Display device

Abstract

The invention relates to a display device. The display device may include: a substrate; a transparent partition wall disposed on the substrate, the transparent partition wall configured to define a plurality of openings; a light shielding member disposed on an upper surface and a side surface of the transparent partition wall, the light shielding member including a negative photosensitive organic material; and a first color conversion pattern disposed in at least one of the plurality of openings, the first color conversion pattern including a quantum dot material or a fluorescent material.

Description

[0001] This application is a divisional application of the invention patent application with the application date of July 20, 2018, the application number of 201810801664.6, and the title of "Display Device and Method of Manufacturing the Same".

[0002] Cross - reference to related applications

[0003] This application claims the priority and benefit of Korean Patent Application No. 10 - 2017 - 0095072, filed on July 27, 2017, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical field

[0004] Exemplary embodiments relate to a display device and a method of manufacturing the same. Background art

[0005] With the development of multimedia, display devices have become increasingly important. Accordingly, various display devices such as liquid crystal displays (LCDs) and organic light - emitting diode (OLED) displays are being developed.

[0006] Specifically, an LCD includes a display panel, a liquid crystal layer, and a light source unit that provides light to the display panel. The display panel includes field - generating electrodes such as pixel electrodes and common electrodes. The LCD rearranges the liquid crystal by applying a voltage to the field - generating electrodes, thereby controlling the amount of light passing through the liquid crystal layer for each pixel. Accordingly, an image is displayed on the LCD.

[0007] As a way to make each pixel uniquely display one primary color, color conversion patterns can be placed in each pixel on the light path from the light source to the observer. For example, a color filter can achieve a primary color by absorbing a specific band of incident light and transmitting only another specific band. Meanwhile, methods for further improving the color purity of display devices need to be developed.

[0008] Wavelength - shifting materials such as quantum dots or fluorescent materials shift the peak wavelength of incident light to emit light having a color different from that of the incident light. That is, color conversion patterns can be implemented using wavelength - shifting materials. However, if the light emitted by the wavelength - shifting material propagates to another adjacent pixel, a defect of light leakage from an unexpected pixel, i.e., a light leakage defect, may occur.

[0009] The above information disclosed in this background art section is only for enhancing the understanding of the background of the inventive concept, and thus, it may include information that does not constitute prior art known to those skilled in the art in this country. Summary of the invention

[0010] Exemplary embodiments provide a display device having improved display quality.

[0011] Exemplary embodiments also provide a method of manufacturing a display device having improved display quality.

[0012] Additional aspects will be set forth in the detailed description below and will be partly apparent from the present disclosure, or can be learned by practice of the inventive concept.

[0013] According to an exemplary embodiment, a display device may include: a substrate; a transparent partition wall disposed on the substrate, the transparent partition wall being configured to define a plurality of openings; a light-shielding member disposed on an upper surface and a side surface of the transparent partition wall, the light-shielding member including a negative photosensitive organic material; and a first color conversion pattern disposed in at least one of the plurality of openings, the first color conversion pattern including a quantum dot material or a fluorescent material.

[0014] The transparent partition wall may include: a plurality of first partition wall portions extending in a first direction; and a plurality of second partition wall portions extending in a second direction intersecting the first direction, wherein the openings may be defined by the first partition wall portions and the second partition wall portions, and the light-shielding member has a lattice shape in a plan view.

[0015] A surface of the light-shielding member disposed on the upper surface of the transparent partition wall may have a greater hydrophobicity than a surface of the light-shielding member disposed on the side surface of the transparent partition wall.

[0016] The light-shielding member disposed on the upper surface of the transparent partition wall may have a greater thickness than the light-shielding member disposed on the side surface of the transparent partition wall.

[0017] The light-shielding member disposed on the upper surface of the transparent partition wall may have a thickness of about 1.3 μm or greater and an optical density of about 2.0 / 1.3 μm or greater.

[0018] The light-shielding member may be directly disposed on the transparent partition wall, and the light-shielding member includes: a first surface, at least a part of which directly contacts the transparent partition wall; and a second surface facing away from the first surface, wherein the roughness of the second surface may be greater than the roughness of the first surface.

[0019] The light-shielding member may further include: a third surface connecting the first surface and the second surface, wherein the roughness of the second surface may be greater than the roughness of the third surface.

[0020] The transparent partition wall may have a light transmittance of about 90% or greater.

[0021] The transparent partition wall may include particles dispersed therein.

[0022] The side surface of the transparent partition wall may be inclined at an average inclination angle with respect to the surface of the substrate, where the transparent partition wall may have a height of about 7.0 μm or greater, and where the average inclination angle may be about 30 degrees to 85 degrees.

[0023] The display device may include: a first pixel configured to display a first color; a second pixel configured to display a second color having a peak wavelength shorter than that of the first color; a third pixel configured to display a third color having a peak wavelength shorter than that of the second color, where the display device may further include: a liquid crystal layer disposed on the first color conversion pattern; a band filter disposed between the first color conversion pattern and the liquid crystal layer, the band filter being configured to selectively transmit light in a band having a peak wavelength including the third color and selectively block light in a band having a peak wavelength longer than the peak wavelength of the third color; and a light source disposed on the liquid crystal layer, the light source being configured to provide light of the third color, where the first color conversion pattern is disposed in the first pixel and is configured to convert the color of incident light into the first color, and where at least a portion of the band filter may be in direct contact with the light-shielding member.

[0024] At least a portion of the band filter may be in direct contact with the first color conversion pattern and the light-shielding member, and the band filter has a substantially constant thickness.

[0025] The display device may further include: a second color conversion pattern disposed in the second pixel; and a light-transmitting pattern disposed in the third pixel, where the second color conversion pattern is configured to convert the color of incident light into the second color, where the light-shielding member may be disposed between the first color conversion pattern and the second color conversion pattern, and where the light-shielding member is disposed between the first color conversion pattern and the light-transmitting pattern.

[0026] The display device includes: a first pixel configured to display a first color; a second pixel configured to display a second color having a peak wavelength shorter than that of the first color; and a third pixel configured to display a third color having a peak wavelength shorter than that of the second color, where the display device may further include: a liquid crystal layer disposed on the first color conversion pattern; a light source disposed on the liquid crystal layer, the light source being configured to provide light of the third color; and a band filter disposed between the light-shielding member and the first color conversion pattern, the band filter being configured to selectively transmit light in a band having a peak wavelength longer than the peak wavelength of the third color and selectively block light in a band having a peak wavelength including the third color, where at least a portion of the band filter may be disposed on the upper surface of the transparent partition wall.

[0027] The display device may further include: a band filter disposed between the light-shielding member and the first color conversion pattern, the band filter being configured to selectively transmit light of a specific band, wherein the band filter does not overlap with the upper surface of the transparent partition wall, and wherein at least a part of the first color conversion pattern is in direct contact with the light-shielding member.

[0028] The display device may further include a band filter disposed between the substrate and the transparent partition wall, the band filter being configured to selectively transmit light of a specific band.

[0029] The display device may further include an opaque material pattern disposed between the band filter and the transparent partition wall, the opaque material pattern including a material different from that of the light-shielding member.

[0030] The display device may further include: a band filter disposed between the substrate and the first color conversion pattern, the band filter being configured to selectively transmit light of a specific band; and an opaque material pattern disposed between the substrate and the light-shielding member, the opaque material pattern including a material different from that of the light-shielding member.

[0031] The display device may further include: a band filter disposed between the substrate and the first color conversion pattern, the band filter being configured to selectively transmit light of a specific band; and an opaque material pattern disposed between the substrate and the transparent partition wall, the opaque material pattern including a material different from that of the light-shielding member.

[0032] The display device may further include: a first light-transmissive layer disposed on the light-shielding member to surround at least a part of the light-shielding member; and a second light-transmissive layer disposed directly on the first light-transmissive layer to surround at least a part of the first light-transmissive layer, wherein the refractive index of the second light-transmissive layer may be greater than that of the first light-transmissive layer.

[0033] The display device may further include: a first light-transmissive layer disposed on the upper surface and the side surface of the transparent partition wall to surround at least a part of the transparent partition wall; and a second light-transmissive layer disposed between the first light-transmissive layer and the light-shielding member to surround at least a part of the first light-transmissive layer, wherein the refractive index of the second light-transmissive layer may be greater than that of the first light-transmissive layer.

[0034] According to an exemplary embodiment, a method of manufacturing a display device may include: disposing a partition wall pattern and an opaque material pattern having light transmissivity on a first surface of a substrate; coating a light-shielding member forming composition onto the partition wall pattern and the opaque material pattern; and using the opaque material pattern as a light-shielding mask to form a light-shielding member on the upper surface and the side surface of the partition wall pattern by irradiating light from a second surface of the substrate.

[0035] Arranging the partition wall pattern and the opaque material pattern may include: arranging the opaque material pattern on the first surface of the substrate such that at least a part of the first surface of the substrate is exposed; and arranging the partition wall pattern on the exposed first surface of the substrate.

[0036] Arranging the opaque material pattern may include: arranging an opaque material layer on the first surface of the substrate; arranging a positive photosensitive layer on the opaque material layer; forming a positive photosensitive pattern layer using a mask as a light-shielding mask; and forming the opaque material pattern by partially etching the opaque material layer using the positive photosensitive pattern layer as an etching mask, wherein arranging the partition wall pattern may include: arranging a negative photosensitive layer on the opaque material pattern; and forming the partition wall pattern using a mask as a light-shielding mask.

[0037] At least a part of the partition wall pattern may overlap with the opaque material pattern.

[0038] The partition wall pattern may be spaced apart from the opaque material pattern, and at least a part of the first surface of the substrate may be exposed without being covered by the partition wall pattern and the opaque material pattern.

[0039] Coating the light-shielding member forming composition includes: arranging the light-shielding member forming composition in the space between the partition wall pattern and the opaque material pattern, and at least a part of the light-shielding member may directly contact the substrate.

[0040] Coating the light-shielding member forming composition may include: arranging the light-shielding member forming composition to have a thickness greater than the height of the partition wall pattern.

[0041] The method of manufacturing a display device may further include: after coating the light-shielding member forming composition, treating the entire surface of the coated light-shielding member forming composition with fluorine.

[0042] The method of manufacturing a display device may further include: after irradiating light, forming a concave and convex pattern layer on the surface of the uncured light-shielding member forming composition and on the surface of the light-shielding member formed on the upper surface of the partition wall pattern.

[0043] The method of manufacturing a display device may further include: before arranging the partition wall pattern and the opaque material pattern, arranging a band-pass filter pattern on the first surface of the substrate, wherein the opaque material pattern may be formed on the band-pass filter pattern to overlap with the band-pass filter pattern, and the opaque material pattern may be narrower than the band-pass filter pattern.

[0044] Arranging the partition wall pattern and the opaque material pattern may include: arranging the partition wall pattern on the first surface of the substrate such that at least a part of the first surface of the substrate is exposed; and arranging the opaque material pattern on the part of the first surface of the substrate exposed by the partition wall pattern.

[0045] At least a part of the pattern of the opaque material overlaps with the pattern of the partition wall.

[0046] The method of manufacturing a display device may further include, after forming the light-shielding member: exposing at least a part of the first surface of the substrate by removing at least a part of the pattern of the opaque material; disposing an ink composition on the exposed first surface of the substrate, the ink composition containing a wavelength-shifting material; and curing the ink composition.

[0047] Forming the light-shielding member may include: pre-baking the light-shielding member forming composition; partially photocuring the pre-baked light-shielding member forming composition by using the pattern of the opaque material as a light-shielding mask; developing by applying a developer to the partially photocured light-shielding member forming composition to form a light-shielding member disposed on the upper surface and the side surface of the partition wall pattern; and hard-baking the light-shielding member, wherein partially photocuring the pre-baked light-shielding member forming composition may include: irradiating light from the second surface of the substrate; transmitting light through the substrate; transmitting light through the partition wall pattern; transmitting light through the upper surface of the partition wall pattern; and transmitting light through the side surface of the partition wall pattern.

[0048] The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter. Description of the Drawings

[0049] The drawings are included to provide a further understanding of the inventive concept and are incorporated into and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the specification, are used to explain the principles of the inventive concept.

[0050] Figure 1 is an exploded perspective view of a display device according to an exemplary embodiment;

[0051] Figure 2 is Figure 1 the layout of any pixel of the display device shown;

[0052] Figure 3 is along Figure 2 a cross-sectional view of the first display panel taken along the section line III-III';

[0053] Figure 4 is along Figure 2 a cross-sectional view taken along the section line IV-IV';

[0054] Figure 5 is Figure 4 an enlarged view of the region “A” of

[0055] Figure 6 is alongFigure 2 A sectional view taken along the section line VI-VI';

[0056] Figure 7 is Figure 4 and Figure 6 A schematic perspective view of the partition wall shown;

[0057] Figure 8 Illustrates the path of light through Figure 4 the second display panel;

[0058] Figure 9A and Figure 9B Illustrate a display device according to an exemplary embodiment;

[0059] Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A , Figure 13B , Figure 14A , Figure 14B , Figure 15A , Figure 15B , Figure 16A , Figure 16B , Figure 17A , Figure 17B , Figure 18A , Figure 18B , Figure 19A , Figure 19B , Figure 20A , Figure 20B , Figure 21A , Figure 21B , Figure 21C , Figure 22A , Figure 22B , Figure 23A , Figure 23B , Figure 24A , Figure 24B , Figure 25A and Figure 25B Illustrate a display device according to an embodiment;

[0060] Figure 26A , Figure 26B , Figure 26C , Figure 26D , Figure 26E , Figure 26F , Figure 26G , Figure 26H , Figure 26I , Figure 26J , Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O Is a sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment;

[0061] Figure 27A , Figure 27B , Figure 27C , Figure 27D , Figure 27E and Figure 27F is a cross-sectional view illustrating a method of manufacturing a display device according to an exemplary embodiment; and

[0062] Figure 28A , Figure 28B , Figure 28C , Figure 28D , Figure 28E , Figure 28F , Figure 28G , Figure 28H , Figure 29A , Figure 29B , Figure 29C , Figure 29D , Figure 29E , Figure 29F , Figure 29G , Figure 29H , Figure 30A , Figure 30B , Figure 30C , Figure 30D , Figure 30E , Figure 30F , Figure 31A , Figure 31B , Figure 31C , Figure 31D , Figure 31E , Figure 31F , Figure 32A , Figure 32B , Figure 32C , Figure 32D , Figure 32E , Figure 32F , Figure 33A , Figure 33B , Figure 33C , Figure 33D , Figure 33E , Figure 33F , Figure 34A , Figure 34B , Figure 34C , Figure 34D , Figure 34E , Figure 34F , Figure 35A , Figure 35B , Figure 35C , Figure 35D , Figure 35E , Figure 35F , Figure 35G , Figure 36A , Figure 36B , Figure 36C , Figure 36D , Figure 36E , Figure 36F , Figure 36G ,Figure 37A , Figure 37B , Figure 37C , Figure 37D , Figure 37E , Figure 37F , Figure 37G and Figure 37H are cross-sectional views illustrating a method of manufacturing a display device according to an embodiment. Detailed Description

[0063] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments. However, it will be apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring various exemplary embodiments.

[0064] In the drawings, for clarity and description purposes, the dimensions and relative dimensions of layers, films, panels, regions, etc. may be exaggerated. Additionally, like reference numerals denote like elements.

[0065] When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, no intervening elements or layers are present. For purposes of the present disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be construed to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. Throughout the specification, like numerals refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0066] Although terms such as first, second, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or section from another element, component, region, layer, and / or section. Thus, a first element, component, region, layer, and / or section discussed below may be referred to as a second element, component, region, layer, and / or section without departing from the teachings of the present disclosure.

