Display panel, manufacturing method and spliced display screen

Abstract

The invention relates to a display panel, a manufacturing method and a spliced display screen, and the display panel comprises a circuit substrate which comprises a driving circuit; the light-emitting chip is arranged on the circuit substrate, and an electrode of the light-emitting chip is electrically connected with the driving circuit; the packaging layer covers the light-emitting chip; the elastic bodies are arranged on the side faces of the periphery of the circuit substrate, the elastic bodies are configured to be compressed and deformed by the circuit substrate after thermal expansion, and the elastic bodies recover deformation after the circuit substrate shrinks. After the circuit substrates are heated to expand, the circuit substrates can compress the elastic bodies to enable the elastic bodies to deform, the deformation of the elastic bodies compensates extension of the circuit substrates, namely, the elastic bodies can be compressed to be thinned while the circuit substrates extend, the stability of the overall size is guaranteed, mutual extrusion between every two adjacent spliced circuit substrates is prevented, and the service life of the circuit substrates is prolonged. The problem of deformation caused by extrusion is solved, and the display effect of the display panel is improved.

Description

Technical Field

[0001] This application relates to the technical field of LED displays, and in particular, to a display panel, a manufacturing method thereof, and a spliced display screen. Background Art

[0002] MLED is a general term for Micro-LED (Light Emitting Diode) and Mini LED (Mini Light Emitting Diode). It has the advantages of high brightness, wide color gamut coverage, high contrast, and more saturated colors, and is sought after by various manufacturers.

[0003] At present, the LED display screens on the market are composed of a single display screen or a spliced display screen composed of multiple display panels spliced together. When the spliced display screen composed of multiple display panels works, it will generate more heat, causing the circuit board that drives the light-emitting chip to emit light to expand due to heat, resulting in mutual extrusion and deformation between adjacent two display panels, which affects the display effect of the spliced display screen.

[0004] Therefore, how to improve the display effect of the spliced display screen is an urgent problem to be solved. Summary of the Invention

[0005] In view of the deficiencies of the above related technologies, the purpose of this application is to provide a display panel, a manufacturing method thereof, and a spliced display screen, aiming to solve the problem that the extrusion deformation caused by the thermal expansion of the circuit board affects the display effect of the spliced display screen.

[0006] This application provides a display panel, including:

[0007] A circuit board, the circuit board includes a driving circuit;

[0008] A light-emitting chip disposed on the circuit board, and an electrode of the light-emitting chip is electrically connected to the driving circuit;

[0009] An encapsulation layer covering the light-emitting chip; and

[0010] An elastomer disposed on the peripheral side surface of the circuit board, and the elastomer is configured to be compressed and deformed by the circuit board after thermal expansion, and the elastomer returns to its original shape after the circuit board shrinks.

[0011] In the above display panel, the elastomer is disposed on the peripheral side surfaces of the circuit substrate. After the circuit substrate expands due to heat, the circuit substrate compresses the elastomer to cause deformation of the elastomer. The deformation of the elastomer compensates for the elongation of the circuit substrate, that is, when the circuit substrate elongates, the elastomer will be compressed and thinned, ensuring the stability of the overall dimensions, preventing mutual extrusion between two adjacent spliced circuit substrates, solving the deformation problem caused by extrusion, and improving the display effect of the display panel.

[0012] Based on the same inventive concept, the present application further provides a method for manufacturing the above-described display panel, including:

[0013] Bond the light-emitting chip on the circuit substrate so that the electrodes of the light-emitting chip are electrically connected to the driving circuit;

[0014] Provide a packaging layer covering the light-emitting chip on the circuit substrate, and provide the elastomer on the peripheral side surfaces of the circuit substrate.

[0015] In the method for manufacturing the above display panel, an elastomer is provided on the peripheral side surfaces of the circuit substrate. After the circuit substrate expands due to heat, the circuit substrate compresses the elastomer to cause deformation of the elastomer. The deformation of the elastomer compensates for the elongation of the circuit substrate, that is, when the circuit substrate elongates, the elastomer will be compressed and thinned, ensuring the stability of the overall dimensions, preventing mutual extrusion between two adjacent spliced circuit substrates, solving the deformation problem caused by extrusion, and improving the display effect of the display panel.

