Display module, preparation method thereof and terminal equipment

Abstract

The embodiment of the invention discloses a display module and a preparation method thereof and terminal equipment, the display module comprises a cooling fin, a first back plate, a second back plate and a display panel, the first back plate and the second back plate are arranged on the two sides of the cooling fin in the film thickness direction respectively, and the display panel comprises a bending section. A containing cavity is formed among the bent section, the cooling fin, the first back plate and the second back plate, a supporting piece is arranged in the containing cavity, the edges of the sides, facing the bent section, of the first back plate and the second back plate exceed the edge of the cooling fin, and one end of the supporting piece is at least connected with the cooling fin in an abutting mode. When glue is adopted to prepare the supporting piece, the edge of the cooling fin is shrunk inwards relative to the edge of the first back plate and the edge of the second back plate to form the avoiding area, so that the size of the containing cavity is increased, more glue can be contained, and excessive overflow of the glue is relieved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly relates to a display module, a preparation method thereof, and a terminal device. Background Art

[0002] In the prior art, bending is generated in a bending section of a flexible display panel, so that a flexible circuit board and some traces are bent and arranged on the back surface. The bending section has a bending radius and forms a hollow chamber around it. When the whole machine drops from a high altitude, a huge impact force causes a large deformation of the middle frame, resulting in defects such as bright lines on the display screen. When the prior art uses glue to prepare a support member, the glue is easily extruded and overflows excessively to both sides, resulting in abnormal display.

[0003] Therefore, there is a technical problem that the glue for forming the support member in the existing display module is prone to overflow. Summary of the Invention

[0004] Embodiments of the present application provide a display module, a preparation method thereof, and a terminal device, which can alleviate the technical problem that the glue for forming the support member in the existing display module is prone to overflow.

[0005] Embodiments of the present application provide a display module, including:

[0006] A heat sink;

[0007] A first backplane, which is disposed on one side of the heat sink along the film thickness direction;

[0008] A second backplane, which is disposed on the other side of the heat sink along the film thickness direction;

[0009] A display panel, which includes a display section, a flat section, and a bending section. The display section is disposed on the side of the first backplane away from the heat sink, the flat section is disposed on the side of the second backplane away from the heat sink, the bending section is bent, and two ends of the bending section are respectively connected to the display section and the flat section;

[0010] Wherein, a receiving cavity is formed between the bending section, the heat sink, the first backplane, and the second backplane. The edges of the first backplane and the second backplane facing the bending section exceed the edges of the heat sink. A support member is disposed in the receiving cavity, and one end of the support member is at least in contact with the heat sink.

[0011] Optionally, in some embodiments of the present application, the bent section includes a long side and a short side that is bent. The extending direction of the long side is the first direction. Along the first direction, the bent section includes a wiring area and reserved areas on both sides of the wiring area. The wiring area is provided with metal wirings, and the support member at least covers the wiring area.

[0012] Optionally, in some embodiments of the present application, the display panel further includes a GOA circuit. The GOA circuit includes an outgoing line end located in the wiring area. Along the first direction, the minimum distance between the edge of the bent section and the outgoing line end is d1, and the width of the reserved area is d2, where 0.2 mm ≤ d2 < d1.

[0013] Optionally, in some embodiments of the present application, the other end of the support member abuts against the bent section.

[0014] Optionally, in some embodiments of the present application, the support member is designed to be similar in shape to the accommodation cavity, and the outer contour surface of the support member is in fit with the inner contour surface of the accommodation cavity.

[0015] Optionally, in some embodiments of the present application, the preparation material of the support member includes a glue material.

[0016] Optionally, in some embodiments of the present application, the cross-sectional shape of the bending contour of the bent section is any one of a semi-ellipse and a semi-circle.

[0017] Optionally, in some embodiments of the present application, the major axis of the semi-ellipse is arranged along the first direction, the minor axis of the semi-ellipse is perpendicular to the first direction and faces the bending vertex of the bent section, where the length of the major axis is greater than the length of the minor axis.

