Single-phase liquid cooling server heat pipe heat dissipation backboard

Abstract

The invention discloses a single-phase liquid cooling server heat pipe heat dissipation backboard, and belongs to the technical field of liquid cooling heat dissipation equipment. The single-phase liquid cooling server heat pipe heat dissipation backboard comprises a backboard body, an evaporation end, a condensation end and an intelligent control module, the evaporation end and the condensation end are arranged on the backboard body, and the condensation end is arranged above the evaporation end. The condensation end is composed of a plurality of stages of condensers, and each stage of condenser is a micro-channel heat exchanger. The pumpless heat pipe phase change heat dissipation technology is adopted, the dependence on a CDU can be effectively reduced through the intelligent control module, the gas-liquid dual-mode heat dissipation structure and the graded circulation design, the heat dissipation performance of the data center can be effectively improved through the unique air cooling and liquid cooling dual heat dissipation path design, and the maintenance cost is reduced. The single-phase liquid cooling server heat pipe heat dissipation backboard can adapt to different environmental conditions, can keep an efficient cooling effect under the working condition of a high-temperature environment, and has high adaptability and wide application prospects.

Description

Technical Field

[0001] The present invention belongs to the technical field of liquid cooling heat dissipation equipment, and particularly relates to a single-phase liquid cooling server heat pipe heat dissipation backplane. Background Art

[0002] With the continuous growth of the computing power demand in data centers, the power consumption and heat dissipation problems of servers have become increasingly prominent. The traditional air-cooling heat dissipation method has been difficult to meet the cooling requirements of high heat flux density devices. For example, the Chinese invention patent with the publication number CN 115397204 A discloses a "heat pipe backplane air conditioner hierarchical processing system and its control method", which sucks out the high-temperature air in the server through a fan and then cools it into low-temperature air through a heat exchanger to achieve the purpose of cooling. The above technical solution uses air-cooling heat dissipation. The ratio of the total energy consumption of the data center of the air-cooling system to the energy consumption of IT equipment (Power Usage Effectiveness, PUE) is generally 1.5 - 1.8, while the PUE of the liquid-cooling system can be reduced to 1.05 - 1.15. It can be seen that the refrigeration and energy-saving effects of the liquid-cooling system are much higher than those of the air-cooling system. Therefore, due to its high heat transfer efficiency, liquid-cooling technology has gradually become the industry mainstream.

[0003] In liquid-cooling technology, single-phase liquid cooling has received wide attention because it can directly cool the server comprehensively, with higher heat dissipation efficiency and lower energy consumption. Single-phase liquid-cooling technology uses a single-phase coolant to circulate inside the system for heat dissipation. In data centers, single-phase liquid-cooling technology is often used to cool high-density heat-generating devices such as servers to improve energy efficiency and equipment stability. However, there are still the following three problems in the current single-phase liquid-cooling system during use: First, the local temperature rise is too high. The existing single-phase liquid cooling system mainly relies on the natural convection of the coolant or an external circulation pump to achieve heat dissipation. However, for a computing unit with a high power density, excessive temperature rise may still occur in a local area, affecting the stable operation of the server. For example, the Chinese invention patent with the publication number CN 106028745 A discloses "A heat dissipation structure for a server cabinet based on a secondary heat pipe". By guiding the heat generated by the main heat-generating components in the server chassis through a primary heat pipe to exchange heat with the secondary heat pipe, although it formally avoids the structural complexity and safety hazards caused by the entry of liquid into the server, the design of directly conducting heat through the heat pipe contact and then dissipating heat through the secondary heat pipe will result in a sequential decrease in energy, a small heat transfer coefficient, a large thermal resistance, and this solution relies heavily on an external water source during operation. On the one hand, it will increase the operating cost during long-term operation. On the other hand, most data centers use air cooling for heat dissipation. If there is no stable source of cooling water, it will greatly limit the use of this device. Another example is that the Chinese invention patent with the publication number CN 107580804 A discloses "Cooling electronic equipment in a data center", which describes the implementation of a thermosyphon system for cooling electronic heat-generating equipment installed in a server rack in a data center. The evaporation module of the thermosyphon system is directly in contact with the heat-generating equipment, evaporating the working fluid into the condensation module, and finally circulating to the condenser module of the thermosyphon system. Still another example is that the Chinese invention patent with the publication number CN 109496110 A discloses "A data center heat dissipation system with a direct connection between a loop heat pipe and a refrigeration cycle pipeline". By fitting the evaporation end to the chip inside the server, the heat generated by the chip inside the server heats the liquid to evaporate it into a gas state. The gas returns along the gas pipe to the condensation end, and the condensation end is connected to the refrigeration cycle pipeline of the refrigerant cycle unit through a circulating working fluid quick-connector unit. The circulating working fluid transfers the heat at the condensation end of the loop heat pipe to the condenser of the refrigerant cycle unit, and the heat is exchanged to the outside through the condenser. The technical solutions described in the latter two patents are both directly fitting the heat pipe to the heat-generating unit and using the evaporation and condensation principle of the heat pipe to take away the heat generated inside the server. Although it can reduce the temperature inside the server to a certain extent, they still adopt single-stage heat dissipation, which is prone to causing local temperature rise, and they are directly in contact with the heat-generating unit, resulting in problems such as a large thermal conduction resistance and a small heat transfer area, thus affecting the heat transfer efficiency.

