Current sensor for pipeline detection

Abstract

The application relates to the technical field of current sensors, and provides a current sensor for pipeline detection, which comprises a sensor main body and further comprises: a device chamber installed in the middle of the sensor main body; a temperature insulation assembly installed in the inside of the device chamber and used for adjusting the temperature of the device chamber; a hollow square column installed on the lower side of the inside of the sensor main body; an embedded cylinder installed on the upper side of the inside of the hollow square column, a plurality of airflow touch plates are annularly installed on the inner wall of the embedded cylinder at equal intervals, an electric heating film is installed on one side end surface of each airflow touch plate, a semiconductor refrigeration sheet is installed on the other side end surface of each airflow touch plate, and an air outlet is installed on the top of the embedded cylinder; and a micro air pump is installed on the lower side of the inside of the hollow square column. When the current sensor is used, the internal temperature can be adjusted according to the external environment demand, the influence of extremely high temperature or low temperature on the precision of the sensor is solved, and the underground pipeline distribution can be more accurately detected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of current sensor, more particularly, to a current sensor for pipeline detection. BACKGROUND

[0002] The current sensor used in pipeline detection is a sensor specially used for detecting the magnetic field generated by the current in the underground pipeline, which can capture the current information in the underground cable and convert it into a measurable electrical signal, thereby assisting the operating personnel to determine the position and direction of the underground pipeline.

[0003] During the pipeline detection stage, due to the complexity of the buried area environment, the external environment may be affected by continuous hot high temperature or cold low temperature, which causes the magnetic permeability and resistivity of the core components of the sensor (such as the magnetic core and the coil) to change with temperature, resulting in reduced sensitivity or signal distortion, at the same time, the internal semiconductor elements (such as Hall sensor, magnetic resistance sensor) also change with temperature, causing the carrier mobility to fluctuate, causing the output signal to drift, which hinders the accurate detection process of the underground pipeline.

[0004] Therefore, the current sensor for pipeline detection is proposed to solve the above problems. SUMMARY

[0005] The technical problem to be solved: In view of the problems existing in the prior art, the purpose of the present application is to provide a current sensor for pipeline detection, which solves the problem that temperature changes caused by complex environment in pipeline detection affect the performance of sensor core components and semiconductor elements, resulting in reduced sensitivity, signal distortion and output drift, which hinders accurate detection.

[0006] To solve the above technical problems, the present application provides the following technical scheme: a current sensor for pipeline detection, comprising a sensor main body, further comprising: a device chamber installed in the middle of the sensor main body; a temperature insulation assembly installed inside the device chamber for adjusting the temperature of the device chamber; a hollow square column installed inside the lower side of the sensor main body; the inside upper side of the hollow square column is installed with an embedded cylinder, a plurality of air flow touch plates are installed on the inner wall of the embedded cylinder in equal distance, one side end face of the air flow touch plate is installed with an electrothermal film, the other side end face of the air flow touch plate is installed with a semiconductor refrigeration piece, and the top of the embedded cylinder is installed with an air outlet; a micro air pump is installed inside the lower side of the hollow square column, and the exhaust port of the micro air pump is communicated with the bottom of the hollow square column; a temperature control assembly is installed on the outer wall of the hollow square column for controlling the start and stop of the electrothermal film and the semiconductor refrigeration piece; a shunt assembly is installed at the top end of the hollow square column, and the top of the shunt assembly is communicated with the two sides of the bottom of the device chamber; a gas dispersion assembly is installed at the top of the device chamber, and the exhaust air flow of the device chamber is triggered.

[0007] In a new embodiment, the temperature insulation assembly comprises: a frame partition plate installed in the interior of the device chamber, and the frame partition plate is composed of three single partition plates; the frame partition plate divides the device chamber into an internal structure cavity and an external airflow cavity; a magnetic shielding layer is arranged on the inner wall of the frame partition plate; mounting holes are equidistantly arranged on the outer wall of the single partition plate, and a ceramic slope column is inserted into the mounting hole, and a moisture absorbing ball is installed at the end of the ceramic slope column.

[0008] In a new embodiment, the temperature control assembly comprises: a temperature sensor installed at the lower middle part of the front end of the sensor body; two wire harness rings are arranged and installed on the upper and lower sides of the hollow square column; the upper wire harness ring is connected with the plurality of electric heating films through wires, and the lower wire harness ring is connected with the plurality of semiconductor refrigerating sheets through wires; a controller is installed on one side of the wire harness ring, and the controller is connected with the wire harness ring, and the controller is also electrically connected with the temperature sensor.

