Cooling equipment and server

Abstract

The invention provides cooling equipment and a server. The liquid cooling equipment comprises a heat dissipation assembly and a soaking assembly, the soaking assembly comprises a soaking plate and a first heat dissipation piece, and the soaking plate comprises a first containing cavity for containing a first cooling medium; the first heat dissipation piece extends in the direction perpendicular to the vapor chamber and comprises a first cavity and a second cavity which communicate with the first containing cavity. The second chamber surrounds the outer peripheral surface of the first chamber; the first cavity communicates with the second cavity through a first one-way valve, and the bottom of the second cavity communicates with the first containing cavity through a second one-way valve. The heat dissipation assembly is arranged on the first heat dissipation piece in a sleeving manner and is configured to exchange heat with a first cooling medium; the heated and gasified first cooling medium enters the second cavity through the first one-way valve, exchanges heat with the heat dissipation assembly and then is condensed into a liquid state; the liquid first cooling medium flows back to the bottom of the first containing cavity through the second one-way valve, and the cooling effect of the cooling equipment is improved.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a cooling device and a server. Background Art

[0002] With the popularization and application of artificial intelligence technology, the demand for high computing power scenarios has been increasing continuously, causing the average power consumption of chips inside the server to jump from 300W to over 1000W, and then resulting in an increase in the temperature of the server, which affects the normal use of the server. Currently, air-cooling devices are usually used to cool the chips inside the server for heat dissipation. However, the air-cooling technology can no longer meet the heat dissipation requirements of the chips inside the server.

[0003] In order to improve the heat dissipation effect of the server, the cooling devices in related technologies combine the air-cooling technology with the heat pipe vapor chamber heat dissipation technology. However, the above cooling devices have insufficient heat transfer capacity, greatly reducing the cooling capacity of the cooling devices. Summary of the Invention

[0004] Embodiments of this application provide a cooling device and a server.

[0005] In a first aspect, embodiments of this application provide a liquid-cooling device, including:

[0006] A heat pipe vapor chamber assembly, the heat pipe vapor chamber assembly includes a heat pipe vapor chamber and a first heat dissipation member disposed on the heat pipe vapor chamber. The heat pipe vapor chamber includes a first accommodation cavity for accommodating a first cooling medium; the first heat dissipation member extends in a direction perpendicular to the heat pipe vapor chamber and includes a first chamber and a second chamber that are both communicated with the first accommodation cavity; the second chamber surrounds the outer peripheral surface of the first chamber; the first chamber is communicated with the second chamber through a first one-way valve, and the bottom of the second chamber is communicated with the first accommodation cavity through a second one-way valve;

[0007] A heat dissipation assembly, the heat dissipation assembly is sleeved on the first heat dissipation member and is configured to exchange heat with the first cooling medium; wherein, the first cooling medium that is heated and vaporized enters the second chamber through the first one-way valve, exchanges heat with the heat dissipation assembly, and then condenses into a liquid state; the liquid first cooling medium flows back to the bottom of the first accommodation cavity through the second one-way valve.

[0008] In the cooling device provided by the embodiment of the present application, by improving the inner cavity of the first heat dissipation member provided on the heat spreader, the inner cavity thereof includes a first chamber and a second chamber that are both communicated with the first accommodation chamber, and the second chamber surrounds the outer peripheral surface of the first chamber. The first chamber is communicated with the second chamber through a first one-way valve, and the bottom of the second chamber is connected to the first accommodation chamber through a second one-way valve. Among them, the first one-way valve allows the first cooling medium gasified by heat in the first accommodation chamber to enter the second chamber, and prevents the first cooling medium condensed in the second chamber from entering the first chamber again, so that the condensed first cooling medium flows back to the bottom of the first accommodation chamber along the second chamber. At the same time, the second one-way valve prevents the first cooling medium gasified by heat in the first accommodation chamber from entering the second chamber. With such a setting, the flow path of the first cooling medium after being gasified by heat and the flow path of the first cooling medium after condensation can be separated. On the one hand, it can avoid the liquid first cooling medium moving from top to bottom from hindering the movement of the gaseous first cooling medium, ensuring that the heat absorbed by the heat spreader is timely transferred to the first heat dissipation member, and improving the heat transfer capacity of the heat spread assembly; on the other hand, it can also prevent the gaseous first cooling medium in the first chamber from being prematurely condensed into a liquid when the heat dissipation capacity of the heat dissipation assembly is too strong, preventing the liquid first cooling medium from hindering the movement of the gaseous first cooling medium from bottom to top, improving the heat transfer capacity of the first heat dissipation member, and further improving the heat dissipation capacity of the cooling device.

[0009] In a possible implementation manner, the second chamber surrounds the entire outer peripheral surface of the first chamber, and a heat exchange chamber is formed between the top of the second chamber and the top of the first chamber.

[0010] In a possible implementation manner, the second chamber surrounds a part of the outer peripheral surface of the first chamber.

[0011] In a possible implementation manner, the first heat dissipation member includes a heat dissipation tube and a cylindrical body; the inner cavity of the heat dissipation tube constitutes the first chamber, one end of the heat dissipation tube is communicated with the first accommodation chamber, and the first one-way valve is arranged at the other end of the heat dissipation tube;

[0012] The cylindrical body is sleeved on the heat dissipation tube, and a buffer chamber is formed between the top of the heat dissipation tube and the top of the cylindrical body; a first communication hole is arranged in the area of the heat spreader opposite to the second chamber, and the second one-way valve is arranged in the first communication hole.

[0013] In a possible implementation manner, the first accommodation chamber includes at least two relatively independent sub-chambers, the bottom surfaces of the at least two sub-chambers are all attached to the component to be cooled, and the top surfaces of the at least two sub-chambers are all communicated with the first chamber and the second chamber of the first heat dissipation member.

[0014] In a possible implementation, the number of the first heat dissipation components is multiple, and the multiple first heat dissipation components are arranged at intervals on the heat spreader;

[0015] In at least two of the sub-chambers, any one of the sub-chambers communicates with the first chamber and the second chamber of a part of the first heat dissipation components.