[0004] Second, it has a high dependence on the Coolant Distribution Unit (CDU). A single-phase liquid cooling system usually requires a CDU to control the coolant temperature and circulation. The cooling capacity of the CDU directly determines the system's heat dissipation performance, increasing equipment costs and maintenance complexity. Traditional CDUs must manage complex multi-branch two-phase flows and achieve precise temperature control through liquid cooling. For example, each cabinet typically requires 8 - 12 externally connected branch valve controls, and a high-pressure circulation pump must be set up for pumping. The high-pressure circulation pump accounts for more than 40% of the CDU's volume, resulting in a relatively large volume of traditional CDUs. The industry average is approximately 1.5 cubic meters.

[0005] Third, it is difficult to optimize energy consumption. Current liquid cooling systems often operate in a mode with fixed flow rates and fan speeds and cannot provide real-time feedback and dynamic adjustment based on server load and ambient temperature changes, resulting in insufficient energy consumption optimization.

[0006] Therefore, there is an urgent need for heat dissipation equipment that can meet the heat dissipation requirements of high-power servers. This heat dissipation equipment is required to optimize energy consumption management, reduce dependence on external cooling equipment (such as CDU), and thus effectively improve the operational stability and energy efficiency ratio of the data center. Summary of the Invention

[0007] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a heat pipe heat dissipation backplane for a single-phase liquid cooling server, so as to solve the technical problems that existing heat dissipation equipment lacks intelligent control feedback and has a high dependence on the Coolant Distribution Unit (CDU), resulting in low heat dissipation performance and being unable to meet the heat dissipation requirements of high-power servers.

[0008] To achieve the above purpose, the present invention adopts the following technical solutions: The present invention discloses a heat pipe heat dissipation backplane for a single-phase liquid cooling server, including a backplane body, an evaporation end, a condensation end, and an intelligent control module; The evaporation end and the condensation end are arranged on the backplane body, and the condensation end is arranged above the evaporation end; the condensation end is composed of several stages of condensers, and each stage of condenser is a microchannel heat exchanger filled with a refrigerant. A fan is arranged behind the backplane body near the condensation end; the evaporation end is composed of several stages of evaporators, and the number of evaporators is the same as that of the condensers, and the evaporator and condenser of the same stage are connected to form a closed refrigerant circulation loop; the intelligent control module is arranged beside the backplane body, used to monitor the temperature distribution of the condensation end and the evaporation end in real time, and adjust the fan air volume and coolant flow rate passing through the condensation end and the evaporation end in real time according to the temperature feedback.

[0009] Preferably, the evaporator and the condenser of the same stage are connected by a riser pipe and a downcomer pipe to form a closed refrigerant circulation loop.

