Method of manufacturing display device

Abstract

A method of manufacturing a display device is provided. The method includes: forming a base layer on a lower protective film; forming a hard coating layer on the base layer; forming a refractive layer having a refractive index of less than or equal to about 1.4 on the hard coating layer; and cutting the upper protective film and the lower protective film with a laser, the upper protective film including a base layer, a hard coat layer, and a refractive layer.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a display device that provides visual information. Background Art

[0002] Thin display devices are implemented in the form of touch screen panels and are used in various smart devices such as smart phones and tablet personal computers, as well as various wearable devices. These touch screen panel-based display devices have a window cover made of tempered glass on the display panel to protect the display panel from scratches or external impacts.

[0003] Optical films applied to window covers of recently developed foldable displays and flexible displays need to have high mechanical strength to replace glass and should not leave marks even when maintained in a deformed state such as folding and bending. In addition, when a user uses a foldable display, attempts to increase visibility by minimizing the reflection of external light continue. Summary of the Invention

[0004] Embodiments provide a method for manufacturing a display device having improved display quality.

[0005] A method of manufacturing a display device according to an embodiment of the present disclosure may include: forming a base layer on a lower protective film; forming a hard coat on the base layer; forming a refractive layer having a refractive index less than or equal to about 1.4 on the hard coat; and cutting the upper protective film and the lower protective film with a laser, the upper protective film including the base layer, the hard coat, and the refractive layer.

[0006] In one embodiment, the output of an oscillator that irradiates the laser may be in the range of about 5 watts to about 100 watts.

[0007] In one embodiment, the wavelength of the laser may be in the range of about 5 μm to about 15 μm.

[0008] In one embodiment, the diameter of the laser may be in the range of about 0.05 mm to about 0.2 mm.

[0009] In one embodiment, the method may further include: removing the lower protective film after cutting the upper protective film and the lower protective film with the laser.

[0010] In one embodiment, when cutting the upper protective film and the lower protective film with the laser, the upper protective film and the lower protective film may be disposed on a worktable and moved, and the moving speed of the worktable may be in the range of about 10 m / min to about 50 m / min.

[0011] In one embodiment, the lower protective film may include plastic.

[0012] In one embodiment, the thickness of the lower protective film may be in the range of about 50 μm to about 150 μm.

[0013] In one embodiment, when the upper protective film and the lower protective film are cut by a laser, the laser may cut about 10% or more and about 70% or less of the thickness of the lower protective film.

[0014] In one embodiment, the refractive layer may include an organic compound containing difluorocarbene (:CF2) and trifluoromethyl group (-CF3).

[0015] In one embodiment, the molar ratio of difluorocarbene to trifluoromethyl group may be about 2:1.

[0016] In one embodiment, the organic compound may include an oligomer of dodecafluorooctyl acrylate (DFHA) represented by Formula 1.

[0017] [Formula 1]

[0018]

[0019] In Formula 1, n may be one of 6, 8, 10, and 12.

[0020] In one embodiment, when forming the refractive layer, the refractive layer may be formed by vacuum deposition.

[0021] In one embodiment, the refractive layer may be a single layer.

[0022] In one embodiment, the elastic strain of the upper protective film may be in the range of about 7% to about 30%.

[0023] In one embodiment, the thickness of the refractive layer may be in the range of about 70 nm to about 130 nm.

[0024] In one embodiment, the thickness of the hard coat may be in the range of about 5 μm to about 13 μm.

[0025] In one embodiment, the thickness of the hard coat may be less than or equal to about 10% of the thickness of the upper protective film.

[0026] In one embodiment, the elastic modulus of the hard coat may be less than or equal to about 10 GPa.

[0027] In one embodiment, the hardness of the hard coat may be in the range of about 40 KPa·mm 3 to about 170 KPa·mm 3 range.

[0028] A method of manufacturing a display device according to an embodiment of the present disclosure may include: forming a base layer on a lower protective film; forming a hard coat on the base layer; forming a refractive layer having a refractive index less than or equal to about 1.4 on the hard coat; and cutting an upper protective film and the lower protective film with a laser, the upper protective film including the base layer, the hard coat, and the refractive layer.

[0029] Therefore, by forming a refractive layer having a refractive index less than or equal to about 1.4 on top of the protective film using a vacuum deposition method, elastic strain against external shocks and the like and reflectance against external light can be reduced. In addition, by cutting the protective film with a laser instead of a knife, the elastic strain value can be further increased compared to cutting with a knife. Therefore, a user using a foldable display device can ensure stability and reliability when using the device according to an embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification, illustrating embodiments of the present disclosure together with the description.

[0031] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0032] Figure 2 shows Figure 1 a perspective view of the folded state of the electronic device shown in

[0033] Figure 3 is Figure 1 an exploded perspective view of the electronic device shown in

[0034] Figure 4 is a schematic cross-sectional view of the display device taken along line I-I' of Figure 3 shown in

[0035] Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 are views for explaining Figure 4 a method of manufacturing the upper protective film of

[0036] Figure 10 and Figure 11 are views for explaining Figure 4 a method of manufacturing the display device of DETAILED DESCRIPTION

[0037] Exemplary, non-limiting embodiments will be more clearly understood from the following detailed description in conjunction with the accompanying drawings.