[0016] In a possible implementation, the heat dissipation assembly includes a heat dissipation housing and multiple second heat dissipation components; the heat dissipation housing is arranged on the heat spreader and encloses a second accommodation cavity with the heat spreader; a second cooling medium is accommodated in the second accommodation cavity;

[0017] The multiple second heat dissipation components are sleeved on the first heat dissipation components at intervals along a direction perpendicular to the heat spreader and are located in the second accommodation cavity; wherein, a flow channel is formed between any two adjacent second heat dissipation components, and the flow channel extends along a direction parallel to the heat spreader.

[0018] In a possible implementation, a liquid inlet pipe is arranged on the top surface of the heat dissipation housing facing away from the heat spreader, the liquid inlet pipe communicates with the second accommodation cavity, and is located on one side of the inlet end of the flow channel;

[0019] A flow equalizing member is arranged between the inlet end of the flow channel and the liquid inlet pipe, the flow equalizing member extends along a direction perpendicular to the heat spreader, and one end of the flow equalizing member is connected to the top surface of the heat dissipation housing, and the other end is connected to the heat spreader;

[0020] The flow equalizing member includes multiple flow equalizing parts, and the multiple flow equalizing parts are configured to balance the flow rates of the second cooling medium in the multiple flow channels.

[0021] In a possible implementation, the flow equalizing member includes a flow equalizing plate and multiple groups of flow equalizing holes arranged on the flow equalizing plate; the multiple groups of flow equalizing holes are arranged at intervals along a direction perpendicular to the heat spreader, and each group of flow equalizing holes is oppositely arranged with one of the flow channels and constitutes one flow equalizing part;

[0022] Each group of flow equalizing holes includes multiple flow equalizing holes, and each flow equalizing hole penetrates through the flow equalizing plate along the thickness direction of the flow equalizing plate.

[0023] In a possible implementation, a liquid outlet pipe is arranged on the top surface of the heat dissipation housing facing away from the heat spreader, and the liquid outlet pipe communicates with the second accommodation cavity;

[0024] The top surface of the heat dissipation housing facing away from the heat spreader is square, and the liquid inlet pipe and the liquid outlet pipe are arranged at the diagonals of the top surface of the heat dissipation housing facing away from the heat spreader.

[0025] In a possible implementation, the cooling device further includes an annular mounting plate and a locking member, and a first mounting hole is provided on the mounting plate;

[0026] A second mounting hole is provided on the heat sink plate, and the second mounting hole is disposed opposite to the first mounting hole; the annular mounting plate is disposed on the heat sink plate and sleeved on the outer peripheral surface of the heat dissipation assembly; the locking member passes through the first mounting hole and the second mounting hole in sequence and then is fixedly connected to the component to be cooled.

[0027] In a possible implementation, the locking member includes a locking rod and an adapter sleeved on the locking rod;

[0028] The adapter includes an annular main body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular main body, and the plurality of elastic claws are spaced apart along the circumferential direction of the annular main body.

[0029] In a possible implementation, the locking member further includes an elastic member; the locking rod includes a first boss and a second boss which are spaced apart, and the second boss and the adapter are respectively located on both sides of the annular mounting plate;

[0030] The elastic member is sleeved on the locking rod and located between the first boss and the second boss.

[0031] In a second aspect, an embodiment of the present application provides a server, including a circuit board, a chip, and the cooling device according to any one of the first aspect; the chip is disposed on the circuit board; the cooling device is disposed on the circuit board, and the heat sink plate of the cooling device is attached to the chip.

[0032] Since the server provided by the embodiment of the present application includes the cooling device of the first aspect, the server of the embodiment of the present application has the same effects as those of the cooling device of the first aspect, which will not be elaborated here.

[0033] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought by the technical features of these technical solutions, other technical problems that can be solved by the cooling device and the server provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manners. Description of the Drawings

[0034] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0035] Figure 1 Explosion schematic diagram of the cooling device provided by an embodiment of the present application;

[0036] Figure 2 For Figure 1 Enlarged schematic diagram of area A in

[0037] Figure 3 Schematic diagram of the heat sink assembly provided by an embodiment of the application Figure 1 ;

[0038] Figure 4 Schematic diagram of the heat sink assembly provided by an embodiment of the present application Figure 2 ;

[0039] Figure 5 Partial explosion schematic diagram of the cooling device provided by an embodiment of the present application;

[0040] Figure 6 For Figure 5 Enlarged schematic diagram of area B in

[0041] Figure 7 Schematic diagram of the heat sink assembly provided by an embodiment of the present application Figure 3 ;

[0042] Figure 8 Schematic diagram of the flow equalizing plate provided by an embodiment of the present application;

[0043] Figure 9 Top view of the cooling device provided by an embodiment of the present application;

[0044] Figure 10 Three-dimensional view of the locking member provided by an embodiment of the present application;

[0045] Figure 11 Schematic diagram of the adapter provided by an embodiment of the present application;

[0046] Figure 12 Schematic diagram of the server provided by an embodiment of the present application.

[0047] Reference numerals:

[0048] 100: Heat sink assembly;

[0049] 110: Heat pipe; 111: First accommodation cavity; 1111: Sub-chamber; 112: Second mounting hole;

[0050] 120: First heat dissipation member; 121: First cavity; 122: Second cavity; 123: Buffer cavity; 124: Heat dissipation pipe; 125: Cylindrical body;

[0051] 130: First one-way valve;

[0052] 140: Second one-way valve;

[0053] 150: Partition board;

[0054] 200: Heat dissipation assembly;

[0055] 210: Heat dissipation housing; 211: Top plate; 2111: Groove; 212: Annular side plate;

[0056] 220: Second heat dissipation member; 221: Through hole;

[0057] 230: Flow passage;

[0058] 240: Liquid inlet pipe;

[0059] 250: Liquid outlet pipe;

[0060] 260: Flow equalizing member; 261: Flow equalizing portion; 262: Flow equalizing plate;

[0061] 300: Mounting plate;

[0062] 400: Locking member; 410: Locking rod; 411: First boss; 412: Second boss; 420: Adapter; 421: Ring-shaped body; 422: Elastic claw; 430: Elastic member;

