Power component performance test method and system based on thermal feedback topology

Abstract

The invention discloses a power component performance test method and system based on thermal feedback topology, and relates to the related field of electrical performance tests.The method comprises the steps that an access circuit of a target component is obtained, circuit scene simulation is conducted, a simulation circuit is determined, and a non-target component of the access circuit is replaced with a black box structure; aiming at a target component, determining an abstract surface under layer-by-layer packaging of the structure by taking a chip as a center, determining a multi-element axial direction according to a plurality of performance parameters, temperature and time, constructing a thermal feedback map, and performing dynamic driving training; the thermal feedback spectrum is dynamically updated by executing periodic simulation of a simulation circuit, a target thermal feedback state is intervened, decomposition calling and directional evaluation based on the thermal feedback spectrum are executed, and a performance test result is determined. The technical problem of insufficient accuracy and comprehensiveness of performance evaluation in the existing performance test of the power component is solved, and the technical effect of accurately and comprehensively testing the performance of the power component is achieved.

Description

Technical Field

[0001] This application relates to the field of electrical performance testing, and particularly to a method and system for testing the performance of power components based on a thermal feedback topology. Background Art

[0002] As a core component in electronic devices, the stability and reliability of the performance of power components are crucial for the normal operation of the entire electronic system. Accurately testing the performance of power components is a key link to ensure the high-quality operation of electronic devices. Currently, the main method to solve the problem of power component performance testing is usually to conduct actual circuit access testing on the components, and evaluate their performance by collecting various data during actual operation. The current method, due to the complex and variable circuit environment in actual circuit access testing and the interference of a large number of non-target components, makes it difficult to accurately focus on the performance evaluation of the target components. At the same time, for performance testing under some extreme or specific working conditions, the actual testing cost is high, the cycle is long, and it is difficult to achieve comprehensive test coverage, resulting in possible deviations in the test results and being unable to comprehensively and accurately reflect the true performance of power components.

[0003] In the current related technologies, there are technical problems of insufficient accuracy and comprehensiveness in the performance evaluation of power component performance testing. Summary of the Invention

[0004] This application provides a method and system for testing the performance of power components based on a thermal feedback topology. By using technical means based on a thermal feedback topology, through obtaining the access circuit of the target component and simulating the circuit scenario, replacing non-target components with a black box structure to reduce interference, determining the abstract surface under the hierarchical packaging with the chip as the center, constructing a multi-axial thermal feedback map including multiple performance parameters, temperature, and time, and performing dynamic drive training, dynamically updating the thermal feedback map using the periodic simulation of the analog circuit, and performing decomposition call and directional evaluation after intervening in the target thermal feedback state, it solves the technical problems of insufficient accuracy and comprehensiveness in the performance evaluation existing in the current power component performance testing, and achieves the technical effect of accurately and comprehensively testing the performance of power components.

[0005] The present application provides a method for testing the performance of power components based on a thermal feedback topology, including: obtaining the access circuit of the target component, simulating the circuit scenario, and determining the simulated circuit, where the non-target components in the access circuit are replaced with a black box structure; for the target component, determining the abstract surface under the hierarchical encapsulation centered on the chip, determining the multi-axis direction with multiple performance parameters, temperature, and time, constructing a thermal feedback map and performing dynamic drive training, where the thermal feedback map is built into the test system and has a temporary communication with the simulated circuit; by performing periodic simulation of the simulated circuit, dynamically updating the thermal feedback map, intervening in the target thermal feedback state, performing decomposition call and directional evaluation based on the thermal feedback map, and determining the performance test result, where the dynamic update includes direct update based on simulation data and indirect update based on non-simulation data.

[0006] In a possible implementation, the following processing is performed: at least one target component is included in the access circuit; for the access circuit, locating the circuit access positions of the non-target components, where the input-output directions of each non-target component at the circuit access positions are determined according to the circuit power flow direction; taking the input-output as the demand orientation, mining the linear state relationships of each non-target component; and replacing the non-target components in the access circuit with the black box structure according to the circuit access positions and the linear state relationships.

[0007] In a possible implementation, when determining the abstract surface under the hierarchical encapsulation centered on the chip, the following processing is performed: centered on the chip and with the outermost encapsulation layer as the boundary, abstractly displaying the component structure from the center to the boundary to determine the multi-layer structure surface; for the multi-layer structure surface, locating the multi-layer encapsulation characteristics, marking the multi-layer structure surface, and determining the abstract surface.

[0008] In a possible implementation, when constructing the thermal feedback map, the following processing is performed: determining multiple performance parameters, where the multiple performance parameters define all the performance elements of the target component; for the multiple performance parameters, determining multiple performance axes; coupling the abstract surface, the temperature axis, the time axis, and the multiple performance axes to determine the thermal feedback map.

[0009] In a possible implementation, when coupling the abstract surface, the temperature axis, the time axis, and the multiple performance axes, the following processing is performed: for the multiple performance parameters, determining performance-related variables; using the performance-related variables to establish the correlation coupling between each performance axis and the abstract surface, the temperature axis, and the time axis.

[0010] In a possible implementation, a thermal feedback map is constructed and dynamically driven training is performed. The following processing is executed: With the sample test task as a constraint, the sample circuit data as an input, and the update of the thermal feedback map as an output, dynamic driven training is performed on the thermal feedback map; if the convergence condition is satisfied, the trained thermal feedback map is embedded and deployed in the test system, and a temporary communication between the thermal feedback map and the analog circuit is established.

[0011] In a possible implementation, the following processing is executed: As the target component to be tested is switched, or the access circuit is switched, the switched analog circuit is determined; the temporary communication between the thermal feedback map and the analog circuit is interrupted, and a temporary communication between the switched analog circuit and the thermal feedback map is established.

[0012] In a possible implementation, the target thermal feedback state is intervened, and decomposition call and directional evaluation based on the thermal feedback map are performed. The following processing is executed: The thermal feedback state is set, where the thermal feedback state at least includes temperature cycle, constant high temperature, thermal stress accumulation under dynamic temperature, thermal stability, mechanical strength, and package reliability, and the thermal stability is conditional on wide temperature range stability; through the analog circuit, the thermal feedback map is updated in real time, including direct update of simulation data and indirect update of performance parameters; the target thermal feedback state is determined, and directional evaluation is performed on the thermally feedback map updated in real time.

