Metal material surface plating device

Abstract

The invention belongs to the technical field of plating devices, and discloses a metal material surface plating device which comprises an electroplating pool with an anode plate and a pump body, a flow equalizing cylinder is fixed in the electroplating pool, an upper mounting cavity and a lower mounting cavity are formed in the flow equalizing cylinder, one end of the pump body communicates with the space, close to the anode plate, in the electroplating pool, and the other end of the pump body communicates with the electroplating pool. The other end of the pump body is communicated with the lower mounting cavity, a base is rotationally arranged in the upper mounting cavity, a storage rack is fixed to the base, at least two storage rollers are arranged on the storage rack, a rotating shaft with blades is rotationally arranged in the lower mounting cavity, and an upper cavity and a lower cavity are formed in the rotating shaft through a fixed partition plate; a supporting spring and a piston rod located above the supporting spring are movably arranged in the upper cavity, the piston rod is fixed to the base, an outer punching hole is formed in the piston rod, a telescopic pipe is fixed between the piston rod and the partition plate, and an inner punching pipe communicated with the outer punching hole is fixed to the storage rack. According to the air bubble removing device, air bubbles can be removed, and the annular metal material can be subjected to comprehensive electroplating.

Description

Technical Field

[0001] The invention belongs to the technical field of plating devices, and in particular relates to a metal material surface plating device. Background Art

[0002] After the annular metal material is processed, it is necessary to electroplate the surface of the metal material through a plating device to further improve the performance of the metal material. However, since there may be concave and convex areas on the surface of the annular metal material, bubbles may be attached to the surface of the annular metal material after the annular metal material enters the electroplating solution. The presence of bubbles will reduce the electroplating quality of the annular metal material, and generally a fixed-point support method is used to support the annular metal material. Due to the existence of the support point, the electroplating of the annular metal material cannot be fully realized. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a metal material surface plating device, which effectively solves the problem that after the annular metal material enters the electroplating solution, there may be bubbles attached to the surface of the annular metal material, and the presence of bubbles will reduce the electroplating quality of the annular metal material. In addition, the annular metal material is generally supported by a fixed point support method. Due to the existence of the support point, the electroplating of the annular metal material cannot be fully realized.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a metal material surface plating device comprises an electroplating cell with an anode plate and a pump body, a flow equalizing cylinder is fixed in the electroplating cell, an upper mounting cavity and a lower mounting cavity are formed in the flow equalizing cylinder, one end of the pump body is connected with the space near the anode plate in the electroplating cell, and the other end of the pump body is connected with the lower mounting cavity, a base is rotatably provided in the upper mounting cavity, a storage rack is fixed on the base, at least two storage rollers are provided on the storage rack, a rotating shaft with blades is rotatably provided in the lower mounting cavity, an upper chamber and a lower chamber are formed by a fixed partition in the rotating shaft, a supporting spring and a piston rod located above the supporting spring are movably provided in the upper chamber, the piston rod is fixed to the base, an outer punching hole is formed in the piston rod, a telescopic tube is fixed between the piston rod and the partition, an inner punching tube connected with the outer punching hole is fixed on the storage rack, the lower mounting cavity is connected with the outer punching hole through a side through hole, a lower chamber, and a telescopic tube, and an inner pressure relief valve is fixed in the outer punching hole and the inner punching tube; the outer punching hole faces the outside of the metal material, and the inner punching tube faces the inside of the metal material.

[0005] Preferably, the storage rack is provided with a power mechanism for controlling the horizontal displacement of the two storage rollers; the power mechanism includes an electric push rod, a pull rope, a mounting plate, a pulley frame and a reset spring, the electric push rod is fixed to the top of the storage rack and its output end is fixed to the mounting plate through a pull rope, the two storage rollers are both rotated on the shaft rod provided on the mounting plate and slidingly cooperate with the two roller holes on the storage rack, the pulley frame is fixed to the middle of the storage rack and the pulley thereon cooperates with the pull rope, and the reset spring surrounds the outside of the pull rope between the mounting plate and the pulley frame.

[0006] Preferably, the edge of the flow equalizing cylinder forms an annular side cavity, the side cavity is connected to the lower mounting cavity, and an external pressure relief valve is fixed at the connection point between the two, and the side cavity is connected to the upper mounting cavity through multiple connecting holes thereon.

