Buffer device

Abstract

The invention discloses a buffer device which comprises an instrument supporting seat and an instrument mounting seat which are arranged in parallel, a plurality of buffer modules are arranged between the instrument supporting seat and the instrument mounting seat, and the plurality of buffer modules are connected in series and / or in parallel; the buffer module comprises a flexible buffer assembly and an energy absorption assembly, the flexible buffer assembly is used for storing impact energy, and the energy absorption assembly is used for dissipating the impact energy; the compliant buffering assembly comprises an upper rigid body, a lower rigid body and a compliant mechanism connected between the upper rigid body and the lower rigid body, the upper rigid body is used for being connected with the instrument mounting base or the lower rigid body of the adjacent buffering module, and the lower rigid body is used for being connected with the instrument supporting base or the upper rigid body of the adjacent buffering module. The buffer device has the advantages of being simple and compact in structure, high in reset precision, convenient to machine, disassemble and assemble and high in applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of buffer and shock absorption equipment, and particularly to a buffer device. Background Art

[0002] During the launch process of an aircraft, the high-pressure gas in the chamber drives the aircraft to accelerate forward. At the same time, the high-pressure gas also acts on the bottom of the aircraft to drive the aircraft to accelerate backward - that is, the recoil movement, which generates a force on the aircraft support body. This is the recoil force generated by the aircraft during the launch process. If no intervention is applied to the recoil force of the aircraft, the excessive recoil force may damage the aircraft support body (such as connecting shafts, bearings, aircraft brackets, or motors and reducers of the electromechanical system), causing it to lose the support effect and further resulting in the loss of combat effectiveness of the aircraft. Therefore, by installing a buffer device between the aircraft and its support body, the recoil force transmitted to the aircraft support body can be reduced and delayed, achieving the effect of protecting the aircraft support body.

[0003] Currently, springs or compliant mechanisms are usually used as the main body of the buffer device. The buffer device with a spring as the main body has many components and a complex structure. Specifically, it includes main structural components such as guide rods, tightening bolts, support body fixing seats, recoil device mounting seats, pin shafts, and copper rings. During the buffering process, guide rods, slide rails, etc. are relied on to reduce the guiding deviation. Due to factors such as friction and assembly clearances, the reset accuracy cannot be effectively guaranteed.

[0004] For the buffer device with a compliant mechanism as the main body, in order to meet the load-bearing requirements or the pointing accuracy requirements of the buffer device, the existing buffer devices based on compliant mechanisms rely on the series and parallel connection of a large number of compliant straight beams. During design, they are integrated with the device mounting rocker. The volume and mass of the buffer device are relatively large, and it is not convenient to adjust the stiffness and stroke of the buffer device, resulting in poor applicability. Moreover, the recoil impact energy is dissipated by the friction of the guiding slider or an external hydraulic damper, which increases the weight of the equipment and is not conducive to the overall integrated design of the device, increasing the volume and weight of the buffer device and unable to meet the lightweight requirements. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a buffer device with a simple, compact structure, high reset accuracy, convenient for processing, disassembly and assembly, and strong applicability.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A buffer device includes a device support seat and a device mounting seat arranged in parallel, and a plurality of buffer modules are provided between the device support seat and the device mounting seat, and the plurality of buffer modules are connected in series and / or in parallel;

[0008] The buffer module includes a compliant buffer component and an energy absorption component. The compliant buffer component is used to store impact energy, and the energy absorption component is used to dissipate impact energy.

[0009] The compliant buffer component includes an upper rigid body, a lower rigid body, and a compliant mechanism connected between the upper rigid body and the lower rigid body. The upper rigid body is used to be connected to the instrument mounting seat or the lower rigid body of an adjacent buffer module, and the lower rigid body is used to be connected to the instrument support seat or the upper rigid body of an adjacent buffer module.

