Ultrasound imaging system and device

By integrating multiple ultrasound transducers and using a modularly designed ultrasound imaging system, the problem of inflexible imaging depth and resolution in 4D ICE technology has been solved, enabling the selection of multiple imaging parameters, shortening surgical time and reducing costs.

CN120131075BActive Publication Date: 2025-12-12JIANGSU TINGSN TECH CO LTD
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Patent Information

Application Number
CN202510306279.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-14
Publication Date
2025-12-12
Estimated Expiration
2045-03-14

AI Technical Summary

Technical Problem

Existing 4D ICE technology uses only one ultrasound transducer, which limits the flexibility of imaging depth and resolution, increasing surgical time and cost.

Method used

It integrates multiple ultrasonic transducers and achieves modular design through a main control chip and flexible conduction structure, supporting different numbers and types of ultrasonic transducers, reducing signal transmission loss, and improving operational flexibility and imaging quality.

Benefits of technology

It enables the selection of multiple imaging parameters, shortens operation time, reduces costs, and improves the adaptability and reliability of the imaging system.

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Abstract

The application provides an ultrasonic imaging system and device, relates to the technical field of medical devices, and comprises a system interface module and an ultrasonic imaging catheter, one end of the system interface module is connected with a host computer, and the end of the ultrasonic imaging catheter away from the system interface module comprises a sheath tube and a sheath tube component; the sheath tube component comprises a main control chip, a flexible conductive structure and at least two ultrasonic transducer devices; the ultrasonic transducer devices and the flexible conductive structure are connected with the first connecting part and the second connecting part of the main control chip respectively, signal conduction is realized, the main control chip is connected to the system interface module, the overall volume and weight can be reduced, and the size of the main control chip and the ultrasonic transducer devices can be adapted. The multiple ultrasonic transducer devices are integrated, the selection of multiple imaging parameters of one catheter can be realized, the operation time is shortened, the operation cost is reduced, the application range of the system can be expanded, and convenience is provided for integrating more functional modules in the future.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of medical devices, in particular to an ultrasonic imaging system and device. BACKGROUND

[0002] As a fast, non-radiation imaging diagnostic method, ultrasonic imaging has been widely used. Ultrasonic imaging technology has experienced the development of 1D ultrasonic signal, 2D gray image, 3D non-real-time image, and 3D real-time image (i.e. 4D ultrasonic image). Among them, 4D ultrasonic image has the function of real-time reconstruction of 3D model of organ, and can provide doctors with more dimensional diagnostic basis, leading the development direction of next generation ultrasonic imaging technology.

[0003] Among them, 4D intracardiac echocardiography (4D ICE) technology has attracted much attention due to its great application potential in structural heart and interventional electrophysiology. However, the current 4D ICE technology only uses one ultrasonic transducer, so the central frequency, bandwidth and other parameters are limited, and the resolution and imaging depth cannot be flexibly changed. If doctors need different imaging depth and other parameters in actual application, multiple catheters need to be inserted, which directly leads to the prolongation of operation time and the increase of operation cost. SUMMARY

[0004] Therefore, the purpose of the present application is to provide an ultrasonic imaging system and device, which integrates multiple different ultrasonic transducer devices, can realize the selection of multiple imaging parameters of one catheter, shortens the operation time and reduces the operation cost.

[0005] In a first aspect, an ultrasonic imaging system is provided, comprising a system interface module, and an ultrasonic imaging catheter connected with the system interface module; one end of the system interface module is connected with a host computer, and the other end is connected with the ultrasonic imaging catheter; one end of the ultrasonic imaging catheter is connected with the system interface module, and the other end is provided with a sheath assembly; the sheath assembly comprises a sheath and a sheath component connected in sequence, and the sheath component is integrated at one end of the sheath away from the system interface module; the sheath component comprises a master chip, a flexible conductive structure and at least two ultrasonic transducer devices; the master chip comprises a chip body, a first connecting part and a second connecting part, the first connecting part is arranged on the surface of the chip body, and the second connecting part is arranged at the opposite edge position of the package body of the chip body; the number of the first connecting parts is consistent with the number of the ultrasonic transducer devices, and the preset ultrasonic transducer devices are connected to the surface of the chip body through the first connecting parts; the flexible conductive structure is connected with the second connecting part, so as to connect the master chip to the system interface module through the second connecting part; the system interface module is used for transmitting the control signal of the host computer to the master chip, so as to control the running state of the preset ultrasonic transducer devices based on the control signal.