[0063] 500: Circuit board;

[0064] 600: Chip. Detailed implementation manner

[0065] As described in the background art, there is a problem of insufficient heat transfer capacity in a cooling device that combines an air-cooling technology and a vapor chamber heat dissipation technology. Through research by the inventors, it is found that the reason for this problem lies in that: the vapor chamber in the related art includes heat dissipation columns, and the heat dissipation columns extend in a direction perpendicular to the bottom surface of the vapor chamber; among them, the heat dissipation columns are filled with a cooling medium. A heat dissipation sleeve is sleeved on the heat dissipation columns. When the cooling medium in the vapor chamber absorbs heat and vaporizes, it moves upward from bottom to top along the height direction of the heat dissipation columns, and is condensed into a liquid state through air-cooled heat exchange of the heat dissipation member, and flows back along the inner cavity of the heat dissipation columns by its own gravity to achieve the heat dissipation function of the cooling device. However, during the heat transfer process of the heat dissipation columns, the heat dissipation columns include both gaseous cooling medium moving from bottom to top and liquid cooling medium moving from top to bottom. Thus, the liquid cooling medium moving from top to bottom will hinder the movement of the gaseous cooling medium, so that the first cooling medium vaporized by heat in the vapor chamber cannot be timely transferred to the heat dissipation member, resulting in defects of insufficient heat transfer capacity and poor cooling effect.

[0066] In view of this, the embodiments of the present application provide a cooling device and a server. By improving the inner cavity of the first heat dissipation member provided on the vapor chamber, the inner cavity thereof includes a first chamber and a second chamber that are both communicated with the first accommodating chamber. The second chamber surrounds the outer peripheral surface of the first chamber, and a second chamber is formed between the top of the second chamber and the top of the first chamber. The first chamber is communicated with the second chamber through a first one-way valve, and the bottom of the second chamber is connected to the first accommodating chamber through a second one-way valve. Among them, the first one-way valve allows the first cooling medium vaporized by heat in the first accommodating chamber to enter the second chamber, and prevents the first cooling medium condensed in the second chamber from entering the first chamber again, so that the condensed first cooling medium converges along the second chamber to the bottom of the first accommodating chamber. At the same time, the second one-way valve prevents the first cooling medium vaporized by heat in the first accommodating chamber from entering the second chamber. With such a setting, the flow path of the first cooling medium after being vaporized by heat and the flow path of the first cooling medium after condensation can be separated. On the one hand, it can avoid the liquid first cooling medium moving from top to bottom from hindering the movement of the gaseous first cooling medium, ensuring that the heat absorbed by the vapor chamber is timely transferred to the first heat dissipation member, and improving the heat transfer capacity of the heat dissipation assembly; on the other hand, it can also avoid premature condensation of the gaseous first cooling medium located in the first chamber into a liquid state when the heat dissipation capacity of the heat dissipation assembly is too strong, preventing the liquid first cooling medium from hindering the movement of the gaseous first cooling medium from bottom to top, improving the heat transfer capacity of the first heat dissipation member, and further improving the heat dissipation capacity of the cooling device.

[0067] In order to make the above-mentioned objects, features, and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0068] Please refer to the attached Figure 1 to the attached Figure 11 , the embodiments of the present application provide a cooling device, which is used to dissipate heat from the piece to be cooled to ensure the normal operation of the piece to be cooled. Exemplarily, the cooling device is used to dissipate heat from the chips of a server. The cooling device has strong heat dissipation performance and can quickly take away the heat generated by the chips of the server, ensuring the normal operation of the chips of the server.

[0069] The cooling device includes a heat spreader assembly 100 and a heat dissipation assembly 200. The heat spreader assembly 100 includes a heat spreader 110 and a first heat dissipation member 120. The first heat dissipation member 120 is disposed on the heat spreader 110, and the first heat dissipation member 120 extends in a direction perpendicular to the heat spreader 110, that is, the first heat dissipation member 120 extends in the vertical direction. Among them, both the heat spreader 110 and the first heat dissipation member 120 have inner cavities, and the inner cavities of the two are in communication with each other. Exemplarily, please continue to refer to the attached Figure 3 and the attached Figure 4 , the heat spreader 110 includes a first accommodation cavity 111, the first heat dissipation member 120 includes a first chamber 121 and a second chamber 122, and both the first chamber 121 and the second chamber 122 are in communication with the first accommodation cavity 111.

[0070] The second chamber 122 surrounds the outer peripheral surface of the first chamber 121. The first chamber 121 is in communication with the second chamber 122 through a first one-way valve 130, and the bottom of the second chamber 122 is in communication with the first accommodation cavity 111 through a second one-way valve 140. Among them, the first one-way valve 130 only allows the first cooling medium vaporized by heat in the first accommodation cavity 111 to flow in the first chamber 121; it can also enter the second chamber 122 through the first one-way valve 130, and prevent the first cooling medium condensed in the second chamber 122 from entering the first chamber 121 again, so that the condensed first cooling medium flows back to the bottom of the first accommodation cavity 111 along the second chamber 122. At the same time, the second one-way valve 140 prevents the first cooling medium vaporized by heat in the first accommodation cavity 111 from entering the second chamber 122.

[0071] Please continue to refer to the attached Figure 1 、the attached Figure 5 and the attached Figure 6, The heat dissipation component 200 is sleeved on the first heat dissipation member 120 and is configured to exchange heat with the first cooling medium. Among them, the heat dissipation component 200 can be a plate heat sink or a microchannel heat sink, and the heat dissipation component 200 can be air-cooled or water-cooled. This embodiment does not make specific limitations here.

[0072] During use, it can be ensured that in the first accommodation cavity 111, the first cooling medium that is heated and vaporized enters the second chamber 122 through the first one-way valve 130, and condenses into a liquid state after exchanging heat with the heat dissipation component 200; the liquid first cooling medium flows back to the bottom of the first accommodation cavity 111 through the second one-way valve 140. It should be noted that Figure 3 and Figure 4 In, the solid arrow is used to represent the flow direction of the first cooling medium after being heated and vaporized, and the dashed arrow is used to represent the flow direction of the first cooling medium after condensing by exchanging heat with the heat dissipation component 200.

