Batch testing device and method for patch power devices

Abstract

The invention relates to the technical field of patch device testing devices, in particular to a patch power device batch testing device and method, which is used for performing batch detection on patch power device bodies and comprises a main machine body, and a detection assembly capable of performing feeding detection on the patch power device bodies is arranged in the center of the top of the main machine body. The detection assembly comprises a detection circuit board which can be used for insertion of pins on the surface-mounted power device body and can detect the surface-mounted power device body, and the detection assembly further comprises a base which is arranged at the top of the main machine body and is used for positioning the detection circuit board. The detection circuit board is arranged between the base and the supporting plate, the center of the supporting plate is provided with the groove, the patch power device body is placed in the groove to be limited, the patch power device body is pressed on the detection circuit board through the pressing assembly, a welding electrical connection method is omitted, and damage to a detected device due to repeated disassembly is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of patch device testing devices, in particular to a patch power device batch testing device. Background Art

[0002] In the field of semiconductor device testing, SMD power devices are widely used in various electronic devices due to their small size, high integration, and easy surface mounting. However, when performing power cycle tests on such devices, testers face a series of technical challenges that seriously hinder the improvement of test efficiency and accuracy. The pins of SMD power devices are usually in the form of tiny pads, which brings wiring difficulties during power cycle testing. Traditional testing methods often lack test interfaces designed specifically for such small pins, resulting in long test preparation time and error-prone wiring process, affecting the reliability and repeatability of the test. In addition, existing test fixtures or adapters on the market often cannot perfectly adapt to the size and pin layout of various SMD power devices, further exacerbating the difficulty of test implementation.

[0003] Secondly, although the traditional method of welding wires for wiring solves the wiring problem to a certain extent, it introduces new problems. Welding wires not only occupy the path originally designed for heat dissipation, but may also affect the thermal performance of the device due to the thermal resistance and stress concentration of the welding points, causing the test results to deviate from the performance under actual use conditions. This problem is particularly prominent in that it hinders the performance comparison test between chips of the same model but different packaging types, because different wiring methods may lead to inconsistent test conditions, making the test data unable to be directly used for performance evaluation and comparison.

[0004] To solve the above problems, another tentative solution is to use a tablet pressing device to fix the device under test on the test circuit board, trying to ensure good electrical contact through physical pressure. However, this method has encountered new challenges in actual operation: the device under test is easy to slide, resulting in poor contact, affecting the stability and accuracy of the test data. Especially when using the transient double interface method to measure thermal resistance, since the test requires changing the contact surface material to maintain the test accuracy, the method of direct soldering on the test circuit board becomes unfeasible, and can only rely on the tablet pressing method, and the instability of the tablet pressing method becomes a major hidden danger to the test results. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] The present invention is aimed at the above-mentioned defects existing in the prior art, and specially proposes a batch testing device and method for chip power devices. A detection circuit board is arranged between a base and a support plate, a groove is opened in the center of the support plate, and the chip power device body is placed in the groove for limiting. The chip power device body is pressed onto the detection circuit board through a pressing assembly, thereby eliminating the electrical connection method of welding, and avoiding the problem of damage to the device under test due to multiple disassemblies.

[0007] 2. Technical Solution

[0008] In order to solve the above technical problems, the present invention provides a batch testing device for patch power devices, which is used for batch testing of patch power device bodies, including a main body, a detection component capable of performing feeding detection on the patch power device body is arranged at the center position of the top of the main body, the detection component includes a detection circuit board for inserting pins on the patch power device body and can detect the patch power device body, the detection component also includes a base arranged on the top of the main body and used to position the detection circuit board, the detection component also includes a support plate arranged on the top of the detection circuit board, and a groove for limiting the patch power device body is also opened at the center position of the support plate, and a pressing component capable of pressing the patch power device body onto the detection circuit board is arranged on the main body.

[0009] Preferably, the detection circuit board is also provided with a plurality of conductive holes for inserting the pins of the chip power device body, and the bottom of the detection circuit board is also provided with a plurality of sleeves corresponding to the conductive holes, the sleeves are electrically connected to the circuit inside the detection circuit board, and a lifting conductive column that can move up and down is slidably provided between each sleeve, and an elastic structure for resetting the lifting conductive column is also provided between the sleeve and the lifting conductive column, and the lifting conductive column extends into the conductive hole.