[0006] With reference to the first aspect, in a first implementation of the first aspect, the sheath component further comprises a backing layer; the backing layer is arranged at the end of the main control chip away from the ultrasonic transducer device.

[0007] With reference to the first aspect, in a second implementation of the first aspect, the number of the main control chips is multiple; at least two ultrasonic transducer devices are distributed on the multiple main control chips; the multiple main control chips are connected in the same plane or are arranged in a stack; when the multiple main control chips are arranged in a stack, the backing layer is arranged between the multiple main control chips.

[0008] With reference to the first aspect, in a third implementation of the first aspect, the flexible conductive structure is multiple; a preset ultrasonic transducer device of the at least two ultrasonic transducer devices is close to the system interface module, and another ultrasonic transducer device is close to the end of the sheath; when the multiple main control chips are connected in a stack, the second connection part is arranged at the opposite two side edges of the package of the main control chip; the preset flexible conductive structure is connected with the second connection part corresponding to the ultrasonic transducer device close to the end of the sheath, and is arranged in a bending mode around the edge of the package of the main control chip, and the other end extends in the direction of the system interface module; another flexible conductive structure is connected with the second connection part corresponding to the ultrasonic transducer device close to the system interface module; when the multiple main control chips are arranged in a stack, the second connection part is arranged at the side of the package of the main control chip close to the system interface module; the multiple flexible conductive structures are respectively connected with the second connection part of the corresponding main control chip.

[0009] With reference to the first aspect, in a fourth implementation of the first aspect, the ultrasonic transducer device comprises multiple transducer elements; the multiple transducer elements are arranged in a preset array mode to form a transducer array; the main control chip comprises an element control circuit corresponding to each transducer element, and the main control chip transmits signals to the transducer elements through the element control circuit.

[0010] With reference to the first aspect, in a fifth implementation of the first aspect, the main control chip comprises a time gain compensation circuit; the time gain compensation circuit is arranged on the element control circuit or is arranged on the connection channel between the main control chip and the system interface module.

[0011] With reference to the first aspect, in a sixth implementation of the first aspect, the system interface module comprises a system connector and a first catheter connector connected with the system connector through a cable; the system connector is used to connect with a host computer; and the first catheter connector is used to connect with an ultrasonic imaging catheter.

[0012] With reference to the first aspect, the seventh implementation of the first aspect is provided in the embodiments of the present application, wherein one end of the ultrasonic imaging catheter is provided with a second catheter connector; the second catheter connector is matched with the first catheter connector; and the ultrasonic imaging catheter is connected to the first catheter connector through the second catheter connector.

[0013] With reference to the first aspect, the eighth implementation of the first aspect is provided in the embodiments of the present application, wherein the ultrasonic imaging catheter further comprises a steering structure, the steering structure is arranged at a preset position of the sheath tube, and the steering structure is connected to the second catheter connector through the cable.

[0014] In the second aspect, the embodiments of the present application provide an ultrasonic imaging device, wherein the ultrasonic imaging device is provided with the ultrasonic imaging system in any of the above embodiments.

[0015] The embodiments of the present application have the following beneficial effects: The ultrasonic imaging system and device provided by the embodiments of the present application integrate at least two ultrasonic transducer devices, can expand the application range of the system, and provide convenience for integrating more functional modules in the future. The flexible modular design is realized by the main control chip design corresponding to the number of first connection parts and second connection parts, different numbers of ultrasonic transducer devices can be adapted, and the connection of the flexible transmission structure is supported, which not only reduces the overall volume and weight, but also adapts to the size of the main control chip and the ultrasonic transducer device, and improves the operation flexibility and integration of the ultrasonic imaging system.

[0016] In addition, the path of the signal from the ultrasonic transducer device to the main control chip and then to the flexible transmission structure is short, the signal attenuation and noise interference are reduced, the signal transmission loss is reduced, and the imaging quality is improved. Only the corresponding flexible transmission structure needs to be replaced to replace or upgrade the components, and the maintenance process is simplified. The overall volume of the embodiments of the present application is small, the weight is light, the complex intervention environment can be adapted, the signal transmission mode is convenient, the operation is flexible, and the required ultrasonic transducer device can be flexibly selected according to the demand.