[0067] For descriptive purposes, spatial relational terms such as "below", "beneath", "under", "above", "on" and the like may be used herein to describe the relationship of one element or feature illustrated in the drawings to another element or feature. Spatial relational terms are intended to cover different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, an element described as "below" or "beneath" another element or feature will then be "above" the other element or feature. Thus, the exemplary term "below" can encompass both an orientation of above and below. Also, the device may be oriented in other directions (e.g., rotated 90 degrees or toward other orientations), and thus the spatial relational descriptors used herein are to be interpreted accordingly.

[0068] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, the singular forms "a" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Additionally, the terms "comprises" and / or "comprising", when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0069] In this disclosure, various exemplary embodiments are described with reference to cross-sectional illustrations that are schematic illustrations of idealized exemplary embodiments and / or intermediate structures. As a result, for example, of manufacturing techniques and / or tolerances, variations between the illustrated shapes are to be expected. Thus, the exemplary embodiments disclosed herein should not be construed as limited to the particular region shapes illustrated, but will include deviations in shapes resulting from, for example, manufacturing. For example, an insertion region illustrated as rectangular will typically have rounded or curved features and / or a gradient of insertion concentration at its edges, rather than a binary change from an inserted to a non-inserted region. Similarly, an implanted region formed by implantation may cause some implantation in the region between the implanted region and the surface into which the implantation is performed. Thus, the regions illustrated in the drawings are in fact schematic, their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to be limiting.

[0070] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and not to be interpreted in an idealized or overly formal sense, unless expressly so defined herein.

[0071] Next, embodiments of the inventive concept will be described with reference to the drawings.

[0072] Figure 1 is an exploded perspective view of a display device 1 according to an exemplary embodiment. Figure 2 is Figure 1 the layout of any pixel of the display device 1 shown.

[0073] Reference Figure 1 and Figure 2 , the display device 1 according to an exemplary embodiment includes a display panel 31 and a light source unit 50 that provides light to the display panel 31.

[0074] The display panel 31 may include a first display panel SUB1, a second display panel SUB2 facing the first display panel SUB1, and a liquid crystal layer LCL disposed between the first display panel SUB1 and the second display panel SUB2. The liquid crystal layer LCL may be sealed by the first display panel SUB1, the second display panel SUB2, and a sealing member that binds the first display panel SUB1 and the second display panel SUB2 together.

[0075] A plurality of pixels arranged substantially in a matrix form in a plan view may be defined in the display panel 31. As used herein, a "pixel" refers to a region formed by dividing a display area to display a color image in a plan view, and one pixel may exhibit a predetermined primary color. That is, one pixel may be the smallest unit of the display panel 31 that can exhibit a color independent of other pixels.

[0076] The pixels may include a first pixel PXa that displays a first color, a second pixel PXb that displays a second color, and a third pixel PXc that displays a third color, the second color having a peak wavelength shorter than the first color, and the third color having a peak wavelength shorter than the second color. In an exemplary embodiment, the first pixel PXa, the second pixel PXb, and the third pixel PXc arranged in sequence in a first direction X may form a basic unit, and the basic unit may be repeated in the first direction X. Additionally, each of the first pixel PXa, the second pixel PXb, and the third pixel PXc may be repeated in a second direction Y.

[0077] For example, the first pixel PXa may be a pixel that displays a first color (red), the second pixel PXb adjacent to the first pixel PXa in the first direction X may be a pixel that displays a second color (green), and the third pixel PXc adjacent to the second pixel PXb in the first direction X may be a pixel that displays a third color (blue), the first color having a peak wavelength in the range of approximately 610 nanometers (nm) to 650 nanometers, the second color having a peak wavelength in the range of approximately 530 nm to 570 nm, and the third color having a peak wavelength in the range of approximately 430 nm to 470 nm.

[0078] In addition, a fourth pixel PXd adjacent to the first pixel PXa in the second direction Y may also display the first color, a fifth pixel PXe adjacent to the second pixel PXb in the second direction Y may also display the second color, and a sixth pixel PXf adjacent to the third pixel PXc in the second direction Y may also display the third color.

[0079] The display panel 31 may include a plurality of gate lines GL extending in the first direction X and a plurality of data lines DL extending in the second direction Y and insulated from the gate lines GL. The gate lines GL and the data lines DL may be respectively connected to a driving unit to transmit driving signals to pixel electrodes PE disposed in the pixels.

[0080] The light source unit 50 may be disposed under the display panel 31 and emit light having a specific wavelength toward the display panel 31. The light source unit 50 may include a light source that directly emits light and a light guide plate that guides the light received from the light source to the display panel 31. The material of the light guide plate is not particularly limited. For example, the light guide plate may include at least one of a glass material, a quartz material, and a plastic material (such as polyethylene terephthalate or polycarbonate).

[0081] The light source may be a light emitting diode (LED) or an organic light emitting diode (OLED). In an exemplary embodiment, the light source may emit light having a peak wavelength shorter than the first color and the second color.

[0082] Although not shown in the drawings, one or more optical sheets may be disposed between the display panel 31 and the light source unit 50. The optical sheet may include at least one of a prism sheet, a diffusion sheet, a (reflective) polarizing sheet, a lenticular lens sheet, and a microlens sheet. The optical sheet may improve the display quality of the display device 1 by modulating the optical characteristics (e.g., condensing, diffusing, scattering, or polarizing characteristics) of the light that propagates toward the display panel 31 after being emitted from the light source unit 50.

[0083] Now, reference will be made to Figure 3 to describe the first display panel SUB1 of the display panel 31 in more detail.

[0084] Figure 3 is a cross-sectional view of the first display panel SUB1 taken along the section line III-III' of Figure 2 .

[0085] Referring to Figure 1 , Figure 2 and Figure 3 , the first display panel SUB1 includes a first substrate BS1, a switching element Q disposed on the surface ( Figure 3 the upper surface in

[0086] The first substrate BS1 may include a transparent insulating substrate. For example, the first substrate BS1 may be made of at least one of a glass material, a quartz material, and a transparent plastic material. In an exemplary embodiment, the first substrate BS1 may be flexible, and the display device 1 may be a curved display device.

[0087] A plurality of switching elements Q may be arranged on the first substrate BS1. Each of the switching elements Q may be arranged in a corresponding one of the pixels PXa, PXb, and PXc to transmit a driving signal to the pixel electrode PE or block the driving signal. In an exemplary embodiment, each of the switching elements Q may be a thin film transistor, and the thin film transistor includes a gate electrode GE, an active layer AL disposed on the gate electrode GE, and a source electrode SE and a drain electrode DE disposed on the active layer AL and spaced apart from each other.

[0088] The gate electrode GE may be a control terminal connected to the gate line GL to receive a gate driving signal, the source electrode SE may be an input terminal connected to the data line DL to receive a data driving signal, and the drain electrode DE may be an output terminal electrically connected to the pixel electrode PE. The active layer AL may include at least one of amorphous silicon and polycrystalline silicon, or may include an oxide semiconductor. The active layer AL may serve as a channel for each of the switching elements Q, and the channel may be turned on or off according to a voltage applied to the gate electrode GE. The gate electrode GE and the active layer AL may be insulated from each other by an insulating film GI. Although not shown in the drawings, when the active layer AL is made of amorphous silicon, an ohmic contact layer may be further arranged between the active layer AL and the source electrode SE and the drain electrode DE.

[0089] A first protective layer PS1 may be arranged on the source electrode SE and the drain electrode DE to protect the wirings and electrodes disposed under the first protective layer PS1. The first protective layer PS1 may include an inorganic material. Examples of the inorganic material may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiN x O y , where x > y), and silicon nitride oxide (SiO x N y , where x > y), and at least one of them.

[0090] An intermediate layer IL may be arranged on the switching elements Q. The intermediate layer IL may electrically insulate the elements arranged on the intermediate layer IL from the elements arranged under the intermediate layer IL and planarize the step difference formed by a plurality of elements stacked on the first substrate BS1. The intermediate layer IL may include one or more layers. For example, the intermediate layer IL may include at least one of an organic material and an inorganic material, or may be a stacked structure including a layer of an organic material and a layer made of an inorganic material.

[0091] A plurality of pixel electrodes PE may be disposed on the intermediate layer IL. Each of the pixel electrodes PE may generate an electric field in the liquid crystal layer LCL together with a common electrode CE, which will be described later, so as to control the orientation direction of the liquid crystal LC in the corresponding pixel. The pixel electrodes PE may be electrically connected to the respective drain electrodes DE of the switching elements Q through contact holes formed in the intermediate layer IL and the first protective layer PS1. The pixel electrodes PE may be respectively disposed in the pixels PXa to PXc. Accordingly, independent voltages may be applied to the pixel electrodes PE through the switching elements Q respectively. Each of the pixel electrodes PE may be a transparent electrode made of a transparent conductive material. For example, the transparent electrode may include indium tin oxide (ITO) and indium zinc oxide (IZO). In Figure 2 , each of the pixel electrodes PE is in the form of a flat plate without a slit. However, in an exemplary embodiment, each of the pixel electrodes PE may have a radial slit.

[0092] A first liquid crystal alignment layer LCA1 may be disposed on the pixel electrode PE. The first liquid crystal alignment layer LCA1 may induce an initial alignment of the liquid crystal LC in the adjacent liquid crystal layer LCL. As used herein, "the initial alignment of the liquid crystal" refers to the alignment of the liquid crystal in a state where no electric field is formed in the liquid crystal layer. The first liquid crystal alignment layer LCA1 may include a polymeric organic material having an imide group in the repeating unit of the main chain.

[0093] Now, reference will be made to Figure 4 , Figure 5 , Figure 6 and Figure 7 to describe the liquid crystal layer LCL of the display panel 31 and the second display panel SUB2 in more detail.

[0094] Figure 4 is a cross-sectional view taken along the section line IV-IV' of Figure 2 . Figure 5 is Figure 4 an enlarged view of the region "A" of Figure 6 is a cross-sectional view taken along the section line VI-VI' of Figure 2 . Figure 7 is Figure 4 and Figure 6 a schematic perspective view of the partition wall 110 shown in

[0095] First, the liquid crystal layer LCL will be described.

[0096] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4, the liquid crystal layer LCL includes a plurality of initially oriented liquid crystals LC. The liquid crystals LC may have negative dielectric anisotropy and are vertically oriented in the initial orientation state. The liquid crystal layer LC may have a predetermined pretilt angle in the initial orientation state. The initial orientation of the liquid crystals LC can be induced by the first liquid crystal alignment layer LCA1 and the second liquid crystal alignment layer LCA2. When an electric field is formed between the pixel electrode PE and the common electrode CE, the liquid crystals LC can tilt in a specific direction to change the polarization state of the light passing through the liquid crystal layer LCL. In an exemplary embodiment, the liquid crystals LC may have positive dielectric anisotropy and are horizontally oriented in the initial orientation state. When an electric field is formed, the liquid crystals LC can rotate to change the polarization state of the light.

[0097] Next, the second display panel SUB2 will be described.

[0098] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 , the second display panel SUB2 includes a second substrate BS2, a partition wall 110 disposed on the surface ( Figure 4 the bottom surface in) of the second substrate BS2, a light-shielding member 210 disposed on the partition wall 110, a color conversion pattern 400 disposed on the light-shielding member 210, and a common electrode CE disposed on the color conversion pattern 400. The second display panel SUB2 may further include a polarization layer POL disposed between the color conversion pattern 400 and the common electrode CE.

[0099] Similar to the first substrate BS1, the second substrate BS2 can be a transparent insulating substrate. The partition wall 110 can be disposed on the second substrate BS2. The partition wall 110 can expose at least a part of the surface of the second substrate BS2. That is, the partition wall 110 may have an opening 110h that exposes at least a part of the surface of the second substrate BS2.

[0100] For example, the partition wall 110 may include a plurality of first partition wall portions 111 extending in the first direction X and a plurality of second partition wall portions 112 extending in the second direction Y. The first partition wall portions 111 and the second partition wall portions 112 may intersect each other and may be physically integrated with each other. That is, in a plan view, the first partition wall portions 111 are the portions of the partition wall 110 extending in the first direction X, and in the plan view, the second partition wall portions 112 are the portions of the partition wall 110 extending in the second direction Y. Each of the openings 110h may be surrounded by two adjacent first partition wall portions 111 and two adjacent second partition wall portions 112 and defined by the two adjacent first partition wall portions 111 and the two adjacent second partition wall portions 112. In other words, the partition wall 110 may be disposed at the boundary between adjacent pixels and may have a substantially lattice shape in a plan view.

[0101] In an exemplary embodiment, the first partition wall portions 111 may overlap with the gate electrode GE, the active layer AL, the source electrode SE, the drain electrode DE, and the contact holes formed in the intermediate layer IL, and the second partition wall portions 112 may overlap with the data line DL. The maximum width W of each of the first partition wall portions 111 in the second direction Y 1 may be greater than the maximum width W of each of the second partition wall portions 112 in the first direction X 2 .

[0102] Although the exemplary embodiment is not limited to the following examples, when the color conversion pattern 400 is formed by an inkjet process, the partition wall 110 may help to align the ejected ink composition. That is, the partition wall 110 may serve as a guide for accurately ejecting and smoothly positioning the ink composition for forming the color conversion pattern 400 at a desired position. In other words, the partition wall 110 may make it easy to form the color conversion pattern 400. To form the color conversion pattern 400 having a sufficient thickness, the height H of the partition wall 110 110 may have a lower limit of about 5.0 μm, about 5.5 μm, about 6.0 μm, about 6.5 μm, about 7.0 μm, about 7.5 μm, about 8.0 μm, about 8.5 μm, about 9.0 μm, about 9.5 μm, about 10.0 μm, about 10.5 μm, about 11.0 μm, about 11.5 μm, about 12.0 μm, or about 15.0 μm. Depending on the thickness of the color conversion pattern 400, the height H of the partition wall 110 110 may be at least 5.0 μm or more. Thus, the color conversion pattern 400 having excellent or improved color conversion efficiency may be formed.

[0103] The partition wall 110 may have an upper surface and side surfaces that slope downward from the upper surface. For example, each of the first partition wall portion 111 and the second partition wall portion 112 may have an upper surface 110t that forms a flat surface and side surfaces 110s that slope downward from the upper surface 110t. In an exemplary embodiment, the lower limit of the average inclination angle θ of the side surface 110s of the partition wall 110 with respect to the surface of the second substrate BS2 may be about 30 degrees, about 35 degrees, or about 40 degrees. The upper limit of the average inclination angle θ of the side surface 110s with respect to the surface of the second substrate BS2 may be about 85 degrees, about 80 degrees, about 70 degrees, about 60 degrees, or about 50 degrees. Although the exemplary embodiment is not limited to the following example, when the light-shielding member 210 is to be formed by a back exposure process, the side surface 110s may have a predetermined inclination such that a sufficient amount of light can be easily transmitted not only through the upper surface 110t of the partition wall 110 but also through the side surface 110s of the partition wall 110. Accordingly, a light-shielding member 210 having a sufficient thickness may be formed on the side surface 110s of the partition wall 110. The light-shielding member 210 having a sufficient thickness may suppress or reduce defects, where, for example, when the first color conversion pattern 410 includes the first wavelength shift material 410p, light of the first color emitted by the first wavelength shift material 410p travels into the second color conversion pattern 420 and thus the first color is manifested in the second pixel PXb. That is, light leakage defects may be suppressed or reduced.

[0104] As a non-limiting example, the bottom surface of the partition wall 110 may be wider than the upper surface 110t of the partition wall 110. For example, the width W of the bottom surface of each of the second partition wall portions 112 of the partition wall 110 2 may be about 17 μm to 30 μm, about 18 μm to about 25 μm, or about 20 μm. Additionally, the width W of the upper surface 110t of each of the second partition wall portions 112 of the partition wall 110 T may be about 15 μm to 25 μm, about 17 μm to 20 μm, or about 18 μm.