[0010] Preferably, the elastic structure is a spring, the top end of the spring is connected to the bottom end of the lifting conductive column, and the bottom end of the spring is connected to the bottom end of the inside of the sleeve.

[0011] Preferably, the elastic structure is a spring.

[0012] Preferably, the detection component includes four copper pillars vertically arranged at the four corners of the support plate, the detection component also includes a top plate installed on the top of the copper pillars, the detection component also includes a lifting member and a sliding rod installed at the bottom of the lifting member, and the sliding rod and the top plate are slidably matched, and a movable plate capable of pressing the chip power device body onto the detection circuit board is provided at the bottom of the sliding rod, and a buffer spring is provided on the upper part of the sliding rod, one end of the buffer spring is connected to the top of the top plate, and the other end of the buffer spring is connected to the bottom of the lifting member, and the pressing assembly can drive the lifting member to move up and down so that the movable plate presses the chip power device body onto the detection circuit board.

[0013] Preferably, the pressing assembly includes a support member vertically fixed to the back of the main body, a telescopic driving member capable of driving the lifting member to move up and down is vertically arranged on the top of the support member, and the output end of the telescopic driving member passes through the support member and is detachably connected to the lifting member.

[0014] Preferably, a limiting groove is provided at the front of the main body along its width direction, and a conductive component capable of pressing on the detection circuit board is also provided on the main body, and the conductive component can move in the limiting groove to adjust the position of the conductive component.

[0015] Preferably, the conductive component includes a sliding part that can slide in the limit groove, and the conductive component also includes an adjusting screw rotatably arranged along the length direction of the limit groove, the adjusting screw is connected to the sliding part by a thread, and a rotating shaft is also provided on the sliding part, a clamping part is rotatably arranged on the rotating shaft, and a contact corresponding to the power supply point on the detection circuit board is also provided at a position of the clamping part close to the detection circuit board, the conductive component also includes a torsion spring sleeved on the rotating shaft for pressing the contact against the power supply point on the detection circuit board, one end of the torsion spring contacts the sliding part, and the other end of the torsion spring contacts the clamping part, and a rotating part is also provided on the adjusting screw.

[0016] Preferably, at least two groups of slide grooves are provided on both sides of the main body along its length direction, and fixing components capable of fixing the base are provided on both sides of the top of the main body, and protrusions are provided on both sides of the base. The fixing component includes a slider that can slide on the slide groove, and the fixing component also includes a lifter arranged on the main body, and a pressure plate is placed on the lifter. A fixing bolt is provided on the slider, and a fixing nut is screwed on the fixing bolt. The fixing nut presses the protrusion on the base to the top of the main body through the pressure plate, and the lifter can adjust its own height.

[0017] A method for testing a chip power device, comprising a batch testing device for chip power devices in the above scheme, characterized in that it comprises the following steps:

[0018] S1: Place the detection circuit board between the base and the support plate and fix it. Place the detection component on the main body and fix the detection component with the fixing component to complete the preparation before the test.

[0019] S2: By rotating the rotating member, the rotating member rotates the adjusting screw, and the adjusting screw moves the sliding member so that the clamping member is close to the detection circuit board. Then, by pressing the clamping member, the clamping member is opened, and then the clamping member is close to the top of the power supply part of the detection circuit board. The torsion spring rotates the clamping member to drive the contact to press the power supply part on the detection circuit board;

[0020] S3: Place the SMD power device body to be tested into the slot in the support plate, insert the pins of the SMD power device body into the conductive holes in the detection circuit board, and use the telescopic drive member to move the lifting member downward, thereby causing the movable plate to press the SMD power device body onto the detection circuit board. The pins on the SMD power device body can move the lifting conductive column downward, and the SMD power device body is detected by the detection circuit board, and the detection information is sent to the background terminal. After the detection is completed, the SMD power device body is taken out.

[0021] 3. Beneficial Effects

[0022] Compared with the prior art, the present invention places the detection circuit board between the base and the support plate, and designs a notch at the center of the support plate for positioning and carrying the chip power device body. Through the action of the pressing assembly, the chip power device body is firmly pressed on the detection circuit board, and its pins are smoothly inserted into the conductive holes of the detection circuit board, thereby realizing the conduction of the circuit. This design abandons the traditional welding electrical connection method and effectively avoids potential damage to the device under test caused by multiple disassembly. At the same time, the disassembly process of the chip power device body becomes simple and efficient, ensuring the consistency of the test conditions of the device under test, greatly protecting the chip power device body, and providing convenience for subsequent ultrasonic scanning analysis, electrical parameter measurement, etc.