[0017] Other features and advantages of the present application will be described in the following description, and some will become apparent from the description, or will be learned from the practice of the present application. The purposes and other advantages of the present application are realized and obtained by the structures specifically pointed out in the specification, claims, and drawings.

[0018] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are specifically described below, and the accompanying drawings are referred to. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to make the technical solutions in the specific embodiments or prior art of the present application clearer, the accompanying drawings needed in the specific embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those of ordinary skill in the art without any creative effort.

[0020] Figure 1 A structural schematic diagram of an ultrasonic imaging system provided by an embodiment of the present application is shown in FIG. 1.

[0021] Figure 2 A structural schematic diagram of a sheath component provided by an embodiment of the present application is shown in FIG. 2.

[0022] Figure 3 A structural schematic diagram of another sheath component provided by an embodiment of the present application is shown in FIG. 3.

[0023] Figure 4 A structural schematic diagram of another ultrasonic imaging system provided by an embodiment of the present application is shown in FIG. 4.

[0024] Figure 5 A schematic diagram of an array element control circuit provided by an embodiment of the present application is shown in FIG. 5.

[0025] Figure 6 A schematic diagram of another array element control circuit provided by an embodiment of the present application is shown in FIG. 6. DETAILED DESCRIPTION

[0026] In order to make the technical solutions in the specific embodiments or prior art of the present application clearer, the accompanying drawings needed in the specific embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those of ordinary skill in the art without any creative effort.

[0027] An ultrasonic imaging system and device provided by an embodiment of the present application can realize selection of multiple imaging parameters of one catheter, shorten operation time and reduce operation cost.

[0028] In order to make the technical solutions in the specific embodiments or prior art of the present application clearer, the accompanying drawings needed in the specific embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those of ordinary skill in the art without any creative effort. Figure 1 A structural schematic diagram of an ultrasonic imaging system provided by an embodiment of the present application is shown in FIG. 1. Figure 1As shown, the ultrasonic imaging system comprises a system interface module 10, and an ultrasonic imaging catheter 20 connected with the system interface module; one end of the system interface module is connected with a host computer, and the other end is connected with the ultrasonic imaging catheter. In an embodiment, the ultrasonic imaging catheter has a diameter of 12 Fr (4 mm) or less, the system interface module is responsible for signal communication between the catheter and the ultrasonic host computer, and is outside the sterilization area during the operation process and can be reused. The ultrasonic imaging catheter is a core component and is responsible for 4D ultrasonic imaging, and is inside the sterilization area during the operation process and is generally a disposable consumable. The system interface module and the catheter are closely combined in the embodiment of the application, which not only reduces the overall size and complexity of the equipment, but also facilitates quick installation and configuration, making the operation more convenient.

[0029] One end of the ultrasonic imaging catheter is connected with the system interface module, and the other end is provided with a sheath tube assembly; the sheath tube assembly comprises a sheath tube 20 and a sheath tube component 21 connected in sequence, and the sheath tube component is integrated at one end of the sheath tube away from the system interface module; the sheath tube component comprises a master control chip, a flexible conductive structure and at least two ultrasonic transducer devices; the master control chip comprises a chip main body, a first connecting part and a second connecting part, the first connecting part is arranged on the surface of the chip main body, and the second connecting part is arranged at the opposite edge position of the package body of the chip main body. The number of the first connecting part is consistent with the number of the ultrasonic transducer devices, and the preset ultrasonic transducer devices are connected to the surface of the chip main body through the first connecting part; the flexible conductive structure is connected with the second connecting part, so as to connect the master control chip to the system interface module through the second connecting part.

[0030] The master control chip in the prior art is usually a single packaging structure, and the connection mode is simple and fixed. The first connecting part and the second connecting part of the master control chip are arranged for signal transmission in the embodiment of the application, which can reduce signal transmission loss and improve imaging quality. Moreover, the number of ultrasonic transducer devices can be flexibly adjusted according to requirements and can be adapted to different ultrasonic transducer devices through the modular design of the embodiment of the application. In addition, the flexible conductive structure is introduced for signal transmission, which can be directly connected with the second connecting part of the master control chip, and the assembly is quick and convenient, which is helpful for batch production and also helps to improve the yield, improve the adaptability and reliability of the ultrasonic imaging system.

