Non-contact mobility microwave radio frequency test waveguide probe assembly
By designing a waveguide probe assembly with an elliptical through-hole in a contactless mobility Hall measuring instrument, the existing instruments have narrow signal bandwidth, low transmission efficiency and susceptibility to interference, achieving more efficient signal transmission and more stable measurement data.
Patent Information
- Application Number
- CN202311713956.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-13
- Publication Date
- 2025-06-13
AI Technical Summary
The performance of existing contactless mobility Hall measuring instruments cannot meet the measurement needs of semiconductor materials development. The signal bandwidth is narrow, the transmission efficiency is low, the susceptible to external interference, and the test data is poor in stability and consistency.
A contactless mobility microwave RF test waveguide probe assembly is designed, using a waveguide transceiver, waveguide and waveguide probe mechanism, and an elliptical through-hole is installed inside the probe to improve signal transmission efficiency and anti-interference ability.
Through the design of the elliptical through hole, the transmission efficiency of microwave radio frequency signals is improved, signal loss is reduced, signal radiation area is increased, external interference is reduced, and the stability and linearization of measurement data is improved, and more abundant measurement data is obtained.
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Figure CN120142335A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a waveguide probe, and more particularly to a non-contact mobility microwave radio frequency test waveguide probe assembly. Background Art
[0002] At present, the measurement of the mobility (Hall) of semiconductor materials mainly uses the Van der Pauw method. This technology is a contact measurement, and its disadvantages are mainly that the sample needs to be cleaved, the test cycle is long, and the electron concentration and mobility in the channel cannot be given for thick capping layer samples. The damage to the surface of the sample and metal deposition, as well as the loss of the probe and effective maintenance, have a great impact on the measurement accuracy. Therefore, non-contact mobility (Hall) measurement has been widely popular; at present, non-contact mobility (Hall) measuring instruments (LEIs) are mainly imported, but their performance cannot meet the measurement needs of the current development of semiconductor materials. Their signal bandwidth is narrow, the transmission efficiency is low, the gain of the near field of the signal is weak, the signal radiation surface is narrow, and it is easily affected by external interference. The stability and consistency of the test data are poor, and there are large differences in the results when the same measured part is measured with different instruments, which brings a lot of inconvenience to material testing, experiments and quality control. Summary of the Invention
[0003] The purpose of the present invention is to provide a non-contact mobility microwave radio frequency test waveguide probe assembly to solve the problems raised in the above background art.
[0004] To achieve the above object, one of the objects of the present invention is to provide a non-contact mobility microwave radio frequency test waveguide probe assembly, including a waveguide transceiver. One end of the waveguide transceiver is fixedly connected to a waveguide through a screw. A waveguide probe mechanism is installed on the waveguide. A connection port is opened on the side wall of the waveguide away from the waveguide transceiver, and the connection port is communicated with the inside of the waveguide.
[0005] The waveguide probe mechanism includes a base housing. An installation cavity is opened on one side of the base housing. The shape of the installation cavity is adapted to that of the waveguide, and the waveguide is installed in the installation cavity.
[0006] A placement port is opened on the side of the base housing away from the installation cavity. The installation cavity is communicated with the placement port. A probe is inserted in the placement port. An oval through hole is opened inside the probe. One end of the probe is inserted into the placement port, and the oval through hole is communicated with the connection port.
[0007] As a further improvement of this technical solution, an installation head is fixed on the side wall of the base housing away from the installation cavity. The placement port penetrates through the installation head and extends out. A positioning disk is provided at one end of the probe away from the installation cavity, and the positioning disk is fixed on the installation head through a screw.
[0008] As a further improvement of the technical solution, a Hall signal acquisition component is installed on the waveguide probe mechanism.
[0009] As a further improvement of the technical solution, mounting openings are formed on one side of the mounting head and the side wall of the probe, and one end of the Hall signal acquisition component is inserted into the elliptical through hole of the probe through the mounting opening.
[0010] As a further improvement of the technical solution, a base cover plate is arranged on one side of the installation cavity. The base cover plate is connected to the side wall of the base housing close to the installation cavity by screws, and the base cover plate clamps and fixes the waveguide in the installation cavity.
[0011] As a further improvement of the technical solution, the waveguide is in an L shape, and a plugging member is inserted into one end of the waveguide away from the waveguide transceiver. The depth of insertion of the plugging member into the waveguide is less than the distance from the connection port to the end of the waveguide away from the waveguide transceiver.