[0038] In this specification, a plane can be defined by a first direction D1 and a second direction D2 that intersects the first direction D1. For example, the second direction D2 can be perpendicular to the first direction D1. A third direction D3 can be the normal direction of the plane. For example, the third direction D3 can be perpendicular to the plane formed by the first direction D1 and the second direction D2.

[0039] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, the one element or layer can be directly on, directly connected to, or directly coupled to the other element or layer, or there can be intervening elements or layers. However, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers. For this reason, the term "connected" can refer to physical connection, electrical connection, and / or fluid connection with or without intervening elements. In addition, when an element is referred to as being "in direct contact" or "having contact" etc. with another element, the one element can be "electrically in contact" or "physically in contact" with the other element; or "indirectly in contact" or "directly in contact" with the other element.

[0040] Although terms such as "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below can be referred to as the second element without departing from the teachings of the present disclosure.

[0041] For descriptive purposes, spatial relative terms (such as "below", "beneath", "under", "lower", "above", "on", "over", "higher", "side" (e.g., as in "sidewall"), etc.) may be used herein and thereby to describe the relationship of one element to another as illustrated in the figures. Spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "beneath" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an above and a below orientation. In addition, the device can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus the spatial relative descriptors used herein are to be interpreted accordingly.

[0042] Taking into account the measurements and errors associated with a particular number of measurements (such as limitations of the measurement system), "about" or "approximately" as used herein includes the recited value and means within an acceptable range of deviation for a particular value as determined by a person of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the recited value.

[0043] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, the terms "comprises", "comprising", "includes" and / or "including" when used in this specification specify the presence of the stated feature, integer, step, operation, element, component, and / or group thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0044] In the specification and claims, for purposes of their meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of...". For example, "at least one of A and B" can be understood to mean "A, B, or A and B". In the specification and claims, for purposes of their meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in the conjunctive or disjunctive sense and can be understood to be equivalent to "and / or".

[0045] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a common dictionary) should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined in this specification.

[0046] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0047] Reference Figure 1, according to an embodiment of the present disclosure, the electronic device ED may have a rectangular shape in a plan view, the rectangular shape including a long side extending in a first direction D1 and a short side extending in a second direction D2 intersecting the first direction D1. However, the present disclosure is not limited thereto, and the electronic device ED may have various shapes such as a square, a circle, and other polygons. The electronic device ED may be a flexible display device.

[0048] The electronic device ED may include a folding area FA and a plurality of non-folding areas adjacent to the folding area FA. The plurality of non-folding areas may include a first non-folding area NFA1 and a second non-folding area NFA2. The folding area FA may be disposed between the first non-folding area NFA1 and the second non-folding area NFA2. The folding area FA, the first non-folding area NFA1, and the second non-folding area NFA2 may be provided in the second direction D2.

[0049] The upper surface of the electronic device ED may be defined as a display surface DS, and the display surface DS may include a plane defined by the first direction D1 and the second direction D2. An image IM generated by the electronic device ED may be provided to a user through the display surface DS.

[0050] The display surface DS may include a display area DA and a peripheral area SA adjacent to the display area DA. The display area DA may display an image, and the peripheral area SA may not display an image. The peripheral area SA may surround the display area DA in a plan view and define a boundary of the electronic device ED printed in color.

[0051] The electronic device ED may include at least one sensor SN and at least one camera CA. The sensor SN and the camera CA may be adjacent to an edge of the electronic device ED. The sensor SN and the camera CA may be disposed in the display area DA adjacent to the peripheral area SA. Although the sensor SN and the camera CA are shown as being disposed in the second non-folding area NFA2, the present disclosure is not limited thereto, and in another embodiment, the sensor SN and the camera CA may be disposed in the first non-folding area NFA1.

[0052] Light may be transmitted through a portion of the electronic device ED on which the sensor SN and the camera CA are disposed to be provided to the sensor SN and the camera CA. For example, the sensor SN may be a proximity light sensor, but the type of the sensor SN is not limited thereto. The camera CA may capture an external image. The sensor SN and the camera CA may be provided as a plurality.

[0053] Figure 2 is a perspective view showing Figure 1 the folded state of the electronic device shown in

[0054] ReferenceFigure 2 The electronic device ED can be a foldable electronic device capable of being folded or unfolded. For example, the folding region FA can be bent about a folding axis FX parallel to the first direction D1 such that the electronic device ED can be folded. The folding axis FX can be defined as an axis parallel to the long side of the electronic device ED.

[0055] When the electronic device ED is folded, the first non-folding region NFA1 and the second non-folding region NFA2 can face each other, and the electronic device ED can be folded inward such that the display surface DS can be not exposed to the outside. However, the present disclosure is not limited thereto. For example, the electronic device ED can be folded outward about the folding axis FX such that the display surface DS can be exposed to the outside.

[0056] As Figure 2 shown, the distance between the first non-folding region NFA1 and the second non-folding region NFA2 can be approximately twice the radius of curvature FR.

[0057] In one embodiment, the radius of curvature FR of the electronic device ED can be in the range of about 0.5 mm to about 2 mm. For example, the radius of curvature FR can be in the range of about 0.5 mm to about 1.5 mm. However, the present disclosure is not limited thereto.