[0031] The system interface module of the embodiment of the present application is used to transmit the control signal of the host to the master control chip, so that the master control chip controls the running state of the preset ultrasonic transducer device based on the control signal. The system interface module, as a key part connecting the host and the ultrasonic imaging catheter, is responsible for transmitting the control signal and data, transmitting the ultrasonic signal received by the ultrasonic transducer device to the host, and realizing the transmission of the control signal of the host to control the running state of the ultrasonic transducer device. The ultrasonic imaging catheter is a flexible catheter body, which provides a flexible channel to allow the internal elements to safely pass through the body cavity to the target position. Its distal end is provided with at least two 4D ICE ultrasonic transducer devices. In an embodiment, the ultrasonic transducer device is composed of a 2D acoustic element array and an ASIC, which can perform real-time 2D, 3D and multi-plane intracardiac imaging. The sheath is an elongated and hollow catheter used in medical procedures, which is usually made of soft and elastic material. The embodiment of the present application protects the device by using the sheath, and integrates the master control chip and the ultrasonic imaging device at the end of the sheath to provide a protection channel for the interventional instrument.

[0032] In the embodiment of the present application, the master control chip is provided with a plurality of ultrasonic transducer devices, each of which can be designed differently, such as selecting different acoustic parameters (such as center frequency, bandwidth, number of array elements, etc.) integrated in the sheath component of the embodiment of the present application, so as to select a specific ultrasonic transducer device for ultrasonic imaging according to the needs. For example, if a high-resolution image with a shallow imaging depth is required, an ultrasonic transducer device with a high center frequency and a wide bandwidth can be used; if a low-resolution image with a deep imaging depth is required, an ultrasonic transducer device with a low center frequency can be used. The parameters of the ultrasonic transducer device compensate for each other.

[0033] In summary, the ultrasonic imaging system provided by the embodiment of the present application can reduce the overall volume and weight by conducting signals to the master control chip through the flexible conducting structure, and can adapt to the size of the master control chip and the ultrasonic transducer device. Not only the operation flexibility of the catheter is improved, but also the components can be replaced or upgraded by only replacing the corresponding flexible conducting structure, simplifying the maintenance process. In the embodiment of the present application, at least two ultrasonic transducer devices are arranged on the surface of the master control chip, and the connection mode of the flexible conducting structure can expand the application range of the system and provide convenience for integrating more functional modules in the future. The embodiment of the present application has small overall volume and light weight, can adapt to complex interventional environment, and the signal conducting mode is convenient and flexible in operation. In addition, the required ultrasonic transducer device can be selected flexibly according to the needs.

[0034] Further, on the basis of the above-mentioned embodiments, the embodiment of the present application further provides another ultrasonic imaging system. In the embodiment of the present application, the number of ultrasonic transducer devices can be two, and correspondingly, the master control chip has enough interfaces (i.e. the first connecting part) to connect and drive each ultrasonic transducer. In addition, a plurality of ultrasonic transducer devices can be selected according to actual requirements and engineering practice, and the number of master control chips (ASIC) can be multiple, and at least two ultrasonic transducer devices are distributed on multiple master control chips, and each master control chip corresponds to a preset ultrasonic transducer device. The multiple master control chips are electrically connected, for example, the multiple master control chips can be connected by wire bonding, or the multiple master control chips can be connected by a flexible circuit board. Among them, the multiple master control chips are spliced and connected on the same plane, or the multiple master control chips are stacked to adapt to different product requirements.

[0035] Further, the sheath component further comprises a backing layer 52, which is arranged on the end face of the master control chip away from the ultrasonic transducer device. The backing layer plays a role in absorbing the reverse propagation of ultrasonic waves. When the multiple master control chips are stacked, the backing layer is arranged between the multiple master control chips. Among them, Figure 3 The corresponding structural diagram for the stacked master control chips, the master control chips can be stacked in two layers, each layer of master control chips is connected with a plurality of corresponding ultrasonic transducer devices, and the backing layer is arranged between the two layers of master control chips. Or, the multiple master control chips can be stacked according to actual needs, and the backing layer supports each layer of master control chips. Or, the multiple master control chips can be stacked according to the needs, and form a three-dimensional structure to meet more use scenarios. Correspondingly, the backing layer is arranged between the multiple master control chips.