[0012] As a further improvement of the technical solution, the plugging member plugs one end of the waveguide away from the waveguide transceiver, and shields the signal in the waveguide.
[0013] As a further improvement of the technical solution, in the elliptical through hole of the probe, 0 < b < a < 18 mm, where a is the major semi-axis dimension and b is the minor semi-axis dimension.
[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0015] In this non-contact mobility microwave radio frequency test waveguide probe assembly, by forming an elliptical through hole inside the probe, when the device performs mobility microwave radio frequency tests, the elliptical through hole on the probe can improve the transmission efficiency of microwave radio frequency signals, reduce signal loss, increase the signal radiation area, be less susceptible to external interference, increase the measurement depth of the device under test, greatly improve the stability of measurement data, have a high data linearity, and thus obtain more abundant measurement data, enabling a more in-depth study of semiconductor materials. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic diagram of the overall structure of the present invention;
[0017] Figure 2 is a schematic diagram of a partial structure of the present invention;
[0018] Figure 3 is a schematic diagram of the waveguide structure of the present invention;
[0019] Figure 4 is a schematic diagram of the structure of the waveguide probe mechanism of the present invention;
[0020] Figure 5 One of the schematic explosion structures of the waveguide probe mechanism of the present invention;
[0021] Figure 6 Another schematic explosion structure of the waveguide probe mechanism of the present invention;
[0022] Figure 7 Data display diagram of the elliptical through - hole inside the probe of the present invention.
[0023] The meanings of each label in the figure are as follows:
[0024] 1. Waveguide transceiver;
[0025] 2. Waveguide; 21. Connection port; 22. Plugging member;
[0026] 3. Waveguide probe mechanism; 31. Base housing; 32. Base cover plate; 33. Installation cavity; 34. Installation head; 35. Probe; 36. Placement port; 37. Installation port;
[0027] 4. Hall signal acquisition component. Specific implementation manner
[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.
[0029] Embodiment 1
[0030] Please refer to Figures 1-7 As shown, one of the purposes of this embodiment is to provide a non - contact mobility microwave radio - frequency test waveguide probe assembly, including a waveguide transceiver 1. The waveguide transceiver 1 is used for transmitting and collecting waveguide signals. One end of the waveguide transceiver 1 is fixedly connected to a waveguide 2 through screws. A waveguide probe mechanism 3 is installed on the waveguide 2, and a Hall signal acquisition component 4 is installed on the waveguide probe mechanism 3.
[0031] The TE10 signal is emitted by the waveguide transceiver 1. The signal emitted by the waveguide transceiver 1 is transmitted into the waveguide 2 and then transmitted by the waveguide 2 to the waveguide probe mechanism 3. The direction of the microwave radio frequency signal changes. The microwave radio frequency signal is incident on the device under test through the waveguide probe mechanism 3. The device under test will reflect part of the signal to the waveguide probe mechanism 3. Through the transmission of the waveguide 2, the reflected signal is transmitted to the waveguide transceiver 1. At this time, an external electric field is introduced in the vertical direction of the device under test, and the reflected TE10 signal will become a TE11 signal. At this time, the TE11 signal is collected by the Hall signal acquisition component 4 and transmitted to the terminal, and the terminal processes the signal transmitted by the Hall signal acquisition component 4.
[0032] At present, the performance of the non-contact mobility Hall measuring instrument LEI cannot meet the measurement requirements of the current development of semiconductor materials. Its signal bandwidth is narrow, the transmission efficiency is low, the gain of the near field of the signal is weak, the signal radiation surface is narrow, and it is easily affected by external interference. The stability and consistency of the test data are poor. When the same device under test is measured with different instruments, the results vary greatly, which brings a lot of inconvenience to material testing, experiments and quality control. In order to solve the above problems of the non-contact mobility Hall measuring instrument, the structures of the waveguide 2 and the waveguide probe mechanism 3 are refined, so that the device can improve the transmission efficiency of the microwave radio frequency signal, reduce signal loss, increase the radiation area of the signal, and is not easily affected by external interference.