[0016] Optionally, the providing a packaging layer covering the light-emitting chip on the circuit substrate and providing the elastomer on the peripheral side surfaces of the circuit substrate includes:

[0017] Form the packaging layer and the elastomer integrally by an injection molding process.

[0018] Forming the packaging layer and the elastomer integrally by injection molding not only simplifies the manufacturing steps of the display panel, but also can avoid the generation of air bubbles in the packaging layer, optimizes the display effect, has higher injection molding precision, and improves the product quality.

[0019] Based on the same inventive concept, the present application further provides a spliced display screen, including at least two spliced display panels as described above, and there is the elastomer between the circuit substrates on adjacent display panels.

[0020] The display panel in the above-mentioned spliced display screen is provided with an elastomer. The elastomer is arranged on the peripheral sides of the circuit board. After the circuit board expands due to heat, the circuit board will compress the elastomer to cause the elastomer to deform. The deformation of the elastomer compensates for the elongation of the circuit board, that is, when the circuit board elongates, the elastomer will be compressed and thinned, ensuring the stability of the overall size, preventing mutual extrusion between two adjacent spliced circuit boards, solving the deformation problem caused by extrusion, and improving the display effect of the spliced display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. is a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0022] Figure 2 FIG. is a schematic structural diagram of an elastomer provided by an embodiment of the present application;

[0023] Figure 3 FIG. is another schematic structural diagram of an elastomer provided by an embodiment of the present application;

[0024] Figure 4 FIG. is still another schematic structural diagram of an elastomer provided by an embodiment of the present application;

[0025] Figure 5 FIG. is a schematic structural diagram of an integral structure of an elastomer and a packaging layer provided by an embodiment of the present application;

[0026] Figure 6 FIG. is another schematic structural diagram of an integral structure of an elastomer and a packaging layer provided by an embodiment of the present application;

[0027] Figure 7 FIG. is a schematic structural diagram of an injection mold provided by an embodiment of the present application;

[0028] Figure 8 FIG. is a schematic structural diagram of an annular elastomer provided by an embodiment of the present application;

[0029] Figure 9 FIG. is a schematic structural diagram of an elastomer including elastic units provided by an embodiment of the present application;

[0030] Figure 10 FIG. is another schematic structural diagram of an elastomer including elastic units provided by an embodiment of the present application;

[0031] Figure 11 FIG. is a flowchart of a method for manufacturing a display panel provided by another alternative embodiment of the present application;

[0032] Figure 12 FIG. is a schematic structural diagram of a spliced display screen provided by still another alternative embodiment of the present application;

[0033] Figure 13Schematic diagram of the structure of the circuit board before expansion provided by another alternative embodiment of the present application;

[0034] Figure 14 Schematic diagram of the structure of the circuit board after expansion provided by another alternative embodiment of the present application;

[0035] Explanation of reference numerals:

[0036] 1 - Circuit board; 2 - Light-emitting chip; 3 - Encapsulation layer; 4 - Elastomer; 5 - Lower mold; 6 - Upper mold; 7 - Cavity; 8 - Glue inlet; 9 - Frame. Detailed implementation manners

[0037] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the description of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0039] When the tiled display screen composed of multiple display panels works, it will generate more heat, causing the circuit board that drives the light-emitting chip to emit light to expand due to heat, resulting in mutual extrusion and deformation between adjacent two display panels, which affects the display effect of the tiled display screen.

[0040] Based on this, the present application hopes to provide a solution that can solve the above technical problems, and its detailed content will be elaborated in the subsequent embodiments.

[0041] This embodiment provides a display panel, and the display panel in this embodiment can be applied to a tiled display screen, such as Figures 1-10 As shown, the display panel includes: a circuit board 1, a light-emitting chip 2, an encapsulation layer 3, and an elastomer 4.