[0036] Further, the flexible conductive structure of the embodiment of the present application has multiple; the preset ultrasonic transducer device in the at least two ultrasonic transducer devices is close to the system interface module, and the other ultrasonic transducer device is close to the end of the sheath. Among them, when the multiple master control chips are spliced and connected, the second connecting part is arranged on the opposite two side edges of the package body of the master control chip. The preset flexible conductive structure (referring to Figure 2 , which is indicated as the second flexible conductive structure 23) is connected with the second connecting part corresponding to the ultrasonic transducer device close to the end of the sheath, and is arranged by bending around the edge of the package body of the master control chip, and the other end extends in the direction of the system interface module. The other flexible conductive structure (referring to Figure 2 , which is indicated as the first flexible conductive structure 22) is connected with the second connecting part corresponding to the ultrasonic transducer device close to the system interface module.

[0037] When the multiple master control chips are stacked, the second connecting part is arranged on the side of the package body of the master control chip close to the system interface module. The multiple flexible conductive structures are respectively connected with the second connecting parts of the corresponding master control chips, Figure 3Another structure diagram corresponding to the embodiment of the present application is shown, and the plurality of flexible conductive structures are distinguished as the first flexible conductive structure 22 and the second flexible conductive structure 23. Based on this, the signal of the ultrasonic transducer device can be led out to the second connection part at the side end by the master control chip, and the master control chip structure does not need to be changed even if the number of ultrasonic transducer devices increases. In an implementation manner, the second connection part can be welded by using a reflow soldering process.

[0038] Further, the sheath part further includes passive devices 53, mainly including decoupling capacitors and thermistors, etc. Figure 2 A structure diagram of the sheath part is shown, and the first flexible conductive structure is shown in detail in the structure diagram. Figure 2 In the embodiment of the present application, the passive devices are installed on the first flexible conductive structure.

[0039] Figure 4 Another structure diagram of the ultrasonic imaging system provided by the embodiment of the present application is shown, and the structure of the ultrasonic imaging system is the same as that of the ultrasonic transducer device shown in the structure diagram of the ultrasonic transducer device. Figure 1 In addition to the structure of the ultrasonic transducer device, Figure 4 The ultrasonic imaging system further includes a system connector 11, a first catheter connector 31, a second catheter connector 32, and a manipulation structure 40. Figure 2 The system interface module includes the system connector, and the first catheter connector connected to the system connector through a cable; the system connector is used for connecting with a host computer; and the first catheter connector is used for connecting with an ultrasonic imaging catheter. Further, one end of the ultrasonic imaging catheter is provided with the second catheter connector; the second catheter connector is matched with the first catheter connector; and the ultrasonic imaging catheter is connected to the first catheter connector through the second catheter connector.

[0040] The embodiment of the present application is connected with the preset host computer through the system connector, and on the physical level, the socket of the system connector is directly connected with the socket of the host computer, playing a double role of electrical connection and mechanical fixation. The circuit can be placed in the system connector, realizing functions such as harmonic circuit, low-voltage power supply module, digital signal level conversion, storage of catheter ID, etc. The low-voltage power supply module is responsible for further voltage division and voltage stabilization of the low-voltage power supply provided by the ultrasonic host computer system. In actual use, due to different design requirements of the internal chip of the catheter, multiple different low-voltage power supplies may be needed. However, the host computer generally only provides 1 to 2 low-voltage power supplies, so multiple low-voltage power supplies need to be generated in the system connector. At the same time, in order to further compensate for the cable voltage drop caused by the cable, the low-voltage power supply module also provides a cable voltage drop compensation function. Further, the system connector and the ultrasonic imaging catheter are connected by using the matched two catheter connectors, and the two catheter connectors are docked to realize electrical and mechanical connection. Generally, an EEPROM is integrated into the catheter connector as a catheter identifier. According to the need, a digital circuit buffer can be arranged in the catheter connector to buffer the attenuation of the digital signal caused by the length of the cable.

