Backlight module

Abstract

A backlight module comprises a film, a light guide plate and a circuit board. The thin film comprises a single-bond light-transmitting area, a light-shielding area and a side light-transmitting area. The shading area is arranged on the periphery of the single-key light-transmitting area. The side edge light-transmitting area is arranged adjacent to or along the side edge of the thin film. The light guide plate is arranged below the film. The light guide plate is provided with a first microstructure group, a second microstructure group, a light conduction area and a through hole. The first microstructure group and the through hole are correspondingly arranged below the single-key light-transmitting area. The second microstructure group is correspondingly arranged below the side edge light-transmitting area. Part of the light conduction area is correspondingly arranged below the shading area. The circuit board is arranged below the light guide plate. And a light-emitting unit is arranged on the circuit board. The light-emitting unit is accommodated in the through hole. The number or the light-emitting area of the microstructures of the second microstructure group is larger than the number or the light-emitting area of the microstructures of the first microstructure group. Therefore, the backlight module can increase the variability of the light-emitting effect under the condition that no additional light-emitting unit or backlight module is added.

Description

Technical Field

[0001] The present disclosure relates to a backlight module, and more particularly to a backlight module for a backlit keyboard. Background Art

[0002] With the development of the e-sports industry, computer peripheral manufacturers have installed backlight modules in keyboards to create backlit keyboards. However, most of the existing backlight modules are only configured to make the keys emit light, which can no longer meet the visual needs of players. Summary of the Invention

[0003] In view of this, an object of the present disclosure is to provide a backlight module that can solve the above problems.

[0004] To achieve the above object, an embodiment of the present disclosure provides a backlight module including a film, a light guide plate, and a circuit board. The film includes single-key light-transmitting areas, light-shielding areas, and side light-transmitting areas. The light-shielding areas are disposed on the peripheries of the single-key light-transmitting areas. The side light-transmitting areas are disposed adjacent to or along the sides of the film. The light guide plate is disposed under the film. The light guide plate has a first microstructure group, a second microstructure group, a light conduction area, and through holes. The first microstructure group and the through holes are correspondingly disposed under the single-key light-transmitting areas. The second microstructure group is correspondingly disposed under the side light-transmitting areas. Part of the light conduction area is correspondingly disposed under the light-shielding areas. The circuit board is disposed under the light guide plate. Light-emitting units are provided on the circuit board. The light-emitting units are received in the through holes. Light emitted by some of the light-emitting units is guided upward by the first microstructure group and passes through the single-key light-transmitting areas. Light emitted by some of the light-emitting units is transmitted through the light conduction area and then guided upward by the second microstructure group and passes through the side light-transmitting areas. The number of microstructures or the light-emitting area of the second microstructure group is greater than that of the first microstructure group.

[0005] In one or more embodiments of the present disclosure, the film further includes a reflection portion. The reflection portion is disposed around the periphery of the light-shielding area. The reflection portion is configured to reflect the light emitted by the light-emitting units back to the light guide plate.

[0006] In one or more embodiments of the present disclosure, the film further includes a light-shielding member or a reflection member. The light-shielding member or the reflection member is disposed above the light-emitting units. The light-shielding member is configured to shield the light directly emitted upward by the light-emitting units. The reflection member is configured to reflect the light directly emitted upward by the light-emitting units back to the light guide plate.

[0007] In one or more embodiments of the present disclosure, a reflection layer is disposed on a surface of the circuit board facing the light guide plate. The reflection layer is configured to reflect the light emitted by the light-emitting units back to the light guide plate.

[0008] In one or more embodiments of the present disclosure, a light-blocking unit is disposed on the surface of the reflective layer facing the light guide plate. The light-blocking unit is disposed corresponding to a part of the light-shielding area. The side of the light-blocking unit adjacent to the side light-transmitting area has an opening. The light-blocking unit is configured to block the light reflected back to the light guide plate by some of the light-emitting units. The light emitted by some of the light-emitting units is reflected back to the light guide plate by a part of the reflective layer under the opening of the light-blocking unit.

