Method and device for determining equipment temperature and electronic equipment

Abstract

The invention discloses an equipment temperature determination method and device and electronic equipment. The method comprises the following steps: receiving a temperature determination request of target equipment; in response to the temperature determination request, calling a target temperature function corresponding to the target equipment; determining actual equipment operation parameters corresponding to the target equipment; and determining the equipment temperature of the target equipment according to the actual equipment operation parameters and the target temperature function. The technical problems that when the size of the device is large, data collected by the sensor is inaccurate, the actual temperature around the heat dissipation device cannot be reflected, and normal operation of the heat dissipation device is affected are solved.

Description

Technical Field

[0001] The present invention relates to the field of data processing, and in particular, to a method, apparatus, and electronic device for determining the temperature of a device. Background Art

[0002] Determining the actual temperature around a heat dissipation device is an important step in evaluating the health status of a device and adjusting the heat dissipation strategy of the device. Currently, the method of collecting temperature data using a temperature sensor is mainly used to determine the actual temperature around the heat dissipation device. However, since the temperature sensor can only be fixed at a fixed position of the device, when the size of the heat dissipation device is large, the data collected by the sensor is inaccurate and can only reflect the local temperature of the device, resulting in the technical problem that the actual temperature around the heat dissipation device cannot be accurately determined, affecting the normal operation of the heat dissipation device.

[0003] In view of the above problems, no effective solution has been proposed yet. Summary of the Invention

[0004] Embodiments of the present invention provide a method, apparatus, and electronic device for determining the temperature of a device, so as to at least solve the technical problem that when the size of the device is large, the data collected by the sensor is inaccurate and cannot reflect the actual temperature around the heat dissipation device, affecting the normal operation of the heat dissipation device.

[0005] According to one aspect of the embodiments of the present invention, a method for determining the temperature of a device is provided, including: receiving a temperature determination request of a target device, where the temperature determination request is used to determine the device temperature of the target device, and the device size of the target device is greater than a predetermined size threshold; in response to the temperature determination request, retrieving a target temperature function corresponding to the target device, where the target temperature coefficient corresponding to the target temperature function is obtained based on a plurality of simulated device operation parameters and simulated temperature data respectively corresponding to the plurality of simulated device operation parameters, the plurality of simulated temperature data are obtained based on the plurality of simulated device operation parameters and a three-dimensional device model corresponding to the target device, the three-dimensional device model is provided with constraint conditions, and the constraint conditions include heat dissipation constraint of device materials and heat generation constraint of device loads; determining the actual device operation parameters corresponding to the target device; and determining the device temperature of the target device based on the actual device operation parameters and the target temperature function.

[0006] Optionally, before retrieving the target temperature function corresponding to the target device in response to the temperature determination request, the method further includes: obtaining a three-dimensional physical model corresponding to the target device; performing mesh division on the three-dimensional physical model to obtain a plurality of mesh regions; determining region models respectively corresponding to the plurality of mesh regions, where the region models are used to determine the region temperature of the corresponding mesh regions; and determining a three-dimensional device model corresponding to the target device based on the plurality of region models.

[0007] Optionally, determining the three-dimensional device model corresponding to the target device according to multiple regional models includes: determining, according to the multiple regional models, the regional simulated temperatures corresponding to the multiple grid regions when corresponding simulated device operation parameters are set; obtaining the regional actual temperatures corresponding to the multiple grid regions when the target device is set with the corresponding simulated device operation parameters; obtaining error values corresponding to the multiple regional simulated temperatures according to the multiple regional simulated temperatures and the regional actual temperatures corresponding to the multiple regional simulated temperatures respectively; and determining the three-dimensional device model corresponding to the target device according to the multiple regional models when all the multiple error values are lower than an error threshold.

[0008] Optionally, before invoking the target temperature function corresponding to the target device in response to the temperature determination request, it further includes: determining an initial temperature function, where the initial temperature function is a temperature function set with an initial temperature coefficient; obtaining the target temperature coefficient according to the multiple simulated device operation parameters and the simulated temperature data corresponding to the multiple simulated device operation parameters respectively; and determining the target temperature function corresponding to the target device according to the target temperature coefficient and the initial temperature function.

[0009] Optionally, obtaining the target temperature coefficient according to the multiple simulated device operation parameters and the simulated temperature data corresponding to the multiple simulated device operation parameters respectively includes: obtaining an updated temperature coefficient according to the multiple simulated device operation parameters and the simulated temperature data corresponding to the multiple simulated device operation parameters respectively; determining the updated temperature data corresponding to the multiple simulated device operation parameters according to an updated temperature function, where the updated temperature function is a function obtained by updating the initial temperature coefficient of the initial temperature function to be the updated temperature coefficient; obtaining the actual temperature data corresponding to the multiple simulated device operation parameters respectively; determining a similarity value corresponding to the updated temperature function according to the multiple updated temperature data and the actual temperature data corresponding to the multiple updated temperature data respectively; and determining the target temperature coefficient according to the updated temperature coefficient when the similarity value is greater than a similarity threshold.

[0010] Optionally, determining the three-dimensional device model corresponding to the target device according to multiple regional models includes: obtaining the device parameters corresponding to the target device; determining the constraint conditions corresponding to the target device according to the device parameters; and determining the three-dimensional device model corresponding to the target device according to the constraint conditions and the multiple regional models.

[0011] Optionally, determining the device temperature of the target device according to the actual device operating parameters and the target temperature function includes: when the actual device operating parameters include environmental parameters, determining an environmental correction factor; updating the target temperature function according to the environmental correction factor to obtain a corrected temperature function; and determining the device temperature of the target device according to the corrected temperature function and the actual device operating parameters.

[0012] According to one aspect of an embodiment of the present invention, there is provided a device for determining device temperature, including: a receiving module, configured to receive a temperature determination request of a target device, where the temperature determination request is used to determine the device temperature of the target device, and the device size corresponding to the target device is greater than a predetermined size threshold; a response module, configured to, in response to the temperature determination request, retrieve the target temperature function corresponding to the target device, where the target temperature coefficient corresponding to the target temperature function is obtained according to a plurality of simulated device operating parameters and simulated temperature data respectively corresponding to the plurality of simulated device operating parameters, the plurality of simulated temperature data are obtained according to the plurality of simulated device operating parameters and a three-dimensional device model corresponding to the target device, and the three-dimensional device model is provided with constraint conditions, and the constraint conditions include device material heat dissipation constraints and device load heat generation constraints; a first determination module, configured to determine the actual device operating parameters corresponding to the target device; and a second determination module, configured to determine the device temperature of the target device according to the actual device operating parameters and the target temperature function.