[0010] As a further improvement of the above technical solution:

[0011] The energy absorption component includes an energy absorption member made of a viscoelastic material.

[0012] The compliant mechanism includes a plurality of compliant beams, and a buffer space is formed between the plurality of compliant beams. The energy absorption member is filled in the buffer space.

[0013] The compliant beams are respectively arranged on both sides of the upper rigid body and the lower rigid body. The compliant beam on the side of the upper rigid body is connected to the corresponding compliant beam on the side of the lower rigid body. The buffer space is enclosed by each compliant beam, the upper rigid body, and the lower rigid body.

[0014] Threaded holes are provided on both the upper rigid body and the lower rigid body.

[0015] A plurality of buffer modules are provided. The lower rigid body of one buffer module is connected to the upper rigid body of an adjacent buffer module to connect a plurality of buffer modules in series. The upper rigid body of the first buffer module is connected to the instrument mounting seat, and the lower rigid body of the last buffer module is connected to the instrument support seat.

[0016] A plurality of buffer modules are provided. The plurality of buffer modules are arranged at intervals. The upper rigid body of each buffer module is connected to the instrument support seat, and the lower rigid body is connected to the instrument mounting seat to connect a plurality of buffer modules in parallel.

[0017] The connecting direction of the upper rigid body and the lower rigid body is perpendicular to the plane where the instrument support seat is located.

[0018] The connecting direction of the upper rigid body and the lower rigid body is parallel to the plane where the instrument support seat is located.

[0019] An installation groove is provided on the instrument support seat, and the buffer module is embedded in the installation groove.

[0020] Compared with the prior art, the advantages of the present invention are as follows:

[0021] The buffer device of the present invention stores and dissipates impact energy through a compliant buffer component and an energy absorption component. Compared with the technical solution that uses a spring as the main body for buffering, it has fewer components, a simple and compact structure, low cost, no gaps and friction, and high reset accuracy. By connecting the upper rigid body of the buffer module to the lower rigid body of the adjacent buffer module, multiple buffer modules can be serially combined, with a high degree of modularization and convenient processing. Through the modular combination method, the combination and disassembly are simple, facilitating installation and disassembly. Different numbers of buffer modules can be serially connected according to requirements. Compared with the technical solution of buffering with a single buffer module, the stiffness is reduced and the stroke is increased, capable of meeting the buffering requirements in more application scenarios and having strong applicability.

[0022] In the buffer device of the present invention, the energy absorption member is made of a viscoelastic material. When the compliant mechanism deforms, the impact energy is conducted to the energy absorption member through the compliant mechanism. Due to the damping characteristics of the viscoelastic material, the energy absorption member generates compression, tension, and shear deformations to consume the impact energy, and the dissipation of the impact energy can be achieved without an external damper, with a simple and compact structure and a reduced volume of the buffer device.

[0023] In the buffer device of the present invention, during buffering, the compliant beam deforms, driving the deformation of the buffer space, thereby causing the energy absorption member in the buffer space to generate compression, tension, and shear deformations for buffering. The energy absorption member is filled in the buffer space, which can make full use of the space between the compliant beams. And because the energy absorption member fills the buffer space, the damping effect of the energy absorption member can be enhanced, and the energy absorption member can more easily generate compression, tension, and shear deformations, making it easier to consume the impact energy and achieving a better buffering effect.

[0024] In the buffer device of the present invention, by connecting each buffer module separately to the instrument support seat and the instrument mounting seat, the parallel connection of multiple buffer modules can be achieved. The parallel connection process is simple and reliable. Compared with the technical solution of buffering with a single buffer module, the stiffness is increased and the stroke remains unchanged, capable of meeting the buffering requirements in more application scenarios and having strong applicability.

[0025] In the buffer device of the present invention, through different parallel connection methods of each buffer module, the impact forces in different directions on the instrument mounting frame can be dealt with, with strong adaptability.

