Terminal device

Abstract

The terminal equipment comprises a shell, a circuit board, a heating device, an air duct, a heat dissipation piece and a fan device. The shell is provided with an air inlet hole and an air outlet hole. The circuit board is arranged in the shell, the heating device is arranged on the circuit board, the air duct is arranged between the shell and the circuit board, the air duct comprises an air inlet and an air outlet, the air inlet is communicated with the air inlet hole, and the air outlet is communicated with the air outlet hole. The heat dissipation piece is arranged in the air channel and close to the air outlet and used for receiving heat conducted by the heating device. The fan device is arranged at the position, close to the air inlet, in the air channel and used for guiding air flow to the heat dissipation piece so that heat of the heat dissipation piece can be dissipated to the outside of the shell through the air outlet and the air outlet holes in sequence through the air flow. According to the terminal equipment, the heat dissipation system comprising the heat dissipation piece, the fan device, the air duct and the like is arranged in the terminal equipment, active heat dissipation can be achieved, the purpose of efficiently cooling a heating device is achieved, and the terminal equipment can obtain good performance when running in a high-load scene.

Description

Technical Field

[0001] This application relates to the technical field of electronic products, and particularly to a terminal device. Background Art

[0002] With the rapid development of smartphone chip technology and the increasingly high performance requirements of third-party applications, mobile phones are bearing an increasingly high load and facing an increasingly serious heat problem. The current technical solutions mainly rely on passive heat dissipation, that is, mainly through the heat conduction between mobile phone components to conduct heat to the surface of the mobile phone, and then through the way of heat convection to exchange heat with the air naturally, and the heat dissipation efficiency is relatively low. Summary of the Invention

[0003] In view of this, this application provides a terminal device to improve the heat dissipation efficiency of the main heat-generating components in the terminal device through active heat dissipation.

[0004] An embodiment of this application provides a terminal device, which includes: a housing, a circuit board, a heat-generating component, an air duct, a heat sink, and a fan device. Among them, an air inlet hole and an air outlet hole are provided on the housing. The circuit board is arranged inside the housing. The heat-generating component is arranged on the circuit board. The air duct is arranged between the housing and the circuit board. The air duct includes an air inlet and an air outlet. The air inlet is communicated with the air inlet hole, and the air outlet is communicated with the air outlet hole. The heat sink is arranged in the air duct near the air outlet for receiving the heat conducted by the heat-generating component. The fan device is arranged in the air duct near the air inlet for guiding air flow to the heat sink, so that the heat of the heat sink can be dissipated to the outside of the housing through the air outlet and the air outlet hole in sequence through the air flow.

[0005] The terminal device provided by the embodiment of this application can achieve active heat dissipation by arranging a heat dissipation system including a heat sink, a fan device, an air duct, etc. inside the terminal device, so as to achieve the purpose of efficiently cooling the heat-generating component, enabling the terminal device to obtain good performance when running in a high-load scenario and improving the user experience.

[0006] In a possible design, along the thickness direction of the terminal device, at least a part of the projection of the heat-generating component coincides with the projection of the heat sink. Among them, by making at least a part of the projection of the heat-generating component along the thickness direction of the terminal device coincide with the projection of the heat sink, the heat dissipation path between the heat-generating component and the heat sink can be shortened, so that most of the heat of the heat-generating component can be quickly conducted to the heat sink and heat exchange can be carried out through the heat sink, thereby achieving fast and efficient heat dissipation and cooling.

[0007] In a possible design, the terminal device further includes a first heat-conducting medium made of a flexible material. The first heat-conducting medium is disposed between the circuit board and the air duct. The heat of the heat-generating device is sequentially conducted to the heat sink through the first heat-conducting medium and the side wall of the air duct. Among them, since both the circuit board and the air duct are made of rigid materials, it is difficult to ensure a tight connection between the circuit board and the air duct when they are directly connected, and gaps are likely to be generated between the circuit board and the air duct, resulting in the heat not being effectively conducted to the heat sink in the air duct. For this reason, in this embodiment, by using a first heat-conducting medium made of a flexible material, the first heat-conducting medium can be fully filled between the circuit board and the air duct through its own flexible deformation, ensuring that there are no gaps in the heat transfer path between the circuit board and the air duct, thereby improving the heat conduction efficiency and further improving the heat dissipation efficiency.

[0008] In a possible design, the material of the first heat-conducting medium is thermal gel or thermal grease. These materials have good heat-conducting capabilities and certain flexibility at the same time, and can be fully filled between the circuit board and the air duct to eliminate the gaps in the heat conduction path and improve the heat dissipation efficiency.

[0009] In a possible design, the terminal device further includes an electromagnetic shielding member. The electromagnetic shielding member is disposed between the first heat-conducting medium and the circuit board. The electromagnetic shielding member is provided with a receiving groove for receiving the devices on the circuit board. At least part of the heat of the heat-generating device is sequentially conducted to the heat sink through the electromagnetic shielding member, the first heat-conducting medium and the side wall of the air duct. Among them, the electromagnetic shielding member can be a metal member, such as metals like copper and aluminum, and has the function of electromagnetic shielding. The devices that generate electromagnetic interference or are affected by electromagnetic interference can be covered in the receiving groove to isolate electromagnetic interference through the receiving groove. In addition, since the electromagnetic shielding member is a metal member, that is, both the electromagnetic shielding member and the air duct are rigid members, if the electromagnetic shielding member is directly connected to the air duct, gaps are likely to be generated between the electromagnetic shielding member and the air duct, and heat cannot be effectively conducted to the heat sink at the gaps, reducing the heat dissipation efficiency. For this reason, in this embodiment, the first heat-conducting medium can be filled between the electromagnetic shielding member and the air duct. The first heat-conducting medium can be fully filled between the electromagnetic shielding member and the air duct by using its own flexibility to eliminate the gaps, and the electromagnetic shielding member made of a metal material also has good heat conductivity, enabling the heat generated by the heat-generating device to be efficiently conducted to the heat sink through the electromagnetic shielding member, the first heat-conducting medium and the side wall of the air duct. Among them, the side wall of the air duct is the side wall for connecting to the heat sink.

