Sensor module and electronic device

Abstract

The invention provides a sensor module and an electronic device. The sensor module includes: a first substrate; a second substrate; a connection portion electrically connecting the first substrate and the second substrate; a first sensor device which is provided on the first substrate and detects a physical quantity of a first axis; a second sensor device which is provided on the first substrate, detects a physical quantity of the first axis, and has a driving frequency different from that of the first sensor device; a third sensor device which is provided on the second substrate and detects a physical quantity of a second axis; and a fourth sensor device that is provided on the second substrate and detects a physical quantity of the second axis.

Description

Technical Field

[0001] The invention relates to a sensor module and an electronic device. Background Art

[0002] Patent Document 1 describes a sensor module in which two X-axis angular velocity sensor devices are mounted on the side surfaces of the same substrate, thereby achieving high accuracy of X-axis angular velocity data.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-163955

[0004] In a sensor module including a plurality of sensor devices for one detection axis, further improvements are expected in terms of effectiveness and reliability of achieving higher precision. Summary of the invention

[0005] A sensor module involved in one embodiment of the present application comprises: a first substrate; a second substrate; a connecting portion electrically connecting the first substrate and the second substrate; a first sensor device, arranged on the first substrate, detecting the physical quantity of the first axis; a second sensor device, arranged on the first substrate, detecting the physical quantity of the first axis, and having a driving frequency different from that of the first sensor device; a third sensor device, arranged on the second substrate, detecting the physical quantity of the second axis; and a fourth sensor device, arranged on the second substrate, detecting the physical quantity of the second axis, and having a driving frequency different from that of the third sensor device.

[0006] A sensor module involved in one embodiment of the present application comprises: a first substrate; a second substrate; a third substrate; a first connecting portion electrically connecting the first substrate and the second substrate; a second connecting portion electrically connecting the first substrate and the third substrate; a first sensor device, arranged on the first substrate, detecting the physical quantity of the first axis; a second sensor device, arranged on the first substrate, detecting the physical quantity of the first axis, and having a driving frequency different from that of the first sensor device; a third sensor device, arranged on the second substrate, detecting the physical quantity of the second axis; a fourth sensor device, arranged on the second substrate, detecting the physical quantity of the second axis, and having a driving frequency different from that of the third sensor device; a fifth sensor device, arranged on the third substrate, detecting the physical quantity of the third axis; and a sixth sensor device, arranged on the third substrate, detecting the physical quantity of the third axis, and having a driving frequency different from that of the fifth sensor device.

[0007] An electronic device according to one aspect of the present application includes the sensor module described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1This is a perspective view showing a state where the sensor module according to Embodiment 1 is fixed to a mounting surface.

[0009] Figure 2 The figure shows the view from the mounting surface side. Figure 1 A three-dimensional diagram of the state of the sensor module.

[0010] Figure 3 This is an exploded perspective view of the sensor module.

[0011] Figure 4 This is an expanded view of the base unit.

[0012] Figure 5 This is an expanded view of the base unit.

[0013] Figure 6 It is a stereogram of a fixed frame.

[0014] Fig. 7A It is along Figure 4 Cross-sectional view of line AA.

[0015] Figure 7B It is along Figure 4 Cross-sectional view of line AA.

[0016] Figure 8 This is a diagram of the structure of the sensor device.

[0017] Fig. 9 This is a perspective view showing an example of an electronic device according to Embodiment 2.

[0018] Fig.10 This is a perspective view showing another example of the electronic device according to the second embodiment.

[0019] Description of Reference Numerals

[0020] 1... vibrator, 2... supporting substrate, 3... sensor element, 3a, 3b... sensor element, 4... circuit element, 5... base, 6... cover, 7... package, 8a... internal terminal, 8b... internal terminal, 8c... external terminal, 9... bonding wire, 10... sensor unit, 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c c, 13d, 13e, 13f...sensor device, 14...calculation circuit, 15...connector, 16...memory, 17...power supply circuit, 18...temperature sensor, 20...substrate unit, 21, 22, 23, 24, 25, 26...substrate, 30...inner case, 31...opening, 32...side wall, 33...recess, 34...upper surface, 40...connection portion, 41, 42, 43, 44, 45...flexible substrate, 50 ...housing, 52...screw hole, 53...inside, 54...side wall, 55...bottom surface, 57...upper surface, 58...lower surface, 60...fixing frame, 61...upper surface, 62, 63, 64, 65...side surface, 66...lower surface, 68...opening, 70...screw, 71...mounting surface, 81...driving circuit, 82...detection circuit, 91...base, 92a, 92b...connecting arms, 93, 94... driving electrode, 95, 96...detecting electrode, 97...ground electrode, 98a, 98b, 98c, 98d...driving arm, 99a, 99b...detecting arm, 100...sensor module, 110...smartphone, 111...control unit, 130...car, 131...vehicle body, 132...vehicle body posture control device, 133...wheel, C1, C2, C3...arrows, D1, D2...detection data, S1, S2...detection signal. DETAILED DESCRIPTION

[0021] In order to make each component easier to see, each drawing may show the dimensions of each component at a different scale.

[0022] In each of the drawings, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other.

[0023] In the following description, “X-axis direction” indicates a direction parallel to the X-axis, “Y-axis direction” indicates a direction parallel to the Y-axis, and “Z-axis direction” indicates a direction parallel to the Z-axis.

[0024] In the following description, the “positive side” means the front end side in the arrow direction of each axis of XYZ, and the “negative side” means the rear end side in the arrow direction.

[0025] In the following description, “planar view” means viewing a surface including the X-axis and the Y-axis from the Z-axis direction.

[0026] In the following description, the description of the upper surface of a certain structure refers to the surface of the structure on the positive side in the Z-axis direction. For example, the "upper surface of the substrate" refers to the surface of the substrate on the positive side in the Z-axis direction.

[0027] In the following description, the description “the lower surface of a certain structure” means the surface of the structure on the negative side in the Z-axis direction.

[0028] In the following description, the description of the left side surface of a certain structure means the surface on the negative side in the X-axis direction of the structure.

[0029] In the following description, the description of the right side surface of a certain structure means the surface of the structure on the positive side in the X-axis direction.

[0030] 1. Implementation Method 1

[0031] Figures 1 to 8 A sensor module 100 according to Embodiment 1 is shown.

[0032] Figure 1 It is a perspective view showing a state where the sensor module 100 is fixed to a mounting surface 71 of a car or the like. Figure 2 It is observed from the mounting surface 71 side. Figure 1 A stereoscopic diagram of a state of the sensor module 100 . Figure 3 is an exploded perspective view of the sensor module 100 . Figure 4 It is a development view of the substrate unit 20 . Figure 5 It is a development view of the substrate unit 20 . Figure 6 It is a perspective view of the fixing frame 60 . Fig. 7A It is along Figure 4 The cross-sectional view taken along line AA of FIG. 1 shows an example of the sensor device 11 e . Figure 7B It is along Figure 4 A cross-sectional view taken along line AA of FIG. 1 shows another example of the sensor device 11 e . Figure 8 It is an explanatory diagram showing the internal structure of the sensor device.

[0033] In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the posture and movement of the mounted device such as a car or a robot. Here, the mounted device can be referred to as a moving body. The movement can be referred to as inertial motion. The example mainly uses the case where the physical quantity detected by the sensor module 100 is angular velocity or acceleration as an example, but the physical quantity is not limited to angular velocity or acceleration, and can also be other physical quantities such as velocity, pressure, displacement, posture, angle or gravity.