[0058] Figure 3 is Figure 1 an exploded perspective view of the electronic device shown in

[0059] Referring to Figure 3 , the electronic device ED can include a display device DD, an electronic module EM, a power supply module PSM, and a housing EDC. Although not shown separately, the electronic device ED can also include a mechanical structure (e.g., a hinge) for controlling the folding operation of the display device DD.

[0060] The display device DD can generate an image and detect an external input. The display device DD can include a window layer WL and a display module DM.

[0061] The window layer WL can provide the front surface of the electronic device ED. The window layer WL can be disposed on the display module DM to protect the display module DM. Specifically, the window layer WL can protect the electronic device ED from external impacts and scratches by attaching an upper protective film UPL to the upper surface of the window layer WL. The window layer WL can transmit the light generated in the display module DM and provide it to the user.

[0062] The display module DM can include a display panel DP. Although only the display panel DP is shown in the stacking structure of the display module DM in Figure 3 , the display module DM can also include a plurality of components disposed above and below the display panel DP.

[0063] The display panel DP may include a display area DA and a peripheral area SA corresponding to the display area DA and the peripheral area SA of the electronic device ED, respectively.

[0064] A first transmissive area TA1 and a second transmissive area TA2 may be defined in the display panel DP. The first transmissive area TA1 and the second transmissive area TA2 may have a light transmittance higher than that of adjacent areas. For example, the camera CA may be disposed under the first transmissive area TA1, and the sensor SN may be disposed under the second transmissive area TA2. The light transmitted through the first transmissive area TA1 and the second transmissive area TA2 may be provided to the camera CA and the sensor SN.

[0065] The display module DM may include a data driver integrated circuit DIC disposed on the peripheral area SA of the display panel DP. The data driver integrated circuit DIC may be manufactured in the form of an integrated circuit chip and mounted on the peripheral area SA. However, the present disclosure is not limited thereto, and in another embodiment, the data driver integrated circuit DIC may be mounted on a flexible circuit board connected to the display panel DP.

[0066] The electronic module EM and the power supply module PSM may be disposed under the display device DD. Although not shown, the electronic module EM and the power supply module PSM may be connected to each other through a separate flexible circuit board. The electronic module EM may control the operation of the display device DD. The power supply module PSM may supply power to the electronic module EM.

[0067] The housing EDC may accommodate the display device DD, the electronic module EM, and the power supply module PSM. The housing EDC may protect the display device DD, the electronic module EM, and the power supply module PSM. The housing EDC may include a first housing EDC1 and a second housing EDC2 to fold the display device DD. The first housing EDC1 and the second housing EDC2 may extend in a first direction D1 and be disposed in a second direction D2.

[0068] Although not shown, the electronic device ED may further include a hinge structure for connecting the first housing EDC1 and the second housing EDC2.

[0069] Figure 4 is taken along line I-I' Figure 3 a schematic cross-sectional view of the display device shown in

[0070] Reference Figure 4 , the display device DD may include a display panel DP, a polarizing layer POL, a first adhesive layer AD1, a light-shielding layer LC, a window layer WL, and an upper protective film UPL.

[0071] The display panel DP can be disposed at the bottom of the display device DD. The display panel DP can include a display area DA for displaying an image and a peripheral area SA adjacent to the display area DA.

[0072] The polarization layer POL can be disposed on the display panel DP. The polarization layer POL can change the optical axis of the light emitted from the display panel DP. The polarization layer POL and the display panel DP can have substantially the same size in a plan view. The polarization layer POL can be a single layer or multiple layers including a polarizing film and a retardation film. However, the present disclosure is not limited thereto.

[0073] The first adhesive layer AD1 can be disposed on the polarization layer POL. The first adhesive layer AD1 can include a photo-curable resin. When a small amount of photoinitiator contained in the resin is exposed to light, a photopolymerization reaction can be initiated, and monomers and oligomers that are the main components of the resin can immediately form polymers and harden. The polarization layer POL and the window layer WL can be attached through the first adhesive layer AD1.

[0074] The light-shielding layer LC can be disposed on at least a part of the first adhesive layer AD1. The light-shielding layer LC can be disposed in the peripheral area SA. The light-shielding layer LC can prevent the driver for driving the display panel DP from being visible from the outside. The light-shielding layer LC can be composed of a single layer. In another embodiment, the light-shielding layer LC can include multiple layers having the same thickness or different thicknesses. The light-shielding layer LC can be omitted.

[0075] The window layer WL can be disposed on the first adhesive layer AD1.

[0076] The window layer WL can include a transparent material, such as glass or plastic. For example, the window layer WL can include an ultra-thin glass or a transparent polyimide film having a width of less than or equal to about 0.3 mm in a third direction D3. For example, the window layer WL can be composed of a single layer. In another embodiment, the window layer WL can include multiple layers. However, the present disclosure is not limited thereto.

[0077] The upper protective film UPL can be disposed on the window layer WL. The upper protective film UPL can include a base layer BL, a second adhesive layer AD2, a hard coat HC, and a refractive layer RFL.

