Fine circuit imprinting method of flexible circuit board

Abstract

The invention belongs to the technical field of circuit board printing and manufacturing, and provides a fine circuit imprinting method of a flexible circuit board, which comprises the following steps of: pretreating a substrate of the flexible circuit board and placing the substrate in an imprinting device; in the coining process, pressure and temperature borne by the flexible circuit board substrate are obtained through a sensor, and a temperature distribution diagram and a pressure distribution diagram are generated; obtaining a constant-state pressure balance value according to the temperature distribution diagram and the pressure distribution diagram; according to the constant-state pressure balance value, forced cooling or natural cooling is carried out on the printed flexible circuit board substrate. According to the circuit imprinting method provided by the embodiment of the invention, temperature and pressure imbalance caused by local temperature difference and non-uniform thermal expansion can be avoided, so that the quality and the stability of the flexible circuit board are guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a fine circuit imprinting method for flexible printed circuit boards. Background Art

[0002] During the manufacturing process of flexible printed circuit boards, changes in temperature and pressure do have a crucial impact on the performance of the substrate. Due to thermal expansion and thermal contraction, the substrate may undergo different degrees of thermal deformation in different regions. Especially in the case of uneven temperature distribution, it may cause uneven thermal expansion in local areas, resulting in stress on the surface or inside of the substrate. These stresses not only reduce the mechanical properties of the substrate but may also cause cracks, affecting its long-term stability.

[0003] When the substrate expands or contracts under the action of heating and pressure, especially in some sensitive areas, the formation and expansion of cracks may be very serious, especially when these cracks gradually expand over time and repeated imprinting. This crack expansion will ultimately affect the integrity of the circuit and may even cause serious faults such as short circuits, resulting in the scrapping of the entire circuit board. Therefore, in the manufacturing process, temperature control and uniform distribution of pressure are particularly important.

[0004] In addition, the changes caused by temperature and pressure may also affect other key links in the integrated circuit (IC) manufacturing process. Especially in processes such as lithography and etching, precise temperature control and pressure management are crucial to ensure the good operation of the equipment. For example, when producing semiconductor device equipment such as dedicated lithography machines and etching machines, the heat treatment link in the manufacturing process must be controlled very precisely to avoid uneven thermal expansion of the materials inside the equipment, thereby affecting the overall accuracy and lifespan of the equipment. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems in the related art to some extent. For this purpose, the object of the present invention is to propose a fine circuit imprinting method for flexible printed circuit boards, which can avoid the temperature-pressure imbalance caused by local temperature difference and uneven thermal expansion, thereby ensuring the quality and stability of flexible printed circuit boards;

[0006] To achieve the above object, an embodiment of the present invention proposes a fine circuit imprinting method for flexible printed circuit boards, and the method includes the following steps:

[0007] S100, pre-treat the flexible printed circuit board substrate and place it in an imprinting device;

[0008] S200, during the imprinting process, obtain the pressure and temperature received by the flexible printed circuit board substrate through a sensor, and generate a temperature distribution map and a pressure distribution map;

[0009] S300. Obtain the steady-state pressure balance value according to the temperature distribution map and the pressure distribution map;

[0010] S400. Judge whether to perform forced cooling or natural cooling on the flexible circuit board substrate after imprinting according to the steady-state pressure balance value.

[0011] According to the circuit imprinting method of the embodiment of the present invention, it is possible to avoid the temperature-pressure imbalance caused by local temperature difference and uneven thermal expansion, thereby ensuring the quality and stability of the flexible circuit board.

[0012] In step S100, the pretreatment of the flexible circuit board substrate and placing it in the imprinting device includes:

[0013] Specifically, the pretreatment process includes cleaning the surface of the substrate to remove impurities, oil stains or dust to ensure the accuracy and reliability of the circuit during the transfer process. The suitable flexible circuit board substrate is a substrate with appropriate thickness, flexibility and surface finish, which can reduce the occurrence of deformation, cracking or uneven transfer under high temperature and high pressure environments.

[0014] Furthermore, after confirming that the substrate meets the requirements of microcircuit transfer, place it in the imprinting device.