[0010] In a possible design, the electromagnetic shielding member includes a body and a cover plate. The body is disposed on the circuit board. The receiving groove is a through groove that penetrates the body in the thickness direction of the terminal device. The cover plate is fastened to the side of the body facing away from the circuit board to close the through groove. The cover plate is connected to the air duct through the first heat-conducting medium. After the body is mounted on the circuit board, a second heat-conducting medium such as heat-conducting gel or heat-conducting silicone grease can also be injected into the through groove to achieve heat conduction of the components in the through groove. In this embodiment, since the cover plate can be used to fasten to the body to close the through groove, this is conducive to injecting a heat-conducting gel with a higher heat-conductivity coefficient into the through groove to improve the heat-conducting ability, thereby improving the heat dissipation efficiency of the heat-generating components.

[0011] In a possible design, the material of the electromagnetic shielding member is a heat-conducting metal. Thus, on the one hand, the function of electromagnetic shielding can be achieved, and on the other hand, the heat exchange efficiency can be improved.

[0012] In a possible design, the terminal device further includes a second heat-conducting medium made of a flexible material, and the second heat-conducting medium is filled between the component in the receiving groove and the inner wall of the receiving groove. The second heat-conducting medium can make full use of its flexibility to be fully filled between the heat-generating component and the inner wall of the receiving groove to eliminate gaps, so that the heat generated by the heat-generating component in the receiving groove can be conducted to the heat sink through the second heat-conducting medium, the electromagnetic shielding member, the first heat-conducting medium, and the wall plate of the air duct in sequence, improving the heat dissipation efficiency.

[0013] In a possible design, the material of the second heat-conducting medium is heat-conducting gel or heat-conducting silicone grease. These materials have good heat-conducting ability and certain flexibility, and can be fully filled between the circuit board and the air duct to eliminate gaps in the heat conduction path and improve the heat dissipation efficiency.

[0014] In a possible design, along the thickness direction of the terminal device, at least part of the projections of the first heat-conducting medium and the electromagnetic shielding member coincide with the projections of the heat sink and the fan device. That is to say, the projections of the first heat-conducting medium and the electromagnetic shielding member in the thickness direction of the terminal device can simultaneously cover the heat sink and the fan device, so that most of the heat generated by the heat-generating component can be conducted to the relatively close heat sink through the electromagnetic shielding member and the first heat-conducting medium in sequence. At the same time, at least part of the heat generated by the heat-generating component can also be conducted to the relatively far fan device through the electromagnetic shielding member and the first heat-conducting medium, so that the heat can be conducted to the structures such as the blades of the fan device and exchange heat with the air through the fan device, thereby further expanding the contact heat dissipation area with the air through the fan device and improving the heat dissipation efficiency.

[0015] In a possible design, the air duct includes an inlet air duct and an outlet air duct. The inlet air duct is in communication with the outlet air duct. The fan device is disposed in the inlet air duct, and the heat dissipation member is disposed in the outlet air duct. Among them, the fan device in the inlet air duct is relatively close to the air inlet of the air duct, which can quickly introduce the air outside the terminal device into the air duct through the air inlet, and can be blown towards the heat dissipation member by the fan device to perform heat exchange with the heat dissipation member. Since the heat dissipation member is disposed in the outlet air duct and the heat dissipation member is relatively close to the air outlet of the air duct, the high-temperature air that has undergone heat exchange with the heat dissipation member can be quickly output from the air outlet to the outside of the terminal device, thereby achieving efficient heat dissipation.

[0016] In a possible design, a heat spreading portion is provided on the air duct. The heat spreading portion is disposed on at least a part of the air duct close to the air outlet. Among them, the heat spreading portion has good heat conduction ability and a large heat dissipation area. When the air with a lower temperature input by the fan device exchanges heat with the heat dissipation member, a part of the high-temperature air flow that has undergone heat exchange can be output from the air outlet and the air outlet holes to the outside of the terminal device, and another part of the hot air flow contacts and exchanges heat with the heat spreading portion. The heat spreading portion can diffuse the heat into the nearby air and can further exchange heat with the air outside the terminal device through the housing, thereby realizing the dissipation of the heat in the housing to the outside of the terminal device.

[0017] In a possible design, the heat spreading portion is a graphite layer. The graphite layer has good heat conduction ability, which can improve the efficiency of heat exchange with the hot air flow. At the same time, the graphite layer can be coated on the outer wall of the air duct and a part of the inner wall close to the air outlet, which is convenient for processing on the air duct, can be flexibly set according to the actual heat dissipation position, and at the same time, the graphite layer can have a smaller thickness, which is beneficial to saving space.

[0018] In a possible design, the air duct is connected to the housing by adhesive bonding or by a connecting member, so as to facilitate the connection between the air duct and the housing.

[0019] In a possible design, the air duct and the housing are integrally formed, that is, the structure of the air duct is integrally formed during the processing of the housing, so as to improve the structural strength and reliability of the air duct and the housing, and at the same time, it is also convenient for production and manufacturing.