[0105] The partition wall 110 may have translucency. The light transmittance of the partition wall 110 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The material of the partition wall 110 is not particularly limited as long as it has excellent or improved light transmittance. For example, the material of the partition wall 110 may include organic materials such as epoxy resin, acrylic resin, or imide resin. Specifically, for example, the partition wall 110 may include at least one of ethylene glycol di(meth)acrylate polymers, polyethylene glycol di(meth)acrylate polymers, trimethylolpropane di(meth)acrylate polymers, trimethylolpropane tri(meth)acrylate polymers, pentaerythritol tri(meth)acrylate polymers, pentaerythritol tetra(meth)acrylate polymers, propylene glycol di(meth)acrylate polymers, dipentaerythritol penta(meth)acrylate polymers, dipentaerythritol hexa(meth)acrylate polymers, bisphenol A epoxy (meth)acrylate polymers, tris(acryloyloxyethyl) phosphate polymers, and cardoepoxy diacrylate-based polymers.

[0106] When the partition wall 110 includes an organic material, it may include a photosensitive organic material. The photosensitive organic material may include, but is not limited to, a negative photosensitive material in which the irradiated portion of the light is cured.

[0107] In an exemplary embodiment, the partition wall 110 may further include first particles 110p dispersed therein. The first particles 110p may be a light-scattering material that can scatter the light transmitted through the partition wall 110. The first particles 110p may have a spherical shape or various regular or irregular polygonal shapes. The refractive index of the first particles 110p may be different from that of the partition wall 110. The first particles 110p are not particularly limited as long as they can scatter and reflect the transmitted light. For example, the first particles 110p may be metal oxide particles or organic particles. Examples of the metal oxide may include at least one of titanium oxide (TiO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), indium oxide (In 2 O 3 ), zinc oxide (ZnO), and tin oxide (SnO 2 ). Examples of the organic material may include at least one of acrylic resin and polyurethane resin.

[0108] The light-shielding member 210 may be disposed on the partition wall 110. The light-shielding member 210 may cover the surface of the partition wall 110 protruding from the second substrate BS2. For example, the light-shielding member 210 may be disposed on the upper surface 110t of the partition wall 110. In addition, at least a part of the light-shielding member 210 may be disposed on the side surface 110s of the partition wall 110.

[0109] The light-shielding member 210 may block the transmission of light. The light-shielding member 210 may be disposed at a flat boundary between adjacent pixels to prevent or reduce color mixing between adjacent pixels. In addition, the light-shielding member 210 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The light-shielding member 210 may suppress or reduce defects. For example, when the first color conversion pattern 410 includes the first wavelength-shifting material 410p, the light of the first color emitted by the first wavelength-shifting material 410p travels into the second color conversion pattern 420 and thus the first color is manifested in the second pixel PXb. The light-shielding member 210 may have a light density of about 2.0 / 1.3 μm or more, about 3.0 / 1.3 μm or more, or about 4.0 / 1.3 μm or more. This means that the light density of the light-shielding member 210 having a thickness of 1.3 μm in the thickness direction may be 2.0 or more, about 3.0 or more, or about 4.0 or more.

[0110] The material of the light-shielding member 210 is not particularly limited as long as it can block the transmission of light. For example, the light-shielding member 210 may include an organic material, and the organic material includes a colorant such as a black pigment or dye.

[0111] Examples of the colorant (such as a black pigment or dye) of the light-shielding member 210 may include inorganic pigments such as carbon black, titanium black, lignin black, perylene black, cyanine black, composite oxide pigments such as iron / manganese, and combinations of the above pigments.

[0112] In addition, the light-shielding member 210 may further include an organic material. The organic material is not particularly limited as long as it can provide dispersibility of black pigments or dyes. Examples of the organic material include at least one of ethylene glycol di(meth)acrylate polymers, diethylene glycol di(meth)acrylate polymers, triethylene glycol di(meth)acrylate polymers, 1,6-hexanediol di(meth)acrylate polymers, pentaerythritol tri(meth)acrylate polymers, pentaerythritol tetra(meth)acrylate polymers, dipentaerythritol penta(meth)acrylate polymers, dipentaerythritol hexa(meth)acrylate polymers, bisphenol A epoxy (meth)acrylate polymers, ethylene glycol monomethyl ether (meth)acrylate polymers, trimethylolpropane tri(meth)acrylate polymers, triacryloyloxyethyl phosphate polymers, and cardo epoxy diacrylate-based polymers. When the light-shielding member 210 includes an organic material, the organic material may include a photosensitive organic material. The photosensitive organic material may include, but is not limited to, a negative photosensitive material, and the irradiated portion of the negative photosensitive material is cured.

[0113] In an exemplary embodiment, a first thickness t of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 T may be different from a second thickness t of the light-shielding member 210 disposed on the side surface 110s of the partition wall 110. S For example, the first thickness t of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 T may be greater than the second thickness t of the light-shielding member 210 disposed on the side surface 110s of the partition wall 110. S . The second thickness t S refers to the vertical distance from each side surface 110s of the partition wall 110 to the upper surface of the light-shielding member 210 in a direction perpendicular to the side surface 110s of the partition wall 110. The first thickness t of the light-shielding member 210 T and the second thickness t S are not particularly limited as long as the light-shielding member 210 can completely block or minimize light transmission. For example, the lower limit of each of the first thickness t T and the second thickness t S may be about 1.3 μm, about 1.4 μm, about 1.5 μm, about 2.0 μm, about 2.5 μm, or about 3.0 μm.

[0114] In addition, a length L of the light-shielding member 210 disposed on the side surface 110s of the partition wall 110 S may be greater than the height H of the partition wall 110. 110For example, the length L of the light-shielding member 210 measured along each side surface 110s of the partition wall 110 S may be about 7.0 μm or more. The length L of the light-shielding member 210 S enables the light-shielding member 210 to have a sufficient height component in the third direction Z. In a non-limiting example, the maximum width W of the light-shielding member 210 210 may be about 33 μm or less, about 28 μm or less, or about 23 μm or less.

[0115] In addition, the height H of the partition wall 110 110 may be about twice or more, about 2.5 times or more, or about three times or more the first thickness t of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 T When the partition wall 110 has a height that is about twice or more, about 2.5 times or more, or about 3 times or more the first thickness t of the light-shielding member 210, a color conversion pattern 400 having a sufficient thickness can be formed, and the first thickness t of the light-shielding member 210 T enables the light-shielding member 210 to exhibit sufficient light absorption characteristics. Additionally, the height H of the partition wall 110 T may be about 10 times or less the first thickness t of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 110 can be about 10 times or less the first thickness t of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 T of the light-shielding member 210.

[0116] According to conventional light-shielding members, due to the light absorption characteristics of the light-shielding members, it is difficult to perform photocuring on light-shielding members made of photosensitive materials. Therefore, it is impossible or difficult to form a light-shielding member having a sufficient thickness (height), or the process of forming a light-shielding member having a sufficient thickness (height) is complex. For example, when using a light-shielding member material with a high absorption rate, a conventional light-shielding member cannot be formed to a thickness (height) greater than 1.3 μm. On the other hand, when using a light-shielding member material with a low absorption rate, the light-shielding member cannot properly exhibit light-shielding characteristics, resulting in light leakage defects.

[0117] However, in the display device 1 according to the exemplary embodiment, a partition wall 110 having a sufficient height is formed, and the light-shielding member 210 is disposed to cover the surface of the partition wall 110. Therefore, the light-shielding member 210 can be formed to have a height greater than the height of the partition wall 110 in the height direction, thereby preventing or reducing light leakage defects between adjacent pixels.

[0118] In an exemplary embodiment, the hydrophobicity of the surface of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 may be greater than the hydrophobicity of the surface of the light-shielding member 210 disposed on the side surface 110s of the partition wall 110. For example, the fluorine content per unit area of the surface of the light-shielding member 210 disposed on the upper surface 110t of the partition wall 110 may be greater than the fluorine content per unit area of the surface of the light-shielding member 210 disposed on the side surface 110s of the partition wall 110. That is, the difference in the fluorine content in each region of the surface of the light-shielding member 210 may result in a difference in the hydrophobicity in each region of the surface of the light-shielding member 210. Although the exemplary embodiment is not limited to the following example, when the color conversion pattern 400 is to be formed by an inkjet process, the side surface 110s of the partition wall 110 corresponding to the position where the ink composition is ejected may be lyophilic to the ink composition, and the upper surface 110t of the partition wall 110 may be repellent to the ink composition, thereby facilitating the formation of the color conversion pattern 400.

[0119] The first band filter 310 and the second band filter 320 may be disposed on the light-shielding member 210. Each of the first band filter 310 and the second band filter 320 is a wavelength-selective optical filter that transmits only a predetermined band of incident light by transmitting light having a certain band and blocking light having other bands. The first band filter 310 may be disposed in the opening 110h formed by the partition wall 110 in the first pixel PXa, and the second band filter 320 may be disposed in the opening 110h formed by the partition wall 110 in the second pixel PXb.

[0120] In an exemplary embodiment, each of the first band filter 310 and the second band filter 320 may selectively transmit light having a peak wavelength longer than the peak wavelength of the third color provided by the light source unit 50 and absorb or reflect the light of the third color.

[0121] For example, the first band filter 310 may be disposed in the first pixel PXa to transmit light having a band including the peak wavelength of the first color and absorb light having a band including the peak wavelength of the third color. At least a part of the first band filter 310 may be disposed on the upper surface 110t of the partition wall 110. That is, at least a part of the first band filter 310 may overlap with the upper surface 110t of the partition wall 110 in the third direction Z.

[0122] In addition, the second band filter 320 may be disposed in the second pixel PXb to transmit light in a band having a peak wavelength including a second color and to absorb light in a band having a peak wavelength including a third color. At least a part of the second band filter 320 may be disposed on the upper surface 110t of the partition wall 110. That is, at least a part of the second band filter 320 may overlap with the upper surface 110t of the partition wall 110 in the third direction Z.

[0123] Each of the first band filter 310 and the second band filter 320 may include, but is not limited to, a colorant or a dye that absorbs light in a specific band.

[0124] Accordingly, the first band filter 310 may block light of a third color that is provided from the light source unit 50 and transmitted through the first color conversion pattern 410 without being color-converted by the first color conversion pattern 410. In addition, the second band filter 320 may block light of a third color that is provided from the light source unit 50 and transmitted through the second color conversion pattern 420 without being color-converted by the second color conversion pattern 420. Accordingly, the purity of the first color displayed by the first pixel PXa and the purity of the second color displayed by the second pixel PXb may be improved, thereby improving the display quality of the display device 1.

[0125] At least a part of each of the first band filter 310 and the second band filter 320 may be disposed on the upper surface 110t of the partition wall 110. That is, each of the first band filter 310 and the second band filter 320 may overlap with at least a part of the upper surface 110t of the partition wall 110 in the third direction Z. The first band filter 310 and the second band filter 320 that protrude further upward than the top (i.e., the upper surface) of the partition wall 110 may make the opening 110h deeper, which in turn makes it easy to form the color conversion pattern 400.

[0126] The third band filter 330 may be disposed in the fourth pixel PXd. Similar to the first band filter 310, the third band filter 330 may transmit light in a band having a peak wavelength including a first color and absorb light in a band having a peak wavelength including a third color. The third band filter 330 may be spaced apart from the first band filter 310 in the second direction Y.

[0127] The color conversion pattern 400 may be disposed on the first band filter 310 and the second band filter 320. Each of the color conversion patterns 400 may convert the color of the transmitted light into a color different from the color of the incident light. That is, when light passes through each of the color conversion patterns 400, the light may be converted into light of a predetermined band. In an exemplary embodiment, the first color conversion pattern 410 and the second color conversion pattern 420 of the color conversion pattern 400 may include materials, i.e., wavelength shift materials that convert or shift the peak wavelength of the incident light into a predetermined peak wavelength. Examples of the wavelength shift materials include quantum dot materials and fluorescent materials.

[0128] For example, when electrons transition from the conduction band to the valence band, the quantum dots may emit light of a specific color. The quantum dot material may have a core-shell structure. The core may include semiconductor nanocrystal materials. Examples of the core of the quantum dots may include, but are not limited to, at least one of silicon (Si) nanocrystals, II-VI group compound nanocrystals, and III-V group compound nanocrystals. As a non-limiting example, the wavelength shift material may include a core and a shell made of zinc sulfide (ZnS), and the core includes at least one of cadmium selenide (CdSe), cadmium telluride (CdTe), cadmium sulfide (CdS), and indium phosphide (InP).

[0129] When each of the color conversion patterns 400 includes a wavelength shift material, at least a portion of the light that passes through the corresponding color conversion pattern 400 and propagates in the third direction Z may contribute to the luminescence of the wavelength shift material. To increase the degree of the transmitted light that contributes to the luminescence of the wavelength shift material, it is advantageous for each of the color conversion patterns 400 to have a sufficient thickness t 400 For example, the thickness t 400 of each of the color conversion patterns 400 may have a lower limit of about 5.0 μm, about 5.5 μm, about 6.0 μm, about 6.5 μm, about 7.0 μm, about 7.5 μm, about 8.0 μm, about 8.5 μm, about 9.0 μm, about 9.5 μm, about 10.0 μm, about 10.5 μm, about 11.0 μm, about 11.5 μm, about 12.0 μm, or about 15.0 μm. As described above, by forming the partition wall 110 to a sufficient height, it is possible to easily form the color conversion pattern 400 having a sufficient thickness.

[0130] The color conversion pattern 400 may include a first color conversion pattern 410 and a second color conversion pattern 420. The first color conversion pattern 410 may be disposed in the opening 110h formed by the partition wall 110 in the first pixel PXa, and the second color conversion pattern 420 may be disposed in the opening 110h formed by the partition wall 110 in the second pixel PXb.

[0131] The first color conversion pattern 410 may include a first wavelength shifting material 410p. The first wavelength shifting material 410p may be a material that emits light having a peak wavelength of a first color. The size of the first wavelength shifting material 410p may be, but is not limited to, approximately to In addition, the second color conversion pattern 420 may include a second wavelength shifting material 420p. The second wavelength shifting material 420p may be a material that emits light having a peak wavelength of a second color. The size of the second wavelength shifting material 420p may be, but is not limited to, approximately to

[0132] The light emitted from the first wavelength shifting material 410p and the second wavelength shifting material 420p radiates in all directions regardless of the incident angle of the incident light, and thus, the lateral visibility of the first color and the second color displayed by the display device 1 can be improved. The light emitted from the first color conversion pattern 410 and the second color conversion pattern 420 toward the observer side ( Figure 4 the upper side in) can be depolarized to become non-polarized light. As used herein, "non-polarized light" refers to light that is not composed of only polarization components in a specific direction and is not polarized only in a specific direction. In other words, non-polarized light is composed of random polarization components. An example of non-polarized light is natural light.

[0133] The light shielding member 210 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 that are spaced apart from each other in the horizontal direction (e.g., the first direction X). That is, the first color conversion pattern 410, the light shielding member 210, and the second color conversion pattern 420 may at least partially overlap each other in the horizontal direction. By disposing the light shielding member 210 having sufficient light absorption characteristics between the first color conversion pattern 410 and the second color conversion pattern 420, it is possible to suppress or reduce defects in which, for example, the light emitted from the first wavelength shifting material 410p travels toward the second color conversion pattern 420 such that the second pixel PXb displays the first color, or defects in which the light emitted from the second wavelength shifting material 420p travels toward the first color conversion pattern 410 such that the first wavelength shifting material 410p emits light.

[0134] The light transmissive pattern 510 may be disposed in the opening 110h formed by the partition wall 110 in the third pixel PXc. For example, the light transmissive pattern 510 may be directly disposed on the second substrate BS2 and the light shielding member 210. The light transmissive pattern 510 may transmit the incident light without changing the color of the incident light. That is, the light passing through the light transmissive pattern 510 may still have the third color provided by the light source unit 50.