[0015] Since the flexible circuit board substrate will undergo thermal expansion or thermal contraction during the heating process, especially when the local imprinting temperature is too high, the local temperature difference of the flexible circuit board substrate will cause uneven thermal expansion in different regions, resulting in an internal temperature-pressure imbalance, increasing the vulnerability of the flexible circuit board substrate. After imprinting, the uneven heating of the flexible circuit board substrate causes the expansion of imprinting temperature cracks, resulting in the scrapping of the flexible circuit board substrate; among them, the expansion of imprinting temperature cracks refers to the phenomenon that during hot imprinting or imprinting, due to the combined action of temperature change and pressure, cracks appear in the flexible material and the cracks further expand over time and pressure; to solve the above problems, the present invention proposes step S200;

[0016] In step S200, during the imprinting process, obtain the pressure and temperature received by the flexible thin-film pressure sensor through the sensor, and generate a temperature distribution map and a pressure distribution map, including:

[0017] Among them, the sensor includes a temperature sensor and a flexible thin-film pressure sensor. The temperature sensor is used to obtain the temperature of the flexible circuit board substrate, and the flexible thin-film pressure sensor is used to obtain the pressure received by the flexible thin-film pressure sensor;

[0018] Obtain the temperature distribution map and pressure distribution map of the flexible circuit board substrate at every other time interval L to obtain H temperature distribution maps and H pressure distribution maps, where the time interval L is set to [1, 10] seconds; denote TTW(Li) as the average temperature value of the temperature distribution map of the flexible circuit board substrate at time Li, and TTY(Li) as the average pressure value of the pressure distribution map at time Li, where Li = [(i - 1)*L, i*L], i = 1, 2, …, H, H ∈ [5, 100], and i is the time interval serial number; among them, when i = 1, Li represents the L-th second, …, when i = H, it represents the L×H-th second. Denote the median of all TTW(Li) as TSM, and the median of all TTY(Li) as YSM;

[0019] Further, in step S300, obtaining the steady-state pressure balance value according to the temperature distribution map and the pressure distribution map includes the following steps:

[0020] S301, obtain the steady-state temperature through the temperature distribution map and the pressure distribution map;

[0021] Perform the same grid division on all temperature distribution maps and pressure distribution maps through the grid division algorithm. The grid size is one-thousandth of the temperature distribution map and the pressure distribution map. Divide the temperature distribution map and the pressure distribution map into K grids, where K = 1000. Denote the temperature value of the j-th grid of the temperature distribution map at time Li as s(Li, j), and the pressure value of the j-th grid of the pressure distribution map at time Li as v(Li, j). The value range of j is [1, K], and K is the number of grids after the division of the temperature distribution map and the pressure distribution map; obtain the median of the temperature values in each grid of the temperature distribution map at time Li and denote it as ZD(i). Denote the mean value of ZD(i) as the steady-state temperature ZDZ;

[0022] Among them, the steady-state temperature is a stable and balanced temperature value obtained through the grid division of the temperature distribution map and the median of the temperature of each temperature distribution map. During the embossing process, too high or too low temperature will cause thermal expansion or contraction of the material, and then generate thermal stress. If the steady-state temperature is relatively too high, it will lead to local deformation and thermal stress accumulation of the substrate material, and then induce the formation or expansion of embossing-temperature cracks. The crack propagation situation of the flexible circuit board substrate after embossing can be evaluated by combining the steady-state temperature with the pressure condition of the flexible circuit board substrate.

[0023] S302, screen out the pressure condensation grid and the temperature condensation grid;

[0024] For each grid in the temperature distribution map and the pressure distribution map, calculate the sum of all average pressure values within the time period from L1 to LH to obtain the total pressure value, and denote the total pressure value of the j-th grid as SFD(j). Among all the grids, find the grid with the largest total pressure value, which is denoted as the pressure condensation grid, and obtain the average value TFDK of the pressure values of the pressure condensation grid in each pressure distribution map; for each grid, calculate the sum of all average temperature values within the time period from L1 to LH to obtain the total temperature value, and denote the total temperature value of the j-th grid as VFD(j). Among all the grids, find the grid with the largest total temperature value, which is denoted as the temperature condensation grid, and denote the average value VFDK of the temperature values of the temperature condensation grid in each temperature distribution map;

[0025] S303, calculate the steady-state pressure balance value through the pressure condensation grid and the temperature condensation grid;

[0026] Calculate the steady-state pressure balance value MUIY, where the value of the steady-state pressure balance value MUIY is the average value TFDK of the pressure values of the pressure condensation grid in each pressure distribution map plus the embossed crack traction pressure value PTK, where the embossed crack traction pressure value PTK is the median YSM of each average pressure in all TTY(Li) multiplied by the temperature traction coefficient U, where the temperature traction coefficient is |1 - ZDZ / 2(VFDK + TSM)|.