[0023] By setting a sleeve on the detection circuit board. A lifting conductive column is slidably installed inside the sleeve. When the pin of the chip power device body contacts the lifting conductive column, the circuit is turned on. This design effectively avoids direct friction between the pin and the conductive hole, thereby significantly reducing the risk of poor contact.

[0024] Furthermore, the lifting conductive column can move freely in the sleeve to adapt to pins of different lengths. At the same time, an elastic structure is integrated inside the sleeve to ensure that the lifting conductive column can be in close contact with the pin and achieve length compensation. This feature enables the detection device of the present application to be compatible with patch power device bodies of different pin lengths, greatly improving the versatility and flexibility of detection. In the traditional way, the wire is usually connected to the power supply of the detection circuit board by welding, which requires the wire to be re-welded when the detection circuit board is replaced, increasing the complexity of the operation. However, the present application drives the adjusting screw to rotate by rotating the rotating part, thereby driving the sliding part to move to the power supply of the detection circuit board. At the same time, the elastic force of the torsion spring is used to press the contacts on the clamp tightly against the power supply of the detection circuit board, thereby achieving a stable electrical connection. This design not only simplifies the wire connection process after replacing the detection circuit board, but also improves the reliability and maintainability of the entire detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a first three-dimensional structural schematic diagram of the present invention.

[0026] Figure 2 It is a second three-dimensional structural schematic diagram of the present invention.

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the detection component of the present invention.

[0028] Figure 4 It is a schematic diagram of the first explosion structure of the detection component of the present invention.

[0029] Figure 5 It is a schematic diagram of a second explosion structure of the detection component of the present invention.

[0030] Figure 6 It is a three-dimensional structural schematic diagram of a detection circuit board of a detection assembly of the present invention.

[0031] Figure 7 It is a schematic diagram of the three-dimensional structure of the main body and the fixing component of the detection component of the present invention.

[0032] Figure 8 It is a schematic diagram of the side structure of the main body and the fixing component of the detection component of the present invention.

[0033] Fig. 9 The present invention Figure 7 Enlarged structural diagram at A in the middle.

[0034] Fig.10 It is a schematic diagram of the three-dimensional structure of the conductive component of the present invention.

[0035] Fig.11 It is a schematic diagram of the structure of the sleeve and the lifting conductive column in Example 1 of the present invention.

[0036] Fig.12 It is a schematic diagram of the structure of the sleeve and the lifting conductive column in Example 2 of the present invention.

[0037] In the figure:

[0038] 1 is the main body; 11 is the slide groove; 12 is the limit groove; 100 is the chip power device body; 2 is the detection component; 21 is the base; 22 is the detection circuit board; 221 is the sleeve; 222 is the lifting conductive column; 23 is the support plate; 24 is the copper column; 25 is the top plate; 26 is the lifting member; 261 is the slide rod; 2611 is the buffer spring; 262 is the movable plate; 3 is the pressing component; 31 is the support member; 311 is the telescopic driving member; 4 is the fixing component; 41 is the slider; 42 is the lifter; 43 is the pressing plate; 44 is the fixing bolt; 45 is the fixing nut; 5 is the conductive component; 51 is the sliding member; 511 is the rotating shaft; 521 is the rotating member; 52 is the adjusting screw; 53 is the clamping member; 531 is the contact; 54 is the torsion spring. DETAILED DESCRIPTION

[0039] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0040] Embodiment 1:

[0041] like Figures 1 to 12 As shown, the batch testing device for chip power devices of this embodiment is used for batch testing of chip power device bodies 100, and includes a main body 1. A detection component 2 capable of performing feeding detection on the chip power device body 100 is arranged at the center position of the top of the main body 1. The detection component 2 includes a detection circuit board 22 for inserting pins on the chip power device body 100 and can detect the chip power device body 100. The detection component 2 also includes a base 21 arranged on the top of the main body 1 and used to position the detection circuit board 22. The detection component 2 also includes a support plate 23 arranged on the top of the detection circuit board 22, and a groove for limiting the chip power device body 100 is also opened at the center position of the support plate 23. A pressing component 3 capable of pressing the chip power device body 100 onto the detection circuit board 22 is arranged on the main body 1.

