Chip diode, capacitor and resistor manufacturing process based on circuit board

Abstract

The invention discloses a chip diode, capacitor and resistor manufacturing process based on a circuit board, which comprises the following steps of: cleaning a substrate of the circuit board, activating the surface of the substrate, removing impurities and oxides on the surface of the substrate by using a plasma cleaning technology, and roughening the surface of the substrate by using a laser micromachining technology; multifunctional printing equipment is used for printing functional materials of diodes, capacitors and resistors on the preprocessed circuit board substrate at a time; the method has the beneficial effects that tedious procedures such as multiple times of coating, baking and complex routing in the traditional process are abandoned; through one-time printing of functional materials and combination of in-situ curing and an integrated 3D printing packaging technology, a plurality of originally dispersed steps are integrated and optimized, the overall manufacturing period is greatly shortened, and the production efficiency is remarkably improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic component manufacturing, and particularly relates to a manufacturing process for patch diodes, capacitors, and resistors based on a circuit board. Background Art

[0002] In the production and manufacturing of electronic devices, patch diodes, capacitors, and resistors are basic and key electronic components, and the quality of their manufacturing processes directly affects the performance and quality of electronic devices.

[0003] A method for manufacturing patch diodes, capacitors, and resistors using a circuit board as a carrier with the patent publication number CN117119708A realizes the combined manufacturing of the circuit board and patch components to a certain extent. Its specific steps include preparing a circuit board substrate, printing and die bonding on the substrate, wire bonding on diode, capacitor, or resistor chips using a wire bonder, then coating the wire bonding areas with liquid epoxy resin to wrap the wires and chips, baking in an oven to cure the epoxy resin, then performing dipping tin treatment on the processed circuit board substrate, and finally cutting the circuit board substrate into individual pieces using a cutting device and conducting testing and packaging. However, there are still many deficiencies in this existing technology;

[0004] The manufacturing process is relatively cumbersome. Many processes not only increase the production cycle but also raise the production cost. For example, multiple coating, baking, and complex post-treatment processes make it difficult to effectively improve production efficiency;

[0005] Throughout the manufacturing process, there is a lack of effective monitoring means, and it is impossible to monitor and control the manufacturing process in real time. As a result, once problems occur, it is difficult to quickly locate and solve them, leading to the production of a large number of defective products and reducing the yield rate. Summary of the Invention

[0006] The purpose of the present invention is to provide a manufacturing process for patch diodes, capacitors, and resistors based on a circuit board, which simplifies the manufacturing process and realizes full monitoring of the manufacturing process.

[0007] To achieve the above purpose, the present invention provides the following technical solution: A manufacturing process for patch diodes, capacitors, and resistors based on a circuit board, comprising the following steps:

[0008] Clean and surface activate the circuit board substrate, use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser micro-machining technology to roughen the substrate surface;

[0009] Use a multi-functional printing device to print the functional materials of diodes, capacitors, and resistors onto the pre-treated circuit board substrate at one time;

[0010] Adopt ultraviolet curing technology to in-situ cure the printed functional materials so that they are formed into the required diode, capacitor and resistor structures;

[0011] Utilize 3D printing encapsulation technology to directly print encapsulation materials on the surface of the formed components, and embed micro sensors for real-time monitoring of component manufacturing process parameters in the encapsulation materials;

[0012] Based on the data collected by the micro sensors, comprehensively monitor the manufacturing process by combining artificial intelligence algorithms, and comprehensively detect the components by using non-contact electronic detection technology;

[0013] Use high-precision laser cutting equipment to cut the circuit board substrate into individual patch diodes, capacitors and resistors.

[0014] As a preferred technical solution of the present invention, the cleaning power of the plasma cleaning technology is 50 - 200W, and the cleaning time is 2 - 6min.

[0015] As a preferred technical solution of the present invention, the laser wavelength of the laser micro-machining technology is 355 - 1064nm, and the pulse frequency is 500 - 2000Hz.

[0016] As a preferred technical solution of the present invention, the multi-functional printing equipment is equipped with a high-precision nozzle, the nozzle temperature is controlled at 20 - 40°C, the printing speed is 30 - 80mm / s, and it is ensured that the printing thickness of the functional material is 10 - 30μm.

[0017] As a preferred technical solution of the present invention, the ultraviolet wavelength of the ultraviolet rapid curing technology is 300 - 400nm, the irradiation intensity is 50 - 200mW / cm 2 , and the irradiation time is 1 - 5min.

[0018] As a preferred technical solution of the present invention, the micro sensor is one or at least two combinations of a temperature sensor, a pressure sensor, and a humidity sensor.

