Connecting assembly, radio frequency module, base station antenna and base station

Abstract

The invention provides a connection assembly, a radio frequency module, a base station antenna and a base station. The connecting assembly is used for being connected with a first radio frequency device and a second radio frequency device, and the first radio frequency device comprises a first conductive layer and a second conductive layer which are arranged at an interval. The second radio frequency device comprises a first power distribution layer and a second power distribution layer which are arranged at intervals. The connecting assembly comprises an outer conductor and a conductor assembly. The outer conductor is connected between the first conductive layer and the first power distribution layer, and the outer conductor is provided with an accommodating hole. The conductor assembly is accommodated in the accommodating hole. The conductor assembly comprises a fixing piece, an insulating piece and an inner conductor, the inner conductor is arranged outside the fixing piece in a surrounding mode, the insulating piece is arranged on the side, opposite to the fixing piece, of the inner conductor, and the inner conductor covers part of the insulating piece. The fixing piece is installed on the second radio frequency device, the inner conductor and the outer conductor are arranged at intervals and are electrically connected with the second conducting layer and the second power distribution layer, and the distance between the insulating piece and the hole wall of the containing hole is smaller than or equal to the distance between the inner conductor and the hole wall of the containing hole. And miniaturization design is facilitated.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a connection component, a radio frequency module, a base station antenna and a base station. Background Art

[0002] The base station antenna of the base station includes RF devices such as antennas, phase shifters and filters. The two RF devices are relatively fixed through the mounting parts of the connecting component. And the two RF devices are electrically connected through the inner conductor and outer conductor of the connecting component. However, in this solution, due to the need for impedance matching and electrical insulation between the inner conductor and the outer conductor, an insulating part needs to be set between the inner conductor and the outer conductor. The assembly of the insulating part and the mounting part requires reserved assembly space, which is not conducive to the miniaturization design of the connecting component. Summary of the invention

[0003] The present application provides a connection component, a radio frequency module, a base station antenna and a base station. The connection component provided by the present application can omit the mounting component, and the relative fixation of the first radio frequency device and the second radio frequency device is achieved through the outer conductor, which is conducive to omitting the assembly space of the mounting component; and is conducive to reducing the size of the insulating component, reducing the distance between the insulating component and the outer conductor, and facilitating the miniaturized design of the connection component.

[0004] In the first aspect, an embodiment of the present application provides a connection assembly for connecting with a first radio frequency device and a second radio frequency device, wherein the first radio frequency device comprises a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are spaced apart, and the second radio frequency device comprises a first power distribution layer and a second power distribution layer, wherein the first power distribution layer and the second power distribution layer are spaced apart. The connection assembly comprises an outer conductor and a conductor assembly. The outer conductor is connected between the first conductive layer and the first power distribution layer, and the outer conductor is provided with a receiving hole, wherein the second conductive layer and the second power distribution layer are located on opposite sides of the outer conductor along the axial direction of the receiving hole. The conductor assembly is received in the receiving hole. The conductor assembly comprises a fixing member, an insulating member and an inner conductor, wherein the inner conductor is arranged outside the fixing member, the insulating member is mounted on the side of the inner conductor facing away from the fixing member, the inner conductor covers a part of the insulating member, and the fixing member is mounted on the second radio frequency device. The inner conductor is spaced apart from the outer conductor and is electrically connected to the second conductive layer and the second power distribution layer. Wherein, the distance between the insulating member and the hole wall of the receiving hole is less than or equal to the distance between the inner conductor and the hole wall of the receiving hole.

[0005] In the connection assembly provided by the present application, since the outer conductor is connected between the first conductive layer and the first power distribution layer; the first RF device and the second RF device are relatively fixed through the outer conductor, and the first conductive layer and the first power distribution layer are electrically connected through the outer conductor. Since the inner conductor is arranged outside the fixing part, the insulating part is installed on the side of the inner conductor facing away from the fixing part, the inner conductor covers part of the insulating part, and the fixing part is installed on the second RF device; the inner conductor and the outer conductor are relatively fixed. In addition, since the inner conductor and the outer conductor are spaced apart and electrically connected to the second conductive layer and the second power distribution layer; the inner conductor and the outer conductor achieve impedance matching and electrical insulation between the two through the air gap, and the first RF device and the second RF device are electrically connected through the inner conductor and the outer conductor.

[0006] In the connection assembly of the prior art, the first RF device and the second RF device are relatively fixed by the mounting piece of the connection assembly. And the first RF device and the second RF device are electrically connected by the inner conductor and the outer conductor of the connection assembly. Compared with the prior art, this solution can not only omit the mounting piece, but also achieve the relative fixation of the first RF device and the second RF device by the outer conductor, which is beneficial to save the assembly space of the mounting piece and is beneficial to the miniaturized design of the connection assembly. Moreover, the design of impedance matching and electrical insulation between the inner conductor and the outer conductor through the air gap is beneficial to reducing the size of the insulating part, reducing the processing materials of the insulating part, reducing the processing cost of the connection assembly, miniaturized design of the insulating part, and miniaturized design of the connection assembly.

[0007] The design in which the distance between the insulating part and the hole wall of the receiving hole is no greater than the distance between the inner conductor and the hole wall of the receiving hole is beneficial to reducing the distance between the insulating part and the hole wall of the receiving hole on the basis of achieving impedance matching and electrical insulation between the inner conductor and the outer conductor, and is beneficial to reducing the aperture of the receiving hole, which is beneficial to improving the space utilization of the outer conductor and is beneficial to the miniaturized design of the connection component.

[0008] In a possible implementation, the inner conductor includes a first conductor and a second conductor, the first conductor is located between the insulating member and the second conductive layer and is fixedly connected to the insulating member, the second conductor is located between the insulating member and the fixing member and is fixedly connected to the insulating member and is connected to the first conductor, the first conductor abuts against and is electrically connected to the second conductive layer, and the second conductor is electrically connected to the second power distribution layer.

[0009] The first conductor abuts against and is electrically connected to the second conductive layer, the second conductor is connected to the first conductor and is electrically connected to the second power distribution layer, and the second conductive layer and the second power distribution layer are electrically connected through the first conductor and the second conductor. The first conductor abuts against the second conductive layer to achieve electrical connection between the two. This design is not only simple in structure, but also has a wide range of application scenarios and strong universality; it can also avoid the presence of solder between the first conductor and the second conductive layer, which is beneficial to reducing processing costs.

[0010] In a possible implementation manner, the insulating component is elastic, the first conductor elastically abuts against the second conductive layer, and the fixing component is spaced apart from the first radio frequency device.

[0011] The insulating member is designed with elasticity to ensure that the first conductor and the second conductive layer can be elastically abutted, which is conducive to increasing the abutment area between the first conductor and the second conductive layer, and is conducive to improving the reliability of the electrical connection between the first conductor and the second conductive layer. The design of the fixed member and the first radio frequency device being arranged at intervals avoids the rigid contact between the fixed member and the second conductive layer, thereby avoiding the situation where the first conductor cannot elastically abut against the second conductive layer, which is conducive to improving the reliability of the abutment between the first conductor and the second conductive layer, and is conducive to improving the reliability of the electrical connection between the first conductor and the second conductive layer.

[0012] In a possible implementation manner, the fixing member is made of a conductive material, the fixing member is connected to the second power distribution layer, and the second conductor is in contact with and electrically connected to the fixing member.

[0013] The second conductor is electrically connected to the second power distribution layer through the fixing member, and the second conductive layer is electrically connected to the second power distribution layer through the inner conductor and the fixing member. Since the contact area between the fixing member and the second power distribution layer can be designed to be larger, the design of the fixing member being made of conductive material is conducive to improving the reliability of the electrical connection between the second conductor and the second power distribution layer.

[0014] In one possible embodiment, the fixing member includes a first fixing portion and a second fixing portion, the first fixing portion is connected to the second power distribution layer, and the second fixing portion is connected to the surface of the first fixing portion facing away from the second power distribution layer; the second conductor is arranged outside the second fixing portion, the first conductor is located on the side of the second conductor facing away from the first fixing portion, and is connected to the second conductor, the insulating member is installed on the side of the second conductor facing away from the second fixing portion, and is fixedly connected to the second conductor, and the insulating member is installed between the first fixing portion and the first conductor, and is fixedly connected to the first conductor, and the second conductor abuts against and is electrically connected to the second fixing portion.

[0015] Since the first fixing part is connected to the second power distribution layer, the second fixing part is connected to the surface of the first fixing part facing away from the second power distribution layer, the second conductor abuts against and is electrically connected to the second fixing part; the second conductor is electrically connected to the second power distribution layer through the first fixing part and the second fixing part. The design that the second conductor is electrically connected to the second power distribution layer through the first fixing part and the second fixing part is conducive to reducing the size of the second conductor, reducing the material cost of the second conductor, and reducing the processing cost of the connection component.

[0016] In a possible implementation, the inner conductor includes a third conductor, the third conductor is located between the insulating member and the first fixing portion, and is fixedly connected to the insulating member and to the second conductor, and the third conductor abuts against and is electrically connected to the first fixing portion.

[0017] Since the third conductor is connected to the second conductor, the third conductor abuts against and is electrically connected to the first fixing portion; the second conductor is also electrically connected to the second power distribution layer through the third conductor and the first fixing portion, which is beneficial to improving the reliability of the electrical connection between the second conductor and the fixing member, and is beneficial to improving the reliability of the electrical connection between the second conductor and the second power distribution layer.

[0018] In a possible implementation, the receiving hole includes a receiving wall, a groove is formed around the receiving wall, the first fixing portion is located in the groove and is spaced apart from the groove wall, and the distance between the first fixing portion and the groove wall is greater than the distance between the insulating member and the receiving wall.

[0019] The design of the groove ensures that the distance between the first fixing portion and the outer conductor is greater than the distance between the insulating member and the outer conductor. On the basis of not changing the distance between the outer conductor and the insulating member, that is, not changing the size of the connecting component, impedance matching and electrical insulation between the fixing member and the outer conductor are achieved, which is beneficial to improving the signal transmission efficiency between the second conductive layer and the second distribution layer.

[0020] In one possible implementation, the insulating member abuts against the second radio frequency device; the second conductor is fixedly stacked on the surface of the insulating member facing the fixing member and is connected to the first conductor, the second conductor abuts against and is electrically connected to the fixing member, and the second conductor abuts against and is electrically connected to the second power distribution layer; or, the insulating member abuts against the fixing member, a receiving groove is provided on the surface of the insulating member facing the fixing member, the second conductor is fixedly received in the receiving groove and is connected to the first conductor, the second conductor abuts against and is electrically connected to the fixing member, and the second conductor is spaced apart from the second power distribution layer.

[0021] Since the second conductor is in contact with and electrically connected to the fixing member, the second conductor is indirectly electrically connected to the second power distribution layer through the fixing member. Furthermore, since the second conductor is in contact with and electrically connected to the second power distribution layer, the second conductor is also directly electrically connected to the second power distribution layer, which is beneficial to improving the reliability of the electrical connection between the second conductor and the second power distribution layer, and is beneficial to improving the reliability of the electrical connection between the second conductive layer and the second power distribution layer.

[0022] Since the second conductor is in contact with and electrically connected to the fixing member, the second conductor is electrically connected to the second power distribution layer through the fixing member. The design of spacing the second conductor from the second power distribution layer is conducive to reducing the size of the second conductor, reducing the material cost of the second conductor, and reducing the processing cost of the connection assembly.

[0023] In a possible implementation manner, the insulating member includes a first surface, the first surface faces the second conductive layer, and the first conductor covers a portion of the first surface and abuts against and is electrically connected to the second conductive layer.

[0024] Since the first conductor covers a portion of the first surface; the distance between the first conductor and the outer conductor is smaller than the distance between the insulating member and the outer conductor, on the basis of ensuring impedance matching and electrical insulation between the first conductor and the outer conductor, the distance between the insulating member and the outer conductor is further reduced, and the insulating member and the outer conductor may even be in contact, further reducing the aperture of the receiving hole, which is beneficial to improving the space utilization of the outer conductor and facilitating the miniaturized design of the connection assembly.

