A heat dissipation structure for a high-speed optical module and a high-speed optical module

Abstract

The present invention relates to the technical field of high-speed optical modules, and particularly relates to a heat dissipation structure for a high-speed optical module and a high-speed optical module. The heat dissipation structure for the high-speed optical module includes: a heat dissipation housing, an installation cavity is formed in the heat dissipation housing, and the installation cavity is used for installing functional components of the high-speed optical module; a heat dissipation component, the heat dissipation component is arranged in the installation cavity and is connected to the functional components for dissipating heat from the functional components; heat dissipation fins, the heat dissipation fins are arranged on the heat dissipation housing and are close to the heat dissipation component. The purpose is to optimize the heat dissipation structure of the high-speed optical module, conduct the heat of the core heat-generating components that cannot directly export heat out indirectly and quickly through the heat dissipation structure, thereby improving the heat dissipation effect of the entire module, reducing the influence of heat dissipation on the operation of the module, and improving the performance and use stability of the module.

Description

Technical Field

[0001] The present invention relates to the technical field of high-speed optical modules, and particularly to a heat dissipation structure and a high-speed optical module for a high-speed optical module. Background Art

[0002] With the rapid development of information technology, the requirements for the speed and capacity of data transmission are constantly increasing. As a key component in an optical communication network, a high-speed optical module undertakes the important task of converting an electrical signal into an optical signal and performing high-speed transmission. The quality of its performance directly affects the operation efficiency and stability of the entire optical communication system. During the operation of a high-speed optical module, a large amount of heat is generated due to the high-speed rotation of internal electronic components and optical devices. Moreover, the heat-generating components cannot directly contact the external housing for heat transfer. If this heat cannot be dissipated in a timely and effective manner, the temperature inside the module will rise sharply. Excessively high temperature will not only affect the performance of the electronic components in the optical module, causing their operating parameters to drift, reducing the transmission quality of signals, and increasing the bit error rate; it will also have a negative impact on the light-emitting efficiency and lifespan of the optical devices, accelerating the aging of the optical devices, and even causing the optical module to malfunction severely in serious cases.

[0003] Currently, the common heat dissipation methods for high-speed optical modules in the market mainly include natural heat dissipation, air-cooled heat dissipation, and simple heat sink heat dissipation, etc. The natural heat dissipation method relies only on the natural heat exchange between the module itself and the surrounding environment for heat dissipation, and the heat dissipation efficiency is extremely low, which is only applicable to some low-power and low-speed optical modules. Although air-cooled heat dissipation improves the heat dissipation efficiency to a certain extent, it requires additional equipment such as fans, increasing the complexity and power consumption of the system. At the same time, the fan generates noise during operation, and the reliability of the fan is relatively low, requiring regular maintenance and replacement, which is not applicable to the optical communication field with extremely high requirements for stability and reliability. For simple heat fin heat dissipation, the heat dissipation effect is enhanced by increasing the heat dissipation area. However, for the large amount of heat generated by high-speed optical modules, its heat dissipation capacity is limited and it is difficult to meet the growing heat dissipation requirements. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a heat dissipation structure and a high-speed optical module for a high-speed optical module. By optimizing the heat dissipation structure of the high-speed optical module, the heat generated by the core heat-generating components that cannot directly export heat is indirectly and quickly conducted out through the heat dissipation structure, thereby improving the heat dissipation effect of the entire module, reducing the impact of heat dissipation on the operation of the module, and improving the module performance and usage stability.

[0005] The present invention solves the above technical problems through the following technical means:

[0006] A heat dissipation structure for a high-speed optical module, comprising:

[0007] Heat dissipation housing, an installation cavity is formed inside the heat dissipation housing, and the installation cavity is used for installing functional components of a high-speed optical module;

[0008] Heat dissipation component, the heat dissipation component is arranged inside the installation cavity and is connected to the functional component for dissipating heat from the functional component;

[0009] The heat dissipation component includes a first heat dissipation assembly and a second heat dissipation assembly; when the first heat dissipation assembly and the second heat dissipation assembly are buckled and arranged on the functional component, a closed space is formed to dissipate heat from the functional component in all directions;

[0010] When the first heat dissipation assembly and the second heat dissipation assembly are buckled, a highly thermally conductive adhesive material is arranged at the buckling connection. The highly thermally conductive adhesive material adopts modified thermally conductive silica gel, and the modified thermally conductive silica gel is prepared by taking thermally conductive silica gel as a carrier and graphene aerogel loaded with surface-modified hexagonal boron nitride nanosheets through ultrasonic treatment and vacuum degassing;

[0011] Heat dissipation fins, the heat dissipation fins are arranged on the heat dissipation housing and are close to the heat dissipation component.