[0042] Place the chip power device body 100 in the groove of the support plate 23 to ensure that its position is accurate and stable. The pressing component 3 is in an inactive state and no pressure is applied. Activate the pressing component 3, so that it descends to contact the chip power device body 100, and apply appropriate pressure. The pins of the chip power device body 100 are pressed into the jacks of the detection circuit board 22 to achieve electrical connection. The detection circuit board 22 performs electrical performance tests on the chip power device body 100 through the internal circuit, such as the measurement of parameters such as current, voltage, and power. The detection circuit board 22 transmits the test results to the processing unit in the main body 1 (such as a backend terminal or a control panel, etc., which is a prior art and is not shown in the figure.) The processing unit analyzes and judges the test results to determine whether the performance of the chip power device body 100 is qualified. After the test is completed, the pressing component 3 rises to the original position and releases the pressure on the chip power device body 100. The operator can take out the tested chip power device body 100 and place a new power device body 100 for the next round of testing. This design abandons the traditional welding electrical connection method, effectively avoiding potential damage to the device under test caused by multiple disassembly. At the same time, the disassembly process of the chip power device body 100 becomes simple and efficient, ensuring the consistency of the test conditions of the device under test, greatly protecting the chip power device body 100, and providing convenience for subsequent ultrasonic scanning analysis, electrical parameter measurement, etc.

[0043] The detection circuit board 22 is also provided with a plurality of conductive holes for inserting the pins of the chip power device body 100, and the bottom of the detection circuit board 22 is also provided with a plurality of sleeves 221 corresponding to the conductive holes, the sleeves 221 are electrically connected to the circuit inside the detection circuit board 22, and a lifting conductive column 222 that can move up and down is slidably provided between each sleeve 221, and an elastic structure for resetting the lifting conductive column 222 is also provided between the sleeve 221 and the lifting conductive column 222, and the elastic structure also has a conductive function, and the lifting conductive column 222 extends into the conductive hole.

[0044] When the chip power device body 100 is pressed on the detection circuit board 22 by the pressing component 3, the pin is inserted into the conductive hole and contacts the lifting conductive column 222. The lifting conductive column 222 moves downward under the pressure of the pin while maintaining electrical connection with the sleeve 221. The detection circuit board 22 performs electrical performance testing on the chip power device body 100 through the internal circuit. When the pin of the chip power device body 100 contacts the lifting conductive column 222, the circuit is turned on. This design effectively avoids direct friction between the pin and the conductive hole, thereby significantly reducing the risk of poor contact.

[0045] In this embodiment, Fig.11 As shown, the elastic structure is a spring, the top of the spring is connected to the bottom of the lifting conductive column 222, and the bottom of the spring is connected to the bottom of the sleeve 221. When the pin of the SMD power device body 100 is inserted into the conductive hole, the lifting conductive column 222 contacts the pin and transmits an electrical signal to the internal circuit of the detection circuit board 22. The lifting conductive column 222 can maintain its initial position under the restoring force of the spring, ready to contact the pin. When the pin is inserted into the conductive hole and pressure is applied, the lifting conductive column 222 moves downward, compresses the spring, and maintains good contact with the pin.

[0046] The lifting conductive column 222 can move freely in the sleeve 221 to adapt to pins of different lengths. At the same time, an elastic structure is integrated inside the sleeve 221 to ensure that the lifting conductive column 222 can be in close contact with the pin and achieve length compensation. This feature enables the detection device of the present application to be compatible with the chip power device body 100 with different pin lengths, greatly improving the versatility and flexibility of the detection.

[0047] like Figure 1-5As shown, the detection component 2 includes four copper pillars 24 vertically arranged at the four corners of the support plate 23, the detection component 2 also includes a top plate 25 installed on the top of the copper pillar 24, the detection component 2 also includes a lifting member 26 and a slide bar 261 installed at the bottom of the lifting member 26, and the slide bar 261 and the top plate 25 are slidably matched, and a movable plate 262 capable of pressing the chip power device body 100 onto the detection circuit board 22 is provided at the bottom of the slide bar 261, and a buffer spring 2611 is sleeved on the upper part of the slide bar 261, one end of the buffer spring 2611 is connected to the top of the top plate 25, and the other end of the buffer spring 2611 is connected to the bottom of the lifting member 26, and the pressing component 3 can drive the lifting member 26 to move up and down to enable the movable plate 262 to press the chip power device body 100 onto the detection circuit board 22.