[0042] The circuit board 1 in this embodiment includes a driving circuit, and the driving circuit has a plurality of pads exposed on the surface of the circuit board 1. It can be understood that the circuit board 1 in this embodiment is made of a material that has a phenomenon of thermal expansion. For example, the circuit board 1 in this embodiment can be a printed circuit board 1, specifically a glass fiber epoxy resin material, but not limited thereto, and can also be other materials that have a phenomenon of thermal expansion.

[0043] In the circuit board 1 of this embodiment, a plurality of light-emitting chips 2 are provided, and the electrodes of the light-emitting chips 2 are electrically connected to the driving circuit. Specifically, the electrodes of the light-emitting chips 2 can be correspondingly bonded to the pads of the driving circuit to form an electrical connection, and the light-emitting chips 2 can be driven to emit light through the driving circuit. It can be understood that the light-emitting chips 2 in this embodiment include but are not limited to Mini LED (Mini Light Emitting Diode, sub-millimeter light-emitting diode), Micro LED (Micro Light Emitting Diode, micron-scale light-emitting diode). Specifically, the light-emitting chip 2 includes an epitaxial layer and electrodes (including a positive electrode and a negative electrode) provided on the epitaxial layer. In this embodiment, the material and shape of the electrodes are not limited either. For example, the material of the electrodes can include at least one of Cr, Ni, Al, Ti, Au, Pt, W, Pb, Rh, Sn, Cu, Ag. The epitaxial layer of the light-emitting chip 2 in this embodiment can include an N-type semiconductor, a P-type semiconductor, and an active layer located between the N-type semiconductor and the P-type semiconductor. The light-emitting chip 2 in this embodiment can be a flip-chip LED chip or a vertical LED chip, and this embodiment does not specifically limit it.

[0044] In this embodiment, the encapsulation layer 3 is provided on the circuit board 1 to cover the light-emitting chips 2. It can be understood that the encapsulation layer 3 in this embodiment is made of a light-transmitting material. For example, it can be a transparent material or other non-transparent but light-transmitting materials. The encapsulation glue in this embodiment can be formed by injection molding. The injection molding process can avoid the generation of bubbles in the encapsulation layer 3, optimize the display effect, and has higher injection precision, improving the product quality. As Figure 7 shown, the injection molding can be completed through an injection mold. The circuit board 1 provided with the light-emitting chips 2 is placed in the cavity 7 of the lower mold 5 of the injection mold and fixed. Then, the upper mold 6 is closed and glue is injected through the glue inlet 8 of the mold. After pressure holding and cooling, the encapsulation layer 3 covering the light-emitting chips 2 can be obtained, and the production of the encapsulation layer 3 is simple. After the upper mold 6 is closed, a closed space can be formed between the upper mold 6 and the lower mold 5. The circuit board 1 provided with the light-emitting chips 2 is fixed in this space, and the surface of the circuit board 1 where the light-emitting chips 2 are provided forms a part of the mold forming surface. This part of the forming surface encloses together with the forming surfaces of the upper mold 6 and the lower mold 5 to form a cavity 7 with the same shape as the outer shape of the encapsulation layer 3. In this embodiment, in order to make the fixing of the circuit board 1 more convenient, at least two positioning holes can be provided on the side of the circuit board 1 away from the light-emitting chips 2, and positioning bosses corresponding in number and position to the positioning holes are provided in the following cavity 7. When placing the circuit board 1, the positioning holes on the circuit board 1 are in concave-convex fit with the positioning bosses on the lower mold 5 to form the limit of the circuit board 1.

