Radiator for electric load device, manufacturing method thereof and electronic equipment

Abstract

The invention discloses a radiator for an electric load device, a manufacturing method thereof and electronic equipment, the radiator comprises a radiating main body, the radiating main body is provided with a hot end and a cold end which are opposite to each other, the hot end is used for being thermally coupled with the electric load device, and the radiating main body is provided with an accommodating cavity extending from the hot end to the cold end; the containing cavity is filled with the phase change working medium, and the phase change working medium is at least converted between a gas state and a liquid state within a phase change temperature range; wherein the first end wall, provided with the hot end, of the heat dissipation body is recessed towards the containing cavity to form at least one assembly blind hole, and the assembly blind hole is used for fixing the electric load device. According to the technical scheme, the radiator capable of being used for the electric load device is easier to assemble, the production cost is lower, and the radiating effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical load devices, and particularly to a heat sink for electrical load devices, a manufacturing method thereof, and an electronic device. Background Art

[0002] In electrical load devices, taking devices made of LED (Light Emitting Diode), IGBT (Insulated Gate Bipolar Transistor), MOS (Metal - Oxide - Semiconductor), etc. as examples, high heat generation is a problem that cannot be ignored. These devices generate a large amount of heat during operation. If the heat is not dissipated in time, it will seriously affect the service life of the electrical load device and even cause device damage. Therefore, the heat dissipation problem has become one of the key factors restricting the performance improvement and wide application of electrical load devices.

[0003] Currently, for electrical load devices, the phase - change heat sink is a choice that can balance the heat dissipation effect and production cost to a certain extent. The advantages of the phase - change heat sink lie in its high - efficiency heat dissipation performance and stable heat dissipation effect. Since the phase - change material can absorb a large amount of heat during the phase - change process, it can significantly reduce the operating temperature of the electrical load device and extend its service life. At the same time, the phase - change heat sink also has the advantages of small volume, light weight, and easy installation, and is suitable for various compact electronic devices.

[0004] However, in the phase - change heat sink, the thickness of the housing not only affects the cost and weight of the heat sink, but also has a direct impact on its heat transfer efficiency. A thicker housing can provide better structural strength and sealing performance, but it will also increase the cost and weight of the heat sink and reduce the heat transfer efficiency. Therefore, in order to achieve more efficient heat dissipation and lower costs, the housing of the heat sink is usually designed to be relatively thin.

[0005] However, thinning the housing also brings a series of problems. Since the housing is thin, it is impossible to directly use penetrating connection methods such as screws for fixing and sealing. And the cavity of the phase - change working medium must be kept sealed to prevent the leakage of the phase - change material. Therefore, penetrating connection methods such as screws are obviously not applicable. Other assembly methods in between are also a bit lacking. For example, using adhesives and other methods can achieve sealing, but they are prone to failure in high - temperature environments, and the gluing process increases the process procedures, which is not conducive to mass production. In addition, other connection methods such as snaps and threads are also more troublesome during the assembly process, requiring additional assembly time and tools, increasing the manufacturing cost and difficulty.

[0006] Therefore, how to achieve efficient heat dissipation and stable sealing of the phase change heat sink while ensuring a thin shell, low cost and light weight has become an urgent problem to be solved. Summary of the invention

[0007] The technical problem solved by the present invention is to provide a radiator for electric load devices which is easier to assemble, has lower production cost and better heat dissipation effect, a manufacturing method thereof and an electronic device.

[0008] To solve the above technical problems, an embodiment of the present invention provides a heat sink for an electric load device, comprising: a heat sink body, having a relative hot end and a cold end, the hot end being used for thermal coupling with an electric load device, the heat sink body having a receiving cavity extending from the hot end to the cold end; a phase change medium filled in the receiving cavity, the phase change medium transforming between a gas state and a liquid state at least within a phase change temperature range; wherein a first end wall of the heat sink body formed with the hot end is recessed toward the receiving cavity to form at least one assembly blind hole, and the assembly blind hole is used to fix the electric load device.

[0009] Optionally, the assembly blind hole is formed by a stamping process.

[0010] Optionally, the heat sink further includes: a mounting dielectric member disposed inside the assembly blind hole, the mounting dielectric member being fixed to an inner wall of the assembly blind hole, the mounting dielectric member being used to match a fixing element that fixes the electric load device.

[0011] Optionally, a limiting structure is provided on the inner wall of the assembly blind hole and / or the outer wall of the installation medium component to fix the installation medium component to the inner wall of the assembly blind hole.

[0012] Optionally, a portion of the inner wall of the assembly blind hole is recessed toward the installation medium component to form the limiting structure to limit the installation medium component.

[0013] Optionally, the inner wall of the assembly blind hole has a threaded structure, and the threaded structure is used for threaded connection with a fixing element that fixes the electric load device.