[0020] In a possible design, the heating device is disposed on the side of the circuit board facing away from the air duct.

[0021] In a possible design, the heat dissipation member includes a plurality of metal fins. Among them, the plurality of fins can be arranged at intervals, thereby greatly expanding the area in contact with the air, realizing efficient heat exchange, and achieving the purpose of quickly and effectively dissipating heat.

[0022] In a possible design, the housing includes a battery cover and a camera decorative member. The camera decorative member is disposed on the battery cover and protrudes from the outer wall of the battery cover. The interior of the camera decorative member has a receiving space, and at least a portion of the air duct is disposed in the receiving space. Among them, the camera decorative member protrudes from the outer wall of the battery cover and has a receiving space inside, which can be used to accommodate the camera module. At least a portion of the air duct can also be disposed in the receiving space within the camera decorative member. Among them, the camera decorative member protrudes from the surface of the battery cover, that is, the setting of the camera decorative member limits the thickness of the entire terminal device. At least a portion of the air duct can be disposed between the battery cover and the circuit board, and at least a portion of the air duct can also be received in the receiving space within the camera decorative member, so that the partial thickness of the air duct can be absorbed by the camera decorative member, enabling the air duct not to occupy additional Z-direction space of the entire machine, which is beneficial to the thin design of the terminal device.

[0023] In a possible design, along a first direction, the camera decorative member has a side wall, and the air inlet hole and the air outlet hole are disposed on the side wall. The first direction is perpendicular to the thickness direction of the terminal device. Among them, the air inlet hole and the air outlet hole can be opened at appropriate positions on the side wall, and the air inlet and the air outlet can be provided at partial positions of the air duct extending into the camera decorative member, so as to facilitate the air inlet and the air outlet to be close to or docked with the air inlet hole and the air outlet hole on the camera decorative member respectively, thereby ensuring the efficiency of air inlet and air outlet, and thus being beneficial to improving the heat dissipation efficiency.

[0024] In a possible design, the heating device is a system on a chip, a power management unit or a UNIX file system.

[0025] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 is a schematic structural diagram of a terminal device provided by an embodiment of the present application;

[0028] Figure 2 is a partial cross-sectional view of a terminal device provided by the first embodiment of the present application from a side view perspective;

[0029] Figure 3Partial cross-sectional view of the terminal device provided by the second embodiment of the present application from a side view perspective;

[0030] Figure 4 Partial cross-sectional view of the terminal device provided by the embodiment of the present application from a top view perspective;

[0031] Figure 5 Partial cross-sectional view of the terminal device provided by the third embodiment of the present application from a side view perspective;

[0032] Figure 6 Partial cross-sectional view of the terminal device provided by the fourth embodiment of the present application from a side view perspective;

[0033] Figure 7 Partial cross-sectional view of the terminal device provided by the fifth embodiment of the present application from a side view perspective;

[0034] Figure 8 Partial cross-sectional view of the terminal device provided by the sixth embodiment of the present application from a side view perspective.

[0035] Reference numerals:

[0036] 1 - Housing;

[0037] 11 - Battery cover;

[0038] 12 - Camera decorative part;

[0039] 13 - Air inlet hole;

[0040] 14 - Air outlet hole;

[0041] 2 - Circuit board;

[0042] 3 - Air duct;

[0043] 31 - Inlet air duct;

[0044] 311 - Air inlet;

[0045] 32 - Outlet air duct;

[0046] 321 - Air outlet;

[0047] 33 - Heat spreader;

[0048] 4 - Heat sink;

[0049] 5 - Fan device;

[0050] 6 - Heat generating component;

[0051] 61 - Double Data Rate Synchronous Dynamic Random Access Memory;

[0052] 7 - First thermal medium;

[0053] 8 - Second heat-conducting medium;

[0054] 9 - Electromagnetic shielding member;

[0055] 91 - Body;

[0056] 92 - Cover plate;

[0057] Z - Thickness direction;

[0058] X - First direction. Detailed implementation manners

[0059] For a better understanding of the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0060] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts belong to the scope of protection of the present application.

[0061] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0062] It should be understood that the term " / and" used herein is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A / and B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0063] In the description of the present application, unless otherwise clearly specified and limited, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated, the term "plural" means two or more; the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0064] With the rapid development of smartphone chip technology and the increasingly high performance requirements of third-party applications, mobile phones are bearing an ever-increasing load and facing an increasingly serious heat problem. The current technical solutions mainly rely on passive heat dissipation, that is, mainly through the heat conduction between mobile phone components to conduct heat to the surface of the mobile phone, and then through the way of heat convection to exchange heat with the air naturally. For example, the heat dissipation path of the System-On-a-Chip (SOC) is mainly single-sided heat dissipation, that is, a vapor chamber (VC) is used for heat dissipation on the screen side, with a single heat dissipation path and low heat dissipation efficiency. In addition, this heat dissipation method cannot achieve efficient heat dissipation in high-load operation scenarios such as gaming, shooting, and video processing, which will cause the device to overheat seriously and affect the operation performance.

[0065] The embodiments of the present application provide a terminal device, which is also called a terminal, a user equipment (UE), a mobile station, or a mobile terminal, etc. The terminal device can be widely applied to various scenarios, such as D2D communication, V2X communication, machine-type communication (MTC), IoT, virtual reality, augmented reality, industrial control, autonomous driving, remote medical treatment, smart grid, smart furniture, smart office, smart wearables, smart transportation, or smart city, etc. For example, the terminal device can be: a mobile phone, a computer, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a robotic arm, a camera, a robot, or a smart home device (such as a TV, an air conditioner, a floor sweeper, a speaker, a set-top box), a relay, a customer premise equipment (CPE), etc.

