Active array plane architecture based on SIP radio frequency top straight-out

Abstract

The invention relates to the technical field of active phased-array antennas, and particularly discloses an active array plane architecture based on SIP radio frequency top straight-out, which sequentially comprises a radiation unit, an upper bearing structure, an active circuit module and a lower bearing structure from top to bottom, the upper bearing structure comprises an upper bearing metal piece and an upper interconnection radio frequency connector arranged on the upper bearing metal piece; the upper interconnection radio frequency connector is respectively connected with the radiation unit and the active circuit module; a radio frequency signal is transmitted by the active circuit module and is directly transmitted to the radiation unit through the upper interconnection radio frequency connector. According to the invention, a radio frequency signal is directly transited to the radiation unit from the SIP packaging top through the radio frequency connector, multiple times of transition and transmission are not needed, and the efficiency and noise are low; the SIP packaging top is directly transited to the radiation unit and does not pass through a system printed board, SIP devices can be installed on the two faces of the system printed board, and the integration level is high.

Description

Technical Field

[0001] The present invention relates to the technical field of active phased array antennas, and more specifically, to an active array surface architecture based on direct top output of SIP radio frequency. Background Art

[0002] Active phased array antennas, with their characteristics of beam scanning without inertia and rapid change, excellent radio frequency performance, good channel redundancy, etc., have been widely used in military fields such as radar, electronic warfare, communication, reconnaissance, and early warning. An active phased array antenna usually includes N radiation units, N amplification modules, N amplitude-phase control modules, N frequency conversion modules, a signal processing module, a power supply module, and supporting carrier and heat dissipation structures, etc. Among them, the radiation unit is a passive circuit, which converts circuit energy into free space wave energy and radiates it outward; the amplification module amplifies weak electrical signals and suppresses noise, etc.; the amplitude-phase control module controls the amplitude and phase of the electrical signals of the N radiation units; the frequency conversion module converts high-frequency signals and digital signals mutually; the signal processing module processes digital signals; the power supply module and supporting carrier and heat dissipation structures provide functions such as power energy, protection support, and heat dissipation for the entire active phased array antenna. Since the radiation unit, amplification module, amplitude-phase control module, and frequency conversion module all belong to radio frequency circuits, they are closely related and usually one-to-one correspondence, that is, one radiation unit corresponds to one amplification, amplitude-phase control, and frequency conversion module. Therefore, they are usually collectively referred to as the active array surface, and the amplification module, amplitude-phase control module, and frequency conversion module among them are collectively referred to as the active circuit because they all need to use chips.

[0003] On the other hand, before the core component chip of the active circuit is applied to a circuit or electronic product, it will be placed in a protective casing. This casing not only protects the chip but also provides I / O interfaces for electrical connection with the system, environmental protection, and heat dissipation. This series of processes is called packaging. The packaging is often welded and assembled onto the system printed circuit board and electrically interconnected with the system through the I / O interface to achieve its function. System in a Package (SIP) is a packaging solution that integrates multiple functional wafers, including processor, memory, radio frequency chips, etc., according to factors such as application scenarios and the number of layers of the packaging substrate, in one package to achieve a basically complete function.

[0004] At present, active phased arrays are developing towards the directions of broadband, high power, multi-function, high performance, thin and light integration, etc. Due to its high performance and high integration, SIP packaging technology is being increasingly applied in active phased arrays. In a conventional active phased array architecture based on SIP, the SIP packaged with active circuits is assembled on one side of the system printed circuit board, and the other side of the system printed circuit board is radio-frequency interconnected with the radiation elements. In this architecture, radio-frequency signals will transition from inside the SIP package to the printed circuit board, then be transmitted by the printed circuit board and transition to the radiation elements, and finally radiate into free space. Therefore, in this architecture, radio-frequency signals experience multiple transitions and transmissions, thereby introducing significant losses, resulting in a decrease in the efficiency and noise performance of the active phased array. In addition, since the other side of the system printed circuit board needs to be radio-frequency interconnected with the radiation elements and cannot install SIP devices, this limits the system printed circuit board to only install SIP devices on one side, resulting in a decrease in the integration of the active phased array. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide an active phased array architecture based on direct top output of SIP radio frequency. The radio-frequency signal directly transitions from the top of the SIP package to the radiation element through a radio-frequency connector, without the need for multiple transitions and transmissions, with low efficiency and low noise; the direct transition from the top of the SIP package to the radiation element, without passing through the system printed circuit board, can achieve double-sided installation of SIP devices on the system printed circuit board, with high integration;