[0026] In the buffer device of the present invention, multiple buffer modules can also be combined in a way that combines series and parallel connections, that is, multiple groups of buffer module groups are connected in parallel, and each group of buffer module groups is composed of multiple buffer modules connected in series, so as to achieve the combined combination of series and parallel connections of multiple buffer modules, with even stronger applicability. Description of the Drawings

[0027] Figure 1 It is a schematic structural diagram of the buffer module in the buffer device of the present invention.

[0028] Figure 2It is the front view of the buffer module in the buffer device of the present invention.

[0029] Figure 3 It is the structural schematic diagram of the compliant buffer component in the buffer device of the present invention.

[0030] Figure 4 It is the schematic diagram when the compliant buffer component generates different deformations in the present invention.

[0031] Figure 5 It is the structural schematic diagram of the energy absorption component in the buffer device of the present invention.

[0032] Figure 6 It is the structural schematic diagram of the buffer device in the first embodiment of the present invention.

[0033] Figure 7 It is the structural schematic diagram of the buffer device in the second embodiment of the present invention.

[0034] Figure 8 It is the structural schematic diagram of the buffer device in the third embodiment of the present invention.

[0035] Figure 9 It is the structural schematic diagram of the buffer device in the fourth embodiment of the present invention.

[0036] In the figure, each reference numeral represents: 1. Compliant buffer component; 11. Upper rigid body; 111. Threaded hole; 12. Lower rigid body; 13. Compliant mechanism; 131. Compliant beam; 14. Buffer space; 2. Energy absorption component; 3. Instrument support seat; 31. Installation groove; 4. Instrument mounting seat; 5. Connecting plate. Detailed implementation manners

[0037] The following will further elaborate on the present invention in detail in conjunction with the accompanying drawings of the specification and specific embodiments.

[0038] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0040] In the present invention, unless otherwise clearly specified and defined, terms such as "assembly", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] Embodiment 1:

[0042] Figures 1 to 6 An embodiment of the buffer device of the present invention is shown. The buffer device of this embodiment includes an instrument support base 3 and an instrument mounting base 4 arranged in parallel. A plurality of buffer modules are provided between the instrument support base 3 and the instrument mounting base 4, and the plurality of buffer modules are connected in series;

[0043] The buffer module includes a compliant buffer component 1 and an energy absorption component 2. The compliant buffer component 1 is used to store impact energy, and the energy absorption component 2 is used to dissipate impact energy;

[0044] The compliant buffer component 1 includes an upper rigid body 11, a lower rigid body 12, and a compliant mechanism 13 connected between the upper rigid body 11 and the lower rigid body 12. The upper rigid body 11 is used to connect to the instrument mounting base 4 or the lower rigid body 12 of an adjacent buffer module, and the lower rigid body 12 is used to connect to the instrument support base 3 or the upper rigid body 11 of an adjacent buffer module.

[0045] In the buffer device of this embodiment, the instrument is installed on the instrument mounting base 4. The instrument support base 3 is connected to the device support body. A plurality of buffer modules are connected in series between the instrument support base 3 and the instrument mounting base 4. During buffering, when the instrument generates an impact, the impact energy of the instrument is transmitted to the compliant buffer assembly 1 of the buffer module. The upper rigid body 11 and the lower rigid body 12 perform relative movement through the deformed compliant mechanism 13, and the impact energy is stored by using the deformation of the compliant mechanism 13. Then, the impact energy stored in the compliant mechanism 13 is dissipated by the energy absorption assembly 2 to achieve buffering. The impact force after buffering is then transmitted to the instrument support body through the instrument support base 3. In the buffer device of this embodiment, the impact energy is stored and dissipated by the compliant buffer assembly 1 and the energy absorption assembly 2. Compared with the technical solution that uses a spring as the main body for buffering, it has fewer components, a simple and compact structure, low cost, no gaps and friction, and high reset accuracy. By connecting the upper rigid body 11 of the buffer module to the lower rigid body 12 of the adjacent buffer module, multiple buffer modules can be connected in series. The modularity is high and it is convenient for processing. Through the modular combination method, the combination and decomposition are simple, which is convenient for disassembly and assembly. Different numbers of buffer modules can be connected in series according to requirements. Compared with the technical solution of buffering with a single buffer module, the stiffness is reduced and the stroke is increased, which can meet the buffering requirements in more application scenarios and has strong applicability.

