Circuit board assembly, camera module and electronic equipment

Abstract

The invention discloses a circuit board assembly, a camera module and electronic equipment, and belongs to the technical field of camera equipment.The circuit board assembly comprises a first rigid circuit board, a flexible circuit board and a second rigid circuit board, the flexible circuit board comprises a first connecting part, a bending part and a second connecting part, the first connecting part is connected with the first rigid circuit board, and the bending part is connected with the second rigid circuit board; and the bending part is connected with the first connecting part and the second connecting part. The second rigid circuit board is provided with a groove, the second connecting part is connected with the second rigid circuit board, and at least one part of the second connecting part extends into the groove.

Description

Technical Field

[0001] This application belongs to the technical field of imaging devices, and particularly relates to a circuit board assembly, an imaging module, and an electronic device. Background Art

[0002] Currently, with the development of smart phones, in order to capture more distant scenes and reduce the overall height of the device, periscope cameras are increasingly used in more and more high-end mobile phones.

[0003] The circuit board assembly in the imaging module usually consists of a rigid circuit board and a flexible circuit board. After the circuit board assembly is installed, the flexible circuit board protrudes from the edge of the housing in the imaging module.

[0004] To solve the problem that the flexible circuit board of the module circuit board protrudes from the housing by a large size, the form of multiple bends of the module circuit board is usually adopted. However, the form of multiple bends requires adding bending gaskets, which brings the problem of increased product cost. Moreover, the increase in components in the periscope camera will lead to an increase in the length of the periscope camera, thereby increasing the size of the product. Summary of the Invention

[0005] This application aims to provide a circuit board assembly, an imaging module, and an electronic device, which can reduce the size of the circuit board assembly, reduce the weight of the imaging module, and further reduce the overall size of the electronic device and reduce the overall weight of the electronic device.

[0006] In a first aspect, an embodiment of this application provides a circuit board assembly, including:

[0007] A first rigid circuit board;

[0008] A flexible circuit board, the flexible circuit board includes a first connection portion, a bending portion, and a second connection portion. The first connection portion is connected to the first rigid circuit board, and the bending portion connects the first connection portion and the second connection portion;

[0009] A second rigid circuit board, a groove is provided on the second rigid circuit board, the second connection portion is connected to the second rigid circuit board, and at least a part of the second connection portion extends into the groove.

[0010] In a second aspect, an embodiment of this application provides an imaging module, including:

[0011] A housing, an opening is provided on the housing, and light enters the housing through the opening;

[0012] A lens assembly, disposed in the housing;

[0013] The circuit board assembly as in the first aspect, the circuit board assembly is connected to the housing, and the light entering the housing is received by the circuit board assembly after passing through the lens assembly.

[0014] In a third aspect, an embodiment of the present application provides an electronic device, including: the camera module as in the second aspect.

[0015] In the embodiment of the present application, by retracting a part of the second rigid circuit board, miniaturization of the camera module is achieved, such that the camera module occupies less space in the whole machine, and space can be reserved for other components in the whole machine. Some structural components in the circuit board assembly are reduced, thereby reducing the cost of the camera module. The processing technology of the circuit board assembly is simple, easy to produce and manufacture, and the product has strong feasibility. Through the above method, the size of the electronic device can be reduced, the cost of the electronic device can be lowered, and the overall weight of the electronic device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a camera module provided by some embodiments of the present application;

[0017] Figure 2 is a schematic structural diagram of a circuit board assembly provided by some embodiments of the present application;

[0018] Figure 3 is a schematic structural diagram of a base and a filter provided by some embodiments of the present application;

[0019] Figure 4 is a schematic structural diagram of a circuit board assembly, a base and a filter provided by some embodiments of the present application;

[0020] Figure 5 is a schematic structural diagram of a base and a filter provided by some embodiments of the present application;

[0021] Figure 6 is a schematic structural diagram of a base and a filter provided by some embodiments of the present application;

[0022] Figure 7 is a schematic structural diagram of an electronic device provided by some embodiments of the present application.