[0013] According to one aspect of an embodiment of the present invention, there is provided an electronic device, including: a processor; and a memory for storing instructions executable by the processor; wherein the processor is configured to execute the instructions to implement the method for determining device temperature as described above.

[0014] According to one aspect of an embodiment of the present invention, there is provided a computer-readable storage medium, when instructions in the computer-readable storage medium are executed by a processor of an electronic device, enabling the electronic device to execute the method for determining device temperature as described above.

[0015] In an embodiment of the present invention, a temperature determination request of a target device is received, where the temperature determination request is used to determine the device temperature of the target device, and the device size corresponding to the target device is greater than a predetermined size threshold; in response to the temperature determination request, a target temperature function corresponding to the target device is retrieved, where the target temperature coefficient corresponding to the target temperature function is obtained based on a plurality of simulated device operating parameters and simulated temperature data respectively corresponding to the plurality of simulated device operating parameters, and the plurality of simulated temperature data are obtained based on the plurality of simulated device operating parameters and a three-dimensional device model corresponding to the target device, and the three-dimensional device model is provided with constraint conditions, and the constraint conditions include a device material heat dissipation constraint and a device load heat generation constraint; an actual device operating parameter corresponding to the target device is determined; and a device temperature of the target device is determined according to the actual device operating parameter and the target temperature function. By retrieving the target temperature function corresponding to the target device, the purpose of determining the device temperature of the target device according to the actual device operating parameter and the target temperature function is achieved. Since the target temperature function can reflect the functional relationship between the device temperature and the device operating parameter, therefore, the actual temperature of the device can be accurately determined according to the actual device operating parameter, and further, the technical problem that when the device size is large, the data collected by the sensor is inaccurate and cannot reflect the actual temperature around the heat dissipation device, affecting the normal operation of the heat dissipation device is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention, and constitute a part of this application. The schematic embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 is a flowchart of a method for determining the device temperature according to an embodiment of the present invention;

[0018] Figure 2 is a comparison chart of the measured temperature value and the simulated temperature value under the same working condition provided by an alternative embodiment of the present invention;

[0019] Figure 3 is a transformer structure diagram provided by an alternative embodiment of the present invention;

[0020] Figure 4 is a schematic diagram of transformer temperature monitoring points provided by an alternative embodiment of the present invention;

[0021] Figure 5 is a transformer device temperature curve graph under different working conditions provided by an alternative embodiment of the present invention;

[0022] Figure 6 is a transformer monitoring point temperature curve graph under different working conditions provided by an alternative embodiment of the present invention;

[0023] Figure 7 It is a structural block diagram of a device temperature determination device according to an embodiment of the present invention. Detailed implementation manners

[0024] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order different from those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0026] Embodiment 1

[0027] According to an embodiment of the present invention, an embodiment of a method for determining the temperature of a device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order from that here.

[0028] Figure 1 It is a flowchart of a method for determining the temperature of a device according to an embodiment of the present invention. As Figure 1 shown, the method includes the following steps:

[0029] Step S102, receiving a temperature determination request of a target device, where the temperature determination request is used to determine the device temperature of the target device, and the device size corresponding to the target device is greater than a predetermined size threshold.

[0030] In step S102 provided in the present application, a temperature determination request of a target device is received.

[0031] Among them, the target device is involved. The target device refers to a device whose temperature needs to be monitored or controlled, and the device size of the target device is usually large.

[0032] Among them, a temperature determination request is involved. The temperature determination request refers to an instruction or signal for requesting to obtain the current device temperature of the target device.

[0033] Among them, the device temperature is involved. The device temperature refers to the average temperature around the target device.

[0034] Among them, a predetermined size threshold is involved. The predetermined size threshold refers to a preset size parameter used to distinguish devices according to the device size to determine the target device that requires a more refined temperature monitoring scheme.

[0035] In this step, first, a temperature determination request of the target device is received. Since the device size of the target device exceeds the predetermined size threshold, its heat dissipation and temperature distribution are more complex than those of small-sized devices. Therefore, traditional temperature monitoring methods cannot provide sufficiently accurate temperature data. Receiving the temperature determination request of the target device is a basic step for determining the accurate device temperature of the target device.

[0036] Step S104: In response to the temperature determination request, retrieve the target temperature function corresponding to the target device. Among them, the target temperature coefficient corresponding to the target temperature function is obtained based on multiple simulated device operation parameters and the simulated temperature data respectively corresponding to the multiple simulated device operation parameters. The multiple simulated temperature data are obtained based on the multiple simulated device operation parameters and the three-dimensional device model corresponding to the target device. The three-dimensional device model is set with constraint conditions, and the constraint conditions include the heat dissipation constraint of the device material and the heat generation constraint of the device load.

[0037] In step S104 provided in the present application, the target temperature function corresponding to the target device is retrieved.

[0038] Among them, the target temperature function is involved. The target temperature function refers to a mathematical model used to predict the device temperature according to the device operation parameters. It takes different operation parameters, such as device load, ambient temperature, and monitoring point temperature, as inputs and outputs the temperature prediction value of the device.

[0039] Among them, the target temperature coefficient is involved. The target temperature coefficient refers to the value used to quantify the influence degree of the device operation parameters on the device temperature in the target temperature function. These coefficients are obtained through numerical simulation and statistical analysis, reflecting the influence of the physical characteristics and operation conditions of the device on the temperature.

[0040] Among them, the simulated device operation parameters are involved. The simulated device operation parameters refer to the virtual operation conditions introduced through numerical simulation software when using the three-dimensional device model to simulate the operation state of the target device under different working conditions to construct the target temperature function, such as device load, ambient temperature, and monitoring point temperature.

[0041] Among them, simulated temperature data is involved. Simulated temperature data refers to the temperature distribution of the device calculated according to the given simulated device operation parameters when using a three-dimensional device model to simulate the operation state of the target device under different working conditions to construct a target temperature function, and the average temperature value around the device obtained therefrom.