[0009] In one or more embodiments of the present disclosure, the first microstructure group has a first area and a second area. The first area is located between the second microstructure group and the second area. The number of microstructures or the light-emitting area of the first area is less than the number of microstructures or the light-emitting area of the second area.

[0010] The embodiments of the present disclosure also provide a backlight module including a film, a light guide plate, and a circuit board. The film includes a first single-bond light-transmitting area, a second single-bond light-transmitting area, a light-shielding area, and a side light-transmitting area. The light-shielding area is disposed on the periphery of the first single-bond light-transmitting area and the second single-bond light-transmitting area. The side light-transmitting area is disposed adjacent to or along the side of the film. The light guide plate is disposed under the film. The light guide plate has a first microstructure group, a second microstructure group, a third microstructure group, a light conduction area, a first through hole, and a second through hole. The first microstructure group and the first through hole are correspondingly disposed under the first single-bond light-transmitting area. The second microstructure group is correspondingly disposed under the side light-transmitting area. The third microstructure group and the second through hole are correspondingly disposed under the second single-bond light-transmitting area. A part of the light conduction area is correspondingly disposed under the light-shielding area. The first microstructure group has a first area and a second area. The first area is located between the second microstructure group and the second area. The number of microstructures or the light-emitting area of the second microstructure group is greater than the number of microstructures or the light-emitting area of the first area. The circuit board is disposed under the light guide plate. A first light-emitting unit and a second light-emitting unit are provided on the circuit board. The first light-emitting unit and the second light-emitting unit are respectively received in the first through hole and the second through hole. The light emitted by some of the first light-emitting units is guided upward by the first microstructure group and passes through the first single-bond light-transmitting area. The light emitted by some of the first light-emitting units and the second light-emitting units is transmitted through the light conduction area and then guided upward by the second microstructure group and passes through the side light-transmitting area.

[0011] In one or more embodiments of the present disclosure, the number of microstructures or the light-emitting area of the first area is less than the number of microstructures or the light-emitting area of the second area.

[0012] In one or more embodiments of the present disclosure, the film further includes a light-shielding member or a reflective member. The light-shielding member or the reflective member is disposed above the first light-emitting unit. The light-shielding member is configured to shield the light directly emitted upward by the first light-emitting unit. The reflective member is configured to reflect the light directly emitted upward by the first light-emitting unit back to the light guide plate.

[0013] In one or more embodiments of the present disclosure, the first area and the second area are separated by a virtual extension line passing through the center of the first light-emitting unit.

[0014] In summary, in the backlight module of the present disclosure, the film includes a single-key light-transmitting area and a side light-transmitting area, and the first microstructure group and the second microstructure group of the light guide plate are respectively disposed below the single-key light-transmitting area and the side light-transmitting area. Thereby, part of the light emitted by the light-emitting unit disposed below the single-key light-transmitting area can be guided upward by the first microstructure group and pass through the single-key light-transmitting area, and part of the light can be guided upward by the second microstructure group and pass through the side light-transmitting area. It can be seen from this that in addition to using the light-emitting unit to generate a light-emitting effect in the single-key light-transmitting area, the backlight module of the present disclosure can also use the same light-emitting unit to additionally provide a light-emitting effect in the side light-transmitting area, thereby increasing the variability of the light-emitting effect without adding additional light-emitting units or backlight modules.