[0010] Further preferably, the evaporator at the evaporation end is provided in three stages, including a first-stage evaporator, a second-stage evaporator, and a third-stage evaporator arranged in parallel. The condenser at the condensation end is provided in three stages, including a first-stage condenser, a second-stage condenser, and a third-stage condenser arranged in parallel; The riser tubes are correspondingly provided in three stages, including a first-stage riser tube, a second-stage riser tube, and a third-stage riser tube. The downcomer tubes are correspondingly provided in three stages, including a first-stage downcomer tube, a second-stage downcomer tube, and a third-stage downcomer tube; The first-stage evaporator, the first-stage riser tube, the first-stage condenser, and the first-stage downcomer tube are connected in sequence to form a closed loop; The second-stage evaporator, the second-stage riser tube, the second-stage condenser, and the second-stage downcomer tube are connected in sequence to form a closed loop; The third-stage evaporator, the third-stage riser tube, the third-stage condenser, and the third-stage downcomer tube are connected in sequence to form a closed loop.

[0011] Even further preferably, the first-stage evaporator and the second-stage evaporator are connected through a first connecting pipe, and the second-stage evaporator and the third-stage evaporator are connected through a second connecting pipe.

[0012] Among them, the evaporation end and the condensation end are connected to each other through the riser tubes and the downcomer tubes to form three independent closed refrigerant circulation loops. The high-temperature coolant output from the data center cabinet flows through the coolant flow channels of the first-stage evaporator, the second-stage evaporator, and then to the third-stage evaporator in sequence, and performs multi-stage heat exchange with the working fluid (refrigerant) in the evaporator; after the refrigerant absorbs heat and evaporates, it enters the microchannel flat tubes in the condenser at the condensation end through the riser tubes, and is forced to condense into a liquid state by an external fan, and then returns to the evaporator at the evaporation end by gravity.

[0013] Preferably, the refrigerant filled in the microchannel heat exchanger includes but is not limited to R134a, and for example, it can also be refrigerants such as carbon dioxide and water.

[0014] Preferably, the intelligent control module includes a main controller, a temperature sensor, and a coolant distribution unit; The main controller is installed outside the data center cabinet. There are two coolant distribution units, which are respectively installed on both sides of the data center cabinet. The outlet end of the first coolant distribution unit is connected to the first-stage evaporator, and the third-stage evaporator is connected to the inlet end of the second coolant distribution unit; There are two temperature sensors. The first temperature sensor is installed at the outlet end of the first coolant distribution unit connected to the first-stage evaporator, and a coolant valve is provided on the pipeline connecting the outlet end to the evaporation end; the second temperature sensor is installed at the inlet end of the second coolant distribution unit connected to the third-stage evaporator.

[0015] Preferably, the fan is an axial flow fan, which is used to draw the air inside the data center cabinet out of the cabinet through the condensation end.

[0016] Preferably, the number of axial flow fans can be one or more.

[0017] More preferably, the main controller synchronously adjusts the opening degree of the coolant valve and the air volume of the axial flow fan according to the inlet temperature of the primary evaporator and the outlet temperature of the tertiary evaporator.

[0018] Preferably, the outlet end of the first coolant distribution unit is connected to the inlet of the primary evaporator, and the outlet of the tertiary evaporator is connected to the inlet of the second coolant distribution unit.

[0019] Preferably, the microchannel heat exchanger includes a plurality of microchannel flat tubes laid in parallel, and fins are evenly arranged between adjacent microchannel flat tubes.

[0020] Preferably, the evaporator adopts a plate heat exchanger or a shell-and-tube heat exchanger.

[0021] Compared with the prior art, the present invention has the following beneficial effects: The single-phase liquid-cooled server heat pipe heat dissipation backplane disclosed by the present invention adopts a pump-free heat pipe phase change heat dissipation technology. Through an intelligent control module, a gas-liquid dual-mode heat dissipation structure and a hierarchical circulation design, it can effectively reduce the dependence on the CDU. The unique dual heat dissipation path design of air cooling and liquid cooling can effectively improve the heat dissipation performance of the data center and reduce the maintenance cost. The single-phase liquid-cooled server heat pipe heat dissipation backplane of the present invention can adapt to different environmental conditions, ensure high-efficiency cooling effect under high-temperature conditions, and has strong adaptability and broad application prospects. The specific innovation points are analyzed as follows: First, a separated gravity heat pipe is used as the heat dissipation carrier. The condensers are all set as microchannel heat exchangers and filled with refrigerant. At the same time, a fan is arranged behind the backplane body near the condensation end. The above structural design can utilize the natural circulation driven by gravity to realize the gas-liquid phase change of the refrigerant. At the same time, the same number of several stages of evaporators and condensers are respectively arranged at the evaporation end and the condensation end, and an independent closed refrigerant self-circulation loop can be formed in the evaporator and condenser corresponding to the same stage, effectively improving the heat exchange efficiency, and the energy consumption is significantly lower than that of the traditional cooling system. Therefore, it is particularly suitable for high-temperature and high-heat environments.