[0033] The structures of the waveguide 2 and the waveguide probe mechanism 3 are refined as follows. Please refer to Figures 2-7 As shown in the figure, a connection port 21 is opened on the side wall of the waveguide 2 far from the waveguide transceiver 1. The connection port 21 is communicated with the inside of the waveguide 2. The waveguide probe mechanism 3 includes a base housing 31. An installation cavity 33 is opened on one side of the base housing 31. The shape of the installation cavity 33 is adapted to that of the waveguide 2. The waveguide 2 is installed in the installation cavity 33. At the same time, a base cover plate 32 is provided on one side of the installation cavity 33. The base cover plate 32 is connected to the side wall of the base housing 31 close to the installation cavity 33 by screws, and the base cover plate 32 clamps and fixes the waveguide 2 in the installation cavity 33. By fixing the base cover plate 32 on one side of the base housing 31, the waveguide 2 is stably clamped and fixed in the installation cavity 33, so as to ensure the stability of the connection between the waveguide probe mechanism 3 and the waveguide 2. At the same time, the shape of the waveguide 2 is L-shaped, and the cross-section of the waveguide 2 is of various shapes, such as rectangular, circular, ridged, etc. The waveguide frequencies of different cross-sectional shapes of the waveguide 2 are also different. According to the data type of the device under test to be measured, the waveguide 2 with the corresponding cross-sectional shape is selected.
[0034] Meanwhile, a placement opening 36 is formed on one side of the base housing 31 away from the installation cavity 33. The installation cavity 33 is in communication with the placement opening 36. A probe 35 is inserted into the placement opening 36. An oval through hole is formed inside the probe 35. One end of the probe 35 is inserted into the placement opening 36, and the oval through hole is in communication with the connection port 21. An installation head 34 is fixed on the side wall of the base housing 31 away from the installation cavity 33. The placement opening 36 penetrates through the installation head 34 and extends out. A positioning disk is fixedly provided at one end of the probe 35 away from the installation cavity 33. The positioning disk is fixed on the installation head 34 by screws. By using screws to fix the positioning disk on the installation head 34, the probe 35 can be stably installed in the placement opening 36, so that the probe 35 can stably transmit the signal in the waveguide 2 during use.
[0035] An oval through hole is provided inside the probe 35. When performing the mobility microwave radio frequency test, the oval through hole on the probe 35 can improve the transmission efficiency of the microwave radio frequency signal, reduce signal loss, increase the radiation area of the signal, make it less susceptible to external interference, increase the measurement depth of the measured component, greatly improve the stability of the measurement data, have a high data linearization, and thus obtain richer measurement data, enabling more in-depth research on semiconductor materials.
[0036] The calculation formula for the eccentricity e of the oval through hole is as follows:
[0037]
[0038]
[0039] Among them, the range of the eccentricity e is 0 < e < 1. a is the major semi-axis dimension of the oval through hole inside the probe 35, and b is the minor semi-axis dimension of the oval through hole inside the probe 35. In the oval through hole of the probe 35, the value ranges of a and b are: 0 < b < a < 18 mm, where a is the major semi-axis dimension and b is the minor semi-axis dimension. A model is established using the three-dimensional electromagnetic field software HFSS, and the simulation result data that meets the requirements is calculated through simulation. At the same time, the length of the probe 35 is taken as a value of 10 mm - 26 mm. By restricting the dimensions of the oval through hole inside the probe 35 with the above dimension data, the transmission loss of the waveguide probe mechanism 3 is reduced from the original 0.7 dB to 0.2 dB, and the input-output return loss of the signal ≤ -25 dB. This greatly enhances the transmission efficiency of the signal, increases the radiation area of the signal, makes it less susceptible to external interference, the measurement depth is deeper than that of imported equipment, and the stability of the measurement data is greatly enhanced, providing a powerful tool for further analyzing the conductive characteristics of semiconductor materials.
[0040] In order to transmit the signal in the waveguide 2 to the probe 35, a plugging member 22 is inserted into one end of the waveguide 2 far from the waveguide transceiver 1. The plugging member 22 plugs one end of the waveguide 2 far from the waveguide transceiver 1, and the plugging member 22 shields the signal in the waveguide 2. Moreover, the depth of the plugging member 22 inserted into the waveguide 2 is less than the distance from the connection port 21 to the end of the waveguide 2 far from the waveguide transceiver 1, so that one end of the plugging member 22 does not block the connection port 21. When the waveguide 2 receives the signal sent by the waveguide transceiver 1, the plugging member 22 shields the signal transmitted to the end of the waveguide 2, enabling the signal in the waveguide 2 to be transmitted to the probe 35 through the connection port 21, ensuring that the probe 35 stably receives the signal in the waveguide 2.