[0015] The above is only used to elaborate on the problems to be solved by the present disclosure, the technical means for solving the problems, and the effects generated thereby. The specific details of the present disclosure will be introduced in detail in the following embodiments and related drawings. Description of the Drawings

[0016] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows:

[0017] Figure 1 Schematic diagram of a light-emitting keyboard according to an embodiment of the present disclosure;

[0018] Figure 2 For showing Figure 1 The exploded view of the backlight module in

[0019] Figure 3 For showing Figure 1 The cross-sectional view of the light-emitting keyboard along the cut line A-A in

[0020] Figure 4 For showing Figure 2 The partial schematic diagram of the film in

[0021] Figure 5 For showing Figure 2 The partial schematic diagram of the light guide plate in

[0022] Figure 6 For showing Figure 2 The partial schematic diagram of the circuit board in

[0023] Figure 7 For showing Figure 5 The partial enlarged view of the light guide plate in Detailed Embodiments

[0024] The following will disclose multiple embodiments of the present disclosure with the accompanying drawings. For the sake of clear illustration, many practical details will be described together in the following narrative. However, it should be understood that these practical details are not used to limit the present disclosure. That is to say, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the purpose of simplifying the accompanying drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.

[0025] Please refer to Figure 1 , which is a schematic diagram showing a backlit keyboard 100 according to an embodiment of the present disclosure. The backlit keyboard 100 includes a housing 110, a keyboard module 120, and a backlight module 200. The keyboard module 120 is disposed on the housing 110 and includes a plurality of key units 121. The key units 121 are configured for a user to press. The backlight module 200 is disposed within the housing 110 and is located below the keyboard module 120. The backlight module 200 is configured to emit light toward the keyboard module 120, thereby enabling the backlit keyboard 100 to present a backlit effect. In addition, the backlit keyboard 100 of the present embodiment may be a keyboard of a notebook computer, an external keyboard of a desktop computer (for example, a keyboard with a PS2 interface or a USB interface), or other input devices including keys, but is not limited thereto.

[0026] Please refer to Figure 2 and Figure 3 . Figure 2 is a perspective view showing Figure 1 the backlight module 200 in Figure 3 Please refer to Figure 1 and

[0027] Please refer to Figure 4 , which is a sectional view showing the backlit keyboard 100 along the cutting line A-A in Figure 2 . In the present embodiment, the backlight module 200 includes a film 210, a light guide plate 220, and a circuit board 230. The light guide plate 220 is disposed between the film 210 and the circuit board 230. Specifically, the film 210 is connected to the lower surface of the keyboard module 120 via a connecting member 240. The light guide plate 220 is connected to the lower surface of the film 210 via the connecting member 240. The circuit board 230 is connected to the lower surface of the light guide plate 220 via the connecting member 240. In some embodiments, the connecting member 240 is an adhesive, but is not limited thereto.

[0027] Please refer to Figure 4 , which is a partial schematic view showing the film 210 in Figure 2 . As shown in Figure 3 and Figure 4As shown, in the present embodiment, the thin film 210 includes a plurality of single - key light - transmitting regions 211a, 211b, a light - shielding region 212, and a side - edge light - transmitting region 213. The single - key light - transmitting regions 211a respectively correspond to the outermost key units 121, and the single - key light - transmitting regions 211b respectively correspond to the other key units 121 except for the outermost key units 121. The light - shielding region 212 is disposed on the periphery of the single - key light - transmitting regions 211a, 211b.

[0028] As Figure 3 and Figure 4 shown, a light - shielding portion 215a is provided on the surface of the thin film 210. The light - shielding portion 215a is configured to shield the light directly emitted upward by the light - emitting unit 231a. The light - shielding region 212 is the region where the thin film 210 is provided with the light - shielding portion 215a. The side - edge light - transmitting region 213 is adjacent to or disposed along the side edge of the thin film 210. Specifically, the single - key light - transmitting regions 211a, 211b are located within the periphery of the light - shielding region 212. The side - edge light - transmitting region 213 is located outside the periphery of the light - shielding region 212.

[0029] In some embodiments, as Figure 3 and Figure 4 shown, the side - edge light - transmitting region 213 is formed in a ring shape along the four side edges of the thin film 210, but is not limited thereto. In practical applications, the side - edge light - transmitting region 213 can be disposed only along at least one of the upper side edge, lower side edge, left side edge, and right side edge of the thin film 210.