[0012] On the basis of the above scheme, the following improvements are also made to this application:

[0013] Further, the heat dissipation housing includes a module cover plate and a module base. The heat dissipation fins are arranged on one side of the module cover plate, a first heat conducting member is arranged on the other side of the module cover plate, a second heat conducting member is arranged on the module base, and the first heat conducting member corresponds to the second heat conducting member.

[0014] According to the above technical means, the functional components and the heat dissipation component of the high-speed optical module can be installed inside through the module cover plate and the module base. When dissipating heat through the heat dissipation component, heat can also be transferred and dissipated up and down between the module cover plate and the module base through the arranged first heat conducting member and the second heat conducting member to improve the heat dissipation efficiency.

[0015] Further, the first heat conducting member is arranged as a first heat conducting protrusion, the first heat conducting protrusion is fixedly arranged on the module cover plate, the second heat conducting member is arranged as a second heat conducting protrusion, the second heat conducting protrusion is fixedly arranged on the module base, and the first heat conducting protrusion and the second heat conducting protrusion are arranged oppositely;

[0016] First heat transfer members are arranged at the free ends of the first heat conducting protrusion and the second heat conducting protrusion.

[0017] According to the above technical means, by arranging the heat conducting member as a heat conducting protrusion, it is convenient for heat transfer up and down between the module cover plate and the module base, and by arranging the first heat transfer member, the heat transfer efficiency is improved.

[0018] Furthermore, the first heat dissipation component includes a heat dissipation cover, a partition board, and a second heat transfer member. The partition board is fixedly arranged inside the heat dissipation cover and is used for separating the heat dissipation cover to form a first groove and a second groove. The first groove and the second groove are used for dissipating heat from and enclosing the functional components. The second heat transfer member is arranged on the heat dissipation cover and is in contact with the heat dissipation housing.

[0019] According to the above technical means, through the setting of the heat dissipation cover, heat can be dissipated from the functional components. Then, through the second heat conduction member, the heat can be quickly transferred to the heat dissipation housing, accelerating heat dissipation. At the same time, the functional components are covered to prevent dust and the like from entering the functional components.

[0020] Furthermore, the first heat dissipation component further includes a plurality of clamping blocks, and the plurality of clamping blocks are respectively arranged at the edges of the heat dissipation cover.

[0021] According to the above technical means, by setting the clamping blocks, on the one hand, it can be more stably installed on the functional components, and heat can also be dissipated when contacting the functional components, thereby enhancing the heat dissipation performance; on the other hand, it is convenient to engage with the second heat dissipation component, so as to form a closed heat dissipation space with the second heat dissipation component.

[0022] Furthermore, the second heat dissipation component includes a bottom plate, a heat dissipation table, and a third heat transfer member. The heat dissipation table is arranged on the bottom plate and corresponds to the functional components. The third heat transfer member is arranged on the bottom plate and is in contact with the heat dissipation housing.

[0023] According to the above technical means, heat is dissipated by the contact between the heat dissipation table and the bottom surface of the functional components. With the cooperation of the bottom plate and the third heat transfer member, the heat can be quickly dissipated to the bottom of the heat dissipation housing.

[0024] Furthermore, the functional components have through holes, the area of the functional components is communicated with the area of the heat dissipation table through the through holes, and a fourth heat transfer member is arranged between adjacent two heat dissipation tables.

[0025] According to the above technical means, through the setting of the through holes, the heat dissipation speed can be increased, and by arranging the fourth heat transfer member between the heat dissipation tables, the heat dissipation can be further accelerated, and at the same time, the temperature stability can be maintained.

[0026] Furthermore, the second heat dissipation component further includes two side plates, and the two side plates are respectively fixedly arranged on both sides of the bottom plate, and clamping grooves are provided on both of the two side plates.