[0018] An embodiment of the present application provides a method for manufacturing a display module, including:

[0019] Providing a display panel, the display panel includes a display section, a planar section, and a bent section located on the same plane;

[0020] Successively manufacturing a first backplane and a heat sink on one side of the display section of the display panel;

[0021] Manufacturing a second backplane on the same side of the planar section of the display panel, and a groove is formed at the interval position between the first backplane and the second backplane;

[0022] Filling the groove with a glue material;

[0023] Bend the bent section so that the second back plate is placed on the side of the heat sink away from the first back plate. Wherein, a receiving cavity is formed among the bent section, the heat sink, the first back plate, and the second back plate, and the support member formed by the adhesive material is disposed in the receiving cavity. One end of the support member abuts at least against the heat sink, and the edges of the first back plate and the second back plate facing the bent section extend beyond the edges of the heat sink.

[0024] An embodiment of the present application provides a terminal device, and the terminal device includes the display module described in any of the above embodiments.

[0025] Beneficial effects: A support member is disposed in the receiving cavity formed around the bent section, and the support member is used to reduce the deformation amount of the bent section. When preparing the support member with glue, by retracting the edge of the heat sink relative to the edges of the first back plate and the second back plate, the glue at least partially fills between the first back plate and the second back plate, so that one end of the support member abuts at least against the heat sink. Since the edge of the heat sink retracts relative to the edges of the first back plate and the second back plate to form an avoidance area, the volume of the receiving cavity increases, and more glue can be accommodated, alleviating the excessive overflow of the glue, thereby alleviating the technical problem that the glue for forming the support member in the existing display module is prone to overflow. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0027] Figure 1 is a cross-sectional schematic diagram of the display module provided by the present application;

[0028] Figure 2 is a cross-sectional schematic diagram of the display module preparation method provided by the present application after filling the groove with the adhesive material;

[0029] Figure 3 is Figure 2 a top view cross-sectional diagram of the cross-sectional schematic diagram of the display module preparation method provided by the present application;

[0030] Figure 4 is a flowchart of the display module preparation method provided by the present application;

[0031] Figure 5 is a comparison schematic diagram of the stress resistance capabilities of the present application when preparing the support member with different adhesive materials and without setting the support member;

[0032] Figure 6 It is a curve graph showing the change of the wire breakage risk with displacement when the bent section of this application is circular;

[0033] Figure 7 It is a curve graph showing the change of the wire breakage risk with displacement when the bent section of this application is oval;

[0034] Figure 8 It is a comparative schematic diagram of the stress resistance ability with and without a support member provided in this application.

[0035] Explanation of reference numerals:

[0036] Detailed implementation manners

[0037] The embodiments of this application only show exemplary embodiments of the inventive concept of the present invention. The inventive concept can be embodied in many different forms and should not be construed as limited to the embodiments described herein.

[0038] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain this application, and are not used to limit this application. In this application, unless otherwise stated, the orientation terms such as "upper" and "lower" usually refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the drawings; and "inner" and "outer" refer to the outline of the device.

[0039] Please refer to Figure 1 、 Figure 2 、 Figure 3, the display module 1 provided by this application includes a heat sink 10, a first backplane 20, a second backplane 30, and a display panel 40. The first backplane 20 is disposed on one side of the heat sink 10 in the film thickness direction, and the second backplane 30 is disposed on the other side of the heat sink 10 in the film thickness direction. The display panel 40 includes a display section 401, a flat section 402, and a bending section 403. The display section 401 is disposed on the side of the first backplane 20 away from the heat sink 10, the flat section 402 is disposed on the side of the second backplane 30 away from the heat sink 10, the bending section 403 is bent, and the two ends of the bending section 403 are respectively connected to the display section 401 and the flat section 402; a receiving cavity is formed between the bending section 403, the heat sink 10, the first backplane 20, and the second backplane 30. The edges of the first backplane 10 and the second backplane 20 facing the bending section 30 extend beyond the edge of the heat sink 10. A support member 50 is disposed in the receiving cavity, and one end of the support member 50 abuts at least against the heat sink 10.