[0046] Further, as Figure 6 shown, in this embodiment, there are two buffer modules. The lower rigid body 12 of the buffer module is connected to the upper rigid body 11 of the adjacent buffer module to connect two buffer modules in series. The upper rigid body 11 of the first buffer module is connected to the instrument mounting base 4, and the lower rigid body 12 of the last buffer module is connected to the instrument support base 3. By connecting the lower rigid body 12 of the buffer module to the upper rigid body 11 of the adjacent buffer module, the series connection of two buffer modules is realized, and the series connection process is simple and reliable. The buffer device composed of two buffer modules connected in series has a stiffness that is 0.5 times that of a single buffer module and a stroke that is 2 times that of a single buffer module. Of course, in other embodiments, more buffer modules can be connected in series in the way of this embodiment, and the applicable range is wider.

[0047] Further, in this embodiment, the energy absorption assembly 2 includes an energy absorption component, and the energy absorption component is made of a viscoelastic material (such as rubber, elastic clay or polymer gel, etc.). When the compliant mechanism 13 deforms, the impact energy is transmitted to the energy absorption component through the compliant mechanism 13. Due to the damping characteristics of the viscoelastic material, the energy absorption component generates compression, tension and shear deformations to consume the impact energy, and the dissipation of the impact energy can be realized without an external damper. The structure is simple and compact, and the volume of the buffer device is reduced.

[0048] Further, as Figure 3As shown, in this embodiment, the compliant mechanism 13 includes multiple compliant beams 131. A buffer space 14 is formed between the multiple compliant beams 131, and an energy absorption member is filled in the buffer space 14. During buffering, the compliant beams 131 deform, driving the deformation of the buffer space 14, so that the energy absorption member in the buffer space 14 undergoes compression, tension, and shear deformation for buffering; the energy absorption member is filled in the buffer space 14, which can make full use of the space between the compliant beams 131. And since the energy absorption member fills the buffer space 14, the damping effect of the energy absorption member can be enhanced. The energy absorption member can more easily undergo compression, tension, and shear deformation, and the impact energy can be consumed more easily, resulting in a better buffering effect.

[0049] Preferably, in this embodiment, the compliant beam 131 is a rectangular compliant beam. Of course, in other embodiments, it can also be a curved compliant beam. By changing the material and geometric parameters of the compliant beam 131, the stiffness of the compliant beam 131 can be adjusted, and further, the precise design of the stiffness of the compliant buffer assembly 1 can be achieved.

[0050] Furthermore, in this embodiment, compliant beams 131 are respectively provided on both sides of the upper rigid body 11 and the lower rigid body 12. The compliant beam 131 on the side of the upper rigid body 11 is connected to the corresponding compliant beam 131 on the side of the lower rigid body 12. The buffer space 14 is formed by enclosing each compliant beam 131, the upper rigid body 11, and the lower rigid body 12. There are four compliant beams 131, two compliant beams 131 are provided on both sides of the upper rigid body 11, and the other two compliant beams 131 are provided on both sides of the lower rigid body 12. The compliant beam 131 on the left side of the upper rigid body 11 is connected to the compliant beam 131 on the left side of the lower rigid body 12, and the compliant beam 131 on the right side of the upper rigid body 11 is connected to the compliant beam 131 on the right side of the lower rigid body 12. That is, the upper rigid body 11 and the compliant beams 131 on both sides thereof form a symmetric structure with the lower rigid body 12 and the compliant beams 131 on both sides thereof. The four compliant beams 131, the upper rigid body 11, and the lower rigid body 12 form a parallelogram frame, and the space inside the parallelogram frame is the buffer space 14, with a simple and compact structure.

