Hanging tool suitable for rapid press-fit sealing of vertical continuous electroplating equipment

Abstract

The invention relates to the technical field of electroplating equipment, and discloses a hanging tool suitable for rapid press-fit sealing of vertical continuous electroplating equipment, the device comprises a hanging tool main body, a wafer main body and a sealing plate, one side of the hanging tool main body is fixedly provided with a conducting strip and a wire, and the middle of the inner part of the hanging tool main body is provided with a mounting groove; the hanger is characterized in that a gear ring is connected to the interior of the mounting groove in a clamped mode, a sealing structure is arranged on the inner side of the gear ring, and a pressing structure is arranged on the side, close to the hanger body, of the sealing plate; the sealing structure comprises an adjusting unit and an abutting unit, the adjusting unit comprises an arc-shaped strip installed in the gear ring in a sliding mode, and the abutting unit comprises an abutting groove and an inclined block, so that the problems that when the sealing back plate is fixed, multi-point positioning and unlocking are still needed, and when the vertical continuous electroplating equipment is used, the sealing back plate cannot be fixed easily are solved. The sealing back plate is inconvenient to mount and dismount quickly, and the use continuity and the production efficiency are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating equipment, and particularly to a fixture suitable for rapid pressing and sealing of vertical continuous electroplating equipment. Background Art

[0002] In a wafer product electroplating equipment, wafers are placed in the electroplating bath liquid through a fixture for electroplating process operations. Each wafer is electroplated on only one side, and the other side needs to be sealed and protected.

[0003] For example, a positive-pressure type wafer electroplating fixture with the publication number CN216006066U has a concave cavity on the surface of the fixture substrate for placing wafer products. A sealing backplane is fastened and fixed on the concave cavity. The inner side surface of the sealing backplane is provided with protrusions corresponding to the shape of the concave cavity. The outer edge of the sealing backplane leans against the surface of the fixture substrate. A plurality of locking mechanisms for locking the sealing backplane are arranged on the fixture substrate. The locking arm can rotate and lift around the locking cam, driving the lower surface of the locking arm to press against the outer side surface of the sealing backplane. Among them, when the locking arm travels to the lower limit along the cam contour of the locking cam, there is a gap between the lower surface of the locking arm and the surface of the fixture substrate, which can improve the production and processing efficiency while enhancing the electroplating quality, reduce the influence of the wear of the locking mechanism on the electrolyte and the product, and also avoid excessive residue of the liquid medicine and the like in the fixture. However, when fixing the sealing backplane of this device, it is still necessary to rotate and position the locking cam separately, and the operation is relatively cumbersome. After electroplating is completed, it is also necessary to rotate and unlock in sequence. When used in a vertical continuous electroplating equipment in the prior art, it is not convenient to quickly install and disassemble the sealing backplane, reducing the usage continuity and being not suitable for use in vertical continuous electroplating equipment, having limitations. Moreover, the usual wafer fixture only fits wafers of the same size and is not convenient for positioning wafers of different thicknesses and sizes, and the applicable range is also small.

[0004] Therefore, a fixture suitable for rapid pressing and sealing of vertical continuous electroplating equipment is proposed to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a fixture suitable for rapid pressing and sealing of vertical continuous electroplating equipment to solve the problems that when fixing the sealing backplane, multi-point positioning and unlocking are still required, and when used in vertical continuous electroplating equipment, it is not convenient to quickly install and disassemble the sealing backplane, reducing the usage continuity and production efficiency.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A fixture suitable for rapid pressing and sealing of vertical continuous electroplating equipment includes a fixture main body, a wafer main body, and a sealing plate. One side of the fixture main body is fixedly installed with a conductive sheet and a wire, and an installation groove is opened in the middle of the interior of the fixture main body; It further includes: A toothed ring is snap - fitted inside the installation groove. A sealing structure is arranged inside the toothed ring. A pressing structure is arranged on one side of the sealing plate close to the fixture body. A pressing plate is installed on the side of the sealing plate far from the fixture body. The sealing structure includes an adjusting unit and a pressing unit. The adjusting unit includes an arc - shaped strip slidably installed inside the toothed ring. One side of the arc - shaped strip is fixedly connected with a sliding strip and a pushing block. The other side of the arc - shaped strip is fixedly connected with a sliding column, and the sliding column is slidably installed with the toothed ring. The pressing unit includes a pressing groove and an inclined block. The inclined block is slidably connected with the pressing groove. The inclined surface of the inclined block abuts against the pushing block. One end of the inclined block is fixedly installed with a pressing block, and the pressing block is located inside the toothed ring. A sealing gasket is also installed inside the toothed ring.