[0045] In this embodiment, the elastomer 4 is disposed on the peripheral side surfaces of the circuit board 1. The elastomer 4 is configured to be compressed and deformed by the circuit board 1 after thermal expansion, and the elastomer 4 resumes deformation after the circuit board 1 contracts. After the circuit board 1 expands due to heat, the circuit board 1 will compress the elastomer 4 to cause deformation of the elastomer 4. The deformation of the elastomer 4 compensates for the elongation of the circuit board 1, that is, when the circuit board 1 elongates, the elastomer 4 will be compressed and thinned, ensuring the stability of the overall dimensions, preventing mutual extrusion between two adjacent spliced circuit boards 1, solving the deformation problem caused by extrusion, and improving the display effect of the display panel. It can be understood that in this embodiment, the circuit board 1 contracts, that is, the thermally expanded circuit board 1 contracts and resumes after being not heated. During the contraction process of the circuit board 1, the elastomer 4 is no longer extruded by the circuit board 1, and the elastomer 4 can release energy and resume deformation. The elastomer 4 in this embodiment is made of an elastic material, which can undergo reversible elastic deformation, for example, but not limited to, rubber material. In this embodiment, the thickness of the elastomer 4 in the direction perpendicular to the side surface of the circuit board 1 can be, but not limited to, 1 mm to 10 mm.

[0046] In some embodiments, as Figure 1 shown, the elastomer 4 can completely cover the side surface of the circuit board 1. Complete coverage can make the force on the side wall of the circuit board 1 more balanced when the circuit board 1 expands due to heat and squeezes the elastomer 4, which is beneficial for long-term use. In some embodiments, the elastomer 4 can also partially cover the side surface of the circuit board 1. When partially covering, it includes at least one of partial coverage in the height direction of the side surface of the circuit board 1 and partial coverage in the width direction of the side surface of the circuit board 1.

[0047] In this embodiment, when the elastomer 4 partially covers the circuit board 1 in the height direction of the side surface, as Figure 4 shown, the elastomer 4 can be disposed in the middle of the circuit board 1 in the height direction of the side surface. At this time, the force when the circuit board 1 expands due to heat is also more balanced; but not limited to this, it can also be as Figure 3 shown, making the elastomer 4 closer to the encapsulation layer 3 or in contact with the encapsulation layer 3; it can also make the elastomer 4 closer to the side of the circuit board 1 away from the light-emitting chip 2. When the elastomer 4 partially covers the circuit board 1 in the width direction of the side surface, the elastomer 4 can include a plurality of elastic units, and at least one elastic unit is provided on one side surface of the circuit board 1. Among them, when one elastic unit is provided on one side surface, the elastic unit can be disposed in the middle of the circuit board 1 in the width direction of the side surface. At this time, the force when the circuit board 1 expands due to heat can also be more balanced; when two or more elastic units are provided on one side surface of the circuit board 1, as Figure 10 shown, the elastic units on one side surface can be evenly distributed in the width direction of the circuit board 1.

[0048] In some embodiments, asFigure 1 , Figure 4 As shown, the side of the elastomer 4 away from the circuit board 1 can be flush with the side of the encapsulation layer 3. When they are flush, it is more conducive to the splicing between adjacent display panels. At this time, the elastomer 4 does not protrude from the side of the circuit board 1 where the light-emitting chip 2 is provided, and the encapsulation layer 3 protrudes from the side of the circuit board 1. In some embodiments, as Figure 2 shown, the elastomer 4 can cover the side of the circuit board 1 and the side of the encapsulation layer 3. When splicing, only the elastomer 4 contacts between adjacent two display panels, and the contact at the splicing seam is better. At this time, the elastomer 4 protrudes from the side of the circuit board 1 where the light-emitting chip 2 is provided.

[0049] In this embodiment, the material of the elastomer 4 and the material of the encapsulation layer 3 can be different or the same. When they are the same, in order to reduce the processing steps of the display panel, the encapsulation layer 3 and the elastomer 4 can be integrally injection-molded. At this time, the encapsulation layer 3 and the elastomer 4 are an integral structure. As Figure 5 shown, the elastomer 4 can completely cover the side of the circuit board 1, that is, the side of the elastomer 4 away from the encapsulation layer 3 is flush with the side of the circuit board 1 away from the light-emitting chip 2; as Figure 6 shown, the elastomer 4 can also partially cover the side of the circuit board 1 in the height direction of the side of the circuit board 1. When the encapsulation layer 3 and the elastomer 4 are integrally injection-molded, it can also be completed through the above-mentioned injection mold. As Figure 7 shown, only a molding space for the elastomer 4 needs to be left between the side of the circuit board 1 and the lower mold 5. At this time, the molding surface of the upper mold 6, the molding surface of the lower mold 5, the side of the circuit board 1 where the light-emitting chip 2 is provided, and the side of the circuit board 1 enclose to form the cavity 7 of the injection mold. In some embodiments, when the material of the elastomer 4 and the material of the encapsulation layer 3 are the same, they need to be light-transmitting materials, such as but not limited to epoxy resin and silicone resin. Epoxy resin and silicone resin not only have good optical properties after curing, but also have certain elasticity.