[0030] Please refer to Figure 5 , which is a partial schematic diagram of the light - guide plate 220 shown in Figure 2 . As Figure 3 and Figure 5 shown, in the present embodiment, the light - guide plate 220 is disposed below the thin film 210. The light - guide plate 220 has a first micro - structure group 221a, a second micro - structure group 221b, a third micro - structure group 221c, a light - conduction region 222, and a plurality of through - holes 223a, 223b. The first micro - structure group 221a and the through - hole 223a are correspondingly disposed below the single - key light - transmitting region 211a. The second micro - structure group 221b is correspondingly disposed below the side - edge light - transmitting region 213. The third micro - structure group 221c and the through - hole 223b are correspondingly disposed below the single - key light - transmitting region 211b. The first micro - structure group 221a, the second micro - structure group 221b, and the third micro - structure group 221c include a plurality of micro - structures. The plurality of micro - structures may include dot - shaped micro - structures, linear micro - structures (such as Figure 7as shown), or microstructures of other shapes, or combinations thereof. Part of the light conduction region 222 is correspondingly disposed below the light shielding region 212. Specifically, the light conduction region 222 includes the region between the first microstructure group 221a, the second microstructure group 221b, and the third microstructure group 221c, and the regions between the plurality of microstructures in the first microstructure group 221a, the second microstructure group 221b, and the third microstructure group 221c. The light shielding portion 215a in the light shielding region 212 is configured to block part of the light transmitted upward by the light conduction region 222 from passing through.

[0031] In the present embodiment, the second microstructure group 221b is a continuous linear microstructure extending along the side of the thin film 210. In some embodiments, the second microstructure group 221b may include a plurality of microstructure units arranged at the same or different spacing distances, and the plurality of microstructure units may be square, rectangular, circular, or of other shapes.

[0032] Please refer to Figure 6 , which is a partial schematic diagram of the circuit board 230 shown in Figure 2 . As shown in Figure 3 and Figure 6 , in the present embodiment, a plurality of light emitting units 231a, 231b are provided on the circuit board 230. The light emitting units 231a, 231b are respectively received in the through holes 223a, 223b. Part of the light emitted by the light emitting unit 231a is guided upward by the first microstructure group 221a and passes through the single key light transmissive region 211a. Part of the light emitted by the light emitting unit 231a is transmitted through the light conduction region 222 and then guided upward by the second microstructure group 221b and passes through the side light transmissive region 213. Part of the light emitted by the light emitting unit 231b is guided upward by the third microstructure group 221c and passes through the single key light transmissive region 211b. Part of the light emitted by the light emitting unit 231b is transmitted through the light conduction region 222 and then guided upward by the second microstructure group 221b and passes through the side light transmissive region 213.

[0033] With the foregoing structural configuration, the light emitted by the light emitting unit 231a can not only be guided upward by the first microstructure group 221a and pass through the single key light transmissive region 211a, but also be guided upward by the second microstructure group 221b and pass through the side light transmissive region 213. At the same time, the light emitted by the light emitting unit 231b can not only be guided upward by the third microstructure group 221c and pass through the single key light transmissive region 211b, but also be guided upward by the second microstructure group 221b and pass through the side light transmissive region 213. It can be seen that in addition to being able to utilize the light emitting units 231a, 231b to generate a light emitting effect in the single key light transmissive regions 211a, 211b, the backlight module 200 of the present embodiment can also utilize the same light emitting units 231a, 231b to additionally provide a light emitting effect in the side light transmissive region 213, thereby increasing the variability of the light emitting effect without adding additional light emitting units or backlight modules.

[0034] As Figure 3 shown in Figure 5 FIG. [0000110], in the present embodiment, since the second microstructure group 221b below the side light-transmitting area 213 is farther away from the light-emitting unit 231a than the first microstructure group 221a below the single-key light-transmitting area 211a, the light-emitting area of the second microstructure group 221b is larger than that of the first microstructure group 221a, effectively making the light-emitting brightness of the side light-transmitting area 213 substantially the same as or similar to that of the single-key light-transmitting area 211a.