[0007] Preferably, arc - shaped grooves are symmetrically opened inside the toothed ring. A fixing ring is fixedly installed inside the arc - shaped grooves. The arc - shaped strip is slidably connected with the arc - shaped grooves. The sliding strip is slidably connected with the fixing ring. A first spring is sleeved outside the sliding strip. One end of the first spring is fixedly connected with the arc - shaped strip, and the other end of the first spring is fixedly connected with the fixing ring.

[0008] By adopting the above - mentioned technical solution, the pressing plate drives the positioning groove and the sealing plate to rotate. The sealing plate drives the sliding column to rotate clockwise, which is convenient for positioning the wafer body through the pressing block. After electroplating is completed, the pressing plate drives the sealing plate to rotate counterclockwise, and the pressing block releases the clamping of the wafer body, which is convenient for removing the wafer body.

[0009] Preferably, there are no less than three arc - shaped grooves. The number of the fixing rings and the arc - shaped strips is the same as that of the arc - shaped grooves. The arc - shaped grooves are communicated with the pressing grooves. Symmetrically fixed on the inner wall of the pressing groove are second springs. One end of the second spring far from the inner wall of the pressing groove is fixedly connected with the inclined block.

[0010] By adopting the above - mentioned technical solution, the sliding column drives the arc - shaped strip and the sliding strip to slide inside the arc - shaped groove. The arc - shaped strip compresses the first spring, and the sliding strip drives the pushing block to slide. The pushing block extrudes the inclined surface of the inclined block, so that the inclined block stretches the second spring and approaches the wafer body.

[0011] Preferably, a fixing bolt is slidably installed inside the pressing block. The fixing bolt is threadedly connected with the inclined block. Symmetrically opened on one side of the toothed ring close to the sealing plate are limiting grooves. The number of the limiting grooves is the same as that of the arc - shaped grooves. The sliding column is slidably connected with the limiting grooves. The sealing gasket fits with the inner side of the toothed ring.

[0012] By adopting the above - mentioned technical solution, the fixing bolt is convenient for replacing pressing blocks of different sizes, so as to adapt to the size of the wafer body for use.

[0013] Preferably, the pressing structure includes a clamping groove formed on one side of the sealing plate. The number of the clamping grooves is the same as that of the sliding columns. The sliding columns are inserted and fixed in the clamping grooves. Inner grooves are symmetrically formed on one side of the sealing plate. A third spring is fixedly installed inside the inner grooves. One end of the third spring close to the gear ring is fixedly connected to a sliding rod. The sliding rod is slidably connected to the inner groove. Two sliding rods are symmetrically arranged.

[0014] By adopting the above technical solution, when the sliding columns are inserted into the clamping grooves, the sealing plate will drive the sliding columns to rotate when it rotates, which is convenient for subsequent clamping and positioning of the wafer body.

[0015] Preferably, the two sliding rods are fixedly connected to the same pressing ring. The pressing ring is located outside the sealing plate. A plurality of groups of mounting blocks are symmetrically and fixedly connected to one side of the sealing plate close to the pressing ring. Each group of mounting blocks includes two symmetrically arranged ones. A connecting rod is rotatably connected between two adjacent mounting blocks.

[0016] By adopting the above technical solution, the sealing plate drives the sliding rods and the pressing ring to move, so that the pressing ring contacts the wafer body. At this time, the elastic force of the third spring drives the pressing ring to press the wafer body, which is convenient for the wafer body to press the sealing gasket.

[0017] Preferably, there are no less than three groups of the mounting blocks. The end of the connecting rod far away from the mounting block is fixedly connected to a pressing roller. The pressing roller is in fit with the pressing ring. A fourth spring is fixedly connected to one side of the connecting rod close to the sealing plate.

[0018] By adopting the above technical solution, the elastic force of the fourth spring presses the connecting rod, and the connecting rod drives the pressing roller to press the pressing ring, maintaining the stable pressing of the pressing ring on the wafer body and reducing the looseness of the wafer body.