[0025] In a possible implementation, the inner conductor includes a third conductor, the third conductor is located between the insulating member and the second power distribution layer, and is fixedly connected to the insulating member and connected to the second conductor, and the third conductor abuts against and is electrically connected to the second power distribution layer.

[0026] Since the third conductor is connected to the second conductor, the third conductor abuts and is electrically connected to the second distribution layer; the second conductor is electrically connected to the second distribution layer through the third conductor, and the second conductive layer is electrically connected to the second distribution layer through the inner conductor. The electrical connection between the third conductor and the second distribution layer is achieved by abutting the second distribution layer. This design is not only simple in structure, but also has a wide range of application scenarios and strong universality; it can also avoid the appearance of solder between the third conductor and the second distribution layer, which is conducive to reducing processing costs.

[0027] In one possible embodiment, the insulating member includes a first surface and a second surface, the first surface faces the second conductive layer, the second surface faces the second power distribution layer, the first conductor covers a portion of the first surface, abuts against and is electrically connected to the second conductive layer, and the third conductor covers a portion of the second surface, abuts against and is electrically connected to the second power distribution layer.

[0028] Since the first conductor covers part of the first surface, the distance between the first conductor and the outer conductor is smaller than the distance between the insulating member and the outer conductor. Since the third conductor covers part of the second surface, the distance between the third conductor and the outer conductor is smaller than the distance between the insulating member and the outer conductor. Thus, on the basis of ensuring impedance matching and electrical insulation between the first conductor and the third conductor and the outer conductor, the distance between the insulating member and the outer conductor is further reduced, and the insulating member and the outer conductor may even contact, further reducing the aperture of the receiving hole, which is beneficial to improving the space utilization of the outer conductor and facilitating the miniaturized design of the connection assembly.

[0029] In a possible implementation, the second radio frequency device includes an insulating connection layer, the first distribution layer and the second distribution layer are fixedly stacked on the insulating connection layer, the fixing piece is fixedly connected to the side of the insulating connection layer facing the second distribution layer, the outer surface of the fixing piece is provided with a distribution body, the distribution body covers the outside of the fixing piece, abuts against the inner conductor, and is electrically connected to the inner conductor, and the distribution body is connected to the second distribution layer.

[0030] Since the distribution body covers the outside of the fixing part and abuts against the inner conductor and is electrically connected to the inner conductor, the distribution body is connected to the second distribution layer, and the inner conductor is electrically connected to the second distribution layer through the distribution body. There are various ways to electrically connect the inner conductor to the second distribution layer, with low design cost and low processing cost.

[0031] In a possible implementation, the number of the second conductive layer, the second power distribution layer, the receiving holes and the conductor components are all multiple, the multiple second conductive layers, the multiple second power distribution layers and the multiple conductor components are correspondingly located in the multiple receiving holes, and the inner conductors of the multiple conductor components are correspondingly electrically connected to the multiple second conductive layers and the multiple second power distribution layers.

[0032] The inner conductors of the multiple conductor components are electrically connected to the multiple second conductive layers and the multiple second power distribution layers in a one-to-one correspondence, and the multiple second conductive layers and the multiple second power distribution layers are electrically connected in a one-to-one correspondence. A single connection component can realize the electrical connection of the multiple second conductive layers of the first RF device and the multiple second power distribution layers of the second RF device, which is conducive to reducing the complexity of the structure, making the structure simple and easy to install.

[0033] In the second aspect, the embodiment of the present application further provides a radio frequency module. The radio frequency module includes a first radio frequency device, a second radio frequency device, and a connection assembly as described in any one of the first aspects, the first radio frequency device includes a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are arranged at intervals, the second radio frequency device includes a first power distribution layer and a second power distribution layer, the first power distribution layer and the second power distribution layer are arranged at intervals; the first conductive layer and the first power distribution layer are connected to opposite sides of the outer conductor, and along the axial direction of the receiving hole, the second conductive layer and the second power distribution layer are located on opposite sides of the outer conductor; wherein the fixing member is mounted on the second radio frequency device, and the inner conductor is electrically connected to the second conductive layer and the second power distribution layer.

[0034] In a third aspect, the embodiment of the present application further provides a base station antenna. The base antenna comprises the radio frequency module and the antenna cover described in the second aspect, and the radio frequency module is accommodated in the antenna cover.

[0035] In a fourth aspect, an embodiment of the present application further provides a base station, wherein the base station comprises the base station antenna and a base station server as described in the third aspect, wherein the base station server is electrically connected to the base station antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0037] Figure 1 is a schematic diagram of the structure of a base station provided in an embodiment of the present application;

[0038] Figure 2 yes Figure 1 A structural block diagram of a base station antenna of the base station shown;

[0039] Figure 3 yes Figure 2 A schematic diagram of the structure of the radio frequency module of the base station antenna shown;

[0040] Figure 4 yes Figure 3 A schematic structural diagram of a first radio frequency device of the radio frequency module shown;

[0041] Figure 5 yes Figure 4 The schematic structural diagram of the first radio frequency device shown is cut along line AA with the reflector omitted;

[0042] Figure 6 yes Figure 3 A schematic structural diagram of a second radio frequency device of the radio frequency module shown;

[0043] Figure 7 yes Figure 6 The structural schematic diagram of the second radio frequency device shown is cut along line BB;

[0044] Figure 8 yes Figure 3 A schematic diagram of the structure of the connection components of the RF module shown;

[0045] Fig. 9 yes Figure 8 The structural schematic diagram of the connection assembly shown is cut along the CC line;

[0046] Fig.10 yes Figure 3 An enlarged view of the X portion of the RF module is shown;

[0047] Fig.11 yes Figure 3 The structure diagram of the radio frequency module shown in another embodiment;

[0048] Fig.12 yes Fig.11 The structure schematic diagram of the connection component of the RF module shown is cut along the DD line;

[0049] Fig.13 yes Figure 3 The structure diagram of the radio frequency module shown in another embodiment;

[0050] Fig.14 yes Fig.13 The structure schematic diagram of the connection component of the RF module shown is cut along line EE;

[0051] Fig.15 yes Fig.13 The structure schematic diagram of the connection component of the RF module shown is cut along the FF line;

[0052] Fig.16 yes Fig.13 The structure diagram of the radio frequency module shown in another embodiment;

[0053] Fig.17 yes Figure 3 The structure diagram of the radio frequency module shown in another embodiment;

[0054] Fig.18 yes Figure 3 The structure of the radio frequency module shown is a schematic diagram under another embodiment. DETAILED DESCRIPTION

[0055] The present application provides a connection component, a radio frequency module, a base station antenna, and a base station. The connection component is applied to the radio frequency module. The radio frequency module is applied to the base station antenna. The base station antenna is applied to the base station. The base station is a device deployed in a wireless access network to provide wireless communication functions. The size of the insulating part of the connection component provided in the present application can be designed to be very small, which is conducive to reducing the processing materials of the insulating part and the processing cost of the connection component; and it is conducive to the miniaturization design of the connection component. It should be noted that in the present application, feature A and feature B are "connected" to mean that feature A and feature B are fixedly connected and electrically connected.

[0056] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0057] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 It is a structural diagram of the base station 1000 provided in an embodiment of the present application. Figure 2 yes Figure 1 A structural block diagram of the base station antenna 4 of the base station 1000 is shown. Figure 3 yes Figure 2 A schematic structural diagram of the radio frequency module 100 of the base station antenna 4 is shown.

[0058] like Figure 1As shown, in some embodiments, the base station 1000 includes a base station server 1, a pole 2, an adjustment bracket 3, a base station antenna 4, a cable 5, a grounding device 6, and a lightning protector 7. The base station server 1 is located indoors, and the base station server 1 is located on one side of a wall 8. The pole 2, the adjustment bracket 3, and the base station antenna 4 are located outdoors, and the pole 2, the adjustment bracket 3, and the base station antenna 4 are all located on the other side of the wall 8. The pole 2 is fixed to a bearing surface, and the bearing surface may include but is not limited to the ground or a floor. The adjustment bracket 3 is mounted on the pole 2. The base station antenna 4 is mounted on the adjustment bracket 3. One end of the cable 5 is connected to the base station server 1, and the other end passes through the wall 8 to connect to the base station antenna 4. The base station server 1 is electrically connected to the base station antenna 4 through the cable 5. The grounding device 6 is arranged on the cable 5. Exemplarily, the number of the grounding devices 6 is 5; among them, 3 grounding devices 6 are located on the side of the wall 8 facing the base station antenna 4, and 2 grounding devices 6 are located on the side of the wall 8 facing the base station server 1. In some other embodiments, the number of the grounding devices 6 may also be 1, 3, or more. The lightning protector 7 is arranged on the cable 5 and is located between the grounding device 6 and the base station server 1. A sealing member may be arranged at the connection between the base station antenna 4 and the cable 5 to ensure the sealing of the connection between the base station antenna 4 and the cable 5.

[0059] The base station server 1 is used to output radio frequency signals. The base station antenna 4 is used to convert radio frequency signals into electromagnetic wave signals and radiate them in the form of electromagnetic wave beams. Exemplarily, the base station antenna 4 can be various antenna elements including but not limited to plate-shaped multi-frequency antennas, wire antennas, planar antennas or beautification antennas. The adjustment bracket 3 is used to adjust the mechanical downtilt angle of the base station antenna 4 so as to adjust the direction of the electromagnetic wave beam of the base station antenna 4, thereby adjusting the coverage range of the electromagnetic wave signal of the base station antenna 4. It should be noted that the mechanical downtilt angle refers to the angle of the opening generated by the inclination of the base station antenna 4 relative to the vertical direction toward the bearing surface. The vertical direction is set perpendicular to the bearing surface. The grounding device 6 is used for grounding to achieve grounding of the cable 5. The lightning protector 7 is used for lightning protection and current discharge to prevent lightning from invading along the cable 5 and damaging the base station server 1. In some other embodiments, the base station antenna 4 can also be used to receive electromagnetic wave signals and convert them into radio frequency signals. The base station server 1 is used to receive radio frequency signals.

[0060] like Figure 1 , Figure 2 and Figure 3As shown, in some embodiments, the base station antenna 4 includes an antenna 10, a phase shifter 10a, a filter 10b, an antenna connector 10c, a transmission component 10d, a calibration network 10e, a radome 10f, and a connection component 20. Exemplarily, the number of the connection components 20 is multiple, and specifically, the number of the connection components 20 is 2. The two connection components 20 are respectively a first connection component 20a and a second connection component 20b. The first connection component 20a is connected to the antenna 10 and the phase shifter 10a. The antenna 10 is connected to the phase shifter 10a through the first connection component 20a. The second connection component 20b is connected to the phase shifter 10a and the filter 10b. The phase shifter 10a is connected to the filter 10b through the second connection component 20b. The filter 10b is electrically connected to the antenna connector 10c. The transmission component 10d and the calibration network 10e are both electrically connected to the phase shifter 10a. The antenna 10 , the first connecting component 20 a , the phase shifter 10 a , the second connecting component 20 b , the filter 10 b , the transmission component 10 d and the calibration network 10 e are housed in the radome 10 f . The antenna connector 10 c is located outside the radome 10 f , wherein the antenna connector 10 c is connected to the cable 5 .

[0061] The antenna connector 10c is used to receive the radio frequency signal output by the base station server 1. The filter 10b is used to filter the radio frequency signal. The phase shifter 10a is used to perform phase shift processing on the radio frequency signal after filtering by the filter 10b. The antenna 10 is used to convert the radio frequency signal after phase shift processing by the phase shifter 10a into an electromagnetic wave signal and radiate it in the form of an electromagnetic wave beam. The transmission component 10d is used to drive the phase shifter 10a to work so as to perform phase shift processing on the radio frequency signal after filtering by the filter 10b. The calibration network 10e is used to output the calibration signal and feed it to the phase shifter 10a so as to perform amplitude calibration and phase calibration on the radio frequency signal after filtering by the filter 10b. In some other embodiments, the transmission component 10d or the calibration network 10e can be omitted. The filter 10b can also be omitted, and the base station antenna 4 can also include a power adapter, which is electrically connected between the phase shifter 10a and the antenna connector 10c, and the power adapter can divide one radio frequency signal into multiple outputs to the phase shifter 10a.