[0035] In some embodiments, the light-emitting area of the first microstructure group 221a can be defined as the sum of the areas occupied by all the microstructures of the first microstructure group 221a; the light-emitting area of the second microstructure group 221b can be defined as the sum of the areas occupied by all the microstructures of the second microstructure group 221b.

[0036] In other embodiments, when the microstructure sizes of the first microstructure group 221a and the second microstructure group 221b are substantially the same, the number of microstructures of the second microstructure group 221b can be made larger than that of the first microstructure group 221a to effectively make the light-emitting brightness of the side light-transmitting area 213 substantially the same as or similar to that of the single-key light-transmitting area 211a.

[0037] As Figure 1 shown in Figure 2 FIG. [0000118], in the present embodiment, the housing 110 is embedded with a semi-transparent black portion 111. The semi-transparent black portion 111 is disposed above the side light-transmitting area 213. When the light-emitting unit 231a is not emitting light, since no light will exit through the side light-transmitting area 213, the user will only see the dark semi-transparent black portion 111 and cannot see the components disposed inside the housing 110 through the semi-transparent black portion 111. On the contrary, when the light-emitting unit 231a emits light, the light will exit through the side light-transmitting area 213 and be emitted through the semi-transparent black portion 111 for the user to see. The projection of the semi-transparent black portion 111 on the film 210 falls within the side light-transmitting area 213, and the area of the semi-transparent black portion 111 is less than or equal to the area of the side light-transmitting area 213.

[0038] As Figure 3 shown in Figure 4 FIG. [0000122], in the present embodiment, a reflective portion 214a is further provided on the surface of the film 210. The reflective portion 214a is disposed around the periphery of the light-shielding area 212. That is, the reflective portion 214a is disposed around the periphery of the light-shielding portion 215a. The reflective portion 214a is configured to reflect the light emitted from the light-emitting unit 231a and the light transmitted upward from the light-conducting area 222 back to the light guide plate 220, thereby effectively reducing light loss and increasing the light-emitting efficiency of the backlight module 200 at the side light-transmitting area 213.

[0039] As Figure 3 shown, in the present embodiment, the thin film 210 further includes a light-shielding member 215b. The light-shielding member 215b is disposed above the light-emitting unit 231a. The light-shielding member 215b is configured to shield the light directly emitted upward by the light-emitting unit 231a. Thereby, the problem that the light emitted upward by the light-emitting unit 231a directly irradiates the button unit 121, resulting in uneven brightness and darkness of the characters, can be effectively avoided.

[0040] In some embodiments, the light-shielding portion 215a and the light-shielding member 215b may be a black ink layer or a coating made of other light-shielding materials, and may be formed on the bottom surface of the thin film 210, that is, the surface of the thin film 210 facing the light guide plate 220, by using, for example, a printing process, but is not limited thereto. The light-shielding portion 215a and the light-shielding member 215b may also be disposed on the top surface of the thin film 210, that is, the surface of the thin film 210 away from the light guide plate 220.

[0041] In other embodiments, the thin film 210 further includes a reflecting member 214b. The reflecting member 214b may replace the light-shielding member 215b or cover the light-shielding member 215b. The reflecting member 214b is configured to reflect the light directly emitted upward by the light-emitting unit 231a back to the light guide plate 220, and thus the amount of light entering the light guide plate 220 can be increased.

[0042] In some embodiments, the reflecting portion 214a and the reflecting member 214b may be a white ink layer or a coating made of other reflective materials, and may be formed on the bottom surface of the thin film 210 by using, for example, a printing process, but is not limited thereto. The reflecting portion 214a and the reflecting member 214b may also be disposed on the top surface of the thin film 210.

[0043] As Figure 3 shown in Figure 6 the present embodiment, a reflective layer 232 is disposed on the surface of the circuit board 230 facing the light guide plate 220. The reflective layer 232 is configured to reflect part of the light emitted by the light-emitting unit 231a and the light transmitted downward from the light conduction region 222 back to the light guide plate 220, thereby effectively reducing light loss and increasing the light output efficiency of the backlight module 200 at each light-transmitting region.