[0013] In a possible implementation, the performance test result is determined. The following processing is executed: The directional evaluation result based on the target thermal feedback state is determined; based on the directional evaluation result and the thermally feedback map updated in real time, the performance test result is determined.

[0014] This application also provides a power component performance test system based on a thermal feedback topology, including: an analog circuit determination module, configured to obtain the access circuit of the target component, perform circuit scenario simulation, and determine the analog circuit, where the non-target components of the access circuit are replaced with a black box structure; a thermal feedback map construction module, configured to, for the target component, determine an abstract surface under layer-by-layer packaging centered on the chip, determine a multi-dimensional axis with multiple performance parameters, temperature, and time, construct a thermal feedback map and perform dynamic driven training, where the thermal feedback map is built into the test system and a temporary communication is established with the analog circuit; a performance test result determination module, configured to perform dynamic update on the thermal feedback map by executing periodic simulation of the analog circuit, intervene in the target thermal feedback state, perform decomposition call and directional evaluation based on the thermal feedback map, and determine the performance test result, where the dynamic update includes direct update based on simulation data and indirect update based on non-simulation data.

[0015] The power component performance testing method and system based on thermal feedback topology proposed in this application first obtain the access circuit of the target component, perform circuit scenario simulation to determine the simulation circuit. Among them, the non-target components in the access circuit are replaced with black box structures. Then, for the target component, an abstract surface under layer-by-layer encapsulation is determined with the chip as the center, a multi-axial direction is determined with multiple performance parameters, temperature, and time, a thermal feedback map is constructed and dynamically driven training is performed. The thermal feedback map is built into the testing system and has a temporary communication with the simulation circuit. Finally, by performing periodic simulation of the simulation circuit, the thermal feedback map is dynamically updated, the target thermal feedback state is intervened, and decomposition call and directional evaluation based on the thermal feedback map are performed to determine the performance test result. The dynamic update includes direct update based on simulation data and indirect update based on non-simulation data. It achieves the technical effect of accurately and comprehensively testing the performance of power components. Description of the Drawings

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments of the present invention will be briefly introduced below. Flowcharts are used in this application to illustrate the operations performed by the systems according to the embodiments of the application. It should be understood that the operations in the front or below do not necessarily need to be executed precisely in sequence. On the contrary, according to needs, they can be executed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or several operations can be removed from these processes.

[0017] Figure 1 It is a schematic flowchart of the power component performance testing method based on thermal feedback topology provided by the embodiment of this application.

[0018] Figure 2 It is a schematic structural diagram of the power component performance testing system based on thermal feedback topology provided by the embodiment of this application.

[0019] Description of the reference numerals: Simulation circuit determination module 10, thermal feedback map construction module 20, performance test result determination module 30. Detailed Embodiments

[0020] The above description is only an overview of the technical solutions of this application. In order to be able to understand the technical means of this application more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features, and advantages of this application more obvious and understandable, the following specifically gives the detailed embodiments of this application.

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe this application in detail with reference to the accompanying drawings. The described embodiments should not be construed as limitations on this application. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0022] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with each other without conflict. The terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or server that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or modules that are not clearly listed or are inherent to these processes, methods, products, or devices. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application.

[0023] The embodiments of this application provide a method for testing the performance of power components based on a thermal feedback topology, as Figure 1 shown, the method includes: Step S100, obtain the access circuit of the target component, perform circuit scenario simulation, and determine the simulation circuit, where the non-target components of the access circuit are replaced with a black box structure.

[0024] Specifically, the target component is a power component that needs to be tested for performance, such as a power MOSFET, a power capacitor, etc. Use circuit design software (such as Cadence, Altium Designer, etc.) to read the circuit diagram of the target component and extract the connection information of the target component, including pin connections, power supply and ground connections, etc. Identify other components in the circuit and mark them as non-target components, and perform black box processing on the non-target components, that is, only retain their input and output interfaces and ignore their internal structures. For example, for a resistor, only retain the voltage and current interfaces at both ends and ignore the specific calculation of its resistance value. Use circuit simulation software (such as LTspice, MATLAB / Simulink, etc.) to simulate the extracted circuit, set simulation conditions, such as power supply voltage, signal frequency, load conditions, etc., and connect the black boxed non-target components to the target component through the interface function of the simulation software to form a complete simulation circuit.

[0025] For example, assume that the target component is a power MOSFET, and the circuit diagram also includes components such as capacitors, resistors, and inductors. Use Cadence software to read the circuit diagram, extract the pin connection information of the MOSFET, and mark the capacitors, resistors, and inductors as non-target components. Simplify the capacitors, resistors, and inductors into black boxes, only retaining their input and output interfaces. Use LTspice software to simulate the simplified circuit, set the power supply voltage to 12V, the signal frequency to 100kHz, and the load condition to a 1Ω resistor. Through the interface function of LTspice, connect the black-boxed non-target components to the MOSFET to form a complete simulation circuit.

[0026] In a possible implementation, step S100 further includes step S110. The access circuit includes at least one target component. For the access circuit, locate the circuit access positions of the non-target components, where the input-output directions of the non-target components at the circuit access positions are determined according to the circuit power flow direction. Specifically, use circuit design software (such as Cadence, Altium Designer, etc.) to read the complete circuit diagram of the access circuit, identify all the components in the circuit, and determine the access position of each component, including pin connections and connection order. For example, for a circuit containing multiple components, parse the circuit diagram to determine the pin connections and connection order of each component. According to the power supply and load distribution of the circuit, analyze the current and voltage flow directions of the circuit to determine the input and output directions of each non-target component in the circuit. For example, for a circuit containing an amplifier, analyze the direction of the current flowing from the power supply to the amplifier and then from the amplifier to the load.