[0006] The solution adopted by the present invention to solve the technical problem is:

[0007] An active phased array architecture based on direct top output of SIP radio frequency, characterized in that it sequentially includes a radiation element, an upper carrier structure, an active circuit module, and a lower carrier structure from top to bottom;

[0008] The upper carrier structure includes an upper carrier metal part and an upper interconnect radio-frequency connector arranged on the upper carrier metal part; the upper interconnect radio-frequency connector is respectively connected to the radiation element and the active circuit module; the radio-frequency signal is transmitted from the active circuit module through the upper interconnect radio-frequency connector and directly transmitted to the radiation element.

[0009] In some possible implementation manners, the upper interconnect radio-frequency connector includes an upper signal pin connected to the radiation element, a lower elastic signal pin connected to the active circuit module and coaxially connected to the upper signal pin, and a plurality of groups of lower elastic ground pins uniformly arranged circumferentially along the lower elastic signal pin.

[0010] In some possible implementation manners, the active circuit module includes a printed circuit board, an upper active circuit SIP assembled on the side of the printed circuit board close to the upper carrier structure, and a lower active circuit SIP assembled on the side of the printed circuit board close to the lower carrier structure; the upper active circuit SIP is connected to the upper interconnect radio-frequency connector.

[0011] In some possible embodiments, a radio frequency interface connected to the upper interconnection radio frequency connector is provided on the upper active circuit SIP. The radio frequency interface includes a signal interface used in cooperation with the lower elastic signal pins, and a ground interface circumferentially arranged around the signal structure and used in cooperation with the lower elastic ground pins.

[0012] In some possible embodiments, the lower carrier structure includes a lower carrier metal part, and a lower high and low frequency connector mounted on the lower carrier metal part and serving as an external I / O interface; the lower high and low frequency connector is connected to a printed circuit board.

[0013] In some possible embodiments, elastic heat dissipation pads are respectively provided between the upper active circuit SIP and the upper carrier metal part, and between the lower active circuit SIP and the lower carrier metal part.

[0014] In some possible embodiments, the connection methods of the upper interconnection radio frequency connector to the radiation unit and the lower high and low frequency connector to the system printed circuit board are both welding or elastic contact.

[0015] In some possible embodiments, a first groove for avoiding the upper active circuit SIP is provided on one side of the upper carrier metal part close to the printed circuit board; a second groove for avoiding the lower active circuit SIP is provided on one side of the lower carrier metal part close to the printed circuit board.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] In the present invention, the upper signal pins of the upper interconnection radio frequency connector are radio frequency interconnected with the radiation unit, and the lower elastic signal pins and the lower elastic ground pins elastically contact the radio frequency interface on the top of the upper active circuit SIP, thereby realizing the radio frequency interconnection between the active circuit module and the radiation unit; the radio frequency signal is directly transmitted from the upper active circuit SIP to the radiation unit, without multiple transitions and transmissions, with low loss, so it has high efficiency and low noise;

[0018] In the present invention, the radio frequency signal is directly transmitted from the upper active circuit SIP to the radiation unit, without passing through the printed circuit board, thereby removing the limitation that the printed circuit board can only be mounted with SIP devices on one side, and doubling the integration degree. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a sectional view of the present invention;

[0020] Figure 2 is an exploded sectional view of the present invention;

[0021] Figure 3 is a top view of the upper carrier structure of the present invention;

[0022] Figure 4 is a bottom view of the carrier structure of the present invention;

[0023] Figure 5 Top view of the active circuit module of the present invention;

[0024] Figure 6 Bottom view of the active circuit module of the present invention;

[0025] Wherein: 1. Radiation unit;