[0007] Preferably, an annular cavity is also formed in the flow equalizing cylinder, in which an annular upper piston plate and a lower air permeable membrane are slidably provided respectively, and an annular frame is rotatably provided on the base, and the annular frame is connected to the upper piston plate through multiple connecting mechanisms; the annular cavity is formed from top to bottom into an upper cavity, a middle cavity and a lower cavity through the upper piston plate and the lower air permeable membrane, the upper cavity is connected to the electroplating pool, the middle cavity is connected to the outside through an exhaust pipe with a one-way valve, one side of the lower cavity is connected to the pump body, and the other side of the lower cavity is connected to the lower mounting cavity through the nozzle thereon.

[0008] Preferably, the connecting mechanism includes a guide wheel frame, a rope body, a connecting rod and a telescopic spring. The guide wheel frame is fixed to the bottom wall of the upper mounting cavity. The annular frame is fixed to the upper piston plate through the rope body and the connecting rod. The connecting rod is slidingly sealed with the rod hole on the upper mounting cavity. The telescopic spring surrounds the outside of the connecting rod and is located in the upper cavity.

[0009] Preferably, a plurality of vertical holes are opened in the top wall of the upper cavity, and the lower mounting cavity is connected with the electroplating pool in sequence through the external pressure relief valve, the upper cavity, the vertical holes, the side cavity, the connecting holes, and the upper mounting cavity.

[0010] Preferably, an extension plate is fixed in the lower cavity, and a vortex channel with a vortex line trajectory is formed in the lower cavity through the extension plate.

[0011] Preferably, two connecting mechanisms are provided, and the two connecting mechanisms are symmetrically distributed with the axis of the flow balancing cylinder as the center.

[0012] Preferably, the current equalizing cylinder is fixed to the electroplating cell via a plurality of brackets.

[0013] Preferably, a frame is fixed on the electroplating cell, at least two hangers are fixed on the frame, and anode plates are detachably mounted on the two hangers.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. During operation, through the cooperation of the pump body, blades, outer punching holes and inner punching tube, the outer punching holes can be used to remove the bubbles that may exist on the outer side of the annular metal material, and on the other hand, the annular metal material can be rolled along the two placing rollers. In the rolling process, it is not only beneficial to separate the bubbles from the annular metal material, but also the contact points between the two placing rollers and the annular metal material can be continuously changed, so that the annular metal material can be fully electroplated to ensure the quality of the electroplating; and in combination with the horizontal rotation of the base, the uniform contact between the annular metal material and the electroplating solution can be further improved.

[0016] 2. During operation, through the power mechanism, the placing roller can be moved to a suitable position according to actual needs during the hoisting process to ensure the effective hoisting space in the flow equalizing cylinder and facilitate the hoisting.

[0017] 3. During operation, the blades, side cavities and connecting holes are used to disturb the electroplating solution. The side cavities and connecting holes are used to make the metal ions in the electroplating solution more evenly distributed.

[0018] 4. During operation, through the cooperation of the connection mechanism, the lower breathable membrane, etc., the self-weight of the annular metal material can be used as a driving force to form a negative pressure environment in the middle cavity, so as to separate the bubbles that may exist in the electroplating solution, thereby improving the quality of electroplating.

[0019] 5. During operation, the eddy current channel is set up to effectively extend the flow trajectory of the electroplating solution, thereby increasing the processing time of bubbles and improving the bubble removal effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0021] In the attached picture:

[0022] Figure 1 It is a schematic structural diagram of a metal material surface plating device of the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of the electroplating pool of the present invention;

[0024] Figure 3 This is one of the schematic diagrams of the flow equalizing tube structure of the present invention;

[0025] Figure 4 This is the second schematic diagram of the flow equalizing tube structure of the present invention;

[0026] Figure 5 This is the third schematic diagram of the flow equalizing tube structure of the present invention;

[0027] Figure 6 This is one of the schematic diagrams of the power mechanism structure of the present invention;

[0028] Figure 7 This is the second schematic diagram of the power mechanism structure of the present invention;

[0029] Figure 8 For the present invention Figure 5 The enlarged structural diagram at A in the middle;

[0030] Fig. 9 For the present invention Figure 5 The enlarged structural diagram at B in the middle;

[0031] Fig.10 It is a schematic diagram of the metal material to be electroplated according to the present invention.