[0042] Among them, a three-dimensional device model is involved. The three-dimensional device model refers to a digital model based on the actual geometric structure and physical characteristics of the target device, which is used to analyze the thermal behavior of the device in numerical simulation.

[0043] Among them, constraint conditions are involved. Constraint conditions refer to the physical limitations or assumptions set when establishing the three-dimensional device model. For example, the heat dissipation constraint of the device material, the heat generation constraint of the device load, etc., which are used to ensure the accuracy and realism of the model.

[0044] Among them, the heat dissipation constraint of the device material is involved. The heat dissipation constraint of the device material refers to the maximum heat dissipation capacity of the device material under given conditions. When the device is operating, it will dissipate heat to the surrounding environment through its material surface, but this heat dissipation ability is limited by the material characteristics and environmental conditions.

[0045] Among them, the heat generation constraint of the device load is involved. The heat generation constraint of the device load refers to the heat that the device can generate under different load levels. When the device is operating, its internal components will generate heat, and this part of the heat is proportional to the load of the device.

[0046] In this step, after receiving the temperature determination request of the target device, in response to this request, the target temperature function corresponding to the target device is called. Since the target temperature function can reflect the functional relationship between the device operation parameters and the device temperature of the target device, through this step, the accuracy of temperature monitoring can be improved.

[0047] It should be noted that the target temperature function can be adaptively adjusted according to the change of environmental conditions to ensure that the device temperature can be accurately predicted under different external conditions, and the adaptability and flexibility of the system are improved. Combining with the Internet of Things technology, the target temperature function can be utilized by the remote monitoring system to realize the temperature prediction and management of the remote device.

[0048] Step S106, determine the actual device operation parameters corresponding to the target device.

[0049] In step S106 provided in this application, the actual device operation parameters corresponding to the target device are determined.

[0050] Among them, the actual device operation parameters are involved. The actual device operation parameters refer to the actual operation status of the target device in the current period. For example, the actual load rate of the target device, the actual ambient temperature, and the actual monitoring point temperature, etc.

[0051] In this step, the actual device operation parameters of the target device in the current period are obtained. These data are used as inputs for subsequent calculation of the target temperature function to determine the device temperature of the device, which is the basis for applying the target temperature function.

[0052] Step S108: Determine the device temperature of the target device according to the actual device operation parameters and the target temperature function.

[0053] In step S108 provided in this application, the device temperature of the target device is determined.

[0054] Through this step, combining the current device operation conditions, that is, the actual device operation parameters, and the previously constructed temperature prediction model, that is, the target temperature function, the real-time calculation of the device temperature is carried out to determine the device temperature of the target device, improving the accuracy of the determined device temperature of the target device.

[0055] It should be noted that the device temperature prediction and monitoring system can be integrated. When the predicted temperature is close to the overheat threshold, an alarm is automatically triggered, the device operation status is adjusted, the cooling strategy is automatically adjusted, and adaptive control is realized to avoid the overheat risk.

[0056] Through the above steps S102 - S108, a temperature determination request of the target device is received, where the temperature determination request is used to determine the device temperature of the target device, and the device size corresponding to the target device is greater than a predetermined size threshold; in response to the temperature determination request, the target temperature function corresponding to the target device is retrieved, where the target temperature coefficient corresponding to the target temperature function is obtained based on multiple simulated device operation parameters and the simulated temperature data respectively corresponding to the multiple simulated device operation parameters, the multiple simulated temperature data are obtained based on the multiple simulated device operation parameters and the three-dimensional device model corresponding to the target device, the three-dimensional device model is provided with constraint conditions, and the constraint conditions include the heat dissipation constraint of the device material and the heat generation constraint of the device load; the actual device operation parameters corresponding to the target device are determined; the way to determine the device temperature of the target device according to the actual device operation parameters and the target temperature function, by retrieving the target temperature function corresponding to the target device, achieves the purpose of determining the device temperature of the target device according to the actual device operation parameters and the target temperature function. Since the target temperature function can reflect the functional relationship between the device temperature and the device operation parameters, therefore, according to the actual device operation parameters, the actual temperature of the device can be accurately determined, thus solving the technical problem that when the device size is large, the data collected by the sensor is inaccurate and cannot reflect the actual temperature around the heat dissipation device, affecting the normal operation of the heat dissipation device.

[0057] As an alternative embodiment, before retrieving the target temperature function corresponding to the target device in response to a temperature determination request, it further includes: obtaining the three-dimensional physical model corresponding to the target device; performing mesh division on the three-dimensional physical model to obtain a plurality of mesh regions; determining the regional models corresponding to the plurality of mesh regions respectively, where the regional model is used to determine the regional temperature of the corresponding mesh region; and determining the three-dimensional device model corresponding to the target device based on the plurality of regional models.

[0058] In this embodiment, the specific steps of determining the three-dimensional device model corresponding to the target device before retrieving the target temperature function corresponding to the target device in response to a temperature determination request are described.

[0059] Among them, the three-dimensional physical model is involved. The three-dimensional physical model refers to the digital representation of the target device, which is determined based on the physical structure of the target device and includes the geometric structure and physical properties of the device, such as material characteristics, thermal conductivity, heat dissipation area, etc.

[0060] Among them, the mesh region is involved. The mesh region refers to the independent spatial unit formed after performing mesh division on the three-dimensional physical model.

[0061] Among them, the regional model is involved. The regional model refers to the independent thermal model for each mesh region in the three-dimensional physical model, which is used to calculate the temperature distribution within a specific mesh region.

[0062] Among them, the regional temperature is involved. The regional temperature refers to the average temperature or temperature distribution of a certain mesh region in the three-dimensional physical model.

[0063] In this step, first, obtain the three-dimensional physical model corresponding to the target device. The three-dimensional physical model is determined based on the physical structure of the target device and can describe the structure and material properties of the device for subsequent mesh division and regional model establishment. Secondly, perform mesh division on the three-dimensional physical model. Through mesh division, the three-dimensional physical model of the target device is divided into multiple small regions, and each region can be independently calculated for temperature, which is a key step for numerical simulation. Then, establish an independent regional model for each mesh region, and determine the average temperature of the region according to the physical properties and boundary conditions of the region. Finally, integrate the results of the regional models of all mesh regions to establish the three-dimensional thermal model of the entire device. This model takes into account the thermal characteristics of all regions inside the device and can more comprehensively predict the temperature of the device.