[0027] According to the above technical means, by setting the side plates and providing clamping grooves on the side plates, it is convenient to be clamped with the clamping blocks, so as to form a closed heat dissipation space.

[0028] This application also discloses a high-speed optical module, including the above-mentioned high-speed optical module heat dissipation structure.

[0029] By adopting the high-speed optical module with the above heat dissipation structure, the heat dissipation performance of the high-speed optical module can be improved, thereby improving the use stability and service life of the high-speed optical module.

[0030] The present application adopting the above solution has the following beneficial effects:

[0031] 1. In the present application, by making the heat dissipation component contact with the functional component of the high-speed optical module, the heat generated by the core heat-generating components that cannot directly export heat can be indirectly and quickly conducted out through the heat dissipation structure, thereby improving the heat dissipation effect of the entire module, reducing the impact of heat dissipation on the module operation, and improving the module performance and use stability;

[0032] 2. In the present application, by setting the heat dissipation component as the first heat dissipation component and the second heat dissipation component, and respectively arranging them on the upper and lower sides of the functional component, a closed heat dissipation space can also be formed, so that heat dissipation can be carried out from both the module cover plate and the module base, thereby improving the heat dissipation efficiency and maintaining temperature stability;

[0033] 3. In the present application, the first heat dissipation component can not only quickly dissipate heat from the functional component, but also cover the upper part of the functional component to prevent dust and the like from entering the functional component; and cooperate with the second heat dissipation component to quickly dissipate heat from the lower part of the functional component, and there are through holes provided between the functional component and the second heat dissipation component to improve the heat dissipation speed, thereby improving the heat dissipation performance of the high-speed optical module, and thus improving the use stability and service life of the high-speed optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present application can be further illustrated by the non-limiting embodiments given in the drawings;

[0035] Figure 1 is a partial split structure schematic diagram of the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0036] Figure 2 is a schematic diagram of heat conduction in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0037] Figure 3 is a schematic diagram of the structure of the functional component in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0038] Figure 4 is a schematic diagram of the structure of the second heat dissipation component in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0039] Figure 5 is a schematic diagram of the structure of the first heat dissipation component in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0040] Figure 6 is a schematic diagram of the structure of the module base in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0041] Figure 7 It is a schematic structural diagram of the module cover plate in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0042] Main symbol element description:

[0043] 100, module cover plate; 110, heat dissipation fins; 120, first heat conducting member; 130, first accommodating groove; 200, functional component; 210, circuit board; 220, special-shaped through groove; 221, notch; 230, array optical fiber jumper; 240, optical connector; 250, coupling lens; 260, first heating chip; 270, second heating chip; 280, third heating chip; 290, fourth heating chip;

[0044] 300, module base; 310, second heat conducting member; 320, second accommodating groove;

[0045] 400, heat dissipation component; 410, second heat dissipation assembly; 411, bottom plate; 412, first heat dissipation table; 413, second heat dissipation table; 414, third heat dissipation table; 415, side plate; 416, card slot; 420, first heat dissipation assembly; 421, heat dissipation cover; 422, partition; 423, first groove; 424, second groove; 425, clamping block. Detailed implementation manners

[0046] The following describes the implementation manners of the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. It should be noted that the drawings provided in the following embodiments are only for illustrative purposes, showing only schematic diagrams, not physical diagrams, and should not be construed as a limitation to the present invention. In order to better illustrate the embodiments of the present invention, some components in the drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0047] In the drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and should not be construed as a limitation to the present invention. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances:

[0048] It should be noted that the illustrations provided in the following embodiments only schematically illustrate the basic concept of the present invention. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0049] As Figures 1-7 shown, an embodiment of the present application discloses a heat dissipation structure for a high-speed optical module, including a heat dissipation housing, a heat dissipation component 400, and heat dissipation fins 110. An installation cavity is formed in the heat dissipation housing, and the installation cavity is used to install the functional components 200 of the high-speed optical module. The heat dissipation component 400 is disposed in the installation cavity and is connected to the functional component 200 for dissipating heat from the functional component 200. The heat dissipation fins 110 are disposed on the heat dissipation housing and are close to the heat dissipation component 400 for increasing the heat dissipation area and improving the heat dissipation capacity.