[0032] In the figure: 1, electroplating tank; 2, anode plate; 3, pump body; 4, flow equalizing cylinder; 5, upper mounting chamber; 6, lower mounting chamber; 7, base; 8, rack; 9, rack roller; 10, rotating shaft; 11, blade; 12, partition; 13, upper chamber; 14, lower chamber; 15, support spring; 16, piston rod; 17, outer punching hole; 18, inner punching pipe; 19, side through hole; 20, inner pressure relief valve; 21, electric push rod; 22, pull rope; 23, mounting plate; 24, pulley frame; 2 5. Return spring; 26. Side cavity; 27. External pressure relief valve; 28. Connecting hole; 29. ​​Annular cavity; 30. Upper piston plate; 31. Lower breathable membrane; 32. Annular frame; 33. Upper cavity; 34. Middle cavity; 35. Lower cavity; 36. One-way valve; 37. Exhaust pipe; 38. Nozzle; 39. Guide wheel frame; 40. Rope body; 41. Connecting rod; 42. Telescopic spring; 43. Vertical hole; 44. Extension plate; 45. Eddy current channel; 46. Frame; 47. Hanger. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0034] Depend on Figure 1-Figure 10The present invention relates to a metal material surface plating device, comprising an electroplating cell 1 with an anode plate 2 and a pump body 3, a frame 46 is fixed on the electroplating cell 1, at least two hangers 47 are fixed on the frame 46, the anode plate 2 is detachably provided on the two hangers 47, a flow equalizing cylinder 4 is fixed in the electroplating cell 1, the flow equalizing cylinder 4 is fixed to the electroplating cell 1 by a plurality of brackets, an upper mounting cavity 5 and a lower mounting cavity 6 are formed in the flow equalizing cylinder 4, one end of the pump body 3 is connected to the space near the anode plate 2 in the electroplating cell 1, and the other end of the pump body 3 is connected to the lower mounting cavity 6, a base 7 is rotatably provided in the upper mounting cavity 5, a storage rack 8 is fixed on the base 7, and at least two storage rollers 9 are provided on the storage rack 8.

[0035] With such a design, when in use, the annular metal material is hoisted onto the two placing rollers 9 on the placing rack 8, and the annular metal material is supported by the two placing rollers 9 to achieve the installation of the annular metal material; when the annular metal material needs to be electroplated, the anode plate 2 in the electroplating cell 1 and the two placing rollers 9 are respectively connected to the positive and negative poles of the external power supply, so as to carry out electroplating, and the plating liquid near the anode plate 2 is transported to the vicinity of the annular metal material through the pump body 3, so as to accelerate the fluidity of the plating liquid and replenish it in time to the vicinity of the annular metal material, so as to ensure the electroplating quality of the annular metal material.

[0036] Since there may be concave and convex areas on the surface of the annular metal material, bubbles may be attached to the surface of the annular metal material after the annular metal material enters the electroplating solution. The presence of bubbles will reduce the electroplating quality of the annular metal material, and the annular metal material is generally supported by a fixed-point support method. Due to the existence of the support points, the electroplating of the annular metal material cannot be fully realized. The following technical solution is now provided to solve the problem.

[0037] A rotating shaft 10 with blades 11 is rotatably provided in the lower mounting chamber 6, an upper chamber 13 and a lower chamber 14 are formed in the rotating shaft 10 by a fixed partition 12, a supporting spring 15 and a piston rod 16 located above the supporting spring 15 are movably provided in the upper chamber 13, the piston rod 16 is fixed to the base 7, an outer punching hole 17 is formed in the piston rod 16, a telescopic tube is fixed between the piston rod 16 and the partition 12, an inner punching tube 18 connected with the outer punching hole 17 is fixed on the storage rack 8, the lower mounting chamber 6 is connected with the outer punching hole 17 through a side through hole 19, the lower chamber 14, and the telescopic tube, an inner pressure relief valve 20 is fixed in both the outer punching hole 17 and the inner punching tube 18; the outer punching hole 17 faces the outside of the metal material, and the inner punching tube 18 faces the inside of the metal material.