[0073] With such a setting, in this embodiment, the flow path of the first cooling medium after being heated and vaporized and the flow path of the first cooling medium after condensation can be separated. On the one hand, it can avoid the liquid first cooling medium moving from top to bottom from hindering the movement of the gaseous first cooling medium, ensuring that the heat absorbed by the heat pipe 110 is timely transferred to the first heat dissipation member 120, improving the heat transfer capacity of the heat pipe assembly 100; on the other hand, it can also avoid the gaseous first cooling medium in the first chamber 121 from condensing into a liquid state prematurely when the heat dissipation capacity of the heat dissipation component 200 is too strong, preventing the liquid first cooling medium from hindering the upward movement of the gaseous first cooling medium, improving the heat transfer capacity of the first heat dissipation member 120, and thus improving the heat dissipation capacity of the cooling device.

[0074] In this embodiment, the second chamber 122 surrounds the outer peripheral surface of the first chamber 121. It can be that the second chamber 122 surrounds a part of the outer peripheral surface of the first chamber 121, or it can be that the second chamber 122 surrounds the entire outer peripheral surface of the first chamber 121.

[0075] In an example, the second chamber 122 surrounds a part of the outer peripheral surface of the first chamber. For example, the second chamber 122 can be located on one side of the first chamber 121 and surround the outer side surface of the first chamber 121 so that the height of the second chamber 122 is equal to the height of the first chamber 121. With such a setting, the preparation of the first heat dissipation member 120 can be simplified. It should be noted that at this time, the first one-way valve 130 can be arranged on the side wall of the first chamber 121.

[0076] For another example, please refer to Figure 3, the second chamber 122 is located on one side of the first chamber 121, and the height of the second chamber 122 is greater than that of the first chamber 121. The second chamber 122 surrounds a part of the outer side surface of the first chamber 121 and the top surface surrounding the first chamber 121. For example, the cross-sectional shape of the second chamber 122 is semi-circular, and the second chamber 122 can surround a part of the outer peripheral surface of the first chamber 121. Wherein, a buffer chamber 123 is formed between the top of the second chamber 122 and the top of the first chamber 121; that is, the height of the first chamber 121 is less than the height of the second chamber 122 so that a buffer chamber 123 is formed between the top of the first chamber 121 and the top of the second chamber 122. It should be understood that in the attached Figure 3 and the attached Figure 4 , the area above the dotted line in them is the buffer chamber 123.

[0077] The volume of the buffer chamber 123 is greater than the volume of other regions of the second chamber 122. When the first cooling medium vaporized by heat enters the buffer chamber 123 through the first one-way valve 130, the buffer chamber 123 can slow down the flow rate of the first cooling medium, reduce the impact on the first heat sink 120, and improve the safety of the cooling device. In addition, the heat exchange time between the second cooling medium and the first cooling medium in the buffer chamber 123 can be extended, improving the cooling effect of the cooling device.

[0078] In another example, the second chamber 122 can also surround the entire outer peripheral surface of the first chamber 121, and a buffer chamber 123 is formed between the top of the second chamber 122 and the top of the first chamber 121. Exemplarily, please refer to the attached Figure 4 , the second chamber 122 surrounds the outer side surface of the first chamber 121 and the top surface surrounding the first chamber 121; in other words, the height of the second chamber 122 is greater than that of the first chamber 121. In this way, the second chamber 122 can wrap the first chamber 121. In this way, the buffer chamber 123 can be used to slow down the flow rate of the first cooling medium, reduce the impact on the first heat sink 120, and improve the safety of the cooling device. In addition, the heat exchange time between the second cooling medium and the first cooling medium in the buffer chamber 123 can also be extended, improving the cooling effect of the cooling device.

[0079] In view of this embodiment, please continue to refer to the attached Figure 5 and the attached Figure 6 , the heat dissipation assembly 200 is sleeved on the first heat sink 120. If the first heat sink 120 only includes one chamber, the distance between the heat dissipation assembly 200 and the chamber of the first heat sink 120 will be shortened. If the heat dissipation ability of the heat dissipation assembly 200 is strong, the vaporized first cooling medium in the chamber of the first heat sink 120 will condense into a liquid too early. Furthermore, during the downward movement of the liquid first cooling medium, it will hinder the upward movement of the first cooling medium after being heated and vaporized, reducing the cooling effect of the cooling device.

[0080] Therefore, in this embodiment, the second chamber 122 surrounds the entire outer peripheral surface of the first chamber 121, and there is also a second chamber 122 spaced between the heat dissipation component 200 and the first chamber 121. On the one hand, the distance between the heat dissipation component 200 and the first chamber 121 can be extended. With such a setting, please refer to the attached Figure 3 , the first cooling medium vaporized by heat has enough time to conduct upward along the vertical heat spreader 110, so that the first cooling medium vaporized by heat quickly diffuses into the second chamber 122, thereby preventing the first cooling medium located in the first chamber 121 from prematurely condensing into a liquid state and improving the heat transfer capacity of the first heat dissipation member 120.

[0081] On the other hand, the first chamber 121 and the second chamber 122 are completely independent chambers. The first chamber 121 only allows the first cooling medium vaporized by heat to flow through, and the second chamber 122 only allows the first cooling medium condensed after heat exchange with the heat dissipation component 200 to flow through. In this way, the first cooling medium vaporized by heat and the first cooling medium condensed after heat exchange can flow through two relatively independent chambers, preventing the first cooling medium condensed after heat exchange from hindering the upward movement of the first cooling medium vaporized by heat from bottom to top and improving the cooling effect of the cooling device.