[0019] Preferably, a positioning groove is formed on the other side of the sealing plate. A positioning rod is fixedly connected to one side of the pressing plate close to the sealing plate. The positioning rod is engaged with the positioning groove. A pair of adapting rods are symmetrically and fixedly connected to one side of the sealing plate. A pair of adapting grooves are symmetrically formed on one side of the hanging tool body close to the sealing plate. The adapting rods are slidably connected to the adapting grooves.

[0020] By adopting the above technical solution, when the adapting rods are inserted into the adapting grooves, the adapting rods slide inside the adapting grooves when the sealing plate rotates, without blocking the sealing plate.

[0021] Preferably, the conductive sheet is fixedly installed on the hanging tool body through bolts. One end of the wire is fixedly connected to the conductive sheet. The other end of the wire is fixedly connected to a connecting part. A side groove is formed on one side of the gear ring far away from the sealing plate. The connecting part is engaged with the side groove. The wire contacts the wafer body through the connecting part.

[0022] By adopting the above technical solution, the cooperation between the wire and the connecting part facilitates the subsequent electroplating operation of the wafer body.

[0023] Compared with the prior art, the present invention has the following beneficial effects: 1. A sealing structure is provided. When installing the wafer body, the operator places the wafer body inside the gear ring, one side of the wafer body fits the sealing gasket, the sliding column is inserted into the card slot, the adapter rod is inserted into the adapter slot, and then the pressure plate is connected to the external rotary clamping device. The rotary clamping device is an electric push rod that drives the servo motor to move. The output end of the servo motor is fixedly connected to the pressure plate to realize the movement and rotation of the pressure plate. The positioning rod on the pressure plate is inserted into the positioning slot, and then the pressure plate drives the positioning slot and the sealing plate to rotate. The sealing plate drives the sliding column to rotate clockwise, and the sliding column slides inside the limit slot, and the sliding column drives the arc bar and the slide bar to slide inside the arc slot. The arc bar compresses the spring, and the slide bar is pressed. The bar drives the push block to slide, and the push block squeezes the inclined surface of the inclined block, so that the inclined block stretches the second spring and approaches the wafer body, and the inclined block drives the clamping block to clamp the outer side of the wafer body, which is convenient for positioning the wafer body through multiple symmetrical clamping blocks. After the electroplating is completed, the pressure plate drives the sealing plate to rotate counterclockwise, and the elastic force of the second spring drives the inclined block and the clamping block to reset, and the elastic force of the first spring drives the arc bar and the sliding column to reset, so that the clamping block releases the clamping of the wafer body, which is convenient for removing the wafer body, and solves the problem of multi-point positioning and unlocking when fixing the sealing back plate. When the vertical continuous electroplating equipment is used, it is not convenient to quickly install and disassemble the sealing back plate, which reduces the problem of continuity of use and production efficiency. 2. A clamping structure is provided. When the sliding column is inserted into the card slot, the sealing plate drives the sliding rod and the clamping ring to move, so that the clamping ring contacts the wafer body. At this time, the elastic force of the spring three drives the sliding rod and the clamping ring to clamp the wafer body, and the wafer body then clamps the sealing gasket. The sealing gasket is deformed under the action of pressure, and the gap between the wafer body and the gear ring is compressed to form a good sealing effect, which can effectively prevent the leakage of the electroplating liquid. The elastic force of the spring four clamps the connecting rod, and the connecting rod drives the clamping roller to clamp the clamping ring, which maintains the stable clamping of the clamping ring on the wafer body, reduces the loosening of the wafer body, and adapts to the different thickness sizes of the wafer body. The use is convenient for subsequent uniform electroplating operations, meets the rapid pressing and sealing requirements of vertical continuous electroplating equipment, and improves electroplating efficiency and quality. The hanger body is made of corrosion-resistant insulating material and is frame-shaped with certain strength and rigidity. It can ensure that it can withstand the weight of the wafer body and the impact of the plating solution during the electroplating process, and at the same time play an insulating role to prevent current leakage. Spring one, spring two, spring three and spring four are made of high-strength stainless steel springs with good elasticity and corrosion resistance, and can provide stable pressure. During the electroplating process, the springs continue to provide stable pressure to ensure the reliability of the seal. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the three-dimensional overall structure of the present invention; Figure 2 Exploded schematic diagram of the installation structure of the sealing plate of the present invention; Figure 3 Schematic diagram of the installation structure of the gear ring of the present invention; Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the structure at position A in Figure 5 Schematic diagram of the installation structure of the connecting part of the present invention; Figure 6 Cross-sectional schematic diagram of the gear ring of the present invention; Figure 7 For the present invention Figure 6 Enlarged schematic diagram of the structure at position B in Figure 8 Schematic diagram of the installation structure of the arc-shaped strip of the present invention; Figure 9 For the present invention Figure 8 Enlarged schematic diagram of the structure at position C in Figure 10 Schematic diagram of the structure of the card slot opened in the present invention; Figure 11 Cross-sectional schematic diagram of the sealing plate of the present invention; Figure 12 For the present invention Figure 11 Enlarged schematic diagram of the structure at position D in Figure 13 Schematic diagram of the sealing plate being removed of the present invention.