[0019] As a preferred technical solution of the present invention, based on the data collected by the micro sensors, comprehensively monitor the manufacturing process by combining artificial intelligence algorithms, and comprehensively detect the components by using non-contact electronic detection technology. The implementation method is as follows:

[0020] The micro sensors collect data during the manufacturing process in real time and transmit it to the central control system through wireless transmission technology;

[0021] The central control system cleans, denoises, and normalizes the collected data;

[0022] Use machine learning algorithms to extract key features from the processed data;

[0023] Based on historical data, use deep learning algorithms to train prediction models;

[0024] Deploy the trained model to the central control system to monitor the manufacturing process in real time;

[0025] When the model detects anomalies, the system sounds an alarm and automatically adjusts manufacturing parameters;

[0026] Comprehensive inspection of components using optical inspection, infrared thermal imaging, electromagnetic inspection and ultrasonic inspection technologies.

[0027] As a preferred technical solution of the present invention, the laser wavelength of the high-precision laser cutting equipment is 10.6 μm.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The cumbersome processes in traditional processes such as multiple coatings, baking and complex wire bonding have been abandoned. Through one-time printing of functional materials, combined with in-situ curing and integrated 3D printing packaging technology, the originally scattered multiple steps are integrated and optimized, greatly shortening the overall manufacturing cycle and significantly improving production efficiency.

[0030] With the help of micro sensors embedded in the packaging material, key parameters of the manufacturing process can be collected in real time and transmitted to the central control system through wireless transmission technology; the central control system uses machine learning and deep learning algorithms to pre-process the data, extract features, and predict models, thereby achieving comprehensive monitoring of the manufacturing process; once an abnormality is detected, the system can immediately issue an alarm and automatically adjust the manufacturing parameters, effectively avoiding the production of defective products and improving product quality;

[0031] A variety of non-contact electronic detection technologies are used to conduct all-round inspection of components; the characteristic signals of components in different aspects can be captured quickly and accurately, and potential defects can be identified through corresponding image processing and signal processing algorithms, which greatly improves the accuracy and comprehensiveness of inspection and ensures the reliability of product quality;

[0032] The simplified manufacturing process reduces the time and labor costs in the production process. At the same time, full-process monitoring and high-precision inspection reduce the defective rate and reduce material waste and rework costs caused by defective products. In addition, flexible production parameter adjustments can optimize the production process, improve the utilization rate of raw materials, and further reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a manufacturing process flow chart of the present invention. DETAILED DESCRIPTION

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] Embodiment 1

[0036] Please refer to Figure 1 , which is the first embodiment of the present invention. This embodiment provides a manufacturing process based on printed circuit board surface-mounted diodes, capacitors, and resistors, including the following steps:

[0037] Clean and surface-activate the printed circuit board substrate. Use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser micro-machining technology to roughen the substrate surface to enhance the adhesion of subsequent materials; the cleaning power of the plasma cleaning technology is 50W, and the cleaning time is 6min; the laser wavelength of the laser micro-machining technology is 355nm, and the pulse frequency is 500Hz;

[0038] Use a multi-functional printing device to print the functional materials of diodes, capacitors, and resistors onto the pre-treated printed circuit board substrate at one time. By precisely controlling the printing parameters, ensure the thickness and pattern accuracy of the functional materials; the multi-functional printing device is equipped with a high-precision nozzle, control the nozzle temperature at 20°C, and the printing speed is 30mm / s to ensure that the printed thickness of the functional materials is 10μm;

[0039] Adopt ultraviolet curing technology to in-situ cure the printed functional materials to form the required diode, capacitor, and resistor structures; the ultraviolet wavelength of the ultraviolet rapid curing technology is 300nm, the irradiation intensity is 50mW / cm 2 , and the irradiation time is 5min;

[0040] Utilize 3D printing encapsulation technology to directly print encapsulation materials on the surface of the formed components, and embed micro-sensors for real-time monitoring of component manufacturing process parameters in the encapsulation materials to monitor the manufacturing process parameters of the components in real time; the micro-sensors are temperature sensors, pressure sensors, and humidity sensors; the temperature sensor collects temperature data during the component manufacturing process in real time, the pressure sensor monitors the pressure data in the encapsulation and other links, and the humidity sensor obtains environmental humidity data; these sensors transmit the data in the form of electrical signals through wireless transmission.

[0041] Through the data collected by the micro-sensors, comprehensively monitor the manufacturing process in combination with artificial intelligence algorithms, and comprehensively detect the components using non-contact electronic detection technology.