[0044] As Figure 3 shown in Figure 6 the present embodiment, a light-blocking unit 233 is disposed on the surface of the circuit board 230 where the reflective layer 232 faces the light guide plate 220. The light-blocking unit 233 is disposed corresponding to a part of the light-shielding region 212. Specifically, the projection of the light-blocking unit 233 on the thin film 210 surrounds the single-button light-transmitting region 211a and is located within the light-shielding region 212. The light-blocking unit 233 has an opening 233a adjacent to the side of the side light-transmitting region 213. For example, the light-blocking unit 233 corresponding to the light-emitting unit 231a close to one side of the circuit board 230 is U-shaped (as Figure 6As shown by the dashed line in [description], the light-blocking unit 233 corresponding to the light-emitting unit 231a adjacent to both adjacent sides of the circuit board 230 simultaneously is L-shaped. The light-blocking unit 233 is configured to block the light emitted by some of the light-emitting units 231a and the light reflected from the light-conducting area 222 downward and reflect it back to the light guide plate 220. That is, when the light reaches the light-blocking unit 233, it is blocked and thus will not continue to propagate to the adjacent single-key light-transmitting area 211a and / or single-key light-transmitting area 211b. The light emitted by some of the light-emitting units 231a is reflected back to the light guide plate 220 by the partial reflection layer 232 under the opening 233a of the light-blocking unit 233. Thereby, the light emitted by the light-emitting units 231a and 231b located below different single-key light-transmitting areas 211a and 211b respectively will be blocked by the light-blocking unit 233 and will not interfere with each other, and the opening 233a of the light-blocking unit 233 allows the light emitted by the light-emitting unit 231a to reach the side light-transmitting area 213 unobstructed.

[0045] Please refer to Figure 7 , which shows Figure 5 a partial enlarged view of the light guide plate 220 in [description]. As Figure 5 and Figure 7 shown, in this embodiment, the first micro-structure group 221a has a first area 221a1 and a second area 221a2. The first area 221a1 is located between the second micro-structure group 221b and the second area 221a2. The light-emitting area of the first area 221a1 is smaller than that of the second area 221a2, that is, the amount of light emitted by the light-emitting unit 231a in the first area 221a1 is less than that in the second area 221a2. By reducing the amount of light emitted from the first area 221a1, more of the light emitted by the light-emitting unit 231a can be transmitted to the side light-transmitting area 213. Specifically, most of the light emitted by the light-emitting unit 231a and reaching the second area 221a2 will be guided upward for light emission and will not continue to be transmitted to the adjacent third micro-structure group 221c. Furthermore, a part of the light emitted by the light-emitting unit 231a and reaching the first area 221a1 is guided upward for light emission, and the other part continues to be transmitted to the second micro-structure group 221b for light emission.

[0046] Furthermore, as Figure 5 and Figure 7As shown, the first microstructure group 221a may include an outer frame microstructure 221a3. The outer frame microstructure 221a3 is located at the outer edge of the first microstructure group 221a. Thereby, most of the light emitted by the light-emitting unit 231a and reaching the outer frame microstructure 221a3 will be guided upward and emitted out of the light, and will not continue to be transmitted to the adjacent single-key light-transmitting area 211a and / or single-key light-transmitting area 211b, thereby preventing light interference between the adjacent single-key light-transmitting area 211a and / or single-key light-transmitting area 211b. In some embodiments, the third microstructure group 221c may also include a plurality of outer frame microstructures 221c1. Thereby, most of the light emitted by the light-emitting unit 231b and reaching the outer frame microstructure 221c1 will be guided upward and emitted out of the light, and will not continue to be transmitted to the adjacent single-key light-transmitting area 211a and / or single-key light-transmitting area 211b, thereby preventing light interference between the adjacent single-key light-transmitting area 211a and / or single-key light-transmitting area 211b.