[0078] In one embodiment, the upper protective film UPL may have a reflectance of less than or equal to about 2% for light having a wavelength of about 550 nm. For example, the upper protective film UPL may have a reflectance in the range of about 0.5% to about 2% for light having a wavelength of about 550 nm. For example, the upper protective film UPL may have a reflectance in the range of about 0.5% to about 1.5% for light having a wavelength of about 550 nm. If the reflectance is higher than the above range, the visibility may be reduced due to the reflection of external light. However, the present disclosure is not limited thereto.

[0079] In one embodiment, the elastic strain of the upper protective film UPL may be in the range of about 7% to about 30%. For example, the elastic strain of the upper protective film UPL may be in the range of about 8% to about 30%. For example, the elastic strain may be in the range of about 8% to about 25%. If the elastic strain of the upper protective film UPL is less than the above range, cracks or the like may occur. However, the present disclosure is not limited thereto.

[0080] The base layer BL may include a plastic. For example, the base layer BL may include at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyimide (PI), polyacrylate (PAR), polycarbonate (PC), polymethyl methacrylate (PMMA), cycloolefin copolymer (COC), polyether block amide (PEBA) resin, etc. These materials may be used alone or in combination with each other. However, the present disclosure is not limited thereto.

[0081] In one embodiment, the first thickness w1 of the base layer BL in the third direction D3 may be in the range of about 30 μm to about 150 μm. For example, the first thickness w1 of the base layer BL in the third direction D3 may be in the range of about 50 μm to about 120 μm. However, the present disclosure is not limited thereto.

[0082] The second adhesive layer AD2 may be disposed on the base layer BL. The second adhesive layer AD2 and the first adhesive layer AD1 may have substantially the same function and the same material. Thus, the base layer BL and the hard coat HC may be attached to each other through the second adhesive layer AD2.

[0083] The hard coating HC can be disposed on the second adhesive layer AD2. For example, the hard coating HC can be attached to the base layer BL through the second adhesive layer AD2. The hard coating HC can protect the surface of the window layer WL from physical and chemical damage and improve the mechanical properties of the window layer WL. The hard coating HC can include at least one of polyimide, polycarbonate, polyethersulfone, polyethylene naphthalate, polyphenylene sulfide, liquid crystal polymer (LCP), polymethyl methacrylate, acrylic polymer, epoxy polymer, etc. These materials can be used alone or in combination with each other. However, the present disclosure is not limited thereto.

[0084] In one embodiment, the second thickness w2 of the hard coating HC in the third direction D3 can be in the range of about 3 μm to about 13 μm. For example, the second thickness w2 of the hard coating HC in the third direction D3 can be in the range of about 5 μm to about 13 μm. For example, the second thickness w2 of the hard coating HC in the third direction D3 can be in the range of about 5 μm to about 8 μm. However, the present disclosure is not limited thereto.

[0085] In one embodiment, the elastic modulus of the hard coating HC can be less than or equal to about 10 GPa. For example, the elastic modulus of the hard coating HC can be in the range of about 2 GPa to about 5 GPa. For example, the elastic modulus of the hard coating HC can be in the range of about 2.5 GPa to about 4.5 GPa. If the elastic modulus of the hard coating HC is less than the range described above, the upper protective film UPL may be easily deformed. On the contrary, if the elastic modulus of the hard coating HC is greater than the range described above, cracks may be easily formed in the upper protective film UPL. However, the present disclosure is not limited thereto.

[0086] In one embodiment, the hardness of the hard coating HC can be in about 40 Kpa·mm 3 to about 170 Kpa·mm 3 range. For example, the hardness of the hard coating HC can be in about 60 Kpa·mm 3 to about 150 Kpa·mm 3 range. However, the present disclosure is not limited thereto.

[0087] The refractive layer RFL can be disposed on the hard coating HC. The refractive layer RFL can have a low reflectivity, and even at high temperatures or high temperatures and high humidities, the refractive layer RFL may not increase the reflectivity or may minimize the increase in reflectivity. Therefore, the reliability of the display device DD and the external light shielding effect can be excellent.

[0088] In one embodiment, the refractive index of the refractive layer RFL may be less than or equal to about 1.5. For example, the refractive index of the refractive layer RFL may be less than or equal to about 1.4. If the refractive index of the refractive layer RFL is greater than the above range, visibility may be reduced when a user uses the display device DD.

[0089] In one embodiment, the refractive layer RFL may include an organic compound containing difluorocarbene (:CF2) and a trifluoromethyl group (-CF3). For example, the refractive layer RFL may include an organic compound having a molar ratio of CF2:CF3 = 2:1. For example, the refractive layer RFL may include an oligomer of dodecafluoroheptyl acrylate (DFHA) represented by the following Formula 1.

[0090] For example, the refractive layer RFL may be formed by crosslinking two or more organic compounds including an oligomer of DFHA represented by the following Formula 1.

[0091] [Formula 1]

[0092]

[0093] n may be one of 6, 8, 10, and 12. For example, n may be one of 8, 10, and 12. For example, n may be 8. For example, when n = 8, the crystallinity of the refractive layer RFL may be strong, and as Figure 5 and Figure 6 shown, the refractive layer RFL may be manufactured at a voltage lower than 500V during a manufacturing process using an ion acceleration voltage.