[0050] In this embodiment, as Figure 3 shown, the functional component 200 includes a circuit board 210, a first heating chip 260, a second heating chip 270, a third heating chip 280, a fourth heating chip 290, an array fiber optic jumper 230, a coupling lens 250, and an optical connector 240. One end of the array fiber optic jumper 230 is connected to the optical connector 240, and the other end is connected to the coupling lens 250. The coupling lens 250 is coupled to the second heating chip 270 and the fourth heating chip 290. The third heating chip 280 and the fourth heating chip 290 are mounted on the surface of the circuit board 210. The first heating chip 260 and the second heating chip 270 are mounted on the heat dissipation component 400 and are electrically connected to the front surface of the circuit board 210.

[0051] In this embodiment, a special-shaped through groove 220 is provided on the circuit board 210 for improving electrical performance, increasing the heat dissipation area, and mounting the first heating chip 260 and the second heating chip 270. Notches 221 are also provided on both sides of the circuit board 210 to facilitate the installation of the heat dissipation component 400. Through holes are provided on the circuit board 210 at the positions of the third heating chip 280 and the fourth heating chip 290 for corresponding to the heat dissipation component 400.

[0052] In this embodiment, as Figure 1 and Figures 6-7As shown, the heat dissipation housing includes a module cover plate 100 and a module base 300. Heat dissipation fins 110 are arranged on the upper side of the module cover plate 100 and close to one side of the upper part of the heat dissipation component 400, which is used to increase the heat dissipation area and improve the heat dissipation capacity. A first heat conducting member 120 is arranged inside the module cover plate 100, and a second heat conducting member 310 is arranged on the module base 300. The first heat conducting member 120 corresponds to the second heat conducting member 310. When the module cover plate 100 and the module base 300 are closed, the first heat conducting member 120 and the second heat conducting member 310 are in contact, so that heat is transferred and dissipated up and down between the module cover plate 100 and the module base 300, thereby improving the heat dissipation efficiency.

[0053] In this embodiment, the first heat conducting member 120 is arranged as a first heat conducting protrusion, and the first heat conducting protrusion is fixedly arranged on the module cover plate 100. The second heat conducting member 310 is arranged as a second heat conducting protrusion, and the second heat conducting protrusion is fixedly arranged on the module base 300. The first heat conducting protrusion and the second heat conducting protrusion are opposite to each other, that is, they can be directly abutted against each other or have a gap therebetween.

[0054] In some embodiments, when there is a gap between the opposite ends of the first heat conducting protrusion and the second heat conducting protrusion, first heat transfer members are arranged at the free ends of the first heat conducting protrusion and the second heat conducting protrusion to increase the heat transfer efficiency and reduce the thermal resistance. When the opposite ends of the first heat conducting protrusion and the second heat conducting protrusion are directly abutted against each other, heat can be transferred by direct contact.

[0055] The first heat conducting protrusion and the second heat conducting protrusion are made of high thermal conductivity materials, for example, copper protrusions, silicon carbide protrusions, graphene protrusions, aluminum nitride protrusions, and so on.

[0056] In this embodiment, as Figure 1 and Figures 4-5 shown, the heat dissipation component 400 includes a first heat dissipation assembly 420 and a second heat dissipation assembly 410. The first heat dissipation assembly 420 and the second heat dissipation assembly 410 can be arranged on the upper and lower sides of the first heating chip 260, the second heating chip 270, the third heating chip 280, and the fourth heating chip 290, and cooperate with the module cover plate 100 and the module base 300 to form a sandwich-type heat dissipation. The first heat dissipation assembly 420 and the second heat dissipation assembly 410 can also cover the upper and lower sides of the first heating chip 260, the second heating chip 270, the third heating chip 280, and the fourth heating chip 290 to form a closed heat dissipation space, which can not only dissipate heat efficiently but also reduce the influence of heat on other components.

[0057] In this embodiment, when the first heat dissipation assembly 420 and the second heat dissipation assembly 410 are arranged on the upper and lower sides of the first heating chip 260, the second heating chip 270, the third heating chip 280, and the fourth heating chip 290 to form a sandwich-type heat dissipation:

[0058] AsFigure 5 As shown, the first heat dissipation component 420 includes a heat dissipation cover 421, a partition 422, and a second heat transfer member. The partition 422 is integrally formed within the heat dissipation cover 421 and is used to divide the heat dissipation cover 421 to form a first groove 423 and a second groove 424 for dissipating heat from and enclosing the upper region of the functional component 200. The second heat transfer member is disposed on the outer surface of the heat dissipation cover 421 and contacts the heat dissipation housing to quickly transfer heat to the module cover plate 100.