[0064] Through this step, based on the three-dimensional physical model of the target device, through mesh division and regional modeling, the thermal distribution inside the device is carefully analyzed, and a three-dimensional device model that can accurately reflect the thermal behavior of the device is constructed, improving the accuracy of temperature determination.

[0065] It should be noted that during the operation of the device, the regional model of the 3D device model can be updated in real time to reflect changes in the device state, such as load fluctuations and ambient temperature changes, so as to improve the timeliness of temperature prediction.

[0066] As an optional embodiment, determining the 3D device model corresponding to the target device based on multiple regional models includes: determining the regional simulated temperatures corresponding to multiple grid regions respectively when the corresponding simulated device operation parameters are set according to the multiple regional models; obtaining the regional actual temperatures corresponding to multiple grid regions respectively when the target device is operating with the corresponding simulated device operation parameters set; obtaining the error values corresponding to the multiple regional simulated temperatures based on the multiple regional simulated temperatures and the regional actual temperatures corresponding to the multiple regional simulated temperatures respectively; and determining the 3D device model corresponding to the target device based on the multiple regional models when all the error values are lower than the error threshold.

[0067] In this embodiment, the specific steps of determining the 3D device model corresponding to the target device based on multiple regional models are described.

[0068] Among them, the regional simulated temperature is involved. The regional simulated temperature refers to the predicted temperatures corresponding to multiple grid regions respectively calculated according to the regional model under the set simulated device operation parameters.

[0069] Among them, the regional actual temperature is involved. The regional actual temperature refers to the actual temperatures corresponding to multiple grid regions respectively when the target device is operating with the corresponding simulated device operation parameters set.

[0070] Among them, the error value is involved. The error value refers to the difference between the regional simulated temperature and the regional actual temperature, which is used to evaluate the accuracy of the simulation result of the regional model. The smaller the error value, the closer the simulation result is to the actual situation, and the higher the accuracy of the regional model.

[0071] Among them, the error threshold is involved. The error threshold refers to a pre-set error standard used to judge the acceptability of the simulation result. If the error values of all grid regions are lower than the error threshold, it indicates that the reliability of the simulation result is relatively high and the accuracy of the regional model is relatively high.

[0072] In this step, when determining the three-dimensional device model corresponding to the target device based on multiple regional models, first, using the regional models, by setting the operating parameters of the corresponding simulated device to simulate the corresponding working conditions, determine the regional simulated temperatures corresponding to multiple grid regions. Second, determine the regional actual temperatures corresponding to multiple grid regions when the target device actually operates under the same working conditions according to the corresponding simulated device operating parameters. Then, compare the regional simulated temperatures with the regional actual temperatures to obtain multiple error values. Finally, under the condition that all the error values meet the error threshold, integrate all the regional models to establish the three-dimensional device model of the entire device for subsequent more comprehensive device status prediction and thermal behavior analysis.

[0073] Through this step, the regional simulated temperatures are compared with the regional actual temperatures to verify the prediction ability of the regional models, identify the deficiencies in the models, and improve the simulation accuracy through continuous iterative optimization, ensuring the accuracy and reliability of the three-dimensional device model.

[0074] As an optional embodiment, before retrieving the target temperature function corresponding to the target device in response to a temperature determination request, it further includes: determining an initial temperature function, where the initial temperature function is a temperature function set with an initial temperature coefficient; obtaining a target temperature coefficient based on multiple simulated device operating parameters and the simulated temperature data respectively corresponding to the multiple simulated device operating parameters; and determining the target temperature function corresponding to the target device based on the target temperature coefficient and the initial temperature function.

[0075] In this embodiment, the specific steps of determining the target temperature function corresponding to the target device before retrieving the target temperature function corresponding to the target device in response to a temperature determination request are described.

[0076] Among them, the initial temperature function is involved. The initial temperature function refers to the form of the temperature function set based on preliminary assumptions or experience, which is used to describe the basic relationship between the device temperature and the environmental parameters.

[0077] Among them, the initial temperature coefficient is involved. The initial temperature coefficient refers to the value in the initial temperature function that is used to quantify the degree of influence of the device operating parameters on the device temperature.

[0078] In this step, first, based on the basic characteristics of the device and the assumption of preliminary operating conditions, an initial temperature function is established, which describes the preliminary relationship between the device temperature and environmental parameters. Then, by setting different simulated device operating parameters, numerical simulations are carried out to obtain the device temperature data, i.e., the simulated temperature data, under the simulated operating conditions corresponding to the simulated device operating parameters. According to the simulated device operating parameters and the simulated temperature data respectively corresponding to multiple simulated device operating parameters, the coefficients in the initial temperature function are adjusted to obtain the target temperature coefficients. Finally, the corresponding coefficients in the initial temperature function are replaced with the optimized target temperature coefficients to obtain the final target temperature function.

[0079] Through this step, according to the simulated device operating parameters and the corresponding simulated temperature data under different operating conditions, the initial temperature coefficients in the initial temperature function are adjusted and optimized to obtain the target temperature coefficients. The corresponding coefficients in the initial temperature function are replaced with the optimized target temperature coefficients to obtain the target temperature function. Such a target temperature function can more accurately reflect the thermal behavior of the device, thereby improving the accuracy of temperature prediction.

[0080] As an alternative embodiment, obtaining the target temperature coefficients according to multiple simulated device operating parameters and the simulated temperature data respectively corresponding to multiple simulated device operating parameters includes: obtaining updated temperature coefficients according to multiple simulated device operating parameters and the simulated temperature data respectively corresponding to multiple simulated device operating parameters; determining the updated temperature data respectively corresponding to multiple simulated device operating parameters according to the updated temperature function, where the updated temperature function is a function obtained by updating the initial temperature coefficient of the initial temperature function to the updated temperature coefficient; obtaining the actual temperature data respectively corresponding to multiple simulated device operating parameters; determining the similarity value corresponding to the updated temperature function according to multiple updated temperature data and the actual temperature data respectively corresponding to multiple updated temperature data; and determining the target temperature coefficients according to the updated temperature coefficients when the similarity value is greater than the similarity threshold.

[0081] In this embodiment, the specific steps of obtaining the target temperature coefficients according to multiple simulated device operating parameters and the simulated temperature data respectively corresponding to multiple simulated device operating parameters are described.