[0027] Among them, the steady-state pressure balance value is a physical quantity used to evaluate the interaction between temperature and pressure during the imprinting process of flexible printed circuit boards. The principle of the steady-state pressure balance value is to reflect the influence of temperature changes on the pressure distribution by combining the average pressure value of the pressure condensation grid and the temperature traction coefficient, and to judge whether crack propagation or other adverse effects may occur during the imprinting process by fitting the relationship between pressure and temperature. Further, the temperature traction coefficient is a coefficient used to quantify the traction effect of temperature changes on the pressure of materials, and is used to reflect the influence of local temperature changes on stress and pressure distributions.

[0028] The beneficial effects of this step are as follows: By comprehensively considering the interaction between temperature and pressure to calculate the steady-state pressure balance value MUIY, the problems of uneven thermal expansion and stress concentration caused by local temperature differences during the imprinting process can be effectively solved. In traditional imprinting processes, only the control of pressure or temperature is often focused on, ignoring the coupling effect between the two. However, MUIY not only accurately evaluates the influence of temperature changes in the local area on the pressure distribution by introducing the temperature traction coefficient and the average pressure value of the pressure condensation grid, but also predicts the risk of crack propagation in the material caused by temperature differences. When the combination of temperature and pressure is inappropriate, it can be determined through MUIY whether forced cooling needs to be triggered to avoid crack generation. This method ensures the uniformity and stability of the flexible printed circuit board substrate in high-temperature and high-pressure environments by accurately analyzing the temperature and pressure equilibrium state, fundamentally reducing the propagation of temperature-pressure cracks in the material and improving the reliability and durability of the finished product.

[0029] S400. Judge whether to perform forced cooling or natural cooling on the imprinted flexible printed circuit board substrate according to the steady-state pressure balance value.

[0030] Compare the magnitudes of MUIY and YSM. If MUIY ≥ YSM, it indicates that under the current temperature and pressure combination, there are conflicts between temperature and pressure or local temperature and pressure are too high, and there is a risk of crack propagation. Forced cooling needs to be performed on the imprinted flexible printed circuit board to avoid more serious propagation of temperature-pressure cracks. The methods of forced cooling include: using a fan or a cooling air system to blow hot air onto the surfaces of the substrate and the mold to accelerate cooling, absorbing the heat of the substrate and the mold through circulating coolant for accelerated cooling, or directly placing the mold or the substrate on a cooling bed for rapid cooling through contact conduction.

[0031] If MUIY < YSM, the imprinted flexible printed circuit board is naturally cooled.

[0032] Specifically, when MUIY < YSM, it indicates that the current temperature and pressure distribution have reached a relatively balanced state, and there are no obvious temperature and pressure conflicts. If forced cooling is performed in this case, the temperature of the flexible printed circuit board will suddenly drop, resulting in excessive temperature differences inside the material, interfering with the uniform expansion or contraction process of the material, and this rapid temperature change will instead break the stable state of temperature and pressure, leading to crack generation and even affecting the performance and stability of the circuit. Therefore, when MUIY < YSM, natural cooling can ensure that the flexible printed circuit board can be naturally cooled under appropriate temperature and pressure conditions, reducing unnecessary mechanical stress and thermal stress.