[0094] Regarding the trifluoromethyl group (-CF3), some of the terminals of the plurality of monomers of the organic compound represented by Formula 1 may be trifluoromethyl groups (-CF3), and among the plurality of monomers of the organic compound represented by Formula 1, the remaining terminals may not be trifluoromethyl groups (-CF3).

[0095] In one embodiment, the third thickness w3 of the refractive layer RFL in the third direction D3 may be in the range of about 50 nm to about 150 nm. For example, the third thickness w3 of the refractive layer RFL in the third direction D3 may be in the range of about 70 nm to about 130 nm. However, the present disclosure is not limited thereto.

[0096] In one embodiment, the refractive layer RFL may be a single layer. For example, a functional layer such as an anti-fingerprint layer may not be disposed on the refractive layer RFL. However, the present disclosure is not limited thereto. The refractive layer RFL may include a layer in which a plurality of refractive layers may be alternately stacked with each other.

[0097] In one embodiment, the refractive layer RFL may include a crosslinking agent. For example, the crosslinking agent may include zinc diacrylate. In another embodiment, the crosslinking agent may include dicumyl peroxide, benzoyl peroxide, lauroyl peroxide, tert-butylcumyl peroxide, di(tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, di-tert-butyl peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-butylperoxy)oxy)cyclohexane, tert-butyl peroxymaleic acid, tert-butyl peroxy-3,3,5-trimethylhexanoate, cyclohexanone peroxide, tert-butyl peroxyaryl carbonate, tert-butyl peroxyisopropyl carbonate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,2-bis(tert-butylperoxy)octane, tert-butyl peroxyacetate, 2,2-bis(tert-butylperoxy)butane, tert-butyl peroxybenzoate, n-butyl-4,4-bis(tert-butylperoxybutylperoxy)valerate, di-tert-butyl peroxyisophthalate, methyl ethyl ketone peroxide, α,α'-bis(tert-butylperoxy-m-isopropyl)benzene, diisopropylbenzene hydroperoxide, di-tert-butyl peroxide, 2,5-dimethyl-2, etc. These materials may be used alone or in combination with each other. However, the present disclosure is not limited thereto.

[0098] In one embodiment, the water contact angle as the inner angle formed between the refractive layer RFL and water may be greater than or equal to about 90 degrees. For example, the water contact angle of the refractive layer RFL may be in the range of about 100 degrees to about 125 degrees. Accordingly, the refractive layer RFL may have anti-fouling properties and may perform a fingerprint-proof function. In other words, if the refractive layer RFL has a water contact angle below the above range, the refractive layer RFL may be vulnerable to contamination or the fingerprint-proof function may deteriorate. However, the present disclosure is not limited thereto.

[0099] The effects of the present disclosure according to comparative examples and examples will be described below.

[0100] <Examples 1, Comparative Example 1, and Comparative Example 2>

[0101] Table 1 below shows that in the upper protective film UPL including the refractive layer RFL according to Example 1, the refractive layer RFL of the crosslinked polymer including DFHA was formed to a thickness of 90 nm. Table 1 below shows the upper protective films UPL including the refractive layer RFL according to Comparative Example 1 and Comparative Example 2, in which a refractive layer RFL including ZrO x , SiO, Nb 2 O 5 and SiO 2 was formed.

[0102] Specifically, referring to Table 1 below, Example 1 includes an upper protective film UPL including a base layer BL (thickness: 65 μm) (including polyethylene terephthalate (PET)), a hard coat HC (thickness: 5 μm) disposed on the base layer BL, and a refractive layer RFL (thickness: 90 nm) disposed on the hard coat HC and including a crosslinked polymer of DFHA.

[0103] Comparative Example 1 includes a base layer BL (thickness: 50 μm) (including polyethylene terephthalate (PET)), a hard coat HC (thickness: 5 μm) disposed on the base layer BL, and a refractive layer RFL disposed on the hard coat HC and including ZrO x (thickness: 110 nm) and SiO (thickness: 80 nm - 90 nm) of the upper protective film UPL.

[0104] Comparative Example 2 includes a base layer BL (thickness: 50 μm) (including polyethylene terephthalate (PET)), a hard coat HC (thickness: 5 μm) disposed on the base layer BL, and a refractive layer RFL disposed on the hard coat HC and including Nb 2 O 5 (thickness: 11 nm), SiO 2 (thickness: 25 nm), Nb 2 O 5 (thickness: 105 nm) and SiO 2 (thickness: 68 nm) of the upper protective film UPL.

[0105]

Table 1

[0106]

[0107] Table 2 below is a table showing the elastic strain and the reflectance of light having a wavelength of about 550 nm of the upper protective film UPL formed according to Example 1, Comparative Example 1, and Comparative Example 2. The effects of the upper protective film UPL described in the present disclosure can be confirmed by Table 2 below.

[0108] Specifically, referring to Table 2 below, it can be confirmed that in Comparative Example 1, the elastic strain of the upper protective film UPL is 4.5%, and the reflectance of light having a wavelength of about 550 nm is 1.33%.

[0109] In Comparative Example 2, it can be confirmed that the elastic strain of the upper protective film UPL is 2%, and the reflectance of light having a wavelength of about 550 nm is 0.25%.

