Flexible circuit board and display device

Abstract

The invention discloses a flexible circuit board and a display device, and relates to the technical field of display, the flexible circuit board comprises a first board area, a second board area and a connecting area, the connecting area is connected between the first board area and the second board area, the thickness of the flexible circuit board corresponding to the first board area is greater than that of the flexible circuit board corresponding to the second board area, and the thickness of the flexible circuit board is greater than that of the second board area. The flexible circuit board corresponding to the second board area is used for being bent, the first board area and the second board area are each provided with at least one first supporting layer and at least one metal layer, and the first supporting layers and the metal layers are arranged in a stacked mode in the thickness direction of the flexible circuit board; and the reinforcing structure is arranged in the connecting area. The reinforcing structure is arranged in the connecting area of the first plate area and the second plate area, the structural strength of the connecting area of the first plate area and the second plate area is improved, the bending strength and the pulling strength of the connecting area can be improved, and therefore the bending life of the second plate area is effectively prolonged.

Description

Flexible circuit board and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] With the development of display technology, flexible circuit boards are now designed with rigid and flexible sections. The flexible sections are bent to facilitate connection to other components, facilitating space design for the entire device. However, bending the flexible sections creates stress concentration at the connection between the rigid and flexible sections, leading to fractures in the connection, affecting the flexible circuit board's routing, resulting in poor display quality, and shortening the display's lifespan.

[0003] Summary of the Invention

[0004] The embodiments of the present application provide a flexible circuit board and a display device, which can improve the bending performance of the flexible circuit board, avoid affecting the routing of the flexible circuit board, extend the service life of the flexible circuit board, and ensure the display stability of the display device.

[0005] According to a first aspect of an embodiment of the present application, a flexible circuit board is provided, comprising:

[0006] A first board area, a second board area, and a connection area, wherein the connection area is connected between the first board area and the second board area, the thickness of the flexible circuit board corresponding to the first board area is greater than the thickness of the flexible circuit board corresponding to the second board area, the flexible circuit board corresponding to the second board area is configured to be bent, and the first board area and the second board area are both provided with at least one first support layer and at least one metal layer, and the first support layer and the metal layer are stacked in a thickness direction of the flexible circuit board;

[0007] The reinforcement structure is arranged in the connection area.

[0008] In some embodiments, the flexible circuit board further comprises:

[0009] A second supporting layer is disposed in the first plate area, and at least one second supporting layer extends to the second plate area, wherein the second supporting layer located in the second plate area is used to form at least a portion of the reinforcement structure.

[0010] In some embodiments, in a direction from the first plate area to the second plate area, a size of the second supporting layer in the second plate area is less than or equal to 1 mm.

[0011] In some embodiments, there are at least two of the second support layers extending to the second plate region;

[0012] In the second plate area, the second supporting layer facing away from the bending direction of the second plate area is the first extension layer, and the second supporting layer facing the bending direction of the second plate area is the second extension layer. In the direction from the first plate area to the second plate area, the size of the first extension layer is larger than the size of the second extension layer.

[0013] In some embodiments, the number of the metal layers provided in the first plate area is greater than the number of the metal layers provided in the second plate area, and the metal layers in the second plate area are provided in the same layer as part of the metal layers in the first plate area;

[0014] The number of the first supporting layers provided in the first plate area is greater than the number of the first supporting layers provided in the second plate area, and the first supporting layers in the second plate area are provided in the same layer as part of the first supporting layers in the first plate area;

[0015] The shielding layer is arranged on both sides of the flexible circuit board in the thickness direction.

[0016] In some embodiments, at least one first supporting layer in the first panel area extends to the second panel area, and the portion of the first supporting layer extending into the second panel area is used to form at least a portion of the reinforcement structure; and / or,

[0017] At least one metal layer in the first plate area extends to the second plate area, and the portion of the metal layer extending to the second plate area is used to form at least a portion of the reinforcement structure.

[0018] In some embodiments, the reinforcement structure is a wedge-shaped structure.

[0019] In some embodiments, the first support layer comprises polyimide; and / or,

[0020] The second support layer includes polypropylene.

[0021] In some embodiments, the reinforcement structure comprises:

[0022] A first fixing adhesive is located on a side of the flexible circuit board away from a bending direction of the second board area, and / or located on a side of the flexible circuit board toward a bending direction of the second board area.

[0023] According to a second aspect of the embodiments of the present application, a display device is provided, including:

[0024] The flexible circuit board as described in the first aspect;

[0025] The display panel is connected by binding pins of the flexible circuit board and the binding pins of the display panel.

[0026] In some embodiments, the display device further includes:

[0027] a first supporting structure, disposed between the non-display side of the display panel and the flexible circuit board;

[0028] The second supporting structure, the display panel includes a bending area, the bending area is provided with binding pins of the display panel, the display panel in the bending area is used to bend to the side of the first supporting structure away from the display side, and the second supporting structure is arranged between the first supporting structure and the display panel in the bending area.