[0009] In a new embodiment, the shunt assembly comprises: a trapezoidal flow cavity installed at the top of the hollow square column, and the top end of the trapezoidal flow cavity is communicated with the bottom of the device chamber; a sound absorbing cone is installed at the middle part of the trapezoidal flow cavity; sound absorbing plates are installed on the inner walls of the left and right sides of the trapezoidal flow cavity.

[0010] In a new embodiment, the air dispersing assembly comprises: a converging flat mouth cavity installed at the top end of the device chamber, and an outer inclined exhaust cavity is installed at the top end of the converging flat mouth cavity; a horizontal plate is installed at the middle part of the inner side of the outer inclined exhaust cavity; a spring column is slidably connected to the middle part of the horizontal plate, and a sliding block is installed at the bottom end of the spring column; two inner cavities are opened, and one end openings are respectively arranged on the bottom left and right sides of the sliding block, and the other end openings are respectively arranged on the upper left and right sides of the outer wall of the sliding block.

[0011] In a new embodiment, the bottom left and right sides of the device chamber are provided with air inlets, and the top left and right sides of the device chamber are provided with air outlets.

[0012] In a new embodiment, the middle part of the airflow touch plate is provided with a partitioned rock wool, and the length and width dimensions of the partitioned rock wool are consistent with the length and width dimensions of the airflow touch plate.

[0013] In a new embodiment, the middle part of the top and bottom ends of the sensor body is provided with an outward extending pipe, the bottom end of the outward extending pipe is connected with the air suction end of the micro air pump, and the top end of the outward extending pipe is connected with the top of the outer inclined exhaust cavity.

[0014] Advantages: compared with the prior art, the advantages of the present application are: 1, by using a micro air pump to generate dry air, the dry air is formed into cold air or hot air through the action of the electric heating film or the semiconductor refrigerating sheet on the airflow touch plate, and is uniformly distributed to the device chamber to protect the current sensor, so that the influence of extreme temperature on the sensor accuracy is avoided, and the underground pipeline distribution is more accurately detected.

[0015] 2. By setting the shunt assembly, using the trapezoidal flow cavity structure, increasing the airflow cross-sectional area, effectively reducing airflow resistance and achieving uniform distribution, combining the sound-absorbing cone and the multi-hole sound-absorbing plate to form a double noise reduction system, which can not only suppress mechanical vibration noise, but also eliminate airflow turbulence noise, the inner wall of the flow channel is designed with smooth transition to further reduce turbulence intensity, and the overall optimization of the flow dynamics performance.

[0016] 3. By setting the temperature insulation assembly, using ceramic slope columns to realize directional heat absorption or cold absorption, cooperating with matrix type mounting holes to realize device area dynamic adaptive layout, the built-in moisture absorbing ball can absorb the water vapor in the device chamber, and the electromagnetic shielding layer is compounded in the inner wall of the cavity to form an electromagnetic isolation barrier, which can guarantee the stable operation environment of the current sensor in multiple dimensions.

[0017] 4. By setting the temperature control assembly, when detecting external temperature mutation, the controller analyzes the sensor signal in real time, automatically triggers the electric heating film heating or semiconductor refrigeration program, and realizes dynamic closed-loop regulation and control of the working environment of the current sensor.

[0018] 5. By setting the air dispersion assembly, when the device chamber accumulates heat, causing the airflow pressure to rise, the airflow pushes the slider to slide upward along the converging flat cavity, the compression spring column opens the exhaust channel, and the overload airflow is guided to the outer inclined exhaust cavity. When the airflow pressure weakens, the spring resets to drive the slider to close the channel, which can block the invasion of external dust and moisture. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a three-dimensional structure schematic diagram of the present application.

[0020] Figure 2 It is another perspective three-dimensional structure schematic diagram of the present application.

[0021] Figure 3 It is a schematic diagram of the internal structure of the sensor body of the present application.

[0022] Figure 4 It is a schematic diagram of the shunt assembly structure of the present application.

[0023] Figure 5 It is a schematic diagram of the internal structure of the embedded cylinder of the present application.

[0024] Figure 6 It is a schematic diagram of the air flow touch plate structure of the present application.