[0082] It should be noted that the separation between the first chamber 121 and the second chamber 122 can be completed by a partition plate provided in the first heat dissipation member 120, or can be composed of two relatively independent components. As a possible implementation manner of the first heat dissipation member 120, please continue to refer to the attached Figure 4 , the first heat dissipation member 120 includes a heat dissipation tube 124; the inner cavity of the heat dissipation tube 124 forms the first chamber 121, and one end of the heat dissipation tube 124 is communicated with the first accommodation cavity 111. For example, a second communication hole (not shown in the figure) is provided on the heat spreader 110, and one end of the heat dissipation tube 124 is fixedly connected in the first communication hole; a first one-way valve 130 is provided at the other end of the heat dissipation tube 124, and the first one-way valve 130 is used to allow the first cooling medium vaporized by heat to flow from the first chamber 121 to the second chamber 122; it should be noted that the heat dissipation tube 124 can be a cylinder with openings at both ends, or a cylinder with an opening at one end. When the heat dissipation tube 124 is a cylinder with an opening at one end, the opening faces the heat spreader 110, and mounting holes are provided on the surface of the heat dissipation tube 124 away from the opening, and the first one-way valve 130 can be provided in the mounting holes.

[0083] The first heat dissipation member 120 further includes a cylindrical body 125 sleeved on the heat dissipation tube 124, and a buffer cavity 123 is formed between the top of the heat dissipation tube 124 and the top of the cylindrical body 125; a first communication hole (not shown in the figure) is provided in the area of the heat dissipation plate 110 opposite to the second chamber 122, and a second one-way valve 140 is arranged in the first communication hole. The second one-way valve 140 is used to allow the first cooling medium condensed into a liquid state to flow from the second chamber 122 into the first accommodation cavity 111. Among them, the shape of the cylindrical body 125 can have various forms. For example, the shape of the cylindrical body 125 can be cylindrical. Also for example, the shape of the cylindrical body 125 can be a polyhedron. Exemplarily, the shape of the cylindrical body 125 is a tetrahedron, a hexahedron or other polyhedrons.

[0084] It should be noted that the first accommodation cavity 111 of the heat dissipation plate 110, the first chamber 121 and the second chamber 122 of the first heat dissipation member 120 are all vacuum cavities. For example, in a specific preparation process, the first cooling medium can be filled into the first accommodation cavity 111 and the first accommodation cavity 111, the first chamber 121 and the second chamber 122 are evacuated to form a vacuum in the first accommodation cavity 111, the first chamber 121 and the second chamber 122.

[0085] In this embodiment, the first heat dissipation member 120 includes a relatively independent heat dissipation tube 124 and a cylindrical body 125, which is beneficial to the preparation of the first heat dissipation member 120 and reasonably adjusts the sizes of the first chamber 121 and the second chamber 122. It is also beneficial to the installation of the first one-way valve 130, reduces the assembly difficulty of the first heat dissipation member 120, and further reduces the production cost of the first heat dissipation member 120.

[0086] In a possible implementation manner, please refer to the appendix Figure 7 , the first accommodation cavity 111 includes at least two relatively independently arranged sub-cavities 1111. For example, a partition 150 is provided in the first accommodation cavity 111, and the partition 150 divides the first accommodation cavity 111 into at least two relatively independently arranged sub-cavities 1111. The bottom surfaces of the at least two sub-cavities 1111 are all attached to the component to be cooled, and the top surfaces of the at least two sub-cavities 1111 are all communicated with the first chamber 121 and the second chamber 122 of the first heat dissipation member 120.

[0087] In this embodiment, the partition 150 can be a flat plate, the partition 150 can be perpendicular to the bottom surface of the heat dissipation plate 110, or can be inclined with respect to the direction perpendicular to the bottom surface of the heat dissipation plate 110 so that the at least two sub-cavities 1111 are regular shapes. The partition 150 can also be an irregular shape so that the at least two sub-cavities 1111 are irregular shapes.

[0088] Wherein, in a direction perpendicular to the bottom surface of the heat sink 110, one end of the partition 150 is connected to the bottom surface of the heat sink 110, and the other end of the partition 150 is connected to the top surface of the heat sink 110, so that the bottom surface of each formed sub-chamber 1111 is in contact with the component to be cooled, and the top surface is in contact with the surface of the first heat dissipation component 120 facing the heat sink 110. With such an arrangement, the first cooling medium in each sub-chamber 1111 can absorb the heat of the component to be cooled and vaporize. The first cooling medium after being heated and vaporized can move towards the top of the sub-chamber 1111, and move into the second chamber 122 through the first chamber 121 and the first one-way valve 130. The first cooling medium after being heated and vaporized exchanges heat with the second cooling medium and condenses into a liquid state. The liquid first cooling medium flows back to the bottom of the sub-chamber 1111 along the second chamber 122 and the second one-way valve 140 under the action of its own gravity. With such an arrangement, when one of the sub-chambers 1111 fails, the other sub-chamber 1111 can still maintain operation, complete the cooling function of the heat sink 110, and enable the cooling device to normally exert its cooling function.

[0089] It should be noted that when the first heat dissipation component 120 is a single heat dissipation component, each sub-chamber 1111 is communicated with the first chamber 121 and the second chamber 122 of the first heat dissipation component 120. When the first heat dissipation component 120 is composed of multiple monomers, each sub-chamber 1111 is communicated with the first chamber 121 and the second chamber 122 of some of the monomers.

[0090] Exemplarily, please continue to refer to the attached Figure 7 , the number of the first heat dissipation components 120 is multiple, each first heat dissipation component 120 has a first chamber 121 and a second chamber 122 both communicated with the first accommodation chamber 111, and the multiple first heat dissipation components 120 are arranged at intervals on the heat sink 110. Among at least two sub-chambers 1111, any one of the sub-chambers 1111 is communicated with the first chamber 121 and the second chamber 122 of some of the first heat dissipation components 120, so that any one of the sub-chambers 1111 and some of the first heat dissipation components 120 can form a separate heat sink assembly 100.

[0091] It should be noted that the arrangement of the multiple first heat dissipation components 120 can be reasonably arranged depending on the layout mode of at least two sub-chambers 1111, and no specific limitation is made in this embodiment.