[0029] In some embodiments, the display device further includes:

[0030] The third supporting structure has adhesives at both ends of the supporting structure, and the third supporting structure is arranged between the first supporting structure and the flexible circuit board in the second board area. The third supporting structure is located in the connection area between the first board area and the second board area.

[0031] In some embodiments, the third support structure comprises PET.

[0032] The flexible circuit board provided in the embodiment of the present application is provided with a first plate area, a second plate area and a reinforcement structure. Among them, the first plate area and the second plate area are connected, and the hardness of the flexible circuit board corresponding to the first plate area is greater than the hardness of the flexible circuit board corresponding to the second plate area, and the thickness of the flexible circuit board corresponding to the first plate area is greater than the thickness of the flexible circuit board corresponding to the second plate area. The flexible circuit board corresponding to the second plate area can be bent so as to facilitate connection to the opponent and facilitate the spatial layout design of the display device. By providing a reinforcement structure in the connection area between the first plate area and the second plate area, the structural strength of the connection area between the first plate area and the second plate area is improved, and the bending strength and tensile strength of the connection area can be improved, thereby effectively improving the bending life of the second plate area. Avoid affecting the routing of the flexible circuit board, ensure the display stability of the display device, and extend the service life of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;

[0034] FIG2 is a schematic diagram showing the partitioning of the first board area and the second board area of ​​the flexible circuit board shown in FIG1 ;

[0035] FIG3 is a partial schematic cross-sectional view of the flexible circuit board shown in FIG1 ;

[0036] FIG4 is a schematic structural diagram of a flexible circuit board according to another embodiment of the present application;

[0037] FIG5 is a partial schematic cross-sectional view of the flexible circuit board shown in FIG3 ;

[0038] FIG6 is a schematic diagram of a fixed glue dispensing position according to an embodiment of the present application;

[0039] FIG7 is a second schematic diagram of a fixed glue dispensing position according to an embodiment of the present application;

[0040] FIG8 is a third schematic diagram of a fixed glue dispensing position according to an embodiment of the present application;

[0041] FIG9 is a fourth schematic diagram of a fixed glue dispensing position according to an embodiment of the present application;

[0042] FIG10 is a fifth schematic diagram of a fixed glue dispensing position according to an embodiment of the present application;

[0043] FIG11 is a sixth schematic diagram of a fixed glue dispensing position according to an embodiment of the present application;

[0044] FIG12 is a schematic structural diagram of a display device according to an embodiment of the present application, in which the second panel area is in an unbent state;

[0045] FIG13 is a schematic structural diagram of a display device according to an embodiment of the present application, in which the second panel area is in a bent state;

[0046] FIG14 is a schematic structural diagram of a display device according to another embodiment of the present application;

[0047] FIG15 is a schematic structural diagram of a display device according to another embodiment of the present application;

[0048] FIG16 is a schematic cross-sectional view of a third supporting structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0050] In this article, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also include elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprising a ..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. The term "two or more" includes two or more than two cases.

[0051] As shown in FIG1 to FIG10 , in a first aspect of an embodiment of the present application, an embodiment of the present application provides a flexible circuit board 100 , comprising: a first board area 110 , a second board area 120 and a connection area, wherein:

[0052] The above-mentioned connection area is connected between the above-mentioned first board area and the above-mentioned second board area. The thickness of the above-mentioned flexible circuit board 100 corresponding to the above-mentioned first board area 110 is greater than the thickness of the above-mentioned flexible circuit board 100 corresponding to the above-mentioned second board area 120. The above-mentioned flexible circuit board 100 corresponding to the above-mentioned second board area 120 is used for bending. The above-mentioned first board area 110 and the above-mentioned second board area 120 are both provided with at least one first supporting layer 160 and at least one metal layer 150. The above-mentioned first supporting layer 160 and the above-mentioned metal layer 150 are stacked in the thickness direction of the above-mentioned flexible circuit board 100; the reinforcement structure 130 is arranged in the above-mentioned connection area.