[0135] In an exemplary embodiment, the light-transmissive pattern 510 may further include second particles 510p. The second particles 510p may be a light-scattering material that can scatter the light transmitted through the light-transmissive pattern 510. The second particles 510p are not particularly limited as long as they can scatter and reflect the transmitted light. For example, the second particles 510p may be metal oxide particles or organic particles. Examples of the metal oxide may include at least one of titanium oxide, zirconium oxide, aluminum oxide, indium oxide, zinc oxide, and tin oxide. Examples of the organic material may include at least one of an acrylic resin and a polyurethane resin.

[0136] The second particles 510p scatter the light of the third color provided from the light source unit 50 and transmitted through the light-transmissive pattern 510 in all directions without changing the wavelength of the light of the third color regardless of the incident angle. Accordingly, the second particles 510p can improve the lateral visibility of the third color displayed by the display device 1. The light emitted toward the observer side through the light-transmissive pattern 510 may be in an unpolarized state. In an exemplary embodiment, the light-transmissive pattern 510 may be omitted.

[0137] The light-shielding member 210 may be disposed between the second color conversion pattern 420 and the light-transmissive pattern 510 that are spaced apart from each other in the horizontal direction (e.g., the first direction X). That is, the second color conversion pattern 420, the light-shielding member 210, and the light-transmissive pattern 510 may at least partially overlap each other in the horizontal direction. By disposing the light-shielding member 210 having sufficient light absorption characteristics between the second color conversion pattern 420 and the light-transmissive pattern 510, it is possible to suppress or reduce defects in which, for example, the light emitted from the second wavelength shift material 420p travels toward the light-transmissive pattern 510 such that the third pixel PXc displays the second color, or defects in which the light scattered by the second particles 510p of the light-transmissive pattern 510 travels toward the second color conversion pattern 420 such that the second wavelength shift material 420p emits light.

[0138] The fourth band filter 610 may be disposed on the color conversion pattern 400 and the light-transmissive pattern 510. The fourth band filter 610 is a wavelength-selective optical filter that transmits only some bands of the incident light by transmitting light having a specific band and blocking light having other bands.

[0139] In an exemplary embodiment, the fourth band filter 610 may selectively reflect light having a peak wavelength longer than the peak wavelength of the third color provided by the light source unit 50 and transmit light of the third color. For example, the fourth band filter 610 may selectively reflect light having a band including the peak wavelength of the first color and light having a band including the peak wavelength of the second color, and transmit light having a band including the peak wavelength of the third color. The fourth band filter 610 may include one or more layers including an inorganic material. For example, the fourth band filter 610 may include a plurality of low refractive index layers and a plurality of high refractive index layers alternately stacked. As used herein, a "low refractive index layer" refers to a layer having a refractive index relatively lower than that of an adjacent layer, and a "high refractive index layer" refers to a layer having a refractive index relatively higher than that of an adjacent layer. The transmission band and the reflection band of the fourth band filter 610 may be controlled by the materials of the low refractive index layer and the high refractive index layer, the respective thicknesses of the low refractive index layer and the high refractive index layer and the difference between the thicknesses, and the respective refractive indices of the low refractive index layer and the high refractive index layer and the difference between the refractive indices.

[0140] The fourth band filter 610 may be formed to have a substantially constant thickness along the outer surfaces of the first color conversion pattern 410, the second color conversion pattern 420, the light transmissive pattern 510, the first band filter 310, the second band filter 320, and the light blocking member 210. The average thickness of the fourth band filter 610 may be about 0.5 μm to 2.0 μm or about 1.0 μm. The fourth band filter 610 may at least partially contact the first color conversion pattern 410, the second color conversion pattern 420, the light transmissive pattern 510, and the light blocking member 210.

[0141] Accordingly, the fourth band filter 610 may reflect, toward the observer side, light emitted in various directions from the first wavelength shift material 410p and the second wavelength shift material 420p and incident on the fourth band filter 610, and thus the reflected light may contribute to color display. This may improve the light utilization efficiency and enable the display device 1 to display clearer colors. In addition, among the light provided by the light source unit 50, the fourth band filter 610 may transmit light having the peak wavelength of the third color while blocking light having a peak wavelength longer than the peak wavelength of the third color. Accordingly, the color purity of the light provided by the light source unit 50 may be further improved.

[0142] The outer coating OC may be disposed on the fourth band filter 610. The outer coating OC may be a planarization layer that minimizes the step difference formed by a plurality of elements stacked on the second substrate BS2. The outer coating OC may include one or more layers. For example, the outer coating OC may be a stacked structure of multiple layers. The outer coating OC may include an organic material having planarization characteristics. For example, the outer coating OC may include an organic material such as Cardo resin, polyimide resin, or acrylic resin. The outer coating OC may be directly disposed on the fourth band filter 610 without difference between the pixels PXa to PXc.

[0143] The polarization layer POL may be disposed on the outer coating OC. The polarization layer POL may perform an optical shutter function together with the liquid crystal layer LCL and another polarization layer disposed between the liquid crystal layer LCL and the light source unit 50 to control the amount of light transmitted through each of the pixels PXa to PXc. In an exemplary embodiment, the polarization layer POL may be a reflective polarizer including a wire grid pattern. As used herein, a "wire grid pattern" refers to a plurality of linear patterns that extend parallel to each other and are spaced apart from each other. The reflective polarizer may polarize the transmitted light by transmitting the polarization component parallel to the transmission axis and reflecting the polarization component parallel to the reflection axis. In an exemplary embodiment, the polarization layer POL may include a coating type polarizer.

[0144] The wire grid pattern of the polarization layer POL may include a reflective material. For example, the wire grid pattern may include at least one of aluminum (Al), silver (Ag), gold (Au), copper (Cu), titanium (Ti), molybdenum (Mo), nickel (Ni), and alloys of these materials.

[0145] In an exemplary embodiment, the second protective layer PS2 may be disposed between the outer coating OC and the polarization layer POL. The second protective layer PS2 may be in contact with the outer coating OC and the wire grid pattern. The second protective layer PS2 may include an inorganic material such as silicon nitride or silicon oxide. The second protective layer PS2 may prevent or reduce damage to the outer coating OC during the process of forming the wire grid pattern. Additionally, the second protective layer PS2 may improve the adhesion of the wire grid pattern and prevent or reduce damage or corrosion of the wire grid pattern due to the penetration of air or moisture, thereby improving the reliability of the display device 1.

[0146] The third protective layer PS3 may be disposed on the polarization layer POL. The third protective layer PS3 may be directly disposed on the polarization layer POL to cover and protect the wire grid pattern. The third protective layer PS3 can prevent and reduce damage or corrosion of the wire grid pattern due to the penetration of air or moisture, and can planarize the upper surface of the polarization layer POL. The third protective layer PS3 may include an inorganic insulating material such as silicon nitride or silicon oxide.

[0147] The common electrode CE may be arranged on the third protective layer PS3. The common electrode CE may be integrally formed as a single piece without differentiation between the pixels PXa to PXc, and a common voltage may be applied to the common electrode CE. In an exemplary embodiment, the common electrode CE may be directly arranged on the third protective layer PS3, and may be a transparent electrode. The second liquid crystal alignment layer LCA2 may be arranged on the common electrode CE to induce an initial orientation of the liquid crystal LC in the adjacent liquid crystal layer LCL. The second liquid crystal alignment layer LCA2 may include a polymer organic material that is the same as or different from that of the first liquid crystal alignment layer LCA1.

[0148] Now refer to Figure 8 A process in which the display device 1 according to the exemplary embodiment implements color display is described in more detail. Figure 8 The diagram shows Figure 4 The light path of the second display panel SUB2.

[0149] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , the light source unit 50 provides the light of the third color to the display panel 31. In an exemplary embodiment, the light source unit 50 may provide the light of the third color having a peak wavelength in the range of about 430 nm to 470 nm to the display panel 31.

[0150] The light L provided by the light source unit 50 and incident on the first pixel PXa of the display panel 31 a0 The light L may be transmitted through the fourth wavelength band filter 610, converted or shifted into the peak wavelength of the first color by the first wavelength shifting material 410p, and then emitted in various directions regardless of the light L a0 What is the angle of incidence?

[0151] Specifically, among the light emitted from the first wavelength shifting material 410p, the light emitted toward the second substrate BS2 ( Figure 8 The light L emitted from the upper side of the a1 The first wavelength band filter 310 may be transmitted as is, thereby facilitating display of the first color by the first pixel PXa.

[0152] In addition, from the first wavelength shifting material 410p toward the fourth band filter 610 ( Figure 8 The light L emitted from the lower side of the a2 The light may be reflected by the fourth wavelength band filter 610 toward the viewer, thereby facilitating the first pixel PXa to display the first color.

[0153] In addition, the light L emitted toward the left / right side in Figure 8 of the second color conversion pattern 420 Figure 8 can be absorbed by the light shielding member 210 disposed between the first color conversion pattern 410 and the second color conversion pattern 420, thereby preventing or reducing light leakage defects. a3 Similarly, the light L provided by the light source unit 50 and incident on the second pixel PXb of the display panel 31

[0154] can be converted or shifted to the peak wavelength of the second color by the second wavelength shift material 420p, thereby contributing to the display of the second color by the second pixel PXb. b0 The light L provided by the light source unit 50 and incident on the third pixel PXc of the display panel 31

[0155] can pass through the fourth band filter 610 and then through the light transmissive pattern 510 without wavelength conversion, thereby contributing to the display of the third color by the third pixel PXc. c0 Hereinafter, other embodiments will be described. For simplicity, the description of elements that are substantially the same as those of the display device 1 according to the above embodiments will be omitted, and those skilled in the art will understand the substantially the same elements from the drawings. In the drawings, the same reference numerals will be used for the same elements.

[0156]

[0157] Figure 9A Figure 9B and Figure 9A illustrate a display device 2 according to an exemplary embodiment. Figure 4 is a cross-sectional view corresponding to Figure 9B and Figure 9A is an enlarged view of region “A” of

[0158] Figure 9A Figure 9B Referring to Figure 1 and

[0159] Figure 1 the difference between the display device 2 according to the exemplary embodiment and the display device 1 according to the embodiment of

[0159] Specifically, the partition wall 120 may have an upper surface 120t that forms a flat surface and a side surface 120s that slopes downward from the upper surface 120t. In an exemplary embodiment, the side surface 120s may slope gently from the upper surface 120t, gradually becoming steeper, and then becoming gently sloped again from an inflection point to reach the second substrate BS2. In this case, the upper limit of the average inclination angle θ of the side surface 120s of the partition wall 120 with respect to the surface of the second substrate BS2 may be approximately 85 degrees, approximately 80 degrees, approximately 70 degrees, approximately 60 degrees, or approximately 50 degrees. When the side surface 120s is a curved surface, the "average inclination angle" may be the inclination angle obtained by calculating the average of different inclination degrees in any interval. The average inclination angle may be represented by the ratio of the height difference to the horizontal distance between the lowermost end of the side surface 120s of the partition wall 120 and the upper surface 120t of the partition wall 120 that has no slope.

[0160] The light-shielding member 220 may be disposed on the partition wall 120 along the curved side surface 120s of the partition wall 120. Additionally, the first band filter 311 and the second band filter 321 may also be disposed on the light-shielding member 220 along the curved side surface 120s of the partition wall 120.

[0161] Figure 10A and Figure 10B FIG. 3 illustrates a display device 3 according to an exemplary embodiment. Figure 10A is a cross-sectional view corresponding to Figure 4 and Figure 10B is an enlarged view of region "A" of Figure 10A .

[0162] Referring to Figure 10A and Figure 10B , the display device 3 according to an exemplary embodiment is different from the display device 1 according to the embodiment of Figure 1 in that the surface of the light-shielding member 230 has a certain roughness.

[0163] In an exemplary embodiment, the light-shielding member 230 may be directly disposed on the second partition wall portion 112. Here, the roughness of the first surface 230a of the light-shielding member 230 that contacts the second partition wall portion 112 may be less than the roughness of the second surface 230b opposite to the first surface 230a. The second surface 230b of the light-shielding member 230 may be the surface that contacts the first band filter 310, the second band filter 320, the light-transmitting pattern 510, and / or the fourth band filter 610.

[0164] Although the exemplary embodiments are not limited to the following examples, when the light-shielding member 230 is formed by a back exposure process in which light is radiated from one side of the second substrate BS2, the first surface 230a of the light-shielding member 230 may be cured before the second surface 230b. That is, the first surface 230a of the light-shielding member 230 that contacts the second partition wall portion 112 may be first exposed and cured, and when light passes through the light-shielding member 230, the light may be gradually absorbed by the light-shielding member 230. In other words, due to the light absorption characteristics of the light-shielding member 230, the amount of light passing through the light-shielding member 230 may gradually decrease. Therefore, the second surface 230b of the light-shielding member 230 may be exposed to a smaller amount of light than the first surface 230a. In the process of developing the light-shielding member 230 cured by exposure in the curing process, the second surface 230b that is relatively less cured and does not show a constant depth may have a larger roughness than the first surface 230a.

[0165] The roughness of the second surface 230b of the light-shielding member 230 can be adjusted by the intensity and / or radiation time of the light irradiated for curing the light-shielding member 230. When any one surface of the light-shielding member 230 has a certain roughness, the thickness t T or t S can be represented as the distance of the protruding portion from the first surface 230a to the second surface 230b.

[0166] Figure 11 is a cross-sectional view of the display device 4 according to an exemplary embodiment corresponding to Figure 4 .

[0167] Referring to Figure 11 , the display device 4 according to an exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that it further includes a concave and convex pattern 700 disposed on the light-shielding member 230.

[0168] In an exemplary embodiment, the concave and convex pattern 700 may be disposed on the light-shielding member 230, and the light-shielding member 230 is disposed on the upper surface of the second partition wall portion 112. The concave and convex pattern 700 may be a plurality of linear patterns arranged parallel to each other and spaced apart from each other in a plan view, or may be island patterns of basic quadrilaterals arranged in a matrix or randomly in a plan view.

[0169] The concave and convex pattern 700 can impart a certain hydrophobicity to the surface of the light-shielding member 230. For example, the surface of the light-shielding member 230 disposed on the upper surface of the second partition wall portion 112 may have a larger hydrophobicity than the surface of the light-shielding member 230 disposed on the side surface of the second partition wall portion 112.

[0170] Although the exemplary embodiments are not limited to the following examples, when the color conversion pattern is formed by an inkjet process, the concave and convex pattern 700 disposed on the upper surface of the second partition wall portion 112 can reduce the surface area with which the ink composition can come into contact, thereby reducing the surface energy. Accordingly, this can make it easy to form the color conversion pattern.

[0171] Figure 12A and Figure 12B FIG. 5 illustrates a display device 5 according to an exemplary embodiment. Figure 12A is a cross-sectional view corresponding to Figure 4 and Figure 12B is Figure 12A an enlarged view of region “A” of

[0172] Referring to Figure 12A and Figure 12B , the display device 5 according to the exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that the first band filter 312 and the second band filter 322 do not overlap with the upper surface 110t of the second partition wall portion 112.

[0173] In the exemplary embodiment, each of the first band filter 312 and the second band filter 322 may be lower in height from the highest point of one surface of the second substrate BS2 than the height of the second partition wall portion 112, that is, the upper surface 110t of the second partition wall portion 112. Accordingly, the first color conversion pattern 410 and the second color conversion pattern 420 may come into contact with the light shielding member 230.

[0174] When different portions of the surface of the light shielding member 230 have different degrees of hydrophobicity, for example, when the surface of the light shielding member 230 disposed on the upper surface 110t of the second partition wall portion 112 has a greater hydrophobicity than the surface of the light shielding member 230 disposed on the side surface 110s of the second partition wall portion 112, the surface of the light shielding member 230 not covered by the first band filter 312 and the second band filter 322 may have positioning points formed by the degree of hydrophobicity. This can make it easy to form the color conversion pattern.