[0025] Figure 7 It is a schematic diagram of the device chamber structure of the present application.

[0026] Figure 8 It is a schematic diagram of the frame partition plate structure of the present application.

[0027] Figure 9 A schematic diagram of the temperature insulation assembly structure of the present application.

[0028] Figure 10 A schematic diagram of the frame baffle structure of the present application.

[0029] Figure 11 A schematic diagram of the air dispersion assembly structure of the present application.

[0030] The reference signs in the figure are: 1, sensor body; 2, device chamber; 3, temperature insulation assembly; 301, frame baffle; 302, magnetic shielding layer; 303, mounting hole; 304, ceramic slope column; 305, moisture absorbing ball; 4, hollow square column; 5, embedded cylinder; 6, air flow touch plate; 7, electrothermal film; 8, semiconductor refrigeration sheet; 9, air outlet; 10, micro air pump; 11, temperature control assembly; 1101, temperature sensor; 1102, wire harness ring; 1103, controller; 12, flow distribution assembly; 1201, trapezoidal flow cavity; 1202, sound absorbing cone; 1203, sound absorbing plate; 13, air dispersion assembly; 1301, converging flat cavity; 1302, outer inclined air outlet cavity; 1303, horizontal plate; 1304, spring column; 1305, sliding block; 1306, inner cavity; 14, air inlet; 15, air outlet; 16, partitioned rock wool; 17, outward extending pipe. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and all other embodiments obtained by a person of ordinary skill in the art without creative labor on the basis of the embodiments in the present application belong to the protection scope of the present application.

[0032] The current sensor for pipeline detection provided by the embodiments of the present application solves the problem that temperature changes caused by complex environments in pipeline detection affect the performance of sensor core components and semiconductor elements, cause sensitivity reduction, signal distortion and output drift, and hinder accurate detection. In use, the current sensor can adjust the internal temperature according to external environmental requirements, solve the influence of extreme high temperature or low temperature on the accuracy of the sensor, and more accurately detect the distribution of underground pipelines.

[0033] The technical solutions in the embodiments of the present application are as follows to solve the above technical problems.

[0034] Embodiment 1

[0035] Please refer to Figures 1-11, the pipeline detection current sensor comprises a sensor body 1, further comprises: a device chamber 2 installed in the middle of the sensor body 1; a temperature insulation assembly 3 installed inside the device chamber 2 for adjusting the temperature of the device chamber 2; a hollow square column 4 installed inside the lower side of the sensor body 1; a hollow square column 4 is installed on the inside of the upper side of the hollow square column 4; a plurality of air flow touch plates 6 are installed on the inner wall of the embedded cylinder 5 in equal intervals; an electric heating film 7 is installed on one side of the air flow touch plate 6; a semiconductor refrigeration piece 8 is installed on the other side of the air flow touch plate 6; an air exhaust port 9 is installed on the top of the embedded cylinder 5; a miniature air pump 10 is installed on the inside of the lower side of the hollow square column 4, and the exhaust port of the miniature air pump 10 is communicated with the bottom of the hollow square column 4; a temperature control assembly 11 is installed on the outer wall of the hollow square column 4 for controlling the start and stop of the electric heating film 7 and the semiconductor refrigeration piece 8; a shunt assembly 12 is installed on the top end of the hollow square column 4, and the top of the shunt assembly 12 is communicated with the two sides of the bottom of the device chamber 2; a gas dispersion assembly 13 is installed on the top of the device chamber 2, and the exhaust airflow of the device chamber 2 is triggered.

[0036] In this embodiment, please refer to Figures 1-11 As shown in the figure, by setting the hollow square column 4, the embedded cylinder 5, the air flow touch plate 6, the electric heating film 7, the semiconductor refrigeration piece 8, the air exhaust port 9 and the miniature air pump 10, first, the miniature air pump 10 generates dry air, the dry air is sent upward into the embedded cylinder 5, and is in full contact with the air flow touch plate 6 distributed in the embedded cylinder 5, and then generates cold air or hot air according to the external environment (high temperature or low temperature), and the generated cold air or hot air is evenly distributed to the device chamber 2 through the shunt assembly 12, forming a hot or cold package for the internal device (also indirectly cooling or heating the structure cavity inside the device chamber 2), protecting the normal operation of the current sensor in high temperature and low temperature, and in order to ensure the continuous operation of the current sensor, the release of dry air is uninterrupted during use, at this time the device chamber 2 will accumulate air flow, the gas expansion caused by the accumulation of air flow will trigger the operation of the gas dispersion assembly 13, and then open the gas dispersion assembly 13 to exhaust excess air flow, avoid air flow accumulation in the device chamber 2, also can make the device chamber 2 inside keep in the suitable operation temperature, not too high temperature or too low temperature.