[0053] It will be appreciated that the flexible circuit board 100 provided in the embodiments of the present application is provided with a first panel area 110, a second panel area 120, a connection region, and a reinforcement structure 130. The first panel area 110 and the second panel area 120 are connected, with a connection region formed between the first and second panels. Furthermore, the hardness of the flexible circuit board 100 corresponding to the first panel area 110 is greater than that corresponding to the second panel area 120, and the thickness of the flexible circuit board 100 corresponding to the first panel area 110 is greater than that corresponding to the second panel area 120. This allows the flexible circuit board 100 corresponding to the second panel area 120 to be bent. Specifically, the second panel area 120 may be formed with a bending region and a connection region. The flexible circuit board 100 in the first panel area 110 can be connected to a first counterpart. The second panel area 120 can be bent in the bending region, allowing the flexible circuit board 100 in the connection region to face away from the first counterpart and connect to the second counterpart via the connection region, thereby facilitating the spatial layout design of the display device 200. If the second panel area 120 bends, the connection area between the first and second panels 110, 120 becomes the starting point of the bend, where stress concentration is likely to occur. If the second panel area 120 is bent for a long time, this connection area may break, affecting the routing of the flexible circuit board 100 and causing display defects. By providing a reinforcement structure 130 at the connection area between the first and second panels 110, 120, the structural strength of the connection area between the first and second panels 110, 120 is increased, thereby enhancing the bending and tensile strength of the connection area, thereby effectively improving the bending life of the second panel area 120. This prevents interference with the routing of the flexible circuit board 100, ensures the display stability of the display device 200, and extends the service life of the flexible circuit board 100.

[0054] It will be appreciated that the flexible circuit board 100 is further provided with a metal layer 150 and a first supporting layer 160. Specifically, the first supporting layer 160 and the metal layer 150 are stacked in the thickness direction of the flexible circuit board 100. The metal layer 150 is used for electrical conductivity, and the first supporting layer 160 provides support for the metal layer 150. Multiple metal layers 150 and first supporting layers 160 are provided, and both the first and second board regions 110 and 120 are provided with at least one metal layer 150 and first supporting layer 160. Specifically, the number of metal layers 150 in the first board region 110 is greater than the number of metal layers 150 in the second board region 120, and the number of first supporting layers 160 in the first board region 110 is greater than the number of first supporting layers 160 in the second board region 120. This ensures that the thickness of the flexible circuit board 100 in the first board region 110 is greater than that in the second board region 120. Under the premise of satisfying the overall performance of the flexible circuit board 100 , it is ensured that the flexible circuit board 100 in the second board area 120 can be bent to a set position.

[0055] Exemplarily, the first plate area 110 is provided with four metal layers 150 and four first support layers 160, and the second plate area 120 is provided with two metal layers 150 and one first metal layer 150. The thickness of the metal layer 150 is 10 microns to 20 microns, and the thickness of the first support layer 160 is 15 microns.

[0056] In some embodiments, as shown in Figure 3, the flexible circuit board 100 further includes: a second supporting layer 140, which is disposed in the first board area 110, and there is at least one second supporting layer 140 extending to the second board area 120, wherein the second supporting layer 140 located in the second board area 120 is used to form at least part of the reinforcement structure 130.

[0057] It is understood that the flexible circuit board 100 is also provided with a second support layer 140. Specifically, the second support layer 140 is provided within the first board area 110, and the flexible circuit board 100 in the first board area 110 can be supported by the second support layer 140 to improve structural strength. In addition, there is at least one second support layer 140 extending from the first board area 110 to the second board area 120. The second support layer 140 located in the second board area 120 can serve as a reinforcement structure 130. When the second board area 120 is bent and pulled, it can support the connection area between the first board area 110 and the second board area 120, thereby improving stress concentration at the starting point of bending, increasing the bending strength and tensile strength at the starting point of bending, and effectively improving the bending life of the second board area 120.

[0058] For example, in the direction of the horizontal plane, the second supporting layer 140 is located on the end face of the second plate area 120 and has at least one convex point and one concave point, so that the end face is wavy or broken line-shaped, thereby avoiding stress concentration at the same section of the second supporting layer 140 in the second plate area 120 when the second plate area 120 is bent, thereby improving the stress concentration and further improving the structural strength of the connection area between the first plate area 110 and the second plate area 120.

[0059] In some embodiments, as shown in FIG3 , in a direction from the first plate area 110 to the second plate area 120 , a size of the second supporting layer 140 in the second plate area 120 is less than or equal to 1 mm.

[0060] It is understood that if the second support layer 140 within the second panel area 120 is too long, as it points from the first panel area 110 to the second panel area 120, the overall structural strength of the second panel area 120 will be too strong, making it difficult to bend and affecting assembly. If the second support layer 140 within the second panel area 120 is too short, the structural strength of the connection area between the first and second panel areas 110 and 120 will be weakened, and stress concentration will easily occur in the connection area, causing the connection area between the first and second panel areas 110 and 120 to be prone to fracture, affecting the routing of the flexible circuit board 100 and causing display defects. Therefore, the size of the second support layer 140 within the second panel area 120 is set to be less than or equal to 1 mm.

[0061] In some embodiments, as shown in Figure 3, there are at least two second support layers 140 extending to the second plate area 120; in the second plate area 120, the second support layer 140 away from the bending direction of the second plate area 120 is the first extension layer 141, and the second support layer 140 toward the bending direction of the second plate area 120 is the second extension layer 142. In the direction from the first plate area 110 to the second plate area 120, the size of the first extension layer 141 is larger than the size of the second extension layer 142.