[0066] As described above, if various terminal devices are located on a vehicle (e.g., placed / installed inside the vehicle), they can all be considered in-vehicle terminal devices. The in-vehicle terminal device can be built into the vehicle's in-vehicle module, in-vehicle module group, in-vehicle component, in-vehicle chip, or in-vehicle unit as one or more components or units. The vehicle can implement the method of this application through the built-in in-vehicle module, in-vehicle module group, in-vehicle component, in-vehicle chip, or in-vehicle unit. The in-vehicle terminal device can be a vehicle equipment, in-vehicle module, vehicle, on-board unit (OBU), roadside unit (RSU), in-vehicle system (or in-vehicle sending unit) (telematics box, T-box), chip, or system on chip (SOC), etc. The above chip or SOC can be installed in a vehicle, OBU, RSU, or T-box.

[0067] In the embodiments of this application, the device for implementing the functions of the terminal device can be the terminal device itself or a device capable of supporting the terminal device to implement such functions, such as a chip system or a combined device or component that can implement the functions of the terminal device. This device can be installed in the terminal device. The embodiments of this application do not limit the specific technologies and specific device forms adopted by the terminal device.

[0068] The terminal device can also be referred to as a terminal, terminal device, user equipment (UE), mobile station, mobile terminal, etc. The terminal can be widely applied to various scenarios, such as device-to-device (D2D), vehicle-to-everything (V2X) communication, machine-type communication (MTC), Internet of Things (IoT), virtual reality, augmented reality, industrial control, autonomous driving, remote medical treatment, smart grid, smart furniture, smart office, smart wearables, smart transportation, smart city, etc. The terminal can be a mobile phone, tablet computer, computer with wireless transceiver function, wearable device, vehicle, drone, helicopter, airplane, ship, robot, robotic arm, smart home device, etc. The embodiments of this application do not limit the specific technologies and specific device forms adopted by the terminal. Figure 1 It is a schematic structural diagram of the terminal device provided by the embodiments of this application. Figure 1 Exemplarily, the terminal device is shown as a mobile phone, and the description is made with the terminal device being a mobile phone.

[0069] Figure 2 It is a partial cross-sectional view of the terminal device provided by the first embodiment of this application in a side view perspective. Refer to Figure 2, the terminal device provided by the embodiment of the present application includes a housing 1, a circuit board 2, a heating device 6, an air duct 3, a heat dissipation component 4, and a fan device 5. Among them, the housing 1 can be the external structural member of the electronic device. Exemplarily, when the terminal device is a mobile phone, the housing 1 can be the back cover or the battery cover 11 of the mobile phone, or a combined structure of the battery cover 11 and the camera decoration piece 12. There is a relatively large space inside the housing 1, which can be used to arrange components such as the circuit board 2, the battery, the speaker, and the camera.

[0070] The circuit board 2 can be a printed circuit board 2 (PCB). Various components can be integrated on the circuit board 2, and these components can implement various functions of the terminal device. Some of the components are heating devices 6, which generate a large amount of heat during operation. Exemplarily, the heating device 6 can be a system on a chip (SOC), a power management unit (PMU), or a UNIX file system (UFS), etc. Of course, it can also be other components with high heat generation. For the convenience of description, the present application takes the heating device 6 as an SOC as an example for illustration.

[0071] The air duct 3 is a channel structure for guiding air flow. Exemplarily, the air duct 3 can be separately processed and manufactured, and installed in the housing 1 by means of adhesive connection or assembly connection with connectors such as screws, etc., so as to facilitate the separate disassembly, replacement, and maintenance of the air duct 3 and the components inside the air duct 3. Exemplarily, the air duct 3 can also be integrally formed with the housing 1, that is, the structure of the air duct 3 is integrally formed during the processing of the housing 1, so as to improve the structural strength and reliability of the air duct 3 and the housing 1, and at the same time facilitate production and manufacturing.

[0072] Figure 3 is a partial cross-sectional view of the terminal device provided by the second embodiment of the present application in the side view perspective, referring to Figure 3, the air duct 3 provided in this embodiment is arranged between the housing 1 and the circuit board 2. The circuit board 2 and the heat-generating components 6 on the circuit board 2 can conduct heat to the air duct 3. The air duct 3 includes an air inlet 311 and an air outlet 321. An air inlet hole 13 and an air outlet hole 14 can be provided on the housing 1. The air inlet 311 communicates with the air inlet hole 13 of the housing 1, and the air outlet 321 communicates with the air outlet hole 14 of the housing 1. The relatively low-temperature air flow outside the housing 1 can sequentially enter the air duct 3 from the air inlet hole 13 and the air inlet 311, and can generate heat exchange with the relatively high-temperature air flow in the air duct 3, so that the hot air flow can be sequentially dissipated to the outside of the housing 1 through the air outlet 321 and the air outlet hole 14. In one embodiment, the air duct 3 can include an inlet air duct 31 and an outlet air duct 32. The inlet air duct 31 communicates with the outlet air duct 32. The fan device 5 can be arranged in the inlet air duct 31, and the heat dissipation component 4 can be arranged in the outlet air duct 32. Among them, the fan device 5 in the inlet air duct 31 is relatively close to the air inlet of the air duct 3, which can quickly introduce the air outside the terminal device into the air duct 3 through the air inlet 311, and can be blown towards the heat dissipation component 4 by the fan device 5 to perform heat exchange with the heat dissipation component 4. Since the heat dissipation component 4 is arranged in the outlet air duct 32, the heat dissipation component 4 is relatively close to the air outlet 321 of the air duct 3, so that the high-temperature air that has undergone heat exchange with the heat dissipation component 4 can be quickly output from the air outlet 321 to the outside of the terminal device, thereby achieving efficient heat dissipation. In one embodiment, the air duct 3 can be an integrally formed structure, that is, in the process of processing and manufacturing the air duct 3, the inlet air duct 31 and the outlet air duct 32 can be directly formed, which can ensure the reliability of the structure of the air duct 3 and is also convenient for the assembly of the air duct 3 in the terminal device.