[0175] Figure 13A and Figure 13B FIG. 6 illustrates a display device 6 according to an exemplary embodiment. Figure 13A is a cross-sectional view corresponding to Figure 4 and Figure 13B is Figure 13A an enlarged view of region “A” of

[0176] Referring to Figure 13A and Figure 13B, the display device 6 according to an exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that at least a part of the light-shielding member 240 is disposed between the second substrate BS2 and the color conversion pattern, and the surface of the light-shielding member 240 disposed between the second substrate BS2 and the color conversion pattern is substantially parallel to the surface of the second substrate BS2.

[0177] Specifically, at least a part of the light-shielding member 240 may be disposed between the second substrate BS2 and the first band-pass filter 310 and may be in contact with the second substrate BS2 and the first band-pass filter 310. In this case, the surface of the light-shielding member 240 disposed between the second substrate BS2 and the first band-pass filter 310 may be substantially parallel to the surface of the second substrate BS2.

[0178] Similarly, at least a part of the light-shielding member 240 may be disposed between the second substrate BS2 and the second band-pass filter 320 and may be in contact with the second substrate BS2 and the second band-pass filter 320. In this case, the surface of the light-shielding member 240 disposed between the second substrate BS2 and the second band-pass filter 320 may be substantially parallel to the surface of the second substrate BS2.

[0179] In addition, at least a part of the light-shielding member 240 may be disposed between the second substrate BS2 and the light-transmitting pattern 510 and may be in contact with the second substrate BS2 and the light-transmitting pattern 510. In this case, the surface of the light-shielding member 240 disposed between the second substrate BS2 and the light-transmitting pattern 510 may be substantially parallel to the surface of the second substrate BS2.

[0180] In the display device 6 according to an exemplary embodiment, the maximum width of the light-shielding member 240 in contact with the second substrate BS2 may be set relatively large. Therefore, this can minimize or reduce the color mixing defect of the display device 6.

[0181] Figure 14A and Figure 14B illustrates a display device 7 according to an exemplary embodiment. Figure 14A is a cross-sectional view corresponding to Figure 4 and Figure 14B is Figure 14A an enlarged view of the region “A” of

[0182] Referring to Figure 14A and Figure 14B , the display device 7 according to an exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that the light-shielding member 250 further includes a third surface 250s perpendicular to the surface of the second substrate BS2.

[0183] The light-shielding member 250 is directly disposed on the second partition wall portion 112, and has a first surface 250a in contact with the second partition wall portion 112 and a second surface 250b opposite to the first surface 250a. The light-shielding member 250 further has a third surface 250s connecting the first surface 250a and the second surface 250b and substantially perpendicular to the surface of the second substrate BS2.

[0184] In an exemplary embodiment, the roughness of the third surface 250s of the light-shielding member 250 may be less than the roughness of the second surface 250b. The second surface 250b and the third surface 250s of the light-shielding member 250 may all be in contact with the first band-pass filter 310, the second band-pass filter 320, or the light-transmitting pattern 510.

[0185] In the display device 7 according to an exemplary embodiment, the light-shielding member 250 has a height component in the third direction Z. Accordingly, the light-shielding member 250 can suppress or reduce the defect in which light propagates between adjacent pixels while maximizing or increasing the width of each opening from which light for color display is emitted. Accordingly, the light utilization efficiency can be improved.

[0186] Figure 15A and Figure 15B FIG. illustrates a display device 8 according to an exemplary embodiment. Figure 15A is a cross-sectional view corresponding to Figure 4 and Figure 15B is an enlarged view of the region “A” of Figure 15A .

[0187] Referring to Figure 15A and Figure 15B , the display device 8 according to an exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that the light-shielding member 260 has an undercut 260U at its lower end. As used herein, the term “undercut” means that the lower end of an element is recessed inwardly in a plan view to form a substantially mushroom-shaped cross-section.

[0188] In an exemplary embodiment, at least a part of the first band-pass filter 310 may be disposed between the light-shielding member 260 and the second substrate BS2. In an exemplary embodiment, the first band-pass filter 310 may not completely fill the space between the light-shielding member 260 and the second substrate BS2, leaving an air layer in the space. Additionally, a part of the light-shielding member 260 may be in contact with the second substrate BS2.

[0189] Similarly, at least a portion of the second band filter 320 may be disposed between the light shielding member 260 and the second substrate BS2. Additionally, at least a portion of the light transmissive pattern 510 may be disposed between the light shielding member 260 and the second substrate BS2.

[0190] In Figure 15A and Figure 15B , the surface of the light shielding member 260 at the undercut 260U of the light shielding member 260 is inclined in a direction opposite to the direction in which the side surface 110s of the second partition wall portion 112 is inclined. However, in an exemplary embodiment, the surface of the light shielding member 260 at the undercut 260U may be substantially perpendicular to the surface of the second substrate BS2, or may be inclined in the same direction as the side surface 110s of the second partition wall portion 112.

[0191] In the display device 8 according to an exemplary embodiment, the light shielding member 260 has a height component in the third direction Z. Accordingly, the light shielding member 260 can suppress or reduce the defect in which light propagates between adjacent pixels while maximizing or increasing the width of each opening from which light for color display is emitted. Therefore, the light utilization efficiency can be improved.

[0192] Figure 16A and Figure 16B Illustrates a display device 9 according to an exemplary embodiment. Figure 16A is a cross-sectional view corresponding to Figure 4 and Figure 16B is Figure 16A an enlarged view of region “A” of

[0193] Referring to Figure 16A and Figure 16B , the display device 9 according to an exemplary embodiment differs from the display device 8 according to the embodiments of Figure 15A and Figure 15B in that it further includes an opaque material pattern 810 disposed on the undercut portion of the light shielding member 260.

[0194] The opaque material pattern 810 may be disposed between the light shielding member 260 and the second substrate BS2. In Figure 16A and Figure 16B , the opaque material pattern 810 is in contact with the light shielding member 260, the second substrate BS2, and the first band filter 310. However, the exemplary embodiment is not limited thereto.

[0195] The opaque material pattern 810 may include a material different from that of the light shielding member 260. The opaque material pattern 810 is not particularly limited as long as it can at least partially block the transmission of light. For example, the opaque material pattern 810 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0196] The opaque material pattern 810 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420, and between the second color conversion pattern 420 and the light transmissive pattern 510. The opaque material pattern 810 may suppress or reduce light leakage between adjacent pixels. Additionally, when the opaque material pattern 810 included in the display device 9 according to an exemplary embodiment is made of a reflective metal material, the opaque material pattern 810 disposed between adjacent pixels may reflect at least a portion of the light propagating toward adjacent pixels, thereby improving light utilization efficiency.

[0197] Figure 17A and Figure 17B FIG. 10 illustrates a display device according to an exemplary embodiment. Figure 17A is a cross-sectional view corresponding to Figure 4 and Figure is an enlarged view of region “A” of ​ FIG. 10.

[0198] Referring to ​ and ​ FIGS. 10 and 11, the display device 10 according to an exemplary embodiment is different from the display device 8 according to the embodiments of ​ and ​ in that a light shielding member 270 is disposed on the upper surface 110t and the side surface 110s of the second partition wall portion 112, but is spaced apart from the second substrate BS2.

[0199] In an exemplary embodiment, the light shielding member 270 may at least partially surround the second partition wall portion 112, and at least partially expose the side surface 110s of the second partition wall portion 112, without completely covering the side surface 110s of the second partition wall portion 112.

[0200] For example, at least a portion of the first band filter 310 may be disposed between the light shielding member 270 and the second substrate BS2. Additionally, the first band filter 310 may be in contact with the side surface 110s of the second partition wall portion 112, the second substrate BS2, and the light shielding member 270.

[0201] Similarly, at least a portion of the second band filter 320 may be disposed between the light shielding member 270 and the second substrate BS2. The second band filter 320 may be in contact with the side surface 110s of the second partition wall portion 112, the second substrate BS2, and the light shielding member 270.

[0202] Additionally, at least a portion of the light transmissive pattern 510 may be disposed between the light shielding member 270 and the second substrate BS2. The light transmissive pattern 510 may be in contact with the side surface 110s of the second partition wall portion 112, the second substrate BS2, and the light shielding member 270.

[0203] ​ and ​ FIG. illustrates a display device 11 according to an exemplary embodiment. ​ is corresponding to ​ a cross-sectional view, and ​ is ​ an enlarged view of region “A” of

[0204] Referring to ​ and ​ , the display device 11 according to an exemplary embodiment is different from the display device 10 according to the embodiments of ​ and ​ in that it further includes an opaque material pattern 820 disposed on a side surface 110s of the second partition wall portion 112.

[0205] The opaque material pattern 820 may be directly disposed on the side surface 110s of the second partition wall portion 112. For example, the opaque material pattern 820 may be disposed between the light-shielding member 270 and the second substrate BS2. In FIG. 18, the opaque material pattern 820 is in contact with the light-shielding member 270, the second substrate BS2, the second partition wall portion 112, and the first band-pass filter 310. However, the exemplary embodiment is not limited thereto.

[0206] The opaque material pattern 820 may include a material different from that of the light-shielding member 270. The opaque material pattern 820 is not particularly limited as long as it can at least partially block the transmission of light. For example, the opaque material pattern 820 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0207] The opaque material pattern 820 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmissive pattern 510. The opaque material pattern 820 may suppress or reduce light leakage between adjacent pixels. In addition, when the opaque material pattern 820 included in the display device 11 according to an exemplary embodiment is made of a reflective metal material, the opaque material pattern 820 disposed between adjacent pixels may reflect at least a part of the light propagating toward adjacent pixels, thereby improving light utilization efficiency.

[0208] ​ and ​ FIG. illustrates a display device 12 according to an exemplary embodiment. ​ is corresponding to ​ a cross-sectional view, and ​ is Figure 19A an enlarged view of region “A” of

[0209] Referring toFigure 19A and Figure 19B The display device 12 according to an exemplary embodiment is different from the display device 8 according to an embodiment of Figure 15A and Figure 15B in that the partition wall 130 has an undercut 130U formed at its lower end.

[0210] In an exemplary embodiment, the lower end of the partition wall 130 may be recessed into the partition wall 130. That is, the width of the partition wall 130 at the portion where the partition wall 130 contacts the second substrate BS2 may be smaller than the maximum width of the partition wall 130.

[0211] In addition, at least a portion of the first band filter 313 may be disposed between the partition wall 130 and the second substrate BS2 and between the light shielding member 280 and the second substrate BS2. In an exemplary embodiment, the first band filter 313 may not completely fill the space between the partition wall 130 and the second substrate BS2, leaving an air layer in the space. The light shielding member 280 may be spaced apart from the second substrate BS2.

[0212] For example, the first band filter 313 may contact the second substrate BS2, the light shielding member 280, and the partition wall 130.

[0213] Similarly, at least a portion of the second band filter 323 may be disposed between the partition wall 130 and the second substrate BS2 and between the light shielding member 280 and the second substrate BS2. The second band filter 323 may contact the second substrate BS2, the light shielding member 280, and the partition wall 130.

[0214] In addition, at least a portion of the light transmissive pattern 510 may be disposed between the partition wall 130 and the second substrate BS2 and between the light shielding member 280 and the second substrate BS2. The light transmissive pattern 510 may contact the second substrate BS2, the light shielding member 280, and the partition wall 130.

[0215] In the display device 12 according to an exemplary embodiment, the portion where the first band filter 313 contacts the second substrate BS2, the portion where the second band filter 323 contacts the second substrate BS2, and the portion where the light transmissive pattern 510 contacts the second substrate BS2 may be wider than each opening formed by the partition wall 130. Therefore, the light utilization efficiency can be improved without light leakage between adjacent pixels.

[0216] Figure 20A and Figure 20B FIG. illustrates a display device 13 according to an exemplary embodiment. Figure 20A is a cross-sectional view corresponding to Figure 4 and Figure 20B is Figure 20A an enlarged view of region “A” of

[0217] Reference Figure 20A and Figure 20B ,the display device 13 according to an exemplary embodiment is different from the display device 12 according to the embodiments of Figure 19A and Figure 19B in that it further includes an opaque material layer 830 disposed on the undercut 130U of the partition wall 130.

[0218] The opaque material layer 830 may be disposed between the partition wall 130 and the second substrate BS2. In Figure 20A and Figure 20B , the opaque material layer 830 is in contact with the second substrate BS2, the partition wall 130, and the first band filter 313. However, the exemplary embodiment is not limited thereto. In the exemplary embodiment, the opaque material layer 830 may be disposed between the light-shielding member 280 and the second substrate BS2.

[0219] The opaque material layer 830 may include a material different from that of the light-shielding member 280. The opaque material layer 830 is not particularly limited as long as it can at least partially block the transmission of light. For example, the opaque material layer 830 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0220] The opaque material layer 830 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light-transmitting pattern 510. The opaque material layer 830 may suppress or reduce light leakage between adjacent pixels. Additionally, when the opaque material layer 830 included in the display device 13 according to the exemplary embodiment is made of a reflective metal material, the opaque material layer 830 disposed between adjacent pixels may reflect at least a portion of the light propagating toward the adjacent pixels, thereby improving light utilization efficiency.

[0221] Figure 21A , Figure 21B and Figure 21C illustrate a display device 14 according to an exemplary embodiment. Figure 21A is a cross-sectional view corresponding to Figure 4 , Figure 21B is Figure 21A an enlarged view of region “A” of Figure 21C and Figure 6 is a cross-sectional view corresponding to

[0222] Reference Figure 21A , Figure 21B and Figure 21C , the display device 14 according to an exemplary embodiment is different from the display device according to Figure 10A and Figure 10BThe display device 3 according to the embodiment is different in that the first band filter 314 and the second band filter 324 are disposed between the second substrate BS2 and the second partition wall portion 112.

[0223] The first band filter 314 may be disposed in the first pixel and is set to be lower than the second partition wall portion 112 (higher in Figure 21A ). For example, at least a part of the first band filter 314 may be placed between the second partition wall portion 112 and the second substrate BS2 and may be in contact with the second partition wall portion 112 and the second substrate BS2.

[0224] In addition, the second band filter 324 may be disposed in the second pixel and may be set to be lower than the second partition wall portion 112 (higher in Figure 21A ). For example, at least a part of the second band filter 324 may be placed between the second partition wall portion 112 and the second substrate BS2 and may be in contact with the second partition wall portion 112 and the second substrate BS2.

[0225] The third band filter 334 may be disposed in the fourth pixel and may be set to be lower than the second partition wall portion 112 (higher in Figure 21C ).

[0226] In the display device 14 according to the exemplary embodiment, each of the first band filter 314 and the second band filter 324 is set to be lower than the second partition wall portion 112. Accordingly, the exposed surface area of the light shielding member 290 can be increased. Although the exemplary embodiment is not limited to the following example, when the color conversion pattern is formed by an inkjet process, the water repellency and liquid affinity of the exposed surface of the light shielding member 290 can be used to facilitate the formation of the color conversion pattern.

[0227] Figure 22A and Figure 22B illustrates a display device 15 according to an exemplary embodiment. Figure 22A is a cross-sectional view corresponding to Figure 4 , and Figure 22B is an enlarged view of the region “A” of Figure 22A .

[0228] Referring to Figure 22A and Figure 22B , the display device 15 according to the exemplary embodiment is different from the display device 14 according to the embodiment of Figure 21A and Figure 21B in that the partition wall 140 and the light shielding member 295 have an undercut 140U at their lower ends.

[0229] In an exemplary embodiment, the lower end of the partition wall 140 may be recessed into the partition wall 140. Additionally, at least a portion of the first color conversion pattern 410 may be disposed between the partition wall 140 and the first band filter 314 in the undercut 140U, and between the light shielding member 295 and the first band filter 314. In an exemplary embodiment, the first color conversion pattern 410 may not completely fill the space between the partition wall 140 and the first band filter 314, leaving an air layer in this space. The light shielding member 295 may be spaced apart from the first band filter 314. For example, the first color conversion pattern 410 may be in contact with the first band filter 314, the light shielding member 295, and the partition wall 140.