[0062] It is understood that multiple second support layers 140 may be provided, with at least two second support layers 140 extending into the second board area 120, further enhancing the structural strength of the connection area between the first board area 110 and the second board area 120. Furthermore, in the direction from the first board area 110 to the second board area 120, the dimension of the first extension layer 141 extending into the second board area 120 is greater than the dimension of the second extension layer 142 extending into the second board area 120. This arrangement ensures that the dimensions of the first extension layer 141 and the second extension layer 142 are designed to meet the bending direction of the second board area 120. When the second board area 120 bends, the bending length of the flexible circuit board 100 away from the bending direction of the second board area 120 is greater than the bending length of the flexible circuit board 100 toward the bending direction of the second board area 120. Therefore, the first extension layer 141 is longer to improve the structural strength of the flexible circuit board 100 in the bending direction away from the second board area 120, and the second extension layer 142 is longer to improve the structural strength of the flexible circuit board 100 in the bending direction toward the second board area 120.

[0063] It is understood that the dimensional difference between the first extension layer 141 and the second extension layer 142 is inversely proportional to the bending radius of the second board area 120. Specifically, the larger the bending radius of the second board area 120, the smaller the deformation of the connection area between the first board area 110 and the second board area 120, thereby reducing the stress concentration. The smaller the difference between the bending length of the flexible circuit board 100 away from the bending direction of the second board area 120 and the bending length of the flexible circuit board 100 toward the second board area 120, the smaller the dimensional difference between the first extension layer 141 and the second extension layer 142 is, the smaller the bending variation of the second board area 120.

[0064] In some embodiments, as shown in Figure 3, the number of the above-mentioned metal layers 150 set in the above-mentioned first board area 110 is greater than the number of the above-mentioned metal layers 150 set in the above-mentioned second board area 120, and the above-mentioned metal layers 150 of the above-mentioned second board area 120 are arranged on the same layer as part of the above-mentioned metal layers 150 in the above-mentioned first board area 110; the number of the above-mentioned first supporting layers 160 set in the above-mentioned first board area 110 is greater than the number of the above-mentioned first supporting layers 160 set in the above-mentioned second board area 120, and the above-mentioned first supporting layers 160 of the above-mentioned second board area 120 are arranged on the same layer as part of the above-mentioned first supporting layers 160 in the above-mentioned first board area 110; the shielding layer 170 is arranged on both sides of the above-mentioned flexible circuit board 100 in the thickness direction.

[0065] It will be appreciated that the flexible circuit board 100 is provided with a metal layer 150, a first support layer 160, and a shielding layer 170. Specifically, the metal layer 150 can be used for electrical conduction. There are multiple metal layers 150, and the number of metal layers 150 located in the first board area 110 is greater than the number of metal layers 150 in the second board area 120. Part of the metal layer 150 is provided only in the first board area 110, while another part of the metal layer 150 is provided in both the first board area 110 and the second board area 120. The second support layer 140 and the first support layer 160 are stacked on the metal layer 150 to support the metal layer 150 and improve the overall structural strength of the flexible circuit board 100. Multiple first supporting layers 160 are provided, and the number of first supporting layers 160 located in the first panel area 110 is greater than the number of first supporting layers 160 located in the second panel area 120. Part of the first supporting layers 160 is located only in the first panel area 110, while another portion of the first supporting layers 160 is located in both the first panel area 110 and the second panel area 120. The shielding layer 170 shields external electromagnetic signals, preventing signal interference and improving the operating stability of the flexible circuit board 100. Furthermore, because the number of metal layers 150, second supporting layers 140, and first supporting layers 160 in the first panel area 110 of the flexible circuit board 100 is greater than that in the second panel area 120, the thickness of the flexible circuit board 100 in the first panel area 110 is greater than that in the second panel area 120.

[0066] Exemplarily, the flexible circuit board 100 is further provided with a cover film 180 . The cover film 180 covers the metal layer 150 close to the shielding layer 170 to improve the protection energy of the metal layer 150 .

[0067] By way of example, the metal layer 150 of the flexible circuit board 100 can be divided into a first metal layer 151 and a second metal layer 152. The first metal layer 151 is disposed only in the first board area 110, while the second metal layer 152 is disposed in both the first board area 110 and the second board area 120. The first metal layer 151 can have four layers, while the second metal layer 152 can have two layers. A first supporting layer 160 is disposed between the two second metal layers 152. Two second supporting layers 140 are disposed on the side of the second metal layer 152 away from the first supporting layer 160, extending from the first board area 110 to the second board area 120. The second supporting layer 140 facing away from the bending direction of the second board area 120 serves as the first extension layer 141, while the second supporting layer 140 facing the bending direction of the second board area 120 serves as the second extension layer 142. In the direction from the first plate area 110 to the second plate area 120, the difference in size between the first extension layer 141 and the second extension layer 142 is greater than the sum of the thicknesses of the two second metal layers 152 and the first support layer 160 between the two second metal layers 152. This ensures that the second support layer 140 extending to the second plate area 120 functions as a reinforcement structure 130, thereby improving stress concentration in the connection area between the first plate area 110 and the second plate area 120.