[0038] With this design, under the action of the pump body 3, the plating liquid enters the lower mounting chamber 6 and impacts the blades 11 on the rotating shaft 10, so that the rotating shaft 10 drives the piston rod 16 to rotate through the upper chamber 13 therein. The piston rod 16 can only move vertically relatively in the upper chamber 13 but cannot rotate relatively. The piston rod 16 drives the annular metal material to rotate horizontally through the base 7, the storage rack 8, and the two storage rollers 9 in turn. At the same time, the plating liquid in the lower mounting chamber 6 enters the outer punching hole 17 through the side through hole 19, the lower chamber 14, and the telescopic tube in turn. Part of the liquid enters the inner punching tube 18 from the outer punching hole 17 and reaches the threshold value of the corresponding internal pressure relief valve 20. When the electroplating liquid in the outer punching hole 17 is discharged, it impacts the annular metal material. On the one hand, it removes the bubbles that may exist on the outside of the annular metal material, and on the other hand, it can make the annular metal material roll along the two placing rollers 9. During the rolling process, it is not only beneficial to separate the bubbles from the annular metal material, but also can make the contact points between the two placing rollers 9 and the annular metal material constantly change, so that the annular metal material can be fully electroplated to ensure the quality of electroplating; and due to the rolling of the annular metal material, in conjunction with the horizontal rotation of the base 7, the uniform contact between the annular metal material and the electroplating liquid can be further improved.

[0039] Considering that the space in the flow-balancing cylinder 4 is limited and it is not suitable for displacement in a larger space, in order to facilitate the lifting of the annular metal material, a power mechanism for controlling the horizontal displacement of the two placement rollers 9 is provided on the storage rack 8; the power mechanism includes an electric push rod 21, a pull rope 22, a mounting plate 23, a pulley frame 24 and a reset spring 25. The electric push rod 21 is fixed to the top of the storage rack 8 and its output end is fixed to the mounting plate 23 through the pull rope 22. The two placement rollers 9 are both rotated on the shaft rod on the mounting plate 23 and slidably matched with the two roller holes on the storage rack 8. The pulley frame 24 is fixed to the middle of the storage rack 8 and the pulley thereon cooperates with the pull rope 22. The reset spring 25 surrounds the outside of the pull rope 22 between the mounting plate 23 and the pulley frame 24.

[0040] With this design, before hoisting, the pull rope 22 is driven to move by the electric push rod 21 with its own power supply, and the pull rope 22 drives the two placement rollers 9 to move through the mounting plate 23, so that the two placement rollers 9 move in the direction close to the pulley frame 24 to a suitable distance and then stop moving, thereby ensuring the effective hoisting space in the flow equalizing cylinder 4, and then the annular metal material can be hoisted into the interior of the flow equalizing cylinder 4 by external hoisting equipment, and then the electric push rod 21 is moved in the opposite direction to relax the pull rope 22, and under the action of the reset spring 25, the mounting plate 23 drives the two placement rollers 9 thereon to move in the direction away from the pulley frame 24 and placed on the inner side of the annular metal material, and then the annular metal material can be supported by the two placement rollers 9, and then the connection between the hoisting equipment and the annular metal material can be released.

[0041] It should be noted that the mounting plate 23 and the two placing rollers 9 are made of conductive materials, such as stainless steel, copper, etc., so as to conduct electricity with the annular metal material. The mounting plate 23 can be connected to an external power source through a wire with a switch.

[0042] In order to further improve the uniformity of the distribution of the electroplating liquid, an annular side cavity 26 is formed on the edge of the flow equalizing cylinder 4. The side cavity 26 is connected to the lower mounting cavity 6 and an external pressure relief valve 27 is fixed at the connection between the two. The side cavity 26 is connected to the upper mounting cavity 5 through multiple connecting holes 28 thereon.

[0043] With this design, when the pressure in the lower mounting cavity 6 reaches the threshold of the external pressure relief valve 27, which is the same as the threshold of the internal pressure relief valve 20, the electroplating liquid in the lower mounting cavity 6 can enter the interior of the side cavity 26 through the external pressure relief valve 27, and then be discharged to the interior of the upper mounting cavity 5 through multiple connecting holes 28, thereby further improving the distribution uniformity of the electroplating liquid and improving the electroplating quality.