[0014] Optionally, the thread structure on the inner wall of the assembly blind hole is formed synchronously or step by step through a stamping process.

[0015] Optionally, the heat dissipation body includes: a heat dissipation shell, the cold end is located in the heat dissipation shell, and the heat dissipation shell has an opening on a side away from the cold end; a cover part, sealing the opening, and the first end wall is located in the cover part.

[0016] Optionally, the wall thickness of the heat dissipation body is uniform.

[0017] Optionally, the thickness of the wall of the heat dissipation body is 0.05 to 1 millimeter.

[0018] Optionally, the material of the heat dissipation body is selected from one of iron, copper, aluminum, iron alloy, copper alloy, and aluminum alloy.

[0019] Optionally, the electrical load device is an LED lamp or a power semiconductor device.

[0020] To solve the above technical problems, an embodiment of the present invention further provides a manufacturing method for a radiator for an electrical load device, including: forming a heat dissipation body having opposite hot and cold ends, the hot end being used for thermal coupling with an electrical load device, and the heat dissipation body having a receiving cavity extending from the hot end to the cold end; filling a phase change working fluid in the receiving cavity; forming at least one assembly blind hole upward on the first end wall of the heat dissipation body where the hot end is formed, and the assembly blind hole is used for fixing the electrical load device.

[0021] Optionally, the forming at least one assembly blind hole upward on the first end wall of the heat dissipation body where the hot end is formed includes: providing a profile as the first end wall; stamping the profile to form the assembly blind hole.

[0022] Optionally, after forming at least one assembly blind hole, the method further includes: placing an installation medium member in the assembly blind hole; fixing the installation medium member to the inner wall of the assembly blind hole, and the installation medium member is used for adapting to a fixing element for fixing the electrical load device.

[0023] Optionally, fixing the installation medium member to the inner wall of the assembly blind hole includes: squeezing a part of the wall of the first end wall where the assembly blind hole is formed, so that a part of the wall of the first end wall where the assembly blind hole is formed is recessed toward the installation medium member to form a limiting structure, and the limiting structure limits the installation medium member.

[0024] Optionally, simultaneously with or after forming at least one assembly blind hole, the method further includes: stamping a thread structure on the inner wall of the assembly blind hole, and the thread structure is used for threaded connection with a fixing element for fixing the electrical load device.

[0025] To solve the above technical problems, an embodiment of the present invention further provides an electronic device, including an electrical load device; the above radiator.

[0026] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0027] To solve the above technical problems, an embodiment of the present invention provides a heat sink for an electrical load device, including: a heat dissipation main body having opposite hot and cold ends, the hot end being adapted to be thermally coupled to an electrical load device, and the heat dissipation main body having a receiving cavity extending from the hot end to the cold end; a phase change working fluid filled in the receiving cavity, the phase change working fluid being convertible between a gaseous state and a liquid state at least within a phase change temperature range; wherein, at least one assembly blind hole is formed by recessing a first end wall of the heat dissipation main body where the hot end is located towards the receiving cavity, and the assembly blind hole is used for fixing the electrical load device.

[0028] Adopting the technical solution of the present application, through the combination of the heat dissipation main body, the phase change working fluid and the assembly blind hole, efficient heat dissipation is achieved. The hot end of the heat dissipation main body is thermally coupled to the electrical load device, effectively conducting heat to the phase change working fluid. The phase change process of the phase change working fluid absorbs heat, and then the heat is released through the cold end of the heat dissipation main body. Thus, an efficient heat dissipation effect can be achieved. Further, the assembly blind hole is formed on the first end wall, enabling the electrical load device to be stably connected to the heat sink. Further, the fixing element of the electrical load device is connected to the assembly blind hole outside the receiving cavity, without affecting the airtightness of the receiving cavity.

[0029] Further, the assembly blind hole is formed by a stamping process. Thus, the processing flow of the heat sink can be simplified, the production cost can be reduced, and the economic benefit of the heat sink can be improved.

[0030] Further, the fixing element of the electrical load device is connected to the installation medium piece, and is indirectly connected to the inner wall of the assembly blind hole through the installation medium piece. Thus, the installation medium piece can strengthen the connection stability between the fixing element and the inner wall of the assembly blind hole. At the same time, the use of the installation medium piece can further simplify the complexity of the assembly blind hole structure.