[0034] like Figure 1 As shown, the sensor module 100 has a housing 50 that is substantially square in plan view and rectangular in three-dimensional view. The dimensions of the sensor module 100 are, for example, a length of one side of the square of approximately 24 mm and a thickness of approximately 10 mm.

[0035] The substrate unit 20 on which a plurality of sensor devices are mounted is accommodated in the housing 50. The substrate unit 20 will be described later.

[0036] Screw holes 52 are formed in the lower surface 58 of the housing 50. By inserting screws 70 through the two screw holes 52, the sensor module 100 is fixed to a mounting surface 71 of a mounting device such as an automobile for use.

[0037] like Figure 2 As shown, the inner housing 30 is housed inside the upper surface 53 of the outer housing 50. An opening 31 is formed on the upper surface 34 of the inner housing 30. Inside the opening 31, the plug-type connector 15 is arranged.

[0038] The connector 15 has a plurality of pins. The connector 15 is connected to a socket-type connector (not shown) from a mounted device. The sensor module 100 is supplied with power from a power supply circuit of the mounted device via the connector 15 and transmits electrical signals such as detection data to the mounted device.

[0039] 1.1. Sensor module configuration

[0040] Figure 3 yes Figure 2 An exploded perspective view of the sensor module 100 is shown.

[0041] like Figure 3 As shown, the sensor module 100 is composed of an outer case 50 and a sensor unit 10 accommodated in the outer case 50 . The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 accommodated in the inner case 30 .

[0042] The housing 50 is a base formed by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resin, or a composite material of metal and resin may be used.

[0043] The housing 50 is in the shape of a box without a cover, and an inner side 53 thereof constitutes an internal space surrounded by a bottom surface 55 and side walls 54 .

[0044] The sensor unit 10 is accommodated in the internal space of the housing 50 via a joint member.

[0045] In the present embodiment, the outer case 50 and / or the inner case 30 is an example of a housing.

[0046] The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 .

[0047] The inner shell 30 is a component for holding the substrate unit 20, and is shaped to be housed inside the inner side 53 of the outer shell 50. In a plan view, the inner shell 30 is an octagon formed by chamfering the corners of the four vertices of a square, and has an opening 31 as a through hole formed on its upper surface and a recess 33 formed inside.

[0048] The height of the side wall 32 of the inner shell 30 is lower than the height of the side wall 54 of the outer shell 50. Figure 2 As shown, the upper surface 34 of the inner case 30 is lower than the upper surface 57 of the outer case 50. Although not shown, guide pins and a support surface for positioning the substrate unit 20 are formed inside the inner case 30.

[0049] The substrate unit 20 is positioned by the guide pins and the support surface, and is fixed to the inner side of the inner case 30 by the joining member.

[0050] 1.2. Structure of the substrate unit

[0051] Figure 4 This is a plan view of the substrate unit 20 in a developed state as viewed from the negative side in the Z-axis direction. Figure 5 This is a plan view of the substrate unit 20 in a developed state as viewed from the positive side in the Z-axis direction.

[0052] like Figure 3 and Figure 6 As shown, the substrate unit 20 is used in an assembled state. In the present embodiment, the substrate unit 20 is supported by the fixing frame 60 and assembled into a substantially rectangular parallelepiped shape.

[0053] like Figure 4 and Figure 5As shown, in this embodiment, the substrate unit 20 includes: substrates 21, 22, 23, 24, 25, 26; flexible substrates 41, 42, 43, 44, 45; and sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f, an operation circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0054] The substrates 21, 22, 23, 24, 25, and 26 are hard substrates called rigid substrates, and are specifically glass epoxy substrates. The substrates 21, 22, 23, 24, 25, and 26 may also be rigid substrates such as composite substrates and ceramic substrates. The substrates 21, 22, 23, 24, 25, and 26 may also be multi-layer or single-layer structures.

[0055] The flexible substrates 41, 42, 43, 44, 45 are softer than the substrates 21, 22, 23, 24, 25, 26. The flexible substrates 41, 42, 43, 44, 45 may be flexible wiring cables, wiring wires, or wires such as flat cables and flat wires. The flexible substrates 41, 42, 43, 44, 45 may also include connectors, solder, conductive adhesives, or crimping terminals.

[0056] In this embodiment, the flexible substrate 41 is an example of the connection portion 40 and the first connection portion, the flexible substrate 42 is an example of the second connection portion, the flexible substrate 43 is an example of the third connection portion, and the flexible substrate 44 is an example of the fourth connection portion.

[0057] Flexible substrate 41 electrically connects substrate 21 and substrate 22. Flexible substrate 42 electrically connects substrate 21 and substrate 23. Flexible substrate 43 electrically connects substrate 21 and substrate 24. Flexible substrate 44 electrically connects substrate 21 and substrate 25. Flexible substrate 45 electrically connects substrate 25 and substrate 26. Substrate 26 is electrically connected to substrate 21 via flexible substrate 45, substrate 25, and flexible substrate 44.

[0058] The substrates 21, 22, 23, 24, 25, 26 and the flexible substrates 41, 42, 43, 44, 45 may be rigid flexible substrates having a plurality of rigid portions and a plurality of flexible portions. In the case of a rigid flexible substrate, the plurality of rigid portions correspond to the substrates 21, 22, 23, 24, 25, 26 of the present embodiment, respectively, and the plurality of flexible portions correspond to the flexible substrates 41, 42, 43, 44, 45 of the present embodiment, respectively.

[0059] Sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f are angular velocity sensors, respectively. Specifically, they are vibration gyro sensors that use crystal as a vibrator and detect angular velocity based on the Coriolis force applied to the vibrator. The vibrator is not limited to crystal. For example, the vibrator may also be a MEMS (Micro Electro Mechanical Systems) vibrator formed using a silicon substrate.

[0060] like Figure 4 As shown, the sensor devices 11a, 11b, and 11c are mounted on the lower surface of the substrate 21. The sensor devices 11a, 11b, and 11c are Z-axis angular velocity sensors that detect angular velocity around the Z axis. The driving frequencies of the vibrators of the sensor devices 11a, 11b, and 11c are different from each other. In this embodiment, the driving frequency of the vibrator is an example of the driving frequency of the sensor device. The driving frequency of the vibrator will be described in detail in the 1.4.3. section described later.

[0061] The sensor devices 12a, 12b, and 12c are mounted on the substrate 22. The sensor devices 12a, 12b, and 12c are X-axis angular velocity sensors that detect angular velocity around the X axis. The driving frequencies of the vibrators of the sensor devices 12a, 12b, and 12c are different from each other.

[0062] The sensor devices 13a, 13b, and 13c are mounted on the substrate 23. The sensor devices 13a, 13b, and 13c are Y-axis angular velocity sensors that detect angular velocity around the Y-axis. The driving frequencies of the vibrators of the sensor devices 13a, 13b, and 13c are different from each other.

[0063] The sensor devices 12d, 12e, and 12f are mounted on the substrate 24. The sensor devices 12d, 12e, and 12f are X-axis angular velocity sensors that detect angular velocity around the X axis. The driving frequencies of the vibrators of the sensor devices 12d, 12e, and 12f are different from each other.

[0064] The sensor devices 13d, 13e, and 13f are mounted on the substrate 25. The sensor devices 13d, 13e, and 13f are Y-axis angular velocity sensors that detect angular velocity around the Y-axis. The driving frequencies of the vibrators of the sensor devices 13d, 13e, and 13f are different from each other.