[0062] The antenna 10, the first connecting component 20a and the phase shifter 10a constitute a first RF module 100a. The phase shifter 10a, the second connecting component 20b and the filter 10b constitute a second RF module 100b. The base station antenna 4 includes a first RF module 100a and a second RF module 100b. That is, the base station antenna 4 includes a RF module 100, and the RF module 100 includes a first RF module 100a and a second RF module 100b. Each RF module 100 includes a first RF device 30, a connecting component 20 and a second RF device 40. The connecting component 20 is connected to the first RF device 30 and the second RF device 40. The first RF device 30 is connected to the second RF device 40 through the connecting component 20. The first RF device 30 is the antenna 10, and the second RF device 40 is the phase shifter 10a; or, the first RF device 30 is the phase shifter 10a, and the second RF device 40 is the filter 10b. In some other embodiments, the first RF device 30 may also be a phase shifter 10a, and the second RF device 40 may also be a power adapter. The first RF device 30 and the second RF device 40 may also be any two RF devices that need to be electrically connected in the base station antenna 4. It can be understood that the first RF module 100a and the second RF module 100b are both housed in the antenna cover 10f, and the RF module 100 is housed in the antenna cover 10f.

[0063] See also Figure 4 and Figure 5 , and combined with Figure 2 , Figure 4 yes Figure 3 The structure diagram of the first RF device 30 of the RF module 100 is shown. Figure 5 yes Figure 4 The structure diagram of the first RF device 30 shown is a schematic diagram of a structure cut along line AA with the reflection plate 33 omitted.

[0064] like Figure 2 and Figure 4 As shown, exemplarily, the first radio frequency device 30 is an antenna 10. The first radio frequency device 30 includes a first circuit board 31, a radiation unit 32 and a reflection plate 33. The radiation unit 32 is mounted on one side of the first circuit board 31, and the reflection plate 33 is mounted on the other side of the first circuit board 31. The radiation unit 32 is used to convert the radio frequency signal into an electromagnetic wave signal and radiate it. The reflection plate 33 is used to enhance the directivity of the first radio frequency device 30. Specifically, the reflection plate 33 can concentrate the electromagnetic wave signal to radiate in the direction of the first circuit board 31 where the radiation unit 32 is provided, thereby enhancing the ability of the first radio frequency device 30 to radiate electromagnetic wave signals. Moreover, the reflection plate 33 can also block and shield the interference of other irrelevant radio waves coming from the side of the first circuit board 31 facing away from the radiation unit 32 on the electromagnetic wave signal radiated by the first radio frequency device 30, thereby improving the quality of the electromagnetic wave signal radiated by the first radio frequency device 30.

[0065] like Figure 4 and Figure 5 As shown, exemplarily, the first circuit board 31 is a rectangular circuit board. In some other embodiments, the first circuit board 31 may also be a circular circuit board, a triangular circuit board or other special-shaped circuit boards. For ease of description, the thickness direction of the first circuit board 31 is defined as the first direction (i.e., the Z-axis direction in the figure), the length direction of the first circuit board 31 is defined as the second direction (i.e., the X-axis direction in the figure), and the width direction of the first circuit board 31 is defined as the third direction (i.e., the Y-axis direction in the figure).

[0066] In some embodiments, the first circuit board 31 includes an insulating layer 311, a first conductive layer 312, a second conductive layer 313, a third conductive layer 314, and a fourth conductive layer 315. In other words, the first RF device 30 includes an insulating layer 311, a first conductive layer 312, a second conductive layer 313, a third conductive layer 314, and a fourth conductive layer 315. Exemplarily, the insulating layer 311 is made of insulating materials including but not limited to ceramic or epoxy resin. The first conductive layer 312, the second conductive layer 313, the third conductive layer 314, and the fourth conductive layer 315 are made of conductive materials including but not limited to copper or aluminum.

[0067] In the Z-axis direction, the first conductive layer 312 is fixedly stacked on one side of the insulating layer 311. The first conductive layer 312 is provided with a first through hole 3121, and the first through hole 3121 penetrates the first conductive layer 312 along the Z-axis direction. Exemplarily, the second conductive layer 313 is in a circular ring shape. In some other embodiments, the second conductive layer 313 may also be a rectangular ring, a triangular ring or other special-shaped rings. In the Z-axis direction, the second conductive layer 313 is fixedly stacked on one side of the insulating layer 311 facing the first conductive layer 312, and is located in the first through hole 3121, and is spaced apart from the first through hole 3121. That is, the first conductive layer 312 and the second conductive layer 313 are spaced apart and electrically insulated.

[0068] In the Z-axis direction, the third conductive layer 314 is fixedly stacked on the side of the insulating layer 311 facing away from the first conductive layer 312. The third conductive layer 314 is provided with a second through hole 3141, and the second through hole 3141 penetrates the third conductive layer 314 along the Z-axis direction. The third conductive layer 314 is electrically connected to the first conductive layer 312 by means including but not limited to vias. Exemplarily, the fourth conductive layer 315 is in the shape of a circular ring. In some other embodiments, the fourth conductive layer 315 may also be a rectangular ring, a triangular ring or other special-shaped ring. In the Z-axis direction, the fourth conductive layer 315 is fixedly stacked on the side of the insulating layer 311 facing the third conductive layer 314, and is located in the second through hole 3141, and is spaced apart from the second through hole 3141. That is, the third conductive layer 314 and the fourth conductive layer 315 are spaced apart and electrically insulated. The fourth conductive layer 315 is electrically connected to the second conductive layer 313 by means including but not limited to vias.

[0069] The radiation unit 32 is fixedly stacked on the third conductive layer 314 and the fourth conductive layer 315 by means including but not limited to welding or gluing, and is electrically connected to the third conductive layer 314 and the fourth conductive layer 315. The reflector 33 is provided with an avoidance hole 331, and the avoidance hole 331 penetrates the reflector 33 along the Z-axis direction. The reflector 33 is fixedly stacked on the side of the insulating layer 311 facing away from the radiation unit 32 by means including but not limited to welding or gluing, and the first conductive layer 312 and the second conductive layer 313 are located in the avoidance hole 331 and are spaced apart from the avoidance hole 331. That is, the first conductive layer 312 and the second conductive layer 313 are spaced apart from the reflector 33.

[0070] In some embodiments, the first circuit board 31 is provided with a first mounting hole 316. The first mounting hole 316 penetrates the first circuit board 31 along the Z-axis direction. Specifically, the first mounting hole 316 penetrates the third conductive layer 314, the insulating layer 311 and the first conductive layer 312 along the Z-axis direction. Exemplarily, the number of the first mounting holes 316 is multiple, and specifically, the number of the first mounting holes 316 is 2. In some other embodiments, the number of the first mounting holes 316 may also be 1, 3 or more. Along the X-axis direction, the two first mounting holes 316 are located on opposite sides of the radiation unit 32 and are spaced apart from the radiation unit 32.

[0071] See also Figure 6 and Figure 7 , and combined with Figure 2 and Figure 3 , Figure 6 yes Figure 3 The structure diagram of the second RF device 40 of the RF module 100 is shown. Figure 7 yes Figure 6 The structure diagram of the second radio frequency device 40 shown is a cross-section diagram along line BB.

[0072] like Figure 2 , Figure 3 and Figure 6 As shown, in the Z-axis direction, the second RF device 40 is arranged opposite to and spaced from the first RF device 30. Exemplarily, the second RF device 40 is a phase shifter 10a. The second RF device 40 includes a second circuit board 41 and a phase shift unit 42. In the Z-axis direction, the second circuit board 41 is located on the side of the reflector 33 facing away from the first circuit board 31. The second circuit board 41 is arranged opposite to and spaced from the reflector 33. The phase shift unit 42 is installed on the side of the second circuit board 41 facing away from the reflector 33. The phase shift unit 42 is used to perform phase shift processing on the RF signal after filtering by the filter 10b. Wherein, the phase shift unit 42 is electrically connected to the transmission component 10d and the calibration network 10e by means including but not limited to cables.

[0073] like Figure 3 , Figure 6 , Figure 7 As shown, exemplarily, the second circuit board 41 is a rectangular circuit board. In some other embodiments, the second circuit board 41 may also be a circular circuit board, a triangular circuit board or other special-shaped circuit boards. The second circuit board 41 includes an insulating connection layer 411, a first power distribution layer 412, a second power distribution layer 413, a third power distribution layer 414 and a fourth power distribution layer 415. In other words, the second RF device 40 includes an insulating connection layer 411, a first power distribution layer 412, a second power distribution layer 413, a third power distribution layer 414 and a fourth power distribution layer 415. Exemplarily, the insulating connection layer 411 is made of insulating materials including but not limited to ceramics or epoxy resins. The first power distribution layer 412, the second power distribution layer 413, the third power distribution layer 414 and the fourth power distribution layer 415 are made of conductive materials including but not limited to copper or aluminum.

[0074] In the Z-axis direction, the first distribution layer 412 is fixedly stacked on one side of the insulating connection layer 411. The first distribution layer 412 is provided with a third through hole 4121, and the third through hole 4121 penetrates the first distribution layer 412 along the Z-axis direction. Exemplarily, the second distribution layer 413 is in the shape of a circular ring. In some other embodiments, the second distribution layer 413 may also be a rectangular ring, a triangular ring, other special-shaped rings or a cylinder. In the Z-axis direction, the second distribution layer 413 is fixedly stacked on the side of the insulating connection layer 411 facing the first distribution layer 412, and is located in the third through hole 4121, and is spaced apart from the third through hole 4121. That is, the first distribution layer 412 and the second distribution layer 413 are spaced apart and electrically insulated. It can be understood that the first distribution layer 412 and the second distribution layer 413 are both fixedly stacked on the insulating connection layer 411.

[0075] In the Z-axis direction, the third distribution layer 414 is fixedly stacked on the side of the insulating connection layer 411 facing away from the first distribution layer 412. The third distribution layer 414 is provided with a fourth through hole 4141, and the fourth through hole 4141 penetrates the third distribution layer 414 along the Z-axis direction. The third distribution layer 414 is electrically connected to the first distribution layer 412 by means including but not limited to vias. Exemplarily, the fourth distribution layer 415 is in the shape of a circular ring. In some other embodiments, the fourth distribution layer 415 may also be a rectangular ring, a triangular ring, other special-shaped rings or a cylinder. In the Z-axis direction, the fourth distribution layer 415 is fixedly stacked on the side of the insulating connection layer 411 facing the third distribution layer 414, and is located in the fourth through hole 4141, and is spaced apart from the fourth through hole 4141. That is, the third distribution layer 414 and the fourth distribution layer 415 are spaced apart and electrically insulated. The fourth distribution layer 415 is electrically connected to the second distribution layer 413 by means including but not limited to vias. The first power distribution layer 412 and the second power distribution layer 413 face the reflector 33. The first power distribution layer 412 is opposite to and spaced from the first conductive layer 312. The second power distribution layer 413 is opposite to and spaced from the second conductive layer 313. The first, third and fourth power distribution layers 414 and 415 face away from the reflector 33. The phase shift unit 42 is fixedly stacked on the third power distribution layer 414 and the fourth power distribution layer 415 and is electrically connected to the third power distribution layer 414 and the fourth power distribution layer 415 by means including but not limited to welding or gluing.