[0025] In the figure: 1. Hanger main body; 2. Conductive sheet; 3. Wire; 4. Installation groove; 5. Gear ring; 6. Wafer main body; 7. Sealing structure; 71. Arc groove; 72. Fixed ring; 73. Arc-shaped strip; 74. Slide bar; 75. Spring 1; 76. Push block; 77. Sliding column; 78. Tightening groove; 79. Inclined block; 710. Spring 2; 711. Tightening block; 712. Fixed bolt; 713. Limiting groove; 714. Sealing gasket; 8. Sealing plate; 9. Pressing structure; 91. Card slot; 92. Inner groove; 93. Spring 3; 94. Slide rod; 95. Pressing ring; 96. Installation block; 97. Connecting rod; 98. Pressing roller; 99. Spring 4; 910. Positioning groove; 911. Fitting rod; 912. Fitting groove; 10. Pressure plate; 11. Connecting part; 12. Side groove; 13. Positioning rod. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] Please refer to Figures 1 - 3 , the present invention provides a technical solution: a fixture suitable for rapid pressing and sealing of a vertical continuous electroplating device, including a fixture main body 1, a wafer main body 6, and a sealing plate 8. A conductive sheet 2 and a wire 3 are fixedly installed on one side of the fixture main body 1, and an installation groove 4 is opened in the middle of the fixture main body 1.

[0028] A toothed ring 5 is snap-fitted inside the installation groove 4, and a sealing structure 7 is arranged inside the toothed ring 5.

[0029] The sealing structure 7 includes an adjustment unit and a pressing unit. The adjustment unit includes an arc-shaped strip 73 slidably installed inside the toothed ring 5. One side of the arc-shaped strip 73 is fixedly connected with a slide bar 74 and a push block 76, and the other side of the arc-shaped strip 73 is fixedly connected with a sliding column 77. The sliding column 77 is slidably installed with the toothed ring 5.

[0030] Arc-shaped grooves 71 are symmetrically opened inside the toothed ring 5. A fixing ring 72 is fixedly installed inside the arc-shaped grooves 71. The arc-shaped strip 73 is slidably connected with the arc-shaped grooves 71. The slide bar 74 is slidably connected with the fixing ring 72. A first spring 75 is sleeved outside the slide bar 74. One end of the first spring 75 is fixedly connected with the arc-shaped strip 73, and the other end of the first spring 75 is fixedly connected with the fixing ring 72.

[0031] There are no less than three arc-shaped grooves 71. The number of the fixing rings 72 and the arc-shaped strips 73 is the same as that of the arc-shaped grooves 71. The arc-shaped grooves 71 are communicated with the pressing grooves 78. Spring two 710 is symmetrically and fixedly installed on the inner wall of the pressing grooves 78. One end of the spring two 710 away from the inner wall of the pressing grooves 78 is fixedly connected with an inclined block 79.

[0032] The pressing unit includes a pressing groove 78 and an inclined block 79. The inclined block 79 is slidably connected with the pressing groove 78. The inclined surface of the inclined block 79 abuts against the push block 76. One end of the inclined block 79 is fixedly installed with a pressing block 711. The pressing block 711 is located inside the toothed ring 5. A sealing gasket 714 is also installed inside the toothed ring 5.

[0033] A fixing bolt 712 is slidably installed inside the pressing block 711. The fixing bolt 712 is threadedly connected with the inclined block 79. Limiting grooves 713 are symmetrically opened on one side of the toothed ring 5 close to the sealing plate 8. The number of the limiting grooves 713 is the same as that of the arc-shaped grooves 71. The sliding column 77 is slidably connected with the limiting grooves 713. The sealing gasket 714 fits with the inner side of the toothed ring 5.