[0023] Reference Signs:

[0024] 100 Circuit board assembly, 110 First rigid circuit board, 120 Flexible circuit board, 121 First connection part, 122 Bending part, 123 Second connection part, 130 Second rigid circuit board, 131 Groove, 132 Body, 133 First protrusion, 134 Second protrusion, 140 Photosensitive chip, 150 Gold connecting wire, 161 First strengthening part, 162 Second strengthening part, 200 Camera module, 210 Housing, 211 Opening, 212 Outer shell, 213 Base, 214 Guide surface, 215 Oblique cutting surface, 220 Lens assembly, 221 Lens, 222 Prism, 230 First bonding part, 231 First sub-bonding part, 232 Second sub-bonding part, 240 Second bonding part, 250 Filter, 260 Motor, 270 Ball, 280 Motor circuit board, 290 Electronic component, 300 Electronic device, 310 Main body. Detailed implementation manners

[0025] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0026] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the related objects before and after.

[0027] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0028] The following will be described in conjunction with Figures 1-7 a circuit board assembly, a camera module and an electronic device according to an embodiment of the present application.

[0029] In conjunction with Figure 1 and Figure 2As shown in the figure, some embodiments of the present application provide a circuit board assembly 100, and the circuit board assembly 100 includes: a first rigid circuit board 110, a flexible circuit board 120, and a second rigid circuit board 130. The flexible circuit board 120 includes a first connection portion 121, a bending portion 122, and a second connection portion 123. The first connection portion 121 is connected to the first rigid circuit board 110, and the bending portion 122 connects the first connection portion 121 and the second connection portion 123. A groove 131 is provided on the second rigid circuit board 130, and the second connection portion 123 is connected to the second rigid circuit board 130, and at least a part of the second connection portion 123 extends into the groove 131.

[0030] The circuit board assembly 100 mainly functions to electrically connect and support other components. In the circuit board assembly 100, the flexible circuit board 120 can be bent. The flexible circuit board 120 serves as an assembly connection component between the module and the whole machine, and the surfaces of the first rigid circuit board 110 and the second rigid circuit board 130 can serve as the bearing surfaces for devices such as electronic components 290 and gold connection lines 150.

[0031] Providing the groove 131 on the second rigid circuit board 130 is equivalent to locally shrinking the second rigid circuit board 130. The soft-hard combination area of the flexible circuit board 120 and the second rigid circuit board 130 is designed to be shrunk relative to the edge of the second rigid circuit board 130, and at least a part of the second connection portion 123 is accommodated in the second rigid circuit board 130. The bending portion 122 connects the first connection portion 121 and the second connection portion 123, and the bending portion 122 is a bending structure. Without changing the length of the flexible circuit board 120, the height by which the bent flexible circuit board 120 protrudes from the second rigid circuit board 130 will be reduced. Such a design ensures that the flexible circuit board 120 does not protrude from the housing 210 of the camera module 200 or protrudes less from the housing 210 of the camera module 200 after being bent. In this case, the number of times of bending the flexible circuit board 120 can be reduced, the damage rate of the flexible circuit board 120 can be lowered, and moreover, the solution of the present application does not require a bending gasket to be provided on the circuit board assembly. In this way, the length of the camera module 200 can be shortened without providing a bending gasket.

[0032] In the embodiments of the present application, by shrinking a part of the second rigid circuit board 130, the miniaturization of the camera module 200 is achieved, so that the camera module 200 occupies less space in the whole machine, and the space can be reserved for other components in the whole machine. The circuit board assembly 100 reduces some structural components, thereby reducing the cost of the camera module 200. The processing technology of the circuit board assembly 100 is simple, easy to produce and manufacture, and the product has strong feasibility. Through the above method, the overall size of the electronic device 300 can be reduced, the cost of the electronic device 300 can be reduced, and the overall weight of the electronic device 300 can be reduced. The size of the circuit board assembly 100 is reduced, correspondingly reducing the weight of the camera module 200. When the circuit board assembly 100 in this embodiment is assembled in the electronic device 300, it is convenient for users to use the electronic device 300.