[0076] In some embodiments, the second circuit board 41 is provided with a second mounting hole 416. The second mounting hole 416 penetrates the second circuit board 41 along the Z-axis direction. Specifically, the second mounting hole 416 penetrates the third power distribution layer 414, the insulating connection layer 411 and the first power distribution layer 412 along the Z-axis direction. Exemplarily, the number of the second mounting holes 416 is multiple, and specifically, the number of the second mounting holes 416 is 2. In some other embodiments, the number of the second mounting holes 416 may also be 1, 3 or more. Along the X-axis direction, the two second mounting holes 416 are located on opposite sides of the phase shifting unit 42 and are spaced apart from the phase shifting unit 42. Among them, along the Z-axis direction, the two second mounting holes 416 are opposite to and spaced apart from the two first mounting holes 316. Along the Z-axis direction, the second mounting hole 416 is opposite to and spaced apart from the first mounting hole 316.

[0077] In some embodiments, the second circuit board 41 is provided with a third mounting hole 417. Specifically, the third mounting hole 417 is provided in the insulating connection layer 411. The third mounting hole 417 extends along the Z-axis direction and has an opening, and the opening is located on the surface of the insulating connection layer 411 facing away from the phase shifting unit 42. The third mounting hole 417 is located in the second power distribution layer 413 and is spaced apart from the second power distribution layer 413.

[0078] See also Figure 8 , Fig. 9 and Fig.10 , and combined with Figure 3 , Figure 8 yes Figure 3 The structure diagram of the connection component 20 of the radio frequency module 100 is shown. Fig. 9 yes Figure 8 The connecting assembly 20 shown is a schematic structural diagram cut along line CC. Fig.10 yes Figure 3 An enlarged view of the X portion of the RF module 100 is shown.

[0079] like Figure 3 and Figure 8 As shown, in some embodiments, the connection component 20 is connected between the first RF device 30 and the second RF device 40. The connection component 20 includes an outer conductor 21 and a conductor component 22. The outer conductor 21 is connected between the first conductive layer 312 and the first power distribution layer 412. The conductor component 22 is accommodated in the outer conductor 21, and the conductor component 22 is installed in the second RF device 40. And the conductor component 22 is electrically connected to the second conductive layer 313 and the second power distribution layer 413. The first circuit board 31 and the second circuit board 41 are electrically connected through the outer conductor 21 and the conductor component 22. The first circuit board 31 and the second circuit board 41 are fixedly connected through the outer conductor 21. That is, the first RF device 30 and the second RF device 40 are connected through the connection component 20. Thus, the RF signal processed by the phase shift unit 42 of the second RF device 40 is transmitted to the first circuit board 31 through the second circuit board 41, the outer conductor 21 and the conductor component 22, and then transmitted from the first circuit board 31 to the radiation unit 32. The radiation unit 32 can convert the RF signal processed by the phase shift unit 42 into an electromagnetic wave signal, and radiate it in the form of an electromagnetic wave beam.

[0080] like Figure 8 , Fig. 9 and Fig.10 As shown, illustratively, the outer conductor 21 is a cylinder. In some other embodiments, the outer conductor 21 may also be a cylinder including but not limited to a rectangular cylinder or a triangular cylinder. The outer conductor 21 is made of a conductive material including but not limited to copper or aluminum. The outer conductor 21 includes a first connection surface 211 and a second connection surface 212. In the Z-axis direction, the first connection surface 211 and the second connection surface 212 are arranged opposite to each other. Among them, the first connection surface 211 is in contact with and electrically connected to the first conductive layer 312. The second connection surface 212 is in contact with and electrically connected to the first distribution layer 412.

[0081] The outer conductor 21 is provided with a receiving hole 213. The receiving hole 213 extends along the Z-axis direction and has two openings, one opening is located on the first connecting surface 211, and the other opening is located on the second connecting surface 212. That is, the receiving hole 213 passes through the outer conductor 21 along the Z-axis direction. Among them, the receiving hole 213 includes a receiving wall 2131. The receiving wall 2131 is connected to the first connecting surface 211 and the second connecting surface 212. Along the Z-axis direction (that is, along the axial direction of the receiving hole 213), the second conductive layer 313 and the second power distribution layer 413 are located on opposite sides of the outer conductor 21, and the second conductive layer 313 and the second power distribution layer 413 are both arranged opposite to the receiving hole 213.

[0082] The outer conductor 21 is provided with a groove 214. Specifically, the groove 214 is arranged around the receiving wall 2131. That is to say, the receiving wall is provided with a groove 214. Exemplarily, the groove 214 includes a truncated cone groove and a cylindrical groove. Along the Z-axis direction, the truncated cone groove is located on the side of the cylindrical groove facing away from the second connecting surface 212 and is connected to the cylindrical groove. Among them, the groove 214 includes a first groove wall 2141 and a second groove wall 2142, and the first groove wall 2141 is inclined relative to the Z-axis direction. The second groove wall 2142 extends along the Z-axis direction and is connected to the first groove wall 2141. The first groove wall 2141 is connected to the receiving wall 2131. The second groove wall 2142 is connected to the second connecting surface 212. In some other embodiments, the groove 214 may also be a cylindrical groove or a truncated cone groove. It can be understood that the first groove wall 2141 and the second groove wall 2142 constitute the groove wall of the groove 214. That is, the groove wall of the groove 214 includes the first groove wall 2141 and the second groove wall 2142. The receiving wall 2131, the first groove wall 2141 and the second groove wall 2142 constitute the hole wall of the receiving hole 213. That is, the hole wall of the receiving hole 213 includes the receiving wall 2131, the first groove wall 2141 and the second groove wall 2142.

[0083] The outer conductor 21 is provided with a fourth mounting hole 215, which extends along the Z-axis direction and has an opening, and the opening is located on the first connecting surface 211. Exemplarily, the number of the fourth mounting holes 215 is multiple, and specifically, the number of the fourth mounting holes 215 is 2. In some other embodiments, the number of the fourth mounting holes 215 may also be 1, 3, or more. In the X-axis direction, the two fourth mounting holes 215 are located on opposite sides of the receiving hole 213 and are spaced apart from the receiving hole 213. Among them, in the Z-axis direction, the two fourth mounting holes 215 are arranged opposite to the two first mounting holes 316. That is, the fourth mounting hole 215 is arranged opposite to the first mounting hole 316.

[0084] The fourth mounting hole 215 and the first mounting hole 316 are used for the first fastener 50 to penetrate. The first fastener 50 passes through the first mounting hole 316 from the side of the third conductive layer 314 facing away from the first conductive layer 312 and penetrates into the fourth mounting hole 215, and is threadedly connected with the fourth mounting hole 215. Through the first fastener 50, the first connection surface 211 is fixedly connected to the first conductive layer 312, so that the first connection surface 211 is connected to the first conductive layer 312, and the outer conductor 21 is connected to the first conductive layer 312. In some other embodiments, the first connection surface 211 can also be connected to the first conductive layer 312 by means including but not limited to welding or gluing, and the outer conductor 21 is also connected to the first conductive layer 312.

[0085] In some embodiments, the outer conductor 21 is provided with a fifth mounting hole 216, and the fifth mounting hole 216 extends along the Z-axis direction and has an opening, and the opening is located on the second connecting surface 212. Exemplarily, the number of the fifth mounting holes 216 is multiple, and specifically, the number of the fifth mounting holes 216 is 2. In some other embodiments, the number of the fifth mounting holes 216 may also be 1, 3, or more. In the X-axis direction, the two fifth mounting holes 216 are located on opposite sides of the receiving hole 213 and are spaced apart from the receiving hole 213. Among them, in the Z-axis direction, the two fifth mounting holes 216 are arranged opposite to the two second mounting holes 416. That is, the fifth mounting hole 216 is arranged opposite to the second mounting hole 416.

[0086] The fifth mounting hole 216 and the second mounting hole 416 are used for the second fastener 60 to pass through. The second fastener 60 passes through the second mounting hole 416 from the side of the third power distribution layer 414 facing away from the first power distribution layer 412 and penetrates into the fifth mounting hole 216, and is threadedly connected to the fifth mounting hole 216. Through the second fastener 60, the second connection surface 212 is fixedly connected to the first power distribution layer 412, so that the second connection surface 212 is connected to the first power distribution layer 412, and the outer conductor 21 is connected to the first power distribution layer 412. That is to say, the outer conductor 21 is connected between the first conductive layer 312 and the first power distribution layer 412. In some other embodiments, the second connection surface 212 can also be connected to the first power distribution layer 412 by means including but not limited to welding or gluing, and the outer conductor 21 is also connected to the first power distribution layer 412.

[0087] In some embodiments, the conductor assembly 22 is received in the receiving hole 213, mounted on the second RF device 40, and electrically connected to the second conductive layer 313 and the second power distribution layer 413. The conductor assembly 22 includes a fixing member 221, an insulating member 222, and an inner conductor 223. The fixing member 221 is mounted on the second RF device 40. Specifically, the fixing member 221 is connected to the first power distribution layer 412 and is spaced apart from the outer conductor 21. The inner conductor 223 covers a portion of the insulating member 222. The insulating member 222 is sleeved on the outside of the fixing member 221. The inner conductor 223 is located between the insulating member 222 and the fixing member 221. That is, the inner conductor 223 is surrounded by the outside of the fixing member 221, the insulating member 222 is mounted on the side of the inner conductor 223 facing away from the fixing member 221, and the inner conductor 223 covers a portion of the insulating member 222. The insulating member 222 is spaced apart from the outer conductor 21. The inner conductor 223 is spaced apart from the outer conductor 21, and is electrically connected to the second conductive layer 313 and the second power distribution layer 413. Specifically, the inner conductor 223 abuts against and is electrically connected to the second conductive layer 313. And the inner conductor 223 abuts against and is electrically connected to the fixing member 221. The inner conductor 223 is electrically connected to the second power distribution layer 413 through the fixing member 221. It can be understood that the conductor assembly 22 is mounted on the second RF device 40 through the fixing member 221. The conductor assembly 22 is electrically connected to the second conductive layer 313 and the second power distribution layer 413 through the inner conductor 223 and the fixing member 221.

[0088] like Figure 3 , Figure 8 and Fig. 9 As shown, in some embodiments, the fixing member 221 is made of conductive materials including but not limited to copper or aluminum. That is, the fixing member 221 is made of conductive material. The fixing member 221 includes a first fixing portion 2211 and a second fixing portion 2212. Exemplarily, the first fixing portion 2211 and the second fixing portion 2212 are both cylindrical. In some other embodiments, it can also be a special-shaped column including but not limited to a rectangular body, a triangular column, etc. In the Z-axis direction, the first fixing portion 2211 is located on the side of the first power distribution layer 412 facing away from the insulating connection layer 411, and the first fixing portion 2211 is in contact with the first power distribution layer 412 and is electrically connected. In the Z-axis direction, the second fixing portion 2212 is connected to the surface of the first fixing portion 2211 facing away from the first power distribution layer 412. In the Z-axis direction, the second fixing portion 2212 is spaced apart from the first insulating layer 311 and spaced apart from the second conductive layer 313. The second fixing portion 2212 is spaced apart from the first RF device 30. The fixing member 221 is spaced apart from the first RF component 30 .

[0089] The first fixing portion 2211 is located in the groove 214. In the X-axis direction, the first fixing portion 2211 is spaced apart from the first groove wall 2141 and the second groove wall 2142. The first fixing portion 2211 is located in the groove 214 and is spaced apart from the groove wall of the groove 214. The first fixing portion 2211 is spaced apart from the outer conductor 21. The second fixing portion 2212 is partially located in the groove 214 and partially located between the groove 214 and the first connecting surface 211. In the X-axis direction, the second fixing portion 2212 is spaced apart from the receiving wall 2131 and the first groove wall 2141. The second fixing portion 2212 is spaced apart from the outer conductor 21. It can be understood that the fixing member 221 is spaced apart from the outer conductor 21.