[0041] The signal transmitted from the waveguide 2 to the probe 35 requires the structure of the Hall signal acquisition component 4. In order to facilitate the Hall signal acquisition component 4 to receive the signal in the probe 35, mounting openings 37 are provided on one side of the mounting head 34 and the side wall of the probe 35. One end of the Hall signal acquisition component 4 is inserted into the internal elliptical through-hole of the probe 35 through the mounting opening 37.
[0042] The TE10 signal is emitted by the waveguide transceiver 1. The signal emitted by the waveguide transceiver 1 is transmitted into the waveguide 2 and then to the position of the connection port 21 by the waveguide 2. The signal enters the internal elliptical through-hole of the probe 35 through the connection port 21. The microwave radio frequency signal is incident on the measured object through the internal elliptical through-hole of the probe 35. The measured object reflects part of the signal into the internal elliptical through-hole of the probe 35. The signal entering the internal elliptical through-hole of the probe 35 is transmitted by the waveguide 2, enabling the reflected signal to be transmitted to the waveguide transceiver 1. At this time, an external electric field is introduced in the vertical direction of the measured object, and the reflected TE10 signal of the measured object will become a TE11 signal. At this time, the TE11 signal is collected by the Hall signal acquisition component 4 and transmitted to the terminal, and the terminal processes the signal transmitted by the Hall signal acquisition component 4.
[0043] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. Non-contact mobility microwave radio frequency test waveguide probe assembly, comprising a waveguide transceiver (1), one end of the waveguide transceiver (1) is fixedly connected with a waveguide (2) through a screw, and a waveguide probe mechanism (3) is installed on the waveguide (2). Characterized in that: A connection port (21) is opened on the side wall of the waveguide (2) far from the waveguide transceiver (1), and the connection port (21) is communicated with the inside of the waveguide (2). The waveguide probe mechanism (3) includes a base housing (31), an installation cavity (33) is opened on one side of the base housing (31), the shape of the installation cavity (33) is adapted to that of the waveguide (2), and the waveguide (2) is installed in the installation cavity (33). A placement port (36) is opened on the side of the base housing (31) far from the installation cavity (33), the installation cavity (33) is communicated with the placement port (36), a probe (35) is inserted in the placement port (36), an oval through hole is opened inside the probe (35), one end of the probe (35) is inserted into the placement port (36), and the oval through hole is communicated with the connection port (21).
2. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 1, Characterized in that: An installation head (34) is fixed on the side wall of the base housing (31) far from the installation cavity (33), the placement port (36) penetrates through the installation head (34) and extends out, a positioning disk is arranged at one end of the probe (35) far from the installation cavity (33), and the positioning disk is fixed on the installation head (34) through a screw.
3. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 2, Characterized in that: A Hall signal acquisition component (4) is installed on the waveguide probe mechanism (3).
4. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 3, Characterized in that: Installation ports (37) are opened on one side of the installation head (34) and the side wall of the probe (35), and one end of the Hall signal acquisition component (4) is inserted into the oval through hole inside the probe (35) through the installation port (37).
5. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 2, Characterized in that: A base cover plate (32) is arranged on one side of the installation cavity (33), the base cover plate (32) is connected to the side wall of the base housing (31) close to the installation cavity (33) through a screw, and the base cover plate (32) clamps and fixes the waveguide (2) in the installation cavity (33).
6. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 1, Characterized in that: The shape of the waveguide (2) is L-shaped, a plugging piece (22) is inserted at one end of the waveguide (2) far from the waveguide transceiver (1), and the depth of the plugging piece (22) inserted into the waveguide (2) is less than the distance from the connection port (21) to the end of the waveguide (2) far from the waveguide transceiver (1).
7. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 6, characterized in that: the plugging member (22) plugs one end of the waveguide (2) away from the waveguide transceiver (1).
8. The non-contact mobility microwave radio frequency test waveguide probe assembly according to claim 1, characterized in that: in the elliptical through hole of the probe (35), 0 < b < a < 18 mm, where a is the major semi-axis dimension and b is the minor semi-axis dimension.