[0047] In some embodiments, the light-emitting area of the first area 221a1 may be defined as the sum of the areas occupied by all the microstructures in the first area 221a1; the light-emitting area of the second area 221a2 may be defined as the sum of the areas occupied by all the microstructures in the second area 221a2.

[0048] In other embodiments, when the microstructure sizes of the first area 221a1 and the second area 221a2 are substantially the same, the number of microstructures in the first area 221a1 may be made less than the number of microstructures in the second area 221a2 to reduce the light-emitting amount of the first area 221a1, so that more of the light emitted by the light-emitting unit 231a can be transmitted to the side light-transmitting area 213.

[0049] Furthermore, as Figure 7 shown, in the present embodiment, the light-emitting area of the second microstructure group 221b is larger than the light-emitting area of the first area 221a1 to effectively make the light-emitting brightness of the side light-transmitting area 213 substantially the same as or similar to the light-emitting brightness of the first area 221a1.

[0050] In other embodiments, when the microstructure sizes of the second microstructure group 221b and the first area 221a1 are substantially the same, the number of microstructures in the second microstructure group 221b may be made greater than the number of microstructures in the first area 221a1 to effectively make the light-emitting brightness of the side light-transmitting area 213 substantially the same as or similar to the light-emitting brightness of the first area 221a1.

[0051] It should be noted that although the light-emitting amount of the second area 221a2 is larger than the light-emitting amount generated by the first area 221a1, since both the first area 221a1 and the second area 221a2 are adjacent to the light-emitting unit 231a, there is no obvious difference in the visual perception of the user.

[0052] As Figure 7 shown, in the present embodiment, the first region 221a1 and the second region 221a2 are separated by a virtual extension line VL passing through the center of the first light-emitting unit 231a. Figure 7 The virtual extension line VL shown is a straight line, but is not limited thereto.

[0053] As Figure 7 shown, in the present embodiment, the second region 221a2, the first region 221a1, and the second microstructure group 221b are arranged in sequence in the lateral direction DL, and the virtual extension line VL extends in the longitudinal direction DV perpendicular to the lateral direction DL, but is not limited thereto. In other embodiments, the second region 221a2, the first region 221a1, and the second microstructure group 221b are arranged in sequence in the longitudinal direction DV, and the virtual extension line VL extends in the lateral direction DL.

[0054] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the backlight module of the present disclosure, the film includes a single-key light-transmitting area and a side light-transmitting area, and the first microstructure group and the second microstructure group of the light guide plate are respectively disposed below the single-key light-transmitting area and the side light-transmitting area. Thereby, part of the light emitted by the light-emitting unit disposed below the single-key light-transmitting area can be guided upward by the first microstructure group and pass through the single-key light-transmitting area, and part of the light can be guided upward by the second microstructure group and pass through the side light-transmitting area. It can be seen therefrom that the backlight module of the present disclosure can not only utilize the light-emitting unit to generate a light-emitting effect in the single-key light-transmitting area, but also utilize the same light-emitting unit to additionally provide a light-emitting effect in the side light-transmitting area, thereby increasing the variability of the light-emitting effect without adding additional light-emitting units or backlight modules.

[0055] Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to that defined by the appended claims.

Claims

1. A backlight module, characterized in that, it comprises: a film, comprising a single-key light-transmitting area, a light-shielding area and a side light-transmitting area, the light-shielding area is arranged on the periphery of the single-key light-transmitting area, and the side light-transmitting area is arranged adjacent to or along the side of the film; a light guide plate, arranged under the film, the light guide plate has a first microstructure group, a second microstructure group, a light conduction area and a through hole, the first microstructure group and the through hole are correspondingly arranged under the single-key light-transmitting area, the second microstructure group is correspondingly arranged under the side light-transmitting area, and part of the light conduction area is correspondingly arranged under the light-shielding area; and a circuit board, arranged under the light guide plate, a light-emitting unit is arranged on the circuit board, and the light-emitting unit is accommodated in the through hole; wherein, light emitted by part of the light-emitting units is guided upward by the first microstructure group and passes through the single-key light-transmitting area, and light emitted by part of the light-emitting units is transmitted through the light conduction area and then guided upward by the second microstructure group and passes through the side light-transmitting area, and the number of microstructures or the light-emitting area of the second microstructure group is greater than that of the first microstructure group.