[0026] 2. Upper carrier structure; 201. Upper carrier metal part; 202. Upper interconnecting RF connector; 203. Lower elastic signal pin; 204. Lower elastic ground pin; 205. Upper signal pin;

[0027] 3. Active circuit module; 301. Printed circuit board; 302. Upper active circuit SIP; 303. RF interface; 304. Signal interface; 305. Ground interface; 306. Elastic heat dissipation gasket; 307. Lower active circuit SIP;

[0028] 4. Lower carrier structure; 401. Lower carrier metal part; 402. Lower high and low frequency connector. Detailed implementation manners

[0029] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal connection of two components or the interaction relationship between two components. The "first", "second" and similar words mentioned in this application do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "a" do not represent a quantity limit, but represent the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In the description of the embodiments of this application, unless otherwise stated, the meaning of "a plurality" refers to two or more. For example, a plurality of positioning posts means two or more positioning posts. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0030] The present invention will be described in detail below.

[0031] As Figures 1 - 6 shown:

[0032] An active array surface architecture based on SIP RF top direct output, which sequentially includes a radiation unit 1, an upper carrier structure 2, an active circuit module 3, and a lower carrier structure 4 from top to bottom;

[0033] The upper bearing structure 2 includes an upper bearing metal part 201 and an upper interconnecting RF connector 202 arranged on the upper bearing metal part 201; the upper interconnecting RF connector 202 is respectively connected to the radiation unit 1 and the active circuit module 3; the RF signal is transmitted from the active circuit module 3 through the upper interconnecting RF connector 202 and directly transmitted to the radiation unit 1, without multiple transitions and transmissions, with low loss, so it has high efficiency and low noise.

[0034] In some possible implementation manners, the upper interconnecting RF connector 202 includes an upper signal pin 205 connected to the radiation unit 1, a lower elastic signal pin 203 connected to the active circuit module 3 and coaxially connected to the upper signal pin 205, and multiple groups of lower elastic ground pins 204 uniformly arranged circumferentially along the lower elastic signal pin 203;

[0035] The upper signal pin 205 is RF-connected to the radiation unit 1, and the lower elastic signal pin 203 and the lower elastic ground pins 204 elastically touch the active circuit module 3 to realize the RF interconnection between the active circuit module 3 and the radiation unit 1.

[0036] In some possible implementation manners, the active circuit module 3 includes a printed circuit board 301, an upper active circuit SIP 302 assembled on one side of the printed circuit board 301 close to the upper bearing structure 2, and a lower active circuit SIP 307 assembled on one side of the printed circuit board 301 close to the lower bearing structure 4; the upper active circuit SIP 302 is connected to the upper interconnecting RF connector 202;

[0037] The function of the printed circuit board 301 is to integrate and distribute the high and low frequency signals from the radiation unit 1 or from the outside of the system to the upper active circuit SIP 302 and the lower active circuit SIP 307 according to whether the active array surface works in the transmitting or receiving state, and provide the electrical interconnection between the two, and after being processed by the two, transmit them to the upper interconnecting RF connector 202 or the lower bearing structure 4.

[0038] In some possible implementation manners, in order to effectively realize the interconnection between the upper interconnecting RF connector 202 and the upper active circuit SIP302; an RF interface 303 connected to the upper interconnecting RF connector 202 is arranged on the upper active circuit SIP 302, and the RF interface 303 includes a signal interface 304 used in cooperation with the lower elastic signal pin 203 and a ground interface 305 arranged circumferentially around the signal structure and used in cooperation with the lower elastic ground pin 204;

[0039] Specifically, there is one group of signal interfaces 304 and four groups of ground interfaces 305;

[0040] Furthermore, both the upper active circuit SIP 302 and the lower active circuit SIP 307 are in multiple groups.

[0041] In some possible embodiments, the lower bearing structure 4 includes a lower bearing metal part 401 and a lower high-low frequency connector 402 mounted on the lower bearing metal part 401 and serving as an external I / O interface; the lower high-low frequency connector 402 is connected to the printed circuit board 301.