[0031] Further, the wall thickness of the heat dissipation main body is uniform, and the wall thickness of the heat dissipation main body is 0.05 - 1 mm. Thus, on the one hand, the heat dissipation main body with a thinner wall has a better heat conduction effect, which is beneficial to enhancing the heat dissipation effect. On the other hand, the thin sheet-shaped profile is easier to stamp, which can reduce the production cost. In addition, a smaller thickness can also further reduce the overall weight of the heat sink to further improve the degree of light weight. Description of the Drawings

[0032] Figure 1 is a schematic diagram of a heat sink for an electrical load device according to an embodiment of the present invention;

[0033] Figure 2 is Figure 1 a cross-sectional view of the structure shown along the A - A direction;

[0034] Figure 3 is Figure 1Schematic diagram of the inner wall of the middle assembly blind hole forming a limiting structure;

[0035] Figure 4 It is a flowchart of a manufacturing method of a heat sink for an electrical load device according to an embodiment of the present invention. Detailed implementation manners

[0036] As mentioned in the background art, for the existing heat sink for an electrical load device to be assembled with the electrical load device, the thickness of the housing is large, the production cost is high, and the heat dissipation efficiency is insufficient.

[0037] To solve the above technical problems, an embodiment of the present invention provides a heat sink for an electrical load device, including: a heat dissipation main body having opposite hot ends and cold ends, the hot end being used for thermally coupling with an electrical load device, and the heat dissipation main body having a receiving cavity extending from the hot end to the cold end; a phase change working fluid filled in the receiving cavity, the phase change working fluid being at least transformed between a gaseous state and a liquid state within a phase change temperature range; wherein, at least one assembly blind hole is formed by the first end wall of the heat dissipation main body where the hot end is located and recessed towards the receiving cavity, and the assembly blind hole is used for fixing the electrical load device.

[0038] Adopting the technical solution of the present application, through the combination of the heat dissipation main body, the phase change working fluid and the assembly blind hole, efficient heat dissipation is achieved. The hot end of the heat dissipation main body is thermally coupled with the electrical load device, effectively conducting heat to the phase change working fluid, absorbing heat through the phase change process of the phase change working fluid, and then releasing heat through the cold end of the heat dissipation main body. Thus, an efficient heat dissipation effect can be achieved. Further, the assembly blind hole is formed on the first end wall, so that the electrical load device can be stably connected to the heat sink. Further, the fixing element of the electrical load device and the assembly blind hole are connected outside the receiving cavity, and the airtightness of the receiving cavity will not be affected.

[0039] To make the above objects, features and beneficial effects of the present invention more obvious and understandable, the following will describe the specific embodiments of the present invention in detail with reference to the accompanying drawings.

[0040] Figure 1 It is a schematic diagram of a heat sink 100 for an electrical load device 200 according to an embodiment of the present invention, Figure 2 is Figure 1 A cross-sectional view of the shown structure along the A-A direction.

[0041] Combined with Figure 1 and Figure 2The heat sink 100 for an electric load device 200 may include: a heat sink body 10, having a hot end 101 and a cold end 102 opposite to each other, wherein the hot end 101 is used for thermal coupling with an electric load device 200, and the heat sink body 10 has a receiving cavity 1 extending from the hot end 101 to the cold end 102; a phase change medium filled in the receiving cavity 1, wherein the phase change medium changes between a gas state and a liquid state at least within a phase change temperature range; wherein a first end wall 2 of the heat sink body 10, which is formed with the hot end 101, is recessed toward the receiving cavity 1 to form at least one assembly blind hole 3, and the assembly blind hole 3 is used to fix the electric load device 200.

[0042] The electrical load device refers to a component or device used to consume or absorb electrical energy in a circuit. These devices may have different characteristics and functions depending on the application requirements.

[0043] In an optional embodiment, the electric load device is an LED lamp or a power semiconductor device. Further, the power semiconductor device may include an insulated gate bipolar transistor (IGBT) or a power metal oxide semiconductor field effect transistor (power MOS tube).

[0044] In some embodiments, the first end wall 2 fits at least a portion of the surface of the electric load device 200 , which can ensure that the hot end of the housing fits tightly with the electric load device, thereby improving the heat conduction efficiency.

[0045] In some embodiments, the heat dissipation body 10 may include: a heat dissipation shell 5, the cold end 102 is located in the heat dissipation shell 5, and the heat dissipation shell 5 has an opening on the side away from the cold end 102; a cover 6, sealing the opening, and the first end wall 2 is located in the cover 6.

[0046] In some embodiments, the heat dissipation housing 5 has a main body 51 and at least one heat dissipation portion 52 protruding outward from a first side 511 of the main body 51. Further, the accommodating chamber 1 includes an evaporation chamber 11 defined by the main body 51, and a condensation chamber 12 defined by each of the heat dissipation portions 52. Each of the condensation chambers 12 is connected to the evaporation chamber 11, and the evaporation chamber 11 has an opening on the second side 512 of the main body 51, and the first side 511 and the second side 512 are opposite; the cover 6 seals the opening.

[0047] Furthermore, the cover 6 may be thermally coupled to an electric load device 200 .

[0048] Furthermore, the condensation chamber 12 and / or the evaporation chamber 11 is filled with a phase change medium.