[0027] For example, assume that the access circuit includes a power MOSFET (target component), an amplifier, and a resistor. Use Cadence software to read the circuit diagram and identify the access position of each component. For example, the input terminal of the amplifier is connected to the signal source, and the output terminal is connected to the gate of the power MOSFET. Analyze the current flow direction of the circuit to determine that the input terminal of the amplifier is in the direction of the signal source and the output terminal is in the direction of the gate of the power MOSFET. Therefore, the input-output direction of the amplifier is from the signal source to the power MOSFET.

[0028] Step S120: With input-output as the demand orientation, mine the linear state relationships of each non-target component. Specifically, analyze the input-output state relationships of each non-target component, use circuit simulation software (such as LTspice, MATLAB / Simulink, etc.) to simulate the non-target components, record their input and output states, and analyze the linear or approximately linear relationships between the input and output states. For example, for an amplifier, analyze the relationships between the amplitude and phase of the input signal and the amplitude and phase of the output signal. Use data fitting methods (such as the least squares method) to fit the input-output data and establish a linear model. For example, for an amplifier, establish a linear model between the amplitude of the input signal and the amplitude of the output signal.

[0029] For example, assume that the non-target component is an amplifier and use LTspice software to simulate it. Record that the amplitude of the input signal is 1V and the amplitude of the output signal is 10V. Analyze the linear relationship between the input and output signals and find that the amplitude of the output signal is 10 times that of the input signal. Use the least squares method to fit the input-output data and establish a linear model. The model formula is: Output amplitude = 10 × Input amplitude.

[0030] Step S130: According to the circuit access position and the linear state relationship, perform black box structure replacement of the non-target component on the access circuit. Specifically, according to the linear state relationship, define the black box structure of the non-target component. The black box structure only retains the input and output interfaces and ignores the internal structure. For example, for an amplifier, define the black box structure as receiving a signal at the input terminal and outputting the amplified signal at the output terminal. Use circuit design software (such as Cadence, Altium Designer, etc.) to replace the non-target component with the black box structure and reconstruct the circuit to ensure that the connection relationship and function of the circuit remain unchanged. For example, replace the amplifier with the black box structure and retain the input and output interfaces.

[0031] This implementation method simplifies the circuit model and reduces the computational complexity by replacing the non-target component with the black box structure. By only focusing on the performance testing of the target component, it avoids the detailed analysis of the non-target component, thereby improving the testing efficiency.

[0032] Step S200: For the target component, determine the abstract surfaces under the hierarchical packaging with the chip as the center, determine the multi-axial directions with multiple performance parameters, temperature, and time, construct a thermal feedback map, and perform dynamic drive training, where the thermal feedback map is built into the test system and has a temporary communication with the analog circuit.

[0033] Specifically, use packaging design software (such as Ansys Icepak, Siemens Xpedition, etc.) to analyze the packaging structure of the target component, and determine the layer-by-layer packaging information of the chip, including the chip, packaging substrate, heat sink, etc. For example, for a packaged power chip, analyze the structure and material properties of its chip, packaging substrate, and heat sink.

[0034] Use thermal analysis software (such as Ansys Fluent, COMSOL Multiphysics, etc.) to perform thermal analysis on the target component. Taking the chip as the center, construct a thermal feedback map, which includes multiple performance parameters (such as voltage, current, power), temperature, and a multi-axis of time, and is used to record the temperature changes of the target component under different working conditions. For example, the map can record the temperature changes of the chip at different currents (0A - 10A), different temperatures (25°C - 100°C), and different times (0s - 1000s).

[0035] Use machine learning algorithms (such as neural networks, support vector machines, etc.) to perform dynamic driving training on the thermal feedback map. Through the training model, predict the temperature changes of the target component under different working conditions. For example, use a neural network to train the thermal feedback map, with the input being current, temperature, and time, and the output being the temperature changes of the target component.

[0036] For example, assume that the target component is a packaged power chip. Use Ansys Icepak software to analyze its packaging structure and determine the structure and material properties of the chip, packaging substrate, and heat sink. Among them, the size of the chip is 10mm×10mm, the material of the packaging substrate is ceramic, and the material of the heat sink is copper. Use Ansys Fluent software to perform thermal analysis on the target component and construct a thermal feedback map, which includes a multi-axis of current (0A - 10A), temperature (25°C - 100°C), and time (0s - 1000s). The map records the temperature changes of the chip at different currents, different temperatures, and different times, as shown in Table 1.

[0037] Table 1: Example of Thermal Feedback Map Data

[0038] Use a neural network to train the thermal feedback map, with the input being current, temperature, and time, and the output being the temperature changes of the target component. After training is completed, the model can predict the temperature changes of the target component under different working conditions.

[0039] In a possible implementation, an abstract surface under layer-by-layer encapsulation with the chip as the center is determined. Step S200 further includes step S210. With the chip as the center and the outermost encapsulation layer as the boundary, the component structure from the center to the boundary is abstractly displayed to determine a multi-layer structure surface. Specifically, use packaging design software (such as Ansys Icepak, Siemens Xpedition, etc.) to read the packaging structure of the target component, starting from the chip center, and gradually analyze each layer of the packaging structure outward until the outermost encapsulation layer. For example, for a packaged power chip, analyze the structure of each layer such as the chip, packaging substrate, heat sink, etc. Abstract each layer of the packaging structure into a region, without showing specific structural features, and only define it by the region. For example, abstract the chip into a central region, the packaging substrate into an intermediate region, and the heat sink into an outer region, and use colors or markings to distinguish different regions for subsequent analysis of temperature distribution.

[0040] For example, assume the target component is a power chip, and use Ansys Icepak software to analyze its packaging structure. Starting from the chip center, gradually analyze each layer of the packaging structure, including the chip, packaging substrate, and heat sink. Abstract the chip into a central region (marked as region 1), the packaging substrate into an intermediate region (marked as region 2), and the heat sink into an outer region (marked as region 3). Use different colors or markings to distinguish these regions, as shown in Table 2.