[0034] The conductive sheet 2 is fixedly installed on the fixture body 1 through bolts. One end of the wire 3 is fixedly connected to the conductive sheet 2, and the other end of the wire 3 is fixedly connected with a connecting portion 11. A side groove 12 is formed on the side of the tooth ring 5 away from the sealing plate 8. The connecting portion 11 is snap-fitted with the side groove 12, and the wire 3 contacts the wafer body 6 through the connecting portion 11.

[0035] Example 1: As Figures 4 - 9 shown, when installing the wafer body 6, the operator places the wafer body 6 inside the tooth ring 5. One side of the wafer body 6 is attached to the sealing gasket 714. The sliding column 77 is inserted into the card slot 91, and the adapter rod 911 is inserted into the adapter slot 912. Then, the pressing plate 10 is connected to an external rotary pressing device. The rotary pressing device is an electric push rod driving a servo motor to move. The output end of the servo motor is fixedly connected to the pressing plate 10 to achieve the movement and rotation of the pressing plate 10.

[0036] The positioning rod 13 on the pressing plate 10 is inserted into the positioning slot 910. Then, the pressing plate 10 drives the positioning slot 910 and the sealing plate 8 to rotate. The sealing plate 8 drives the sliding column 77 to rotate clockwise. The sliding column 77 slides inside the limiting slot 713, and the sliding column 77 drives the arc-shaped strip 73 and the sliding strip 74 to slide inside the arc-shaped slot 71. The arc-shaped strip 73 compresses the first spring 75, and the sliding strip 74 drives the push block 76 to slide. The push block 76 presses the inclined surface of the inclined block 79, causing the inclined block 79 to stretch the second spring 710 and approach the wafer body 6. The inclined block 79 drives the clamping block 711 to clamp the outside of the wafer body 6, facilitating the positioning of the wafer body 6 by multiple symmetric clamping blocks 711.

[0037] After electroplating is completed, the pressing plate 10 drives the sealing plate 8 to rotate counterclockwise. The elastic force of the second spring 710 drives the inclined block 79 and the clamping block 711 to reset. The elastic force of the first spring 75 drives the arc-shaped strip 73 and the sliding column 77 to reset, so that the clamping block 711 releases the clamping of the wafer body 6, facilitating the removal of the wafer body 6. This solves the problem that when fixing the sealing backplane, multi-point positioning and unlocking are still required, which is not convenient for quickly installing and disassembling the sealing backplane during the use of vertical continuous electroplating equipment, reducing the use continuity and production efficiency.

[0038] A pressing structure 9 is arranged on the side of the sealing plate 8 close to the fixture body 1. A pressing plate 10 is installed on the side of the sealing plate 8 away from the fixture body 1. The pressing structure 9 includes a card slot 91 formed on one side of the sealing plate 8. The number of the card slots 91 is the same as that of the sliding columns 77. The sliding columns 77 are inserted and fixed with the card slots 91. Inner slots 92 are symmetrically formed on one side of the sealing plate 8. A third spring 93 is fixedly installed inside the inner slots 92. One end of the third spring 93 close to the tooth ring 5 is fixedly connected with a sliding rod 94. The sliding rod 94 is slidably connected with the inner slots 92, and two sliding rods 94 are symmetrically arranged.

[0039] Two sliding rods 94 are fixedly connected to the same pressing ring 95. The pressing ring 95 is located outside the sealing plate 8. On one side of the sealing plate 8 close to the pressing ring 95, multiple groups of mounting blocks 96 are symmetrically and fixedly connected. Each group of mounting blocks 96 includes two symmetrically arranged ones. A connecting rod 97 is rotatably connected between two adjacent mounting blocks 96.

[0040] There are no less than three groups of mounting blocks 96. One end of the connecting rod 97 away from the mounting block 96 is fixedly connected with a pressing roller 98. The pressing roller 98 is in contact with the pressing ring 95. A fourth spring 99 is fixedly connected to one side of the connecting rod 97 close to the sealing plate 8.