[0065] The sensor devices 11d, 11e, and 11f are mounted on the substrate 26. The sensor devices 11d, 11e, and 11f are Z-axis angular velocity sensors that detect angular velocity around the Z axis. The driving frequencies of the vibrators of the sensor devices 11d, 11e, and 11f are different from each other.

[0066] In this embodiment, the sensor module 100 has six X-axis angular velocity sensors, six Y-axis angular velocity sensors, and six Z-axis angular velocity sensors. Thus, according to the configuration of providing six angular velocity sensors on each axis of XYZ, the operation circuit 14 calculates the average value of the statistic of the angular velocity data based on the angular velocity data from the six angular velocity sensors on each axis of XYZ, thereby achieving high precision of the angular velocity data of each axis.

[0067] The number of angular velocity sensors for each axis is not limited to six. Two or more angular velocity sensors for each axis may be provided, but six angular velocity sensors for each axis can further improve the accuracy of angular velocity data for each axis compared to two angular velocity sensors for each axis.

[0068] The number of angular velocity sensors of each axis may be different. For example, the number of Z-axis angular velocity sensors may be 6, the number of X-axis angular velocity sensors may be 3, and the number of Y-axis angular velocity sensors may be 3.

[0069] In this embodiment, the six X-axis angular velocity sensors, the six Y-axis angular velocity sensors, and the six Z-axis angular velocity sensors are divided into three and mounted on two substrates, respectively. Therefore, according to this embodiment, the limited space in the inner shell 30 can be efficiently and flexibly used to mount the angular velocity sensors of each axis, and the miniaturization of the sensor module 100 can be easily achieved.

[0070] When there are three angular velocity sensors for each axis, they can be divided into one or two and installed on two substrates respectively. Similarly, when there are four angular velocity sensors for each axis, they can be divided into two and installed on two substrates respectively. Similarly, when there are five angular velocity sensors for each axis, they can be divided into two or three and installed on two substrates respectively, or divided into one or four and installed on two substrates respectively. Even when there are seven or more angular velocity sensors for each axis, they can be divided and installed in the same way. Not limited to two substrates, the angular velocity sensors for each axis can also be divided and installed on more than three substrates.

[0071] In this embodiment, the three Z-axis angular velocity sensors mounted on one substrate have different driving frequencies. Therefore, the three Z-axis angular velocity sensors mounted on one substrate are prevented from mechanically and / or electrically interfering with each other. Therefore, the effectiveness of the high-precision angular velocity data around the Z axis can be improved.

[0072] Even when two or four or more Z-axis angular velocity sensors are mounted on one substrate, the plurality of Z-axis angular velocity sensors mounted on one substrate may have respective different driving frequencies.

[0073] The same is true also in the case of three X-axis angular velocity sensors mounted on one substrate and three Y-axis angular velocity sensors mounted on one substrate.

[0074] In this embodiment, the driving frequency of the sensor device 11a of the substrate 21 is the same as the driving frequency of the sensor device 11d of the substrate 26, for example, 49.6 kHz. The driving frequency of the sensor device 11b of the substrate 21 is the same as the driving frequency of the sensor device 11e of the substrate 26, for example, 51.1 kHz. The driving frequency of the sensor device 11c of the substrate 21 is the same as the driving frequency of the sensor device 11f of the substrate 26, for example, 53.6 kHz.

[0075] Therefore, the sensor module 100 of the present embodiment does not need to prepare Z-axis angular velocity sensors having different driving frequencies for the six Z-axis angular velocity sensors. Therefore, the sensor module 100 of the present embodiment can reduce the cost required for preparing Z-axis angular velocity sensors having different driving frequencies for the six Z-axis angular velocity sensors, such as the cost in manufacturing, ordering, inventory, or assembly, and can improve the industrial utilization value.

[0076] like Figure 5 As shown, the operation circuit 14, the connector 15, the memory 16, the power supply circuit 17, and the temperature sensor 18 are mounted on the upper surface of the substrate 21. Other electronic components may also be mounted on the upper surface of the substrate 21.

[0077] The operation circuit 14 is a controller that is a main controller for the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f. The operation circuit 14 is an integrated circuit device, and can be implemented by a processor such as an MPU (Micro Processor Unit) or a CPU (central processing unit).

[0078] The arithmetic circuit 14 includes a digital interface. The digital interface is a circuit that performs digital interface processing based on a communication standard such as SPI or I2C.

[0079] The operation circuit 14 receives the detection data output from the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f, performs various processes, and transmits the processed detection data to the outside via the connector 15. In the present embodiment, the operation circuit 14 is an example of a processing unit.

[0080] The various processings performed by the operation circuit 14 are: calculating the average value of the detection data of the angular velocities around the Z axis from the sensor devices 11a, 11b, 11c, 11d, 11e, and 11f; calculating the average value of the detection data of the angular velocities around the X axis from the sensor devices 12a, 12b, 12c, 12d, 12e, and 12f; calculating the average value of the detection data of the angular velocities around the Y axis from the sensor devices 13a, 13b, 13c, 13d, 13e, and 13f; performing temperature correction, zero point correction, etc., sensitivity adjustment, filtering, etc. on the obtained average values, and outputting the processed data from the connector 15.

[0081] The connector 15 is a plug-type connector having two rows of connection terminals arranged at equal intervals in the Y-axis direction. In the present embodiment, the connector 15 has connection terminals with 10 pins in one row and 20 pins in total, but the number of terminals may be appropriately changed according to design specifications.

[0082] The memory 16 stores a program for executing various processes performed by the arithmetic circuit 14 , a program for assembling processed detection data into packet data, and data required for executing the program, such as table data for temperature correction processing.

[0083] The power circuit 17 is supplied with power from the mounted device, and supplies necessary power to each sensor device, the calculation circuit 14 , and the like.

[0084] The temperature sensor 18 outputs temperature information used for temperature correction processing to the calculation circuit 14 .

[0085] 1.3. About fixed frame

[0086] Figure 6 FIG. 2 is a perspective view of the fixing frame 60, showing the fixing frame 60 in a state where the substrate unit 20 is mounted. Figure 6 In the figure, the substrate 21 is omitted for illustration.

[0087] The fixing frame 60 has an octagonal cylindrical shape in a plan view, and openings 68 are provided in the mounting substrates 21, 22, 23, 24, 25, and 26. The openings 68 function as escape portions for the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f.

[0088] The substrates 21, 22, 23, 24, 25, and 26 are mounted on the fixing frame 60 with the mounted sensor devices facing inside. Therefore, the mounted sensor devices do not protrude outside, so the size of the substrate unit 20 can be reduced, and the sensor module 100 can be miniaturized.

[0089] The fixing frame 60 is formed of, for example, resin.

[0090] The elastic modulus of the fixing frame 60 is preferably smaller than that of the substrates 21 , 22 , 23 , 24 , 25 , 26 , and larger than that of the flexible substrates 41 , 42 , 43 , 44 , 45 .

[0091] By making the elastic modulus of the fixing frame 60 smaller than that of the substrates 21, 22, 23, 24, 25, and 26, it is possible to suppress mechanical or electrical interference caused by the simultaneous operation of the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f.

[0092] By making the elastic modulus of fixing frame 60 larger than that of flexible substrates 41 , 42 , 43 , 44 , 45 , substrates 21 , 22 , 23 , 24 , 25 , 26 can be fixed at desired positions corresponding to the detection axes of the mounted sensor devices, thereby preventing deviation from the desired positions.