[0041] Table 2: Example of multi-layer structure surface

[0042] Step S220, for the multi-layer structure surface, locate the multi-layer packaging characteristics, mark the multi-layer structure surface, and determine the abstract surface. Specifically, analyze the characteristics of each layer of the packaging structure, such as material properties (thermal conductivity, coefficient of thermal expansion, etc.), thickness, etc. For example, the chip has a high thermal conductivity, the packaging substrate has a low thermal conductivity, and the heat sink has a high thermal conductivity. Use thermal analysis software (such as Ansys Fluent, COMSOL Multiphysics, etc.) to perform thermal characteristic analysis on each layer of the packaging structure. According to the packaging characteristics, mark each layer of the structure surface. For example, mark the chip region as "high thermal conductivity region", the packaging substrate region as "low thermal conductivity region", and the heat sink region as "high thermal conductivity region". Determine the abstract surface, that is, the boundary of each layer of the structure, for subsequent temperature distribution analysis.

[0043] For example, the Ansys Fluent software is used to analyze the thermal characteristics of each layer of the encapsulation structure. The analysis results are as follows: Chip area: high thermal conductivity and low coefficient of thermal expansion; Encapsulation substrate area: low thermal conductivity and high coefficient of thermal expansion; Heat sink area: high thermal conductivity and low coefficient of thermal expansion. According to the analysis results, each layer of the structure surface is marked: the chip area is marked as "high thermal conductivity area" (marked as A); the encapsulation substrate area is marked as "low thermal conductivity area" (marked as B); the heat sink area is marked as "high thermal conductivity area" (marked as C). The abstract surface, that is, the boundary of each layer of the structure, is determined as shown in Table 3.

[0044] Table 3: Example of the abstract surface

[0045] In this implementation, by abstracting each layer of the encapsulation structure into a region and defining it by the region, the temperature distribution at different internal structural positions can be more intuitively displayed. By marking the encapsulation characteristics of each layer of the structure, the influence of the temperature distribution on the encapsulation state can be more accurately analyzed, thereby improving the accuracy of the temperature distribution analysis. By analyzing the influence of the temperature distribution on the encapsulation state, the mechanical properties of the encapsulation structure can be more accurately evaluated. By marking the multi-layer structure surface, the behavior of each layer of the structure under temperature changes can be more clearly understood, thereby providing more reliable data support for the mechanical property evaluation and enhancing the reliability of the mechanical property evaluation.

[0046] In a possible implementation, to construct a thermal feedback map, step S200 further includes step S230 of determining a plurality of performance parameters, where the plurality of performance parameters define all the performance elements of the target component. Specifically, according to the specifications and application scenarios of the target component, key performance parameters are extracted. These parameters cover all the important characteristics of the target component during actual operation. For example, for a power MOSFET, the performance parameters include: Voltage: drain-source voltage (Vds), gate-source voltage (Vgs); Current: drain current (Id); Power: power consumption (Pd); Efficiency: conversion efficiency; Switching speed: turn-on and turn-off times. Ensure that the extracted performance parameters can comprehensively reflect the performance of the target component, and these parameters should include electrical performance, thermal performance, mechanical performance, etc. For example, in addition to electrical performance parameters (such as voltage, current, power), thermal performance parameters (such as temperature, thermal resistance) and mechanical performance parameters (such as package strength, coefficient of thermal expansion) should also be included.

[0047] For example, assume that the target component is a power MOSFET, and its key performance parameters include: Electrical performance parameters: drain-source voltage (Vds), gate-source voltage (Vgs), drain current (Id), power consumption (Pd); Thermal performance parameters: junction temperature (Tj), package temperature (Tc), thermal resistance (Rth); Mechanical performance parameters: package strength, coefficient of thermal expansion.

[0048] Step S240, for the multiple performance parameters, determine multiple performance axes. Specifically, define an independent axis for each performance parameter, which is used to represent the change range of the parameter in the map. For example, define a voltage axis for the drain-source voltage (Vds), with a range from 0V to 100V; define a current axis for the drain current (Id), with a range from 0A to 10A. Similarly, define a temperature axis for the temperature (Tj), with a range from 25°C to 150°C; define a time axis for the time (t), with a range from 0s to 1000s. Construct a multi-axis system by integrating the axes of all performance parameters together to form a multi-dimensional space. For example, construct a four-dimensional space including a voltage axis, a current axis, a temperature axis, and a time axis.

[0049] Step S250, couple the abstract surface, the temperature axis, the time axis, and the multiple performance axes to determine the thermal feedback map. Specifically, couple the abstract surface (such as the chip area, the package substrate area, the heat sink area) with the temperature axis, the time axis, and the multiple performance axes. For example, for the chip area, record the changes in the drain-source voltage (voltage axis) and the drain current (current axis) at different times (time axis) and different temperatures (temperature axis). Use data processing software (such as MATLAB, Python) to process and visualize these multi-dimensional data. Construct a thermal feedback map that includes all the coupled data points. For example, the map can show the changes in the performance parameters such as voltage, current, and power consumption of the target component at different times and different temperatures. Use thermal analysis software (such as Ansys Fluent, COMSOL Multiphysics) to dynamically update and analyze the map.

[0050] This implementation method can comprehensively evaluate the performance of the target component by coupling the abstract surface, the temperature axis, the time axis, and the multiple performance axes. Such a multi-dimensional map can reflect the electrical, thermal, and mechanical performance of the target component under different working conditions. The thermal feedback map can be dynamically updated to reflect the performance changes of the target component in real time, providing real-time data support for performance optimization and improving the comprehensiveness of performance evaluation. By defining multiple performance parameters and integrating them into the map, the performance of the target component can be evaluated more precisely. Such a multi-dimensional analysis method can capture more details and improve the test accuracy.

[0051] In a possible implementation, coupling the abstract plane, the temperature axis, the time axis, and the multiple performance axes, step S250 further includes step S251 of determining performance-related variables for the multiple performance parameters. Specifically, each performance parameter is analyzed to determine the variables associated with it. These variables can be direct physical quantities (such as temperature, current, voltage) or derived performance metrics (such as power consumption, efficiency, thermal resistance). For example, for voltage (Vds) and current (Id), the associated variable can be power consumption Pd = Vds × Id; for temperature (Tj), the associated variable can be thermal resistance Rth = (Tj - Tc) / Pd.