[0092] Please continue to refer to the attached Figure 1 、the attached Figure 2 and the attached Figure 5, the heat dissipation component 200 provided in this embodiment includes a heat dissipation housing 210 and a plurality of second heat dissipation members 220. Among them, the heat dissipation housing 210 is disposed on the heat spreader 110 and encloses a second accommodation cavity (not shown in the figure) with the heat spreader 110; the second accommodation cavity accommodates a second cooling medium. It should be noted that the projected area of the heat dissipation housing 210 on the heat spreader 110 is smaller than the area of the heat spreader 110, so that the heat dissipation housing 210 and the heat spreader 110 can directly enclose a sealed second accommodation cavity.

[0093] The plurality of second heat dissipation members 220 are sleeved on the first heat dissipation member 120 at intervals in a direction perpendicular to the heat spreader 110 and are located in the second accommodation cavity; exemplarily, through holes 221 can be formed in each second heat dissipation member 220, and each first heat dissipation member 120 can pass through the corresponding through holes 221 in sequence to realize the connection between the plurality of second heat dissipation members 220 and the first heat dissipation member 120. In this example, the plurality of second heat dissipation members 220 and the first heat dissipation member 120 are always immersed in the second cooling medium, and the second cooling medium is always in a circulating state, so that heat exchange with the first cooling medium can be carried out as soon as possible, thereby improving the cooling effect of the cooling device.

[0094] Among them, a flow channel 230 is formed between any adjacent second heat dissipation members 220, and the flow channel 230 extends in a direction parallel to the heat spreader 110. In this embodiment, the second heat dissipation member 220 is a heat dissipation fin, and the shapes of the heat dissipation fin and the heat spreader 110 are both square. The extending direction of the flow channel 230 can be the length direction of the heat spreader 110 or the width direction of the heat spreader 110. Exemplarily, the positions of the liquid inlet pipe 240 and the liquid outlet pipe 250 can be reasonably set to change the extending direction of the flow channel 230. For example, when the length direction of the heat dissipation fin is the same as the length direction of the heat spreader 110, that is, the X direction in the attachment Figure 1 and the liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at intervals along the length direction of the heat spreader 110, the flow channel 230 formed between adjacent heat dissipation fins extends along the length direction of the heat spreader 110, that is, the flow channel 230 extends along the X direction in the attachment Figure 1 . Another example is that when the length direction of the heat dissipation fin is the same as the width direction of the heat spreader 110, that is, the Y direction in the attachment Figure 1 and the liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at intervals along the width direction of the heat spreader 110, the flow channel 230 formed between adjacent heat dissipation fins extends along the width direction of the heat spreader 110, that is, the flow channel 230 extends along the Y direction in the attachment Figure 1 .

[0095] In this embodiment, a plurality of second heat dissipation members 220 are sleeved and fixedly connected to the first heat dissipation member 120, and a plurality of flow channels 230 are formed, enabling the second cooling medium to contact each second heat dissipation member 220. The heat carried by the first heat dissipation member 120 can also be transferred to the second heat dissipation members 220. With this arrangement, the heat carried by the first heat dissipation member 120 not only exchanges heat with the second cooling medium surrounding it but also with the second cooling medium surrounding the second heat dissipation members 220, greatly increasing the heat dissipation area of the heat dissipation assembly 200 and enhancing the heat dissipation capacity of the heat dissipation assembly 200.

[0096] In addition, since the heat dissipation area of the heat dissipation assembly 200 is greatly increased, the distance between adjacent second heat dissipation members 220 can be increased to reduce the resistance of the flow channels 230 and the second heat dissipation members 220, thereby reducing the power consumption of the circulation pump of the cooling device.

[0097] Please refer to the attached Figure 1 and the attached Figure 5 , an inlet pipe 240 is provided on the top surface of the heat dissipation housing 210 facing away from the heat spreader 110. Exemplarily, the heat dissipation housing 210 includes a top plate 211 and an annular side plate 212 provided on the side of the top plate 211 facing the heat spreader 110. The inlet pipe 240 is provided on the top plate 211 and penetrates through the top plate 211. The inlet pipe 240 is in communication with the second accommodation cavity and is located on the inlet side of the flow channels 230 to facilitate the supply of the flowing second cooling medium into the second accommodation cavity.

[0098] Please refer to the attached Figure 8 , a flow equalizing member 260 is provided between the inlet end of the flow channel 230 and the inlet pipe 240. The flow equalizing member 260 extends in a direction perpendicular to the heat spreader 110, and one end of the flow equalizing member 260 is connected to the top surface of the heat dissipation housing 210, and the other end is connected to the heat spreader 110.

[0099] Among them, the flow equalizing member 260 includes a plurality of flow equalizing portions 261, and the plurality of flow equalizing portions 261 are configured to balance the flow rate of the second cooling medium in the plurality of flow channels 230, so that the flow rate of the second cooling medium in the plurality of flow channels 230 is more uniform and stable, which is beneficial to improving the safety and cooling effect of the cooling device.

[0100] In this example, the flow equalizing member 260 further includes a flow equalizing plate 262, and the plurality of flow equalizing portions 261 are spaced apart on the flow equalizing plate 262, and each flow equalizing portion 261 corresponds to one of the flow channels 230. Among them, as a possible implementation manner of the flow equalizing portion 261, the flow equalizing portion 261 can be an oblong hole extending in the width direction of the heat spreader 110, and the oblong hole corresponds to one of the flow channels. In another example, please refer to the attached Figure 8, a plurality of flow equalizing hole groups are arranged on the flow equalizing plate 262. The plurality of flow equalizing hole groups are arranged at intervals in a direction perpendicular to the heat sink plate 110, and each flow equalizing hole group is arranged opposite to one of the flow channels 230 and constitutes a flow equalizing portion 261. It should be noted that the flow equalizing holes within the dashed line in the appendix Figure 8 represent one flow equalizing hole group.