[0230] Similarly, at least a portion of the second color conversion pattern 420 may be disposed between the partition wall 140 and the second band filter 324 in the undercut 140U, and between the light shielding member 295 and the second band filter 324. The second color conversion pattern 420 may be in contact with the second band filter 324, the light shielding member 295, and the partition wall 140.

[0231] Additionally, at least a portion of the light transmissive pattern 510 may be disposed between the partition wall 140 and the second substrate BS2, and between the light shielding member 295 and the second substrate BS2. The light transmissive pattern 510 may be in contact with the second substrate BS2, the light shielding member 295, and the partition wall 140.

[0232] In the display device 15 according to an exemplary embodiment, the portions where the first color conversion pattern 410 contacts the first band filter 314, the portions where the second color conversion pattern 420 contacts the second band filter 324, and the portions where the light transmissive pattern 510 contacts the second substrate BS2 may be wider than each opening formed by the partition wall 140. Accordingly, the light utilization efficiency can be improved without light leakage between adjacent pixels.

[0233] Figure 23A and Figure 23B FIG. illustrates a display device 16 according to an exemplary embodiment. Figure 23A is a cross-sectional view corresponding to Figure 4 and Figure 23B is an enlarged view of region “A” of Figure 23A .

[0234] Referring to Figure 23A and Figure 23B , the display device 16 according to an exemplary embodiment differs from the display device 15 according to the embodiment of Figure 22A and Figure 22B in that it further includes an opaque material layer 840 disposed on the undercut 140U of the partition wall 140.

[0235] The opaque material layer 840 may be disposed between the partition wall 140 and the first band filter 314 and between the partition wall 140 and the second band filter 324. In Figure 23A and Figure 23B the opaque material layer 840 is in contact with the first band filter 314, the partition wall 140, and the first color conversion pattern 410. However, the exemplary embodiments are not limited thereto. In an exemplary embodiment, the opaque material layer 840 may be disposed between the light shielding member 295 and the first band filter 314.

[0236] The opaque material layer 840 may include a material different from that of the light shielding member 295. The opaque material layer 840 is not particularly limited as long as it can at least partially block the transmission of light. However, the opaque material layer 840 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials.

[0237] The opaque material layer 840 may be disposed between the first color conversion pattern 410 and the second color conversion pattern 420 and between the second color conversion pattern 420 and the light transmissive pattern 510. The opaque material layer 840 may suppress or reduce light leakage between adjacent pixels. Additionally, when the opaque material layer 840 included in the display device 16 according to the exemplary embodiment is made of a reflective metal material, the opaque material layer 840 disposed between adjacent pixels may reflect at least a part of the light propagating toward the adjacent pixels, thereby improving the light utilization efficiency.

[0238] Figure 24A and Figure 24B illustrates a display device 17 according to an exemplary embodiment. Figure 24A is a cross-sectional view corresponding to Figure 4 and Figure 24B is an enlarged view of region “A” of Figure 24A .

[0239] Referring to Figure 24A and Figure 24B , the display device 17 according to the exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that it further includes a first light transmissive layer 910 disposed on the light shielding member 230 and a second light transmissive layer 920 disposed on the first light transmissive layer 910.

[0240] In an exemplary embodiment, the first light-transmitting layer 910 may be directly disposed on the light-shielding member 230 and may surround at least a portion of the light-shielding member 230. For example, the first light-transmitting layer 910 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the first light-transmitting layer 910 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The first light-transmitting layer 910 may be in contact with the second substrate BS2.

[0241] In addition, the second light-transmitting layer 920 may be directly disposed on the first light-transmitting layer 910 and may surround at least a portion of the first light-transmitting layer 910. For example, the second light-transmitting layer 920 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the second light-transmitting layer 920 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The second light-transmitting layer 920 may be in contact with the second substrate BS2.

[0242] In an exemplary embodiment, the refractive index of the second light-transmitting layer 920 may be greater than the refractive index of the first light-transmitting layer 910. Accordingly, a certain optical function may be imparted to the first light-transmitting layer 910 and the second light-transmitting layer 920.

[0243] For example, when the first color conversion pattern 410 includes a wavelength-shifting material, at least a portion of the light emitted from the wavelength-shifting material and traveling toward the second color conversion pattern 420 may be reflected at the interface between the first light-transmitting layer 910 and the second light-transmitting layer 920. This not only suppresses or reduces light leakage defects but also improves light utilization efficiency. In addition, the light passing through the interface between the first light-transmitting layer 910 and the second light-transmitting layer 920 is absorbed by the light-shielding member 230. Accordingly, light leakage defects may be suppressed or reduced.

[0244] In Figure 24A and Figure 24B two light-transmitting layers (i.e., the first light-transmitting layer 910 and the second light-transmitting layer 920) are disposed between the light-shielding member 230 and the first band-pass filter 310, between the light-shielding member 230 and the second band-pass filter 320, and between the light-shielding member 230 and the light-transmitting pattern 510. However, in an exemplary embodiment, three or more light-transmitting layers may be formed to provide an approximate total reflection function at each interface.

[0245] Figure 25A and Figure 25B illustrates a display device 18 according to an exemplary embodiment. Figure 25A is a cross-sectional view corresponding to Figure 4 and Figure 25B is Figure 25AAn enlarged view of the region “A”.

[0246] Reference Figure 25A and Figure 25B , the display device 18 according to an exemplary embodiment is different from the display device 3 according to the embodiments of Figure 10A and Figure 10B in that it further includes a first light-transmissive layer 930 and a second light-transmissive layer 940 disposed between the light-shielding member 230 and the second partition wall portion 112.

[0247] In an exemplary embodiment, the first light-transmissive layer 930 may be directly disposed on the second partition wall portion 112 and may surround at least a part of the second partition wall portion 112. For example, the first light-transmissive layer 930 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the first light-transmissive layer 930 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The first light-transmissive layer 930 may be in contact with the second substrate BS2.

[0248] In addition, the second light-transmissive layer 940 may be directly disposed on the first light-transmissive layer 930 and may surround at least a part of the first light-transmissive layer 930. For example, the second light-transmissive layer 940 may be disposed on the upper surface 110t of the second partition wall portion 112 and on the side surface 110s of the second partition wall portion 112. The light transmittance of the second light-transmissive layer 940 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The second light-transmissive layer 940 may be in contact with the second substrate BS2.

[0249] In an exemplary embodiment, the refractive index of the second light-transmissive layer 940 may be greater than the refractive index of the first light-transmissive layer 930. Accordingly, a certain optical function may be imparted to the first light-transmissive layer 930 and the second light-transmissive layer 940.

[0250] For example, when the first color conversion pattern 410 includes a wavelength-shifting material, among the light emitted from the wavelength-shifting material, the light traveling toward the second color conversion pattern 420 may be absorbed by the light-shielding member 230, thereby suppressing or reducing light leakage defects. In addition, the light that passes through the light-shielding member 230 and is not completely blocked or minimized by the light-shielding member 230 may be reflected at the interface between the first light-transmissive layer 930 and the second light-transmissive layer 940, thereby suppressing or reducing light leakage defects and improving light utilization efficiency.

[0251] In Figure 25A and Figure 25BIn [the above], two light-transmitting layers (i.e., the first light-transmitting layer 930 and the second light-transmitting layer 940) are disposed between the light-shielding member 230 and the second partition wall portion 112. However, in an exemplary embodiment, three or more light-transmitting layers may be formed to provide an approximate total reflection function at each interface.

[0252] A method of manufacturing a display device according to an embodiment will be described below.

[0253] A method of manufacturing a display device according to an exemplary embodiment includes: forming or disposing a partition wall pattern having light-transmittance and an opaque material pattern on a first surface of a substrate; coating a composition for forming or disposing a light-shielding member onto the partition wall pattern and the opaque material pattern; and irradiating light from a second surface of the substrate by using the opaque material pattern as a light-shielding mask to form a light-shielding member on an upper surface and a side surface of the partition wall pattern. The method of manufacturing a display device may further include: at least partially exposing the first surface of the substrate by removing the opaque material pattern; ejecting an ink composition containing a wavelength shift material onto the exposed first surface of the substrate; and forming a color conversion pattern by curing the ink composition.

[0254] Figure 26A 、 Figure 26B 、 Figure 26C 、 Figure 26D 、 Figure 26E 、 Figure 26F 、 Figure 26G 、 Figure 26H 、 Figure 26I 、 Figure 26J 、 Figure 26K 、 Figure 26L 、 Figure 26M 、 Figure 26N and Figure 26O are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0255] Referring to Figure 26A , an opaque material layer 800 is formed on a surface (the upper surface in Figure 26A ) of the substrate BS2. The opaque material layer 800 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials, or may include an opaque organic material. The method of forming the opaque material layer 800 is not particularly limited. For example, a deposition method such as sputtering may be used.

[0256] Next, referring to Figure 26B , a photosensitive layer 850 is formed on the opaque material layer 800. Forming the photosensitive layer 850 may include coating a photosensitive composition and pre-baking the photosensitive composition. In an exemplary embodiment, the photosensitive composition and the photosensitive layer 850 may include a positive photosensitive material.

[0257] Next, referring to Figure 26C , the photosensitive pattern layer 851 is formed by placing a mask M1 having an opening and irradiating light. Forming the photosensitive pattern layer 851 includes: irradiating light to the photosensitive layer 850 using the mask M1 as an exposure mask, and developing by coating a developer to form the photosensitive pattern layer 851. In an exemplary embodiment in which the photosensitive layer 850 includes a positive photosensitive material, the bonds between polymers may be at least partially broken at the portions exposed through the openings of the mask M1, and the exposed portions may be removed by the developer.

[0258] Next, referring to Figure 26D , the opaque material pattern 801 is formed using the photosensitive pattern layer 852 as an etching mask. Forming the opaque material pattern 801 may include patterning the opaque material layer 800 using an etching process. The etching process may be a dry etching process or a wet etching process. As a result of the etching process, the opaque material pattern 801 that exposes at least a portion of the surface of the substrate BS2 may be formed. The photosensitive pattern layer 852 used as the etching mask may be removed by an ashing process.

[0259] Next, referring to Figure 26E , the organic layer 100 is formed on the opaque material pattern 801. Forming the organic layer 100 may include coating an organic layer forming composition and pre-baking the organic layer forming composition. In an exemplary embodiment, the organic layer forming composition and the organic layer 100 may include a negative photosensitive material.

[0260] For example, the organic layer forming composition may include a photopolymerizable compound, a photoinitiator, and a solvent, and may further include other additives. The photopolymerizable compound is a polymerizable monomer compound, and may include a monofunctional monomer, a difunctional monomer, and a polyfunctional monomer. Examples of the monofunctional monomer include nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinylpyrrolidone. Additionally, examples of the difunctional monomer include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, and 3-methylpentanediol di(meth)acrylate. Additionally, examples of the polyfunctional monomer include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0261] The photoinitiator is not particularly limited. Examples of the photoinitiator include triazine-based initiator compounds such as 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine or 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine; acetophenone-based initiator compounds such as oligomers of diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylphenylthio)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one or 2-hydroxy-2-methyl-1-[4-(1-methylethenyl)phenyl]propan-1-one; imidazole-based initiator compounds such as 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-imidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)imidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)imidazole; or imidazole compounds in which the phenyl groups at the 4,4',5,5' positions are substituted with alkoxycarbonyl groups; and combinations of the above initiator compounds.

[0262] In addition, the organic layer 100 may have light transmittance. The light transmittance of the organic layer 100 may be about 90% or more, about 95% or more, about 98% or more, or about 99% or more. The material for forming the organic layer 100 is not particularly limited as long as it has excellent light transmittance. For example, the material for forming the organic layer 100 may be an organic material such as an epoxy resin, an acrylic resin, or an imide resin.

[0263] In an exemplary embodiment, the organic layer forming composition and the organic layer 100 may include particles 110p dispersed therein.

[0264] Reference Figure 26F, a second partition wall portion 112 is formed on the substrate BS2. Forming the second partition wall portion 112 may include: irradiating light to the organic layer 100 by using the mask M1 as an exposure mask, and forming the second partition wall portion 112 by coating a developer. In an exemplary embodiment in which the organic layer forming composition and the organic layer 100 are made of a negative photosensitive material, the mask M1 may be the same as the mask M1 used to form the opaque material pattern 801. The portion of the organic layer 100 exposed through the opening of the mask M1 may be cured, and the other portions may be removed by the developer. In the current operation, the second partition wall portion 112 and the opaque material pattern 801 may be spaced apart from each other, and at least a portion of the surface of the substrate BS2 may be exposed and not covered by the second partition wall portion 112 and the opaque material pattern 801. Accordingly, the second partition wall portion 112 may be formed on the exposed surface of the substrate BS2. According to an exemplary embodiment, only one mask M1 may be used to form the second partition wall portion 112 and the opaque material pattern 801. Thus, the manufacturing cost may be reduced.

[0265] The second partition wall portion 112 may contribute to aligning the ink composition in an inkjet process to be described later. That is, the second partition wall portion 112 may serve as a guide for accurately ejecting and stably positioning the ink composition at a desired position. The lower limit of the height of the second partition wall portion 112 may be about 5.0 μm, about 5.5 μm, about 6.0 μm, about 6.5 μm, about 7.0 μm, about 7.5 μm, about 8.0 μm, about 8.5 μm, about 9.0 μm, about 9.5 μm, about 10.0 μm, about 10.5 μm, about 11.0 μm, about 11.5 μm, about 12.0 μm or about 15.0 μm. Additionally, the second partition wall portion 112 may include an upper surface 110t forming a flat surface and a side surface 110s inclined downward from the upper surface 110t. The average inclination angle of the side surface 110s of the second partition wall portion 112 with respect to the surface of the substrate BS2 may be, but is not limited to, about 30 degrees to 85 degrees.

[0266] In an exemplary embodiment, the second partition wall portion 112 may include a first partition wall portion extending in a first direction X in a plan view and a second partition wall portion extending in a second direction Y intersecting the first direction X. Accordingly, in the plan view, the second partition wall portion 112 may have a substantially lattice shape.

[0267] Since it has been described with respect to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8The partition wall specifically describes other features of the second partition wall portion 112, and thus redundant descriptions of these features will be omitted.

[0268] Next, referring to Figure 26G , a light-shielding member forming composition 200 including a light-shielding material is coated onto the second partition wall portion 112. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed. The pre-baking of the light-shielding member forming composition 200 may be performed at a temperature of about 50°C to 120°C for about 60 seconds to 200 seconds.

[0269] Coating the light-shielding member forming composition 200 onto the second partition wall portion 112 may include coating the light-shielding member forming composition 200 to have a thickness greater than the height of the second partition wall portion 112. That is, the light-shielding member forming composition 200 may be coated to cover the upper surface 110t of the second partition wall portion 112. In the current operation, the light-shielding member forming composition 200 may at least partially fill the space between the second partition wall portion 112 and the opaque material pattern 801.

[0270] The light-shielding member forming composition 200 may include a colorant such as a black pigment or dye, a photopolymerizable compound, a photoinitiator, and a solvent, and may further include an additive such as insulating particles.

[0271] Examples of the colorant such as a black pigment or dye include inorganic pigments such as carbon black, titanium black, lignin black, perylene black, cyanine black, complex oxide pigments such as iron / manganese, and combinations of the above pigments.