[0033] The beneficial effects of the present invention are as follows: By optimizing the temperature field distribution and pressure co-regulation mechanism, the phenomenon of temperature-pressure imbalance caused by local temperature difference and thermal expansion coefficient difference during the processing can be effectively suppressed. In the manufacturing process of semiconductor device special equipment, this imprinting method can dynamically compensate for the nanoscale deformation deviation of flexible circuit boards, improving the imprinting accuracy of sub-micron circuit patterns. For the manufacturing of key components of etching machines, this thermal expansion equilibrium control technology can reduce the risk of micro-deformation of plasma chamber materials in high-temperature etching environments, thereby ensuring the uniformity of atomic layer etching processes. This innovative method realizes the thermodynamic co-control of the entire process by establishing a multi-physical field coupling model, meeting the thermal matching requirements of the heterogeneous integration of flexible substrates and silicon-based chips in advanced packaging technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The figure shows a flowchart of a fine line imprinting method for a flexible printed circuit board. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0036] Figure 1 The figure shows a flowchart of a fine line imprinting method for a flexible printed circuit board.

[0037] Referring to Figure 1 , the present invention provides a fine line imprinting method for a flexible printed circuit board, and the method includes the following steps:

[0038] S100, pre-treat the flexible printed circuit board substrate and place it in an imprinting device;

[0039] S200, during the imprinting process, obtain the pressure and temperature of the flexible printed circuit board substrate through sensors, and generate a temperature distribution map and a pressure distribution map;

[0040] S300, obtain the steady-state pressure balance value according to the temperature distribution map and the pressure distribution map;

[0041] S400, determine whether to perform forced cooling or natural cooling on the imprinted flexible printed circuit board substrate according to the steady-state pressure balance value.

[0042] According to the line imprinting method of the embodiments of the present invention, the temperature-pressure imbalance caused by local temperature difference and uneven thermal expansion can be avoided, thereby ensuring the quality and stability of the flexible printed circuit board.

[0043] In step S100, the pretreatment of the flexible printed circuit board substrate and placing it in the imprinting device includes:

[0044] Specifically, the pretreatment process includes cleaning the surface of the substrate to remove impurities, oil stains or dust to ensure the accuracy and reliability of the circuit during the transfer process. A suitable flexible printed circuit board substrate is a substrate with appropriate thickness, flexibility and surface finish, which can reduce the occurrence of deformation, cracking or uneven transfer under high temperature and high pressure environments.

[0045] Furthermore, after confirming that the substrate meets the requirements for microcircuit transfer, it is placed in the imprinting device.

[0046] Since the flexible printed circuit board substrate will undergo thermal expansion or thermal contraction during the heating process, especially when the local imprinting temperature is too high, the local temperature difference of the flexible printed circuit board substrate will cause uneven thermal expansion in different regions, resulting in an imbalance in internal temperature and pressure, increasing the vulnerability of the flexible printed circuit board substrate. After the imprinting is completed, the uneven heating of the flexible printed circuit board substrate causes the expansion of the imprint temperature cracks, leading to the scrapping of the flexible printed circuit board substrate; among them, the expansion of the imprint temperature cracks refers to the phenomenon that during the hot imprinting or imprinting process, due to the combined action of temperature change and pressure, cracks appear in the flexible material and the cracks further expand with time and pressure. To solve the above problems, the present invention proposes step S200;

[0047] In step S200, during the imprinting process, the pressure and temperature received by the flexible printed circuit board substrate are obtained through sensors, and the temperature distribution map and pressure distribution map are generated, including:

[0048] The temperature distribution map and pressure distribution map of the flexible printed circuit board substrate are obtained at every time interval L to obtain H temperature distribution maps and H pressure distribution maps, where the time interval L is set to [3] seconds; denote TTW(Li) as the average temperature value of the temperature distribution map of the flexible printed circuit board substrate at time Li, and TTY(Li) as the average pressure value of the pressure distribution map at time Li, where Li = [(i - 1)*L, i*L], i = 1, 2,..., H, H is 50, and i is the time interval serial number; among them, when i = 1, Li represents the Lth second,..., when i = H, it represents the L×Hth second. Denote the median of all TTW(Li) as TSM, and the median of all TTY(Li) as YSM;

[0049] Furthermore, in step S300, obtaining the steady-state pressure balance value according to the temperature distribution map and pressure distribution map includes the following steps:

[0050] S301, obtaining the steady-state temperature through the temperature distribution map and pressure distribution map;