[0052] Select relevant variables according to specific test requirements. For example, if the test requirement is to evaluate thermal failure, the relevant variables may include the temperature overlimit position, the structural failure state at the package position, etc. If the test requirement is to evaluate thermal stability, the relevant variables may include the temperature fluctuation partition based on the time trend.

[0053] For example, assume the target component is a power MOSFET, and its performance parameters include drain-source voltage (Vds), drain current (Id), chip temperature (Tj), package temperature (Tc), and power consumption (Pd). The relevant variables are as follows: Power consumption (Pd): Pd = Vds × Id; Thermal resistance (Rth): Rth = (Tj - Tc) / Pd; Temperature change rate (dT / dt): used to evaluate temperature fluctuation.

[0054] If the test requirement is to evaluate thermal failure, the relevant variables include: Temperature overlimit position: Tj > 150°C; Structural failure state at the package position: abnormal increase in thermal resistance.

[0055] If the test requirement is to evaluate thermal stability, the relevant variables include: Temperature fluctuation partition based on the time trend: dT / dt > 1°C / s.

[0056] Step S252, using the performance-related variables, establish the correlation coupling between each performance axis and the abstract plane, the temperature axis, and the time axis. Specifically, use data processing software (such as MATLAB, Python) to analyze the performance-related variables to determine the correlation between them. For example, analyze the relationship between temperature (Tj) and power consumption (Pd), or analyze the relationship between temperature change rate (dT / dt) and time (t). According to the results of the correlation analysis, establish the coupling relationship between each performance axis and the abstract plane, the temperature axis, and the time axis.

[0057] For example, establish a coupling relationship between the temperature axis (Tj) and the power consumption axis (Pd), or establish a coupling relationship between the temperature change rate axis (dT / dt) and the time axis (t). Use thermal analysis software (such as Ansys Fluent, COMSOL Multiphysics) to perform dynamic simulation and visualization of the coupling relationship.

[0058] This implementation method can quickly locate the data part related to the test requirements by establishing a correlation coupling. Through the correlation coupling, the performance of the target component can be efficiently evaluated. By analyzing the relationship between performance-related variables, the performance of the target component can be evaluated more accurately. This precise analysis method can capture more details and improve the test accuracy.

[0059] In a possible implementation, construct a thermal feedback map and perform dynamic drive training. Step S200 further includes step S260, which performs dynamic drive training on the thermal feedback map with the sample test task as a constraint, the sample circuit data as input, and the update of the thermal feedback map as output. Specifically, define a set of sample test tasks that cover various working scenarios of the target component in actual applications. For example, for a power MOSFET, the sample test tasks include: switching operations under different load conditions; continuous operation under different ambient temperatures; performance evaluation under different input voltages.

[0060] Collect circuit data corresponding to the sample test tasks, including voltage, current, temperature, etc. These data are obtained through circuit simulation. Use machine learning algorithms (such as neural networks, support vector machines, etc.) to train the thermal feedback map. Perform dynamic drive training with the sample test task as a constraint, the sample circuit data as input, and the update of the thermal feedback map as output. For example, use a neural network to train the thermal feedback map, with the input being the sample circuit data (voltage, current, temperature) and the output being the update of the thermal feedback map.

[0061] Step S270, if the convergence condition is met, embed the trained thermal feedback map in the test system and establish temporary communication between the thermal feedback map and the analog circuit. Specifically, during the training process, set the convergence condition, such as the error being less than a certain threshold (such as 0.01) or the number of training times reaching a certain upper limit (such as 1000 times). Embed the trained thermal feedback map into the test system, which can be a hardware test platform or a software simulation platform for real-time evaluation of the performance of the target component. Establish temporary communication between the thermal feedback map and the analog circuit to update and feedback data in real time during the test. For example, use a data interface (such as USB, Ethernet) to establish communication between the thermal feedback map and the analog circuit.

[0062] This implementation method can update the thermal feedback map in real time according to the actual circuit data through dynamic drive training, improving the test accuracy. By establishing temporary communication between the thermal feedback map and the analog circuit, data can be fed back in real time, enhancing the real-time performance and dynamics of the test.

[0063] In a possible implementation method, step S270 further includes step S271. As the target component to be tested is switched, or the access circuit is switched, determine the switched analog circuit. Specifically, in the test system, through hardware interfaces (such as GPIO, I2C, etc.) or software interfaces (such as API calls), it is monitored in real time whether the target component to be tested has been replaced. For example, when the test system detects that the target component has switched from a power MOSFET to a power capacitor, the switching process is triggered. Similarly, by detecting the connection status in the circuit (such as relay status, switch status) or through the interface of circuit simulation software, it is monitored in real time whether the access circuit has changed. For example, when the access circuit switches from a simple load circuit to a complex multi-load circuit, the switching process is triggered. According to the new target component or access circuit, the analog circuit is re-determined by reloading the circuit model or reconfiguring the simulation parameters. For example, if the target component switches from a power MOSFET to a power capacitor, reload the circuit model of the power capacitor and update the simulation parameters to match the new circuit configuration.

[0064] Step S272, interrupt the temporary communication between the thermal feedback map and the analog circuit, and establish temporary communication between the switched analog circuit and the thermal feedback map. Specifically, when switching the target component or the access circuit, the temporary communication between the current thermal feedback map and the analog circuit is interrupted by closing the communication interface (such as USB, Ethernet) or pausing data transmission. For example, close the USB communication interface between the current analog circuit and the thermal feedback map. According to the new analog circuit, the temporary communication between the thermal feedback map and the switched analog circuit is re-established by reconfiguring the communication interface or restarting data transmission. For example, reconfigure the USB communication interface to connect it to the new analog circuit and resume data transmission.

[0065] This implementation method can quickly switch the analog circuit by monitoring the changes of the target component and the access circuit in real time to adapt to different test requirements. By interrupting and re-establishing the temporary communication, it ensures seamless docking between the thermal feedback map and the new analog circuit, reducing data loss and communication delay during the switching process, and enhancing the flexibility and adaptability of the test system.

[0066] Step S300, by performing periodic simulation of the analog circuit, dynamically update the thermal feedback map, intervene in the target thermal feedback state, perform decomposition call and directional evaluation based on the thermal feedback map, and determine the performance test result, where the dynamic update includes direct update based on simulation data and indirect update based on non-simulation data.