[0033] In some embodiments of the present application, optionally, the circuit board assembly 100 further includes: an image sensor chip 140, the image sensor chip 140 is disposed on the second rigid circuit board 130, and the image sensor chip 140 is spaced apart from the groove 131.

[0034] When the groove 131 is formed on the second rigid circuit board 130, the size of the groove 131 should not be too large to avoid excessive reduction of the solid area on the second rigid circuit board 130, and to ensure that there is enough space on the second rigid circuit board 130 to arrange the electronic components 290.

[0035] The second rigid circuit board 130 is mounted with the image sensor chip 140, and the second rigid circuit board 130 plays a role of supporting the image sensor chip 140. The image sensor chip 140 is spaced apart from the groove 131, that is, the groove 131 is not formed at the mounting position of the image sensor chip 140. The second rigid circuit board 130 cannot be shrunk to the bottom of the image sensor chip 140 to avoid the image sensor chip 140 being suspended on the flexible board, thereby ensuring that the image sensor chip 140 is mounted in the hard board area of the circuit board assembly 100 and guaranteeing the mounting stability of the image sensor chip 140 on the second rigid circuit board 130.

[0036] Combined with Figure 1 and Figure 2 As shown, in some embodiments, optionally, the circuit board assembly 100 further includes: a gold connecting wire 150, and the gold connecting wire 150 connects the image sensor chip 140 and the second rigid circuit board 130.

[0037] One end of the gold connecting wire 150 is connected to the image sensor chip 140, and the other end of the gold connecting wire 150 is connected to the second rigid circuit board 130. The gold connecting wire 150 has good electrical conductivity. The gold connecting wire 150 can reduce the loss during signal transmission, ensuring the efficiency and accuracy of electrical signal transmission. For the image sensor chip 140 with high resolution and high frame rate, fast and stable transmission of image signals can be achieved.

[0038] The bonding force of the gold connecting wire 150 is relatively strong. In complex usage environments such as vibration and impact, the connection of the gold connecting wire 150 is more reliable, and the problem of key detachment is not likely to occur, improving the stability of the connection of the photosensitive chip 140.

[0039] Other electronic components 290 are also connected to the second rigid circuit board 130. The electronic components 290 can be fixed on the second rigid circuit board 130 by soldering to ensure good electrical connection between the electronic components 290 and the second rigid circuit board 130.

[0040] Combined Figure 1 and Figure 2 As shown in , in some embodiments, optionally, the second rigid circuit board 130 includes: a body 132, a first protruding portion 133, and a second protruding portion 134. The first protruding portion 133 and the second protruding portion 134 are provided on the body 132. A groove 131 is provided between the body 132, the first protruding portion 133, and the second protruding portion 134. The first protruding portion 133 and the second protruding portion 134 are both spaced apart from the flexible circuit board 120.

[0041] A part of the second rigid circuit board 130 is recessed to form the groove 131, and the first protruding portion 133 and the second protruding portion 134 are formed on both sides of the groove 131. When a part of the flexible circuit board 120 extends into the groove 131, the first protruding portion 133 and the second protruding portion 134 are both spaced apart from the flexible circuit board 120, that is, the flexible circuit board 120 does not adhere to the first protruding portion 133 and the second protruding portion 134. When the flexible circuit board 120 is bent, the first protruding portion 133 and the second protruding portion 134 will not interfere with the bending process of the flexible circuit board 120, avoiding scratching the flexible circuit board 120, thereby reducing the damage rate of the flexible circuit board 120.

[0042] Combined Figure 1 and Figure 2 As shown in , in some embodiments, optionally, the circuit board assembly 100 further includes: a first reinforcing portion 161 and a second reinforcing portion 162. The first reinforcing portion 161 connects the second connecting portion 123 and the second rigid circuit board 130. The first reinforcing portion 161 is provided on the side of the second connecting portion 123 close to the first protruding portion 133. The second reinforcing portion 162 connects the second connecting portion 123 and the second rigid circuit board 130. The second reinforcing portion 162 is provided on the side of the second connecting portion 123 close to the second protruding portion 134. In the direction away from the bending portion 122 of the second connecting portion 123, that is, Figure 1 as indicated by the arrow at H2 in , the side of the first reinforcing portion 161 away from the second connecting portion 123 is inclined towards the first protruding portion 133, and the side of the second reinforcing portion 162 away from the second connecting portion 123 is inclined towards the second protruding portion 134.