[0082] Among them, the updated temperature coefficients are involved. The updated temperature coefficients refer to the updated coefficient values obtained by adjusting the initial temperature coefficients according to multiple simulated device operating parameters and the simulated temperature data respectively corresponding to multiple simulated device operating parameters during the model optimization process.

[0083] Among them, the updated temperature function is involved. The updated temperature function refers to the temperature prediction function obtained by updating the initial temperature coefficient in the initial temperature function to the updated temperature coefficient.

[0084] Among them, updating temperature data is involved. Updating temperature data refers to the device temperature data determined according to the updated temperature function under the set operating parameters of the simulated device.

[0085] Among them, actual temperature data is involved. Actual temperature data refers to the actual device temperature of the target device under the corresponding operating parameters of the simulated device.

[0086] Among them, a similarity value is involved. The similarity value refers to the value used to measure the matching degree between the updated temperature data and the actual temperature data. The higher the similarity value, the closer the prediction ability of the updated temperature function is to the actual situation.

[0087] Among them, a similarity threshold is involved. The similarity threshold refers to a preset standard value used to judge whether the prediction accuracy of the updated temperature function meets the requirements. When the similarity value is greater than the similarity threshold, it indicates that the prediction accuracy of the updated temperature function is high enough.

[0088] In this step, first, multiple sets of simulated temperature data corresponding to different operating parameters of the simulated device are obtained through numerical simulation; second, an updated temperature coefficient is obtained based on multiple operating parameters of the simulated device and the corresponding simulated temperature data, and the updated temperature coefficient is applied to the initial temperature function to replace the original coefficient, thereby obtaining an updated temperature function; then, using the updated temperature function, the updated temperature data corresponding to multiple operating parameters of the simulated device is determined, and at the same time, through actual measurement, the actual temperature data corresponding to multiple operating parameters of the simulated device is obtained; next, the updated temperature data is compared with the actual temperature data to determine the similarity value, such as statistical indicators like the correlation coefficient and root mean square error, etc., for evaluating the prediction ability of the updated temperature function. Finally, it is judged whether the similarity value is greater than the similarity threshold. If the similarity value is greater than the preset similarity threshold, it indicates that the prediction accuracy of the updated temperature function meets the requirements; otherwise, the temperature coefficient needs to be continuously adjusted to optimize the model. When the prediction accuracy of the updated temperature function meets the requirements, the updated temperature coefficient can be used as the final target temperature coefficient to construct an accurate target temperature function for predicting the device temperature.

[0089] Through this step, the similarity value between the updated temperature data and the actual temperature data is determined, and it is judged whether it is necessary to adjust the coefficient of the update function to improve the accuracy of the finally obtained target temperature function.

[0090] It should be noted that when determining the similarity value between the updated temperature data and the actual temperature data, the correlation coefficient between the updated temperature data and the actual temperature data can be calculated. The closer the correlation coefficient is to 1, the higher the accuracy of the updated temperature function.

[0091] As an alternative embodiment, determining a three-dimensional device model corresponding to a target device based on multiple regional models includes: obtaining device parameters corresponding to the target device; determining constraint conditions corresponding to the target device according to the device parameters; and determining a three-dimensional device model corresponding to the target device according to the constraint conditions and the multiple regional models.

[0092] In this embodiment, the specific steps of determining a three-dimensional device model corresponding to a target device based on multiple regional models are described.

[0093] Among them, device parameters are involved. Device parameters refer to the characteristics and operating conditions related to the target device, such as the geometric dimensions of the device, material properties, load rate, ambient temperature, characteristics of the cooling system, etc.

[0094] Among them, constraint conditions are involved. Constraint conditions refer to the rules or boundary conditions that need to be observed during model construction. For example, the heat dissipation constraint of the device material, the heat generation constraint of the device load, the thermal boundary of the device, and the safety and performance requirements for device operation.

[0095] In this step, first, collect all relevant parameters of the target device, including the physical dimensions, material properties, operating parameters, etc. of the device. These parameters will be used to establish the regional model of the device. Then, according to the actual operating conditions and design requirements of the device, determine the constraint conditions of the model, such as the heat dissipation constraint of the device material, the heat generation constraint of the device load, and the thermal boundary conditions of the device. The constraint conditions set the boundaries and rules for model calculation. Apply the constraint conditions to each regional model to ensure that the calculation results of the model meet the actual operating conditions of the device. Finally, integrate the results of multiple regional models to form a comprehensive three-dimensional device model. This model can reflect the temperature distribution and thermal behavior of the device under different regions and different working conditions.

[0096] Through this step, collect device parameters, adjust the boundary conditions of the three-dimensional device model of the target device, more comprehensively reflect the real operating state of the device, improve the accuracy and practicality of the determined three-dimensional device model, and more accurately predict the temperature distribution of the device under various working conditions.

[0097] As an alternative embodiment, determining the device temperature of a target device based on actual device operating parameters and a target temperature function includes: when the actual device operating parameters include environmental parameters, determining an environmental correction coefficient; updating the target temperature function according to the environmental correction coefficient to obtain a corrected temperature function; and determining the device temperature of the target device according to the corrected temperature function and the actual device operating parameters.

[0098] In this embodiment, the specific steps of determining the device temperature of a target device when the actual device operating parameters include environmental parameters are described.

[0099] Among them, environmental parameters are involved. The environmental parameters refer to the quantified parameters of the external environment of the target device. For example, parameters such as environmental humidity and air pressure.

[0100] Among them, an environmental correction coefficient is involved. The environmental correction coefficient refers to the coefficient value used to correct the influence of the external environmental parameters of the target device on the determination result of the device temperature.

[0101] Among them, a corrected temperature function is involved. The corrected temperature function refers to the function obtained by updating the target temperature function after considering the environmental correction coefficient, and it can more accurately reflect the temperature of the device under actual environmental conditions.

[0102] In this step, first, determine the degree of influence of the environmental parameters on the determination result of the target device temperature, and quantify it as the environmental correction coefficient. Then, apply the determined environmental correction coefficient to the target temperature function, adjust the relevant coefficients in the function, and obtain the updated corrected temperature function. This function can more accurately reflect the temperature change law of the device under specific environmental conditions. Finally, based on the corrected temperature function and according to the actual device operation parameters, determine the device temperature of the target device.