[0059] As Figure 4 shown, the second heat dissipation component 410 includes a bottom plate 411, a heat dissipation platform, and a third heat conduction member. The heat dissipation platform is disposed on the bottom plate 411 and corresponds to the functional component 200 for dissipating heat from the lower region of the functional component 200. The third heat conduction member is disposed on the bottom plate 411 and contacts the heat dissipation housing to quickly transfer heat to the module base 300.

[0060] In this embodiment, both the heat dissipation cover 421 and the partition 422 are made of high thermal conductivity materials, such as diamond, copper, silicon carbide, graphene, aluminum nitride, and so on. The first groove 423 and the second groove 424 can respectively enclose the first heating chip 260, the second heating chip 270, the fourth heating chip 290, and the coupling lens 250 within the first groove 423 and the second groove 424 and fit with the upper surfaces of the first heating chip 260, the second heating chip 270, the fourth heating chip 290, and the coupling lens 250, serving as a protective box while dissipating heat and preventing impurities such as dust from entering. At this time, the third heating chip 280 is located outside the heat dissipation cover 421, and a second heat transfer member is also provided between the third heating chip 280 and the inner side surface of the module cover plate 100 to quickly transfer the heat of the third heating chip 280 to the module cover plate 100.

[0061] In another embodiment, the heat dissipation cover 421 can also cover the third heating chip 280 while dissipating heat from and protecting the third heating chip 280.

[0062] The second heat transfer member is also made of a high thermal conductivity material, such as diamond, copper, silicon carbide, graphene, aluminum nitride, and so on. The second heat transfer member can be fabricated into a circular shape, a square shape, and so on, and the material used can be the same as or different from the material of the heat dissipation cover 421. The module cover plate 100 has a first receiving groove 130. The lower surface of the second heat transfer member contacts the upper surface of the heat dissipation cover 421, and the upper surface of the second heat transfer member is located within the first receiving groove 130, enabling the heat generated by the first heating chip 260, the second heating chip 270, and the fourth heating chip 290 during operation to be quickly transferred to the module cover plate 100 through the heat dissipation cover 421 and the second heat transfer member, thereby quickly dissipating heat.

[0063] In this embodiment, both the bottom plate 411 and the heat dissipation platform are made of high thermal conductivity materials, such as copper, silicon carbide, graphene, aluminum nitride, and so on. There are multiple heat dissipation platforms, preferably 3. The 3 heat dissipation platforms and the bottom plate 411 can be fixed by welding, screwing, riveting, etc., or can be integrally formed. Integral formation is preferred as it is convenient for processing and molding, and at the same time, the heat transfer effect will not be affected by the addition of other materials.

[0064] The 3 heat dissipation platforms are divided into a first heat dissipation platform 412, a second heat dissipation platform 413, and a third heat dissipation platform 414. The first heat dissipation platform 412 and the second heat dissipation platform 413 respectively correspond to the first heating chip 260 and the second heating chip 270. The first heating chip 260 and the second heating chip 270 are respectively mounted on the first heat dissipation platform 412 and the second heat dissipation platform 413, and are electrically connected to the front surface of the circuit board 210 through the special-shaped through holes 220 on the circuit board 210. The third heat dissipation platform 414 corresponds to the fourth heating chip 290. There is a through hole between the fourth heating chip 290 and the circuit board 210, so that when the fourth heating chip 290 is working, heat can be directly or indirectly transferred to the third heat dissipation platform 414 through the circuit board 210 and the through hole, accelerating heat dissipation. Through heat transfer by the circuit board 210 and heat transfer through the through hole, compared with direct heat transfer by the circuit board 210, the heat dissipation efficiency is higher and the temperature stability is more reliable.