[0043] A first reinforcing portion 161 and a second reinforcing portion 162 are arranged on both sides of the flexible printed circuit board 120. The first reinforcing portion 161 and the second reinforcing portion 162 are located on the side of the flexible printed circuit board 120 adjacent to the second rigid printed circuit board 130. The first reinforcing portion 161 connects the flexible printed circuit board 120 and the second rigid printed circuit board 130, and the second reinforcing portion 162 also connects the flexible printed circuit board 120 and the second rigid printed circuit board 130.

[0044] In the direction from the first rigid printed circuit board 110 to the second rigid printed circuit board 130, the distance between the first reinforcing portion 161 and the first protruding portion 133 decreases, that is, the width of the first reinforcing portion 161 gradually increases. The distance between the second reinforcing portion 162 and the second protruding portion 134 decreases, that is, the width of the second reinforcing portion 162 gradually increases. Arranging the first reinforcing portion 161 and the second reinforcing portion 162 on both sides of the flexible printed circuit board 120 is equivalent to widening the side of the flexible printed circuit board 120 adjacent to the second rigid printed circuit board 130, increasing the contact area between the flexible printed circuit board 120 and the second rigid printed circuit board 130, and improving the connection stability between the flexible printed circuit board 120 and the second rigid printed circuit board 130.

[0045] In some embodiments, optionally, the bending portion 122 bends towards the opening direction of the groove 131, and the opening direction of the groove 131 is Figure 1 the direction pointed by the arrow at H3.

[0046] The bending portion 122 bends towards the opening direction of the groove 131. The bending direction of the bending portion 122 is the same as the direction in which the second connecting portion 123 extends out of the groove. There is no included angle between the second connecting portion 123 and the bending portion 122, so that the flexible printed circuit board 120 does not need to be bent multiple times, reducing the damage rate of the flexible printed circuit board 120.

[0047] Combined Figure 1 and Figure 2 As shown, in some embodiments of the present application, an imaging module 200 is proposed. The imaging module 200 includes: a housing 210, a lens assembly 220, and the circuit board assembly 100 in any of the above embodiments. An opening 211 is provided on the housing 210, and light enters the housing 210 through the opening 211. The lens assembly 220 is disposed in the housing 210. The circuit board assembly 100 is connected to the housing 210, and the light entering the housing 210 is received by the circuit board assembly 100 after passing through the lens assembly 220.

[0048] External light enters the housing 210 through the opening 211. The light entering the housing 210 passes through the lens assembly 220, and the light passing through the lens assembly 220 irradiates on the photosensitive chip 140 in the circuit board assembly 100.

[0049] The lens assembly 220 includes a prism 222 and a lens 221. In this embodiment, the imaging module 200 can be a periscope imaging module. When external light passes through the prism 222, the prism 222 reflects the light so that the light is reflected to the lens 221, and after passing through the lens 221, the light irradiates on the photosensitive chip 140.

[0050] Combined with Figure 1 and Figure 2 as shown, in some embodiments, optionally, in the direction of the opening of the groove 131, that is, Figure 2 the direction pointed by the arrow at H1, the distance between the second rigid circuit board 130 and the edge of the housing 210 is D1, the maximum distance between the second rigid circuit board 130 and the flexible circuit board 120 is D2, D1≥D2, or D1<D2, and D2 - D1≤1.2mm.

[0051] Since a part of the flexible circuit board 120 extends into the second rigid circuit board 130, the height by which the bent flexible circuit board 120 protrudes from the second rigid circuit board 130 is reduced, so that the flexible circuit board 120 does not protrude from the edge of the housing 210, or the height difference by which the flexible circuit board 120 protrudes from the edge of the housing 210 is less than or equal to 1.2mm, solving the problem that the size by which the flexible circuit board 120 protrudes from the edge of the housing 210 is too large. In this case, the size of the imaging module 200 can be reduced.