[0093] The substrate 21 (not shown) is fixed to the upper surface 61 of the fixing frame 60, and the substrate 26 is fixed to the lower surface 66. In other words, the substrate 21 on which the sensor devices 11a, 11b, 11c for detecting angular velocity around the Z axis are mounted is arranged opposite to the substrate 26 on which the sensor devices 11d, 11e, 11f are mounted.

[0094] The substrate 22 is fixed to the side surface 62 of the fixing frame 60, and the substrate 24 is fixed to the side surface 64. In other words, the substrate 22 on which the sensor devices 12a, 12b, and 12c for detecting angular velocity around the X axis are mounted faces the substrate 24 on which the sensor devices 12d, 12e, and 12f are mounted.

[0095] The substrate 23 is fixed to the side surface 63 of the fixing frame 60, and the substrate 25 is fixed to the side surface 65. In other words, the substrate 23 on which the sensor devices 13a, 13b, and 13c for detecting angular velocity around the Y axis are mounted faces the substrate 25 on which the sensor devices 13d, 13e, and 13f are mounted.

[0096] In this embodiment, the substrate unit 20 is fixed to the fixing frame 60 during assembly, but the substrate unit 20 is not limited to the method using the fixing frame 60. For example, the substrate unit 20 may be directly fixed to the inner case 30 without using the fixing frame 60.

[0097] 1.4. About sensor devices

[0098] 1.4.1. Encapsulation

[0099] Fig. 7A and Figure 7B It is a cross-sectional view for explaining the package of the sensor device 11e.

[0100] In this embodiment, Fig. 7A The sensor device 11e is a physical quantity sensor that detects angular velocity with the Z axis as a detection axis. Figure 7B The sensor device 11 e is a composite physical quantity sensor that detects angular velocity with the Z axis as a detection axis and acceleration with the Z axis as a detection axis.

[0101] like Fig. 7A and Figure 7B As shown, the sensor device 11e includes a package 7, a sensor element 3 and a circuit element 4 housed in the package 7, or sensor elements 3a, 3b and a circuit element 4. Although not shown, the sensor devices 11a, 11b, 11c, 11d, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f also have the same configuration as the sensor device 11e.

[0102] The package 7 includes a base 5 having a recessed portion opened in the upper surface, and a lid 6 bonded to the upper surface of the base 5 via a bonding member so as to close the opening of the recessed portion. An internal space S is formed inside the package 7 by the recessed portion.

[0103] The package 7 is, for example, a ceramic package. The base 5 is made of ceramic such as alumina, and the lid 6 is made of ceramic such as alumina or a metal material such as kovar.

[0104] Fig. 7AThe sensor device 11e accommodates a sensor element 3 and a circuit element 4 in an internal space S. The sensor element 3 is an angular velocity sensor for detecting an angular velocity around the Z axis, and includes a vibrator 1 and a support substrate 2. The vibrator 1 is a crystal vibrator. The circuit element 4 includes a detection circuit described later and the like.

[0105] The internal space S is airtight and in a reduced pressure state, preferably a state closer to a vacuum. This improves the vibration characteristics of the vibrator 1. However, the atmosphere of the internal space S is not particularly limited.

[0106] In the internal space S, the vibrator 1, the support substrate 2, and the circuit element 4 are arranged to overlap each other in a plan view. Such a configuration can suppress the expansion of the plane area of ​​the package 7 in the direction along the X-axis and / or the Y-axis, and is advantageous for miniaturization.

[0107] A plurality of internal terminals 8 a and 8 b are provided in the recess of the base 5 , and a plurality of external terminals 8 c are provided on the lower surface of the base 5 .

[0108] These internal terminals 8 a and 8 b and the external terminal 8 c are electrically connected to wiring (not shown) formed in the base 5 and the substrate 26 .

[0109] The internal terminal 8 a is electrically connected to the sensor element 3 via a conductive bonding member, and the internal terminal 8 b is electrically connected to the circuit element 4 via a bonding wire 9 .

[0110] Figure 7B The sensor device 11e accommodates the sensor elements 3a, 3b and the circuit element 4 in the internal space S.

[0111] The sensor element 3 a is an angular velocity sensor that detects an angular velocity around the Z axis, and similarly to the sensor element 3 , includes a vibrator that performs bending vibration, and detects an angular velocity using the Coriolis force.

[0112] The sensor element 3b is an acceleration sensor that detects acceleration in the Z-axis direction. The sensor element 3b includes a crystal oscillator, and detects acceleration by using changes in the vibration frequency of the crystal oscillator. The sensor element 3b may also be configured as follows: a silicon MEMS having a comb-shaped fixed electrode and a movable electrode, and detecting acceleration by using changes in the capacitance formed therebetween.

[0113] The circuit element 4 includes a detection circuit and the like which will be described later.

[0114] exist Figure 7B In the illustrated embodiment, the sensor device 11 e includes an angular velocity sensor for detecting an angular velocity around the Z axis and an acceleration sensor for detecting acceleration in the Z axis direction. However, the sensor device 11 e is not limited to this configuration.

[0115] For example, the sensor device 11e may include an angular velocity sensor element for detecting an angular velocity around the X-axis and / or an angular velocity sensor element for detecting an angular velocity around the Y-axis in addition to the sensor elements 3a and 3b.

[0116] For example, the sensor device 11e may include an acceleration sensor element for detecting acceleration in the X-axis direction and / or an acceleration sensor element for detecting acceleration in the Y-axis direction in addition to the sensor elements 3a and 3b.

[0117] For example, the sensor element 3 a may be a three-axis angular velocity sensor that detects angular velocity about each axis of X, Y, and Z.

[0118] For example, the sensor element 3 b may be a three-axis acceleration sensor that detects acceleration in the directions of the X, Y, and Z axes.

[0119] For example, the sensor element 3 b may be an angular velocity sensor that detects angular velocity around the Y axis and / or around the X axis, or a three-axis angular velocity sensor that detects angular velocity around each axis of X, Y, and Z.

[0120] For example, the sensor element 3a may be a three-axis angular velocity sensor that detects angular velocity around each axis of XYZ, and the sensor element 3b may be a three-axis acceleration sensor that detects acceleration in each axis direction of XYZ. In other words, the sensor device 11e may be a three-axis angular velocity sensor, a three-axis acceleration sensor, or a 6DoF (Six degrees of freedom) sensor.

[0121] When a ceramic package is used for the package 7, the package 7 can be referred to as a hard substrate. In this case, the sensor elements 3, 3a, 3b can be referred to as a sensor device 11e.

[0122] When a ceramic package is used for the package 7 , the package 7 may be directly mounted on the flexible substrate 45 without the substrate 26 interposed therebetween.

[0123] 1.4.2. Composition of sensor elements and circuit elements

[0124] Figure 8 Show Fig. 7A The sensor device 11e shown is a detailed configuration example of the sensor element 3 and the circuit element 4. The sensor devices 11a, 11b, 11c, 11d, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, and 13f also have the same configuration.

[0125] The sensor device 11 e includes a sensor element 3 and a circuit element 4 .

[0126] The sensor element 3 includes a vibrator 1 , and the circuit element 4 includes a driving circuit 81 and a detection circuit 82 .

[0127] The driving circuit 81 includes an amplifier circuit that inputs the feedback signal DG from the vibrator 1 and amplifies the signal, an AGC (Automatic Gain Control) circuit that performs automatic gain control, and an output circuit that outputs the driving signal DS to the vibrator 1. The AGC circuit automatically and variably adjusts the gain so that the amplitude of the feedback signal DG from the vibrator 1 becomes constant. The output circuit outputs the driving signal DS of a rectangular wave to the vibrator 1, for example.