[0040] It can be understood that since the support member 50 is disposed in the receiving cavity, when the bending section 403 is deformed by an external force, the support member 50 will support the bending section 403, thereby improving the anti-pressure load capacity of the receiving cavity and reducing the deformation amount of the bending section 403 caused by the external force.

[0041] In this embodiment, by disposing the support member 50 in the receiving cavity formed by surrounding the bending section 403, the support member 50 is used to reduce the deformation amount of the bending section 403. When preparing the support member 50 with glue, by retracting the edge of the heat sink 10 relative to the edges of the first backplane 20 and the second backplane 30, the glue is at least partially filled between the first backplane 20 and the second backplane 30, so that one end of the support member 50 abuts at least against the heat sink 10. Since the edge of the heat sink 10 is retracted relative to the edges of the first backplane 20 and the second backplane 30 to form an avoidance area 4, the volume of the receiving cavity is increased, more glue can be accommodated, the excessive overflow of the glue is alleviated, and thus the technical problem that the glue for forming the support member in the existing display module is prone to overflow is alleviated.

[0042] Now, the technical solution of this application will be described in combination with specific embodiments.

[0043] The viscosity of the glue material, the modulus of the glue material, the width of the reserved area 3, the selected material of the support member 50, etc. of this application are only described in the best or better implementation manners, and other implementation manners and scopes should also belong to the protection scope of the present invention, which will not be elaborated here.

[0044] The display section 401 of the present application can be used for a display function. The planar section 402 can be used to make an electrical connection with the printed circuit board 120, and the bent section 403 is a bent section.

[0045] The display panel 40 of the present application is described by taking the flexible display panel 40 as an example.

[0046] Please refer to Figure 1 , Figure 2 , the display module 1 provided by the present application further includes: a hardening layer 60, a polarizer 70, an optical adhesive 110, a cover plate 80, a light-shielding member 90, and a protective layer 100. The polarizer 70 is disposed on the side of the display section 401 away from the heat sink 10. The optical adhesive 110 is disposed on the side of the polarizer 70 away from the heat sink 10. The cover plate 80 is disposed on the side of the optical adhesive 110 away from the heat sink 10. Among them, a light-shielding member 90 is disposed at the edge position of the cover plate 80, and the light-shielding member 90 is used to prevent edge light leakage.

[0047] Among them, the protective layer 100 is at least disposed to cover the outside of the bent section 403, which plays a role in preventing moisture from invading the display panel 40 and adjusting the neutral layer.

[0048] Among them, the hardening layer 60 is disposed on the side of the heat sink 10 away from the first backplane 20, and the second backplane 30 is disposed on the side of the hardening layer 60 away from the heat sink 10.

[0049] Among them, the side of the planar section 402 away from the bent section 403 is further connected to a printed circuit board 120, and a chip 140 and a black coating 130 are disposed on the printed circuit board 120.

[0050] In one embodiment, the portions of the first backplane 20 and the second backplane 30 that extend beyond the edge of the heat sink 10 are symmetrically arranged.

[0051] Among them, the edge of the hardening layer 60 can be aligned with the edge of the heat sink 10.

[0052] It can be understood that when the amount of inward shrinkage of the edge of the heat sink 10 is fixed, when the portions of the first backplane 20 and the second backplane 30 that extend beyond the edge of the heat sink 10 are symmetrically arranged, at this time, the volume of the avoidance area 4 is the largest, which can accommodate more glue and further prevent the overflow of the glue.

[0053] In one embodiment, the other end of the support member 50 abuts against the bent section 403.

[0054] It can be understood that both ends of the support member 50 are respectively in contact with the opposite inner walls of the accommodation cavity, and one end of the support member 50 is in contact with at least one of the heat sink 10, the first back plate 20, and the second back plate 30. The other end of the support member 50 is in contact with the bent section 403, so that the support member 50 provides a better support effect on the bent section 403, and further reduces the deformation amount of the bent section 403.