[0052] In a possible application, 0.1mm≤D1≤3mm, 0mm≤D2≤2mm.

[0053] Combined with Figure 1 and Figure 5 as shown, in some embodiments, optionally, the housing 210 includes: an outer shell 212 and a base 213. The base 213 is connected to the outer shell 212, the circuit board assembly 100 is connected to the base 213, and a guiding surface 214 is provided on the base 213, and at least a part of the flexible circuit board 120 is bent along the guiding surface 214.

[0054] An opening 211 is provided on the outer shell 212, and the lens assembly 220 is installed inside the outer shell 212. The base 213 is installed on a side of the outer shell 212 far from the opening 211, and the circuit board assembly 100 is installed on the base 213.

[0055] After the flexible circuit board 120 is bent, the base 213 is located adjacent to the flexible circuit board 120. A guiding surface 214 is provided on the base 213, and a part of the flexible circuit board 120 is bent along the guiding surface 214. The guiding surface 214 plays a role in guiding and supporting the flexible circuit board 120, avoiding the problem that the flexible circuit board 120 is suspended and prone to shaking, and reducing the damage rate of the flexible circuit board 120.

[0056] As Figure 1 shown, in a possible application, an inclined plane 215 is further provided on the base 213. The inclined plane 215 is adjacent to the guiding surface 214. By providing the inclined plane 215 on one side of the guiding surface 214, burrs at the end of the guiding surface 214 can be avoided, making the end of the guiding surface 214 smoother in processing and preventing the guiding surface 214 from damaging the flexible circuit board 120.

[0057] As Figure 1 shown, in some embodiments, optionally, at least a part of the flexible circuit board 120 is connected to the guiding surface 214.

[0058] A part of the flexible circuit board 120 is attached to the guiding surface 214, and a part of the flexible circuit board 120 that abuts against the guiding surface 214 is connected to the guiding surface 214. The guiding surface 214 fixes the flexible circuit board 120, further improving the stability of the flexible circuit board 120.

[0059] In this embodiment, the flexible circuit board 120 is fixed by the base 213, improving the reliability of the camera module 200 and preventing the flexible circuit board 120 from failing after aging testing.

[0060] Combined with Figure 1 、 Figure 4 and Figure 6 shown, in some embodiments, optionally, a first bonding portion 230 and a second bonding portion 240 are provided on a side of the base 213 facing away from the lens assembly 220. At least a part of the edge of the second rigid circuit board 130 is bonded to the first bonding portion 230, and one side of the second connecting portion and the second rigid circuit board 130 that are close to each other is pasted on the second bonding portion 240.

[0061] The second rigid circuit board 130 is bonded to the base 213, thereby fixing the second rigid circuit board 130. The connection position between the second rigid circuit board 130 and the flexible circuit board 120 is bonded to the second bonding portion 240. Therefore, the connection position between the second rigid circuit board 130 and the flexible circuit board 120 is also fixed on the base 213. During the bending process of the flexible circuit board 120, the connection position between the second rigid circuit board 130 and the flexible circuit board 120 will not break due to the bending of the flexible circuit board 120, ensuring the connection stability between the second rigid circuit board 130 and the flexible circuit board 120.

[0062] Combined with Figure 1 and Figure 6As shown, in some embodiments, optionally, the first bonding portion 230 includes: a first sub-bonding portion 231 and a second sub-bonding portion 232. The first sub-bonding portion 231 extends along a part of the edge of the base 213. The first sub-bonding portion 231 is spaced apart from the second bonding portion 240. The second sub-bonding portion 232 extends along the edge of the groove 131.

[0063] The first sub-bonding portion 231 extends along a part of the edge of the base 213. In the circumferential direction of the base 213, there is a relatively large bonding area between the second rigid circuit board 130 and the base 213, ensuring the connection stability of the second rigid circuit board 130 on the base 213. A part of the structure on the second rigid circuit board 130 is recessed to form the groove 131. The second sub-bonding portion 232 is provided on the base 213, and the second sub-bonding portion 232 extends along the edge of the groove 131, that is, the second sub-bonding portion 232 is adapted to a part of the structure of the groove 131, so that the recessed position of the second rigid circuit board 130 can also be adhesively fixed on the base 213, further improving the connection stability of the second rigid circuit board 130.