[0068] For example, the first support layer 160 can be a polyimide support layer, with a thickness of 15 microns. There are four first support layers 160 in the first panel region 110, one of which extends into the second panel region 120. The second support layer 140 can be a polypropylene support layer, with a thickness of 40 microns. There are three second support layers 140 in the first panel region 110, two of which extend into the second panel region 120. The dimension of the second support layer 140 extending into the second panel region 120 in the direction of the bend is 1 mm shorter than the dimension of the second support layer 140 extending into the second panel region 120 in the direction of the bend. The outermost layers of the laminated structure of the first and second panel regions are both shielding layers, and the thickness of the shielding layer 170 in the first panel region 110 and the shielding layer 170 in the second panel region 120 are equal, both 15 microns. The first and second plate areas are both provided with a covering film 180 , which covers the metal layer 150 close to the shielding layer 170 . The covering film 180 of the first plate area 110 and the covering film 180 of the second plate area 120 have the same thickness, both 15 μm.

[0069] In some embodiments, as shown in Figures 4 and 5, at least one layer of the first supporting layer 160 in the first plate area 110 extends to the second plate area 120, and the portion of the first supporting layer 160 extending to the second plate area 120 is used to form at least a portion of the reinforcing structure 130; and / or, at least one layer of the metal layer 150 in the first plate area 110 extends to the second plate area 120, and the portion of the metal layer 150 extending to the second plate area 120 is used to form at least a portion of the reinforcing structure 130.

[0070] It is understood that at least one first support layer 160 exists within the first panel region 110 and extends to the second panel region 120. The first support layer 160 extending to the second panel region 120 can form at least a portion of the reinforcement structure 130, thereby improving the structural strength of the connection area between the first and second panel regions 110, 120 and alleviating stress concentration. At least one metal layer 150 exists within the first panel region 110 and extends to the second panel region 120. The metal layer 150 extending to the second panel region 120 can form at least a portion of the reinforcement structure 130, thereby improving the structural strength of the connection area between the first and second panel regions 110, 120 and alleviating stress concentration. The metal layer 150 extending to the second panel region 120, the second support layer 140, and the first support layer 160 together form the reinforcement structure 130, further improving the bending and tensile strength of the connection area, thereby effectively increasing the bending life of the second panel region 120. This avoids affecting the routing of the flexible circuit board 100 , ensures the display stability of the display device 200 , and prolongs the service life of the flexible circuit board 100 .

[0071] In some embodiments, as shown in FIG. 4 and FIG. 5 , the reinforcement structure 130 is a wedge-shaped structure 131 .

[0072] It is understood that the reinforcement structure 130 is a wedge-shaped structure 131. Specifically, the metal layer 150, second supporting layer 140, first supporting layer 160, and shielding layer 170 extending to the second panel area 120 are arranged obliquely toward the second panel area 120 to form the wedge-shaped structure 131. Across the thickness of the flexible circuit board 100, the thicker first panel area 110 transitions to the thinner second panel area 120 in a wedge-shaped manner. This allows the metal layer 150, second supporting layer 140, and first supporting layer 160 in the reinforcement structure 130 to collectively enhance the structural strength of the connection area between the first and second panel areas 110, 120, and alleviate stress concentration. This further increases the bending and tensile strength of the connection area, effectively improving the bending life of the second panel area 120. This prevents interference with the routing of the flexible circuit board 100, ensures the display stability of the display device 200, and extends the service life of the flexible circuit board 100. Furthermore, the wedge-shaped structure 131 may be inclined at an angle of 30° to 60° from the first plate area 110 to the second plate area 120 .