2. The backlight module according to claim 1, characterized in that, the film further comprises a reflection part, the reflection part is arranged around the periphery of the light-shielding area, and the reflection part is configured to reflect the light emitted by the light-emitting unit back to the light guide plate.

3. The backlight module according to claim 1, characterized in that, the film further comprises a light-shielding member or a reflection member, the light-shielding member or the reflection member is arranged above the light-emitting unit, the light-shielding member is configured to block the light directly emitted upward by the light-emitting unit, and the reflection member is configured to reflect the light directly emitted upward by the light-emitting unit back to the light guide plate.

4. The backlight module according to claim 1, characterized in that, a reflection layer is arranged on a surface of the circuit board facing the light guide plate, and the reflection layer is configured to reflect the light emitted by the light-emitting unit back to the light guide plate.

5. The backlight module according to claim 4, characterized in that, a light-blocking unit is arranged on a surface of the reflection layer facing the light guide plate, the light-blocking unit corresponds to a part of the light-shielding area, and one side of the light-blocking unit adjacent to the side light-transmitting area has an opening, the light-blocking unit is configured to block part of the light emitted by the light-emitting unit from being reflected back to the light guide plate, and part of the light emitted by the light-emitting unit is reflected back to the light guide plate through part of the reflection layer under the opening of the light-blocking unit.

6. The backlight module according to claim 1, characterized in that, the first microstructure group has a first area and a second area, the first area is located between the second microstructure group and the second area, and the number of microstructures or the light-emitting area of the first area is less than that of the second area.

7. A backlight module, characterized in that, it comprises: a film, comprising a first single-key light-transmitting area, a second single-key light-transmitting area, a light-shielding area and a side light-transmitting area, the light-shielding area is arranged on the periphery of the first single-key light-transmitting area and the second single-key light-transmitting area, and the side light-transmitting area is arranged adjacent to or along the side of the film; A light guide plate is disposed below the film. The light guide plate has a first microstructure group, a second microstructure group, a third microstructure group, a light conduction region, a first through hole, and a second through hole. The first microstructure group and the first through hole are correspondingly disposed below the first single-key light-transmitting region. The second microstructure group is correspondingly disposed below the side light-transmitting region. The third microstructure group and the second through hole are correspondingly disposed below the second single-key light-transmitting region. Part of the light conduction region is correspondingly disposed below the light-shielding region. The first microstructure group has a first region and a second region. The first region is located between the second microstructure group and the second region. The number of microstructures or the light-emitting area of the second microstructure group is greater than the number of microstructures or the light-emitting area of the first region; and A circuit board is disposed below the light guide plate. A first light-emitting unit and a second light-emitting unit are provided on the circuit board. The first light-emitting unit and the second light-emitting unit are respectively received in the first through hole and the second through hole; Wherein, part of the light emitted by the first light-emitting unit is guided upward by the first microstructure group and passes through the first single-key light-transmitting region. Part of the light emitted by the first light-emitting unit and the second light-emitting unit is transmitted through the light conduction region and then guided upward by the second microstructure group and passes through the side light-transmitting region.

8. The backlight module according to claim 7, characterized in that the number of microstructures or the light-emitting area of the first region is less than the number of microstructures or the light-emitting area of the second region.

9. The backlight module according to claim 7, characterized in that the film further includes a light-shielding member or a reflecting member. The light-shielding member or the reflecting member is disposed above the first light-emitting unit. The light-shielding member is configured to shield the light directly emitted upward by the first light-emitting unit, and the reflecting member is configured to reflect the light directly emitted upward by the first light-emitting unit back to the light guide plate.

10. The backlight module according to claim 7, characterized in that the first region and the second region are separated by a virtual extension line passing through the center of the first light-emitting unit.

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