[0049] In some embodiments, the main body portion 51 has opposite first and second sides 511 and 512, where the second side 512 is closer to the heat source than the first side 511, and the heat source is the electrical load device 200 to be cooled. In other words, in a specific application scenario, the heat generated by the electrical load device 200 is transferred to the second side 512 of the main body portion 51 by heat conduction.

[0050] Further, the cover portion 6 is disposed on the second side 512 of the main body portion 51 and is thermally coupled to the electrical load device 200. Further, the hot end 101 is formed on the cover portion 6, and at least a part of the cover portion 6 forms the first end wall 2.

[0051] Further, the heat dissipation housing 5 is indirectly thermally coupled to the electrical load device 200 through the cover portion 6.

[0052] Further, the main body portion 51 defines an evaporation chamber 11, and at least one heat dissipation portion 52 disposed on the first side 511 of the main body portion 51 defines a condensation chamber 12. In other words, the evaporation chamber 11 is closer to the hot end 101 than the condensation chamber 12.

[0053] Further, the phase change working fluid can at least transform between a gaseous state and a liquid state within a phase change temperature range and flow reciprocally between the evaporation chamber 11 and the condensation chamber 12.

[0054] In a specific application scenario, the initial state of the phase change working fluid can be, for example, a liquid state. The liquid phase change working fluid is accommodated in the evaporation chamber 11 and is closer to the second side 512 than the first side 511. The electrical load device 200 as the heat source transfers heat to the phase change working fluid by heat transfer, causing the temperature of the phase change working fluid to rise and gradually vaporize (or evaporate), and absorbing heat in this process. The gaseous phase change working fluid diffuses from the evaporation chamber 11 in the opposite direction of the first direction D1 to at least one condensation chamber 12 (as shown by the dashed arrow in Figure 2 ). The first direction D1 is in the same direction as the direction from the cold end 101 to the hot end 102.

[0055] Further, due to being far from the heat source, the temperature in the condensation chamber 12 is lower than the temperature in the evaporation chamber 11. The heat carried by the gaseous phase change working fluid is dissipated in the condensation chamber 12, and the temperature gradually drops until it re-condenses (or liquefies) into a liquid phase change working fluid. Further, the liquid phase change working fluid flows back to the evaporation chamber 11 (as shown by the solid arrow in Figure 2 ) to continue absorbing heat and vaporizing (or evaporating). Thus, in the cyclic phase change process, the phase change working fluid continuously carries the heat of the heat source to the condensation chamber and then transfers it to the external environment through the heat dissipation portion 52.

[0056] In some embodiments, the phase change working fluid can be selected from alcohol substances such as ethanol and methanol and related mixtures, or the type of the phase change working fluid can be determined according to specific application scenarios.

[0057] Furthermore, the boiling point of the phase change working fluid should be less than the highest temperature threshold at which the electrical load device 200 can operate stably, so as to ensure that the temperature of the electrical load device 200 always remains below the highest temperature threshold.

[0058] In some embodiments, the evaporation chamber 11 and the condensation chamber 12 can both be vacuum chambers before filling with the phase change working fluid. Thus, it is possible to avoid other substances such as mixed air from affecting the normal operation of the phase change working fluid.

[0059] In some embodiments, the heat dissipation housing 5 and the cover portion 6 can be made of materials with relatively high thermal conductivity such as aluminum alloy, stainless steel, copper, and copper alloy to ensure the heat dissipation efficiency of the radiator 100.

[0060] Continue to refer to Figure 1 and Figure 2 , in some embodiments, the main body portion 51 and the heat dissipation portion 52 are integrally formed. That is, the entire heat dissipation housing 5 is integrally formed. Thus, the integrally formed main body portion 51 and the heat dissipation portion 52 can make the heat dissipation housing 5 have higher structural strength. And the integrally formed main body portion 51 and the heat dissipation portion 52 are easier to manufacture, and the production of the entire heat dissipation housing 5 can be completed through fewer manufacturing steps. Thus, the manufacturing cost can be reduced and the production efficiency can be improved.

[0061] In some embodiments, the main body portion 51 and the heat dissipation portion 52 are formed synchronously or step by step through a stamping process. Among them, the stamping process is a commonly used metal processing method, which uses a mold to apply an external force to a metal sheet on a press, causing it to undergo plastic deformation, so as to obtain parts with the required shape and size.

[0062] In a typical application scenario, a mold with a specific shape can be selected according to actual production requirements, and the main body portion 51 and the heat dissipation portion 52 are formed synchronously by stamping with this mold. Thus, the process steps can be simplified and the production efficiency of the heat dissipation housing 5 can be improved.

[0063] In another typical application scenario, the main body portion 51 can also be formed by stamping with one mold first, and then the heat dissipation portion 52 can be formed by stamping with another mold. Thus, forming the heat dissipation housing 5 step by step by stamping can improve the yield rate and reduce the risk of profile cracking during the stamping process.

[0064] In other embodiments, the heat dissipation housing 5 can also be integrally formed by processes such as thermoforming, hot pressing, or injection molding.