[0103] Through this step, by considering the influence of environmental parameters, the corrected temperature function can more accurately predict the temperature change of the device under actual environmental conditions, providing more reliable data support for the thermal management and intelligent control of the device.

[0104] It should be noted that based on the above-mentioned embodiments and optional embodiments, an optional implementation manner is provided, which is specifically described below.

[0105] The high-voltage equipment operating in the substation will emit a large amount of heat. In the related art, the start and stop of the ventilation and heat dissipation equipment are usually controlled by temperature sensors, but traditional temperature sensors have great limitations. A core problem is that the temperature collected by the sensor is difficult to accurately reflect the actual temperature around the heat dissipation equipment, and it is easily interfered by external environmental factors, thus failing to capture the temperature change in a timely manner. In addition, it is difficult to obtain accurate temperature data around the equipment. These problems lead to the situation that when the device temperature fluctuates rapidly, the monitoring data cannot truly present the thermal state of the device, making it difficult to reflect the real needs of the heat dissipation equipment, which may cause incorrect start and stop of the ventilation equipment, resulting in the failure to discharge the waste heat of the device in a timely manner, and further affecting the operation efficiency and lifespan of the device.

[0106] In view of this, in the optional implementation manner of the present invention, a mathematical model and a construction method for accurately reflecting the temperature around the heat dissipation equipment in the main transformer room of the substation are provided. The purpose is to accurately reflect the average temperature around the equipment by combining the outdoor environmental parameters, the operating conditions of the equipment, and the temperature at the monitoring point, facilitating the accurate guidance of the operation of the ventilation equipment and improving the indoor ventilation and heat dissipation effect.

[0107] Based on numerical simulation software, an alternative embodiment of the present invention gives a mathematical relationship between the average temperature around the transformer and the temperature at the detection point by coupling the influence of the transformer load rate and the outdoor temperature, thereby improving the accuracy of temperature monitoring in indoor substations, promptly removing waste heat, and ensuring that the temperature around the equipment is appropriate.

[0108] The following specifically introduces the specific steps of the alternative embodiment of the present invention.

[0109] S1. Receive a temperature determination request for the target device.

[0110] The temperature determination request is used to determine the device temperature of the target device, and the device size corresponding to the target device is greater than a predetermined size threshold. In an alternative embodiment of the present invention, the target device is a transformer.

[0111] S2. In response to the temperature determination request, retrieve the target temperature function corresponding to the target device.

[0112] The mathematical model (same as the above target temperature function) of the transformer provided by the alternative embodiment of the present invention is:

[0113] T = -1.57962Tout + 0.27236β + 2.57598Tc – 3.55661

[0114] Wherein, T is the average temperature around the transformer (same as the above device temperature), in degrees Celsius (°C), Tout is the outdoor temperature (supply air temperature), in °C; β is the device load rate; Tc is the temperature at the detection point, in °C, and the device parameters include Tout, β, and Tc.

[0115] S3. Determine the actual device operating parameters corresponding to the target device.

[0116] S4. Determine the device temperature of the target device based on the actual device operating parameters and the target temperature function.

[0117] In actual ventilation control, given the device load rate and the outdoor temperature, the average temperature around the transformer can be accurately judged according to the above mathematical model through the temperature at the detection point, so as to perform ventilation control and improve the overall operating efficiency and ventilation and heat dissipation effect.

[0118] Before S2, it is also necessary to determine the target temperature function. First, according to the actual structure of the main transformer room in the indoor substation, a three-dimensional physical model of the main transformer room is established through modeling software. The three-dimensional physical model is discretized using grid division software, and the boundaries are named. Based on numerical simulation software, the indoor thermal environment of the main transformer room in the substation under different equipment load rates and different external environmental conditions is simulated. Then, according to the numerical simulation results, the temperature field distribution of the main transformer room under different working conditions is analyzed to obtain the average temperature around the transformer and the temperature at the temperature sensor measurement points under different working conditions. Finally, through data processing software, the average temperature around the transformer, the temperature at the sensor measurement points, the transformer load rate, and the outdoor temperature are coupled, and multiple linear fitting is performed to establish a mathematical model that accurately reflects the temperature around the heat dissipation equipment in the main transformer room of the substation. The mathematical model is shown in the following formula:

[0119] T = aTout + bβ + cTc + d

[0120] Among them, T is the average temperature around the transformer, with the unit of °C; Tout is the outdoor temperature (supply air temperature), with the unit of °C; β is the equipment load rate; Tc is the temperature at the monitoring point, with the unit of °C; a, b, c, and d are all correlation coefficients.

[0121] The steps to determine the target temperature function are introduced in detail below.

[0122] A1. Obtain the three-dimensional physical model corresponding to the target equipment.

[0123] Based on the actual structure of the main transformer room in a certain indoor substation in Beijing, a three-dimensional physical model of the main transformer room is established through three-dimensional solid direct modeling software (SpaceClaim).

[0124] A2. Perform grid division on the three-dimensional physical model to obtain multiple grid regions.

[0125] Use the grid division function of the workbench (Workbench meshing grid division software) to discretize the three-dimensional model to ensure that the grid accuracy meets the requirements, and name the model boundaries.

[0126] A3. Determine the constraint conditions corresponding to the target equipment according to the equipment parameters.

[0127] Import the model into computational fluid dynamics software (Flunet numerical simulation software), and set the boundary conditions:

[0128] (1) Turn on the energy equation, turbulent kinetic energy and turbulent dissipation rate equation (k-epsilon turbulence model), and discrete coordinate radiation model (DO radiation model);

[0129] (2) Regarding air as an incompressible fluid, the Boussinesq model (Boussinasp gas model) is adopted, that is, the air density is only related to temperature;

[0130] (3) The heat transfer processes of the walls, roof and ground are ignored, and adiabatic boundaries are adopted; the materials of the transformer and radiator are aluminum, and the boundary conditions adopt the equal heat flux density boundary. Since the transformer body and radiator are arranged integrally, the heat generation of the transformer under different load rates (such as 10%, 30%, 50%, 70% and 90%) is calculated by the following formula:

[0131] ΔP = P0 + β 2 *PK

[0132] Among them, ΔP is the total loss, with the unit of watt (W); P0 is the no-load loss, which is 24800 W; β is the load rate; PK is the load loss, which is 175000 W.

