed on the right side of the outer wall of the gripping module, a heating unit (19) is installed on the rear side of the outer wall of the adaptation box (5), a refrigeration unit (20) is installed on the upper side of the outer wall of the heating unit (19), a refrigeration unit (20) is installed on the right side of the outer wall of the heating unit (19), and an electromagnetic unit (7) is installed on the upper side of the outer wall of the adaptation box (5).

4. The testing device for a semiconductor chip handling robot arm set according to claim 1, characterized in that: A fixing module is installed on the front side of the outer wall of the test platform (1), and the fixing module is connected to the controller (2) via a signal line; The fixing module comprises: a fixing platform (3), an interface (22), a buckle (23) and a second moving component, wherein the second moving component is connected to the controller (2) via a signal line, and the buckle (23) is connected to the grabbing motor (11) via a connecting shaft. A second movable assembly is installed on the front side of the outer wall of the test platform (1), a fixed platform (3) is installed on the front side of the outer wall of the second movable assembly, a buckle (23) is installed on the upper side of the outer wall of the fixed platform (3), and an interface (22) is installed on the upper side of the outer wall of the buckle (23).

5. The testing device for a semiconductor chip handling robot arm set according to claim 4, characterized in that: A vibration component (4) is installed on the lower side of the outer wall of the fixing platform (3), and the vibration component (4) is connected to the controller (2) via a signal line; The vibration component (4) comprises: a spring (24), a connector (25), a vibration table (26) and a buffer pad (27); the connector (25) and the vibration table (26) are connected to the controller (2) via a signal line; A buffer pad (27) is installed on the lower side of the outer wall of the fixed platform (3), a vibration platform (26) is installed on the lower side of the outer wall of the buffer pad (27), a spring (24) is installed on the lower side of the outer wall of the vibration platform (26), and a connector (25) is installed in the middle of the outer wall of the vibration platform (26).

6. The testing device for a semiconductor chip handling robot arm set according to claim 1, characterized in that: A loading unit is installed in the middle of the inner wall of the storage box (8), and the loading unit comprises: a push rod (28), a slide groove (29), an opening and closing valve (30) and a counter (31); the push rod (28) is connected to the grabbing motor (11) via a connecting shaft, and the opening and closing valve (30) and the counter (31) are connected to the controller (2) via a signal line; A push rod (28) is installed at the middle of the inner wall of the test platform (1), a slide groove (29) is installed at the front side of the outer wall of the push rod (28), an opening and closing valve (30) is installed at the front side of the outer wall of the slide groove (29), and a counter (31) is installed at the rear side of the outer wall of the opening and closing valve (30).

7. The testing device for a semiconductor chip handling robot arm set according to claim 1, characterized in that: The first moving assembly comprises: a first slide rail (32), a first pulley (33), a first fixture (34), a storage platform (6) and a tension sensor (35); the first pulley (33) is connected to the grabbing motor (11) via a connecting shaft; the first fixture (34) and the tension sensor (35) are connected to the controller (2) via a signal line; A first slide rail (32) is installed on the upper side of the outer wall of the storage box (8), a first pulley (33) is installed on the upper side of the outer wall of the first slide rail (32), a storage platform (6) is installed on the upper side of the outer wall of the first pulley (33), a first fixer (34) is installed on the upper side of the outer wall of the storage platform (6), and a tension sensor (35) is installed on the lower side of the outer wall of the storage platform (6).

8. The testing device for a semiconductor chip handling robot arm set according to claim 3, characterized in that: An opening and closing unit is arranged inside the adaptation box (5), and the opening and closing unit comprises: an infrared sensor (36), a guide rail (37), a telescopic shaft (38) and a positioning member (39); the infrared sensor (36) is connected to the controller (2) via a signal line, and the telescopic shaft (38) is connected to the grabbing motor (11) via a connecting shaft; A guide rail (37) is installed at the lower part of the inner wall of the adaptation box (5), a telescopic shaft (38) is installed on the upper side of the outer wall of the guide rail (37), an infrared sensor (36) is installed on the left side of the outer wall of the adaptation box (5), and a positioning piece (39) is installed on the lower side of the outer wall of the adaptation box (5).

9. The testing device for a semiconductor chip handling robot arm set according to claim 3, characterized in that: The electromagnetic unit (7) comprises: an electromagnetic generator (40) and an electromagnetic inductor (41), wherein the electromagnetic generator (40) and the electromagnetic inductor (41) are connected to the controller (2) via a signal line; An electromagnetic inductor (41) is installed on the upper side of the outer wall of the adaptation box (5), and an electromagnetic generator (40) is installed in the middle of the outer wall of the electromagnetic inductor (41).

10. The testing device for the semiconductor chip handling robot arm set according to claim 4, characterized in that: The second moving assembly comprises: a second slide rail (42), a second pulley (43), a second fixer (44) and a positioner (45); the positioner (45) is connected to the second fixer (44) via a signal line, and the second pulley (43) is connected to the grabbing motor (11) via a connecting shaft; A second slide rail (42) is installed on the lower side of the outer wall of the fixed module, a second pulley (43) is installed on the upper side of the outer wall of the second slide rail (42), a second fixer (44) is installed on the upper side of the outer wall of the second slide rail (42), and a positioner (45) is installed on the rear side of the outer wall of the fixed platform (3).

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