[0064] The first sub-bonding portion 231 and the second bonding portion 240 are spaced apart. There is no bonding structure between the connection position of the second rigid circuit board 130 and the flexible circuit board 120 and the first protrusion 133, and there is no bonding structure between the connection position of the second rigid circuit board 130 and the flexible circuit board 120 and the second protrusion 134. The positions without the bonding structure avoid the bending area of the flexible circuit board 120, preventing interference during the assembly of the flexible circuit board 120.

[0065] Combined Figure 1 and Figure 3 As shown, in a possible embodiment, the camera module 200 further includes a motor 260. The motor 260 is fixed on the base 213. The lens 221 is connected to the motor 260. The motor 260 is used to drive the lens 221 to move relative to the housing 212, thereby adjusting the position of the lens 221 to achieve functions such as focusing and / or defocusing. A ball 270 is provided on the lens 221, and the ball 270 is used to reduce the frictional force when the lens 221 moves. A motor circuit board 280 is fixed on the housing 212, and the motor circuit board 280 is used to supply power to the motor 260. A filter 250 is fixed on the base 213. After the light passes through the lens 221, the light passes through the filter 250 and then irradiates onto the photosensitive chip 140.

[0066] In the above embodiments, the purpose of the present application is to provide a structural design mainly applied to the cameras of digital electronic products such as smart phones and tablet computers, which is used to reduce the size of the periscope camera module and improve the bending reliability of the module circuit board.

[0067] The second rigid circuit board 130 on the circuit board assembly 100 is designed to be recessed, so that the junction position of the rigid-flexible circuit board is recessed relative to the outer shape of the camera module 200, and the bending position of the flexible circuit board 120 presents a concave shape.

[0068] The base 213 is designed with a special-shaped structure. Part of it bonds the second rigid circuit board 130, part of it bonds the flexible circuit board 120, and serves as a guiding track for the bending of the flexible circuit board 120.

[0069] The camera module 200 in this solution has the following advantages: reducing the use of components, thereby reducing the cost of the camera module 200. By reducing the outer dimension of the camera module 200, the problem that the flexible circuit board 120 protrudes from the housing 210 is solved. When the flexible circuit board 120 is fixed, the reliability of the camera module 200 is improved, and the failure of the flexible circuit board 120 after the aging test is avoided.

[0070] This application solves the problem of module miniaturization by adopting a new periscope camera structure design, while reducing the cost of the module and improving the bending reliability of the module circuit board.

[0071] As Figure 1 shown, a structure diagram of a new periscope camera module is shown. The camera module 200 is composed of a first rigid circuit board 110, a second rigid circuit board 130, a flexible circuit board 120, a gold connecting wire 150, electronic components 290, a photosensitive chip 140, a motor, a base 213, a lens 221, a prism 222 (or a reflector), etc. The circuit board assembly 100 mainly plays the role of electrical connection and supporting other parts. The components and devices can be fixed by conventional processes such as glue bonding and solder paste welding.

[0072] For the final state after the flexible circuit board 120 is bent, the flexible circuit board 120 does not protrude from the edge of the housing 210 as much as possible. Figure 1 The dotted line position in Figure 1 is the edge of the housing 210, and the flexible circuit board 120 does not extend to the dotted line position in

[0073] The size of the base 213 is greater than or equal to the size of the second rigid circuit board 130. For the special-shaped design of the base 213, the local base 213 needs to be designed to avoid the bending area of the flexible circuit board 120, and the flexible circuit board 120 should not be interfered during assembly.

[0074] The base 213 is designed with a special-shaped structure. The base 213 and the flexible circuit board 120 are designed to be adhered, so that the base 213 fixes the shape of the flexible circuit board 120 and protects the flexible circuit board 120 from external forces. The flexible circuit board 120 is partially fixed on the base 213 and does not need to be dynamically bent later.

[0075] The flexible circuit board 120 only needs to be bent and shaped during assembly, and there will be no secondary bending after the camera module 200 is assembled, which greatly reduces the risk of bending failure of the flexible circuit board 120.