[0067] Specifically, use circuit simulation software (such as LTspice, MATLAB / Simulink, etc.) to perform periodic simulation on the analog circuit. Set the simulation period, for example, simulate once every 100 ms, and record the electrical parameters (such as voltage, current, power) and temperature changes of the target components. For example, use LTspice software to set the simulation once every 100 ms, and record the voltage, current, and temperature changes of the target components.

[0068] Use data processing software (such as Python, MATLAB, etc.) to process the simulation data, and directly update the thermal feedback map according to the simulation data. For example, update the temperature changes of the target components under different working conditions. For non-simulation data, use empirical formulas or historical data for indirect update.

[0069] Use evaluation software (such as Excel, MATLAB, etc.) to perform decomposition call on the thermal feedback map, and perform directional evaluation on the performance of the target components according to the target thermal feedback state and the data in the thermal feedback map. For example, evaluate performance indicators such as power loss and efficiency of the target components at different temperatures. After the evaluation is completed, determine the performance test result of the target components.

[0070] In a possible implementation, intervene in the target thermal feedback state and perform decomposition calls and directional evaluations based on the thermal feedback map. Step S300 further includes step S310 of setting the thermal feedback state, where the thermal feedback state at least includes temperature cycling, constant high temperature, thermal stress accumulation under dynamic temperature, thermal stability, mechanical strength, and packaging reliability, and the thermal stability is conditioned on wide temperature range stability. Specifically, multiple thermal feedback states are set to comprehensively evaluate the performance of the target component under different thermal conditions. These states include: temperature cycling (simulating the scenario where the component cycles between different temperatures), constant high temperature (simulating the long-term operation of the component in a high-temperature environment), thermal stress accumulation under dynamic temperature (simulating the thermal stress accumulation of the component under dynamic temperature changes), thermal stability (evaluating the stability of the component within a wide temperature range), mechanical strength (evaluating the mechanical strength of the packaging structure under thermal stress), and packaging reliability (evaluating the reliability of the packaging structure under thermal stress). Define the conditions for thermal stability, for example, maintaining stable performance within a wide temperature range (such as -40°C to 150°C). For example, set the thermal stability condition as: within the range of -40°C to 150°C, the change in the performance parameters (such as voltage, current, power consumption) of the component does not exceed 5%.

[0071] Step S320, through the analog circuit, update the thermal feedback map in real time, where it includes direct update of simulation data and indirect update of performance parameters. Specifically, use the data generated by the analog circuit to directly update the thermal feedback map, and these data include real-time voltage, current, temperature, etc. For example, through LTspice or MATLAB / Simulink to simulate the circuit, obtain the voltage, current, and temperature data of the component in real time and update the thermal feedback map. Indirectly update the performance parameters in the thermal feedback map according to the existing performance model or empirical formula. For example, indirectly update the temperature data in the thermal feedback map according to the relationship between the temperature change rate (dT / dt) and time (t).

[0072] Step S330, determine the target thermal feedback state and perform a directional evaluation on the thermally feedback map updated in real time. Specifically, determine the target thermal feedback state according to the set thermal feedback state. For example, determine the thermal stress accumulation, thermal stability, mechanical strength, and packaging reliability of the target component under temperature cycling, constant high temperature, and dynamic temperature. For example, determine the thermal stability of the target component within the range of -40°C to 150°C. Perform a directional evaluation on the thermally feedback map updated in real time according to the target thermal feedback state. For example, evaluate the performance change of the target component under temperature cycling, or its stability under constant high temperature. Use data processing software (such as MATLAB, Python) to analyze the thermal feedback map and generate an evaluation report.

[0073] For example, assume that the target component is a power MOSFET, and determine the following target thermal feedback states: thermal stability in the range of -40°C to 150°C; constant high-temperature performance when operating at 150°C for 1000 hours; thermal stress accumulation under dynamic temperature with the temperature changing hourly between 0°C and 100°C. Based on the target thermal feedback states, conduct a directional evaluation of the real-time updated thermal feedback map. For example, evaluate the performance changes of the target component under temperature cycling, as shown in Table 4.

[0074] Table 4: Example of Thermal Stability Evaluation under Temperature Cycling

[0075] This implementation method can comprehensively evaluate the performance of the target component under different thermal conditions by setting multiple thermal feedback states. By real-time updating the thermal feedback map, it can capture the performance changes of the target component under dynamic conditions, improving the comprehensiveness of performance evaluation. Through the direct update of simulation data and the indirect update of performance parameters, the accuracy and integrity of the thermal feedback map are ensured. Conducting a directional evaluation based on the target thermal feedback states can more accurately identify problems and improve the reliability of testing.

[0076] In a possible implementation, to determine the performance test result, step S300 further includes step S340 of determining the directional evaluation result based on the target thermal feedback states. Specifically, according to the target thermal feedback states (such as temperature cycling, constant high temperature, thermal stress accumulation under dynamic temperature, thermal stability, mechanical strength, and package reliability), extract relevant evaluation results from the real-time updated thermal feedback map. For example, for thermal stability under constant high temperature, extract the performance parameter changes when operating at 150°C for 1000 hours. Conduct a statistical analysis of the extracted evaluation results to determine the change trend and stability of the performance parameters. For example, calculate statistics such as the mean, standard deviation, maximum value, and minimum value of the performance parameters to evaluate the change range and fluctuation of the performance parameters.

[0077] Step S350, based on the directional evaluation result and the real-time updated thermal feedback map, determine the performance test result. Specifically, combine the directional evaluation result and the real-time updated thermal feedback map to comprehensively evaluate the performance of the target component. For example, according to the statistical analysis result, evaluate whether the thermal stability of the target component under constant high temperature meets the design requirements. Conduct a trend analysis of the real-time updated thermal feedback map to determine the change trend of the performance parameters over the entire test cycle. For example, analyze the change trend of power consumption over time to determine whether there is performance degradation or abnormality. Based on the comprehensive evaluation and trend analysis results, determine the final performance test result. For example, if the average performance change is within the design allowable range (such as less than 1%), it is considered that the thermal stability of the target component under constant high temperature is good.