[0073] Among them, Figure 4 is a partial cross-sectional view provided by an embodiment of the present application from a top-down perspective. Refer to Figure 4 , the heat dissipation component 4 has good heat conduction ability and can provide a relatively large area for contacting with air to achieve rapid and effective heat exchange. The heat dissipation component 4 can be fins made of a metal material, and there can be multiple such fins. The multiple fins can be arranged at intervals, thus greatly expanding the area in contact with air and enabling efficient heat exchange to achieve the purpose of rapid and effective heat dissipation. In this embodiment, the heat dissipation component 4 is arranged at a position in the air duct 3 close to the air outlet 321. The heat generated by the heat-generating component 6 can be conducted to the heat dissipation component 4 and perform heat exchange with the relatively low-temperature air flow in the air duct 3 through the heat dissipation component 4. Since the heat dissipation component 4 is close to the air outlet 321, the heat can be quickly dissipated to the outside of the housing 1.

[0074] The fan device 5 can be a centrifugal fan. During operation, the centrifugal fan can generate a negative pressure around it. Since the centrifugal fan is close to the air inlet, it can quickly guide the relatively low-temperature air outside the housing 1 into the air duct 3 and blow it onto the heat sink 4, so that the relatively low-temperature air flow can exchange heat with the relatively high-temperature heat sink 4, and can further blow the relatively high-temperature air flow after heat exchange out of the housing 1 through the air outlet 321 and the air outlet holes 14, thereby achieving the purpose of efficiently dissipating heat from the heat-generating device 6 and cooling it down.

[0075] Therefore, the terminal device provided by the embodiment of the present application can achieve active heat dissipation by setting a heat dissipation system including a heat sink 4, a fan device 5, an air duct 3, etc. inside the terminal device, so as to achieve the purpose of efficiently cooling the heat-generating device 6, enabling the terminal device to obtain good performance when operating in a high-load scenario and improving the user experience.

[0076] In one embodiment, referring to Figure 3 , a heat equalizing part 33 can be provided on the air duct 3, and the heat equalizing part 33 is provided on at least part of the air duct 3 close to the air outlet 321. Among them, the heat equalizing part 33 has good heat conduction ability and a large heat dissipation area. When the relatively low-temperature air input by the fan device 5 exchanges heat with the heat sink 4, a part of the high-temperature air flow after heat exchange can be output to the outside of the terminal device through the air outlet 321 and the air outlet holes 14, and another part of the hot air flow contacts and exchanges heat with the heat equalizing part 33. The heat equalizing part 33 can diffuse the heat into the nearby air and can further exchange heat with the air outside the terminal device through the housing 1, thereby realizing the dissipation of the heat in the housing 1 to the outside of the terminal device. That is to say, for the high-temperature air formed by the heat exchange between the low-temperature air and the heat sink 4 after the heat generated by the heat-generating device 6 exchanges heat with the heat sink 4, on the one hand, it can be diffused to the outside of the terminal device through the air outlet 321 of the air duct 3 and the air outlet holes 14 of the housing 1, and on the other hand, it can exchange heat with the heat equalizing part 33 and be diffused to the outside of the terminal device through the heat equalizing part 33 and the nearby housing 1, thereby improving the heat dissipation efficiency.

[0077] In one embodiment, the heat equalizing part 33 can be a graphite layer. The graphite layer has good heat conduction ability and can improve the efficiency of heat exchange with the hot air flow. At the same time, the graphite layer can be coated on the outer wall of the air duct 3 and part of the inner wall close to the air outlet 321, which is convenient for processing on the air duct 3, can be flexibly set according to the actual heat dissipation position, and at the same time, the graphite layer can have a smaller thickness, which is beneficial to saving space.

[0078] In one embodiment, Figure 5 is a partial cross-sectional view of the terminal device provided by the third embodiment of the present application from a side view perspective. Referring to Figure 5, the heating device 6 can be arranged on the side of the circuit board 2 away from the air duct 3. The heat generated by the heating device 6 can be conducted to the heat sink 4 through the circuit board 2 and the air duct 3 in sequence, and active heat dissipation can be achieved through the fan device 5. Among them, the heating device 6 and the air duct 3 are located on both sides of the circuit board 2 respectively, which can enable the air duct 3 to have a larger layout space on the circuit board 2. At the same time, through the above-mentioned active heat dissipation method, it can ensure effective heat dissipation of the heating device 6 located on the other side of the circuit board 2, without the need to reduce the thermal resistance by opening holes or thinning at local positions of the circuit board 2. Therefore, active and efficient heat dissipation can be achieved without damaging the circuit board 2. Of course, in some other embodiments, Figure 6 is a partial cross-sectional view of the terminal device provided in the fourth embodiment of the present application from a side view perspective. Refer to Figure 6 , the heating device 6 can also be arranged on the side of the circuit board 2 facing the air duct 3. The heat generated by the heating device 6 does not need to pass through the circuit board 2, but can be conducted to the heat sink 4 through the wall plate of the air duct 3. In some other embodiments, refer to Figure 2 , heating devices 6 can also be arranged on both sides of the circuit board 2, and this embodiment does not limit this.