[0065] Continue to refer toFigure 2 The cover portion 6 includes a plate portion 61 and a flange 62 extending from the outer edge of the plate portion 61 in the first direction D1. The heat dissipation housing 5 includes an extension wall 53 extending from the plane where the plate portion 61 is located in the first direction D1. At least a part of the flange 62 and at least a part of the extension wall 53 are seamlessly fitted. Thus, the flange 62 and the extension wall 53 in surface-to-surface contact can strengthen the connection between the heat dissipation housing 5 and the cover portion 6, enhancing the connection stability of the radiator 100. Further, the surface-to-surface contact between the flange 62 and the extension wall 53 has a better sealing effect compared to other contact methods (such as line contact). The surface-to-surface contact can provide a larger contact area, thereby increasing the reliability and stability of the seal, avoiding accidental leakage of the phase change working fluid, and effectively reducing the performance degradation or failure risk caused by poor sealing.

[0066] In some embodiments, the seamless connection between the flange 62 and the extension wall 53 can be achieved by welding or a multi-crimping process, etc.

[0067] Further, the plate portion 61 can be used to form the first end wall 2. In other words, the at least one assembly blind hole 3 can be formed in the plate portion 1.

[0068] In some embodiments, in combination Figure 2 and Figure 3 , at least one assembly blind hole 3 is formed by the first end wall 2 recessing towards the accommodation cavity 1. The assembly blind hole 3 is used to fix the electrical load device 200.

[0069] Specifically, the electrical load device 200 can have a fixing element 201, and at least a part of the fixing element 201 can be inserted into the assembly blind hole 3 and directly or indirectly fixedly connected to the inner wall of the assembly blind hole 3.

[0070] In some embodiments, the assembly blind hole 3 is formed by a stamping process. Thereby, the production process can be simplified. Compared with the process of forming an assembly blind hole by drilling in the prior art, the solution of forming the assembly blind hole 3 by the stamping process allows the thickness of the first end wall 2 (and the walls of the entire heat dissipation body 10) to be further reduced. For example, in the prior art, in order to drill an assembly blind hole, the shell thickness of the radiator needs to be greater than the depth of the processed assembly blind hole (for example, at least 1-2 cm), which not only increases the production cost but also increases the overall weight of the radiator and deteriorates the heat dissipation effect. However, by adopting the solution of forming the assembly blind hole 3 by the stamping process in the present application, the wall of the heat dissipation body 10 can be thinned to 0.05-1 mm, thus reducing the production cost, reducing the overall weight of the radiator 100, and optimizing the heat dissipation effect of the radiator 100. As a preferred embodiment, the radiator can be made of a thin and ductile material (such as tinplate, galvanized iron sheet, low-carbon cold-rolled sheet, etc.). Specifically, both the heat dissipation housing 5 and the cover 6 can be formed by the stamping process on the basis of this thinner material, and the seal between the heat dissipation housing 5 and the cover 6 can also be realized by a multi-crimping process. The cost of such materials is low, and the above processes are all mature processes, which is beneficial to greatly reducing the cost.

[0071] In some embodiments, the assembly blind hole 3 can also be formed by processes such as thermoforming, hot pressing, or injection molding.

[0072] In some embodiments, the assembly blind hole 3 can be formed simultaneously with the processing of the cover 6, or it can also be formed by further processing the cover 6 after the cover 6 is processed and formed.

[0073] In some embodiments, the cover 6 is recessed toward the cold end 102 to form a recessed portion, and the recessed portion is adapted to receive at least a part of the electrical load device 200.

[0074] Furthermore, an annular cavity 13 is formed between at least a part of the side wall of the cover 6 that forms the recessed portion and the side wall of the main body portion 51 that forms the evaporation cavity 11, and the annular cavity 13 is adapted to form a part of the evaporation cavity 111. Thus, the annular cavity 13 is arranged around the heat source (for example, the electrical load device 200), which can increase the heat exchange area between the phase change working medium and the heat source and further optimize the heat dissipation effect.

[0075] In some embodiments, the radiator 100 may further include: a mounting medium member 4, disposed inside the assembly blind hole 3, the mounting medium member 4 being fixed to the inner wall 31 of the assembly blind hole 3, and the mounting medium member 4 being adapted to cooperate with a fixing element 201 for fixing the electrical load device 200.

[0076] Specifically, in combination with Figure 2 and Figure 3The outer peripheral surface of the mounting dielectric member 4 can be closely fitted with the inner wall 3 of the mounting blind hole 3. Thus, it can be ensured that the mounting dielectric member 4 is firmly mounted in the mounting blind hole 3, thereby ensuring that the electric load device 200 can be firmly connected to the heat sink 100 through the mounting dielectric member 4.