[0078] This implementation method can more comprehensively evaluate the performance of target components by combining the results of directional evaluation and a real-time updated thermal feedback map. Through statistical analysis, it can more accurately evaluate the change trend and stability of performance parameters, improving the reliability of testing.

[0079] The embodiment of the present application adopts technical means based on a thermal feedback topology. By obtaining the access circuit of the target component and performing circuit scenario simulation, non-target components in the access circuit are replaced with black box structures to reduce interference. An abstract surface is determined layer by layer for the structure centered on the chip, a multi-axial thermal feedback map including multiple performance parameters, temperature, and time is constructed and dynamically driven training is performed. The thermal feedback map is dynamically updated using the periodic simulation of the analog circuit. After intervening in the target thermal feedback state, decomposition calls and directional evaluations are executed, solving the technical problems of insufficient accuracy and comprehensiveness in performance evaluation existing in the performance testing of existing power components, and achieving the technical effect of accurately and comprehensively testing the performance of power components.

[0080] In the above, reference is made to Figure 1 The method for testing the performance of power components based on a thermal feedback topology according to an embodiment of the present invention is described in detail. Next, reference will be made to Figure 2 Describe the system for testing the performance of power components based on a thermal feedback topology according to an embodiment of the present invention.

[0081] The system for testing the performance of power components based on a thermal feedback topology according to an embodiment of the present invention is used to solve the technical problems of insufficient accuracy and comprehensiveness in performance evaluation existing in the performance testing of existing power components, and achieve the technical effect of accurately and comprehensively testing the performance of power components. The system for testing the performance of power components based on a thermal feedback topology includes: an analog circuit determination module 10, a thermal feedback map construction module 20, and a performance test result determination module 30.

[0082] The analog circuit determination module 10 is used to obtain the access circuit of the target component, perform circuit scenario simulation, and determine the analog circuit, where non-target components in the access circuit are replaced with black box structures; the thermal feedback map construction module 20 is used to, for the target component, determine the abstract surface layer by layer for the structure centered on the chip, determine multiple axes with multiple performance parameters, temperature, and time, construct a thermal feedback map and perform dynamic drive training, where the thermal feedback map is built into the test system and has a temporary communication with the analog circuit; the performance test result determination module 30 is used to, by performing the periodic simulation of the analog circuit, dynamically update the thermal feedback map, intervene in the target thermal feedback state, perform decomposition calls and directional evaluations based on the thermal feedback map, and determine the performance test result, where the dynamic update includes direct update based on simulation data and indirect update based on non-simulation data.

[0083] Next, the specific configuration of the analog circuit determination module 10 will be described in detail. As described above, the analog circuit determination module 10 may further include: a non-target component circuit access position positioning unit for the access circuit to include at least one target component, and for the access circuit, position the circuit access position of the non-target component, wherein the input-output direction of each non-target component located at the circuit access position is determined according to the circuit power flow direction; a linear state relationship mining unit for mining the linear state relationship of each non-target component with input-output as the demand orientation; and a black box structure replacement unit for performing black box structure replacement of the non-target component on the access circuit according to the circuit access position and the linear state relationship.

[0084] Next, the specific configuration of the thermal feedback map construction module 20 will be described in detail. As described above, with the chip as the center, the abstract surface under the hierarchical packaging is determined. The thermal feedback map construction module 20 may further include: a multi-layer structure surface determination unit for taking the chip as the center and the outermost packaging layer as the boundary, abstractly display the component structure from the center to the boundary, and determine the multi-layer structure surface; a multi-layer packaging characteristic positioning unit for positioning the multi-layer packaging characteristics for the multi-layer structure surface, marking the multi-layer structure surface, and determining the abstract surface.

[0085] Among them, for constructing the thermal feedback map, the thermal feedback map construction module 20 may further include: a plurality of performance parameter determination units for determining a plurality of performance parameters, wherein the plurality of performance parameters define all the performance elements of the target component; a plurality of performance axis determination units for determining a plurality of performance axes for the plurality of performance parameters; and a thermal feedback map determination unit for coupling the abstract surface, the temperature axis, the time axis and the plurality of performance axes to determine the thermal feedback map.

[0086] Among them, for coupling the abstract surface, the temperature axis, the time axis and the plurality of performance axes, the thermal feedback map determination unit may further include: a performance-related variable determination subunit for determining performance-related variables for the plurality of performance parameters; and a correlation coupling establishment subunit for establishing the correlation coupling between each performance axis and the abstract surface, the temperature axis, and the time axis with the performance-related variables.

[0087] Among them, for constructing the thermal feedback map and performing dynamic drive training, the thermal feedback map construction module 20 may further include: a dynamic drive training unit for taking the sample test task as a constraint, taking the sample circuit data as input, and taking the update of the thermal feedback map as output, and performing dynamic drive training on the thermal feedback map; and a thermal feedback map embedding unit for, if the convergence condition is met, embedding and deploying the trained thermal feedback map in the test system and establishing temporary communication between the thermal feedback map and the analog circuit.

[0088] Among them, the thermal feedback map construction module 20 may further include: a switching analog circuit determination unit configured to determine a switching analog circuit as the target component to be tested is switched or the access circuit is switched; a switching analog circuit temporary communication establishment unit configured to interrupt the temporary communication between the thermal feedback map and the analog circuit and establish temporary communication between the switching analog circuit and the thermal feedback map.

[0089] Next, the specific configuration of the performance test result determination module 30 will be described in detail. As described above, intervening in the target thermal feedback state and performing decomposition calls and directional evaluations based on the thermal feedback map, the performance test result determination module 30 may further include: a thermal feedback state setting unit configured to set a thermal feedback state, where the thermal feedback state at least includes temperature cycling, constant high temperature, thermal stress accumulation under dynamic temperature, thermal stability, mechanical strength, and package reliability, and the thermal stability is conditional on wide temperature range stability; a thermal feedback map updating unit configured to update the thermal feedback map in real time through the analog circuit, including direct updating of analog data and indirect updating of performance parameters; and a directional evaluation unit configured to determine a target thermal feedback state and perform a directional evaluation on the thermal feedback map updated in real time.