[0037] Specifically, by using the detection of the temperature control assembly 11, when the external environment is cold weather, the dry air contacts the air flow touch plate 6 starting the electric heating film 7, which will heat the dry air, forming a hot flow, on the contrary, when the dry air contacts the air flow touch plate 6 starting the semiconductor refrigeration piece 8, it will refrigerate the dry air, forming a cold flow, so that the current sensor can be bidirectional adjusted according to the external environment demand, solve the influence of extreme high temperature or low temperature on the sensor precision, more accurate detection of the underground pipeline distribution.

[0038] Further, please refer toFigure 5 and Figure 6 As shown in FIG. 7, the middle part of the air flow touch plate 6 is installed with a partitioned rock wool 16, and the length and width dimensions of the partitioned rock wool 16 are consistent with the length and width dimensions of the air flow touch plate 6. By setting the partitioned rock wool 16, the middle part of the air flow touch plate 6 is blocked by the partitioned rock wool 16. On the one hand, the heating of the electrothermal film 7 will not affect the semiconductor refrigeration sheet 8, and vice versa, the refrigeration of the semiconductor refrigeration sheet 8 will not affect the electrothermal film 7, effectively preventing the damage caused by the contact between the high temperature or low temperature generated between the two.

[0039] Further, as shown in FIG. 7, Figure 3 As shown in FIG. 7, the middle part of the air flow touch plate 6 is installed with a partitioned rock wool 16, and the length and width dimensions of the partitioned rock wool 16 are consistent with the length and width dimensions of the air flow touch plate 6. By setting the partitioned rock wool 16, the middle part of the air flow touch plate 6 is blocked by the partitioned rock wool 16. On the one hand, the heating of the electrothermal film 7 will not affect the semiconductor refrigeration sheet 8, and vice versa, the refrigeration of the semiconductor refrigeration sheet 8 will not affect the electrothermal film 7, effectively preventing the damage caused by the contact between the high temperature or low temperature generated between the two.

[0040] Example 2

[0041] Please refer to FIG. 7- Figure 10 The temperature insulation assembly 3 comprises a frame partition plate 301 installed in the inside of the device chamber 2, and the frame partition plate 301 is composed of three single partition plates; the frame partition plate 301 divides the device chamber 2 into an internal structure cavity and an external air flow cavity; a magnetic shielding layer 302 is arranged on the inner wall of the frame partition plate 301; installation holes 303 are equidistantly arranged on the outer wall of the single partition plate, and a ceramic slope column 304 is inserted into the installation hole 303, and a moisture absorbing ball 305 is installed at the end of the ceramic slope column 304.

[0042] By setting the frame partition plate 301, the magnetic shielding layer 302, the installation hole 303, the ceramic slope column 304 and the moisture absorbing ball 305, when the external air flow (hot flow or cold flow) enters the air flow cavity outside the device chamber 2, the ceramic slope column 304 can absorb the heat source or cold source energy (the ceramic slope column 304 is made of ceramic material), and realize indirect temperature control (heating or cooling) of fixed-point diffusion through its heat insulation characteristics. At the same time, the modular design of the installation hole 303 allows the ceramic slope column 304 to be flexibly adjusted and arranged to adapt to the heat load demand of different areas (mainly divided according to the distribution of main structures in the structure cavity inside the device chamber 2, and the more main structures, the more concentrated the ceramic slope column 304, and vice versa). In addition, the moisture absorbing ball 305 can absorb the condensed water vapor generated in the air flow temperature control process, avoiding the interference of water vapor accumulation caused by direct heat conduction to the internal device, and further protecting the normal operation of the current sensor. The magnetic shielding layer 302 can isolate external electromagnetic interference and ensure the stability of the current detection signal.

[0043] Further, as shown in FIG. 7, Figure 7As shown, the bottom end of the device chamber 2 is provided with an air inlet 14 on the left and right sides, and the top end of the device chamber 2 is provided with an air outlet 15 on the left and right sides. By setting the air inlet 14 and the air outlet 15, the airflow conveyed in the shunt assembly 12 can be sent to the airflow cavity outside the device chamber 2, and the upper airflow of the device chamber 2 can be discharged into the air distribution assembly 13 after being gathered and expanded.