[0073] Exemplarily, the metal layer 150 of the flexible circuit board 100 can be divided into a third metal layer 153 and a fourth metal layer 154. The thickness of each of the third metal layer 153 and the fourth metal layer 154 is 15 microns. Four third metal layers 153 are provided. These third metal layers 153 are provided in the first board area 110 and extend to the connection area between the first board area 110 and the second board area 120. The third metal layers 153 extending to the second board area 120 partially form the reinforcement structure 130. Two fourth metal layers 154 are provided, each provided in the first board area 110 and the second board area 120. Four first supporting layers 160 are provided, each having a thickness of 15 microns. Three first supporting layers 160 are provided in the first board area 110 and extend to the connection area between the first board area 110 and the second board area 120. The first supporting layers 160 extending to the second board area 120 partially form the reinforcement structure 130. The remaining first supporting layer 160 is disposed between the two fourth metal layers 154. Three second supporting layers 140 are provided, each having a thickness of 40 microns. Each second supporting layer 140 is disposed in the first board area 110 and extends to the connection area between the first board area 110 and the second board area 120. The second supporting layers 140 extending to the second board area 120 form part of the reinforcement structure 130. In the thickness direction of the flexible circuit board 100, the laminated structure extending to the connection area between the first board area 110 and the second board area 120 becomes longer as it approaches the fourth metal layer 154, thereby forming a wedge-shaped structure 131. The wedge-shaped structure 131 is inclined at an angle of 30° from the first board area 110 to the second board area 120.

[0074] In some embodiments, the second supporting layer 140 includes polypropylene; and / or the first supporting layer 160 includes polyimide.

[0075] It is understood that the second support layer 140 can be made of polypropylene. Polypropylene has chemical resistance, heat resistance, electrical insulation, high mechanical strength, and good high-wear processing properties, making it suitable for flexible circuit board 100 and improving the structural strength of flexible circuit board 100. The first support layer 160 is made of polyimide, a thin-film insulating material with excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance. Exemplarily, the cover film 180 includes an epoxy resin thermosetting adhesive film.

[0076] In some embodiments, as shown in Figures 6 to 11, the above-mentioned reinforcement structure 130 includes: a first fixing glue 132, and the above-mentioned first fixing glue 132 is located on the side of the above-mentioned flexible circuit board 100 away from the bending direction of the above-mentioned second board area 120, and / or, is located on the side of the above-mentioned flexible circuit board 100 toward the bending direction of the above-mentioned second board area 120.

[0077] It is understood that the reinforcement structure 130 is also provided with a first fixing adhesive 132. The first fixing adhesive 132 can be applied to the connection area between the first panel area 110 and the second panel area 120 through a dispensing process to strengthen the structural strength of the connection area. The specific dispensing location can be determined based on the actual situation of the flexible circuit board 100. Specifically, in the thickness direction of the flexible circuit board 100, the side of the first panel area 110 that is connected to the display panel 210 is the bottom layer 113; the side of the first panel area 110 facing away from the bottom layer 113 is the top layer 111; and the space between the bottom layer 113 and the top layer 111 is the middle layer 112.

[0078] As shown in Figure 7, the second panel 120 can be connected to the top layer 111 of the first panel 110. In this case, the second panel 120 and the top layer 111 are flush with each other in the thickness direction of the flexible circuit board 100, with no step. A first fixing adhesive 132 can be applied to the side of the flexible circuit board 100 that bends toward the second panel 120. The first fixing adhesive 132 is applied simultaneously to the top layer 111 and the side of the second panel 120 that is closest to the top layer 111.

[0079] As shown in FIG8 , it is understood that the thickness of the first fixing adhesive 132 can be controlled within 0.2 mm. When the second board area 120 is connected to the top layer 111 of the first board area 110, there are thickness restrictions on both the top layer 111 side and the bottom layer 113 side of the first board area 110 during assembly. In this case, the first fixing adhesive 132 can be applied on the side away from the bending direction of the second board area 120. This allows the first fixing adhesive 132 to be located only at the gap between the bottom layer 113 and the second board area 120, and the first fixing adhesive 132 is not applied on the bottom layer 113. This improves the structural strength of the connection area between the first board area 110 and the second board area 120 while not affecting the overall thickness of the flexible circuit board 100.

[0080] As shown in FIG9 , it is understood that the thickness of the first fixing adhesive 132 can be controlled within 0.2 mm. When the second panel 120 is connected to the top layer 111 of the first panel 110, during assembly, there is a thickness restriction on the top layer 111 side of the first panel 110, making it impossible to apply adhesive to the top layer 111. In this case, the first fixing adhesive 132 can be applied on the side facing away from the bending direction of the second panel 120, that is, the first fixing adhesive 132 is placed on the side facing away from the back side F of the bending direction. This allows the first fixing adhesive 132 to be applied to the bottom layer 113, the side of the second panel 120 close to the bottom layer 113, and the gap between the bottom layer 113 and the second panel 120.

[0081] As shown in Figure 10, the second board area 120 can be connected to the middle layer 112 of the first board area 110. In this case, there is a step difference between the second board area 120 and the top layer 111, and there is also a step difference between the second board area 120 and the bottom layer 113 in the thickness direction of the flexible circuit board 100. Depending on the actual situation, the first fixing adhesive 132 can be applied to the top layer 111, the side of the second board area 120 close to the top layer 111, and the step difference between the top layer 111 and the second board area 120, or to the bottom layer 113, the side of the second board area 120 close to the bottom layer 113, and the step difference between the bottom layer 113 and the second board area 120. The first fixing adhesive 132 is placed on the side facing the bending direction W.