[0128] The detection circuit 82 can include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit receives the detection signals S1 and S2 from the oscillator 1, and performs charge-voltage conversion and signal amplification of the detection signals S1 and S2 as differential signals. The synchronous detection circuit uses the synchronization signal from the drive circuit 81 to perform synchronous detection for extracting the desired wave. The A / D conversion circuit converts the analog detection signals S1 and S2 after synchronous detection into digital detection data D1, and outputs it to the operation circuit 14. In this embodiment, the detection data D1 is an example of a detection signal.

[0129] The calculation circuit 14 performs various processes such as temperature correction, zero point correction, sensitivity adjustment, and filter processing on the detection data D1 , and outputs the processed detection data D2 to the outside through the connector 15 .

[0130] In the present embodiment, the vibrator 1 is a double T-shaped vibrator. As the vibrator 1, a tuning fork type or H-shaped vibrator may be used.

[0131] The vibrator 1 includes driving arms 98a, 98b, 98c, and 98d, detection arms 99a and 99b, a base 91, and connection arms 92a and 92b.

[0132] The base 91 has a rectangular shape, and a detection arm 99 a , a detection arm 99 b , a connection arm 92 a , and a connection arm 92 b are provided on respective sides of the base 91 .

[0133] A driving arm 98a and a driving arm 98b are provided at the front end portion of the connecting arm 92a.

[0134] A driving arm 98c and a driving arm 98d are provided at the front end portion of the connecting arm 92b.

[0135] A weight portion for frequency adjustment is provided at the front end of the driving arms 98a, 98b, 98c, 98d and the detection arms 99a, 99b.

[0136] When the Z-axis direction is set as the thickness direction of the vibrator 1 , the vibrator 1 detects the angular velocity around the Z-axis.

[0137] The driving electrodes 93 are formed on the upper and lower surfaces of the driving arms 98a and 98b. The driving electrodes 94 are formed on the right and left sides of the driving arms 98a and 98b.

[0138] The driving electrodes 94 are formed on the upper and lower surfaces of the driving arms 98c and 98d. The driving electrodes 93 are formed on the right and left sides of the driving arms 98c and 98d.

[0139] The driving electrodes 93 and 94 are electrically connected to the driving circuit 81 . The driving circuit 81 supplies the driving signal DS to the driving electrode 93 , and inputs the feedback signal DG from the driving electrode 94 .

[0140] Detection electrodes 95 are formed on the upper and lower surfaces of the detection arm 99a. Ground electrodes 97 are formed on the right and left sides of the detection arm 99a.

[0141] Detection electrodes 96 are formed on the upper and lower surfaces of the detection arm 99b. Ground electrodes 97 are formed on the right and left sides of the detection arm 99b.

[0142] The detection electrodes 95 and 96 are electrically connected to the detection circuit 82. The detection circuit 82 receives the detection signals S1 and S2 from the detection electrodes 95 and 96.

[0143] 1.4.3. Operation of sensor elements and circuit elements

[0144] The sensor element 3 and the circuit element 4 operate as follows.

[0145] When a driving signal DS is applied to the driving electrode 93 from the driving circuit 81, the driving arms 98a, 98b, 98c, and 98d perform bending vibrations as indicated by arrows C1 due to the inverse piezoelectric effect. Specifically, the front ends of the driving arms 98a and 98c repeatedly approach and separate from each other, and the front ends of the driving arms 98b and 98d also repeatedly approach and separate from each other.

[0146] In other words, the driving arms 98a, 98b, 98c, and 98d repeat the vibration posture indicated by the solid arrow C1 and the vibration posture indicated by the dotted arrow C1 at a predetermined frequency. The predetermined frequency is, for example, 49.6 kHz.

[0147] In the present embodiment, the frequency of the bending vibration of the driving arms 98a, 98b, 98c, 98d is an example of the driving frequency of the sensor device 11e. The frequency of the bending vibration of the driving arms 98a, 98b, 98c, 98d can also be defined based on the frequency of the driving signal DS. This is because the frequency of the driving signal DS is correlated with the frequency of the bending vibration of the driving arms 98a, 98b, 98c, 98d. Similarly, the driving frequency of the sensor device 11e can also be defined based on other signals that are correlated with the frequency of the bending vibration of the driving arms 98a, 98b, 98c, 98d.

[0148] The bending vibration of the driving arms 98a and 98b and the bending vibration of the driving arms 98c and 98d are vibrations that are line-symmetrical with respect to the Y-axis passing through the center of gravity of the base 91. Therefore, the base 91, the connecting arms 92a and 92b, the detection arm 99a, and the detection arm 99b hardly vibrate due to the bending vibration of the driving arms 98a, 98b, 98c, and 98d.

[0149] In this state, if an angular velocity with the Z axis as the rotation axis is applied to the vibrator 1, the driving arms 98a, 98b, 98c, and 98d vibrate as indicated by the arrow C2 due to the Coriolis force. In other words, the Coriolis force in the direction of the arrow C2 orthogonal to the direction of the arrow C1 and the direction of the Z axis acts on the driving arms 98a, 98b, 98c, and 98d, thereby generating a vibration component in the direction of the arrow C2.

[0150] The vibration indicated by the arrow C2 is transmitted to the base portion 91 via the connecting arm 92a and the connecting arm 92b, whereby the detection arm 99a and the detection arm 99b perform bending vibration in the direction of the arrow C3.

[0151] Charge signals generated based on the piezoelectric effect caused by the bending vibration of the detection arms 99a and 99b are input to the detection circuit 82 as detection signals S1 and S2, and the angular velocity around the Z axis is detected.

[0152] As described above, the sensor module 100 of the present embodiment achieves the following effects.

[0153] The sensor module 100 of the present embodiment comprises: a substrate 21 as a first substrate; a substrate 22 as a second substrate; a connecting portion 40 electrically connecting the substrate 21 and the substrate 22; a sensor device 11a as a first sensor device, which is arranged on the substrate 21 and detects the angular velocity around the Z axis as a physical quantity of the first axis; a sensor device 11b as a second sensor device, which is arranged on the substrate 21, detects the angular velocity around the Z axis, and has a driving frequency different from that of the sensor device 11a; a sensor device 12a as a third sensor device, which is arranged on the substrate 22, detects the angular velocity around the X axis as a physical quantity of the second axis; and a sensor device 12b as a fourth sensor device, which is arranged on the substrate 22, detects the angular velocity around the X axis, and has a driving frequency different from that of the sensor device 12a.

[0154] Thus, the sensor module 100 of this embodiment comprises: a substrate 21, on which a sensor device 11a and a sensor device 11b for detecting the angular velocity around the Z axis are mounted; and a substrate 22, on which a sensor device 12a and a sensor device 12b for detecting the angular velocity around the X axis are mounted, and which is connected to the substrate 21 via a connecting portion 40, wherein a driving frequency of the sensor device 11a is different from a driving frequency of the sensor device 11b, and a driving frequency of the sensor device 12a is different from a driving frequency of the sensor device 12b.

[0155] Therefore, in the sensor module 100 of the present embodiment, mechanical and / or electrical interference between the two angular velocity sensors about the Z axis mounted on the substrate 21 is suppressed, and mechanical and / or electrical interference between the two angular velocity sensors about the X axis mounted on the substrate 22 is suppressed. Furthermore, mechanical and / or electrical interference between the two angular velocity sensors about the Z axis mounted on the substrate 21 and the two angular velocity sensors about the X axis mounted on the substrate 22 is suppressed.