[0044] Embodiment 3

[0045] Please refer to Figure 1 and Figure 2 The temperature control assembly 11 includes: a temperature sensor 1101 installed at the lower middle of the front end of the sensor main body 1; two wire harness rings 1102 installed on the upper and lower sides of the outside of the hollow square column 4; the upper wire harness ring 1102 is connected to the plurality of electric heating films 7 through wires, and the lower wire harness ring 1102 is connected to the plurality of semiconductor refrigerating sheets 8 through wires; a controller 1103 installed on one side of the wire harness ring 1102, and the controller 1103 is connected to the wire harness ring 1102, and the controller 1103 is also electrically connected to the temperature sensor 1101.

[0046] By setting the temperature sensor 1101, the wire harness ring 1102 and the controller 1103, first, the temperature sensor 1101 senses the change of the external temperature, when the external temperature is low, the temperature sensor 1101 transmits an electric signal to the controller 1103 installed on the upper wire harness ring 1102, and the controller 1103 starts the heating operation of the electric heating film 7, on the contrary, when the external temperature is high, the temperature sensor 1101 transmits an electric signal to the controller 1103 installed on the lower wire harness ring 1102, and the controller 1103 starts the refrigeration operation of the semiconductor refrigerating sheet 8, which can dynamically adjust the protection measures of the current sensor according to the change of the external temperature.

[0047] Further, please refer to Figure 4 As shown, the shunt assembly 12 includes: a trapezoidal flow cavity 1201 installed at the top of the hollow square column 4, and the top end of the trapezoidal flow cavity 1201 is communicated with the bottom of the device chamber 2; a sound-absorbing cone 1202 installed at the middle of the trapezoidal flow cavity 1201; and a sound-absorbing plate 1203 installed on the inner walls on the left and right sides of the trapezoidal flow cavity 1201.

[0048] By setting the trapezoidal flow cavity 1201, the sound-absorbing cone 1202 and the sound-absorbing plate 1203, the gradually expanding cavity design of the trapezoidal flow cavity 1201 significantly increases the cross-sectional area of the airflow passage, effectively reduces the flow resistance and uniformly distributes the airflow. At the same time, the sound-absorbing cone 1202 scatters and guides the airflow through the conical structure, and the sound-absorbing plate 1203 absorbs the sound wave energy through the porous sound-absorbing material on the surface, which greatly suppresses the airflow noise and the vibration transmission of the pump body, avoids the interference of mechanical resonance on the internal precision components of the sensor, and ensures the stability and measurement accuracy of the current detection signal. In addition, the gentle transition design of the trapezoidal flow cavity 1201 can also reduce the generation of turbulent flow, further optimizing the airflow dynamic performance.

[0049] Further, please refer to Figure 11 As shown in the figure, the air diffusing assembly 13 comprises: a converging flat chamber 1301 installed at the top end of the device chamber 2, and an outer inclined exhaust cavity 1302 installed at the top end of the converging flat chamber 1301; a horizontal plate 1303 installed at the inner middle part of the outer inclined exhaust cavity 1302; a spring column 1304 slidingly connected at the middle part of the horizontal plate 1303, and a sliding block 1305 installed at the bottom end of the spring column 1304; and two inner cavities 1306, one end of each of which is respectively opened at the left and right sides of the bottom of the sliding block 1305, and the other end of each of which is respectively opened at the left and right sides of the outer wall of the upper part of the sliding block 1305.

[0050] By setting the converging flat chamber 1301, the outer inclined exhaust cavity 1302, the horizontal plate 1303, the spring column 1304, the sliding block 1305 and the inner cavities 1306, when the heat accumulates inside the device chamber 2, the rising airflow forms pressure at the converging flat chamber 1301, pushing the sliding block 1305 to slide inside the converging flat chamber 1301, and the spring column 1304 connected with the sliding block 1305 also slides upward on the horizontal plate 1303. When the inner cavities 1306 on the sliding block 1305 are separated from the blocking of the converging flat chamber 1301 and reach the outer inclined exhaust cavity 1302, the airflow gathered in the converging flat chamber 1301 will be released. When the airflow is weakened, the spring column 1304 is elastically reset, driving the sliding block 1305 to move downward to close the converging flat chamber 1301, preventing the reverse intrusion of external dust or moisture.