[0079] In one embodiment, for some terminal devices such as mobile phones and tablet computers, the housing 1 can include a battery cover 11 and a camera decorative piece 12. The battery cover 11 is an exterior part on the back of the terminal device and can be directly contacted by the user. The camera decorative piece 12 can cover the outside of the camera module. As an exterior part of the camera module, it can play a role in protecting the camera module. The camera decorative piece 12 can be connected to the battery cover 11 by means of gluing or screw connection. The camera decorative piece 12 protrudes from the outer wall of the battery cover 11 and has an accommodation space inside, which can be used to accommodate the camera module. At least part of the air duct 3 can also be arranged in the accommodation space inside the camera decorative piece 12. Among them, the camera decorative piece 12 protrudes from the surface of the battery cover 11. At least part of the air duct 3 can be arranged between the battery cover 11 and the circuit board 2, and at least part of the air duct 3 can also be accommodated in the accommodation space inside the camera decorative piece 12, so that the air duct 3 does not need to occupy additional Z-direction space of the whole machine, which is beneficial to the thin design of the terminal device. Among them, the Z direction is the thickness direction of the terminal device.

[0080] In one embodiment, along the first direction X, the camera decorative member 12 has a side wall, on which an air inlet hole 13 and an air outlet hole 14 are provided. The first direction X is perpendicular to the thickness direction Z of the terminal device. The camera decorative member 12 has a side wall, which protrudes from the outer wall of the battery cover 11 and forms an accommodation space inside it. The air inlet hole 13 and the air outlet hole 14 can be opened at appropriate positions on the side wall. The part of the air duct 3 extending into the camera decorative member 12 can be provided with an air inlet 311 and an air outlet 321, so as to facilitate the air inlet 311 and the air outlet 321 to be close to or docked with the air inlet hole 13 and the air outlet hole 14 on the camera decorative member 12 respectively, thereby ensuring the efficiency of air inlet and outlet, and thus being beneficial to improving the heat dissipation efficiency.

[0081] In one embodiment, referring to Figure 3 , along the thickness direction Z of the terminal device, at least part of the projection of the heat generating device 6 coincides with the projection of the heat dissipation member 4. Among them, the heat dissipation member 4 is the main heat exchange component. By making at least part of the projection of the heat generating device 6 along the thickness direction Z of the terminal device coincide with the projection of the heat dissipation member 4, the heat dissipation path between the heat generating device 6 and the heat dissipation member 4 can be shortened, so that most of the heat of the heat generating device 6 can be quickly conducted to the heat dissipation member 4 and heat exchange can be carried out through the heat dissipation member 4, thereby realizing fast and efficient heat dissipation and temperature reduction.

[0082] In one embodiment, referring to Figure 3 , the terminal device further includes a first heat conducting medium 7 made of a flexible material. The first heat conducting medium 7 is arranged between the circuit board 2 and the air duct 3. The heat of the heat generating device 6 is conducted to the heat dissipation member 4 through the first heat conducting medium 7 and the side wall of the air duct 3 in sequence. Among them, since both the circuit board 2 and the air duct 3 are made of hard materials, it is difficult to ensure a tight connection between the circuit board 2 and the air duct 3 when they are directly connected, and it is easy to generate a gap between the circuit board 2 and the air duct 3, resulting in the heat not being effectively conducted to the heat dissipation member 4 in the air duct 3. For this reason, in this embodiment, by using the first heat conducting medium 7 prepared from a flexible material, the first heat conducting medium 7 can be fully filled between the circuit board 2 and the air duct 3 through its own flexible deformation, and it can be ensured that there is no gap in the heat transfer path between the circuit board 2 and the air duct 3, thereby improving the efficiency of heat conduction and further improving the heat dissipation efficiency.

[0083] In one embodiment, the material of the first heat conducting medium 7 can be heat conducting gel or heat conducting silicone grease. These materials have good heat conducting ability and certain flexibility, and can be fully filled between the circuit board 2 and the air duct 3 to eliminate the gap in the heat conduction path and improve the heat dissipation efficiency.

[0084] There are numerous components on the circuit board 2, which are densely integrated on the circuit board 2. The distance between some components is small, making it easy to generate electromagnetic interference and affecting the normal operation of some components. Therefore, referring to Figure 3 , in one embodiment, the terminal device provided in this embodiment further includes an electromagnetic shielding member 9, and the electromagnetic shielding member 9 can cover the heating element 6. In one embodiment, the heating element 6 is disposed on one surface of the circuit board 2 facing the air duct 3, and the electromagnetic shielding member 9 is disposed between the first heat-conducting medium 7 and the circuit board 2. The electromagnetic shielding member 9 is provided with a receiving groove for receiving some components on the circuit board 2. These components can be heating components 6 or non-heating components. For heating components, at least part of the heat of the heating component 6 is sequentially conducted to the heat sink 4 through the electromagnetic shielding member 9, the first heat-conducting medium 7, and the wall plate of the air duct 3. Among them, the electromagnetic shielding member 9 can be a metal member, such as metals like copper and aluminum, and has the function of electromagnetic shielding. The components that generate electromagnetic interference or are affected by electromagnetic interference can be covered in the receiving groove to isolate electromagnetic interference through the receiving groove. In addition, since the electromagnetic shielding member 9 is a metal member, that is, both the electromagnetic shielding member 9 and the air duct 3 are rigid members, if the electromagnetic shielding member 9 is directly connected to the air duct 3, it is easy to generate a gap between the electromagnetic shielding member 9 and the air duct 3, and heat cannot be effectively conducted to the heat sink 4 at the gap, reducing the heat dissipation efficiency. Therefore, in this embodiment, the first heat-conducting medium 7 can be filled between the electromagnetic shielding member 9 and the air duct 3. The first heat-conducting medium 7 can fully fill the gap between the electromagnetic shielding member 9 and the air duct 3 by virtue of its flexibility, eliminating the gap, and the electromagnetic shielding member 9 made of a metal material also has good heat conductivity, enabling the heat generated by the heating component 6 to be efficiently conducted to the heat sink 4 sequentially through the electromagnetic shielding member 9, the first heat-conducting medium 7, and the side wall of the air duct 3. Among them, the side wall of the air duct 3 is the side wall for connecting to the heat sink 4. In one embodiment, the electromagnetic shielding member 9 can be assembled on the circuit board 2 through surface mount technology (SMT), thereby improving the assembly reliability, reducing the solder joint defect rate, and being beneficial to improving the integration degree.