[0101] Each flow equalizing hole group includes a plurality of flow equalizing holes. The plurality of flow equalizing holes can be arranged at intervals in a direction perpendicular to the extending direction of the flow channel 230, that is, the plurality of flow equalizing holes are arranged at intervals in the Y direction in the appendix Figure 1 and the appendix Figure 5 . Each flow equalizing hole penetrates the flow equalizing plate 262 in the thickness direction of the flow equalizing plate 262, so that the second cooling medium located on the side of the flow equalizing plate 262 facing the liquid inlet pipe 240 moves through the flow equalizing holes to the side of the flow equalizing member 260 facing the second heat dissipation member 220. With such a setting, the second cooling medium can be more effectively distributed, which is beneficial to improving the heat exchange efficiency between the second cooling medium and the first cooling medium that is heated and vaporized.

[0102] In a possible implementation manner, a liquid outlet pipe 250 is arranged on the top surface of the heat dissipation housing 210 facing away from the heat sink plate 110. The liquid outlet pipe 250 is communicated with the second accommodating cavity; that is to say, a liquid outlet pipe 250 is arranged on the top surface of the top plate 211 of the heat dissipation housing 210, and the liquid outlet pipe 250 penetrates the top plate 211 in the thickness direction of the top plate 211.

[0103] The top surface of the heat sink plate 110 of the heat dissipation housing 210 is square. In other words, the shape of the top plate 211 of the heat dissipation housing 210 is square. The liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at the diagonals of the top surface of the heat dissipation housing 210 facing away from the heat sink plate 110. The top plate 211 includes an intersecting first diagonal line and a second diagonal line. Taking the orientation shown in the appendix Figure 1 as an example, the angle between the first diagonal line and the X direction is an acute angle. The liquid inlet pipe 240 and the liquid outlet pipe 250 can be arranged on the first diagonal line or the second diagonal line. With such a setting, the flow path of the second cooling medium in the second accommodating cavity can be extended, and the heat dissipation effect of the cooling device can be improved.

[0104] It should be noted that the other ends of the liquid inlet pipe 240 and the liquid outlet pipe 250 can also be respectively connected to a storage tank for storing the first cooling medium to ensure the normal use of the cooling device.

[0105] At least two grooves 2111 are spaced apart on the top plate 211. The bottoms of the at least two grooves 2111 are located within the top plate 211, and the two grooves 2111 have side openings, and the side openings penetrate through one side surface of the top plate 211 along the width direction of the top plate 211. In this way, the grooves 2111 can facilitate the operator's gripping and are beneficial to the installation or disassembly of the heat dissipation housing 210 and the heat spreader 110.

[0106] It should be noted that the cooling device disclosed in the embodiments of the present application needs to be installed on the component to be cooled. For example, it needs to be installed on a circuit board. Therefore, the cooling device disclosed in the embodiments of the present application further includes a mounting plate 300 and a locking member 400.

[0107] Exemplarily, please refer to Att Figure 1 、Att Figure 5 and Att Figure 9 , the mounting plate 300 is an annular member, and a first mounting hole (not shown in the figure) is provided on the mounting plate 300; a second mounting hole 112 is provided on the heat spreader 110; the second mounting hole 112 is disposed opposite to the first mounting hole. The mounting plate 300 is disposed on the heat spreader 110 and sleeved on the outer peripheral surface of the heat dissipation assembly 200; that is to say, the mounting plate 300 is sleeved on the outer peripheral surface of the heat dissipation housing 210.

[0108] One end of the locking member 400 sequentially passes through the first mounting hole and the second mounting hole 112 and is fixedly connected to the component to be cooled. For example, one end of the locking member 400 sequentially passes through the first mounting hole and the second mounting hole 112 and is fixedly connected to the circuit board.

[0109] Please refer to Att Figure 10 and Att Figure 11 , wherein the locking member 400 includes a locking rod 410 and an adapter 420. The adapter 420 is sleeved on the locking rod 410. Among them, the adapter 420 is located below the mounting plate 300 and within the second mounting hole 112 for adapting to the second mounting hole 112.

[0110] Please refer to Att Figure 11 , the adapter 420 includes an annular body 421 and a plurality of elastic claws 422; the plurality of elastic claws 422 are connected to the inner surface of the annular body 421, and the plurality of elastic claws 422 are spaced apart along the circumferential direction of the annular body 421. Among them, the end of each elastic claw 422 facing away from the annular body 421 extends towards the center of the annular body 421, so that the diameter of the area surrounded by the plurality of elastic claws 422 gradually decreases in the direction away from the annular body 421. With such a setting, the adapter 420 can adapt to locking rods 410 of different sizes and improve the connection strength between the heat spreader 110 and the locking member 400.

[0111] The locking member 400 further includes an elastic member 430; the elastic member 430 may include a spring. Among them, the locking rod 410 includes a first boss 411 and a second boss 412 arranged at intervals, and the second boss 412 and the adapter 420 are respectively located on both sides of the annular mounting plate 300. Taking the Figure 1 orientation shown as an example, the second boss 412 is located above the mounting plate 300, and the adapter 420 is located below the annular mounting plate 300.

[0112] The elastic member 430 is sleeved on the locking rod 410 and is located between the first boss 411 and the second boss 412, which can buffer the installation force, reduce the damage to the circuit board, and improve the service life of the circuit board.

[0113] The embodiment of the present application also provides a server. Please refer to the attached Figure 12 , this server includes a circuit board 500, a chip 600, and the cooling device described in any one of the above embodiments.

[0114] Among them, the chip 600 is arranged on the circuit board 500; the cooling device is arranged on the circuit board 500, and the heat dissipation plate 110 of the cooling device at least adheres to the chip.

[0115] Since the server provided by the embodiment of the present application includes the cooling device described in any one of the above embodiments, the effects of the cooling device described in any one of the above embodiments are also possessed by the server of the embodiment of the present application, and will not be elaborated here.

[0116] It should be noted that other components on the circuit board 500 can also be dissipated heat through the cooling device. For example, other components can be in contact with the bottom surface of the heat dissipation plate 110 through a heat-conducting material to conduct the heat generated by other components to the heat dissipation plate 110.

[0117] In the description of the embodiment of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection or an indirect connection through an intermediate medium. It can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiment of the present application can be understood according to specific situations.

[0118] In the embodiment of the present application or the device or component implied must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the embodiment of the present application. In the description of the embodiment of the present application, the meaning of "a plurality" is two or more, unless otherwise precisely and specifically defined.