[0133] (4) The air supply inlet is a pressure inlet, with the air outlet size of 6m × 1.2m, and different air supply temperatures are simulated (such as 5°C, 15°C, 25°C and 35°C); the exhaust outlet is a mass flow outlet, with the number of two, and the mass flow of a single air outlet is 13.3 kg / m3, and the air outlet size is 1.1m × 1m;

[0134] (5) Based on the pressure solver, the fully implicit coupling method (Coupled algorithm) is selected, the discretization adopts the second-order upwind scheme, and the pressure interpolation adopts the volume force weighted scheme (Body Force Weighted format).

[0135] A4. According to the constraint conditions and multiple regional models, determine the three-dimensional equipment model corresponding to the target equipment.

[0136] Before the formal simulation, the accuracy of the numerical model is verified. The temperatures at different positions in the field test are compared with the simulated temperatures under the same working conditions. Figure 2 It is the comparison chart of the measured temperature value and the simulated temperature value under the same working conditions provided by the optional implementation manner of the present invention. As Figure 2 shown, the measured values and the simulated values at each point are relatively close, and the errors are all kept within 10%. Therefore, through the above boundary condition settings, the numerical model (the same as the above three-dimensional equipment model) can reflect the indoor thermal environment distribution of the substation.

[0137] A5. Determine the target temperature function.

[0138] Using the steady-state numerical simulation method, simulate different working conditions, and monitor the temperature around the transformer and the temperature at the monitoring points. Figure 3 It is the structure diagram of the transformer provided by the optional implementation manner of the present invention. As Figure 3 shown, the temperature monitoring points are set near the exhaust outlet. Figure 4It is a schematic diagram of the transformer temperature monitoring points provided by an alternative embodiment of the present invention. As Figure 4 shown, the transformer is provided with multiple temperature monitoring points.

[0139] Extract the average temperature around the transformer and the temperature data of the temperature sensor arrangement points from the simulation results. Record the temperature distribution characteristics under multiple working conditions and correlate them with the load rate and outdoor temperature. Figure 5 It is a temperature curve graph of the transformer equipment under different working conditions provided by an alternative embodiment of the present invention. As Figure 5 shown, it shows the change curve of the average temperature around the transformer under different working conditions. Figure 6 It is a temperature curve graph of the transformer monitoring points under different working conditions provided by an alternative embodiment of the present invention. As Figure 6 shown, it shows the change curve of the temperature of the transformer monitoring points under different working conditions, from which it can be seen that it shows a certain regularity.

[0140] Use the graphical visualization software (Origin software) to process and fit the collected data. Import the data containing various variables (such as the average temperature around the transformer, outdoor temperature, equipment load rate, monitoring point temperature) into the worksheet of Origin, perform multiple linear regression, and specify the dependent variable (such as the average temperature around the transformer) and independent variables (such as outdoor temperature, equipment load rate, monitoring point temperature). The correlation coefficient (R2, the same as the above similarity value) of the fitted mathematical model is 0.98953, indicating a strong correlation.

[0141] Finally, determine the target temperature function based on the collected data:

[0142] T = -1.57962Tout + 0.27236β + 2.57598Tc – 3.55661

[0143] Through the above alternative embodiments, at least the following beneficial effects can be achieved:

[0144] (1) Improve the accuracy of substation thermal environment analysis: Through numerical simulation and multiple linear fitting, the proposed mathematical model can accurately reflect the temperature distribution around the equipment in the main transformer room of the substation, filling the accuracy deficiency of traditional methods in complex thermal environment prediction;

[0145] (2) Improve energy conservation and environmental protection effects: While ensuring the normal operation of the equipment, by accurately predicting the heat dissipation demand, the power consumption of the cooling system can be optimized, energy consumption can be reduced, and the goal of green environmental protection can be achieved;

[0146] (3) Strengthen the data-driven intelligent management of substations: With the help of the model analysis results, it can assist in realizing the intelligent monitoring and management of substations, improving energy utilization efficiency, reducing operation costs, promoting the development of substations towards intelligent management, and enhancing the overall operation efficiency and safety.

[0147] It should be noted that for the foregoing method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the present invention is not limited by the described action sequence, because according to the present invention, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0148] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions for causing a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of the present invention.

[0149] Embodiment 2

[0150] According to an embodiment of the present invention, there is also provided a device for implementing the method for determining the temperature of the above device. Figure 7 It is a structural block diagram of the device for determining the temperature of the device according to an embodiment of the present invention, as Figure 7 shown. The device includes: a receiving module 702, a response module 704, a first determination module 706, and a second determination module 708. The device will be described in detail below.

[0151] A receiving module 702, configured to receive a temperature determination request of a target device, where the temperature determination request is used to determine the device temperature of the target device, and the device size corresponding to the target device is greater than a predetermined size threshold; a response module 704, connected to the receiving module 702, configured to, in response to the temperature determination request, retrieve a target temperature function corresponding to the target device, where the target temperature coefficient corresponding to the target temperature function is obtained based on a plurality of simulated device operation parameters and simulated temperature data respectively corresponding to the plurality of simulated device operation parameters, the plurality of simulated temperature data are obtained based on the plurality of simulated device operation parameters and a three-dimensional device model corresponding to the target device, and the three-dimensional device model is provided with constraint conditions, and the constraint conditions include a device material heat dissipation constraint and a device load heat generation constraint; a first determination module 706, connected to the response module 704, configured to determine the actual device operation parameters corresponding to the target device; a second determination module 708, connected to the first determination module 706, configured to determine the device temperature of the target device based on the actual device operation parameters and the target temperature function.

[0152] It should be noted here that the above receiving module 702, response module 704, first determination module 706, and second determination module 708 correspond to steps S102 to S108 in the method for determining the device temperature. The instances and application scenarios implemented by the multiple modules and the corresponding steps are the same, but are not limited to the content disclosed in the above Embodiment 1.

[0153] Embodiment 3

[0154] According to another aspect of the embodiments of the present invention, an electronic device is further provided, including: a processor; a memory for storing processor-executable instructions, where the processor is configured to execute the instructions to implement the method for determining the device temperature in any one of the above.

[0155] Embodiment 4

[0156] According to another aspect of the embodiments of the present invention, a computer-readable storage medium is further provided. When the instructions in the computer-readable storage medium are executed by a processor of an electronic device, the electronic device can execute the method for determining the device temperature in any one of the above.