[0065] The third heat conducting member is arranged on the lower surface of the bottom plate 411. A second receiving groove 320 is arranged on the module base 300. The upper surface of the third heat transfer member contacts the outer surface of the base, and the lower surface of the third heat transfer member is located in the second receiving groove 320, so that heat can be quickly transferred to the module base 300 through the heat dissipation platform, the bottom plate 411, and the third heat conducting member, thereby dissipating heat, and through the first heat conducting member 120 and the second heat conducting member 310, the heat is transferred to the module cover 100, further accelerating heat dissipation.

[0066] In this embodiment, the third heat transfer member is also made of high thermal conductivity materials, such as diamond, copper, silicon carbide, graphene, aluminum nitride, and so on. The third heat transfer member can be prepared into a circular shape, a square shape, etc. The materials used can be the same as or different from the materials of the heat dissipation cover 421.

[0067] In another embodiment, the third heating chip 280 can also correspond to the second heat dissipation platform 413. At this time, there is also a through hole between the third heating chip 280 and the circuit board 210, so that when the third heating chip 280 is working, heat can be directly or indirectly transferred to the second heat dissipation platform 413 through the circuit board 210 and the through hole, accelerating heat dissipation. Through heat transfer by the circuit board 210 and heat transfer through the through hole, compared with direct heat transfer by the circuit board 210, the heat dissipation efficiency is higher and the temperature stability is more reliable.

[0068] In this embodiment, a fourth heat-conducting member is provided between the first heat dissipation table 412, the second heat dissipation table 413, and the third heat dissipation table 414. The fourth heat-conducting member can be set as heat-conducting silica gel, heat-conducting gel, etc., to connect the heat dissipation tables, which is beneficial to maintaining the temperature stability.

[0069] In this embodiment, when the first heat dissipation assembly 420 and the second heat dissipation assembly 410 can cover the upper and lower sides of the first heating chip 260, the second heating chip 270, the third heating chip 280, and the fourth heating chip 290 to form a closed heat dissipation space, the first heat dissipation assembly 420 and the second heat dissipation assembly 410 not only include the structures of the above embodiments, but also include the following structures:

[0070] The first heat dissipation assembly 420 further includes a plurality of clamping blocks 425, and the plurality of clamping blocks 425 are respectively arranged at the edges of the heat dissipation cover 421.

[0071] The second heat dissipation assembly 410 further includes two side plates 415, and the two side plates 415 are respectively fixedly arranged on both sides of the bottom plate 411. Slots 416 are formed on both of the two side plates 415.

[0072] When the first heat dissipation assembly 420 and the second heat dissipation assembly 410 are engaged and cover the upper and lower sides of the first heating chip 260, the second heating chip 270, the third heating chip 280, and the fourth heating chip 290, the clamping blocks 425 are clamped in the slots 416 to form a closed structure. Through the cooperation of the clamping blocks 425 and the slots 416, it can be more stably installed on the circuit board 210, and heat dissipation can also be carried out when contacting the edge of the circuit board 210, cooperating with the heat dissipation of the first heat dissipation assembly 420 and the second heat dissipation assembly 410 for the heating chips, thereby enhancing the heat dissipation performance.

[0073] In this embodiment, the clamping blocks 425 and the heat dissipation cover 421 are arranged at the edge of the heat dissipation cover 421 by an integral molding method, and the side plates 415 and the slots 416 are formed on the bottom plate 411 by an integral molding method. It is not only convenient for processing, but also made of the same high heat-conducting material, which is beneficial to heat dissipation.

[0074] In this embodiment, a high heat-conducting adhesive material is provided at the connection between the clamping blocks 425 and the slots 416, such as modified heat-conducting silica gel, heat-conducting gel, heat-conducting epoxy glue, heat-conducting double-sided tape, etc. By providing the high heat-conducting adhesive material, on the one hand, it can make the first heat dissipation assembly 420 and the second heat dissipation assembly 410 more stably installed, and on the other hand, it can improve the sealing performance of the connection. At the same time, it will not affect the heat dissipation effect.

[0075] In this embodiment, the high heat-conducting adhesive material uses modified heat-conducting silica gel, and the modified heat-conducting silica gel is prepared by loading nano heat-conducting materials with heat-conducting silica gel as the carrier. The specific preparation method includes the following steps:

[0076] Place the hexagonal boron nitride nanosheets in a 3-aminopropyltriethoxysilane solution and react for 1-2 h while stirring to obtain surface-modified hexagonal boron nitride nanosheets. Filter and then dry to obtain the surface-modified hexagonal boron nitride nanosheets after drying.