[0048] The lifting member 26 is in the initial position, and the movable plate 262 maintains a certain height under the action of the buffer spring 2611 and does not contact the chip power device body 100. The chip power device body 100 is placed on the detection circuit board 22, and the pins are aligned with the conductive holes. The pressing component 3 is started, driving the lifting member 26 to move downward. The lifting member 26 drives the slide bar 261 and the movable plate 262 to move downward together, and the buffer spring 2611 is compressed. The buffer spring 2611 provides a buffering effect to absorb the impact when the lifting member 26 moves up and down. The movable plate 262 contacts and presses the chip power device body 100, fixes it on the detection circuit board 22, and the pins are inserted into the conductive holes and contact the lifting conductive column 222. The chip power device body 100 is stably pressed on the detection circuit board 22, and the detection circuit board 22 performs an electrical performance test on the chip power device body 100 through the internal circuit. After the test is completed, the pressing component 3 drives the lifting member 26 to move upward. The lifting member 26 drives the slide bar 261 and the movable plate 262 to move upwards, and the buffer spring 2611 returns to its original shape. The movable plate 262 leaves the SMD power device body 100, and is ready for the next round of testing.

[0049] like Figure 1-5 As shown, the pressing assembly 3 includes a support member 31 vertically fixed on the back of the main body 1, and a telescopic driving member 311 capable of driving the lifting member 26 to move up and down is vertically arranged on the top of the support member 31. The telescopic driving member 311 can be a cylinder, a hydraulic cylinder, an electric push rod, etc. The output end of the telescopic driving member 311 passes through the support member 31 and can be detachably connected to the lifting member 26.

[0050] like Figure 7-10 As shown, a limiting groove 12 is provided at the front of the main body 1 along its width direction, and a conductive component 5 that can be pressed on the detection circuit board 22 is also provided on the main body 1, and the conductive component 5 can move in the limiting groove 12 to adjust the position of the conductive component 5.

[0051] The conductive component 5 includes a sliding member 51 that can slide in the limiting groove 12, and the conductive component 5 also includes an adjusting screw 52 that is rotatably arranged along the length direction of the limiting groove 12. The adjusting screw 52 is connected to the sliding member 51 through a thread. A rotating shaft 511 is also provided on the sliding member 51. A clamping member 53 is rotatably arranged on the rotating shaft 511. A contact 531 corresponding to the power supply position on the detection circuit board 22 is also provided on the clamping member 53 near the detection circuit board 22. The conductive component 5 also includes a torsion spring 54 that is sleeved on the rotating shaft 511 and is used to press the contact 531 against the power supply position on the detection circuit board 22. One end of the torsion spring 54 contacts the sliding member 51, and the other end of the torsion spring 54 contacts the clamping member 53. A rotating member 521 is also provided on the adjusting screw 52.

[0052] The rotating member 521 is rotated to drive the adjusting screw 52 to rotate. The adjusting screw 52 drives the sliding member 51 to slide in the limiting groove 12 through a threaded connection. The sliding member 51 drives the rotating shaft 511, the clamping member 53 and the contact 531 to move together, and adjusts the position of the contact 531 so that it is aligned with the power supply on the detection circuit board 22. Under the torsion of the torsion spring 54, the clamping member 53 rotates around the rotating shaft 511, so that the contact 531 is pressed on the power supply of the detection circuit board 22. The contact 531 maintains good contact with the power supply to transmit electrical signals or power. The detection circuit board 22 receives electrical signals or power through the contact 531 to test the electrical performance of the chip power device body. The conductive component 5 maintains stable contact to ensure the smooth progress of the test process. After the test is completed, if it is necessary to adjust the position of the contact 531 or replace the detection circuit board 22, the rotating member 521 can be rotated again to drive the sliding member 51 to slide in the limiting groove 12 to adjust the position of the contact 531.

[0053] By adjusting the design of the screw 52 and the sliding member 51, the position of the contact 531 can be flexibly adjusted to meet the requirements of different detection circuit boards 22. The introduction of the torsion spring 54 provides continuous torque to ensure stable contact between the contact 531 and the power supply, thereby improving the accuracy and reliability of the test.