[0044] Taking into account the existence of bubbles inside the electroplating liquid, in order to further remove the bubbles in the electroplating liquid, an annular cavity 29 is further formed in the flow equalizing cylinder 4, in which an annular upper piston plate 30 and a lower air permeable membrane 31 are respectively slidably provided, and an annular frame 32 is rotatably provided on the base 7, and the annular frame 32 is connected to the upper piston plate 30 through multiple connecting mechanisms; the annular cavity 29 is formed from top to bottom by the upper piston plate 30 and the lower air permeable membrane 31 to form an upper cavity 33, a middle cavity 34 and a lower cavity 35, the upper cavity 33 is connected to the electroplating pool 1, the middle cavity 34 is connected to the outside through an exhaust pipe 37 with a one-way valve 36, one side of the lower cavity 35 is connected to the pump body 3, and the other side of the lower cavity 35 is connected to the lower mounting cavity 6 through the nozzle 38 thereon.

[0045] With this design, when the annular metal material is mounted on the two placing rollers 9, its own gravity acts on the upper piston plate 30 through the placing rack 8, the base 7, the annular rack 32, and multiple connecting mechanisms in sequence, and the direction of the force is changed by the connecting mechanism, so that the upper piston plate 30 moves upward. Due to the setting of the one-way valve 36 in the exhaust pipe 37, the outside air cannot enter the middle cavity 34, so that a negative pressure environment is formed in the middle cavity 34. When the electroplating liquid passes through the lower cavity 35 and the nozzle 38 and enters the lower installation cavity 6 under the action of the pump body 3, the lower The electroplating liquid in the cavity 35 is under the negative pressure environment of the lower air permeable membrane 31 and the middle cavity 34, so that the bubbles in the electroplating liquid pass through the lower air permeable membrane 31 and enter the interior of the middle cavity 34. After the electroplating is completed, the two placing rollers 9 no longer support the annular metal material. At this time, under the action of the supporting spring 15 and the telescopic spring 42 in the connecting mechanism, the base 7 is displaced upward and the upper piston plate 30 is displaced downward, so that the air in the middle cavity 34 is discharged to the outside through the one-way valve 36 on the exhaust pipe 37, so as to remove the bubbles in the electroplating liquid by circulation.

[0046] Specifically, two connecting mechanisms are provided, and the two connecting mechanisms are symmetrically distributed around the axis of the flow equalizing cylinder 4; the connecting mechanism includes a guide wheel frame 39, a rope body 40, a connecting rod 41 and a telescopic spring 42, the guide wheel frame 39 is fixed to the bottom wall of the upper mounting cavity 5, the annular frame 32 is fixed to the upper piston plate 30 through the rope body 40 and the connecting rod 41, the connecting rod 41 is slidably sealed with the rod hole on the upper mounting cavity 5, and the telescopic spring 42 surrounds the outside of the connecting rod 41 and is located in the upper cavity 33.

[0047] With such a design, the guide wheel on the guide wheel frame 39 is located above the base 7, so that the direction of the force can be changed through the cooperation of the rope body 40 and the guide wheel, so that the base 7 drives the upper piston plate 30 to move through the annular frame 32, the rope body 40, and the connecting rod 41 in turn.

[0048] Specifically, a plurality of vertical holes 43 are formed in the inner top wall of the upper cavity 33, and the lower mounting cavity 6 is connected to the electroplating pool 1 via the external pressure relief valve 27, the upper cavity 33, the vertical hole 43, the side cavity 26, the connecting hole 28, and the upper mounting cavity 5 in sequence.

[0049] Furthermore, in order to increase the residence time of the plating solution in the lower cavity 35 and thus increase the time for removing bubbles, an extension plate 44 is fixed in the lower cavity 35 , and a vortex channel 45 with a vortex line trajectory is formed in the lower cavity 35 through the extension plate 44 .