[0119] In the description, claims, and above-mentioned accompanying drawings of the embodiments of the present application, terms such as "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the embodiments of the present application described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "may include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application and are not intended to limit them. Although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling device, characterized in that, it includes: A soaking component, the soaking component includes a soaking plate and a first heat dissipation piece arranged on the soaking plate, the soaking plate includes a first accommodation cavity for accommodating a first cooling medium; the first heat dissipation piece extends in a direction perpendicular to the soaking plate, and includes a first cavity and a second cavity both communicating with the first accommodation cavity; the second cavity surrounds the outer peripheral surface of the first cavity; the first cavity communicates with the second cavity through a first one-way valve, and the bottom of the second cavity communicates with the first accommodation cavity through a second one-way valve; A heat dissipation component, the heat dissipation component is sleeved on the first heat dissipation piece and is configured to exchange heat with the first cooling medium; wherein, the first cooling medium vaporized by heat enters the second cavity through the first one-way valve, and condenses into a liquid state after exchanging heat with the heat dissipation component; the liquid first cooling medium flows back to the bottom of the first accommodation cavity through the second one-way valve.

2. The cooling device according to claim 1, characterized in that, the second cavity surrounds the entire outer peripheral surface of the first cavity, and a buffer cavity is formed between the top of the second cavity and the top of the first cavity.

3. The cooling device according to claim 1, characterized in that, the second cavity surrounds a part of the outer peripheral surface of the first cavity.

4. The cooling device according to claim 2, characterized in that, the first heat dissipation piece includes a heat dissipation pipe and a cylindrical body; the inner cavity of the heat dissipation pipe constitutes the first cavity, one end of the heat dissipation pipe communicates with the first accommodation cavity, and the other end of the heat dissipation pipe is provided with the first one-way valve; the cylindrical body is sleeved on the heat dissipation pipe, and a buffer cavity is formed between the top of the heat dissipation pipe and the top of the cylindrical body; a first communication hole is provided in the area of the soaking plate opposite to the second cavity, and the second one-way valve is arranged in the first communication hole.

5. The cooling device according to any one of claims 1-4, characterized in that, the first accommodation cavity includes at least two relatively independently arranged sub-cavities, the bottom surfaces of at least two sub-cavities are all attached to the piece to be cooled, and the top surfaces of at least two sub-cavities are all communicated with the first cavity and the second cavity of the first heat dissipation piece.

6. The cooling device according to claim 5, characterized in that, the number of the first heat dissipation pieces is multiple, and the multiple first heat dissipation pieces are arranged at intervals on the soaking plate; among at least two sub-cavities, any one sub-cavity communicates with the first cavity and the second cavity of part of the first heat dissipation pieces.

7. The cooling device according to any one of claims 1-4, characterized in that, the heat dissipation component includes a heat dissipation housing and a plurality of second heat dissipation pieces; the heat dissipation housing is arranged on the soaking plate and encloses a second accommodation cavity with the soaking plate; a second cooling medium is accommodated in the second accommodation cavity; A plurality of the second heat dissipation members are sleeved on the first heat dissipation member at intervals in a direction perpendicular to the heat pipe, and are located in the second accommodation cavity; wherein, a flow passage is formed between any two adjacent second heat dissipation members, and the flow passage extends in a direction parallel to the heat pipe.

8. The cooling device according to claim 7, wherein, a liquid inlet pipe is arranged on the top surface of the heat dissipation housing facing away from the heat pipe, the liquid inlet pipe is communicated with the second accommodation cavity, and is located on one side of the inlet end of the flow passage; a flow equalizing member is arranged between the inlet end of the flow passage and the liquid inlet pipe, the flow equalizing member extends in a direction perpendicular to the heat pipe, and one end of the flow equalizing member is connected to the top surface of the heat dissipation housing, and the other end is connected to the heat pipe; the flow equalizing member includes a plurality of flow equalizing portions, and the plurality of flow equalizing portions are configured to balance the flow rates of the second cooling medium in the plurality of flow passages.

9. The cooling device according to claim 8, wherein, the flow equalizing member includes a flow equalizing plate and a plurality of flow equalizing hole groups arranged on the flow equalizing plate; the plurality of flow equalizing hole groups are arranged at intervals in a direction perpendicular to the heat pipe, and each flow equalizing hole group is arranged opposite to one of the flow passages and constitutes one of the flow equalizing portions; each flow equalizing hole group includes a plurality of flow equalizing holes, and each flow equalizing hole penetrates through the flow equalizing plate in the thickness direction of the flow equalizing plate.

10. The cooling device according to claim 8 or 9, wherein, a liquid outlet pipe is arranged on the top surface of the heat dissipation housing facing away from the heat pipe, the liquid outlet pipe is communicated with the second accommodation cavity; the top surface of the heat dissipation housing facing away from the heat pipe is square, and the liquid inlet pipe and the liquid outlet pipe are arranged at the diagonals of the top surface of the heat dissipation housing facing away from the heat pipe.

11. The cooling device according to any one of claims 1-4, wherein, the cooling device further includes an annular mounting plate and a locking member, and the mounting plate is provided with a first mounting hole; a second mounting hole is arranged on the heat pipe, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat pipe and sleeved on the outer peripheral surface of the heat dissipation assembly; the locking member passes through the first mounting hole and the second mounting hole in sequence and is fixedly connected to the component to be cooled.

12. The cooling device according to claim 11, wherein, the locking member includes a locking rod and an adapter sleeved on the locking rod; the adapter includes an annular main body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular main body, and the plurality of elastic claws are arranged at intervals in the circumferential direction of the annular main body.

13. The cooling device according to claim 12, wherein, the locking member further includes an elastic member; the locking rod includes a first boss and a second boss arranged at intervals, and the second boss and the adapter are respectively located on both sides of the annular mounting plate; the elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

14. A server, wherein, Comprising a circuit board, a chip, and the cooling device according to any one of claims 1-13; the chip is disposed on the circuit board; The cooling device is disposed on the circuit board, and the heat spreader of the cooling device is attached to the chip.

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