[0077] Add 10 parts by weight of the surface-modified hexagonal boron nitride nanosheets to 30 parts by weight of a graphene oxide solution with a concentration of 2-4 mg / mL, and then add 0.1 part by weight of an ethylenediamine crosslinking agent. Ultrasonic for 30 min under the condition of 200-300 W to obtain a self-assembled liquid.

[0078] After the self-assembled liquid is sub-packed, it is packed in a forming mold, and then freeze-dried under the condition of -20~-30 °C to obtain a graphene aerogel loaded with hexagonal boron nitride nanosheets. Then place the graphene gel in an acetic acid solution and reduce it at 85 °C for 2 h, filter and wash it 3 times with deionized water to obtain reduced graphene oxide. At the same time, the amino group on the surface of the hexagonal boron nitride nanosheets forms an amide bond with the carboxyl group of the reduced graphene oxide to obtain a graphene aerogel with enhanced interfacial bonding.

[0079] Ultrasonic 5 parts by weight of thermally conductive silica gel and 2 parts by weight of graphene aerogel for 30 min under the condition of 800-1000 W, mix evenly, and then perform vacuum degassing to obtain modified thermally conductive silica gel. Through testing, the in-plane thermal conductivity of the modified thermally conductive silica gel is 28.4 W / m·K, and the out-of-plane thermal conductivity is increased to 3.6 W / m·K. There is a certain adhesiveness on the surface, which can reduce the thermal resistance between the chuck 425 and the card slot 416, thereby accelerating heat dissipation.

[0080] In this embodiment, since the heating chip in the functional component 200 is the main heat source of the module, it directly or indirectly conducts heat to the second heat dissipation component 410 and then transfers it to the module base 300. At the same time, the heat directly or indirectly passes through the first heat dissipation component 420 and is transferred to the module cover 100. Since the upper surface of the module cover 100 is the main heat dissipation surface, in addition to its own heat dissipation, part of the heat of the module base 300 will be conducted to the module cover 100 through the first heat conducting member 120, the second heat conducting member 310 and the contact surface, and finally the heat is dissipated through the heat dissipation fins 110 provided on the module cover 100 and exchanged with the external environment. This way makes full use of the internal space of the module, increases the heat transfer area, can accelerate the overall heat dissipation of the module, and thus improves the heat dissipation ability of the entire module.

[0081] The embodiment of the present application also discloses a high-speed optical module, including the high-speed optical module heat dissipation structure in the above embodiment.

[0082] By adopting the heat dissipation structure of the high-speed optical module in the above embodiments, the heat dissipation performance of the high-speed optical module can be improved, thereby improving the use stability and service life of the high-speed optical module.

[0083] The above provides a detailed introduction to a heat dissipation structure and a high-speed optical module of the present invention. The description of specific embodiments is only used to help understand the method and its core idea of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

[0084] It should be noted that the "one embodiment", "embodiment", "some optional embodiments", "exemplary embodiments", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include specific features, structures or characteristics, but not necessarily each embodiment includes such specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. Moreover, when combining specific features, structures or characteristics with an embodiment, implementing such features, structures or characteristics in combination with other embodiments, whether explicitly or implicitly described, is within the knowledge scope of those skilled in the art.