[0156] Therefore, in the configuration in which the sensor module 100 of the present embodiment includes a plurality of angular velocity sensors about the Z axis and a plurality of angular velocity sensors about the X axis, it is possible to improve the effectiveness of increasing the accuracy of angular velocity data about each axis.

[0157] In other words, in the sensor module 100 of the present embodiment, by changing the combination of the two or more angular velocity sensors mounted on the substrate 21 and the two or more angular velocity sensors mounted on the substrate 22 to the X-axis and the Y-axis, the Y-axis and the Z-axis, and the Z-axis and the X-axis, the effectiveness of the high-precision multi-axis angular velocity sensor can be improved. Moreover, in the sensor module 100 of the present embodiment, by replacing the angular velocity sensor with an acceleration sensor, the sensor module 100 of the present embodiment can also improve the effectiveness of the high-precision multi-axis acceleration sensor.

[0158] In the sensor module 100 of the present embodiment, the connection portion 40 includes a flexible substrate 41 .

[0159] As described above, in the sensor module 100 of the present embodiment, the substrate 21 and the substrate 22 are electrically connected via the flexible substrate 41 .

[0160] The flexible substrate 41 is a soft substrate. Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference between the substrate 21 and the substrate 22. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of high-precision detection data.

[0161] The sensor module 100 of the present embodiment further includes: an operation circuit 14 as a processing unit, which is arranged on the substrate 21, and processes the detection data D1 as the first detection signal of the sensor device 11a, the detection data D1 as the second detection signal of the sensor device 11b, the detection data D1 as the third detection signal of the sensor device 12a, and the detection data D1 as the fourth detection signal of the sensor device 12b.

[0162] Therefore, in the sensor module 100 of the present embodiment, the calculation circuit 14 processes each detection data D1 detected by each sensor device based on a configuration that ensures effectiveness of high precision. Therefore, the sensor module 100 of the present embodiment can obtain highly accurate and reliable detection data D2.

[0163] The sensor module 100 of the present embodiment further includes a connector 15 provided on the substrate 21 and electrically connected to the calculation circuit 14 .

[0164] Therefore, the sensor module 100 of the present embodiment can output the highly accurate and reliable detection data D2 processed by the calculation circuit 14 to the outside through the connector 15 based on the configuration that ensures the effectiveness of high accuracy.

[0165] The sensor module 100 of the present embodiment further includes a fixing frame 60 as a fixing portion for fixing the substrate 21 and the substrate 22 .

[0166] In this way, the substrate 21 and the substrate 22 are respectively fixed to the fixing frame 60. Therefore, the sensor module 100 of this embodiment can easily and reliably fix the substrate 21 and the substrate 22. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of high-precision detection data.

[0167] The sensor module 100 of the present embodiment further includes an inner case 30 and / or an outer case 50 as a housing for accommodating the substrate 21 , the substrate 22 , and the connection portion 40 .

[0168] In this way, the substrate 21 , the substrate 22 , and the connection portion 40 are accommodated in the inner case 30 and / or the outer case 50 , so that influences from the outside can be blocked, and the effectiveness and reliability of high-precision detection data can be improved.

[0169] The sensor module 100 of the present embodiment comprises: a substrate 21 as a first substrate; a substrate 22 as a second substrate; a substrate 23 as a third substrate; a flexible substrate 41 as a first connecting portion, electrically connecting the substrate 21 and the substrate 22; a flexible substrate 42 as a second connecting portion, electrically connecting the substrate 21 and the substrate 23; a sensor device 11a as a first sensor device, provided on the substrate 21, detecting an angular velocity around the Z axis as a physical quantity of the first axis; a sensor device 11b as a second sensor device, provided on the substrate 21, detecting an angular velocity around the Z axis, and having a driving frequency different from that of the sensor device 11a. rate; the sensor device 12a as the third sensor device is arranged on the substrate 22, and detects the angular velocity around the X-axis as the physical quantity of the second axis; the sensor device 12b as the fourth sensor device is arranged on the substrate 22, detects the angular velocity around the X-axis, and has a driving frequency different from that of the sensor device 12a; the sensor device 13a as the fifth sensor device is arranged on the substrate 23, and detects the angular velocity around the Y-axis as the physical quantity of the third axis; the sensor device 13b as the sixth sensor device is arranged on the substrate 23, detects the angular velocity around the Y-axis, and has a driving frequency different from that of the sensor device 13a.

[0170] Thus, the sensor module 100 of the present embodiment includes: a substrate 21 on which the sensor device 11a and the sensor device 11b for detecting the angular velocity around the Z axis are mounted; a substrate 22 on which the sensor device 12a and the sensor device 12b for detecting the angular velocity around the X axis are mounted, and is connected to the substrate 21 via the flexible substrate 41; and a substrate 23 on which the sensor device 13a and the sensor device 13b for detecting the angular velocity around the Y axis are mounted, and is connected to the substrate 21 via the flexible substrate 42, wherein the driving frequency of the sensor device 11a is different from the driving frequency of the sensor device 11b, the driving frequency of the sensor device 12a is different from the driving frequency of the sensor device 12b, and the driving frequency of the sensor device 13a is different from the driving frequency of the sensor device 13b.

[0171] Therefore, in the sensor module 100 of the present embodiment, mechanical and / or electrical interference between the two angular velocity sensors about the Z axis mounted on the substrate 21 is suppressed, mechanical and / or electrical interference between the two angular velocity sensors about the X axis mounted on the substrate 22 is suppressed, and mechanical and / or electrical interference between the two angular velocity sensors about the Y axis mounted on the substrate 23 is suppressed. Furthermore, mechanical and / or electrical interference between the two angular velocity sensors about the Z axis mounted on the substrate 21, the two angular velocity sensors about the X axis mounted on the substrate 22, and the two angular velocity sensors about the Y axis mounted on the substrate 23 is suppressed.

[0172] Therefore, the sensor module 100 of this embodiment can improve the effectiveness of high-precision angular velocity data about each axis in a configuration that includes a plurality of angular velocity sensors about each axis. In other words, the sensor module 100 of this embodiment can improve the effectiveness of high-precision angular velocity sensors of multiple axes. Moreover, in the sensor module 100 of this embodiment, by replacing the angular velocity sensors with acceleration sensors, the sensor module 100 of this embodiment can also improve the effectiveness of high-precision angular velocity sensors of multiple axes.

[0173] The sensor module 100 of the present embodiment further includes: a substrate 24 as a fourth substrate; a substrate 25 as a fifth substrate; a substrate 26 as a sixth substrate; a flexible substrate 43 as a third connection portion, electrically connecting the substrate 21 and the substrate 24; a flexible substrate 44 as a fourth connection portion, electrically connecting the substrate 21 and the substrate 25; a flexible substrate 45 as a fifth connection portion, electrically connecting the substrate 25 and the substrate 26; a sensor device 12d as a seventh sensor device, provided on the substrate 24, detecting an angular velocity around the X-axis; a sensor device 12e as an eighth sensor device, provided on the substrate 24, detecting an angular velocity around the X-axis, and And it has a driving frequency different from that of the sensor device 12d; the sensor device 13d as the ninth sensor device is arranged on the substrate 25, and detects the angular velocity around the Y axis; the sensor device 13e as the tenth sensor device is arranged on the substrate 25, and detects the angular velocity around the Y axis, and has a driving frequency different from that of the sensor device 13d; the sensor device 11d as the eleventh sensor device is arranged on the substrate 26, and detects the angular velocity around the Z axis; and the sensor device 11e as the twelfth sensor device is arranged on the substrate 26, and detects the angular velocity around the Z axis, and has a driving frequency different from that of the sensor device 11d.