[0085] In one embodiment, referring to Figure 3, the electromagnetic shielding member 9 can be an integrally formed structure, and the electromagnetic shielding member 9 can directly form a receiving groove during the molding process, so as to facilitate processing and manufacturing, and at the same time ensure the overall structural reliability of the electromagnetic shielding member 9. Among them, the receiving groove can be a groove structure that is penetrated on one side and not penetrated on the other side in the thickness direction Z of the electromagnetic shielding member 9. After the electromagnetic shielding member 9 is assembled on the circuit board 2, the open side of the receiving groove can be closed by the circuit board 2 to form a closed space, thereby improving the electromagnetic shielding effect. In addition, the device contained in the receiving groove can also be a heating device 6. In order to improve the heat conduction efficiency of the heating device 6 in the receiving groove, the receiving groove can also be filled with a second heat-conducting medium 8 of a flexible material. The second heat-conducting medium 8 can use its own flexibility to fully fill between the heating device 6 and the inner wall of the receiving groove to eliminate the gap, so that the heat generated by the heating device 6 in the receiving groove can be sequentially conducted to the heat sink 4 through the second heat-conducting medium 8, the electromagnetic shielding member 9, the first heat-conducting medium 7, and the wall plate of the air duct 3. In one embodiment, the material of the second heat-conducting medium 8 can be heat-conducting gel or heat-conducting silicone grease, which has good thermal conductivity and certain flexibility, and can be fully filled between the circuit board 2 and the air duct 3, eliminating the gap in the heat conduction path and improving the heat dissipation efficiency. It can be understood that the first heat-conducting medium 7 and the second heat-conducting medium 8 can be the same material or different materials, and this application does not limit this.

[0086] In one embodiment, Figure 7 A partial cross-sectional view of a terminal device provided in the fifth embodiment of the present application at a side view angle, referring to Figure 7 The electromagnetic shielding component 9 includes a body 91 and a cover plate 92. The body 91 is arranged on the circuit board 2. The receiving groove is a through groove. The through groove passes through the body 91 along the thickness direction Z of the terminal device. The cover plate 92 is buckled on the side of the body 91 away from the circuit board 2, and is used to close the through groove. The cover plate 92 is connected to the air duct 3 through the first heat-conducting medium 7. Among them, the electromagnetic shielding component 9 is a structure assembled by the body 91 and the cover plate 92 separately, that is, after the body 91 is mounted on the circuit board 2 through the SMT process, the cover plate 92 can be fixedly buckled on the body 91 by welding, gluing, etc. to close the through groove and form an effective electromagnetic shielding function. Among them, after the body 91 is mounted on the circuit board 2, a second heat-conducting medium 8 such as heat-conducting gel and heat-conducting silicone grease can also be injected into the through groove to achieve heat conduction of the device in the through groove. In this embodiment, since the cover plate 92 can be snapped onto the body 91 to close the through groove, it is convenient to inject a thermally conductive gel with a higher thermal conductivity coefficient into the through groove to improve the thermal conductivity and thus improve the heat dissipation efficiency of the heating element 6 .

[0087] In one embodiment, referring to Figure 5, the heating device 6 can also be disposed on the side of the circuit board 2 away from the air duct 3. Exemplarily, the heating device 6 can be a system-on-chip. To reduce the electromagnetic interference between the heating device 6 on the side of the circuit board 2 away from the air duct 3 and the surrounding devices, the heating device 6 can also be electromagnetically shielded by the aforementioned electromagnetic shielding member 9. The structure, effect, etc. of the electromagnetic shielding member 9 are the same as those of the aforementioned electromagnetic shielding member, and will not be elaborated herein. Wherein, a second heat-conducting medium 8 can also be filled between the heating device 6 located on the side of the circuit board 2 away from the air duct 3 and the electromagnetic shielding member 9. The second heat-conducting medium 8 has the same function as the aforementioned second heat-conducting medium, and will not be elaborated herein. In one embodiment, the heating device 6 located on the side of the circuit board 2 away from the air duct 3 can be a system-on-chip, and a double data rate synchronous dynamic random access memory (Double Data Rate SDRAM, DDR SDRAM) 61 can be connected to the side of the system-on-chip away from the circuit board 2. The data transmission speed of the DDR SDRAM is twice the system clock frequency, and it has good transmission performance. The system-on-chip and the DDR SDRAM can be integrally covered in the electromagnetic shielding member 9 (refer to Figure 5 ).