[0272] The photopolymerizable compound is a polymerizable monomer compound, and may include monofunctional monomers, difunctional monomers, and polyfunctional monomers. Examples of monofunctional monomers include nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinylpyrrolidone. Additionally, examples of difunctional monomers include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, and 3-methylpentanediol di(meth)acrylate. Additionally, examples of polyfunctional monomers include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0273] The photoinitiator is not particularly limited. Examples of the photoinitiator include triazine-based initiator compounds such as 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine or 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine; acetophenone-based initiator compounds such as oligomers of diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylphenylthio)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one or 2-hydroxy-2-methyl-1-[4-(1-methylethenyl)phenyl]propan-1-one; imidazole-based initiator compounds such as 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-imidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)imidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)imidazole; or imidazole compounds in which the phenyl groups at the 4,4',5,5' positions are substituted with alkoxycarbonyl groups; and combinations of the above initiator compounds.

[0274] Next, referring to Figure 26H , the light-shielding member 210 is formed by irradiating light from the back of the substrate BS2 (the bottom surface in Figure 26H ). Forming the light-shielding member 210 may include forming the light-shielding member 210 using the opaque material pattern 801 as a light-shielding mask.

[0275] In an exemplary embodiment, forming the light-shielding member 210 may include: radiating light from the back of the substrate BS2, passing the light through the substrate BS2, entering the light into the second partition wall portion 112, passing the light through the upper surface 110t of the second partition wall portion 112, and passing the light through the side surface 110s of the second partition wall portion 112.

[0276] The light incident on the opaque material pattern 801 may be blocked by the opaque material pattern 801, and thus the light-shielding member forming composition 200 may not be cured. On the other hand, the light incident on the second partition wall portion 112 having excellent light transmittance may pass through the upper surface 110t and the side surface 110s of the second partition wall portion 112 to contribute to curing the light-shielding member forming composition 200. The light propagating toward the light-shielding member forming composition 200 may cure the light-shielding member forming composition 200. Then, as the light further propagates a certain distance, due to the light absorption characteristics of the light-shielding member forming composition 200, it may gradually decrease. Accordingly, the light-shielding member 210 may be formed on the upper surface 110t and the side surface 110s of the second partition wall portion 112, and the portion of the light-shielding member forming composition 200 disposed away from the second partition wall portion 112 may remain in the state of the light-shielding member forming composition 200.

[0277] In an exemplary embodiment, the thickness and surface roughness of the light-shielding member 210 may be controlled by the intensity and irradiation time of the radiated light.

[0278] The second partition wall portion 112 according to an exemplary embodiment may have an inclined side surface 110s. Accordingly, a sufficient amount of light may pass not only through the upper surface 110t of the second partition wall portion 112 but also through the side surface 110s of the second partition wall portion 112. In addition, when the second partition wall portion 112 includes particles 110p dispersed therein, the light scattered / diffused by the particles 110p can easily propagate in all directions. In an exemplary embodiment, the light-shielding member 210 disposed on the upper surface 110t of the second partition wall portion 112 may be thicker than the light-shielding member 210 disposed on the side surface 110s of the second partition wall portion 112.

[0279] Since the light-shielding member 210 has been specifically described with reference to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 the redundant description of the light-shielding member 210 will be omitted.

[0280] Next, referring to Figure 26I, the remaining light-shielding member is removed to form Composition 200. Removing the remaining light-shielding member to form Composition 200 may include removing the remaining light-shielding member to form Composition 200 by coating a developer. Thus, a substrate BS2, a second partition wall portion 112 disposed on the substrate BS2, and a light-shielding member 210 and an opaque material pattern 801 disposed to surround the second partition wall portion 112 may be formed.

[0281] In an exemplary embodiment, after removing the remaining light-shielding member to form Composition 200, hard baking of the light-shielding member 210 may be further performed.

[0282] Next, referring to Figure 26J , the opaque material pattern 801 is removed. Removing the opaque material pattern 801 may include at least partially exposing the surface of the substrate BS2. Removing the opaque material pattern 801 may include removing the opaque material pattern 801 using a wet etching process. This operation may leave only the substrate BS2, the second partition wall portion 112 disposed on the substrate BS2, and the light-shielding member 210 disposed to surround the second partition wall portion 112.

[0283] Next, referring to Figure 26K , a first bandpass filter 310 and a second bandpass filter 320 are formed in at least some of the openings formed by the second partition wall portion 112. The first bandpass filter 310 and the second bandpass filter 320 may be formed by patterning a photosensitive organic material using a photolithography process or by an inkjet process. Since the first bandpass filter 310 and the second bandpass filter 320 have been specifically described with reference to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , redundant descriptions of the first bandpass filter 310 and the second bandpass filter 320 will be omitted.

[0284] Referring to Figure 26L , a first ink composition 401, a second ink composition 402, and a third ink composition 500 are disposed in the openings formed by the second partition wall portion 112. The first ink composition 401, the second ink composition 402, and the third ink composition 500 may be disposed sequentially or simultaneously. In an exemplary embodiment, the first ink composition 401 may include a first wavelength shift material 410p that emits light having a peak wavelength of a first color, the second ink composition 402 may include a second wavelength shift material 420p that emits light having a peak wavelength of a second color, and the third ink composition 500 may include particles 510p.

[0285] Since the second partition wall portion 112 has sufficient height, the first ink composition 401, the second ink composition 402, and the third ink composition 500 can be precisely arranged at desired positions.

[0286] Next, referring to Figure 26M , the above ink compositions are dried and cured to form a first color conversion pattern 410, a second color conversion pattern 420, and a light transmissive pattern 510. Since the first color conversion pattern 410, the second color conversion pattern 420, and the light transmissive pattern 510 have been specifically described with reference to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , redundant descriptions of the first color conversion pattern 410, the second color conversion pattern 420, and the light transmissive pattern 510 will be omitted.

[0287] Referring to Figure 26N , a fourth band filter 610, an outer coating OC, a polarization layer POL, and a common electrode CE are sequentially formed on the first color conversion pattern 410, the second color conversion pattern 420, and the light transmissive pattern 510, thereby preparing a second display panel SUB2. Since each element of the second display panel SUB2 has been specifically described with reference to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , redundant descriptions of each element of the second display panel SUB2 will be omitted.

[0288] Referring to Figure 26O , a first display panel SUB1 including a switching element Q and a pixel electrode PE is prepared, and a liquid crystal layer LCL is disposed between the first display panel SUB1 and the second display panel SUB2. As a result, a display panel 31 is prepared. The first display panel SUB1 and the second display panel SUB2 can be bonded together by a sealing member.

[0289] By dropping a liquid crystal composition including liquid crystal LC onto the first display panel SUB1 or the second display panel SUB2, and then bonding the first display panel SUB1 and the second display panel SUB2 together, the liquid crystal layer LCL can be disposed between the first display panel SUB1 and the second display panel SUB2. Although not shown in the drawings, a light source unit 50 can be further placed on the first display panel SUB1.

[0290] A method of manufacturing a display device according to an exemplary embodiment will be described below.

[0291] Figure 27A , Figure 27B , Figure 27C , Figure 27D , Figure 27E and Figure 27F are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0292] Referring to Figure 27A , a second partition wall portion 112 having light transmissivity and an opaque material pattern 801 are formed on the surface of a substrate BS2. Since the formation of the second partition wall portion 112 and the opaque material pattern 801 has been specifically described with reference to Figure 26A , Figure 26B , Figure 26C , Figure 26D , Figure 26E and Figure 26F , redundant description of this operation will be omitted.

[0293] Next, referring to Figure 27B , a light-shielding member forming composition 200 including a light-shielding material is coated onto the second partition wall portion 112. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed.

[0294] Next, referring to Figure 27C , the entire surface of the coated light-shielding member forming composition 200 is treated with fluorine. Treating the entire surface of the coated light-shielding member forming composition 200 with fluorine may include injecting carbon tetrafluoride (CF 4 ) gas. In the current operation, the overall fluorine content of the exposed surface (upper surface) of the coated light-shielding member forming composition 200 may be increased.

[0295] Next, referring to Figure 27D , a light-shielding member 210 is formed by irradiating light from the back of the substrate BS2. Since the formation of the light-shielding member 210 has been specifically described with reference to Figure 26H , redundant description of this operation will be omitted.

[0296] Next, referring to Figure 27E , the remaining light-shielding member forming composition 200 is removed. Removing the remaining light-shielding member forming composition 200 may include removing the remaining light-shielding member forming composition 200 by coating a developer.

[0297] After removing the remaining light-shielding member, the exposed light-shielding member 210 after forming the composition 200 may have different fluorine contents in its different regions. For example, the fluorine content per unit area of the surface of the light-shielding member 210 disposed on the upper surface of the second partition wall portion 112 that is exposed to fluorine treatment may be greater than the fluorine content per unit area of the surface of the light-shielding member 210 disposed on the side surface of the second partition wall portion 112 that is not exposed to fluorine treatment.

[0298] Next, referring to Figure 27F , the opaque material pattern 801 is removed to at least partially expose the surface of the substrate BS2.

[0299] Although not shown in the drawings, a display device may be manufactured by the same method as that referred to above Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O described.

[0300] Figure 28A , Figure 28B , Figure 28C , Figure 28D , Figure 28E , Figure 28F , Figure 28G and Figure 28H are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0301] Referring to Figure 28A , a second partition wall portion 112 having light transmissivity and an opaque material pattern 801 are formed on the surface of the substrate BS2. Since the formation of the second partition wall portion 112 and the opaque material pattern 801 has been specifically described with reference to Figure 26A , Figure 26B , Figure 26C , Figure 26D , Figure 26E and Figure 26F , redundant description of this operation will be omitted.

[0302] Next, referring to Figure 28B , a light-shielding member forming composition 200 including a light-shielding material is coated onto the second partition wall portion 112. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed.

[0303] Next, referring to Figure 28C , the light-shielding member 210 is formed by irradiating light from the back of the substrate BS2. Since the formation of the light-shielding member 210 has been specifically described with reference to Figure 26H , redundant description of this operation will be omitted.

[0304] Next, referring toFigure 28D The resin layer 750 is formed on the light-shielding member 210 and the uncured portion 201. The method of forming the resin layer 750 is not particularly limited. For example, the resin layer 750 can be formed by coating a UV-curable resin material.

[0305] Next, referring to Figure 28E , the patterned resin layer 750 is formed using the stamper ST. The stamper ST can have a pattern opposite to the concave and convex pattern to be formed. By placing the stamper ST on the surface of the resin layer 750 and pressing the stamper ST, the opposite pattern of the pattern formed on the stamper ST can be transferred to the surface of the resin layer 750.

[0306] Next, referring to Figure 28F , the stamper ST is removed to form the concave and convex pattern layer 751 on the light-shielding member 210 and the uncured portion 201.

[0307] Next, referring to Figure 28G , the uncured portion 201 of the light-shielding member forming composition 200 is removed to form the concave and convex pattern 700 on the light-shielding member 210. Removing the light-shielding member forming composition 200 can include removing the remaining light-shielding member forming composition 200 by coating a developer.

[0308] When the remaining light-shielding member forming composition 200 is removed, the concave and convex pattern layer 751 overlapping with the uncured portion 201 is removed, and the concave and convex pattern 700 can remain on the surface of the cured light-shielding member 210.

[0309] Next, referring to Figure 28H , the opaque material pattern 801 is removed to at least partially expose the surface of the substrate BS2.

[0310] Although not shown in the drawings, a display device can be manufactured by the same method as that referred to above with reference to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0311] Figure 29A , Figure 29B , Figure 29C , Figure 29D , Figure 29E , Figure 29F , Figure 29G and Figure 29H are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0312] Referring to Figure 29A, an opaque material layer 800 and a photosensitive pattern layer 851 are formed on the surface of the substrate BS2. Since the formation of the opaque material layer 800 and the photosensitive pattern layer 851 has been specifically described with reference to Figure 26A , Figure 26B and Figure 26C , a redundant description of this operation will be omitted.

[0313] Next, with reference to Figure 29B , an opaque material pattern 802 is formed using the photosensitive pattern layer 852 as an etching mask. Forming the opaque material pattern 802 may include patterning the opaque material layer 800 using an etching process. In an exemplary embodiment, the side surface of the opaque material pattern 802 may have an inverse slope. The side shape of the opaque material pattern 802 can be controlled by the type of etching process, etchant, etching time, etching conditions, etc. However, the exemplary embodiment is not limited thereto, and the side surface of the opaque material pattern 802 may have a non-inverse slope, or may be substantially perpendicular to the surface of the substrate BS2. The photosensitive pattern layer 852 used as the etching mask can be removed by an ashing process.

[0314] Next, with reference to Figure 29C , an organic layer 100 is formed on the opaque material pattern 802. Since the formation of the organic layer 100 has been described above with reference to Figure 26E , a redundant description of this operation will be omitted.

[0315] Next, with reference to Figure 29D , a second partition wall portion 112 is formed on the substrate BS2. Forming the second partition wall portion 112 may include: irradiating light to the organic layer 100 using a mask M1 as an exposure mask, and forming the second partition wall portion 112 by coating a developer. In the current operation, the second partition wall portion 112 and the opaque material pattern 802 may be spaced apart from each other, and at least a part of the surface of the substrate BS2 may be exposed and not covered by the second partition wall portion 112 and the opaque material pattern 802.

[0316] Next, with reference to Figure 29E , a light-shielding member forming composition 200 including a light-shielding material is coated onto the second partition wall portion 112. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed. In the current operation, the light-shielding member forming composition 200 may at least partially fill the space between the second partition wall portion 112 and the opaque material pattern 802.

[0317] Next, with reference to Figure 29F , a light-shielding member 240 is formed by irradiating light from the back of the substrate BS2. Since it has been referred to Figure 26HThe formation of the light-shielding member 240 is specifically described, and thus redundant descriptions of this operation will be omitted.

[0318] Next, referring to Figure 29G , the remaining light-shielding member forming composition 200 is removed. Removing the remaining light-shielding member forming composition 200 may include removing the remaining light-shielding member forming composition 200 by coating a developer.

[0319] Next, referring to Figure 29H , the opaque material pattern 802 is removed to at least partially expose the surface of the substrate BS2.

[0320] Although not shown in the drawings, a display device may be manufactured by the same method as that referred to above with respect to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0321] Figure 30A , Figure 30B , Figure 30C , Figure 30D , Figure 30E and Figure 30F are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0322] Referring to Figure 30A , an opaque material pattern 803 is formed on the surface of the substrate BS2. The side surface of the opaque material pattern 803 may be substantially perpendicular to the surface of the substrate BS2. Since the method of forming the opaque material pattern 803 has been specifically described with reference to Figure 26A , Figure 26B , Figure 26C and Figure 26D , redundant descriptions of this method will be omitted.

[0323] Next, referring to Figure 30B , a second partition wall portion 112 is formed on the substrate BS2. In the current operation, the second partition wall portion 112 and the opaque material pattern 803 may at least partially contact each other. That is, the surface of the substrate BS2 may be completely covered by the second partition wall portion 112 and the opaque material pattern 803. Since the formation of the second partition wall portion 112 has been described above with reference to Figure 26E and Figure 26F , redundant descriptions of this operation will be omitted.

[0324] Next, referring to Figure 30C , a light-shielding member forming composition 200 including a light-shielding material is coated onto the second partition wall portion 112. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed.

[0325] Next, referring to Figure 30D , the light-shielding member 250 is formed by irradiating light from the back of the substrate BS2. When the opaque material pattern 803 having a vertical side surface comes into contact with the second partition wall portion 112, the side surface of the light-shielding member 250 can also be vertical. Since the formation of the light-shielding member 250 has been specifically described with reference to Figure 26H , redundant description of this operation will be omitted.

[0326] Next, referring to Figure 30E , the remaining light-shielding member forming composition 200 is removed. Removing the remaining light-shielding member forming composition 200 may include removing the remaining light-shielding member forming composition 200 by coating a developer.

[0327] Next, referring to Figure 30F , the opaque material pattern 803 is removed to at least partially expose the surface of the substrate BS2.