[0041] On the other side of the sealing plate 8, a positioning groove 910 is opened. A positioning rod 13 is fixedly connected to one side of the pressing plate 10 close to the sealing plate 8. The positioning rod 13 is engaged with the positioning groove 910. On one side of the sealing plate 8, two matching rods 911 are also symmetrically and fixedly connected. On one side of the fixture body 1 close to the sealing plate 8, two matching grooves 912 are symmetrically opened. The matching rods 911 are slidably connected with the matching grooves 912.

[0042] Embodiment 2: As Figures 10 - 13 shown, when the sliding column 77 is inserted into the clamping groove 91, the sealing plate 8 drives the sliding rod 94 and the pressing ring 95 to move, so that the pressing ring 95 contacts the wafer body 6. At this time, the elastic force of the third spring 93 drives the sliding rod 94 and the pressing ring 95 to press the wafer body 6. The wafer body 6 then presses the sealing gasket 714. The sealing gasket 714 deforms under the pressure. The gap between the wafer body 6 and the gear ring 5 is compressed, forming a good sealing effect and effectively preventing the leakage of electroplating solution.

[0043] Moreover, the elastic force of the fourth spring 99 presses the connecting rod 97. The connecting rod 97 drives the pressing roller 98 to press the pressing ring 95, maintaining the stable pressing of the pressing ring 95 on the wafer body 6, reducing the looseness of the wafer body 6, adapting to the use of different thickness dimensions of the wafer body 6, facilitating subsequent uniform electroplating operations, meeting the rapid pressing and sealing requirements of the vertical continuous electroplating equipment, and improving the electroplating efficiency and quality.

[0044] The fixture body 1 is made of corrosion-resistant insulating material, and its shape is frame type, having a certain strength and rigidity, which can ensure bearing the weight of the wafer body 6 and the impact force of the electroplating solution during the electroplating process, and at the same time playing an insulating role to prevent current leakage. The first spring 75, the second spring 710, the third spring 93 and the fourth spring 99 are made of high-strength stainless steel springs, having good elasticity and corrosion resistance, and being able to provide stable pressure, so that during the electroplating process, the springs continuously provide stable pressure, ensuring the reliability of the seal.

[0045] Working principle: When using this device, first, as Figures 1 - 13As shown, the operator places the wafer body 6 inside the toothed ring 5. The sliding column 77 is inserted into the card slot 91, and the fitting rod 911 is inserted into the fitting slot 912. Then, the pressing plate 10 is connected to an external rotary pressing device. The positioning rod 13 on the pressing plate 10 is inserted into the positioning slot 910. Next, the pressing plate 10 drives the positioning slot 910 and the sealing plate 8 to rotate. The sealing plate 8 drives the sliding column 77 to rotate clockwise, facilitating the positioning of the wafer body 6 by multiple symmetric abutting blocks 711. After electroplating is completed, the pressing plate 10 drives the sealing plate 8 to rotate counterclockwise, causing the abutting blocks 711 to release the clamping of the wafer body 6, making it convenient to remove the wafer body 6. When the sealing plate 8 drives the sliding rod 94 and the pressing ring 95 to move, the pressing ring 95 presses the wafer body 6, and the wafer body 6 further presses the sealing gasket 714. The connecting rod 97 drives the pressing roller 98 to press the pressing ring 95, maintaining the stable pressing of the pressing ring 95 on the wafer body 6, reducing the looseness of the wafer body 6, and facilitating subsequent uniform electroplating operations.

[0046] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0047] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A hanger suitable for rapid pressing and sealing of a vertical continuous electroplating device, comprising a hanger body (1), a wafer body (6) and a sealing plate (8), a conductive sheet (2) and a wire (3) being fixedly mounted on one side of the hanger body (1), and a mounting groove (4) being provided in the middle of the hanger body (1); It is characterized in that Also includes: The interior of the mounting groove (4) is snap-fitted with a toothed ring (5), the inner side of the toothed ring (5) is provided with a sealing structure (7), the side of the sealing plate (8) close to the hanger body (1) is provided with a pressing structure (9), and the side of the sealing plate (8) away from the hanger body (1) is provided with a pressing plate (10); The sealing structure (7) comprises an adjustment unit and a pressing unit, the adjustment unit comprises an arc-shaped strip (73) slidably mounted inside the gear ring (5), a sliding strip (74) and a push block (76) being fixedly connected to one side of the arc-shaped strip (73), and a sliding column (77) being fixedly connected to the other side of the arc-shaped strip (73), and the sliding column (77) being slidably mounted on the gear ring (5); The abutting unit comprises a abutting groove (78) and an inclined block (79), the inclined block (79) being slidably connected to the abutting groove (78), the inclined surface of the inclined block (79) abutting against the push block (76), a abutting block (711) being fixedly mounted on one end of the inclined block (79), the abutting block (711) being located on the inner side of the gear ring (5), and a sealing gasket (714) being further mounted inside the gear ring (5).