[0054] Both sides of the main body 1 are also provided with at least two groups of slide grooves 11 along the length direction thereof, and both sides of the top of the main body 1 are also provided with fixing components 4 capable of fixing the base 21, and both sides of the base 21 are also provided with protrusions, and the fixing component 4 includes a slider 41 capable of sliding on the slide groove 11, and the fixing component 4 also includes a lifter 42 arranged on the main body 1, and a pressure plate 43 is placed on the lifter 42, and a fixing bolt 44 is provided on the slider 41, and a fixing nut 45 is screwed on the fixing bolt 44, and the fixing nut 45 presses the protrusion on the base 21 to the top of the main body 1 through the pressure plate 43, and the lifter 42 can adjust its own height.

[0055] A method for testing a chip power device, including a batch testing device for a chip power device in the above scheme, comprises the following steps:

[0056] S1: Place the detection circuit board 22 between the base 21 and the support plate 23 and fix it. Place the detection component 2 on the main body 1 and fix the detection component 2 with the fixing component 4 to complete the preparation before the test.

[0057] S2: By rotating the rotating member 521, the rotating member 521 rotates the adjusting screw 52, ​​and the adjusting screw 52 moves the sliding member 51 so that the clamping member 53 is close to the detection circuit board 22. Then, by pressing the clamping member 53, the clamping member 53 is opened, and then the clamping member 53 is close to the top of the power supply part of the detection circuit board 22. The torsion spring 54 rotates the clamping member 53 to drive the contact 531 to press on the power supply part on the detection circuit board 22.

[0058] S3: Place the chip power device body 100 to be tested into the groove in the support plate 23, insert the pins of the chip power device body 100 into the conductive holes in the detection circuit board 22, and the telescopic drive member 311 moves the lifting member 26 downward, thereby causing the movable plate 262 to press the chip power device body 100 onto the detection circuit board 22. The pins on the chip power device body 100 can move the lifting conductive column 222 downward, and the chip power device body 100 is detected by the detection circuit board 22, and the detection information is sent to the background terminal. After the detection is completed, the chip power device body 100 is taken out.

[0059] Embodiment 2:

[0060] Compared with Example 1, Fig.12 As shown, the elastic structure is a spring. The spring is usually made of a metal sheet and has a certain elasticity and toughness. When the lifting conductive column 222 is subjected to pressure, the spring will deform and store elastic potential energy. Under the restoring force of the spring, the lifting conductive column 222 maintains its initial position and is ready to contact the pin. When the pin is inserted into the conductive hole and pressure is applied, the lifting conductive column 222 moves downward, and the spring is deformed at the same time.

[0061] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A batch testing device for chip power devices, used for batch testing of chip power device bodies (100), characterized in that: The patch power device batch testing device comprises a main body (1); a detection component (2) capable of performing feeding detection on a patch power device body (100) is arranged at the center position of the top of the main body (1); the detection component (2) comprises a detection circuit board (22) capable of inserting pins on the patch power device body (100) and capable of detecting the patch power device body (100); the detection component (2) further comprises a base (21) arranged at the top of the main body (1) and used for positioning the detection circuit board (22); the detection component (2) further comprises a support plate (23) arranged at the top of the detection circuit board (22); a groove for limiting the patch power device body (100) is also opened at the center position of the support plate (23); and a pressing component (3) capable of pressing the patch power device body (100) onto the detection circuit board (22) is arranged on the main body (1).

2. A batch testing device for SMD power devices according to claim 1, characterized in that: The detection circuit board (22) is also provided with a plurality of conductive holes for inserting pins of the chip power device body (100), and the bottom of the detection circuit board (22) is also provided with a plurality of sleeves (221) corresponding to the conductive holes, the sleeves (221) are electrically connected to the circuit inside the detection circuit board (22), and a lifting conductive column (222) capable of moving up and down is slidably provided between each sleeve (221), and an elastic structure for resetting the lifting conductive column (222) is also provided between the sleeve (221) and the lifting conductive column (222), and the lifting conductive column (222) extends into the conductive hole.

3. A batch testing device for patch power devices according to claim 2, characterized in that: The elastic structure is a spring, the top end of the spring is connected to the bottom end of the lifting conductive column (222), and the bottom end of the spring is connected to the bottom end inside the sleeve (221).

4. A batch testing device for SMD power devices according to claim 2, characterized in that: The elastic structure is a spring sheet.