[0022] Second, an intelligent control module is arranged beside the backplane body, which can monitor the temperature distribution at the evaporation end and the condensation end in real time, synchronously adjust the refrigerant flow rate and the air volume of the fan, and ensure that the heat dissipation system is in the best energy efficiency state. For example, under the working conditions of high ambient temperature in summer, when the temperature difference between the hot end and the cold end is small, the intelligent control module can automatically increase the air volume to ensure that the device can maintain high-efficiency heat exchange effect under low-temperature difference conditions.

[0023] Thirdly, the present invention can reduce the dependence on the CDU. The traditional CDU branch is complex and requires precise temperature control of traditional liquid cooling and high-pressure pumps to achieve its functions. On the one hand, through the design of an independent heat pipe cycle (a closed loop from the evaporation end to the condensation end), each heat pipe loop completes the phase change heat transfer of the working medium by self-circulation without a pump, and the CDU only needs to provide the basic liquid cooling flow rate (single-phase coolant). Therefore, at the same heat dissipation power (50 kW), the volume of the CDU required by the present invention is only 1 / 3 of that of the traditional system (the industry average is 1.5 cubic meters, and the present invention's solution is about 0.5 cubic meters). On the other hand, the structural design of the present invention can effectively simplify the pipeline topology. Through the coupled design of the evaporator (plate heat exchanger) and the condenser (microchannel heat exchanger), the connection ports of the CDU can be effectively reduced (only two external pipelines for liquid inlet and outlet are required for a single cabinet), while each traditional CDU cabinet requires 8 - 12 external branch valve controls. Therefore, both the volume and the failure points of the CDU of the present invention are significantly reduced.

[0024] Fourthly, the present invention uses gravity drive to replace the traditional external pump. The separated gravity heat pipe loop effectively realizes pump-free circulation and does not need to rely on the cooling water system, thus reducing the additional energy consumption requirements, effectively reducing the equipment operation cost, and having a higher energy efficiency ratio. In addition, from a structural perspective, the device itself has no complex mechanical components, so it can reduce the long-term maintenance cost and the impact on the environment.

[0025] Furthermore, the refrigerant is selected as a refrigerant working medium that can perform phase change heat transfer at the evaporation end and the condensation end. For example, an environmentally friendly refrigerant can reduce the environmental impact and meet the requirements of energy conservation and environmental protection. For example, refrigerants such as R134a, carbon dioxide, or water.

[0026] Furthermore, the evaporator and the condenser at the evaporation end and the condensation end of the heat pipe heat dissipation backplane of the single-phase liquid-cooled server of the present invention can be considered to be set from two-stage to four-stage, and the number of stages can be adjusted according to different application scenarios. Currently, considering the structure and actual working conditions requirements, three stages are preferably selected. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of the overall structure of the heat pipe heat dissipation backplane of the single-phase liquid-cooled server of the present invention; Figure 2 is an exemplary structural schematic diagram of the heat pipe heat dissipation backplane of the single-phase liquid-cooled server of the present invention for a data center cooling system; Figure 3 is a schematic diagram of the device structure of a data center cabinet; Figure 4 is a schematic diagram of the structure of a microchannel heat exchanger; Figure 5Schematic diagram of the local structure of the evaporation end of the heat pipe heat dissipation backplane of the single-phase liquid-cooled server of the present invention; Figure 6 Experimental result diagram of the application of the heat pipe heat dissipation backplane of the single-phase liquid-cooled server of the present invention.