[0088] As described above, the heat dissipation member 4 is the main heat dissipation component. Making the projections of the heating device 6, the first heat-conducting medium 7, and the electromagnetic shielding member 9 coincide with the projection of the heat dissipation member 4 in the thickness direction Z of the terminal device can shorten the heat dissipation path and achieve fast and effective heat dissipation. Figure 8 This is a partial cross-sectional view of the terminal device provided by the sixth embodiment of the present application in a side view perspective. Refer to Figure 8 . To further improve the heat dissipation efficiency, in one embodiment, along the thickness direction Z of the terminal device, at least part of the projections of the first heat-conducting medium 7 and the electromagnetic shielding member 9 coincide with the projections of the heat dissipation member 4 and the fan device 5. That is to say, the projections of the first heat-conducting medium 7 and the electromagnetic shielding member 9 in the thickness direction Z of the terminal device can simultaneously cover the heat dissipation member 4 and the fan device 5, so that most of the heat generated by the heating device 6 can be sequentially conducted to the relatively close heat dissipation member 4 through the electromagnetic shielding member 9 and the first heat-conducting medium 7. At the same time, at least part of the heat generated by the heating device 6 can also be conducted to the relatively far fan device 5 through the electromagnetic shielding member 9 and the first heat-conducting medium 7, so that the heat can be conducted to the structures such as the blades of the fan device 5 and exchange heat with the air through the fan device 5. Thus, the contact heat dissipation area with the air can be further expanded through the fan device 5, and the heat dissipation efficiency can be improved.

[0089] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A terminal device, characterized in that, it includes: a housing, on which an air inlet hole and an air outlet hole are provided; a circuit board, disposed inside the housing; a heating device, disposed on the circuit board; an air duct, disposed between the housing and the circuit board, the air duct includes an air inlet and an air outlet, the air inlet is communicated with the air inlet hole, and the air outlet is communicated with the air outlet hole; a heat dissipation member, disposed at a position in the air duct close to the air outlet; a fan device, disposed at a position in the air duct close to the air inlet.

2. The terminal device according to claim 1, characterized in that, along the thickness direction of the terminal device, at least a part of the projection of the heating device coincides with the projection of the heat dissipation member.

3. The terminal device according to claim 1, characterized in that, it further includes a first heat-conducting medium, and the first heat-conducting medium is disposed between the circuit board and the air duct.

4. The terminal device according to claim 3, characterized in that, the material of the first heat-conducting medium is heat-conducting gel or heat-conducting silicone grease.

5. The terminal device according to claim 3 or 4, characterized in that, it further includes an electromagnetic shielding member, and a receiving groove is provided on the electromagnetic shielding member, and the receiving groove is used for receiving the devices on the circuit board.

6. The terminal device according to claim 5, characterized in that, the electromagnetic shielding member is disposed between the first heat-conducting medium and the circuit board, and / or the electromagnetic shielding member is disposed on the side of the circuit board facing away from the air duct.

7. The terminal device according to claim 5 or 6, characterized in that, the electromagnetic shielding member includes a body and a cover plate, the body is disposed on the circuit board, the receiving groove is a through groove, and the through groove penetrates the body along the thickness direction of the terminal device; the cover plate is buckled on the side of the body facing away from the circuit board for closing the through groove, and the cover plate is connected to the air duct through the first heat-conducting medium.

8. The terminal device according to any one of claims 5-7, characterized in that, the material of the electromagnetic shielding member is heat-conducting metal.

9. The terminal device according to any one of claims 5-8, characterized in that, it further includes a second heat-conducting medium, and the second heat-conducting medium is filled between the devices in the receiving groove and the inner wall of the receiving groove.

10. The terminal device according to claim 9, characterized in that, the material of the second heat-conducting medium is heat-conducting gel or heat-conducting silicone grease.

11. The terminal device according to any one of claims 3-10, characterized in that, along the thickness direction of the terminal device, at least a part of the projection of the first heat-conducting medium and the electromagnetic shielding member coincides with the projection of the heat dissipation member and the fan device.

12. The terminal device according to any one of claims 1-11, characterized in that, the air duct includes an air inlet duct and an air outlet duct, the air inlet duct is communicated with the air outlet duct, the fan device is disposed in the air inlet duct, and the heat dissipation member is disposed in the air outlet duct.

13. The terminal device according to any one of claims 1-12, characterized in that, A heat equalizing part is provided on the air duct, and the heat equalizing part is provided on at least a part of the air duct close to the air outlet.

14. The terminal device according to claim 13, wherein, the heat equalizing part is a graphite layer.

15. The terminal device according to claims 1-14, wherein, the air duct is connected to the housing by adhesive bonding, or the air duct is connected to the housing by a connecting member, or the air duct and the housing are integrally formed.

16. The terminal device according to any one of claims 1-15, wherein, the heating device is arranged on a side of the circuit board facing away from the air duct.

17. The terminal device according to any one of claims 1-16, wherein, the heat dissipating member includes a plurality of metal fins.

18. The terminal device according to any one of claims 1-17, wherein, the housing includes a battery cover and a camera decorative member. The camera decorative member is arranged on the battery cover. The camera decorative member protrudes from an outer wall of the battery cover. An accommodation space is provided inside the camera decorative member. At least a part of the air duct is arranged in the accommodation space.

19. The terminal device according to claim 18, wherein, along a first direction, the camera decorative member has a side wall, and the air inlet hole and the air outlet hole are provided on the side wall. The first direction is perpendicular to the thickness direction of the terminal device.

20. The terminal device according to any one of claims 1-19, wherein, the heating device is a system on chip, a power management unit or a UNIX file system.

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