[0041] The sheath assembly of the embodiment of the present application further comprises a steering structure 40 arranged at a preset position of the sheath, and a sheath component is integrated at an end of the sheath away from the steering structure. In the embodiment of the present application, the steering structure (such as a handle) is used to control the bending of the sheath, and the bending direction and degree of the distal end of the sheath can be conveniently controlled by the doctor during operation. In an embodiment, the steering structure comprises two rotating wheels to pull four traction ropes to realize the bending function of the sheath. In the steering structure, a knob and a bending knob can be arranged to allow the catheter to deflect left and right and rotate 360° to adapt to different surgical requirements. The sheath is used for entering a blood vessel and plays a role of mechanically connecting the steering structure and the distal end of the sheath (i.e. the sheath component), and also has a role of protecting internal electrical connection. Generally, the sheath wall is pulled by four traction guide wires to realize four-way bending of the distal end of the sheath.

[0042] In a specific implementation, the ultrasonic transducer device comprises a plurality of transducer elements arranged in a preset array to form a transducer array. The ultrasonic transducer device can be a common 1D linear array, and can also comprise ultrasonic transducers of various materials such as PZT, CMUT, or PMUT. The master control chip (ASIC) comprises an element control circuit corresponding to each transducer element, and each transducer element is connected to the master control chip through a flexible circuit board. In a specific implementation, the master control chip is used for transmission, reception, and time delay control, and each transducer element corresponds to a transmission, reception, and time delay circuit to realize independent control of the transducer element.

[0043] In the embodiment of the present application, for each element in the transducer array, there is a set of high-voltage pulse generators, high-voltage switches, amplifiers, TGCs, and corresponding control circuits. In this way, it is ensured that a single element can be independently controlled by the ultrasonic host. Correspondingly, the control end of the control circuit corresponds to the first connection part, and the second connection part and the signal receiving and transmitting end of the master control chip correspond. The master control chip controls the transmission period, frequency, amplitude, time delay, etc. of each transducer element of the ultrasonic transducer device according to the control signal provided by the ultrasonic system host. When receiving ultrasonic waves, the return signals of a plurality of elements are amplified and delayed according to the time delay signal provided by the ultrasonic system host and are superimposed and transmitted to the system host channel. Specifically, Figure 5 、 Figure 6The schematic diagrams of the array element control circuit are shown respectively. As shown in the diagrams, the HV Pulser generates a high-voltage pulse signal for driving the ultrasonic transducer to emit ultrasonic waves, and the TR Switch is used for switching the transmission and reception modes. In the transmission mode, it transmits the high-voltage pulse signal to the ultrasonic transducer; in the reception mode, it transmits the weak signal received by the ultrasonic transducer to the subsequent circuit. The LNA is a low-noise amplifier used for amplifying the weak signal received by the transducer while maintaining a low noise level. The SH Delay is a sample-and-hold circuit used for sampling the signal at a specific time point and maintaining the value for a period of time for subsequent processing. The Σ is an analog addition used for adding the signals, and the SH Delay in front constitutes an analog time delay addition circuit. The Cable Driver is used for driving the signal transmission in the cable to ensure that the signal is not distorted during long-distance transmission. Further, the sheath component also includes a time gain compensation circuit used for adjusting the gain of the echo signal at different depths to compensate for the energy attenuation of the ultrasonic wave during propagation in the medium. Referring to Figure 6 , the time gain compensation circuit is arranged on the array element control circuit to perform TGC compensation amplification for each array element. Alternatively, referring to Figure 5 , the time gain compensation circuit is arranged on the connection channel of the master control chip and the system interface module to ensure that the received signal of each channel can be timely and accurately adjusted in gain, thereby improving the response speed and accuracy of the entire system.

[0044] Further, on the basis of the above-mentioned embodiments, the embodiment of the present application also provides an ultrasonic imaging device, which includes the ultrasonic imaging system of any one of the above-mentioned embodiments. The ultrasonic imaging device provided by the embodiment of the present application has the same implementation principle and technical effects as the above-mentioned ultrasonic imaging system embodiments. For brevity, the part of the ultrasonic imaging device embodiment not mentioned can be referred to the corresponding content in the above-mentioned ultrasonic imaging system embodiments.