[0051] Perform the same mesh division on all temperature distribution maps and pressure distribution maps through a mesh division algorithm. The mesh size is one-thousandth of the temperature distribution map and the pressure distribution map. Divide the temperature distribution map and the pressure distribution map into K meshes, where K = 1000. Let s(Li, j) represent the temperature value of the j-th mesh of the temperature distribution map at time Li, and let v(Li, j) represent the pressure value of the j-th mesh of the pressure distribution map at time Li. The value range of j is [1, K], and K is the number of meshes after the division of the temperature distribution map and the pressure distribution map; Obtain the median of the temperature values in each mesh of the temperature distribution map at time Li and denote it as ZD(i). Denote the mean value of ZD(i) as the steady-state temperature ZDZ;

[0052] S302. Screen out the pressure condensation mesh and the temperature condensation mesh;

[0053] For each mesh of the temperature distribution map and the pressure distribution map, calculate the sum of all average pressure values within the time period from L1 to LH to obtain the total pressure value, and use SFD(j) to represent the total pressure value of the j-th mesh. Among all meshes, find the mesh with the largest total pressure value, denote it as the pressure condensation mesh, and obtain the average value TFDK of the pressure values of the pressure condensation mesh in each pressure distribution map; For each mesh, calculate the sum of all average temperature values within the time period from L1 to LH to obtain the total temperature value, and use VFD(j) to represent the total temperature value of the j-th mesh. Among all meshes, find the mesh with the largest total temperature value, denote it as the temperature condensation mesh, and denote the average value VFDK of the temperature values of the temperature condensation mesh in each temperature distribution map;

[0054] S303. Calculate the steady-state pressure balance value through the pressure condensation mesh and the temperature condensation mesh;

[0055] Calculate the steady-state pressure balance value MUIY, where the value of the steady-state pressure balance value MUIY is the average value TFDK of the pressure values of the pressure condensation mesh in each pressure distribution map plus the embossed crack traction pressure value PTK, where the embossed crack traction pressure value PTK is the median YSM of each average pressure in all TTY(Li) multiplied by the temperature traction coefficient U, and the temperature traction coefficient is |1 - ZDZ / 2(VFDK + TSM)|.

[0056] Among them, the steady-state pressure balance value is a physical quantity used to evaluate the interaction between temperature and pressure during the imprinting process of a flexible printed circuit board. The principle of the steady-state pressure balance value is to reflect the influence of temperature change on pressure distribution by combining the average pressure value of the pressure condensation grid and the temperature traction coefficient, and to judge whether crack propagation or other adverse effects may occur during the imprinting process by fitting the relationship between pressure and temperature. Further, the temperature traction coefficient is a coefficient used to quantify the traction effect of temperature change on the material pressure, and is used to reflect the influence of local temperature change on stress and pressure distribution.

[0057] S400, judge whether to perform forced cooling or natural cooling on the imprinted flexible circuit board substrate according to the steady-state pressure balance value;

[0058] Compare the magnitudes of MUIY and YSM. If MUIY ≥ YSM, it indicates that under the current temperature and pressure combination, there is a conflict between temperature and pressure or the local temperature and pressure are too high, which is likely to cause crack propagation. Therefore, it is necessary to perform forced cooling on the imprinted flexible circuit board to avoid more serious pressure-temperature crack propagation. The forced cooling methods include: using a fan or a cooling air system to blow hot air onto the substrate and mold surfaces to accelerate cooling, absorbing the heat of the substrate and mold through circulating coolant for accelerated cooling, or directly placing the mold or substrate on a cooling bed for rapid cooling through contact conduction.

[0059] If MUIY < YSM, it means that the current temperature and pressure control is appropriate and forced cooling is not required, and the imprinted flexible circuit board is naturally cooled.

[0060] Note that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or in combination with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in combination with an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium include the following: an electrical connection part with one or more wirings (electronic device), a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or otherwise processing as appropriate, and then stored in a computer memory.

[0061] It should be understood that various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application specific integrated circuits having suitable combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0062] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0063] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0064] In addition, the terms "first", "second", etc. used in the embodiments of the present invention are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this embodiment. Thus, the features defined with the terms "first", "second", etc. in the embodiments of the present invention may explicitly or implicitly indicate that at least one such feature is included in this embodiment. In the description of the present invention, the meaning of the word "plurality" is at least two or more than two, such as two, three, four, etc., unless otherwise explicitly and specifically defined in the embodiment.