[0051] In this embodiment, the compliant buffer assembly 1 (the four compliant beams 131, the upper rigid body 11, and the lower rigid body 12) is integrally processed by wire cutting, with high cutting accuracy, which can improve the consistency of each buffer module.

[0052] Furthermore, in this embodiment, threaded holes 111 are provided on both the upper rigid body 11 and the lower rigid body 12. Between the upper rigid body 11 and the lower rigid body 12, between the upper rigid body 11 and the instrument mounting seat 4, and between the lower rigid body 12 and the instrument support seat 3, threaded connections can be used. The structure is simple, the fixation is reliable, and it is easy to disassemble and assemble, facilitating the modular combination of the buffer modules. Of course, in other embodiments, detachable connection methods such as snap connection and key and pin connection can also be selected. Specifically, the upper rigid body 11 and the lower rigid body 12 are connected by a connecting plate 5, with a simple and reliable structure.

[0053] Example Two:

[0054] Figure 7 The second embodiment of the buffer device of the present invention is shown. The buffer device in this embodiment is basically the same in structure as the buffer device in the first embodiment, and the differences include:

[0055] In this embodiment, multiple buffer modules are connected in parallel. There are two buffer modules, which are arranged at intervals. The upper rigid body 11 of each buffer module is connected to the instrument support seat 3, and the lower rigid body 12 is connected to the instrument mounting seat 4 to connect multiple buffer modules in parallel. By connecting each buffer module separately to the instrument support seat 3 and the instrument mounting seat 4, the parallel connection of multiple buffer modules can be achieved. The parallel connection process is simple and reliable. Compared with the technical solution of using a single buffer module for buffering, the stiffness increases and the stroke remains unchanged, which can meet the buffering requirements in more application scenarios and has strong applicability. The buffer device composed of two buffer modules connected in parallel has a stiffness twice that of a single buffer module and a stroke 1 time that of a single buffer module. Of course, in other embodiments, more buffer modules can be connected in parallel in the way of this embodiment, and the applicable range is wider.

[0056] In this embodiment, the connecting line direction of the upper rigid body 11 and the lower rigid body 12 is parallel to the plane where the instrument support seat 3 is located, that is, each buffer module is "connected in parallel in an opposing manner", which can buffer the impact force in the horizontal direction borne by the instrument mounting frame 4.

[0057] Furthermore, in this embodiment, an installation groove 31 is provided on the instrument support seat 3, and the buffer module is embedded in the installation groove 31. Embedding the buffer module in the installation groove 31 can further reduce the volume of the buffer device and make the structure more compact.

[0058] Example Three:

[0059] Figure 8 The third embodiment of the buffer device of the present invention is shown. The buffer device in this embodiment is basically the same in structure as the buffer device in the second embodiment, and the differences include:

[0060] In this embodiment, there are four buffer modules, which are arranged at intervals. The upper rigid body 11 of each buffer module is connected to the instrument support seat 3, and the lower rigid body 12 is connected to the instrument mounting seat 4. Specifically, two buffer modules are in a group and are respectively arranged at both ends of the instrument support seat 3. The buffer device composed of four buffer modules connected in parallel has a stiffness four times that of a single buffer module and a stroke 1 time that of a single buffer module.

[0061] Example Four:

[0062] Figure 9The fourth embodiment of the buffer device of the present invention is shown. The structure of the buffer device in this embodiment is basically the same as that of the buffer device in the second embodiment, and the differences include:

[0063] In this embodiment, the connection direction of the upper rigid body 11 and the lower rigid body 12 is perpendicular to the plane where the instrument support base 3 is located, that is, each buffer module is "vertically connected in parallel", and the impact force in the vertical direction borne by the instrument mounting rack 4 can be buffered. By different parallel connection methods of each buffer module, the impact forces in different directions on the instrument mounting rack 4 can be coped with, and the adaptability is strong.