[0082] As shown in Figure 11, the reinforcing structure 130 between the first panel area 110 and the second panel area 120 is a wedge-shaped structure 131, so that a first inclined surface is formed between the second panel area 120 and the top layer 111, and a second inclined surface is formed between the second panel area 120 and the bottom layer 113. The first fixing glue 132 can be applied to the first inclined surface and / or the second inclined surface to strengthen the structural strength of the wedge-shaped structure 131 through the first fixing glue 132, thereby improving the bending resistance of the second panel area 120.

[0083] By comparing the flexible circuit board 100 provided with the first fixing glue 132 and the flexible circuit board 100 without the reinforcement structure 130, the flexible circuit board 100 provided with the first fixing glue 132 has a 90° bending frequency increase of approximately 63% in the second board area 120, and the flexible circuit board 100 provided with the first fixing glue 132 has a 180° bending frequency increase of approximately 60% in the second board area 120, which is a significant effect.

[0084] As shown in Figures 12 to 16, a second aspect of an embodiment of the present application provides a display device 200, including: the flexible circuit board 100 as described in the first aspect; and a display panel 210, wherein the binding pins of the flexible circuit board 100 are bound and connected to the binding pins of the display panel 210.

[0085] It is understood that the display device 200 is provided with the flexible circuit board 100 described in any of the above-described technical solutions, and therefore has all the beneficial effects of the flexible circuit board 100 described above, which will not be further described here. During the assembly of the display panel 210 and the flexible circuit board 100, the binding pins of the flexible circuit board 100 can be bound and connected to the binding pins of the display panel 210. As shown in Figure 11, after the assembly of the display panel 210 and the flexible circuit board 100 is completed, the second board area 120 is in an unbent state. As shown in Figure 12, the second board area 120 can be bent in a direction away from the display side of the display panel 210 to facilitate assembly of the second board area 120 with the counterpart.

[0086] In some embodiments, as shown in Figures 12 to 16, the display device 200 further includes: a first supporting structure 220, which is arranged between the non-display side of the display panel 210 and the flexible circuit board 100; a second supporting structure 230, the display panel 210 includes a bending area, the bending area is provided with binding pins of the display panel 210, the display panel 210 in the bending area is used to bend to the side of the first supporting structure 220 away from the display side, and the second supporting structure 230 is arranged between the first supporting structure 220 and the display panel 210 in the bending area.

[0087] It will be appreciated that the display device 200 is further provided with a first support structure 220 and a second support structure 230. The first support structure 220 is disposed between the non-display side of the display panel 210 and the flexible circuit board 100 to support the first panel area 110. Since the flexible circuit board 100 is located on the non-display side of the display panel 210, the display panel 210 is provided with a bending region, and the bending region is provided with binding pins for the display panel 210. By bending the display panel 210 in the bending region away from the display side, the binding pins of the display panel 210 are positioned on the non-display side, facilitating the binding connection between the binding pins of the flexible circuit board 100 and the binding pins of the display panel 210. Furthermore, the second support structure 230 is disposed between the first support structure 220 and the display panel 210 in the bending region to support the binding pins of the flexible circuit board 100 and the display panel 210 after the binding straps are connected, ensuring the stability of the binding connection.

[0088] For example, adhesive may be provided between the first supporting structure 220 and the flexible circuit board 100 in the first board area 110 to ensure a tight connection between the first supporting structure 220 and the flexible circuit board 100 in the first board area 110 and improve stability.

[0089] In some embodiments, as shown in Figures 14 to 16, the display device 200 further includes: a third supporting structure 240, both ends of which are provided with adhesive 241, the third supporting structure 240 is arranged between the first supporting structure 220 and the flexible circuit board 100 of the second board area 120, and the third supporting structure 240 is located in the connection area between the first board area 110 and the second board area 120.

[0090] As will be appreciated, the display device 200 is also provided with a third support structure 240. Specifically, adhesive 241 is applied to both ends of the third support structure 240, so that one end of the third support structure 240 is adhered to the first support structure 220, and the other end of the third support structure 240 is adhered to the connection area between the first and second board sections 110 and 120. This arrangement provides tension to the flexible circuit board 100 in the connection area through the third support structure 240, thereby securing the flexible circuit board 100 to the first support structure 220. This also changes the location of the bending starting point of the second board section 120, so that the bending starting point is located only in the second board section 120. This prevents stress concentration in the connection area due to different hardnesses, which could lead to fracture in the connection area. Furthermore, it increases the adhesive surface area between the flexible circuit board 100 and the first support layer 160, further improving the connection security between the flexible circuit board 100 and the first support layer 160.