[0090] Among them, for determining the performance test result, the performance test result determination module 30 may further include: a directional evaluation result determination unit configured to determine a directional evaluation result based on the target thermal feedback state; and a performance test result determination unit configured to determine the performance test result based on the directional evaluation result and the thermal feedback map updated in real time.

[0091] The power component performance test system based on thermal feedback topology provided by the embodiments of the present invention can execute the power component performance test method based on thermal feedback topology provided by any embodiment of the present invention, and has corresponding functional modules and beneficial effects for executing the method.

[0092] Although various references are made to certain modules in the systems of the embodiments of the present application, any number of different modules may be used and run on a user terminal and / or a server. The various units and modules included are only divided according to functional logic, but are not limited to the above division as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of mutual distinction and do not limit the protection scope of the present invention.

[0093] The above specific embodiments do not constitute a limitation on the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application shall be included within the protection scope of the present application. In some cases, the actions or steps recited in the present application can be executed in a sequence different from that in the embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

Claims

1. A power component performance testing method based on thermal feedback topology, characterized in that: The method comprises: Obtaining access circuits of target components, performing circuit scenario simulation, and determining simulation circuits, wherein non-target components of the access circuits are replaced with black box structures; For the target components, the abstract surface of the structure under layer-by-layer packaging is determined with the chip as the center, and the multi-axis is determined with multiple performance parameters, temperature and time, and a thermal feedback map is constructed and dynamic drive training is performed, wherein the thermal feedback map is built into the test system and establishes temporary communication with the simulation circuit; By performing periodic simulation of the analog circuit, the thermal feedback map is dynamically updated, the target thermal feedback state is intervened, and decomposition call and directional evaluation based on the thermal feedback map are performed to determine the performance test results, wherein the dynamic update includes direct update based on analog data and indirect update based on non-analog data.

2. The power component performance testing method based on thermal feedback topology according to claim 1, characterized in that: The access circuit includes at least one target component; For the access circuit, locate the circuit access position of the non-target components, wherein the input-output direction of each non-target component at the circuit access position is determined according to the circuit power flow direction; Guided by input-output requirements, the linear state relationship of each non-target component is mined; According to the relationship between the circuit access position and the linear state, a black box structure replacement of non-target components is performed on the access circuit.

3. The power component performance testing method based on thermal feedback topology according to claim 1, characterized in that: The chip is the center of the structure, and the abstract surface of each layer of packaging is determined, including: With the chip as the center and the outermost packaging layer as the boundary, the component structure from the center to the boundary is abstractly displayed to determine the multi-layer structure surface; For the multi-layer structure surface, the multi-layer packaging characteristics are located, the multi-layer structure surface is marked, and the abstract surface is determined.

4. The power component performance testing method based on thermal feedback topology according to claim 3, characterized in that: Construct a thermal feedback map, including: Determining a plurality of performance parameters, wherein the plurality of performance parameters define all performance factors of the target component; Determining a plurality of performance axes for the plurality of performance parameters; The abstract surface, the temperature axis, the time axis and the plurality of performance axes are coupled to determine the thermal feedback map.

5. The power component performance testing method based on thermal feedback topology according to claim 4, characterized in that: The abstract surface, the temperature axis, the time axis and the plurality of performance axes are coupled, including: For the plurality of performance parameters, determining performance-related variables; The correlation coupling between each performance axis and the abstract surface, temperature axis, and time axis is established using the performance-related variables.

6. The power component performance testing method based on thermal feedback topology according to claim 1, characterized in that: Build a thermal feedback map and conduct dynamic drive training, including: Taking the sample test task as a constraint, taking the sample circuit data as an input, and taking the update of the thermal feedback map as an output, dynamically driving the thermal feedback map; If the convergence condition is met, the trained thermal feedback graph is embedded and deployed in the test system, and temporary communication between the thermal feedback graph and the analog circuit is established.

7. The power component performance testing method based on thermal feedback topology according to claim 1, characterized in that: Determining a switching simulation circuit along with the switching of the target component to be tested or the switching of the access circuit; The temporary communication between the thermal feedback map and the analog circuit is interrupted, and the temporary communication between the switching analog circuit and the thermal feedback map is established.

8. The power component performance testing method based on thermal feedback topology according to claim 1, characterized in that: Intervene in the target thermal feedback state, and perform decomposition call and directional evaluation based on the thermal feedback map, including: Setting a thermal feedback state, wherein the thermal feedback state at least includes temperature cycling, constant high temperature, thermal stress accumulation under dynamic temperature, thermal stability, mechanical strength and packaging reliability, and the thermal stability is based on stability over a wide temperature range; By means of the analog circuit, the thermal feedback map is updated in real time, including direct update of analog data and indirect update of performance parameters; The target thermal feedback state is determined, and a directional evaluation is performed on the thermal feedback map updated in real time.

9. The power component performance testing method based on thermal feedback topology according to claim 8, characterized in that: Determine performance test results, including: determining a directional assessment result based on the target thermal feedback state; The performance test result is determined based on the directional evaluation result and the thermal feedback map updated in real time.

10. A power component performance test system based on thermal feedback topology, characterized in that: The system is used to implement the power component performance testing method based on thermal feedback topology according to any one of claims 1 to 9, and the system comprises: The simulation circuit determination module is used to obtain the access circuit of the target component, perform circuit scenario simulation, and determine the simulation circuit, wherein the non-target components of the access circuit are replaced with a black box structure; A thermal feedback map construction module is used to determine the abstract surface of the structure under layer-by-layer packaging with the chip as the center for the target component, determine the multi-axis with multiple performance parameters, temperature and time, construct a thermal feedback map and perform dynamic drive training, wherein the thermal feedback map is built into the test system and establishes temporary communication with the simulation circuit; The performance test result determination module is used to dynamically update the thermal feedback map by performing periodic simulation of the analog circuit, intervene in the target thermal feedback state, perform decomposition call and directional evaluation based on the thermal feedback map, and determine the performance test result, wherein the dynamic update includes direct update based on simulation data and indirect update based on non-simulation data.

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