[0042] Use a high-precision laser cutting device to cut the circuit board substrate into individual patch diodes, capacitors, and resistors. The laser wavelength of the high-precision laser cutting device is 10.6 μm, and finally, packaging is carried out.

[0043] Collect data through micro sensors, and combine artificial intelligence algorithms to monitor the entire manufacturing process. Use non-contact electronic detection technology to comprehensively detect components. The implementation method is as follows:

[0044] Embed micro sensors including temperature sensors, pressure sensors, and humidity sensors in the packaging material; these sensors can monitor key parameters during the manufacturing process in real time, such as temperature, pressure, and humidity; the sensors transmit the collected data to the central control system through wireless transmission technologies (such as Bluetooth, Zigbee); the data collection frequency can be adjusted according to the needs of the manufacturing process;

[0045] The central control system first preprocesses the raw data collected by the sensors, including data cleaning, denoising, and normalization, to ensure the accuracy and consistency of the data;

[0046] Use machine learning algorithms (such as principal component analysis PCA, linear discriminant analysis LDA) to extract key features from the preprocessed data, and these features can reflect the key states and changes during the manufacturing process;

[0047] Based on historical data, use deep learning algorithms (such as convolutional neural network CNN, long short-term memory network LSTM) to train a prediction model, and the model can predict potential problems during the manufacturing process according to real-time data, such as material defects and process deviations;

[0048] Deploy the trained model to the central control system to monitor the manufacturing process in real time; when the model detects an anomaly, the system immediately issues an alarm and automatically adjusts the manufacturing parameters to correct the problem;

[0049] Use a high-resolution camera and optical sensors to scan the surface of the components to detect surface defects (such as cracks, bubbles); the optical detection system can quickly capture high-resolution images and identify defects through image processing algorithms (such as edge detection, morphological processing);

[0050] Use a thermal imager to perform non-contact temperature detection on the components to identify temperature anomaly areas; infrared thermal imaging technology can quickly capture the temperature distribution of the components and identify potential hot spots or cold spots through thermal image analysis algorithms;

[0051] Use electromagnetic sensors to detect the electrical performance of the components to identify electrical defects (such as short circuits, open circuits); the electromagnetic detection system can quickly capture the electromagnetic signals of the components and identify anomalies through signal processing algorithms;

[0052] Use an ultrasonic sensor to detect the internal structure of components and identify internal defects (such as voids and delaminations); the ultrasonic detection system can quickly capture the ultrasonic signals of components and identify internal defects through signal processing algorithms;

[0053] Integrate micro sensors, artificial intelligence algorithms, and non-contact electronic detection technologies into a unified manufacturing monitoring system; the system can collect, process, and analyze data in real time, and automatically adjust manufacturing parameters according to the analysis results; when the system detects an abnormality in the manufacturing process, it will automatically adjust manufacturing parameters (such as temperature, pressure, humidity, etc.) to correct the problem; at the same time, the system will record the abnormal data and adjustment measures for subsequent analysis and optimization.

[0054] Embodiment 2

[0055] Please refer to Figure 1 , which is the second embodiment of the present invention. This embodiment is based on the previous embodiment, and the differences are as follows:

[0056] Clean and surface activate the circuit board substrate. Use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser microfabrication technology to roughen the substrate surface to enhance the adhesion of subsequent materials; the cleaning power of the plasma cleaning technology is 125W, and the cleaning time is 4min; the laser wavelength of the laser microfabrication technology is 700nm, and the pulse frequency is 1250Hz;

[0057] Use a multi-functional printing device to print the functional materials of diodes, capacitors, and resistors onto the pre-treated circuit board substrate at one time. By precisely controlling the printing parameters, ensure the thickness and pattern accuracy of the functional materials; the multi-functional printing device is equipped with a high-precision nozzle, control the nozzle temperature at 30°C, and the printing speed is 55mm / s to ensure that the printing thickness of the functional materials is 20μm;

[0058] Adopt ultraviolet curing technology to in-situ cure the printed functional materials to form the required diode, capacitor, and resistor structures; the ultraviolet wavelength of the ultraviolet rapid curing technology is 350nm, the irradiation intensity is 125mW / cm 2 , and the irradiation time is 3min.

[0059] Embodiment 3

[0060] Please refer to Figure 1 , which is the third embodiment of the present invention. This embodiment is based on the previous embodiment, and the differences are as follows:

[0061] Clean and surface activate the circuit board substrate. Use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser micro-machining technology to roughen the substrate surface to enhance the adhesion of subsequent materials. The cleaning power of the plasma cleaning technology is 200W, and the cleaning time is 2 minutes. The laser wavelength of the laser micro-machining technology is 1064nm, and the pulse frequency is 2000Hz.