[0091] For example, as shown in FIG15 , the second board area 120 is connected to the top layer 111 of the first board area 110, and a step exists between the bottom layer 113 and the second board area 120. A third support structure 240 can be provided at the step to provide tension to the flexible circuit board 100 in the connection area, thereby securing the flexible circuit board 100 in the connection area to the first support structure 220. Simultaneously, a first fixing adhesive 132 can be applied to the top layer 111 and the side of the second board area 120 near the top layer 111, further improving the structural strength of the connection area between the first board area 110 and the second board area 120, alleviating stress concentration at the bending starting point, and increasing the bending strength and tensile strength at the bending starting point, thereby effectively extending the bending life of the second board area 120.

[0092] In some embodiments, the third support structure 240 comprises PET.

[0093] It is understood that the substrate 242 of the third support structure 240 can be made of PET (Polyethylene terephthalate), which has good toughness and electrical insulation properties, avoids affecting the flexible circuit board 100, and improves stability.

[0094] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

[0095] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0096] Obviously, those skilled in the art may make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if such changes and modifications fall within the scope of the claims of this specification and their equivalents, this specification is intended to include such changes and modifications.

Claims

1. A flexible circuit board, characterized in that: include: A first board area, a second board area and a connection area, wherein the connection area is connected between the first board area and the second board area, the thickness of the flexible circuit board corresponding to the first board area is greater than the thickness of the flexible circuit board corresponding to the second board area, the flexible circuit board corresponding to the second board area is used for bending, and the first board area and the second board area are both provided with at least one first support layer and at least one metal layer, and the first support layer and the metal layer are stacked in the thickness direction of the flexible circuit board; The reinforcement structure is arranged in the connection area.

2. The flexible circuit board according to claim 1, characterized in that: The flexible circuit board also includes: A second supporting layer is arranged in the first plate area, and there is at least one second supporting layer extending to the second plate area, wherein the first supporting layer located in the second plate area is used to form at least a part of the reinforcement structure.

3. The flexible circuit board according to claim 2, characterized in that: In the direction from the first plate area to the second plate area, a size of the second supporting layer in the second plate area is less than or equal to 1 mm.

4. The flexible circuit board according to claim 3, characterized in that: There are at least two of the second support layers extending to the second plate area; In the second plate area, the second supporting layer away from the bending direction of the second plate area is the first extension layer, and the second supporting layer toward the bending direction of the second plate area is the second extension layer. In the direction from the first plate area to the second plate area, the size of the first extension layer is larger than the size of the second extension layer.

5. The flexible circuit board according to claim 2, characterized in that: The number of the metal layers arranged in the first plate area is greater than the number of the metal layers arranged in the second plate area, and the metal layers in the second plate area are arranged in the same layer as part of the metal layers in the first plate area; The number of the first supporting layers arranged in the first plate area is greater than the number of the first supporting layers arranged in the second plate area, and the first supporting layers in the second plate area are arranged in the same layer as part of the first supporting layers in the first plate area; The shielding layer is arranged on both sides of the flexible circuit board in the thickness direction.

6. The flexible circuit board according to claim 5, characterized in that: At least one of the first supporting layers in the first panel area extends to the second panel area, and the portion of the first supporting layer extending to the second panel area is used to form at least a portion of the reinforcement structure; and / or, At least one of the metal layers in the first plate area extends to the second plate area, and the portion of the metal layer extending to the second plate area is used to form at least a portion of the reinforcement structure.

7. The flexible circuit board according to claim 6, characterized in that: The reinforcement structure is a wedge-shaped structure.

8. The flexible circuit board according to claim 6, characterized in that: The first supporting layer comprises polyimide; and / or, The second support layer includes polypropylene.

9. The flexible circuit board according to claim 1, characterized in that: The reinforcement structure comprises: The first fixing glue is located on a side of the flexible circuit board away from a bending direction of the second board area, and / or the first fixing glue is located on a side of the flexible circuit board toward a bending direction of the second board area.

10. A display device, characterized in that: include: The flexible circuit board according to any one of claims 1 to 9; The display panel, the binding pins of the flexible circuit board are bound and connected with the binding pins of the display panel.

11. The display device according to claim 10, characterized in that: Also includes: A first supporting structure is disposed between the non-display side of the display panel and the flexible circuit board; The second supporting structure, the display panel includes a bending area, the bending area is provided with binding pins of the display panel, the display panel in the bending area is used to bend to the side of the first supporting structure away from the display side, and the second supporting structure is arranged between the first supporting structure and the display panel in the bending area.

12. The display device according to claim 11, characterized in that: Also includes: A third supporting structure, both ends of which are provided with adhesive, the third supporting structure is arranged between the first supporting structure and the flexible circuit board in the second board area, and the third supporting structure is located in the connection area between the first board area and the second board area.

13. The display device according to claim 12, characterized in that: The third support structure comprises PET.

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