[0028] Wherein: 100, data center cooling system; 110, data center cabinet; 120, first coolant distribution unit; 121, second coolant distribution unit; 130, first temperature sensor; 131, second temperature sensor; 140, coolant valve; 150, main controller; 160, condensation end; 161, primary condenser; 162, secondary condenser; 163, tertiary condenser; 164, axial flow fan; 165, primary downcomer; 166, secondary downcomer; 167, tertiary downcomer; 170, evaporation end; 171, primary evaporator; 172, secondary evaporator; 173, tertiary evaporator; 174, primary riser; 175, secondary riser; 176, tertiary riser; 177, primary connecting pipe; 178, secondary connecting pipe; 181, liquid inlet; 182, liquid outlet; 190, microchannel heat exchanger; 191, microchannel flat tube; 192, fin. Detailed implementation manners

[0029] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings: Embodiment 1 See Figure 1, the single-phase liquid-cooled server heat pipe cooling backplane disclosed by the present invention includes a backplane body, an evaporation end 170, a condensation end 160, and an intelligent control module. The evaporation end 170 and the condensation end 160 are both arranged on the backplane body, and the condensation end 160 is arranged above the evaporation end 170. The condensation end 160 is composed of several levels of condensers, and each level of condenser is a microchannel heat exchanger 190. A refrigerant is filled in the microchannel heat exchanger 190. A fan is arranged behind the backplane body where the condensation end is installed, and is used to lead the air inside the data center cabinet 110 out of the cabinet through the condensation end.

[0032] The evaporation end 170 is composed of several levels of evaporators. The number of evaporators is the same as that of the condensers, and the evaporator and the condenser of the corresponding level are connected to form a closed refrigerant circulation loop. After the refrigerant absorbs heat and evaporates, it enters the microchannel heat exchanger 190 of the condenser, is forced to condense into a liquid state by external forced convection of the fan, and then relies on gravity to flow back into the evaporator.

[0033] See Figure 2 , in the data center cooling system 100, the backplane body is regarded as the cabinet door of the data center cabinet 110. The intelligent control module is arranged beside the backplane body and is used to monitor the temperature distribution of the condensation end 160 and the evaporation end 170 in real time, and adjust the refrigerant flow rate through the condensation end 160 and the evaporation end 170 and the air volume of the fan in real time according to the temperature feedback.

[0034] Preferably, the intelligent control module includes a main controller 150, temperature sensors, and a coolant distribution unit. The main controller 150 is installed outside the data center cabinet 110. Two coolant distribution units are provided, including a first coolant distribution unit 120 and a second coolant distribution unit 121, which are respectively installed on both sides of the data center cabinet 110. The outlet end of the first coolant distribution unit 120 is connected to the first-stage evaporator 171, and the third-stage evaporator 173 is connected to the inlet end of the second coolant distribution unit 121. Two temperature sensors are provided, including a first temperature sensor 130 and a second temperature sensor 131. Among them, the first temperature sensor 130 is installed at the outlet end of the first coolant distribution unit 120 connected to the first-stage evaporator 171, and a coolant valve 140 is provided on the pipeline connecting the outlet end to the evaporation end 170. The second temperature sensor 131 is installed at the inlet end of the second coolant distribution unit 121 connected to the third-stage evaporator 173. The main controller 150 performs temperature feedback based on the temperature parameters collected by the above two temperature sensors in real time, and synchronously adjusts the opening degree of the coolant valve 140 and the rotation speed of the axial flow fan 164 to achieve the dynamic balance of heat dissipation efficiency and energy consumption.

[0035] Considering the structure and actual working conditions requirements, the evaporator and condenser at the evaporation end and condensation end of the embodiments of the present invention are preferably arranged in three stages. Specifically, the evaporation end 170 is composed of a first-stage evaporator 171, a second-stage evaporator 172, and a third-stage evaporator 173 arranged in parallel, and the above three evaporators are connected by two sections of connecting pipes. Specifically, the first-stage evaporator 171 and the second-stage evaporator 172 are connected through a first-stage connecting pipe 177, and the second-stage evaporator 172 and the third-stage evaporator 173 are connected through a second-stage connecting pipe 178.

[0036] Preferably, as Figure 1 shown, the evaporator used in this embodiment is a plate heat exchanger (such as a printed circuit board heat exchanger) or a shell-and-tube heat exchanger (such as a high-efficiency tank).