[0328] Although not shown in the drawings, a display device can be manufactured by the same method as that referred to above with reference to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0329] Figure 31A , Figure 31B , Figure 31C , Figure 31D , Figure 31E and Figure 31F are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0330] Referring to Figure 31A , the opaque material pattern 804 is formed on the surface of the substrate BS2. Since the method of forming the opaque material pattern 804 has been specifically described with reference to Figure 26A , Figure 26B , Figure 26C and Figure 26D , redundant description of this method will be omitted.

[0331] Next, referring to Figure 31B , the second partition wall portion 112 is formed on the substrate BS2. Since the formation of the second partition wall portion 112 has been described above with reference to Figure 26E and Figure 26F , redundant description of this operation will be omitted.

[0332] Next, referring to Figure 3, a light-shielding member forming composition 200 including a light-shielding material is coated onto the second partition wall portion 112. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed.

[0333] Next, referring to ​ , a light-shielding member 260 is formed by irradiating light from the back of the substrate BS2. In an exemplary embodiment, the light-shielding member 260 may at least partially overlap with the opaque material pattern 804. Since the formation of the light-shielding member 260 has been specifically described with reference to ​ , redundant description of this operation will be omitted.

[0334] Next, referring to ​ , the remaining light-shielding member forming composition 200 is removed. Removing the remaining light-shielding member forming composition 200 may include removing the remaining light-shielding member forming composition 200 by coating a developer.

[0335] Referring to ​ , the opaque material pattern 804 is removed to at least partially expose the surface of the substrate BS2. Accordingly, the second partition wall portion 112 disposed on the substrate BS2 and the light-shielding member 260 disposed on the second partition wall portion 112 and having an undercut portion may be formed.

[0336] Although not shown in the drawings, a display device may be manufactured by the same method as that described above with reference to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0337] Figure 32A , Figure 32B , Figure 32C , Figure 32D , Figure 32E and Figure 32F are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0338] Referring to Figure 32A , Figure 32B , Figure 32C , Figure 32D and Figure 32E , a second partition wall portion 112 having light transmissivity and an opaque material pattern 804 are formed on the surface of the substrate BS2. Then, the light-shielding member forming composition 200 is coated, and light is irradiated from the back of the substrate BS2 to form the light-shielding member 260. The light-shielding member 260 may at least partially overlap with the opaque material pattern 804. Since these operations are the same as those in Figure 31A , Figure 31B , Figure 31C , Figure 31DAnd Figure 31E These operations are substantially the same, so redundant descriptions will be omitted.

[0339] Next, referring to Figure 32F , the opaque material pattern 804 is removed to at least partially expose the surface of the substrate BS2. In an exemplary embodiment, the opaque material pattern 810 may remain on at least a portion of the undercut portion of the light-shielding member 260. Thus, the opaque material pattern 810 may be formed between the light-shielding member 260 and the substrate BS2.

[0340] Although not shown in the drawings, a display device may be manufactured by the same method as that referred to above with respect to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0341] Figure 33A , Figure 33B , Figure 33C , Figure 33D , Figure 33E and Figure 33F are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0342] Referring to Figure 33A , an opaque material pattern 805 is formed on the surface of the substrate BS2. Since the method of forming the opaque material pattern 805 has been specifically described with reference to Figure 26A , Figure 26B , Figure 26C and Figure 26D , redundant descriptions of this method will be omitted.

[0343] Next, referring to Figure 33B , the partition wall 130 is formed on the substrate BS2. In an exemplary embodiment, the partition wall 130 may at least partially overlap with the opaque material pattern 805. Since the formation of the partition wall 130 has been described with reference to Figure 26E and Figure 26F , redundant descriptions of this operation will be omitted.

[0344] Next, referring to Figure 33C , Figure 33D and Figure 33E , a light-shielding member forming composition 200 including a light-shielding material is coated, light is radiated from the back of the substrate BS2 to form a light-shielding member 280, and the remaining light-shielding member forming composition 200 is removed.

[0345] Referring to Figure 33FThe opaque material pattern 805 is removed to at least partially expose the surface of the substrate BS2. Accordingly, the partition wall 130 having the undercut 130U disposed thereon and the light-shielding member 280 disposed on the partition wall 130 can be formed on the substrate BS2.

[0346] Although not shown in the drawings, the display device can be manufactured by the same method as described above with reference to Figure 26K 、 Figure 26L 、 Figure 26M 、 Figure 26N and Figure 26O .

[0347] Figure 34A 、 Figure 34B 、 Figure 34C 、 Figure 34D 、 Figure 34E and Figure 34F are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0348] Referring to Figure 34A 、 Figure 34B 、 Figure 34C 、 Figure 34D and Figure 34E , the partition wall 130 having light transmissivity and the opaque material pattern 805 are formed on the surface of the substrate BS2. Then, the light-shielding member forming composition 200 is coated, and light is irradiated from the back of the substrate BS2 to form the light-shielding member 280. The partition wall 130 may at least partially overlap with the opaque material pattern 805. Since these operations are the same as those of Figure 33A 、 Figure 33B 、 Figure 33C 、 Figure 33D and Figure 33E , redundant description will be omitted.

[0349] Referring to Figure 34F , the opaque material pattern 805 is removed to at least partially expose the surface of the substrate BS2. In the exemplary embodiment, the opaque material pattern 805 may remain on at least a part of the undercut portion of the partition wall 130. Accordingly, the opaque material layer 830 can be formed between the partition wall 130 and the substrate BS2.

[0350] Although not shown in the drawings, the display device can be manufactured by the same method as described above with reference to Figure 26K 、 Figure 26L 、 Figure 26M 、 Figure 26N and Figure 26O .

[0351] Figure 35A 、 Figure 35B 、 Figure 35C 、 Figure 35D, Figure 35E , Figure 35F and Figure 35G are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0352] Referring to Figure 35A , a second partition wall portion 112 is formed on the surface of the substrate BS2 (the upper surface in Figure 35A ). Forming the second partition wall portion 112 may include forming an organic layer and patterning the organic layer. Accordingly, a second partition wall portion 112 that exposes at least a part of the surface of the substrate BS2 may be formed.

[0353] Next, referring to Figure 35B , an opaque material layer 806 is formed on the substrate BS2 and the second partition wall portion 112. The opaque material layer 806 may include a reflective metal material or an opaque organic material. The method of forming the opaque material layer 806 is not particularly limited. For example, the opaque material layer 806 may be formed by a deposition method such as sputtering.

[0354] Next, referring to Figure 35C , an opaque material pattern 807 is formed. Forming the opaque material pattern 807 may include placing an etching mask and etching the opaque material layer 806 using the etching mask. In an exemplary embodiment, the opaque material pattern 807 may be disposed on at least a part of the second partition wall portion 112. That is, the opaque material pattern 807 may at least partially overlap with the second partition wall portion 112. Accordingly, the opaque material pattern 807 may be formed on the exposed surface of the substrate BS2.

[0355] Next, referring to Figure 35D , a light-shielding member forming composition 200 including a light-shielding material is coated on the opaque material pattern 807. In an exemplary embodiment, pre-baking of the coated light-shielding member forming composition 200 may be further performed.

[0356] Next, referring to Figure 35E , a light-shielding member 270 is formed by irradiating light from the back of the substrate BS2. Since the formation of the light-shielding member 270 has been specifically described with reference to Figure 26H , a redundant description of this operation will be omitted.

[0357] Next, referring to Figure 35F , the remaining light-shielding member forming composition 200 is removed. Removing the remaining light-shielding member forming composition 200 may include removing the remaining light-shielding member forming composition 200 by coating a developer.

[0358] Next, referring to Figure 35G, the opaque material pattern 807 is removed to at least partially expose the surface of the substrate BS2. Accordingly, the light-shielding member 270 spaced apart from the substrate BS2 can be formed.

[0359] Although not shown in the drawings, a display device can be manufactured by the same method as that described above with reference to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0360] Figure 36A , Figure 36B , Figure 36C , Figure 36D , Figure 36E , Figure 36F and Figure 36G are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

[0361] Referring to Figure 36A , Figure 36B , Figure 36C , Figure 36D , Figure 36E and Figure 36F , a second partition wall portion 112 having transparency and an opaque material pattern 807 are formed on the surface of the substrate BS2. Then, the light-shielding member forming composition 200 is coated, and light is irradiated from the back of the substrate BS2 to form the light-shielding member 270. The opaque material pattern 807 may at least partially overlap with the second partition wall portion 112. Since these operations are substantially the same as those of Figure 35A , Figure 35B , Figure 35C , Figure 35D , Figure 35E and Figure 35F , redundant descriptions will be omitted.

[0362] Next, referring to Figure 36G , the opaque material pattern 807 is removed to at least partially expose the surface of the substrate BS2. In the exemplary embodiment, the opaque material pattern 820 may remain on at least a part of the exposed side surface of the second partition wall portion 112. Accordingly, the opaque material pattern 820 may be formed in contact with the second partition wall portion 112.

[0363] Although not shown in the drawings, a display device can be manufactured by the same method as that described above with reference to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O .

[0364] Figure 37A ,Figure 37B , Figure 37C , Figure 37D , Figure 37E , Figure 37F , Figure 37G and Figure 37H are cross - sectional views illustrating methods of manufacturing a display device according to exemplary embodiments.

[0365] Referring to Figure 37A , a first band - pass filter 314 and a second band - pass filter 324 are formed on the surface of the substrate BS2 (the upper surface in Figure 37A ). Each of the first band - pass filter 314 and the second band - pass filter 324 may be a wavelength - selective optical filter that transmits light of a specific band and blocks light of another specific band. The first band - pass filter 314 and the second band - pass filter 324 may be spaced apart from each other.

[0366] Referring to Figure 37B , an opaque material layer 808 is formed on the first band - pass filter 314 and the second band - pass filter 324. The opaque material layer 808 may include a reflective metal material such as aluminum, copper, silver, gold, titanium, molybdenum, nickel, or an alloy of these materials, or may include an opaque organic material.

[0367] Referring to Figure 37C , an opaque material pattern 809 is formed by patterning the opaque material layer 808. Forming the opaque material pattern 809 may include patterning the opaque material layer 808 using an etching mask.

[0368] In an exemplary embodiment, the width t 1 of the opaque material pattern 809 may be smaller than the widths t 2 of the first band - pass filter 314 and the second band - pass filter 324. That is, the formed opaque material pattern 809 may partially expose the first band - pass filter 314 and the second band - pass filter 324, rather than completely covering the first band - pass filter 314 and the second band - pass filter 324.

[0369] Next, referring to Figure 37D , a second partition wall portion 112 is formed on the substrate BS2. In an exemplary embodiment, the second partition wall portion 112 may at least partially overlap with the first band - pass filter 314 and / or the second band - pass filter 324. Since the formation of the second partition wall portion 112 has been described above with reference to Figure 26E and Figure 26F , a redundant description of this operation will be omitted.

[0370] Next, referring to Figure 37E , Figure 37F and Figure 37G, a light-shielding member forming composition 200 including a light-shielding material is coated, light is radiated from the back of the substrate BS2 to form a light-shielding member 290, and the remaining light-shielding member forming composition 200 is removed.

[0371] Reference Figure 37H , the opaque material pattern 809 is removed to at least partially expose the surface of the substrate BS2 and the first bandpass filter 314 and the second bandpass filter 324. Accordingly, the first bandpass filter 314 and the second bandpass filter 324 disposed between the substrate BS2 and the second partition wall portion 112 can be formed.

[0372] Although not shown in the drawings, a display device can be manufactured by the same method as described above with reference to Figure 26K , Figure 26L , Figure 26M , Figure 26N and Figure 26O described.

[0373] A display device according to an exemplary embodiment may include a light-shielding member disposed between adjacent pixels to block the travel of light between the pixels. Accordingly, a defect in which light leaks from an undesired pixel can be suppressed or reduced, thereby providing a display device having improved display quality.

[0374] A method of manufacturing a display device according to an exemplary embodiment can be employed to produce a display device having improved display quality.

[0375] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the provided claims and various apparent modifications and equivalent arrangements.

Claims

1. A display device, comprising: a substrate; a transparent partition wall disposed on the substrate, the transparent partition wall being configured to define a plurality of openings; a light-shielding member disposed on an upper surface and a side surface of the transparent partition wall, the light-shielding member comprising a negative photosensitive organic material; and a first color conversion pattern disposed in at least one of the plurality of openings, the first color conversion pattern comprising a quantum dot material or a fluorescent material, wherein a maximum height of the first color conversion pattern with respect to a surface of the substrate is greater than a maximum height of the transparent partition wall with respect to the surface of the substrate, and wherein the transparent partition wall has an undercut at an end thereof, and a width of a lower surface of the transparent partition wall facing the substrate is less than a maximum width of the transparent partition wall.

2. The display device according to claim 1, wherein the transparent partition wall comprises: a plurality of first partition wall portions extending in a first direction; and a plurality of second partition wall portions extending in a second direction intersecting the first direction, wherein the openings are defined by the first partition wall portions and the second partition wall portions, and the light-shielding member has a lattice shape in a plan view.

3. The display device according to claim 1, wherein, the light-shielding member disposed on the upper surface of the transparent partition wall has a greater thickness than the light-shielding member disposed on the side surface of the transparent partition wall.

4. The display device according to claim 1, wherein the light-shielding member is directly disposed on the transparent partition wall, and the light-shielding member comprises: a first surface, at least a part of which directly contacts the transparent partition wall; and a second surface facing away from the first surface, wherein a roughness of the second surface is greater than a roughness of the first surface.

5. The display device according to claim 1, wherein, the transparent partition wall comprises particles dispersed therein.

6. The display device according to claim 1, comprising: a first pixel configured to display a first color; a second pixel configured to display a second color having a shorter peak wavelength than the first color; a third pixel configured to display a third color having a shorter peak wavelength than the second color, wherein the display device further comprises: a liquid crystal layer disposed on the first color conversion pattern; a band filter disposed between the first color conversion pattern and the liquid crystal layer, the band filter being configured to selectively transmit light in a band having a peak wavelength including the third color and selectively block light in a band having a peak wavelength longer than the peak wavelength of the third color; and a light source disposed on the liquid crystal layer, the light source being configured to provide light of the third color, wherein the first color conversion pattern is disposed in the first pixel and is configured to convert a color of incident light into the first color, and wherein at least a part of the band filter directly contacts the light-shielding member.

7. The display device according to claim 1, comprising: a first pixel configured to display a first color; a second pixel configured to display a second color, the second color having a peak wavelength shorter than that of the first color; and a third pixel configured to display a third color, the third color having a peak wavelength shorter than that of the second color, wherein the display device further comprises: a liquid crystal layer disposed on the first color conversion pattern; a light source disposed on the liquid crystal layer, the light source being configured to provide light of the third color; and a band filter disposed between the light-shielding member and the first color conversion pattern, the band filter being configured to selectively transmit light in a band having a peak wavelength including a peak wavelength longer than that of the third color and selectively block light in a band including the peak wavelength of the third color, wherein at least a part of the band filter is disposed on the upper surface of the transparent partition wall.

8. The display device according to claim 1, further comprising: a band filter disposed between the substrate and the transparent partition wall, the band filter being configured to selectively transmit light in a specific band; and an opaque material pattern disposed between the band filter and the transparent partition wall, the opaque material pattern including a material different from that of the light-shielding member.

9. The display device according to claim 1, further comprising: a band filter disposed between the substrate and the first color conversion pattern, the band filter being configured to selectively transmit light in a specific band; and an opaque material pattern disposed between the substrate and the light-shielding member, the opaque material pattern including a material different from that of the light-shielding member.

10. The display device according to claim 1, further comprising: a band filter disposed between the substrate and the first color conversion pattern, the band filter being configured to selectively transmit light in a specific band; and an opaque material pattern disposed between the substrate and the transparent partition wall, the opaque material pattern including a material different from that of the light-shielding member.

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