[0077] In some embodiments, the mounting dielectric member 4 may also be formed with a mounting hole 41 extending along the first direction D1 , and at least a portion of the fixing element 201 of the electric load device 200 may be inserted into the mounting hole 41 .

[0078] In an optional embodiment, the mounting hole 41 may be, for example, a threaded hole, the fixing element 201 may be, for example, a bolt or a screw, and the outer peripheral surface of the fixing element 201 may be threadably matched with the inner wall of the mounting hole 41 .

[0079] In some embodiments, the mounting medium member 4 may be made of an elastic material, and the diameter of the mounting hole 41 may be slightly smaller than the diameter of the fixing element 201. Thus, when the fixing element 201 is inserted into the mounting hole 41, the mounting medium member 4 may be elastically deformed toward the inner wall 31 of the mounting blind hole 3, so that the connection between the mounting medium member 4 and the inner wall 31 of the mounting blind hole 3 is tighter and more secure.

[0080] In some embodiments, the inner wall 31 of the assembly blind hole 3 and / or the outer wall of the installation dielectric member 4 may be provided with a limiting structure 7 to fix the installation dielectric member 4 to the inner wall 31 of the assembly blind hole 3. Thus, the limiting structure 7 can effectively prevent the installation dielectric member 4 from accidentally falling out of the assembly blind hole 3, causing the electric load device 200 to accidentally fall off and cause losses.

[0081] Specifically, refer to Figure 3 A portion of the inner wall 31 of the assembly blind hole 3 is recessed toward the installation medium component 4 to form the limiting structure 7 to limit the installation medium component 4 .

[0082] In some embodiments, the limiting structure 7 can be formed simultaneously when the assembly blind hole 3 is formed. Alternatively, the limiting structure 7 can be formed on the inner wall 31 of the assembly blind hole 3 before the installation medium member 4 is placed.

[0083] In a preferred embodiment, the limiting structure 7 can be formed after the installation medium member 4 is placed in the assembly blind hole 3. For example, after the installation medium member 4 is placed in the assembly blind hole 3, the portion of the first end wall 2 forming the assembly blind hole 3 can be squeezed on the side of the first end wall 2 away from the first direction D1, so that the inner wall 31 of the assembly blind hole 3 is plastically deformed and recessed toward the installation medium member 4 to form the limiting structure 7. As a result, the process of forming the limiting structure 7 is simpler, which is conducive to improving production and processing efficiency.

[0084] In some embodiments, the inner wall 31 of the assembly blind hole 3 has a threaded structure for threaded connection with a fixing element 201 that fixes the electrical load device 200.

[0085] Furthermore, the threaded structure on the inner wall 31 of the assembly blind hole 3 is formed synchronously or step by step by a stamping process.

[0086] In other embodiments, the threaded structure can also be used as the limiting structure 7, and the outer peripheral surface of the mounting medium member 4 can be threadedly connected to the inner wall 31 of the assembly blind hole 3.

[0087] In some embodiments, the wall thickness of the heat dissipation body 10 is uniform. Thus, it can ensure that the heat generated by the electrical load device 200 is evenly transferred to the phase change working fluid, optimizing the heat dissipation effect.

[0088] In some embodiments, the wall thickness of the heat dissipation body 10 is 0.05 to 1 millimeter. Thus, it can save materials, reduce production costs, and also reduce the overall weight of the radiator 100.

[0089] It should be understood that the wall thickness of the heat dissipation body 10 is related to the actual size of the radiator 100. The wall thickness of the radiator 100 for a larger-sized electrical load device 200 can be greater than that of the radiator 100 for a smaller-sized electrical load device 200.

[0090] In some embodiments, the material of the heat dissipation body 10 is selected from one of iron, copper, aluminum, iron alloy, copper alloy, and aluminum alloy. Thus, it can not only ensure the heat dissipation performance of the radiator 100 but also simplify the production process and reduce production costs.

[0091] In some embodiments, a capillary structure (not shown in the figure) can also be provided on the inner wall of the heat dissipation housing 1. The liquid phase change working fluid flows back from the condensation chamber 12 to the evaporation chamber 11 under the action of the capillary structure. Thus, it can accelerate the circulation of the phase change working fluid between the evaporation chamber 11 and the condensation chamber 12, optimizing the heat dissipation effect of the radiator 100.

[0092] It should be understood that in a typical practical application of the radiator 100 in the embodiments of the present application, the evaporation chamber 11 is located below the condensation chamber 12 along the direction of gravity. In some actual application scenarios, the radiator 100 may also need to be inclined or inverted. At this time, the capillary structure provided on the inner wall of the heat dissipation housing 1 can play a guiding role to enable at least a part of the liquid phase change working fluid to flow back to the evaporation chamber 11 against gravity.