[0090] The fixing member 221 is provided with a sixth mounting hole 2213. The sixth mounting hole 2213 penetrates the fixing member 221 along the Z-axis direction. The sixth mounting hole 2213 penetrates the first fixing portion 2211 and the second fixing portion 2212 along the Z-axis direction. Among them, in the Z-axis direction, the sixth mounting hole 2213 is arranged opposite to the third mounting hole 417 of the second circuit board 41. The sixth mounting hole 2213 and the third mounting hole 417 are used for the third fastener 70 to penetrate. The third fastener 70 passes through the sixth mounting hole 2213 and penetrates into the third mounting hole 417 from the side of the second fixing portion 2212 facing away from the first fixing portion 2211, and is threadedly connected to the third mounting hole 417. Through the third fastener 70, the first fixing portion 2211 is fixedly connected to the second power distribution layer 413. The first fixing portion 2211 is fixedly stacked on the side of the second power distribution layer 413 facing away from the insulating connection layer 411, and is electrically connected to the second power distribution layer 413. That is, the first fixing portion 2211 is connected to the second power distribution layer 413. The fixing member 221 is connected to the second power distribution layer 413. The fixing member 221 is mounted on the second RF device 40. In some other embodiments, the first fixing portion 2211 may also be fixedly stacked and electrically connected to the first power distribution layer 412 by means including but not limited to welding or gluing, and the fixing member 221 is also connected to the second power distribution layer 413, and the fixing member 221 is also mounted on the second RF device 40.

[0091] like Figure 8 , Fig. 9 and Fig.10As shown, in some embodiments, the insulating member 222 is made of an insulating material with elasticity, including but not limited to rubber or plastic. That is to say, the insulating member 222 is made of an insulating material. The insulating member 222 is elastic. In some other embodiments, the insulating member 222 may also be made of a rigid insulating material such as glass. Exemplarily, the insulating member 222 is a circular ring-shaped cylinder. In some other embodiments, the insulating member 222 may also be a rectangular ring-shaped cylinder, a triangular ring-shaped cylinder or other special-shaped ring-shaped cylinder. The insulating member 222 is sleeved on the outside of the second fixing portion 2212 and is installed on the side of the first fixing portion 2211 facing away from the second power distribution layer 413. In the X-axis direction, the insulating member 222 is spaced apart from the second fixing portion 2212. In the Z-axis direction, the insulating member 222 is spaced apart from the first fixing portion 2211 and spaced apart from the second conductive layer 313. The insulating member 222 is partially located in the groove 214 and partially located between the groove 214 and the first connecting surface 211. In the X-axis direction, the insulating member 222 is spaced apart from the hole wall of the receiving hole 213 , and the insulating member 222 is spaced apart from the outer conductor 21 .

[0092] The insulating member 222 includes a first surface 2221, a second surface 2222, a third surface 2223 and a fourth surface 2224. Exemplarily, the first surface 2221 and the second surface 2222 are planes, and the third surface 2223 and the fourth surface 2224 are annular surfaces. In the Z-axis direction, the first surface 2221 and the second surface 2222 are opposite to each other and are spaced apart. In the X-axis direction, the third surface 2223 and the fourth surface 2224 are opposite to each other and are spaced apart. The third surface 2223 and the fourth surface 2224 are both connected between the first surface 2221 and the second surface 2222. Among them, the first surface 2221 faces the second conductive layer 313 and is spaced apart from the second conductive layer 313. The second surface 2222 faces the first fixing portion 2211 and is spaced apart from the first fixing portion 2211. The third surface 2223 faces the second fixing portion 2212 and is spaced apart from the second fixing portion 2212. The fourth surface 2224 faces the outer conductor 21 and is spaced apart from the outer conductor 21. The fourth surface 2224 is flush with the surface of the first fixing portion 2211 facing the outer conductor 21. In some other embodiments, the fourth surface 2224 may not be flush.

[0093] The distance between the fourth surface 2224 and the receiving wall 2131 in the X-axis direction, and the distance between the fourth surface 2224 and the first groove wall 2141 in the X-axis direction are both smaller than the distance between the first fixing portion 2211 and the first groove wall 2141 in the X-axis direction. And the distance between the fourth surface 2224 and the receiving wall 2131 in the X-axis direction, and the distance between the fourth surface 2224 and the first groove wall 2141 in the X-axis direction are both smaller than the distance between the first fixing portion 2211 and the second groove wall 2142 in the X-axis direction. It can be understood that the distance between the first fixing portion 2211 and the groove wall of the groove 214 is greater than the distance between the insulating member 222 and the receiving wall 2131, and greater than the distance between the insulating member 222 and the groove wall of the groove 214. The distance between the insulating member 222 and the hole wall of the receiving hole 213 is smaller than the distance between the fixing member 221 and the hole wall of the receiving hole 213. The distance between the insulating member 222 and the outer conductor 21 is smaller than the distance between the fixing member 221 and the outer conductor 21 .

[0094] In some embodiments, the inner conductor 223 is made of a conductive material including but not limited to copper or aluminum. The inner conductor 223 includes a first conductor 2231, a second conductor 2232, and a third conductor 2233. The first conductor 2231 is fixedly laminated on the first surface 2221 of the insulating member 222 (i.e., the surface of the insulating member 222 facing the second conductive layer 313). In other words, the first conductor 2231 is located between the insulating member 222 and the second conductive layer 313, and is fixedly connected to the insulating member 222. The second conductor 2232 is fixedly laminated on the third surface 2223 of the insulating member 222 (i.e., the surface of the insulating member 222 facing the second fixed portion 2212), and is connected to the first conductor 2231. In other words, the second conductor 2232 is surrounded by the outside of the second fixed portion 2212, and the first conductor 2231 is located on the side of the second conductor 2232 facing away from the first fixed portion 2211, and is connected to the second conductor 2232. The insulating member 222 is mounted on the side of the second conductor 2232 facing away from the second fixing portion 2212, and is fixedly connected to the second conductor 2232. The insulating member 222 is mounted between the first fixing portion 2211 and the first conductor 2231, and is fixedly connected to the first conductor 2231. It can be understood that the second conductor 2232 is located between the insulating member 222 and the fixing member 221, and is fixedly connected to the insulating member 222, and is connected to the first conductor 2231. The third conductor 2233 is fixedly stacked on the second surface 2222 of the insulating member 222 (i.e., the surface of the insulating member 222 facing the first fixing portion 2211), and is connected to the second conductor 2232. In other words, the third conductor 2233 is located between the insulating member 222 and the first fixing portion 2211, and is fixedly connected to the insulating member 222, and is connected to the second conductor 2232.

[0095] The surface of the first conductor 2231 facing the outer conductor 21 is flush with the fourth surface 2224 of the insulating member 222. The first conductor 2231 covers the entire first surface 2221. In some other embodiments, it may not be flush. The first conductor 2231 is spaced apart from the outer conductor 21. In the X-axis direction, the distance between the first conductor 2231 and the receiving wall 2131 is equal to the distance between the insulating member 222 and the receiving wall 2131, and is smaller than the distance between the insulating member 222 and the first slot wall 2141. The surface of the third conductor 2233 facing the outer conductor 21 is flush with the fourth surface 2224 of the insulating member 222. The third conductor 2233 covers the entire second surface 2222. In some other embodiments, it may not be flush. The third conductor 2233 is spaced apart from the outer conductor 21. In the X-axis direction, the distance between the third conductor 2233 and the outer conductor 21 is greater than the distance between the insulating member 222 and the receiving wall 2131, and greater than the distance between the insulating member 222 and the first slot wall 2141. It can be understood that the inner conductor 223 is spaced apart from the outer conductor 21. The distance between the insulating member 222 and the hole wall of the receiving hole 213 is less than or equal to the distance between the inner conductor 223 and the hole wall of the receiving hole 213. The distance between the insulating member 222 and the outer conductor 21 is less than or equal to the distance between the inner conductor 223 and the outer conductor 21.

[0096] The first conductor 2231 abuts against and is electrically connected to the second conductive layer 313. Since the insulating member 222 is elastic, the first conductor 2231 elastically abuts against the second conductive layer 313. The second conductor 2232 abuts against and is electrically connected to the second fixing portion 2212. The second conductor 2232 contacts and is electrically connected to the fixing member 221. The third conductor 2233 abuts against and is electrically connected to the first fixing portion 2211. The third conductor 2233 contacts and is electrically connected to the fixing member 221. In some other embodiments, the third conductor 2233 may also be omitted, and the second surface 2222 of the insulating member 222 may abut against the first fixing portion 2211.

[0097] Since the first fixing portion 2211 is connected to the second power distribution layer 413, and the second fixing portion 2212 is connected to the surface of the first fixing portion 2211 facing away from the second power distribution layer 413, the second conductor 2232 abuts against and is electrically connected to the second fixing portion 2212; the second conductor 2232 is electrically connected to the second power distribution layer 413 through the first fixing portion 2211 and the second fixing portion 2212, and the second conductor 2232 is electrically connected to the second power distribution layer 413 through the fixing member 221. The inner conductor 223 is electrically connected to the second power distribution layer 413 through the fixing member 221. Since the first conductor 2231 is in contact with and electrically connected to the second conductive layer 313, the second conductor 2232 is connected to the first conductor 2231; the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the first conductor 2231, the second conductor 2232 and the fixing member 221, and the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the inner conductor 223 and the fixing member 221. The inner conductor 223 is electrically connected to the second conductive layer 313 and the second power distribution layer 413.

[0098] That is to say, the first conductor 2231 is in contact with and electrically connected to the second conductive layer 313, the second conductor 2232 is connected to the first conductor 2231 and electrically connected to the second power distribution layer 413, and the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the first conductor 2231 and the second conductor 2232. The first conductor 2231 is in contact with the second conductive layer 313 to achieve electrical connection between the two. Such a design is not only simple in structure, but also has a wide range of application scenarios and strong universality; it can also avoid the presence of solder between the first conductor 2231 and the second conductive layer 313, which is conducive to reducing processing costs.

[0099] In addition, since the third conductor 2233 is connected to the second conductor 2232, the third conductor 2233 abuts against and is electrically connected to the first fixing portion 2211; the second conductor 2232 is also electrically connected to the second power distribution layer 413 through the third conductor 2233 and the first fixing portion 2211, which is beneficial to improving the reliability of the electrical connection between the second conductor 2232 and the fixing member 221, and is beneficial to improving the reliability of the electrical connection between the second conductor 2232 and the second power distribution layer 413.

[0100] It can be understood that since the connection area between the first fixing portion 2211 and the second distribution layer 413 can be designed to be larger, the contact area between the fixing member 2211 and the second distribution layer 413 can be designed to be larger, and the design of the fixing member 221 being made of conductive material is conducive to improving the reliability of the electrical connection between the second conductor 2232 and the second distribution layer 413.

[0101] The design in which the second conductor 2232 is electrically connected to the second distribution layer 413 through the first fixing portion 2211 and the second fixing portion 2212 is beneficial to reducing the size of the second conductor 2232, reducing the material cost of the second conductor 2232, reducing the processing cost of the connection component 20, and reducing the processing cost of the RF module 100.

[0102] The insulating member 222 is designed to be elastic, ensuring that the first conductor 2231 and the second conductive layer 313 can be elastically abutted, which is beneficial to increasing the abutment area of ​​the first conductor 2231 and the second conductive layer 313, and is beneficial to improving the reliability of the electrical connection between the first conductor 2231 and the second conductive layer 313. The design of the fixed member 221 and the first RF device 30 being arranged at intervals avoids the rigid contact between the fixed member 221 and the second conductive layer 313, thereby avoiding the situation where the first conductor 2231 cannot be elastically in contact with the second conductive layer 313, which is beneficial to improving the reliability of the abutment between the first conductor 2231 and the second conductive layer 313, and is beneficial to improving the reliability of the electrical connection between the first conductor 2231 and the second conductive layer 313.