[0042] In some possible embodiments, in order to effectively avoid thermal contact between the upper active circuit S IP302 and the upper bearing metal part 201, and between the lower active circuit S IP307 and the lower bearing metal part 401; elastic heat dissipation pads 306 are respectively provided between the upper active circuit S IP302 and the upper bearing metal part 201, and between the lower active circuit S IP307 and the lower bearing metal part 401; heat dissipation can be effectively achieved through the elastic heat dissipation pads 306;

[0043] Specifically, the elastic heat dissipation pad 306 provided on the upper active circuit S IP302 will avoid the radio frequency interface 303.

[0044] In some possible embodiments, the connection methods of the upper interconnection radio frequency connector 202 to the radiation unit 1 and the lower high-low frequency connector 402 to the system printed circuit board 301 are both welding or elastic contact; the assembly between each module can also be welding, screwing or other possible methods.

[0045] In some possible embodiments, a first groove for avoiding the upper active circuit S IP302 is provided on one side of the upper bearing metal part 201 close to the printed circuit board 301; a second groove for avoiding the lower active circuit S IP307 is provided on one side of the lower bearing metal part 401 close to the printed circuit board 301; the first groove and the upper bearing metal part 201 cooperate to form a first cavity for mounting the upper active circuit S IP302, and the second groove and the lower bearing metal part 401 cooperate to form a second cavity for mounting the lower active circuit S IP307.

[0046] The present invention is not limited to the foregoing specific embodiments. The present invention extends to any new feature or any new combination disclosed in this specification, and any new method or process step or any new combination disclosed.

Claims

1. An active array architecture based on SIP RF top direct outlet, characterized in that: From top to bottom, it includes a radiation unit, an upper bearing structure, an active circuit module, and a lower bearing structure; The upper bearing structure includes an upper bearing metal part and an upper interconnecting RF connector arranged on the upper bearing metal part; the upper interconnecting RF connector is respectively connected to the radiation unit and the active circuit module; the RF signal is transmitted by the active circuit module and directly transmitted to the radiation unit through the upper interconnecting RF connector.

2. According to claim 1, an active array architecture based on SIP RF top straight-out, characterized in that: The upper interconnection RF connector includes an upper signal pin connected to the radiation unit, a lower elastic signal pin connected to the active circuit module and coaxially connected to the upper signal pin, and a plurality of lower elastic ground pins uniformly arranged along the circumference of the lower elastic signal pin.

3. According to claim 2, an active array architecture based on SIP RF top straight-out, characterized in that: The active circuit module includes a printed circuit board, an upper active circuit SIP mounted on the printed circuit board near the upper bearing structure, and a lower active circuit SIP mounted on the printed circuit board near the lower bearing structure; the upper active circuit SIP is connected to the upper interconnection RF connector.

4. According to claim 3, an active array architecture based on SIP RF top straight-out is characterized in that: A radio frequency interface connected to the upper interconnection radio frequency connector is arranged on the upper active circuit SIP.

5. According to claim 4, an active array architecture based on SIP RF top straight-out, characterized in that: The radio frequency interface includes a signal interface used in conjunction with the lower elastic signal pin, and a ground interface which is arranged circumferentially around the signal structure and used in conjunction with the lower elastic ground pin.

6. According to claim 3, an active array architecture based on SIP RF top straight-out is characterized in that: The lower bearing structure comprises a lower bearing metal part and a lower high and low frequency connector installed on the lower bearing metal part and serving as an external I / O interface; the lower high and low frequency connector is connected to a printed circuit board.

7. The active array architecture based on SIP RF top straight-out according to claim 6 is characterized in that: Elastic heat dissipation pads are respectively arranged between the upper active circuit SIP and the upper bearing metal piece, and between the lower active circuit SIP and the lower bearing metal piece.

8. The active array architecture based on SIP RF top outlet according to claim 6 is characterized in that: The connection modes of the upper interconnected RF connector and the radiation unit, and the lower high and low frequency connector and the system printed circuit board are welding or elastic contact.

9. An active array architecture based on SIP RF top straight-out according to any one of claims 6 to 8, characterized in that: A first groove for avoiding the upper active circuit SIP is provided on one side of the upper bearing metal member close to the printed circuit board; a second groove for avoiding the lower active circuit SIP is provided on one side of the lower bearing metal member close to the printed circuit board.

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