[0055] In one embodiment, please refer to Figure 3 , the bent section 403 includes a long side and a short side that is bent. The extending direction of the long side is the first direction. Along the first direction, the bent section 403 includes a wiring area 2 and reserved areas 3 on both sides of the wiring area 2. A metal wiring is provided in the wiring area 2, and the support member 50 at least covers the wiring area 2.

[0056] Wherein, at least part of the metal wiring in the wiring area 2 is provided on the same layer as the source electrode and the drain electrode in the display panel 40.

[0057] It can be understood that when the bent section 403 is deformed due to extrusion, the metal wiring in the wiring area 2 is easily broken under the action of stress. By making the support member 50 at least cover the wiring area 2 provided with the metal wiring, the metal wiring can be better protected and prevented from breaking.

[0058] In this embodiment, by setting the support member 50 to cover the wiring area 2, the protection effect of the support member 50 on the metal wiring in the wiring area 2 is enhanced.

[0059] In one embodiment, in the direction of the heat sink 10 facing the accommodation cavity, the edges of the first back plate 20 and the second back plate 30 extend beyond the edge of the heat sink 10.

[0060] Wherein, one end of the support member 50 is in contact with both the first back plate 20 and the second back plate 30.

[0061] It can be understood that since the edges of the first back plate 20 and the second back plate 30 are not flush with the edge of the heat sink 10, the metal wiring at the edge contact position between the bent section 403 and the edges of the first back plate 20 and the second back plate 30 is more likely to break with the deformation of the bent section 403. By making one end of the support member 50 in contact with both the first back plate 20 and the second back plate 30, the metal wiring at the above-mentioned edge contact position can be effectively prevented from breaking, and the metal wiring at the above-mentioned edge contact position can be better protected.

[0062] In this embodiment, during the deformation process of the bending section 403, the metal traces at the edge contact positions between the bending section 403 and the first backplane 20 and the second backplane 30 are subjected to greater stress. By making one end of the support member 50 abut against both the first backplane 20 and the second backplane 30, it is possible to better prevent the metal traces at the above-mentioned edge contact positions from breaking.

[0063] In one embodiment, please refer to Figure 3 , the display panel 40 further includes a GOA circuit. The GOA circuit 40 includes an outgoing line end located in the wiring area 2. Along the first direction, the minimum distance between the edge of the bending section 403 and the outgoing line end is d1, and the width of the reserved area 3 is d2, where 0.2 mm ≤ d2 < d1.

[0064] It can be understood that by limiting the width of the reserved area 3 to be greater than 0.2 mm, when preparing the support member 50 with a glue material, the reserved area 3 is used to accommodate the glue material that flows to both sides due to extrusion, thereby preventing the glue material from extruding and overflowing.

[0065] It can be understood that since there is an outgoing line end of the GOA circuit in the wiring area 2, and there may still be a certain distance between this outgoing line end and the edge of the wiring area, therefore, the set width of the reserved area 3 cannot exceed the minimum distance between the outgoing line end and the edge of the bending section in the first direction, so as to avoid the setting of the reserved area affecting the setting of the outgoing line end of the GOA circuit.

[0066] In this embodiment, by setting the reserved area 3 and limiting the width d2 of the reserved area 3 to satisfy: 0.2 mm ≤ d2 < d1; it is possible to prevent the glue material forming the support member 50 from extruding and overflowing after the bending section 403 is bent during the preparation process of the support member 50.

[0067] In one embodiment, the support member 50 is designed to be conformable to the receiving cavity, and the outer contour surface of the support member 50 is in a fitting arrangement with the inner contour surface of the receiving cavity.