[0103] It can be understood that since the first conductive layer 312 is electrically connected to the first power distribution layer 412 through the outer conductor 21, and the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the inner conductor 223 and the fixing member 221; the first RF device 30 and the second RF device 40 are electrically connected through the outer conductor 21, the inner conductor 223 and the fixing member 221. Among them, since the inner conductor 223 and the outer conductor 21 are spaced apart, the inner conductor 223 and the outer conductor 21 are impedance matched and electrically insulated through the air gap. Since the fixing member 221 and the outer conductor 21 are spaced apart, the fixing member 221 and the outer conductor 21 are impedance matched and electrically insulated through the air gap.

[0104] The design in which the distance between the insulating member 222 and the hole wall of the receiving hole 213 is less than or equal to the distance between the inner conductor 223 and the hole wall of the receiving hole 213 is beneficial for reducing the distance between the insulating member 222 and the outer conductor 21 on the basis of achieving impedance matching and electrical insulation between the inner conductor 223 and the outer conductor 21, and is beneficial for reducing the aperture of the receiving hole 213, thereby improving the space utilization of the outer conductor 21 and facilitating the miniaturization design of the connecting component 20.

[0105] The design of the groove 214 ensures that the distance between the first fixing portion 2211 and the outer conductor 21 is greater than the distance between the insulating member 222 and the outer conductor 21. On the basis of not changing the distance between the outer conductor 21 and the insulating member 222, that is, not changing the size of the connecting component 20, impedance matching and electrical insulation between the fixing member 221 and the outer conductor 21 are achieved, which is beneficial to improving the signal transmission efficiency between the second conductive layer 313 and the second distribution layer 413.

[0106] Please refer again Figure 3 , Figure 8 and Fig.10 , an embodiment of the present application provides a connection component 20 for connecting with a first radio frequency device 30 and a second radio frequency device 40, wherein the first radio frequency device 30 includes a first conductive layer 312 and a second conductive layer 313, and the first conductive layer 312 and the second conductive layer 313 are spaced apart. The second radio frequency device 40 includes a first power distribution layer 412 and a second power distribution layer 413, and the first power distribution layer 412 and the second power distribution layer 413 are spaced apart. The connection component 100 includes an outer conductor 21 and a conductor component 22. The outer conductor 21 is connected between the first conductive layer 312 and the first power distribution layer 412. The outer conductor 21 is provided with a receiving hole 213. Along the axial direction of the receiving hole 213 (i.e., in the Z-axis direction), the second conductive layer 313 and the second power distribution layer 413 are located on opposite sides of the outer conductor 21. The conductor component 22 is received in the receiving hole 213. The conductor assembly 22 includes a fixing member 221, an insulating member 222 and an inner conductor 223. The inner conductor 223 is arranged outside the fixing member 221, and the insulating member 222 is installed on the side of the inner conductor 223 facing away from the fixing member 221. The inner conductor 223 covers a part of the insulating member 222. The fixing member 221 is installed on the second RF device 40. The inner conductor 223 is spaced apart from the outer conductor 21 and is electrically connected to the second conductive layer 313 and the second power distribution layer 413. The distance between the insulating member 222 and the hole wall of the receiving hole 213 is less than or equal to the distance between the inner conductor 223 and the hole wall of the receiving hole 213.

[0107] The embodiment of the present application also provides a radio frequency module 100. The radio frequency module 100 includes a first radio frequency device 30, a second radio frequency device 40 and a connecting assembly 20, wherein the first radio frequency device 30 includes a first conductive layer 312 and a second conductive layer 313, and the first conductive layer 312 and the second conductive layer 313 are spaced apart. The second radio frequency device 40 includes a first power distribution layer 412 and a second power distribution layer 413, and the first power distribution layer 412 and the second power distribution layer 413 are spaced apart. The first conductive layer 312 and the first power distribution layer 412 are connected to opposite sides of the outer conductor 21. Along the axial direction of the receiving hole 213 (i.e., in the Z-axis direction), the second conductive layer 313 and the second power distribution layer 413 are located on opposite sides of the outer conductor 21. Among them, the fixing member 221 is installed on the second radio frequency device 40, and the inner conductor 223 is electrically connected to the second conductive layer 313 and the second power distribution layer 413.

[0108] In the connection assembly 20 and the RF module 100 provided in the embodiment of the present application, since the outer conductor 21 is connected between the first conductive layer 312 and the first power distribution layer 412; the first RF device and the second RF device are relatively fixed through the outer conductor 21, and the first conductive layer 312 and the first power distribution layer 412 are electrically connected through the outer conductor 21. Since the inner conductor 223 is surrounded by the outside of the fixing member 221, the insulating member 222 is installed on the side of the inner conductor 223 facing away from the fixing member 221, the inner conductor 223 covers part of the insulating member 222, and the fixing member 221 is installed on the second RF device 40; the inner conductor 223 is relatively fixed to the outer conductor 21. In addition, since the inner conductor 223 is spaced apart from the outer conductor 21 and is electrically connected to the second conductive layer 313 and the second power distribution layer 413; the inner conductor 223 and the outer conductor 21 are separated by air to achieve impedance matching and electrical insulation between the two, and the first RF device 30 and the second RF device 40 are electrically connected through the inner conductor 223 and the outer conductor 21.

[0109] In the connection component 20 of the prior art, the first RF device 30 and the second RF device 40 are relatively fixed by the mounting member of the connection component 20. And the first RF device 30 and the second RF device 40 are electrically connected by the inner conductor 223 and the outer conductor 21 of the connection component 20. Compared with the prior art, this solution can not only omit the mounting member, but also realize the relative fixation of the first RF device 30 and the second RF device 40 by the outer conductor 21, which is beneficial to save the assembly space of the mounting member and is beneficial to the miniaturization design of the connection component 20. Moreover, the design of impedance matching and electrical insulation between the inner conductor 223 and the outer conductor 21 through the air gap is beneficial to reduce the size of the insulating member 222, reduce the processing materials of the insulating member 222, reduce the processing cost of the connection component 20, and is beneficial to the miniaturization design of the insulating member 222 and the miniaturization design of the connection component 20.

[0110] The design in which the distance between the insulating part 222 and the hole wall of the receiving hole 213 is less than or equal to the distance between the inner conductor 223 and the hole wall of the receiving hole 213 is beneficial for reducing the distance between the insulating part 222 and the hole wall of the receiving hole 213 on the basis of achieving impedance matching and electrical insulation between the inner conductor 223 and the outer conductor 21, and is beneficial for reducing the distance between the insulating part 222 and the outer conductor 21, and is beneficial for reducing the aperture of the receiving hole 213, which is beneficial for improving the space utilization of the outer conductor 21 and is beneficial for the miniaturized design of the connecting component 20.

[0111] See also Fig.11 and Fig.12 , and combined with Figure 3 , Fig.11 yes Figure 3 The structure of the radio frequency module 100 shown in FIG. 1 is a schematic diagram of another embodiment. Fig.12 yes Fig.11The structure diagram of the connection assembly 20 of the RF module 100 is shown cut along line DD.

[0112] In some other embodiments, the fixing member 221 is a cylinder. The fixing member 221 is made of insulating materials including but not limited to rubber or plastic. That is, the fixing member 221 is made of insulating material. The fixing member 221 is fixedly stacked on the side of the second power distribution layer 413 facing away from the insulating connection layer 411. In the Z-axis direction, the fixing member 221 and the first radio frequency device 30 are spaced apart. The insulating member 222 is sleeved on the outside of the fixing member 221. The first conductor 2231 of the inner conductor 223 is fixedly stacked on the first surface 2221 of the insulating member 222 (that is, the surface of the insulating member 222 facing the fixing member 221), and is in contact with and electrically connected to the second conductive layer 313. The second conductor 2232 of the inner conductor 223 is fixedly stacked on the third surface 2223 of the insulating member 222 (that is, the surface of the insulating member 222 facing the fixing member 221), and is connected to the first conductor 2231. The second conductor 2232 is in contact with the fixing member 221. The third conductor 2233 of the inner conductor 223 is fixedly stacked on the second surface 2222 of the insulating member 222 (i.e., the insulating member 222 faces the second power distribution layer 413), and is connected to the second conductor 2232. In other words, the third conductor 2233 is located between the insulating member 222 and the second power distribution layer 413, and is fixedly connected to the second power distribution layer 413, and is connected to the second conductor 2232. The third conductor 2233 abuts against and is electrically connected to the second power distribution layer 413.

[0113] Since the first conductor 2231 is in contact with and electrically connected to the second conductive layer 313, the second conductor 2232 is connected to the first conductor 2231, the third conductor 2233 is connected to the second conductor 2232, and the third conductor 2233 is in contact with and electrically connected to the second power distribution layer 413; the second conductor 2232 is electrically connected to the second power distribution layer 413 through the third conductor 2233, the first conductor 2231 is electrically connected to the second power distribution layer 413 through the second conductor 2232 and the third conductor 2233, and the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the first conductor 2231, the second conductor 2232 and the third conductor 2233. That is, the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the inner conductor 223. The electrical connection between the second power distribution layer 413 is achieved by the contact between the third conductor 2233 and the second power distribution layer 413. Such a design is not only simple in structure, but also has wide application scenarios and strong universality; it can also avoid the presence of solder between the third conductor 2233 and the second power distribution layer 413, which is beneficial to reducing processing costs.

[0114] The groove 214 may be omitted. The surface of the insulating member 222 facing the outer conductor 21 (i.e., the fourth surface 2224) is located between the outer conductor 21 and the surface of the first conductor 2231 facing the outer conductor 21, and is spaced apart from the surface of the first conductor 2231 facing the outer conductor 21. It can be understood that the first conductor 2231 covers a portion of the first surface 2221, abuts against and is electrically connected to the second conductive layer 313. The surface of the insulating member 222 facing the outer conductor 21 (i.e., the fourth surface 2224) is located between the outer conductor 21 and the surface of the third conductor 2233 facing the outer conductor 21, and is spaced apart from the surface of the third conductor 2233 facing the outer conductor 21. It can be understood that the third conductor 2233 covers a portion of the second surface 2222, abuts against and is electrically connected to the second power distribution layer 413.

[0115] Since the first conductor 2231 covers a portion of the first surface 2221, the distance between the first conductor 2231 and the hole wall of the receiving hole 213 is smaller than the distance between the insulating member 222 and the hole wall of the receiving hole 213. The distance between the first conductor 2231 and the outer conductor 21 is smaller than the distance between the insulating member 222 and the outer conductor 21. Since the third conductor 2233 covers a portion of the second surface 2222, the distance between the third conductor 2233 and the hole wall of the receiving hole 213 is smaller than the distance between the insulating member 222 and the hole wall of the receiving hole 213, and the distance between the third conductor 2233 and the outer conductor 21 is smaller than the distance between the insulating member 222 and the outer conductor 21. The distance between the inner conductor 223 and the hole wall of the receiving hole 213 is smaller than the distance between the insulating member 222 and the hole wall of the receiving hole 213, and the distance between the inner conductor 223 and the outer conductor 21 is smaller than the distance between the insulating member 222 and the outer conductor 21. In this way, on the basis of ensuring impedance matching and electrical insulation between the first conductor 2231 and the third conductor 2233 and the outer conductor 21, the distance between the insulating member 222 and the outer conductor 21 is further reduced, and the insulating member 222 and the outer conductor 21 can even be in contact, further reducing the aperture of the receiving hole 213, which is beneficial to improving the space utilization of the outer conductor 21 and facilitating the miniaturization design of the connection assembly 20. It can be understood that the insulating member 222 can be in contact with the hole wall of the receiving hole 213, and the insulating member 222 can be in contact with the outer conductor 21. The distance between the insulating member 222 and the hole wall of the receiving hole 213 can be equal to zero. The distance between the insulating member 222 and the outer conductor 21 can be equal to zero.