[0050] In some embodiments, as Figure 8 shown, the elastomer 4 can be annularly enclosed around the four side surfaces of the circuit board 1, that is, the elastomer 4 is an integral structure. The integral structure of the elastomer 4 can reduce the processing steps. In some application scenarios, as Figure 9 , Figure 10 shown, the elastomer 4 can include elastic units respectively provided on the four side surfaces of the circuit board 1, and the elastic units are separated from each other. The forces between the separated elastic units will not affect each other. The elastomer 4 in this embodiment can be provided on the side of the circuit board 1 by but not limited to bonding, molding, and injection molding.

[0051] In the above display panel, the elastomer 4 is provided on the four side surfaces of the circuit board 1. After the circuit board 1 expands due to heat, as Figure 14As shown in the figure, the circuit board 1 compresses the elastomer 4, causing the elastomer 4 to deform. The deformation of the elastomer 4 compensates for the elongation of the circuit board 1. That is, when the circuit board 1 elongates, the elastomer 4 will be compressed and thinned, ensuring the stability of the overall dimensions, preventing mutual extrusion between two adjacent spliced circuit boards 1, solving the deformation problem caused by extrusion, and improving the display effect of the display panel.

[0052] Another optional embodiment of the present application:

[0053] This embodiment provides a method for manufacturing a display panel as described above. Figure 11 , including the following steps:

[0054] S1: Bond a light-emitting chip on the circuit board so that the electrodes of the light-emitting chip are electrically connected to the driving circuit.

[0055] S2: Provide a packaging layer covering the light-emitting chip on the circuit board, and provide an elastomer on the peripheral side surfaces of the circuit board.

[0056] In this embodiment, the packaging layer 3 covering the light-emitting chip 2 can be provided on the circuit board 1 first, and then the elastomer 4 can be provided on the peripheral side surfaces of the circuit board 1. It is also possible to first provide the elastomer 4 on the peripheral side surfaces of the circuit board 1, and then provide the packaging layer 3 covering the light-emitting chip 2 on the circuit board 1. It is also possible to form the packaging layer 3 and the elastomer 4 on the circuit board 1 simultaneously. For example, when the materials of the packaging layer 3 and the elastomer 4 are the same, the step of providing the packaging layer 3 covering the light-emitting chip 2 on the circuit board 1 and providing the elastomer 4 on the peripheral side surfaces of the circuit board 1 includes:

[0057] Form the integrated packaging layer 3 and the elastomer 4 through an injection molding process.

[0058] Integrated injection molding not only simplifies the manufacturing steps of the display panel, but also can avoid the generation of air bubbles in the packaging layer 3, optimizes the display effect, has higher injection molding precision, and improves the product quality. Moreover, when manufacturing, the circuit board 1 can be made into the required size and then injection molded. The size formed after injection molding is the product size, and there is no need for cutting processing, avoiding the situation where the product quality is poor after cutting due to the different hardnesses of the circuit board 1 and the packaging layer 3.

[0059] In the method for manufacturing the above display panel, an elastomer 4 is provided on the peripheral side surfaces of the circuit board 1. After the circuit board 1 expands due to heat, the circuit board 1 will compress the elastomer 4 to cause the elastomer 4 to deform. The deformation of the elastomer 4 compensates for the elongation of the circuit board 1, that is, when the circuit board 1 elongates, the elastomer 4 will be compressed and thinned, ensuring the stability of the overall dimensions, preventing mutual extrusion between two adjacent spliced circuit boards 1, solving the deformation problem caused by extrusion, and improving the display effect of the display panel.