[0110] On the other hand, in Example 1, it can be confirmed that the elastic strain of the upper protective film UPL is 8.2%, and the reflectance of light having a wavelength of about 550 nm is 1.35%.

[0111]

Table 2

[0112]

[0113] Based on the above experiments, it can be confirmed that the elastic strain of the upper protective film UPL including the crosslinked polymer of DFHA and including the refractive layer RFL formed with a thickness of 90 nm is greater than the elastic strains of Comparative Example 1 and Comparative Example 2, and the reflectance of light having a wavelength of approximately 550 nm is also measured within 2%.

[0114] Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 are views for explaining Figure 4 the manufacturing method of the upper protective film. Specifically, Figure 5 and Figure 6 are schematic cross-sectional views for explaining the method of forming the refractive layer in the upper protective film of Figure 4 .

[0115] Referring to Figure 5 and Figure 6 , the vacuum deposition apparatus may include a chamber CB, a support SP, an ion accelerator IA, a gas supply GS, a monomer storage section MO, a monomer supply line MSL, and a monomer supply section MS.

[0116] The chamber CB can protect the protective film PL by providing an environment sealed from the outside and can provide a space in which the protective film PL is stacked. For example, the chamber CB can be maintained at a vacuum pressure (e.g., about 10 Torr to about 200 Torr) lower than normal pressure (e.g., about 1 atmosphere or about 760 Torr). For example, a vacuum deposition polymerization reaction can be performed in the chamber CB. However, the present disclosure is not limited thereto.

[0117] The support SP can be disposed in the chamber CB. The support SP can provide a space in which the protective film PL can be disposed. The support SP can be an electrostatic chuck that uses electrostatic force to hold the protective film PL or a device that supports the protective film PL in a manner such as mechanical clamping.

[0118] For example, the lower protective film LPL, the base layer BL, and the hard coat HC can be sequentially stacked on the support SP. Subsequently, the refractive layer RFL can be formed on the hard coat HC. For example, the refractive layer RFL having a refractive index less than or equal to about 1.4 can be formed on the hard coat HC. The base layer BL, the hard coat HC, and the refractive layer RFL sequentially stacked on the lower protective film LPL can constitute the upper protective film UPL. As will be described below, when the upper protective film UPL is attached to Figure 4Before the window layer WL, the lower protective film LPL can be separated from the upper protective film UPL and removed.

[0119] The gas supply unit GS can supply gas into the chamber CB. The gas can include an inert gas. For example, the gas can include helium, neon, argon, etc. However, the present disclosure is not limited thereto. The gas can be used in combination with oxygen, etc. as needed.

[0120] The ion accelerator IA can accelerate the gas supplied to the chamber CB. For example, a bias voltage can be applied to the hard coating HC to allow the gas to collide with the hard coating HC.

[0121] In one embodiment, dodecafluorooctyl acrylate can be crosslinked on the hard coating HC by the ion accelerator IA. For example, the gas accelerated by the ion accelerator IA and the dodecafluorooctyl acrylate organic compound may be crosslinked on the hard coating HC due to the impact.

[0122] During the formation of the refractive layer RFL by the ion accelerator IA, the chamber CB can be kept dry without moisture. Therefore, the refractive layer RFL can be formed in a dry state by vacuum deposition.

[0123] In one embodiment, the ion acceleration voltage of the ion accelerator IA can be less than or equal to about 500V. For example, the ion acceleration voltage of the ion accelerator IA can be in the range of about 100V to about 500V. When the ion acceleration voltage of the ion accelerator IA exceeds about 500V, the water resistance of the protective film PL may be reduced. When the ion acceleration voltage of the ion accelerator IA is less than about 100V, the adhesiveness of the protective film PL may be reduced. However, the present disclosure is not limited thereto.

[0124] The monomer storage part MO, the monomer supply line MSL, and the monomer supply part MS can supply a monomer on the hard coating HC to form the protective film PL which can be a target. The monomer can be polymerized on the hard coating HC to form the refractive layer RFL. For example, the monomer storage part MO can include the monomer, and the monomer can move along the monomer supply line MSL and can be supplied into the chamber CB through the monomer supply part MS.

[0125] In one embodiment, the lower protective film LPL, the base layer BL, and the hard coating HC can be formed on the support part SP, and the gas supplied from the gas supply unit GS can be ion-accelerated on the hard coating HC to be polymerized with the monomer on the hard coating HC. The gas can form the refractive layer RFL by applying an impact to the hard coating HC together with the monomer. For example, when the monomer is formed on the hard coating HC, the ion-accelerated gas can promote the polymerization.

[0126] Figure 7 Shows laser cutting throughFigure 6 Schematic perspective view of an embodiment of a protective film formed by a manufacturing method.

[0127] Reference Figure 7 , the protective film PL can be disposed on the workbench ST and moved on the workbench ST. For example, when the workbench ST moves in one direction, the protective film PL disposed on the workbench ST can move in that direction. For example, the protective film PL can be disposed on the workbench ST and moved in the first direction D1.