[0068] It can be understood that the support member 50 can be prepared from a glue material, and the glue material is easily conformable to the receiving cavity during the bending process of the bending section 403, so that there are no other gaps between the support member 50 and the inner wall of the receiving cavity. Thus, when the bending section 403 is deformed under extrusion, the support member 50 can provide a supporting force for the bending section 403, which is equivalent to improving the anti-pressure load capacity.

[0069] Specifically, in this embodiment, the inner wall of the bent section 403 abuts against the support member 50. When the middle frame presses the bent section 403, the anti-pressure load capacity of the bent section 403 and the support member 50 as a whole structure is at least four times that of the anti-pressure load capacity of only the bent section 403.

[0070] In this embodiment, since the support member 50 and the accommodating cavity are in a profiling design, there is no gap between the support member 50 and the accommodating cavity, further optimizing the support effect of the support member 50 on the bent section 403, enhancing the anti-pressure load capacity of the bent section 403 and the support member 50 as a whole structure, and making it not easy for the bent section 403 to deform when the bent section 403 is pressed by the middle frame or the like.

[0071] In one embodiment, the preparation material of the support member 50 includes a glue material.

[0072] Wherein, the glue material is at least one of an optical glue 110 and a pressure-sensitive glue.

[0073] It can be understood that, from a process perspective, the glue material is easier to realize the preparation of the support member 50; however, this application includes but is not limited to the glue material. For example, the support member 50 can be used as an independent component and is disposed on the side of the heat sink 10, the first back plate 20, and the second back plate 30 facing the accommodating cavity.

[0074] In one embodiment, the viscosity range of the glue material is from 1300 centipoise to 4200 centipoise, and the modulus range of the glue material is from 1 GPa to 3 GPa.

[0075] Wherein, the viscosity of the glue material can be 1300 centipoise, 2000 centipoise, 3000 centipoise, or 4200 centipoise.

[0076] Wherein, the modulus of the glue material can be 1 GPa, 2 GPa, or 3 GPa.

[0077] Furthermore, the viscosity range of the glue material can be from 3000 centipoise to 4200 centipoise.

[0078] Furthermore, the modulus range of the glue material can be from 2 GPa to 3 GPa.

[0079] It can be understood that the viscosity range of the glue material can be the viscosity of the glue layer that can be selected during the glue coating process.

[0080] It can be understood that the greater the viscosity, the lower the fluidity of the glue material before curing, and the smaller the impact on the metal traces; the greater the modulus of the glue material, the stronger the anti-pressure load capacity of the support member 50 prepared from the glue material.

[0081] In this embodiment, by limiting the modulus and viscosity of the adhesive material for preparing the support member 50, on the one hand, the influence of the adhesive material on the process and the stress of the wiring during the manufacturing process is reduced; on the other hand, the compressive load resistance of the support member 50 is enhanced.

[0082] In one embodiment, the major axis of the semi-ellipse is arranged along the first direction, the minor axis of the semi-ellipse is perpendicular to the first direction and faces the bending vertex of the bending section, wherein the length of the major axis is greater than the length of the minor axis.

[0083] Wherein, the bending vertex of the bending section refers to: the vertex on the side of the minor axis of the semi-ellipse.

[0084] It can be understood that the setting direction of the minor axis is the width direction of the frame. By reducing the length of the minor axis, the effect of a narrow frame can be achieved.

[0085] In one embodiment, the cross-sectional shape of the bending profile of the bending section 403 is an arc, and the arc is a part of any one of an ellipse and a circle.

[0086] Wherein, the radius of the circle can be 0.26 mm.

[0087] Wherein, the major axis radius of the ellipse can be 0.26 mm, and the minor axis radius of the ellipse can be 0.23 mm.

[0088] It can be understood that the major axis of the ellipse is arranged along the second direction, the minor axis of the ellipse is arranged along the width direction of the frame. By reducing the width of the minor axis of the ellipse, the width of the frame can be reduced; the second direction can be the film thickness direction of the display module 1.