[0093] Adopting the technical solution of the present application, through the combination of the heat dissipation main body 10, the phase change working fluid, and the assembly blind hole 3, efficient heat dissipation is achieved. The hot end of the heat dissipation main body 10 is thermally coupled with the electrical load device 200, effectively conducting heat to the phase change working fluid. Heat is absorbed through the phase change process of the phase change working fluid, and then released through the cold end of the heat dissipation main body 10. Thus, an efficient heat dissipation effect can be achieved. Further, the assembly blind hole 3 is formed in the first end wall 2, enabling the electrical load device 200 to be stably connected to the radiator 100. Further, the fixing element 201 of the electrical load device 200 and the assembly blind hole 3 are connected outside the accommodation cavity 1, without affecting the airtightness of the accommodation cavity 1.

[0094] Further, the assembly blind hole 3 is formed by a stamping process. Thus, the processing flow of the radiator 100 can be simplified, the production cost can be reduced, and the economic benefit of the radiator 100 can be improved.

[0095] Further, the fixing element 201 of the electrical load device 200 is connected to the mounting medium member 4 and is grounded to the inner wall 31 of the assembly blind hole 3 through the mounting medium member 4. Thus, the mounting medium member 4 can enhance the connection stability between the fixing element 201 and the inner wall 31 of the assembly blind hole 3. At the same time, by using the mounting medium member 4, the complexity of the structure of the assembly blind hole 3 can be further simplified.

[0096] Further, the thickness of the wall of the heat dissipation main body 10 is uniform, and the thickness of the wall of the heat dissipation main body 10 is 0.05 to 1 mm. Thus, on the one hand, the heat dissipation main body 10 with a thinner wall has a better heat conduction effect, which is beneficial to enhancing the heat dissipation effect. On the other hand, the thin sheet-shaped profile is easier to stamp, which can reduce the production cost. In addition, the overall weight of the radiator 100 can also be further reduced.

[0097] Reference Figure 3 , the embodiment of the present invention also provides a manufacturing method for a radiator for an electrical load device, and the method can be used to manufacture Figures 1 to 3 the above-mentioned radiator 100 shown.

[0098] Specifically, the method may include:

[0099] Step S1, forming a heat dissipation main body, the heat dissipation main body having opposite hot and cold ends, the hot end being used for thermal coupling with an electrical load device, and the heat dissipation main body having an accommodation cavity extending from the hot end to the cold end;

[0100] Step S2, filling a phase change working fluid in the accommodation cavity;

[0101] Step S3, forming at least one assembly blind hole upward on the first end wall where the hot end of the heat dissipation main body is formed, the assembly blind hole being used for fixing the electrical load device.

[0102] Among them, for the specific structure and working principle of the heat sink for the electrical load device, reference can be made to the relevant descriptions of the Figures 1 to 3 embodiments shown above, which will not be elaborated here.

[0103] In some embodiments, step S2 can be carried out in a vacuum environment. Thus, it is possible to avoid doping impurities such as air and water vapor in the phase change working medium, which affects the phase change process and further affects the heat dissipation effect.

[0104] In some embodiments, step S3 can further include: stamping the first end wall to form the assembly blind hole. Thus, forming the assembly blind hole by the stamping process can simplify the production and processing flow and reduce the production cost.

[0105] In some embodiments, after step S3 is executed, the method can further include:

[0106] placing an installation medium piece in the assembly blind hole;

[0107] fixing the installation medium piece to the inner wall of the assembly blind hole, and the installation medium piece is used to be adapted to the fixing element for fixing the electrical load device.

[0108] Thus, through the installation medium piece, a stable connection between the electrical load device and the assembly blind hole can be achieved.

[0109] Furthermore, fixing the installation medium piece to the inner wall of the assembly blind hole includes: squeezing the part of the wall of the first end wall that forms the assembly blind hole, so that the part of the wall of the first end wall that forms the assembly blind hole is recessed towards the installation medium piece to form a limiting structure, and the limiting structure limits the installation medium piece. Thus, the limiting structure can be formed by squeezing, so that the installation medium piece is more firmly and stably placed in the assembly blind hole.

[0110] In some embodiments, simultaneously or after forming at least one assembly blind hole, the method can further include: stamping a thread structure on the inner wall of the assembly blind hole, and the thread structure is used for threaded connection with the fixing element for fixing the electrical load device, and the electrical load device 200 is connected to the assembly blind hole formed on the first end wall of the heat sink through a fixing piece.

[0111] An embodiment of the present invention also provides an electronic device. Combining Figure 1 and Figure 2 , the electronic device includes: an electrical load device 200 and a heat sink 100 as described in the Figures 1 to 3 embodiments shown above.

[0112] It should be understood that the term "and / or" in this text is merely a description of the association relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text indicates that the associated objects before and after are in an "or" relationship. As used herein, unless otherwise clearly stated, the term "or" encompasses all possible combinations, unless infeasible. For example, if it is stated that a component can include A or B, then unless otherwise clearly stated or infeasible, the component can include A, or B, or A and B. As a second example, if it is stated that a component can include A, B, or C, then unless otherwise clearly stated or infeasible, the component can include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C. The term "plurality" as used in the embodiments of this application refers to two or more.