[0060] Another optional embodiment of the present application:

[0061] This embodiment provides a spliced display screen, such as Figures 12-14 shown, including at least two spliced display panels as described above, and there is an elastomer 4 between the circuit boards 1 on adjacent display panels.

[0062] In one embodiment, the spliced display screen further includes a box body, and the display panels are spliced and arranged on the box body.

[0063] In another embodiment, the spliced display screen further includes a frame 9, and the display panels are arranged inside the frame 9.

[0064] The spliced display screen in this embodiment can be applied to the fields of home display, medical display, decorative display, traffic display, advertising display, etc. The above applications are only several applications exemplified by this embodiment, and the application of the display panel in this embodiment is not limited to the several fields exemplified above. Specifically, the display panel or spliced display screen in this embodiment can be applied to display devices such as televisions, mobile phones, in-vehicle displays, AR, and VR.

[0065] The display panel in the above spliced display screen is provided with an elastomer 4, and the elastomer 4 is provided on the peripheral side surfaces of the circuit board 1, such as Figure 13 , Figure 14 shown. After the circuit board 1 expands due to heat, the circuit board 1 will compress the elastomer 4 to cause the elastomer 4 to deform. The deformation of the elastomer 4 compensates for the elongation of the circuit board 1, that is, when the circuit board 1 elongates, the elastomer 4 will be compressed and thinned, ensuring the stability of the overall dimensions, preventing mutual extrusion between two adjacent spliced circuit boards 1, solving the deformation problem caused by extrusion, and improving the display effect of the spliced display screen.

[0066] It should be understood that the application of the present application is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present application.

Claims

1. A display panel, characterized in that, comprising: a circuit board, the circuit board including a driving circuit; a light-emitting chip disposed on the circuit board, electrodes of the light-emitting chip being electrically connected to the driving circuit; a packaging layer covering the light-emitting chip; and an elastomer disposed on the peripheral side surfaces of the circuit board, the elastomer being configured to be compressed and deformed by the thermally expanded circuit board and to recover its deformation after the circuit board contracts.

2. The display panel according to claim 1, characterized in that, the elastomer completely covers the side surface of the circuit board.

3. The display panel according to claim 1, characterized in that, a surface of the elastomer away from the circuit board is flush with a side surface of the packaging layer; alternatively, the elastomer covers the side surface of the circuit board and the side surface of the packaging layer.

4. The display panel according to claim 1, characterized in that, the packaging layer and the elastomer are integrally injection-molded.

5. The display panel according to any one of claims 1-4, characterized in that, the elastomer is annularly enclosed around the peripheral side surfaces of the circuit board.

6. The display panel according to any one of claims 1-4, characterized in that, the elastomer includes elastic units respectively disposed on four side surfaces of the circuit board, and the elastic units are separated from each other.

7. The display panel according to any one of claims 1-4, characterized in that, a thickness of the elastomer in a direction perpendicular to the side surface of the circuit board is 1 mm to 10 mm.

8. A method for manufacturing a display panel, for manufacturing the display panel according to any one of claims 1-7, characterized in that, comprising: bonding the light-emitting chip on the circuit board so that electrodes of the light-emitting chip are electrically connected to the driving circuit; providing a packaging layer covering the light-emitting chip on the circuit board and providing the elastomer on the peripheral side surfaces of the circuit board.

9. The method for manufacturing a display panel according to claim 8, characterized in that, the providing a packaging layer covering the light-emitting chip on the circuit board and providing the elastomer on the peripheral side surfaces of the circuit board includes: forming the integrally formed packaging layer and the elastomer by an injection molding process.

10. A spliced display screen, characterized in that, comprising at least two spliced display panels according to any one of claims 1-7, and there is the elastomer between the circuit boards on adjacent display panels.

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