[0050] With such a design, the flow trajectory of the electroplating solution can be effectively extended through the vortex channel 45, thereby increasing the processing time for bubbles and improving the bubble removal effect.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A metal material surface plating device, comprising an electroplating cell having an anode plate and a pump body, characterized in that: A flow equalizing cylinder is fixed in the electroplating pool, and an upper mounting cavity and a lower mounting cavity are formed in the flow equalizing cylinder. One end of the pump body is connected to the space near the anode plate in the electroplating pool, and the other end of the pump body is connected to the lower mounting cavity. A base is rotatably provided in the upper mounting cavity, and a storage rack is fixed on the base. At least two storage rollers are provided on the storage rack. A rotating shaft with blades is rotatably provided in the lower mounting cavity, and an upper chamber and a lower chamber are formed by a fixed partition in the rotating shaft. A support spring and a piston rod located above the support spring are movably provided in the upper chamber, and the piston rod is fixed to the base. An outer punching hole is formed in the piston rod, and a telescopic tube is fixed between the piston rod and the partition. An inner punching tube connected to the outer punching hole is fixed on the storage rack, and the lower mounting cavity is connected to the outer punching hole through a side through hole, a lower chamber, and a telescopic tube. Internal pressure relief valves are fixed in the outer punching hole and the inner punching tube; the outer punching hole faces the outside of the metal material, and the inner punching tube faces the inside of the metal material.

2. A metal material surface plating device according to claim 1, characterized in that: The storage rack is provided with a power mechanism for controlling the horizontal displacement of the two storage rollers; the power mechanism includes an electric push rod, a pull rope, a mounting plate, a pulley frame and a reset spring, the electric push rod is fixed to the top of the storage rack and its output end is fixed to the mounting plate through a pull rope, the two storage rollers are both rotated on the shaft rod arranged on the mounting plate and slidably matched with the two roller holes on the storage rack, the pulley frame is fixed to the middle of the storage rack and the pulley thereon is matched with the pull rope, and the reset spring is surrounded on the outside of the pull rope between the mounting plate and the pulley frame.

3. A metal material surface plating device according to claim 1, characterized in that: The edge of the flow equalizing cylinder forms an annular side cavity, which is connected to the lower installation cavity and an external pressure relief valve is fixed at the connection point between the two. The side cavity is connected to the upper installation cavity through multiple communication holes thereon.

4. A metal material surface plating device according to claim 3, characterized in that: An annular cavity is also formed in the flow equalizing cylinder, in which an annular upper piston plate and a lower air permeable membrane are slidably provided respectively, an annular frame is rotatably provided on the base, and the annular frame is connected to the upper piston plate through multiple connecting mechanisms; the annular cavity is formed from top to bottom into an upper cavity, a middle cavity and a lower cavity through the upper piston plate and the lower air permeable membrane, the upper cavity is connected to the electroplating pool, the middle cavity is connected to the outside through an exhaust pipe with a one-way valve, one side of the lower cavity is connected to the pump body, and the other side of the lower cavity is connected to the lower installation cavity through the nozzle thereon.

5. A metal material surface plating device according to claim 4, characterized in that: The connecting mechanism includes a guide wheel frame, a rope body, a connecting rod and a telescopic spring. The guide wheel frame is fixed to the bottom wall of the upper mounting cavity. The annular frame is fixed to the upper piston plate through the rope body and the connecting rod. The connecting rod is slidingly sealed with the rod hole on the upper mounting cavity. The telescopic spring surrounds the outside of the connecting rod and is located in the upper cavity.

6. A metal material surface plating device according to claim 4, characterized in that: The top wall of the upper cavity is provided with a plurality of vertical holes, and the lower mounting cavity is connected with the electroplating pool through the external pressure relief valve, the upper cavity, the vertical holes, the side cavity, the connecting holes and the upper mounting cavity in sequence.

7. A metal material surface plating device according to claim 4, characterized in that: An extension plate is fixed in the lower cavity, and a vortex channel with a vortex line trajectory is formed in the lower cavity through the extension plate.

8. A metal material surface coating device according to claim 5, characterized in that: There are two connecting mechanisms, which are symmetrically distributed around the axis of the flow balancing cylinder.

9. A metal material surface plating device according to claim 1, characterized in that: The current equalizing cylinder is fixed to the electroplating tank via a plurality of brackets.

10. A metal material surface plating device according to claim 1, characterized in that: A frame is fixed on the electroplating pool, and at least two hangers are fixed on the frame. Anode plates are detachably mounted on the two hangers.

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