5. A batch testing device for SMD power devices according to claim 1, characterized in that: The detection component (2) comprises four copper pillars (24) respectively arranged vertically at the four corners of the support plate (23); the detection component (2) also comprises a top plate (25) installed on the top of the copper pillars (24); the detection component (2) also comprises a lifting member (26) and a sliding rod (261) installed at the bottom of the lifting member (26); the sliding rod (261) and the top plate (25) are slidably matched; the bottom of the sliding rod (261) is provided with a The movable plate (262) is mounted on the detection circuit board (22), and a buffer spring (2611) is sleeved on the upper part of the slide bar (261), one end of the buffer spring (2611) is connected to the top of the top plate (25), and the other end of the buffer spring (2611) is connected to the bottom of the lifting member (26), and the pressing component (3) can drive the lifting member (26) to move up and down to enable the movable plate (262) to press the chip power device body (100) onto the detection circuit board (22).

6. A batch testing device for SMD power devices according to claim 5, characterized in that: The pressing assembly (3) comprises a support member (31) vertically fixed to the back of the main body (1); a telescopic driving member (311) capable of driving the lifting member (26) to move up and down is vertically arranged on the top of the support member (31); the output end of the telescopic driving member (311) passes through the support member (31) and is detachably connected to the lifting member (26).

7. A batch testing device for SMD power devices according to claim 1, characterized in that: A limiting groove (12) is provided at the front of the main body (1) along its width direction, and a conductive component (5) capable of being pressed onto the detection circuit board (22) is also provided on the main body (1), and the conductive component (5) can be moved in the limiting groove (12) to adjust the position of the conductive component (5).

8. A batch testing device for SMD power devices according to claim 7, characterized in that: The conductive component (5) comprises a sliding member (51) capable of sliding in the limiting groove (12), and the conductive component (5) also comprises an adjusting screw (52) rotatably arranged along the length direction of the limiting groove (12), the adjusting screw (52) being connected to the sliding member (51) by means of a thread, the sliding member (51) is also provided with a rotating shaft (511), a clamping member (53) is rotatably arranged on the rotating shaft (511), a contact (531) corresponding to a power supply location on the detection circuit board (22) is also arranged at a position of the clamping member (53) close to the detection circuit board (22), the conductive component (5) also comprises a torsion spring (54) sleeved on the rotating shaft (511) for pressing the contact (531) against the power supply location on the detection circuit board (22), one end of the torsion spring (54) is in contact with the sliding member (51), and the other end of the torsion spring (54) is in contact with the clamping member (53), and the adjusting screw (52) is also provided with a rotating member (521).

9. A batch testing device for SMD power devices according to claim 1, characterized in that: The main body (1) is also provided with at least two groups of slide grooves (11) along its length direction on both sides, and the main body (1) is also provided with fixing components (4) capable of fixing the base (21) on both sides of the top, and the base (21) is also provided with protrusions on both sides, and the fixing component (4) includes a slider (41) capable of sliding on the slide groove (11), and the fixing component (4) also includes a lifter (42) arranged on the main body (1), and a pressure plate (43) is also placed on the lifter (42), and a fixing bolt (44) is provided on the slider (41), and a fixing nut (45) is screwed on the fixing bolt (44), and the fixing nut (45) presses the protrusion on the base (21) onto the top of the main body (1) through the pressure plate (43), and the lifter (42) can adjust its own height.

10. A method for testing a chip power device, using a chip power device batch testing device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: placing the detection circuit board (22) between the base (21) and the support plate (23) and fixing them, placing the detection component (2) on the main body (1), and fixing the detection component (2) by the fixing component (4) to complete the preparation before the test; S2: By rotating the rotating member (521), the rotating member (521) causes the adjusting screw (52) to rotate, and the adjusting screw (52) causes the sliding member (51) to move so that the clamping member (53) approaches the detection circuit board (22), and then, by pressing the clamping member (53), the clamping member (53) is opened, and then the clamping member (53) approaches the top of the power supply part of the detection circuit board (22), and the torsion spring (54) causes the clamping member (53) to rotate and drive the contact (531) to press on the power supply part on the detection circuit board (22); S3: The chip power device body (100) to be tested is placed in the groove in the support plate (23), the pins of the chip power device body (100) are inserted into the conductive holes in the detection circuit board (22), the telescopic driving member (311) causes the lifting member (26) to move downward, and then the movable plate (262) presses the chip power device body (100) onto the detection circuit board (22), the pins on the chip power device body (100) can cause the lifting conductive column (222) to move downward, the chip power device body (100) is detected by the detection circuit board (22), and the detection information is sent to the background terminal. After the detection is completed, the chip power device body (100) is taken out.

Images