[0037] Preferably, the condensation end 160 is composed of a first-stage condenser 161, a second-stage condenser 162, and a third-stage condenser 163 arranged in parallel. Each stage of the condenser works independently, and the condenser uses a microchannel heat exchanger 190. As Figure 4 shown, the microchannel heat exchanger 190 includes a number of microchannel flat tubes 191 laid in parallel, and fins 192 are evenly arranged between adjacent microchannel flat tubes 191. The design of this fin structure increases the contact area between the refrigerant and the cold air, improves the condensation efficiency, and thus enhances the overall heat exchange effect. The microchannel heat exchanger 190 is filled with a heat pipe working fluid, that is, a refrigerant. The refrigerant used in this embodiment is R134a, and it can also be a refrigerant such as carbon dioxide or water.

[0038] Preferably, the evaporator and condenser of the same stage are connected by a riser pipe and a downcomer pipe to form a closed refrigerant circulation loop. Further preferably, the riser pipe is correspondingly arranged in three stages, including a first-stage riser pipe 174, a second-stage riser pipe 175, and a third-stage riser pipe 176, and the downcomer pipe is correspondingly arranged in three stages, including a first-stage downcomer pipe 165, a second-stage downcomer pipe 166, and a third-stage downcomer pipe 167; The first-stage evaporator 171, the first-stage riser pipe 174, the first-stage condenser 161, and the first-stage downcomer pipe 165 are connected in sequence to form a closed loop; the second-stage evaporator 172, the second-stage riser pipe 175, the second-stage condenser 162, and the second-stage downcomer pipe 166 are connected in sequence to form a closed loop; the third-stage evaporator 173, the third-stage riser pipe 176, the third-stage condenser 163, and the third-stage downcomer pipe 167 are connected in sequence to form a closed loop.

[0039] Preferably, referring to Figure 3, the fan provided behind the backplane body near the condensation end, i.e., outside the data center cabinet 110, is an axial flow fan 164. The number of axial flow fans 164 can be one or more, and is used to draw the air inside the data center cabinet 110 out of the cabinet through the condensation end. Therefore, further preferably, the main controller 150 synchronously adjusts the opening degree of the coolant valve 140 and the air volume of the axial flow fan 164 according to the temperature of the liquid inlet 181 of the primary evaporator 171 and the temperature of the liquid outlet 182 of the tertiary evaporator 173.

[0040] Preferably, referring to Figure 5 , the outlet end of the first coolant distribution unit 120 is connected to the liquid inlet 181 of the primary evaporator 171, and the liquid outlet 182 of the tertiary evaporator 173 is connected to the inlet end of the second coolant distribution unit 121.

[0041] The following describes a working scenario of the present invention for a single-phase liquid-cooled server heat pipe cooling backplane during use through an application example.

[0042] Figure 2 It is an exemplary structural diagram of the single-phase liquid-cooled server heat pipe cooling backplane of the present invention for a data center cooling system. Through such an application example, the problem of excessively high internal server temperature in the data center is listed, and a solution for temperature control adjustment using the single-phase liquid-cooled server heat pipe cooling backplane of the present invention is provided.

[0043] Specifically, as the power consumption and heat dissipation of data center servers increase day by day, the working temperature inside the data center servers reaches up to 70 °C. In order to prevent problems such as slow server operation speed, reduced computing power, and equipment damage caused by excessive temperature, the above single-phase liquid-cooled server heat pipe cooling backplane of the present invention is used for heat dissipation, and the heat in the server is taken away by the cold air circulation of the environment to ensure the high-quality and stable operation of the server.