[0113] Relational terms such as first, second, etc. that appear in the embodiments of this application are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship or order between these entities or operations. In addition, the words "comprising", "having", "containing" and other similar forms are intended to be equivalent in meaning and are open-ended. One or more items following any of these words do not mean an exhaustive list of such one or more items, or are limited to the listed one or more items. In the drawings and the specification, exemplary embodiments have been disclosed. However, many variations and modifications can be made to these embodiments. Therefore, although specific terms are used, they are only for general and descriptive purposes and not for the purpose of limitation.

[0114] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined by the claims.

Claims

1. A heat sink for an electrical load device, characterized in that: include: A heat dissipation body having a hot end and a cold end opposite to each other, wherein the hot end is used for thermal coupling with an electric load device, and the heat dissipation body has a receiving cavity extending from the hot end to the cold end; A phase-change working medium is filled in the containing cavity, and the phase-change working medium changes between a gas state and a liquid state at least within a phase-change temperature range; Wherein, the first end wall of the heat dissipation body formed with the hot end is recessed toward the accommodating cavity to form at least one assembly blind hole, and the assembly blind hole is used to fix the electric load device.

2. The heat sink according to claim 1, characterized in that: The assembly blind hole is formed by a punching process.

3. The heat sink according to claim 1, characterized in that: Also includes: The mounting dielectric member is arranged inside the assembly blind hole, the mounting dielectric member is fixed to the inner wall of the assembly blind hole, and the mounting dielectric member is used to adapt to the fixing element fixing the electric load device.

4. The heat sink according to claim 3, characterized in that: The inner wall of the assembly blind hole and / or the outer wall of the installation medium component are provided with a limiting structure to fix the installation medium component to the inner wall of the assembly blind hole.

5. The heat sink according to claim 4, characterized in that: A portion of the inner wall of the assembly blind hole is recessed toward the installation medium component to form the limiting structure to limit the installation medium component.

6. The heat sink according to claim 1, characterized in that The inner wall of the assembly blind hole has a thread structure, and the thread structure is used for threaded connection with a fixing element that fixes the electric load device.

7. The heat sink according to claim 6, characterized in that The thread structure on the inner wall of the assembly blind hole is formed synchronously or step by step through a stamping process.

8. The heat sink according to claim 1, characterized in that The heat dissipation body comprises: A heat dissipation shell, wherein the cold end is located in the heat dissipation shell, and a side of the heat dissipation shell facing away from the cold end has an opening; The cover part seals the opening, and the first end wall is located on the cover part.

9. The heat sink according to claim 1, characterized in that: The thickness of the wall of the heat dissipation body is uniform; and / or the thickness of the wall of the heat dissipation body is 0.05-1 mm.

10. The heat sink according to claim 9, characterized in that The material of the heat dissipation body is selected from one of iron, copper, aluminum, iron alloy, copper alloy and aluminum alloy.

11. The heat sink according to claim 1, characterized in that The electric load device is an LED lamp or a power semiconductor device.

12. A method for manufacturing a heat sink for an electric load device, characterized in that: include: Forming a heat dissipation body, the heat dissipation body having a hot end and a cold end opposite to each other, the hot end being used for thermal coupling with an electric load device, and the heat dissipation body having a receiving cavity extending from the hot end to the cold end; Filling the accommodating cavity with a phase-change working medium; At least one assembly blind hole is formed upward on a first end wall of the heat dissipation body where the hot end is formed, and the assembly blind hole is used to fix the electric load device.

13. The method according to claim 12, characterized in that The at least one assembly blind hole is formed upward on the first end wall of the heat dissipation body where the hot end is formed, comprising: The first end wall is punched to form the assembly blind hole.

14. The method according to claim 12, characterized in that After forming at least one assembly blind hole, the method further comprises: placing a mounting medium component in the assembly blind hole; The mounting dielectric member is fixed to the inner wall of the assembly blind hole, and the mounting dielectric member is used to match with a fixing element that fixes the electric load device.

15. The method according to claim 14, characterized in that Fixing the mounting medium member to the inner wall of the assembly blind hole comprises: The portion of the first end wall that forms the assembly blind hole is squeezed so that the portion of the first end wall that forms the assembly blind hole is recessed toward the installation dielectric member to form a limiting structure, and the limiting structure limits the installation dielectric member.

16. The method according to claim 12, characterized in that While or after forming at least one assembly blind hole, the method further comprises: A thread structure is punched on the inner wall of the assembly blind hole, and the thread structure is used for threaded connection with a fixing element that fixes the electric load device.

17. An electronic device, characterized in that: include: Electrical load devices; The radiator according to any one of claims 1 to 11.

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