[0085] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation structure for a high-speed optical module, characterized in that, Comprising: A heat dissipation housing, within which an installation cavity is formed, and the installation cavity is used for installing the functional components (200) of a high-speed optical module; A heat dissipation component (400), which is arranged within the installation cavity and is in contact with the functional components (200), and is used for dissipating heat from the functional components (200); The heat dissipation component (400) includes a first heat dissipation assembly (420) and a second heat dissipation assembly (410); when the first heat dissipation assembly (420) and the second heat dissipation assembly (410) are snap-fitted on the functional components (200), a closed space is formed to dissipate heat from the functional components (200) in all directions; When the first heat dissipation assembly (420) and the second heat dissipation assembly (410) are snap-fitted, a highly thermally conductive adhesive material is provided at the snap-fitting connection, and the highly thermally conductive adhesive material uses a modified thermally conductive silica gel, which is prepared by taking thermally conductive silica gel as a carrier and subjecting graphene aerogel loaded with surface-modified hexagonal boron nitride nanosheets to ultrasonic treatment and vacuum degassing; Heat dissipation fins (110), which are arranged on the heat dissipation housing and are close to the heat dissipation component (400); The functional components (200) include a circuit board (210), a first heating chip (260), a second heating chip (270), a third heating chip (280), a fourth heating chip (290), an array optical fiber jumper (230), a coupling lens (250), and an optical connector (240). One end of the array optical fiber jumper (230) is connected to the optical connector (240), and the other end is connected to the coupling lens (250). The coupling lens (250) is coupled to the second heating chip (270) and the fourth heating chip (290). The third heating chip (280) and the fourth heating chip (290) are mounted on the surface of the circuit board (210), and the first heating chip (260) and the second heating chip (270) are mounted on the heat dissipation component (400) and are electrically connected to the front side of the circuit board (210); The circuit board (210) is provided with a special-shaped through groove (220) for improving electrical performance, increasing the heat dissipation area, and mounting the first heating chip (260) and the second heating chip (270). Notches (221) are also provided on both sides of the circuit board (210) to facilitate the installation of the heat dissipation component (400). The circuit board (210) is provided with through holes at the positions of the third heating chip (280) and the fourth heating chip (290) for corresponding to the heat dissipation component (400).

2. The heat dissipation structure of the high-speed optical module according to claim 1, characterized in that, The heat dissipation housing includes a module cover plate (100) and a module base (300). The heat dissipation fins (110) are arranged on one side of the module cover plate (100). A first heat conducting member (120) is arranged on the other side of the module cover plate (100). A second heat conducting member (310) is arranged on the module base (300), and the first heat conducting member (120) corresponds to the second heat conducting member (310).

3. The heat dissipation structure of the high-speed optical module according to claim 2, wherein The first heat conducting member (120) is arranged as a first heat conducting protrusion, the first heat conducting protrusion is fixedly arranged on the module cover plate (100), the second heat conducting member (310) is arranged as a second heat conducting protrusion, the second heat conducting protrusion is fixedly arranged on the module base (300), and the first heat conducting protrusion and the second heat conducting protrusion are opposite to each other; The free ends of the first heat conducting protrusion and the second heat conducting protrusion are both provided with a first heat transfer member.

4. The heat dissipation structure of the high-speed optical module according to claim 1 or 2, characterized in that, The first heat dissipation assembly (420) includes a heat dissipation cover (421), a partition plate (422) and a second heat transfer member. The partition plate (422) is fixedly arranged in the heat dissipation cover (421) and is used for separating the heat dissipation cover (421) to form a first groove (423) and a second groove (424). The first groove (423) and the second groove (424) are used for dissipating heat from and enclosing the functional component (200). The second heat transfer member is arranged on the heat dissipation cover (421) and is in contact with the heat dissipation housing.

5. The heat dissipation structure of the high-speed optical module according to claim 1, characterized in that The first heat dissipation assembly (420) further includes a plurality of clamping blocks (425), and the plurality of clamping blocks (425) are respectively arranged at the edges of the heat dissipation cover (421).

6. The heat dissipation structure of the high-speed optical module according to claim 1, characterized in that The second heat dissipation assembly (410) includes a bottom plate (411), a heat dissipation table and a third heat conducting member. The heat dissipation table is arranged on the bottom plate (411) and corresponds to the functional component (200). The third heat conducting member is arranged on the bottom plate (411) and is in contact with the heat dissipation housing.

7. The heat dissipation structure of the high-speed optical module according to claim 6, wherein The functional component (200) has through holes, the area of the functional component (200) is communicated with the area of the heat dissipation table through the through holes, and a fourth heat conducting member is arranged between adjacent heat dissipation tables.

8. The heat dissipation structure of the high-speed optical module according to claim 6, characterized in that The second heat dissipation assembly (410) further includes side plates (415), the side plates (415) are respectively fixedly arranged on both sides of the bottom plate (411), and clamping grooves (416) are formed in the side plates (415).

9. A high-speed optical module, characterized in that, It includes the high-speed optical module heat dissipation structure according to any one of claims 1-8.

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