[0044] The schematic diagram of the data center cooling system 100 is as Figure 3As shown, during use, the temperature of the coolant inside the data center server rises. The coolant flows into the liquid inlet 181 of the primary evaporator 171 through the first coolant distribution unit 120, then passes through the secondary evaporator 172 and the tertiary evaporator 173 in sequence, and finally flows out from the liquid outlet 182 of the tertiary evaporator 173 and then enters the second coolant distribution unit 121. During the above process, when the coolant passes through the evaporation end 170, it undergoes multi-stage heat exchange with the working medium inside. After the refrigerant inside the evaporation end 170 absorbs heat and evaporates into a gaseous state, it enters the condensation end 160 through the rising pipes at all levels. Each condenser in the condensation end 160 is a microchannel heat exchanger 190, and the fin structure therein can effectively increase the heat exchange area. At the same time, the axial flow fan 164 outside the data center cabinet 110 extracts the cold air inside the data center cabinet 110, and then discharges the heated cold air outside the data center cabinet 110 through the condensation end 160. When the cold air passes through the condensation end 160, it uses forced convection to condense the gaseous refrigerant inside the microchannel heat exchanger 190 into a liquid state, and relies on gravity to flow back into the evaporation end 170 through the descending pipes at all levels. Through this process, the purpose of cooling the single-phase liquid-cooled server is achieved. In addition, the main controller 150 in the intelligent control module performs temperature feedback based on the temperature sensors set at the outlet end and the inlet end of the coolant distribution unit, and then synchronously adjusts the opening degree of the coolant valve 140 and the rotation speed of the axial flow fan 164 to achieve the dynamic balance of heat dissipation efficiency and energy consumption.

[0045] The above-mentioned single-phase liquid-cooled server heat pipe heat dissipation backplane was used for application experiments. Specifically, under the condition that the ambient temperature was 38°C, experiments were carried out with two different fan powers (60 kW and 200 kW were used in the experiment). The inlet temperature of the cold air before passing through the condensation end was 38°C. Three inlet temperature conditions were simulated for the coolant before entering the condensation end, which were 70°C, 60°C, and 52°C respectively. After being cooled by the condensation end, the outlet temperature of the cold air increased, and the highest reached 59°C, while the outlet temperature of the coolant decreased significantly. For example, when the fan power was 200 kW and the inlet temperature of the coolant was 70°C, the outlet temperature was 54°C. The results are as Figure 6 shown. The figure shows the heat dissipation amounts corresponding to two different fan powers under three working conditions. From this change, it can be seen that the single-phase liquid-cooled server heat pipe heat dissipation backplane of the present invention significantly reduces the temperature of the coolant during the heat exchange process and increases the temperature of the cold air, showing excellent heat exchange effects, especially the advantage in realizing the reverse temperature difference. Therefore, it fully demonstrates that the heat exchange efficiency of the single-phase liquid-cooled server heat pipe heat dissipation backplane of the present invention is remarkable and can achieve more efficient energy exchange in practical applications.

[0046] In summary, the heat pipe cooling backplane for single-phase liquid-cooled servers provided by the present invention, with a composite hierarchical cooling structure combining a plate heat exchanger and a microchannel heat exchanger, can effectively achieve high-efficiency phase change cooling, reduce local temperature rise, and improve heat transfer uniformity. At the same time, the present invention can also dynamically adjust the coolant flow rate and fan operation parameters using an intelligent control module to optimize energy consumption and achieve a more stable and energy-saving cooling solution. The present invention adopts a "plate heat exchanger + microchannel heat exchanger" composite hierarchical structure, combining air-cooling and liquid-cooling dual heat dissipation paths, solving the problem of excessive local temperature rise in traditional single-phase cooling. Through the design of an independent closed refrigerant self-circulation loop formed by several stages of evaporators and condensers, a pump-free heat pipe phase change heat dissipation is embedded in the single-phase liquid-cooling system, which can effectively reduce the dependence on the cooling capacity of the CDU, and achieve energy-saving optimization of the cooling backplane using multi-stage temperature sensing and coordinated control. Therefore, the heat pipe cooling backplane for single-phase liquid-cooled servers of the present invention can improve the heat transfer uniformity of high heat flux density data centers, and the maintenance cost is significantly lower than that of traditional cold plate solutions.

[0047] The above content is only to illustrate the technical idea of the present invention, and the protection scope of the present invention cannot be limited thereby. Any changes made on the basis of the technical solution according to the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A single-phase liquid cooling server heat pipe heat dissipation backplane, characterized in that: It comprises a back plate body, an evaporation end (170), a condensation end (160) and an intelligent control module; The evaporation end (170) and the condensation end (160) are arranged on the back plate body, and the condensation end (160) is arranged above the evaporation end (170); the condensation end (160) is composed of a plurality of stages of condensers, each stage of the condenser is a microchannel heat exchanger (190), the microchannel heat exchanger (190) is filled with refrigerant, and a fan is arranged behind the back plate body close to the condensation end; the evaporation end (170) is composed of a plurality of stages of evaporators, the number of evaporators and condensers is the same, and the evaporators and condensers corresponding to the same stage are connected to form a closed refrigerant circulation loop; The intelligent control module is arranged beside the back panel body and is used to monitor the temperature distribution of the condensing end (160) and the evaporating end (170) in real time, and to adjust the fan air volume and coolant flow through the condensing end (160) and the evaporating end (170) in real time according to temperature feedback.