[0045] Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, but not to limit the present application, the protection scope of the present application is not limited to this, although the present application has been described in detail with reference to the above-mentioned embodiments, those skilled in the art should understand that any person skilled in the art within the technical range disclosed by the present application can still modify or easily think of changes to the technical solutions recorded in the above-mentioned embodiments, or make equivalent replacement to part of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and all should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An ultrasound imaging system, characterized by, The system interface module is connected with a host computer and an ultrasonic imaging catheter; one end of the system interface module is connected with the host computer, and the other end is connected with the ultrasonic imaging catheter; one end of the ultrasonic imaging catheter is connected with the system interface module, and the other end is provided with a sheath tube assembly; The sheath tube assembly comprises a sheath tube and a sheath tube component connected in sequence, and the sheath tube component is integrated at one end of the sheath tube away from the system interface module; the sheath tube component comprises a master control chip, a flexible conductive structure and at least two ultrasonic transducer devices; the master control chip comprises a chip main body, a first connecting part and a second connecting part, the first connecting part is arranged on the surface of the chip main body, and the second connecting part is arranged at the opposite edge position of the package body of the chip main body; The number of the first connecting part is consistent with the number of the ultrasonic transducer devices, and the preset ultrasonic transducer devices are connected to the surface of the chip main body through the first connecting part; the flexible conductive structure is connected with the second connecting part, so as to connect the master control chip to the system interface module through the second connecting part; The system interface module is used for transmitting the control signal of the host computer to the master control chip, so that the master control chip controls the running state of the preset ultrasonic transducer device based on the control signal.

2. The ultrasound imaging system of claim 1, wherein, The sheath tube component further comprises a backing layer; the backing layer is arranged at the end face of the master control chip away from the ultrasonic transducer device.

3. The ultrasound imaging system of claim 2, wherein, The number of the master control chip is multiple; at least two ultrasonic transducer devices are distributed on multiple master control chips; The multiple master control chips are spliced and connected in the same plane, or the multiple master control chips are arranged in a stacked mode; when the multiple master control chips are arranged in a stacked mode, the backing layer is arranged between the multiple master control chips.

4. The ultrasound imaging system of claim 3, wherein, The flexible conductive structure has multiple; the preset ultrasonic transducer device in the at least two ultrasonic transducer devices is close to the system interface module, and the other ultrasonic transducer device is close to the end of the sheath tube; When the multiple master control chips are spliced and connected, the second connecting part is arranged at the opposite two side edges of the package body of the master control chip; the preset flexible conductive structure is connected with the second connecting part corresponding to the ultrasonic transducer device close to the end of the sheath tube, and is arranged in a bent mode around the edge of the package body of the master control chip, and the other end extends to the direction of the system interface module; the other flexible conductive structure is connected with the second connecting part corresponding to the ultrasonic transducer device close to the system interface module; When the multiple master control chips are arranged in a stacked mode, the second connecting part is arranged at the side of the package body of the master control chip close to the system interface module; the multiple flexible conductive structures are respectively connected with the second connecting parts of the corresponding master control chips.

5. The ultrasound imaging system of claim 1, wherein, The ultrasonic transducer device comprises multiple transducer array elements; the multiple transducer array elements are arranged in a preset array mode to form a transducer array; The master control chip comprises an array element control circuit corresponding to each transducer array element, and the master control chip transmits signals to the transducer array element through the array element control circuit.

6. The ultrasound imaging system of claim 5, wherein, The main control chip comprises a time gain compensation circuit, which is arranged on the array element control circuit, or arranged on a connection channel of the main control chip and the system interface module.

7. The ultrasound imaging system of claim 1, wherein, The system interface module comprises a system connector, and a first catheter connector connected with the system connector through a cable; The system connector is used for connecting with the host computer; The first catheter connector is used for connecting with the ultrasonic imaging catheter.

8. The ultrasound imaging system of claim 7, wherein, One end of the ultrasonic imaging catheter is provided with a second catheter connector, which is matched with the first catheter connector; The ultrasonic imaging catheter is connected to the first catheter connector through the second catheter connector.

9. The ultrasound imaging system of claim 8, wherein, The ultrasonic imaging catheter further comprises a steering structure, which is arranged at the preset position of the sheath tube, and the steering structure is connected with the second catheter connector through a cable.

10. An ultrasound imaging device, characterized by The device comprises the ultrasonic imaging system of any one of claims 1-9.

Citation Information

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