[0174] Thus, the sensor module 100 of the present embodiment further comprises: a substrate 24 on which the sensor device 12d and the sensor device 12e for detecting the angular velocity around the X-axis are mounted, and which is connected to the substrate 21 via the flexible substrate 43; a substrate 25 on which the sensor device 13d and the sensor device 13e for detecting the angular velocity around the Y-axis are mounted, and which is connected to the substrate 21 via the flexible substrate 44; and a substrate 26 on which the sensor device 11d and the sensor device 11e for detecting the angular velocity around the Z-axis are mounted, and which is connected to the substrate 25 via the flexible substrate 45, wherein the driving frequency of the sensor device 11d is different from the driving frequency of the sensor device 11e, the driving frequency of the sensor device 12d is different from the driving frequency of the sensor device 12e, and the driving frequency of the sensor device 13d is different from the driving frequency of the sensor device 13e.

[0175] Therefore, in the sensor module 100 of the present embodiment, further, the two angular velocity sensors around the X axis mounted on the substrate 24 are prevented from mechanically and / or electrically interfering with each other, the two angular velocity sensors around the Y axis mounted on the substrate 25 are prevented from mechanically and / or electrically interfering with each other, and the two angular velocity sensors around the Z axis mounted on the substrate 26 are prevented from mechanically and / or electrically interfering with each other. Furthermore, the two angular velocity sensors around the Z axis mounted on the substrate 21, the two angular velocity sensors around the X axis mounted on the substrate 22, the two angular velocity sensors around the Y axis mounted on the substrate 23, the two angular velocity sensors around the X axis mounted on the substrate 24, the two angular velocity sensors around the Y axis mounted on the substrate 25, and the two angular velocity sensors around the Z axis mounted on the substrate 26 are prevented from mechanically and / or electrically interfering with each other.

[0176] Therefore, the sensor module 100 of this embodiment can improve the effectiveness of high-precision angular velocity data about each axis in a configuration including a plurality of angular velocity sensors about each axis. In other words, the sensor module 100 of this embodiment can improve the effectiveness of high-precision angular velocity sensors about multiple axes.

[0177] Furthermore, the sensor module 100 of this embodiment mounts a plurality of X-axis angular velocity sensors, Y-axis angular velocity sensors, and Z-axis angular velocity sensors on two substrates, respectively. Therefore, the sensor module 100 of this embodiment can realize miniaturization of the substrate, which is beneficial to miniaturization of the sensor module 100.

[0178] Furthermore, in the sensor module 100 of the present embodiment, by replacing the angular velocity sensor with an acceleration sensor, the sensor module 100 of the present embodiment can also improve the effectiveness of increasing the accuracy of the multi-axis acceleration sensor.

[0179] The sensor module 100 of the present embodiment further comprises: a sensor device 11c as a thirteenth sensor device, which is arranged on the substrate 21, detects the angular velocity around the Z axis, and has a driving frequency different from that of the sensor device 11a and the sensor device 11b; a sensor device 12c as a fourteenth sensor device, which is arranged on the substrate 22, detects the angular velocity around the X axis, and has a driving frequency different from that of the sensor device 12a and the sensor device 12b; and a sensor device 13c as a fifteenth sensor device, which is arranged on the substrate 23, detects the angular velocity around the Y axis, and has a driving frequency different from that of the sensor device 13a and the sensor device 13b. In addition, the sensor module 100 of the present embodiment further includes: a sensor device 12f as a sixteenth sensor device, which is arranged on the substrate 24, detects the angular velocity around the X-axis, and has a driving frequency different from that of the sensor device 12d and the sensor device 12e; a sensor device 13f as a seventeenth sensor device, which is arranged on the substrate 25, detects the angular velocity around the Y-axis, and has a driving frequency different from that of the sensor device 13d and the sensor device 13e; and a sensor device 11f as an eighteenth sensor device, which is arranged on the substrate 26, detects the angular velocity around the Z-axis, and has a driving frequency different from that of the sensor device 11d and the sensor device 11e.

[0180] Thus, the sensor module 100 of the present embodiment includes: sensor devices 11a, 11b, 11c, which are provided on the substrate 21, detect the angular velocity around the Z axis, and have different driving frequencies; sensor devices 12a, 12b, 12c, which are provided on the substrate 22, detect the angular velocity around the X axis, and have different driving frequencies; and sensor devices 13a, 13b, 13c, which are provided on the substrate 23, detect the angular velocity around the Y axis, and have different driving frequencies. In addition, the sensor module 100 of the present embodiment includes: sensor devices 12d, 12e, 12f, which are provided on the substrate 24, detect the angular velocity around the X axis, and have different driving frequencies; sensor devices 13d, 13e, 13f, which are provided on the substrate 25, detect the angular velocity around the Y axis, and have different driving frequencies; and sensor devices 11d, 11e, 11f, which are provided on the substrate 26, detect the angular velocity around the Z axis, and have different driving frequencies.

[0181] Therefore, the sensor module 100 of this embodiment can improve the effectiveness of high-precision angular velocity data about each axis in a configuration that includes a plurality of angular velocity sensors about each axis. In other words, the sensor module 100 of this embodiment can improve the effectiveness of high-precision angular velocity sensors of multiple axes. Moreover, in the sensor module 100 of this embodiment, by replacing the angular velocity sensors with acceleration sensors, the sensor module 100 of this embodiment can also improve the effectiveness of high-precision angular velocity sensors of multiple axes.

[0182] In the sensor module 100 of this embodiment, the driving frequencies of the sensor devices 11a and 11d are the same, the driving frequencies of the sensor devices 12a and 12d are the same, and the driving frequencies of the sensor devices 13a and 13d are the same.

[0183] Therefore, in the sensor module 100 of the present embodiment, it is not necessary to prepare angular velocity sensors having different driving frequencies for the multiple angular velocity sensors of the same axis. Therefore, in the sensor module 100 of the present embodiment, it is possible to reduce the cost required for preparing angular velocity sensors having different driving frequencies for the multiple angular velocity sensors of the same axis, such as the cost of manufacturing, ordering, inventory, or assembly, and to improve the industrial utilization value.

[0184] 2. Implementation Method 2

[0185] In the second embodiment, an electronic device including the sensor module 100 will be described.

[0186] Hereinafter, as examples of electronic devices, portable devices such as smartphones and mobile objects such as cars will be described.

[0187] 2.1. Overview of portable devices

[0188] Fig. 9 It is a perspective view of a portable device as the electronic device according to Embodiment 2, and is a diagram showing the configuration of a smartphone 110 as an example of the portable device.

[0189] The smartphone 110 is equipped with the sensor module 100 .

[0190] The detection data D2 of the sensor module 100 is received by the control unit 111. The control unit 111 can recognize the posture and movement of the smartphone 110 based on the received detection signal, change the image displayed on the display unit, emit a warning sound, sound effect, or drive a vibration motor to vibrate the main body.

[0191] The sensor module 100 may also be mounted on other portable devices other than the smartphone 110. For example, the sensor module 100 may also be mounted on portable devices such as smart watches, portable activity meters, HMDs (Head Mounted Displays), mobile PCs (Personal Computers), tablet PCs, cameras, and PDAs (Personal Digital Assistants). Thus, the portable device can recognize the posture and movement of the portable device based on the detection data D2 of the sensor module 100, change the displayed image, emit a warning sound, an effect sound, or drive a vibration motor to vibrate the main body, etc.