[0051] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A current sensor for pipeline detection, comprising a sensor body (1), characterized in that, Also includes: Device chamber (2) is installed in the middle of sensor body (1); A thermal insulation component (3) is installed inside the device chamber (2) to adjust the temperature of the device chamber (2); A hollow square column (4) is installed on the lower inside of the sensor body (1); An inner cylinder (5) is installed on the upper side of the hollow square column (4). Multiple airflow contact plates (6) are installed in a ring at equal intervals on the inner wall of the inner cylinder (5). An electric heating film (7) is installed on one side end face of each airflow contact plate (6), and a semiconductor cooling chip (8) is installed on the other side end face of each airflow contact plate (6). An air outlet (9) is installed on the top of the inner cylinder (5). A miniature air pump (10) is installed inside the lower side of the hollow square column (4), and the exhaust port of the miniature air pump (10) is connected to the bottom of the hollow square column (4); Temperature control component (11) is installed on the outer wall of hollow square column (4) to control the start and stop of electric heating film (7) and semiconductor cooling chip (8); The top of the hollow square column (4) is equipped with a diversion component (12), and the top of the diversion component (12) is connected to both sides of the bottom of the device chamber (2). The top of the device chamber (2) is equipped with a gas dissipation component (13), which is triggered by the exhaust airflow of the device chamber (2). The thermal insulation component (3) includes: A frame partition (301) is installed inside the device chamber (2), and the frame partition (301) is composed of three single partitions spliced ​​together around it; The frame partition (301) divides the device chamber (2) into an internal structural chamber and an external airflow chamber; A magnetic shielding layer (302) is disposed on the inner wall of the frame partition (301); Mounting holes (303) are evenly spaced and installed on the outer wall of the single partition, and ceramic slope columns (304) are inserted into the mounting holes (303), with moisture-absorbing balls (305) installed at the ends of the ceramic slope columns (304). The temperature control component (11) includes: Temperature sensor (1101) is installed at the lower middle front end of sensor body (1); Two wire harness rings (1102) are provided and are respectively installed on the upper and lower sides of the hollow square column (4); the upper wire harness ring (1102) is connected to multiple electrothermal films (7) through wires, and the lower wire harness ring (1102) is connected to multiple semiconductor cooling chips (8) through wires. A controller (1103) is installed on one side of the wire harness ring (1102) and is connected to the wire harness ring (1102). The controller (1103) is also electrically connected to the temperature sensor (1101). The gas dissipation assembly (13) includes: A converging flat cavity (1301) is installed at the top of the device chamber (2), and an external oblique exhaust cavity (1302) is installed at the top of the converging flat cavity (1301). A horizontal plate (1303) is installed in the middle of the inner side of the external inclined exhaust chamber (1302); A spring column (1304) is slidably connected to the middle of the horizontal plate (1303), and a slider (1305) is installed at the bottom end of the spring column (1304). The inner cavity (1306) has two openings, one of which is located on the bottom left and right sides of the slider (1305), and the other of which is located on the upper left and right sides of the outer wall of the slider (1305).

2. The current sensor for pipeline detection as described in claim 1, characterized in that, The splitter component (12) includes: A trapezoidal flow cavity (1201) is installed on the top of the hollow square column (4), and the top of the trapezoidal flow cavity (1201) is connected to the bottom of the device chamber (2); A silencer cone (1202) is installed in the middle of the trapezoidal flow cavity (1201); The sound-absorbing plate (1203) is installed on the inner walls of the left and right sides of the trapezoidal flow cavity (1201).

3. The current sensor for pipeline detection as described in claim 1, characterized in that, The device chamber (2) has air inlets (14) on the left and right sides of the bottom end, and air outlets (15) on the left and right sides of the top end.

4. The current sensor for pipeline detection as described in claim 1, characterized in that, Each airflow contact plate (6) is equipped with a separating rock wool (16) in the middle, and the length and width of the separating rock wool (16) are the same as the length and width of the airflow contact plate (6).

5. The current sensor for pipeline detection as described in claim 1, characterized in that, The sensor body (1) has an extension tube (17) installed at the top and bottom middle. The extension tube (17) at the bottom is connected to the air extraction end of the micro air pump (10), and the extension tube (17) at the top is connected to the top of the external inclined exhaust chamber (1302).

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