[0116] In other embodiments, the fixing member 221 may also be made of conductive materials including but not limited to copper or aluminum. The fixing member 221 is fixedly stacked on the side of the second distribution layer 413 facing away from the insulating connection layer 411, and is electrically connected to the second distribution layer 413. The second conductor 2232 of the inner conductor 223 abuts against and is electrically connected to the fixing member 221. The second conductor 2232 may also be electrically connected to the second distribution layer 413 through the fixing member 221. In this way, it is not only beneficial to improve the reliability of the electrical connection between the second conductive layer 313 and the second distribution layer 413; moreover, a variety of materials can be selected to make the fixing member 221, which is beneficial to reduce the processing cost of the fixing member 221. In other embodiments, the fixing member 221 may also be fixedly stacked on the side of the insulating connection layer 411 facing the second distribution layer 413.

[0117] See also Fig.13 , Fig.14 and Fig.15 , and combined with Figure 3 , Fig.13 yes Figure 3 The structure of the radio frequency module 100 shown in FIG. 1 is a schematic diagram of another embodiment. Fig.14 yes Fig.13 The structure diagram of the connection assembly 20 of the radio frequency module 100 is shown cut along line EE. Fig.15 yes Fig.13 The structure diagram of the connection assembly 20 of the RF module 100 is shown cut along line FF.

[0118] like Fig.13 , Fig.14 and Fig.15 As shown, in some other embodiments, the fixing member 221 is a cylinder. The fixing member 221 is fixedly stacked on the second power distribution layer 413 and is electrically connected to the second power distribution layer 413. In the Z-axis direction, the fixing member 221 is spaced apart from the first RF device 30. The insulating member 222 is sleeved on the outside of the fixing member 221. The insulating member 222 abuts against the second RF device 40. Specifically, the first surface 2221 of the insulating member 222 faces the second conductive layer 313 and is spaced apart from the second conductive layer 313. The second surface 2222 of the insulating member 222 abuts against the second power distribution layer 413. The third surface 2223 of the insulating member 222 faces the fixing member 221 and is spaced apart from the fixing member 221. The fourth surface 2224 of the insulating member 222 faces the outer conductor 21 and is spaced apart from the outer conductor 21. In other embodiments, the second surface 2222 of the insulating member 222 may also face the insulating connection layer 411 and abut against the insulating connection layer 411.

[0119] The third conductor 2233 of the inner conductor 223 (such as Figure 3The first conductor 2231 of the inner conductor 223 is fixedly stacked on the first surface 2221 of the insulating member 222 (i.e., the surface of the insulating member 222 facing the fixing member 221), and is in contact with and electrically connected to the second conductive layer 313. The second conductor 2232 of the inner conductor 223 is fixedly stacked on the third surface 2223 of the insulating member 222 (i.e., the surface of the insulating member 222 facing the fixing member 221), and is connected to the first conductor 2231. The second conductor 2232 is in contact with and electrically connected to the fixing member 221. And the second conductor 2232 is in contact with and electrically connected to the second power distribution layer 413.

[0120] Since the first conductor 2231 is in contact with and electrically connected to the second conductive layer 313, the second conductor 2232 is connected to the first conductor 2231, the second conductor 2232 is in contact with and electrically connected to the fixing member 221, and the second conductor 2232 is in contact with and electrically connected to the second power distribution layer 413, the fixing member 221 is fixedly stacked on the second power distribution layer 413 and electrically connected to the second power distribution layer 413; the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the first conductor 2231 and the second conductor 2232, and is electrically connected to the second power distribution layer 413 through the first conductor 2231, the second conductor 2232 and the fixing member 221. That is, the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the inner conductor 223 and the fixing member 221.

[0121] Among them, since the second conductor 2232 is in contact with and electrically connected to the fixing member 221, the second conductor 2232 is indirectly electrically connected to the second power distribution layer 413 through the fixing member 221. Since the second conductor 2232 is in contact with and electrically connected to the second power distribution layer 413, the second conductor 2232 is also directly electrically connected to the second power distribution layer 413, which is beneficial to improving the reliability of the electrical connection between the second conductor 2232 and the second power distribution layer 413, and is beneficial to improving the reliability of the electrical connection between the second conductive layer 313 and the second power distribution layer 413.

[0122] Groove 214 (eg Figure 3The surface of the insulating member 222 facing the outer conductor 21 (i.e., the fourth surface 2224) is located between the outer conductor 21 and the surface of the first conductor 2231 facing the outer conductor 21, and is spaced apart from the surface of the first conductor 2231 facing the outer conductor 21. It can be understood that the first conductor 2231 covers a portion of the first surface 2221, and abuts against and is electrically connected to the second conductive layer 313. Since the first conductor 2231 covers a portion of the first surface 2221; the distance between the first conductor 2231 and the hole wall of the receiving hole 213 is smaller than the distance between the insulating member 222 and the hole wall of the receiving hole 213, the distance between the first conductor 2231 and the outer conductor 21 is smaller than the distance between the insulating member 222 and the outer conductor 21, the distance between the inner conductor 223 and the hole wall of the receiving hole 213 is smaller than the distance between the insulating member 222 and the hole wall of the receiving hole 213, and the distance between the inner conductor 223 and the outer conductor 21 is smaller than the distance between the insulating member 222 and the outer conductor 21. In this way, on the basis of ensuring impedance matching and electrical insulation between the first conductor 2231 and the outer conductor 21, the distance between the insulating part 222 and the outer conductor 21 is further reduced, and the insulating part 222 and the outer conductor 21 can even be in contact, further reducing the aperture of the receiving hole 213, which is beneficial to improving the space utilization of the outer conductor 21 and facilitating the miniaturized design of the connecting component 20.

[0123] See also Fig.16 , and combined with Fig.13 , Fig.16 yes Fig.13 The structure of the radio frequency module 100 shown in FIG. 1 is a schematic diagram of another embodiment.

[0124] In some other embodiments, the insulating member 222 abuts against the fixing member 221. Specifically, the third surface 2223 of the insulating member 222 faces the fixing member 221 and abuts against the fixing member 221. The surface of the insulating member 222 facing the fixing member 221 (i.e., the third surface 2223) is provided with a receiving groove 2225. The receiving groove 2225 is arranged on the third surface 2223. The receiving groove 2225 extends along the Z-axis direction and has an opening, and the opening is located on the first surface 2221 of the insulating member 222.

[0125] The first conductor 2231 of the inner conductor 223 is fixedly stacked on the first surface 2221 of the insulating member 222 (i.e., the surface of the insulating member 222 facing the fixing member 221), and is in contact with and electrically connected to the second conductive layer 313. The second conductor 2232 of the inner conductor 223 is fixedly stacked on the surface of the receiving groove 2225 facing the fixing member 221, and is connected to the first conductor 2231. That is, the second conductor 2232 of the inner conductor 223 is received in the receiving groove 2225 and is connected to the first conductor 2231. The second conductor 2232 is fixedly connected to the side of the insulating member 222 facing the fixing member 221. The second conductor 2232 is in contact with and electrically connected to the fixing member 221. Among them, part of the second conductor 2232 is in contact with the fixing member 221, and part of it is not in contact with the fixing member 221. The length of the projection of the second conductor 2232 on the fixing member 221 (i.e., the dimension in the Z-axis direction) is not less than 1 mm (millimeter). In the Z-axis direction, the second conductor 2232 and the second power distribution layer 413 are spaced apart from each other.

[0126] Since the first conductor 2231 is in contact with and electrically connected to the second conductive layer 313, the second conductor 2232 is connected to the first conductor 2231, the second conductor 2232 is in contact with and electrically connected to the fixing member 221, the second conductor 2232 is electrically connected to the second power distribution layer 413 through the fixing member 221, the first conductor 2231 is electrically connected to the second power distribution layer 413 through the second conductor 2232 and the fixing member 221, and the second conductive layer 313 is electrically connected to the second power distribution layer 413 through the inner conductor 223 and the fixing member 221. The design of the second conductor 2232 and the second power distribution layer 413 being arranged at intervals is conducive to reducing the size of the second conductor 2232, reducing the material cost of the second conductor 2232, and reducing the processing cost of the connection assembly 20.

[0127] See also Fig.17 , and combined with Figure 3 , Fig.17 yes Figure 3 The structure of the radio frequency module 100 shown in FIG. 1 is a schematic diagram of another embodiment.

[0128] In some other embodiments, the third fastener 70, the third mounting hole 417 and the sixth mounting hole 2213 are omitted. The fixing member 221 is fixedly connected to the side of the insulating connection layer 411 facing the second distribution layer 413, and the fixing member 221 is located in the second distribution layer 413 and fixedly connected to the second distribution layer 413. Exemplarily, the fixing member 221 is integrally formed with the insulating connection layer 411. In some other embodiments, the fixing member 221 can also be fixedly connected to the side of the insulating connection layer 411 facing the second distribution layer 413 by means including but not limited to welding, gluing or fasteners. Specifically, the first fixing portion 2211 is fixedly stacked on the side of the insulating connection layer 411 facing the second distribution layer 413. The first fixing portion 2211 is located in the second distribution layer 413 and fixedly connected to the second distribution layer 413. In the Z-axis direction, the second fixing portion 2212 is connected to the surface of the first fixing portion 2211 facing away from the insulating connection layer 411.

[0129] Among them, the outer surface of the fixing member 221 is provided with a distribution body 224, and the distribution body 224 covers the outside of the fixing member 221. Specifically, the distribution body 224 includes a first section 2241, a second section 2242, a third section 2243 and a fourth section 2244. Exemplarily, the first section 2241 is a circular plane. The second section 2242, the third section 2243 and the fourth section 2244 are all annular surfaces. The first section 2241 is fixedly stacked on the surface of the second fixing part 2212 facing away from the first fixing part 2211. The second section 2242 is fixedly stacked on the surface of the second fixing part 2212 facing the outer conductor 21, and is connected to the first section 2241. The third section 2243 is fixedly stacked on the surface of the first fixing part 2211 facing the second fixing part 2212, and is connected to the second section 2242. The fourth section 2244 is fixedly stacked on the surface of the first fixing part 2211 facing the outer conductor 21, and is connected to the third section 2243. And the fourth section 2244 is connected to the second power distribution layer 413. That is, the power distribution body 224 is connected to the second power distribution layer 413. Exemplarily, the power distribution body 224 and the second power distribution layer 413 can be integrally formed on the outer surface of the fixing member 221. In some other embodiments, the power distribution body 224 and the second power distribution layer 413 can also be connected by welding.

[0130] The insulating member 222 is sleeved on the outside of the second fixing portion 2212 and mounted on the side of the first fixing portion 2211 facing away from the insulating connecting layer 411. The first conductor 2231 of the inner conductor 223 is fixedly stacked on the first surface 2221 and abuts against and electrically connected to the second conductive layer 313. The inner conductor 223 abuts against and electrically connected to the second conductive layer 313. The second conductor 2232 of the inner conductor 223 is fixedly stacked on the third surface 2223 and abuts against and electrically connected to the second section 2242 of the distributor 224. The third conductor 2233 of the inner conductor 223 is fixedly stacked on the second surface 2222 and abuts against and electrically connected to the third section 2243 of the distributor 224. The inner conductor 223 abuts against and electrically connected to the distributor 224. That is, the outer surface of the fixing member 221 is provided with a power distribution body 224 , which covers the outside of the fixing member 221 and abuts against and is electrically connected to the inner conductor 223 . The power distribution body 224 is connected to the second power distribution layer 413 .

[0131] Since the current distributor 224 covers the outside of the fixing member 221, abuts against the inner conductor 223, and is electrically connected to the inner conductor 223, the current distributor 224 is connected to the second distribution layer 413, and the inner conductor 223 is electrically connected to the second distribution layer 413 through the current distributor 224. Since the inner conductor 223 abuts against and is electrically connected to the second conductive layer 313, the second conductive layer 313 is electrically connected to the second distribution layer 413 through the inner conductor 223 and the current distributor 224. It can be understood that there are various ways to electrically connect the inner conductor 223 to the second distribution layer 413, with low design cost and low processing cost.

[0132] See also Fig.18 , and combined with Figure 3 , Fig.18 yes Figure 3 The structure of the radio frequency module 100 shown in FIG. 1 is a schematic diagram of another embodiment.