[0128] The protective film PL can move in that direction, and the protective film PL can be cut by the laser LS irradiated by the laser cutter LSC disposed on the workbench ST. For example, in the case where the workbench ST moves in the first direction D1, the cutting line CL can be formed on the protective film PL by the laser LS irradiated from the laser cutter LSC.

[0129] In one embodiment, the moving speed of the workbench ST in the first direction D1 can be in the range of about 10 m / min to about 50 m / min. For example, the moving speed of the workbench ST in the first direction D1 can be in the range of about 10 m / min to about 30 m / min. If the moving speed is less than about 10 m / min, the productivity may decrease. However, the present disclosure is not limited thereto.

[0130] As Figure 7 shown, the elastic strain of the protective film PL can be increased by cutting the protective film PL with the laser LS instead of a knife. By cutting the protective film PL with the laser LS instead of a knife, the elastic strain value can be further increased compared with cutting with a knife. Therefore, the user using the foldable display device can ensure stability and reliability.

[0131] Figure 8 is a schematic diagram showing Figure 7 the laser cutter.

[0132] Reference Figure 7 and Figure 8 , the laser cutter LSC can include an oscillator OCS, a mirror MR, and a lens CD.

[0133] In one embodiment, the laser LS oscillated from the oscillator OCS can be a CO 2 laser. The laser LS can be a solid-state laser including YAG laser, sapphire laser, or a gas laser including He-Ne laser, Ar+ laser, and excimer laser. However, the present disclosure is not limited thereto.

[0134] The oscillator OCS can cause the laser LS to oscillate. In one embodiment, the output of the oscillator OCS can be in the range of approximately 5 watts to approximately 100 watts. For example, the output of the oscillator OCS can be in the range of approximately 10 watts to approximately 50 watts. However, the present disclosure is not limited thereto.

[0135] In one embodiment, the wavelength of the laser LS can be in the range of approximately 5 μm to approximately 15 μm. For example, the wavelength of the laser LS can be in the range of approximately 7 μm to approximately 12 μm. In the case where the wavelength of the laser LS is less than the above range, the protective film PL may be thermally damaged, and in the case where the wavelength of the laser LS is greater than the above range, the cutting speed of the protective film PL may slow down, thereby reducing productivity.

[0136] In one embodiment, the diameter of the laser LS can be in the range of approximately 0.05 mm to approximately 0.2 mm. For example, the diameter of the laser LS can be in the range of approximately 0.05 mm to approximately 0.1 mm. In the case where the diameter of the laser LS is less than the above range, the cutting speed of the protective film PL may slow down, and in the case where the diameter of the laser LS is greater than the above range, a large amount of by-products may be generated when the protective film PL is cut. However, the present disclosure is not limited thereto.

[0137] The laser LS emitted from the oscillator OCS can be reflected by the mirror MR, converged by the lens CD, and irradiated onto the protective film PL.

[0138] Figure 9 is a schematic cross-sectional view showing the protective film taken along Figure 7 the line II-II'.

[0139] Referring to Figure 7 , Figure 8 and Figure 9 , the protective film PL can include a cutting line CL in its cross-section by laser cutting, as shown in Figure 7 . The cutting line CL can be the area where the entire upper protective film UPL is cut in the third direction D3 in the cross-section. The cutting line CL can be the area where a part of the lower protective film LPL is cut in the third direction D3 in the cross-section.

[0140] In one embodiment, the lower protective film LPL of the protective film PL may be cut by a laser LS in a cross-section in a range of about 10% to about 70% of the thickness of the lower protective film LPL. For example, the lower protective film LPL of the protective film PL may be cut by a laser LS in a cross-section in a range of about 30% to about 70% of the thickness of the lower protective film LPL. Since a part of the lower protective film LPL is removed by the laser LS, separation from the upper protective film UPL can be promoted. For example, the lower protective film LPL may be separated from and removed by the upper protective film UPL after laser cutting. However, the present disclosure is not limited thereto.

[0141] In one embodiment, the lower protective film LPL may include plastic. For example, the lower protective film LPL may include at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyimide (PI), polyacrylate (PAR), polycarbonate (PC), polymethyl methacrylate (PMMA), cycloolefin copolymer (COC), polyether block amide (PEBA) resin, etc. These materials may be used alone or in combination with each other. However, the present disclosure is not limited thereto.

[0142] In one embodiment, the thickness of the lower protective film LPL may be in a range of about 50 μm to about 150 μm. For example, the thickness of the lower protective film LPL may be in a range of about 70 μm to about 120 μm. However, the present disclosure is not limited thereto.

[0143] Reference Figure 7 、 Figure 8 and Figure 9 and

[0144] In one embodiment, about 10% or more and about 90% or less of the thickness of the lower protective film LPL in the third direction D3 may be cut by the laser LS. For example, about 10% or more and about 70% or less of the thickness of the lower protective film LPL in the third direction D3 may be cut by the laser LS. However, the present disclosure is not limited thereto.

[0145] In one embodiment, the fifth thickness w5 of the lower protective film LPL may be less than or equal to about 20% of the fourth thickness w4 of the upper protective film UPL. For example, the thickness w5 of the lower protective film LPL may be less than or equal to about 10% of the thickness w4 of the upper protective film UPL. However, the present disclosure is not limited thereto.