2. A single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 1, characterized in that: The evaporator and condenser corresponding to the same level are connected through the riser and the downcomer to form a closed loop of refrigerant circulation.

3. The single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 2, characterized in that: The evaporator at the evaporation end (170) is arranged in three stages, including a primary evaporator (171), a secondary evaporator (172) and a tertiary evaporator (173) arranged in parallel; the condenser at the condensation end (160) is arranged in three stages, including a primary condenser (161), a secondary condenser (162) and a tertiary condenser (163) arranged in parallel; The ascending pipe is provided in three stages, including a first-stage ascending pipe (174), a second-stage ascending pipe (175) and a third-stage ascending pipe (176); the descending pipe is provided in three stages, including a first-stage descending pipe (165), a second-stage descending pipe (166) and a third-stage descending pipe (167); The primary evaporator (171), the primary riser (174), the primary condenser (161) and the primary downcomer (165) are sequentially connected to form a closed loop; The secondary evaporator (172), the secondary ascending pipe (175), the secondary condenser (162) and the secondary descending pipe (166) are sequentially connected to form a closed loop; The third-stage evaporator (173), the third-stage ascending pipe (176), the third-stage condenser (163) and the third-stage descending pipe (167) are connected in sequence to form a closed loop.

4. The single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 3, characterized in that: The primary evaporator (171) and the secondary evaporator (172) are connected via a primary connecting pipe (177), and the secondary evaporator (172) and the tertiary evaporator (173) are connected via a secondary connecting pipe (178).

5. The single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 3, characterized in that: The intelligent control module comprises a main controller (150), a temperature sensor and a coolant distribution unit; The main controller (150) is installed outside the data center cabinet (110); two cooling liquid distribution units are provided and are installed on both sides of the data center cabinet (110), respectively; the outlet end of the first cooling liquid distribution unit (120) is connected to the primary evaporator (171); and the tertiary evaporator (173) is connected to the inlet end of the second cooling liquid distribution unit (121); Two temperature sensors are provided, wherein the first temperature sensor (130) is installed at the outlet end of the first cooling liquid distribution unit (120) connected to the primary evaporator (171), and a cooling liquid valve (140) is provided on a pipeline connected to the outlet end and the evaporation end (170); and the second temperature sensor (131) is installed at the inlet end of the second cooling liquid distribution unit (121) connected to the tertiary evaporator (173).

6. The single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 5, characterized in that: The fan is an axial flow fan (164) and is used to lead the air inside the data center cabinet (110) out of the cabinet through a condensation end.

7. The single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 6, characterized in that: The main controller (150) synchronously adjusts the opening size of the coolant valve (140) and the air volume of the axial flow fan (164) according to the temperature of the liquid inlet (181) of the first-stage evaporator (171) and the temperature of the liquid outlet (182) of the third-stage evaporator (173).

8. The single-phase liquid cooling server heat pipe heat dissipation backplane according to claim 5, characterized in that: The outlet end of the first cooling liquid distribution unit (120) is connected to the liquid inlet (181) of the first-stage evaporator (171), and the liquid outlet (182) of the third-stage evaporator (173) is connected to the inlet end of the second cooling liquid distribution unit (121).

9. A single-phase liquid cooling server heat pipe heat dissipation backplane according to any one of claims 1 to 8, characterized in that: The microchannel heat exchanger (190) comprises a plurality of microchannel flat tubes (191) laid in parallel, and fins (192) are evenly arranged between adjacent microchannel flat tubes (191).

10. A single-phase liquid cooling server heat pipe heat dissipation backplane according to any one of claims 1 to 8, characterized in that: The evaporator adopts a plate heat exchanger or a shell and tube heat exchanger.

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