[0133] In some other embodiments, the number of the first through holes 3121 of the first conductive layer 312, the number of the second conductive layer 313, the number of the second through holes 3141 of the third conductive layer 314, the fourth conductive layer 315, and the number of the radiation units 32 are all multiple. Specifically, the number of the first through holes 3121 of the first conductive layer 312, the number of the second conductive layer 313, the number of the third conductive layer 314, the fourth conductive layer 315, and the number of the radiation units 32 are all 2. In some other embodiments, the number of the first through holes 3121 of the first conductive layer 312, the number of the second conductive layer 313, the number of the third conductive layer 314, the fourth conductive layer 315, and the number of the radiation units 32 may also be 3, 4, or more. The multiple first through holes 3121 are arranged at intervals along the X-axis direction. The multiple second conductive layers 313 are located in the multiple first through holes 3121 in a one-to-one correspondence, and are all arranged at intervals from the first conductive layer 312. The plurality of fourth conductive layers 315 are located in the plurality of second through holes 3141 in a one-to-one correspondence, and are spaced apart from the third conductive layer 314. The third conductive layer 314 is electrically connected to the first conductive layer 312 by means including but not limited to vias, and the plurality of fourth conductive layers 315 are electrically connected to the plurality of second conductive layers 313 in a one-to-one correspondence. The plurality of radiation units 32 are fixedly stacked on the side of the third conductive layer 314 facing away from the first conductive layer 312, and are fixedly stacked on the plurality of fourth conductive layers 315 in a one-to-one correspondence.

[0134] The number of the third through holes 4121 of the first distribution layer 412, the number of the second distribution layer 413, the number of the fourth through holes 4141 of the third distribution layer 414, the fourth distribution layer 415, and the number of the phase shift unit 42 are all multiple. Specifically, the number of the third through holes 4121 of the first distribution layer 412, the number of the second distribution layer 413, the number of the third distribution layer 414, the number of the fourth distribution layer 415 and the number of the phase shift unit 42 are all 2. In other embodiments, the number of the third through holes 4121 of the first distribution layer 412, the number of the second distribution layer 413, the number of the third distribution layer 414, the number of the fourth distribution layer 415 and the number of the phase shift unit 42 may also be 3, 4 or more. The multiple third through holes 4121 are spaced apart along the X-axis direction. The multiple second distribution layers 413 are located in the multiple third through holes 4121 in a one-to-one correspondence, and are all spaced apart from the first distribution layer 412. The plurality of fourth power distribution layers 415 are located in the plurality of fourth through holes 4141 in a one-to-one correspondence, and are spaced apart from the third power distribution layer 414. The third power distribution layer 414 is electrically connected to the first power distribution layer 412 by means including but not limited to vias, and the plurality of fourth power distribution layers 415 are electrically connected to the plurality of second power distribution layers 413 in a one-to-one correspondence. The plurality of phase shifting units 42 are fixedly stacked on the side of the third conductive layer 314 facing away from the first power distribution layer 412, and are fixedly stacked on the plurality of fourth power distribution layers 415 in a one-to-one correspondence.

[0135] The outer conductor 21 is connected between the first conductive layer 312 and the first power distribution layer 412. The number of the receiving holes 213 of the outer conductor 21 and the number of the conductor components 22 are both multiple. Specifically, the number of the receiving holes 213 of the outer conductor 21 and the number of the conductor components 22 are both 2. The multiple receiving holes 213 are arranged at intervals along the X-axis direction. Among them, the multiple second conductive layers 313 are located in the multiple receiving holes 213 in a one-to-one correspondence. The multiple second power distribution layers 413 are located in the multiple receiving holes 213 in a one-to-one correspondence. The conductor components 22 are located in the multiple receiving holes 213 in a one-to-one correspondence. The multiple conductor components 22 are relatively fixed to the multiple second power distribution layers 413 in a one-to-one correspondence, and the inner conductors 223 of the multiple conductor components 22 are electrically connected to the multiple second conductive layers 313 and the multiple second power distribution layers 413 in a one-to-one correspondence. For details, please refer to Figure 3 The relevant description of the illustrated embodiment is not repeated here. Thus, the plurality of radiation units 32 are electrically connected to the plurality of phase shift units 42 in a one-to-one correspondence through the plurality of conductor components 22. In this way, it is beneficial to increase the capacity of the RF signal transmitted from the second RF device 40 to the first RF device 30 after the phase shift processing by the phase shift unit 42, and it is beneficial to improve the signal transmission efficiency between the first RF device 30 and the second RF device 40.

[0136] It can be understood that in this embodiment, the number of the second conductive layer 313, the second power distribution layer 413, the receiving holes 213 and the conductor components 22 are all multiple, and the multiple second conductive layers 313, the multiple second power distribution layers 413 and the multiple conductor components 22 are located in the multiple receiving holes 213 one by one, and the multiple conductor components 22 are electrically connected to the multiple second conductive layers 313 and the multiple second power distribution layers 413 one by one.

[0137] The inner conductors 223 of the plurality of conductor components 22 are electrically connected to the plurality of second conductive layers 313 and the plurality of second power distribution layers 413 in a one-to-one correspondence, and the plurality of second conductive layers 313 and the plurality of second power distribution layers 413 are electrically connected in a one-to-one correspondence. A single connection component 20 can realize the electrical connection of the plurality of second conductive layers 313 of the first RF device 30 and the plurality of second power distribution layers of the second RF device 40, which is conducive to reducing the complexity of the structure, making the structure simple and easy to install.

Claims

1. A connection assembly, used to connect a first radio frequency device and a second radio frequency device, wherein the first radio frequency device comprises a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are spaced apart, and the second radio frequency device comprises a first power distribution layer and a second power distribution layer, the first power distribution layer and the second power distribution layer are spaced apart, It is characterized in that The connection component comprises: an outer conductor, the outer conductor being connected between the first conductive layer and the first power distribution layer, the outer conductor being provided with a receiving hole, and along the axial direction of the receiving hole, the second conductive layer and the second power distribution layer being located at opposite sides of the outer conductor; and A conductor assembly, the conductor assembly is received in the receiving hole, the conductor assembly comprises a fixing part, an insulating part and an inner conductor, the inner conductor is arranged outside the fixing part, the insulating part is installed on the side of the inner conductor facing away from the fixing part, the inner conductor covers a part of the insulating part, the fixing part is installed on the second radio frequency device, the inner conductor is spaced apart from the outer conductor, and is electrically connected to the second conductive layer and the second power distribution layer; Wherein, the distance between the insulating member and the hole wall of the receiving hole is less than or equal to the distance between the inner conductor and the hole wall of the receiving hole.

2. The connection assembly according to claim 1, It is characterized in that The inner conductor includes a first conductor and a second conductor, the first conductor is located between the insulating member and the second conductive layer and is fixedly connected to the insulating member, the second conductor is located between the insulating member and the fixing member and is fixedly connected to the insulating member and is connected to the first conductor, the first conductor abuts against and is electrically connected to the second conductive layer, and the second conductor is electrically connected to the second power distribution layer.

3. The connection assembly according to claim 2, It is characterized in that The insulating component is elastic, the first conductor is in elastic contact with the second conductive layer, and the fixing component is spaced apart from the first radio frequency component.

4. The connection assembly according to claim 2, It is characterized in that The fixing member is made of a conductive material, the fixing member is connected to the second power distribution layer, and the second conductor is in contact with and electrically connected to the fixing member.

5. The connection assembly according to claim 4, It is characterized in that The fixing member includes a first fixing portion and a second fixing portion, the first fixing portion is connected to the second power distribution layer, and the second fixing portion is connected to a surface of the first fixing portion facing away from the second power distribution layer; The second conductor is arranged outside the second fixing portion, the first conductor is located on a side of the second conductor facing away from the first fixing portion and is connected to the second conductor, the insulating component is installed on a side of the second conductor facing away from the second fixing portion and is fixedly connected to the second conductor, and the insulating component is installed between the first fixing portion and the first conductor and is fixedly connected to the first conductor, and the second conductor abuts against and is electrically connected to the second fixing portion.

6. The connection assembly according to claim 5, It is characterized in that The inner conductor includes a third conductor, the third conductor is located between the insulating member and the first fixing portion, and is fixedly connected to the insulating member and connected to the second conductor, and the third conductor abuts against and is electrically connected to the first fixing portion.

7. The connection assembly according to claim 5, It is characterized in that The receiving hole includes a receiving wall, the receiving wall is surrounded by a groove, the first fixing portion is located in the groove and is spaced apart from the groove wall of the groove, and the distance between the first fixing portion and the groove wall of the groove is greater than the distance between the insulating member and the receiving wall.

8. The connection assembly according to claim 4, It is characterized in that The insulating member abuts against the second radio frequency device; The second conductor is fixedly stacked on the surface of the insulating member facing the fixing member and connected to the first conductor, the second conductor abuts against and is electrically connected to the fixing member, and the second conductor abuts against and is electrically connected to the second power distribution layer; Alternatively, the insulating member abuts against the fixing member, a receiving groove is provided on the surface of the insulating member facing the fixing member, the second conductor is fixedly received in the receiving groove and connected to the first conductor, the second conductor abuts against the fixing member and is electrically connected, and the second conductor is spaced apart from the second distribution layer.

9. The connection assembly according to claim 8, It is characterized in that The insulating member includes a first surface, the first surface faces the second conductive layer, and the first conductor covers a portion of the first surface and abuts against and is electrically connected to the second conductive layer.

10. The connection assembly according to claim 2, It is characterized in that The inner conductor includes a third conductor, the third conductor is located between the insulating member and the second power distribution layer, and is fixedly connected to the insulating member and connected to the second conductor. The third conductor abuts against and is electrically connected to the second power distribution layer.

11. The connection assembly according to claim 10, It is characterized in that The insulating member includes a first surface and a second surface, the first surface faces the second conductive layer, the second surface faces the second power distribution layer, the first conductor covers a portion of the first surface, abuts against and is electrically connected to the second conductive layer, and the third conductor covers a portion of the second surface, abuts against and is electrically connected to the second power distribution layer.

12. The connection assembly according to any one of claims 1 to 3, It is characterized in that The second radio frequency device includes an insulating connection layer, the first distribution layer and the second distribution layer are fixedly stacked on the insulating connection layer, the fixing piece is fixedly connected to a side of the insulating connection layer facing the second distribution layer, a distribution body is provided on the outer surface of the fixing piece, the distribution body covers the outside of the fixing piece, abuts against the inner conductor, and is electrically connected to the inner conductor, and the distribution body is connected to the second distribution layer.

13. The connection assembly according to any one of claims 1 to 12, It is characterized in that The number of the second conductive layer, the second power distribution layer, the receiving holes and the conductor components are all multiple, and the multiple second conductive layers, the multiple second power distribution layers and the multiple conductor components are located in the multiple receiving holes one by one, and the inner conductors of the multiple conductor components are electrically connected to the multiple second conductive layers and the multiple second power distribution layers one by one.

14. A radio frequency module, It is characterized in that The RF module comprises a first RF device, a second RF device and the connection assembly according to any one of claims 1 to 13, wherein the first RF device comprises a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are spaced apart, the second RF device comprises a first power distribution layer and a second power distribution layer, the first power distribution layer and the second power distribution layer are spaced apart; The first conductive layer and the first power distribution layer are connected to opposite sides of the outer conductor, and along the axial direction of the receiving hole, the second conductive layer and the second power distribution layer are located on opposite sides of the outer conductor; Wherein, the fixing member is mounted on the second radio frequency device, and the inner conductor is electrically connected to the second conductive layer and the second power distribution layer.

15. A base station antenna, It is characterized in that The substrate antenna includes the radio frequency module according to claim 14 and an antenna cover, and the radio frequency module is accommodated in the antenna cover.

16. A base station, It is characterized in that The base station includes the base station antenna according to claim 15 and a base station server, and the base station server is electrically connected to the base station antenna.

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