[0065] In the present invention, unless otherwise explicitly specified or limited in the embodiments, the terms "mounted", "connected", "connected" and "fixed" and the like appearing in the embodiments should be understood in a broad sense. For example, the connection may be a fixed connection, a detachable connection, or an integral body. It can be understood that it may also be a mechanical connection, an electrical connection, etc.; of course, it may also be directly connected, or indirectly connected through an intermediate medium, or it may be the communication inside two elements, or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific implementation circumstances.

[0066] In the present invention, unless otherwise explicitly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0067] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A fine circuit imprinting method for a flexible circuit board, characterized in that: The method comprises the following steps: S100, pre-processing the flexible circuit board substrate and placing it in an imprinting device; S200, obtaining the pressure and temperature of the flexible circuit board substrate through the sensor during the printing process, and generating a temperature distribution map and a pressure distribution map; S300, obtaining a constant pressure balance value according to the temperature distribution map and the pressure distribution map; S400, judging whether to perform forced cooling or natural cooling on the printed flexible circuit board substrate according to the constant pressure balance value.

2. The method according to claim 1, characterized in that In step S100 , the flexible circuit board substrate is pre-processed and placed in an imprinting device. The pre-processing process includes cleaning the substrate surface to remove impurities, oil stains or dust.

3. The method according to claim 1, characterized in that Step S200 includes: The temperature distribution map and pressure distribution map of the flexible circuit board substrate at every time interval L are obtained to obtain H temperature distribution maps and H pressure distribution maps, wherein the time interval L is set to [1, 10] seconds; TTW(Li) is denoted as the average temperature of the temperature distribution map of the flexible circuit board substrate at time Li, and TTY(Li) is denoted as the average pressure of the pressure distribution map at time Li, wherein Li = [(i-1)*L, i*L], i = 1, 2, ..., H, H∈[5, 100], and i is the time interval serial number; wherein, when i = 1, Li represents the Lth second, ..., when i = H, it represents the L×Hth second, the median of all TTW(Li) is denoted as TSM, and the median of all TTY(Li) is denoted as YSM.

4. The method according to claim 3, characterized in that In step S300, obtaining a constant pressure balance value according to the temperature distribution map and the pressure distribution map includes the following steps: S301, obtaining a constant temperature through a temperature distribution diagram and a pressure distribution diagram; S302, screening out a pressure condensation grid and a temperature condensation grid; S303, calculating a steady-state pressure balance value through a pressure condensation grid and a temperature condensation grid.

5. The method according to claim 4, characterized in that Step S301 includes: performing the same grid division on all temperature distribution diagrams and pressure distribution diagrams through a grid division algorithm, dividing the temperature distribution diagram and the pressure distribution diagram into K grids, where K=1000; obtaining the median of the temperature values ​​in each grid in the temperature distribution diagram at time Li and recording it as ZD(i), and recording the mean of ZD(i) as the constant temperature ZDZ.

6. The method according to claim 5, characterized in that Step S302 includes: for each grid of the temperature distribution diagram and the pressure distribution diagram, calculating the sum of all average pressure values ​​and the sum of all average temperature values ​​in the time period L1 to LH to obtain the total pressure value and the total temperature value; among all the grids, finding the grid with the largest total pressure value, recording it as the pressure condensation grid, and obtaining the average pressure value TFDK of the pressure condensation grid in each pressure distribution diagram; among all the grids, finding the grid with the largest total temperature value, recording it as the temperature condensation grid, and recording the average temperature value VFDK of the temperature condensation grid in each temperature distribution diagram.

7. The method according to claim 6, characterized in that In step S303, calculating the steady-state pressure balance value by using the pressure condensation grid and the temperature condensation grid includes: Calculate the steady-state pressure balance value MUIY, where the value of the steady-state pressure balance value MUIY is the average value TFDK of the pressure values ​​of the pressure condensation grid in each pressure distribution diagram plus the embossed crack traction pressure value PTK, where the embossed crack traction pressure value PTK is the median YSM of each average pressure in all TTY(Li) multiplied by the temperature traction coefficient.

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