[0157] The above serial numbers of the embodiments of the present invention are only for description and do not represent the advantages and disadvantages of the embodiments.

[0158] In the above embodiments of the present invention, the descriptions of the respective embodiments have their own emphases. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0159] In several embodiments provided by the present application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are merely illustrative. For example, the division of the units can be a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the couplings or direct couplings or communication connections shown or discussed with each other can be through some interfaces. The indirect couplings or communication connections of units or modules can be in electrical or other forms.

[0160] The units described as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they can be located in one place or distributed to multiple units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0161] In addition, in each embodiment of the present invention, the functional units can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0162] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present invention. The foregoing storage medium includes: USB flash drives, read-only memories (ROMs), random access memories (RAMs), mobile hard disks, magnetic disks, or optical discs and other various media that can store program codes.

[0163] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for determining device temperature, characterized in that: include: receiving a temperature determination request of a target device, wherein the temperature determination request is used to determine a device temperature of the target device, and a device size corresponding to the target device is greater than a predetermined size threshold; In response to the temperature determination request, a target temperature function corresponding to the target device is retrieved, wherein a target temperature coefficient corresponding to the target temperature function is obtained based on a plurality of simulated device operating parameters and simulated temperature data corresponding to the plurality of simulated device operating parameters, the plurality of simulated temperature data are obtained based on the plurality of simulated device operating parameters and a three-dimensional device model corresponding to the target device, the three-dimensional device model is provided with constraints, the constraints including constraints on the heat dissipation of device materials and constraints on the heat generation of device loads; Determining actual device operating parameters corresponding to the target device; The device temperature of the target device is determined according to the actual device operating parameters and the target temperature function.

2. The method according to claim 1, characterized in that Before the step of calling the target temperature function corresponding to the target device in response to the temperature determination request, the method further includes: Acquire a three-dimensional physical model corresponding to the target device; Meshing the three-dimensional physical model to obtain a plurality of mesh regions; Determine regional models corresponding to the plurality of grid regions respectively, wherein the regional models are used to determine regional temperatures of the corresponding grid regions; A three-dimensional device model corresponding to the target device is determined according to the multiple area models.

3. The method according to claim 2, characterized in that The determining, based on the plurality of area models, a three-dimensional device model corresponding to the target device includes: Determining, based on the multiple regional models, regional simulation temperatures corresponding to the multiple grid regions respectively when corresponding simulation device operating parameters are set; Acquiring actual temperatures of regions corresponding to the plurality of grid regions respectively when the target device is set with corresponding simulation device operating parameters; According to a plurality of regional simulated temperatures and the regional actual temperatures respectively corresponding to the plurality of regional simulated temperatures, error values ​​respectively corresponding to the plurality of regional simulated temperatures are obtained; When the multiple error values ​​are all lower than the error threshold, a three-dimensional device model corresponding to the target device is determined according to the multiple area models.

4. The method according to claim 1, characterized in that Before the step of calling the target temperature function corresponding to the target device in response to the temperature determination request, the method further includes: Determining an initial temperature function, wherein the initial temperature function is a temperature function provided with an initial temperature coefficient; Obtaining the target temperature coefficient according to the plurality of simulation device operating parameters and the simulation temperature data respectively corresponding to the plurality of simulation device operating parameters; A target temperature function corresponding to the target device is determined according to the target temperature coefficient and the initial temperature function.

5. The method according to claim 4, characterized in that The step of obtaining the target temperature coefficient according to the plurality of simulation device operating parameters and the simulation temperature data respectively corresponding to the plurality of simulation device operating parameters comprises: Obtaining an updated temperature coefficient according to the plurality of simulation device operating parameters and the simulation temperature data respectively corresponding to the plurality of simulation device operating parameters; Determining updated temperature data corresponding to the plurality of simulation device operating parameters respectively according to an updated temperature function, wherein the updated temperature function is a function obtained by updating an initial temperature coefficient of the initial temperature function to an updated temperature coefficient; Acquire actual temperature data corresponding to the plurality of simulation device operating parameters respectively; Determine a similarity value corresponding to the updated temperature function according to a plurality of updated temperature data and actual temperature data respectively corresponding to the plurality of updated temperature data; When the similarity value is greater than a similarity threshold, the target temperature coefficient is determined according to the updated temperature coefficient.

6. The method according to claim 2, characterized in that The determining, based on the plurality of area models, a three-dimensional device model corresponding to the target device includes: Obtaining device parameters corresponding to the target device; Determining the constraint conditions corresponding to the target device according to the device parameters; A three-dimensional device model corresponding to the target device is determined according to the constraint conditions and the multiple area models.

7. The method according to any one of claims 1 to 6, characterized in that: The determining the device temperature of the target device according to the actual device operating parameters and the target temperature function includes: In the case where the actual equipment operating parameters include environmental parameters, determining an environmental correction factor; According to the environmental correction coefficient, the target temperature function is updated to obtain a corrected temperature function; The device temperature of the target device is determined according to the corrected temperature function and the actual device operating parameters.

8. A device for determining the temperature of an equipment, characterized in that: include: A receiving module, configured to receive a temperature determination request of a target device, wherein the temperature determination request is used to determine a device temperature of the target device, and a device size corresponding to the target device is greater than a predetermined size threshold; a response module, configured to call a target temperature function corresponding to the target device in response to the temperature determination request, wherein a target temperature coefficient corresponding to the target temperature function is obtained based on a plurality of simulated device operating parameters and simulated temperature data corresponding to the plurality of simulated device operating parameters, the plurality of simulated temperature data are obtained based on the plurality of simulated device operating parameters and a three-dimensional device model corresponding to the target device, the three-dimensional device model is provided with constraints, and the constraints include constraints on the heat dissipation of device materials and constraints on the heat generation of device loads; A first determination module, used to determine actual device operating parameters corresponding to the target device; The second determination module is used to determine the device temperature of the target device according to the actual device operating parameters and the target temperature function.

9. An electronic device, characterized in that: include: processor; a memory for storing instructions executable by the processor; The processor is configured to execute the instructions to implement the method for determining the device temperature according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: When the instructions in the computer-readable storage medium are executed by a processor of an electronic device, the electronic device is enabled to execute the method for determining the device temperature as claimed in any one of claims 1 to 7.

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