2. The hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 1, characterized in that: The gear ring (5) is symmetrically provided with an arc groove (71), a fixing ring (72) is fixedly installed inside the arc groove (71), the arc strip (73) is slidably connected to the arc groove (71), the sliding strip (74) is slidably connected to the fixing ring (72), a spring (75) is sleeved on the outer side of the sliding strip (74), one end of the spring (75) is fixedly connected to the arc strip (73), and the other end of the spring (75) is fixedly connected to the fixing ring (72).

3. The hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 2, characterized in that: The number of the arc-shaped grooves (71) is no less than three, the number of the fixing rings (72) and the arc-shaped strips (73) is the same as that of the arc-shaped grooves (71), the arc-shaped groove (71) is connected to the abutting groove (78), the inner wall of the abutting groove (78) is symmetrically fixedly mounted with a second spring (710), and one end of the second spring (710) away from the inner wall of the abutting groove (78) is fixedly connected to the inclined block (79).

4. The hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 3, characterized in that: A fixing bolt (712) is slidably mounted inside the pressing block (711), and the fixing bolt (712) is threadedly connected to the inclined block (79). A limiting groove (713) is symmetrically provided on one side of the gear ring (5) close to the sealing plate (8), and the number of the limiting grooves (713) is the same as that of the arc grooves (71). The sliding column (77) is slidably connected to the limiting groove (713), and the sealing gasket (714) is fitted to the inner side of the gear ring (5).

5. The hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 1, characterized in that: The clamping structure (9) comprises a slot (91) provided on one side of the sealing plate (8), the number of the slots (91) being the same as the number of the sliding posts (77), the sliding posts (77) being plugged and fixed to the slots (91), and an inner slot (92) being symmetrically provided on one side of the sealing plate (8), a spring three (93) being fixedly installed inside the inner slot (92), a sliding rod (94) being fixedly connected to one end of the spring three (93) close to the gear ring (5), the sliding rod (94) being slidably connected to the inner slot (92), and two sliding rods (94) being symmetrically provided.

6. The hanger for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 5, characterized in that: The two sliding rods (94) are fixedly connected to the same clamping ring (95), and the clamping ring (95) is located outside the sealing plate (8). A plurality of groups of mounting blocks (96) are symmetrically fixedly connected to one side of the sealing plate (8) close to the clamping ring (95), and each group of mounting blocks (96) includes two symmetrically arranged ones, and a connecting rod (97) is rotatably connected between two adjacent mounting blocks (96).

7. The hanger for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 6, characterized in that: There are no less than three groups of the mounting blocks (96); one end of the connecting rod (97) away from the mounting blocks (96) is fixedly connected to a clamping roller (98); the clamping roller (98) is in contact with the clamping ring (95); and a spring four (99) is fixedly connected to one side of the connecting rod (97) close to the sealing plate (8).

8. The hanger for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 7, characterized in that: A positioning groove (910) is provided on the other side of the sealing plate (8); a positioning rod (13) is fixedly connected to the side of the pressure plate (10) close to the sealing plate (8); the positioning rod (13) is snap-fitted and connected to the positioning groove (910); an adapting rod (911) is symmetrically fixedly connected to one side of the sealing plate (8); and an adapting groove (912) is symmetrically provided on the side of the hanger body (1) close to the sealing plate (8); the adapting rod (911) is slidably connected to the adapting groove (912).

9. The hanger for rapid pressing and sealing of vertical continuous electroplating equipment according to claim 1, characterized in that: The conductive sheet (2) is fixedly mounted to the hanger body (1) by means of bolts, one end of the conductive wire (3) is fixedly connected to the conductive sheet (2), the other end of the conductive wire (3) is fixedly connected to a connecting portion (11), a side of the gear ring (5) away from the sealing plate (8) is provided with a side groove (12), the connecting portion (11) is snap-fitted with the side groove (12), and the conductive wire (3) is in contact with the wafer body (6) via the connecting portion (11).

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