[0076] In an embodiment of the present application, an electronic device 300 is proposed, which includes the camera module 200 in any of the above embodiments. The electronic device 300 in this embodiment can achieve the technical effects of the camera module 200 in any of the above embodiments, which will not be elaborated here.

[0077] As Figure 7 shown, the electronic device 300 further includes a main body 310, and the camera module 200 is assembled on the main body 310.

[0078] The electronic device 300 can be an electronic consumer product such as a mobile phone, a tablet computer, a laptop computer, a personal game console, etc.

[0079] In the description of this specification, the description of reference terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0080] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A first rigid circuit board; A flexible circuit board, the flexible circuit board comprising a first connecting portion, a bending portion, and a second connecting portion, the first connecting portion being connected to the first rigid circuit board, and the bending portion connecting the first connecting portion and the second connecting portion; A second rigid circuit board is provided with a groove, the second connecting portion is connected to the second rigid circuit board, and at least a portion of the second connecting portion extends into the groove.

2. The circuit board assembly according to claim 1, characterized in that: The circuit board assembly also includes: A photosensitive chip is arranged on the second rigid circuit board, and the photosensitive chip is spaced apart from the groove.

3. The circuit board assembly according to claim 2, characterized in that: The circuit board assembly also includes: A gold connecting wire is used to connect the photosensitive chip and the second rigid circuit board.

4. The circuit board assembly according to claim 1, characterized in that: The second rigid circuit board comprises: ontology; The first protrusion and the second protrusion are arranged on the body, the groove is arranged between the body, the first protrusion and the second protrusion, and the first protrusion and the second protrusion are spaced apart from the flexible circuit board.

5. The circuit board assembly according to claim 4, characterized in that: The circuit board assembly also includes: A first reinforcing portion, connecting the second connecting portion and the second rigid circuit board, wherein the first reinforcing portion is disposed on a side of the second connecting portion close to the first protruding portion; A second reinforcing portion connects the second connecting portion and the second rigid circuit board, the second reinforcing portion is arranged on a side of the second connecting portion close to the second protruding portion, and in a direction in which the second connecting portion is away from the bending portion, a side of the first reinforcing portion away from the second connecting portion is inclined toward the first protruding portion, and a side of the second reinforcing portion away from the second connecting portion is inclined toward the second protruding portion.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The bent portion is bent toward an opening direction of the groove.

7. A camera module, characterized in that: include: A shell, wherein the shell has an opening, and light is incident into the shell through the opening; A lens assembly is disposed in the housing; The circuit board assembly according to any one of claims 1 to 6, wherein the circuit board assembly is connected to the housing, and light incident into the housing passes through the lens assembly and is received by the circuit board assembly.

8. The camera module according to claim 7, characterized in that: In the opening direction of the groove, the distance between the second rigid circuit board and the edge of the shell is D1, and the maximum distance between the second rigid circuit board and the flexible circuit board is D2, D1≥D2, or D1<D2, and D2-D1≤1.2mm.

9. The camera module according to claim 7, characterized in that: The housing comprises: shell; The base is connected to the housing, the circuit board assembly is connected to the base, a guide surface is provided on the base, and at least a portion of the flexible circuit board is bent along the guide surface.

10. The camera module according to claim 9, characterized in that: At least a portion of the flexible circuit board is connected to the guide surface.

11. The camera module according to claim 9, characterized in that: A first bonding portion and a second bonding portion are provided on a side of the base facing away from the lens assembly, at least a portion of the edge of the second rigid circuit board is bonded to the first bonding portion, and the second connecting portion and a side of the second rigid circuit board close to each other are adhered to the second bonding portion.

12. The camera module according to claim 11, characterized in that: The first bonding portion comprises: A first sub-adhesive portion extending along a portion of an edge of the base, wherein the first sub-adhesive portion and the second adhesive portion are spaced apart from each other; The second sub-adhesive portion extends along the edge of the groove.

13. An electronic device, characterized in that: A camera module comprising any one of claims 7 to 12.

Images