[0146] Figure 10 and Figure 11 are views for explaining Figure 4 a method of manufacturing a display device.

[0147] Referring to Figure 10 and Figure 11 , a polarization layer POL may be formed on the display panel DP. The polarization layer POL may cover the display panel DP. The polarization layer POL may be formed as a single layer or multiple layers including a polarizing film and a retardation film. However, the present disclosure is not limited thereto.

[0148] A first adhesive layer AD1 may be formed on the polarization layer POL. The first adhesive layer AD1 may include a photo-curable resin. When a small amount of a photoinitiator contained in the resin is exposed to light, a photopolymerization reaction may be initiated, and monomers and oligomers that are the main components of the resin may instantaneously form polymers and harden.

[0149] A light-shielding layer LC may be formed on at least a part of the first adhesive layer AD1. The light-shielding layer LC may be formed in a peripheral region (e.g., Figure 4 the peripheral region SA in).

[0150] A window layer WL may be formed on the first adhesive layer AD1. For example, the window layer WL may be attached to the polarization layer POL through the first adhesive layer AD1. The window layer WL may include a transparent material such as glass or plastic as an example. For example, the window layer WL may be composed of a single layer.

[0151] Figure 4 The upper protective film UPL of Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 may be formed according to the processes performed in Figure 5 and Figure 6 formed Figure 4 The upper protective film UPL of may be attached to the window layer WL. Thus, the display device DD shown in Figure 4 can be manufactured.

[0152] The present disclosure can be applied to a display device and an electronic device including the display device. For example, the present disclosure can be applied to a high-resolution smartphone, a mobile phone, a smart tablet, a smart watch, a tablet personal computer, a vehicle navigation system, a television, a computer monitor, a laptop computer, etc.

[0153] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure pertains will be able to make various modifications and changes. Therefore, the embodiments of the present disclosure described above can be implemented individually or in combination with each other.

[0154] Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but are intended to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The protection scope of the present disclosure should be interpreted by the appended claims and should be interpreted as including all technical spirits within the equivalent scope in the scope of the present disclosure.

Claims

1. A method for manufacturing a display device, comprising: forming a base layer on the lower protective film; forming a hard coating layer on the base layer; forming a refractive layer having a refractive index less than or equal to 1.4 on the hard coating layer; as well as An upper protective film and the lower protective film are cut using a laser, the upper protective film including the base layer, the hard coating layer, and the refractive layer.

2. The method for manufacturing a display device according to claim 1, wherein: The output of the oscillator irradiating the laser light is in the range of 5 watts to 100 watts.

3. The method for manufacturing a display device according to claim 1, wherein: The wavelength of the laser is in the range of 5 μm to 15 μm.

4. The method for manufacturing a display device according to claim 1, wherein: The diameter of the laser is in the range of 0.05 mm to 0.2 mm.

5. The method for manufacturing a display device according to claim 1, further comprising: After the upper protective film and the lower protective film are cut by the laser, the lower protective film is removed.

6. The method for manufacturing a display device according to claim 1, wherein: When the upper protective film and the lower protective film are cut by the laser, The upper protective film and the lower protective film are arranged on a workbench and moved, and The moving speed of the workbench is in the range of 10 m / min to 50 m / min.

7. The method for manufacturing a display device according to claim 1, wherein: The lower protective film includes plastic.

8. The method for manufacturing a display device according to claim 1, wherein: The lower protective film has a thickness in the range of 50 μm to 150 μm.

9. The method for manufacturing a display device according to claim 1, wherein: When the upper protective film and the lower protective film are cut with the laser, the laser cuts 10% or more and 70% or less of the thickness of the lower protective film.

10. The method for manufacturing a display device according to claim 1, wherein: The refractive layer includes an organic compound including difluorocarbene and trifluoromethyl groups.

11. The method for manufacturing a display device according to claim 10, wherein: The molar ratio of the difluorocarbene to the trifluoromethyl group is 2:

1.

12. The method for manufacturing a display device according to claim 10, wherein: The organic compound includes an oligomer of dodecafluoroheptyl acrylate represented by Formula 1: [Formula 1] In Formula 1, n is one of 6, 8, 10, and 12.

13. The method for manufacturing a display device according to claim 1, wherein: When forming the refractive layer, the refractive layer is formed by vacuum deposition.

14. The method for manufacturing a display device according to claim 1, wherein: The refractive layer is a single layer.

15. The method for manufacturing a display device according to claim 1, wherein: The elastic strain of the upper protective film is in the range of 7% to 30%.

16. The method for manufacturing a display device according to claim 1, wherein: The thickness of the refractive layer is in the range of 70 nm to 130 nm.

17. The method for manufacturing a display device according to claim 1, wherein: The hard coating layer has a thickness in the range of 5 μm to 13 μm.

18. The method for manufacturing a display device according to claim 1, wherein: The hard coating layer has a thickness less than or equal to 10% of a thickness of the upper protective film.

19. The method for manufacturing a display device according to claim 1, wherein: The elastic modulus of the hard coating layer is less than or equal to 10 GPa.

20. The method for manufacturing a display device according to claim 1, wherein: The hardness of the hard coating is 40 KPa·mm 3 To 170KPa·mm 3 within the range.

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