[0192] As described above, in the present embodiment, the sensor module 100 is mounted on a portable device such as the smartphone 110. Therefore, according to the present embodiment, the reliability of the portable device including the substrate sensor module 100 can be improved.

[0193] 2.2. Overview of mobile objects

[0194] Fig.10 1 is a perspective view of a moving object as the electronic device according to Embodiment 2, and is a view showing a configuration of a car 130 as an example of the moving object.

[0195] The automobile 130 is equipped with the sensor module 100 .

[0196] The sensor module 100 detects the posture of the vehicle body 131 and transmits the detection data D2 to the vehicle body posture control device 132. The detection data D2 includes an angular velocity signal and an acceleration signal.

[0197] When the vehicle posture control device 132 that controls the posture of the vehicle body 131 receives the detection data D2 from the sensor module 100, it detects the posture of the vehicle body 131 based on the signal, and controls the hardness of the suspension or the brakes of each wheel 133 according to the detection result.

[0198] In addition, the detection data D2 of the sensor module 100 can also be flexibly used in ECUs (Electronic Control Units) such as keyless entry, anti-theft devices, car navigation systems, car air conditioners, anti-lock braking systems (ABS), airbags, TPMS (Tire Pressure Monitoring System), engine control, control equipment for inertial navigation for autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0199] The sensor module 100 may also be mounted on other mobile bodies other than the automobile 130. Other mobile bodies include, for example, bipedal walking robots, electric trains, radio-controlled airplanes, radio-controlled helicopters, drones, agricultural machinery, and construction machinery. The mobile body equipped with the sensor module 100 can flexibly use the detection data D2 of the sensor module 100 for posture control, position measurement, and the like of the mobile body.

[0200] As described above, in the present embodiment, the sensor module 100 is mounted on a moving object such as the automobile 130. Therefore, according to the present embodiment, the reliability of the moving object including the sensor module 100 can be improved.

[0201] Although preferred embodiments have been described above, the present invention is not limited to the above-described embodiments. The configuration of each part of the present invention can be replaced with an arbitrary configuration that exhibits the same functions as the above-described embodiments, and an arbitrary configuration can be added.

Claims

1. A sensor module, characterized in that: have: a first substrate; a second substrate; a connecting portion, electrically connecting the first substrate and the second substrate; A first sensor device, disposed on the first substrate, for detecting a physical quantity of a first axis; a second sensor device, disposed on the first substrate, detecting a physical quantity of the first axis and having a driving frequency different from that of the first sensor device; A third sensor device is disposed on the second substrate and detects a physical quantity of a second axis; as well as The fourth sensor device is provided on the second substrate, detects the physical quantity of the second axis, and has a driving frequency different from that of the third sensor device.

2. The sensor module according to claim 1, characterized in that: The connecting portion includes a flexible substrate.

3. The sensor module according to claim 1, characterized in that: The sensor module comprises: The processing unit is provided on the first substrate and processes the first detection signal of the first sensor device, the second detection signal of the second sensor device, the third detection signal of the third sensor device, and the fourth detection signal of the fourth sensor device.

4. The sensor module according to claim 3, characterized in that: The sensor module comprises: The connector is disposed on the first substrate and is electrically connected to the processing unit.

5. The sensor module according to claim 1, characterized in that: The sensor module comprises: The fixing part fixes the first substrate and the second substrate.

6. The sensor module according to claim 1, characterized in that: The sensor module comprises: The housing accommodates the first substrate, the second substrate, and the connecting portion.

7. The sensor module according to claim 1, characterized in that: The sensor module comprises: a fifth sensor device, which is disposed on the first substrate, detects the physical quantity of the first axis, and has a driving frequency different from that of the first sensor device and the second sensor device; and The sixth sensor device is provided on the second substrate, detects the physical quantity of the second axis, and has a driving frequency different from that of the third sensor device and the fourth sensor device.

8. A sensor module, characterized in that: have: a first substrate; a second substrate; a third substrate; a first connecting portion, electrically connecting the first substrate and the second substrate; a second connecting portion, electrically connecting the first substrate and the third substrate; A first sensor device, disposed on the first substrate, for detecting a physical quantity of a first axis; a second sensor device, disposed on the first substrate, detecting a physical quantity of the first axis and having a driving frequency different from that of the first sensor device; A third sensor device is disposed on the second substrate and detects a physical quantity of a second axis; a fourth sensor device, disposed on the second substrate, detecting a physical quantity of the second axis, and having a driving frequency different from that of the third sensor device; a fifth sensor device, disposed on the third substrate, for detecting a physical quantity of a third axis; as well as The sixth sensor device is provided on the third substrate, detects the physical quantity of the third axis, and has a driving frequency different from that of the fifth sensor device.

9. The sensor module according to claim 8, characterized in that: The sensor module comprises: a fourth substrate; a fifth substrate; a sixth substrate; a third connecting portion, electrically connecting the first substrate and the fourth substrate; a fourth connecting portion, electrically connecting the first substrate and the fifth substrate; a fifth connecting portion, electrically connecting the fifth substrate and the sixth substrate; a seventh sensor device, disposed on the fourth substrate, for detecting a physical quantity of the second axis; an eighth sensor device, disposed on the fourth substrate, detecting the physical quantity of the second axis, and having a driving frequency different from that of the seventh sensor device; a ninth sensor device, disposed on the fifth substrate, for detecting a physical quantity of the third axis; a tenth sensor device, disposed on the fifth substrate, detecting the physical quantity of the third axis, and having a driving frequency different from that of the ninth sensor device; an eleventh sensor device, disposed on the sixth substrate, for detecting a physical quantity of the first axis; as well as A twelfth sensor device is provided on the sixth substrate, detects the physical quantity of the first axis, and has a driving frequency different from that of the eleventh sensor device.

10. The sensor module according to claim 9, characterized in that: The sensor module comprises: a thirteenth sensor device, disposed on the first substrate, detecting the physical quantity of the first axis, and having a driving frequency different from that of the first sensor device and the second sensor device; a fourteenth sensor device, which is disposed on the second substrate, detects the physical quantity of the second axis, and has a driving frequency different from that of the third sensor device and the fourth sensor device; and A fifteenth sensor device is provided on the third substrate, detects a physical quantity of the third axis, and has a driving frequency different from those of the fifth sensor device and the sixth sensor device.

11. The sensor module according to claim 10, characterized in that: The sensor module comprises: a sixteenth sensor device, disposed on the fourth substrate, detecting the physical quantity of the second axis, and having a driving frequency different from that of the seventh sensor device and the eighth sensor device; a seventeenth sensor device, disposed on the fifth substrate, detecting the physical quantity of the third axis, and having a driving frequency different from that of the ninth sensor device and the tenth sensor device; as well as An eighteenth sensor device is provided on the sixth substrate, detects the physical quantity of the first axis, and has a driving frequency different from those of the eleventh sensor device and the twelfth sensor device.

12. The sensor module according to claim 9, characterized in that: The driving frequency of the first sensor device is the same as the driving frequency of the eleventh sensor device, The driving frequency of the third sensor device is the same as the driving frequency of the seventh sensor device, The driving frequency of the fifth sensor device is the same as the driving frequency of the ninth sensor device.

13. An electronic device, characterized in that: have: The sensor module according to any one of claims 1 to 12.

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