[0062] Use a multi-functional printing device to print the functional materials of diodes, capacitors, and resistors onto the pre-treated circuit board substrate at one time. By precisely controlling the printing parameters, ensure the thickness and pattern accuracy of the functional materials. The multi-functional printing device is equipped with a high-precision nozzle, control the nozzle temperature at 40°C, and the printing speed is 80mm / s, ensuring that the printed thickness of the functional material is 30μm.

[0063] Adopt ultraviolet curing technology to in-situ cure the printed functional materials to form the required diode, capacitor, and resistor structures. The ultraviolet wavelength of the ultraviolet rapid curing technology is 400nm, and the irradiation intensity is 200mW / cm 2 , and the irradiation time is 1 minute.

[0064] Manufacturing efficiency comparison: Verify the improvement of manufacturing efficiency by comparing the number of components produced per unit time by the traditional process and the simplified process of the present invention.

[0065]

[0066]

[0067] Yield comparison: Verify the improvement of the yield by comparing the yields of the traditional process and the simplified process of the present invention under the same production conditions.

[0068] Process type Yield rate (%) Traditional process 85 The present invention 98

[0069] Detection accuracy comparison: Verify the improvement of detection accuracy by comparing the performance of the traditional detection method and the non-contact electronic detection technology of the present invention in defect detection rate.

[0070] Process type Defect detection rate (%) Traditional process 90 The present invention 98

[0071] Cost control comparison: Verify the optimization of cost control by comparing the production costs per unit component of the traditional process and the simplified process of the present invention.

[0072] Process type Production cost per unit component (yuan) Traditional process 5 The present invention 3

[0073] Real-time monitoring effect verification: Verify the effect of real-time monitoring by comparing the response times of the traditional process and the simplified process of the present invention in abnormal detection and parameter adjustment.

[0074] Process type Abnormal detection response time (seconds) Parameter adjustment response time (seconds) Traditional process 10 40 The present invention 5 10

[0075] Although embodiments of the present invention have been shown and described, refer to the above detailed description. For those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A process for manufacturing circuit board chip diodes, capacitors and resistors, characterized in that: The steps include: Clean and activate the circuit board substrate, use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser micromachining technology to roughen the substrate surface; Use multifunctional printing equipment to print the functional materials of diodes, capacitors and resistors onto the pre-treated circuit board substrate at one time; Using ultraviolet curing technology, the printed functional materials are cured in situ to form the required diode, capacitor and resistor structures; Using 3D printing packaging technology, packaging materials are directly printed on the surface of the formed component, and micro sensors for real-time monitoring of component manufacturing process parameters are embedded in the packaging material; The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and use non-contact electronic detection technology to fully detect components; Use high-precision laser cutting equipment to cut the circuit board substrate into individual SMD diodes, capacitors and resistors.

2. A process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The cleaning power of plasma cleaning technology is 50-200W and the cleaning time is 2-6min.

3. The process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The laser wavelength of laser micromachining technology is 355-1064nm and the pulse frequency is 500-2000Hz.

4. The process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The multifunctional printing equipment is equipped with a high-precision nozzle, which controls the nozzle temperature at 20-40°C and the printing speed at 30-80mm / s, ensuring that the printing thickness of the functional material is 10-30μm.

5. The process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The ultraviolet wavelength of ultraviolet rapid curing technology is 300-400nm, and the irradiation intensity is 50-200mW / cm 2 , the irradiation time is 1-5min.

6. A process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The micro sensor is one of a temperature sensor, a pressure sensor, and a humidity sensor, or a combination of at least two of them.

7. A process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and non-contact electronic detection technology is used to fully detect components. The implementation method is as follows: Micro sensors collect data from the manufacturing process in real time and transmit it to the central control system via wireless transmission technology; The central control system cleans, denoises, and normalizes the collected data; Use machine learning algorithms to extract key features from processed data; Based on historical data, use deep learning algorithms to train prediction models; Deploy the trained model to the central control system to monitor the manufacturing process in real time; When the model detects anomalies, the system sounds an alarm and automatically adjusts manufacturing parameters; Comprehensive inspection of components using optical inspection, infrared thermal imaging, electromagnetic inspection and ultrasonic inspection technologies.

8. The process for manufacturing circuit board-based chip diodes, capacitors and resistors according to claim 1, characterized in that: The laser wavelength of high-precision laser cutting equipment is 10.6μm.

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