[0064] In other embodiments, a combination of series and parallel connections can also be used to combine multiple buffer modules, that is, multiple groups of buffer module groups are connected in parallel in the manner of the second embodiment or the fourth embodiment, and each group of buffer module groups is connected in series with multiple buffer modules in the manner of the first embodiment, so as to realize the combined combination of series and parallel connections of multiple buffer modules, and the applicability is stronger.

[0065] The above are only the preferred embodiments of the present invention and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above, or modify it into an equivalent embodiment with equivalent changes. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A buffer device, characterized in that: It comprises an instrument support seat (3) and an instrument mounting seat (4) arranged in parallel, a plurality of buffer modules are arranged between the instrument support seat (3) and the instrument mounting seat (4), and the plurality of buffer modules are connected in series and / or in parallel; The buffer module comprises a compliant buffer component (1) and an energy absorption component (2), wherein the compliant buffer component (1) is used to store impact energy, and the energy absorption component (2) is used to dissipate impact energy; The compliant buffer component (1) comprises an upper rigid body (11), a lower rigid body (12), and a compliant mechanism (13) connected between the upper rigid body (11) and the lower rigid body (12); the upper rigid body (11) is used to be connected to an instrument mounting seat (4) or the lower rigid body (12) of an adjacent buffer module; and the lower rigid body (12) is used to be connected to an instrument support seat (3) or the upper rigid body (11) of an adjacent buffer module.

2. The buffer device according to claim 1, characterized in that: The energy absorbing component (2) comprises an energy absorbing member, and the energy absorbing member is made of viscoelastic material.

3. The buffer device according to claim 2, characterized in that: The compliant mechanism (13) comprises a plurality of compliant beams (131), a buffer space (14) is formed between the plurality of compliant beams (131), and the energy absorbing member is filled in the buffer space (14).

4. The buffer device according to claim 3, characterized in that: The flexible beams (131) are respectively provided on both sides of the upper rigid body (11) and the lower rigid body (12); the flexible beams (131) on the sides of the upper rigid body (11) are connected to the flexible beams (131) on the corresponding sides of the lower rigid body (12); and the buffer space (14) is formed by enclosing the flexible beams (131), the upper rigid body (11) and the lower rigid body (12).

5. The buffer device according to claim 1, characterized in that: The upper rigid body (11) and the lower rigid body (12) are both provided with threaded holes (111).

6. The buffer device according to any one of claims 1 to 5, characterized in that: The buffer modules are provided in plurality, wherein the lower rigid body (12) of the buffer module is connected to the upper rigid body (11) of an adjacent buffer module to connect the plurality of buffer modules in series, the upper rigid body (11) of the first buffer module is connected to the instrument mounting seat (4), and the lower rigid body (12) of the last buffer module is connected to the instrument supporting seat (3).

7. The buffer device according to any one of claims 1 to 5, characterized in that: The buffer modules are provided in plurality and are arranged at intervals. The upper rigid body (11) of each buffer module is connected to the instrument support seat (3), and the lower rigid body (12) is connected to the instrument mounting seat (4) so ​​as to connect the plurality of buffer modules in parallel.

8. The buffer device according to claim 7, characterized in that: The direction of the connection line between the upper rigid body (11) and the lower rigid body (12) is perpendicular to the plane where the instrument support seat (3) is located.

9. The buffer device according to claim 7, characterized in that: The direction of the connection line between the upper rigid body (11) and the lower rigid body (12) is parallel to the plane where the instrument support seat (3) is located.

10. The buffer device according to claim 7, characterized in that: The instrument support seat (3) is provided with a mounting groove (31), and the buffer module is embedded in the mounting groove (31).

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