[0089] Furthermore, due to the provision of the support member 50, the overall compressive load resistance of the bending section 403 and the support member 50 is stronger. Therefore, the major axis and minor axis of the ellipse can be set smaller to achieve a narrower frame.

[0090] Specifically, the major axis radius of the ellipse can be 0.23 mm, and the minor axis radius of the ellipse can be 0.17 mm.

[0091] It can be understood that when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse, compared with when the cross-sectional shape of the bending profile of the bending section 403 is a part of a circle, the stress of the metal lines at the edges of the first backplane 20 and the second backplane 30 will be greater. Therefore, when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse, the support member 50 can better prevent the bending section 403 from being squeezed and deformed.

[0092] It should be noted that along the second direction, when the major axis radius of the bent section 403 is an ellipse or the radius of the circle is equal when it is a circle, when the bent section 403 is an ellipse, its minor axis radius is smaller than the radius of the circle. That is to say, when the cross-sectional shape of the bending profile of the bent section 403 is a part of an ellipse, the frame can be made narrower.

[0093] It is worth noting that since the above design improves the compressive load capacity of the bent section 403, the safety distance between the bent section 403 and the middle frame can be further compressed, thereby further realizing the narrow frame design.

[0094] In this embodiment, by making the cross-sectional shape of the bending profile of the bent section 403 an arc, when the arc is a part of an ellipse, the minor axis of the ellipse is arranged along the width direction of the frame, and the width of the frame can be further reduced.

[0095] In one embodiment, the cross-sectional shape of the bending profile of the bent section 403 is a semi-ellipse or a semi-circle.

[0096] In one embodiment, the bent section 403 is further provided with stress buffer vias, and the stress buffer vias penetrate at least part of the inorganic film layer in the bent section 403, and the support member 50 can also improve the stiffness of the bent section 403 at the stress buffer vias.

[0097] Wherein, the support member 50 can also be in contact with the area of the bent section 403 where the stress buffer vias are provided.

[0098] It can be understood that since the bending performance of the inorganic film layer is not good, in order to make the display panel 40 bend better in the bent section 403, by providing stress buffer vias, the stress buffer vias will penetrate at least part of the inorganic film layer, thereby reducing the thickness of the inorganic film layer and making the bent section 403 easier to bend; in this application, by providing a support member 50 in the accommodation cavity, the support member 50 can be in contact with the area of the bent section 403 where the stress buffer vias are provided, thereby improving the stiffness of the bent section 403 at the stress buffer vias.

[0099] In this embodiment, the bent section 403 is further provided with stress buffer vias that penetrate at least part of the inorganic film layer. On the one hand, it can better relieve the stress generated by the bending of the bent section 403. On the other hand, by the support member 50 contacting the area of the bent section 403 where the stress buffer vias are provided, the stiffness of the bent section 403 at the stress buffer vias can also be improved.

[0100] Please refer to Figure 4 , this application embodiment provides a method for manufacturing a display module 1, including:

[0101] S1: Provide a display panel 40, where the display panel 40 includes a display section 401, a flat section 402, and a bending section 403 located in the same plane;

[0102] S2: Sequentially fabricate a first backplane 20 and a heat sink 10 on one side of the display section 401 of the display panel 40;

[0103] S3: Fabricate a second backplane 30 on the same side of the flat section 402 of the display panel 40, and a groove is formed at the interval position between the first backplane 20 and the second backplane 30;

[0104] S4: Fill the groove with a glue material;

[0105] S5: Bend the bending section 403 so that the second backplane 30 is placed on the side of the heat sink 10 away from the first backplane 20. Among them, an accommodation cavity is formed between the bending section 403 and the heat sink 10, the first backplane 20, and the second backplane 30. The support member 50 formed by the glue material is disposed in the accommodation cavity, and at least one end of the support member 50 abuts against the heat sink 10, and the edges of the first backplane 20 and the second backplane 30 facing the bending section 403 extend beyond the edges of the heat sink 10.

[0106] Among them, when the glue material is only disposed in the groove, the glue material is not provided on the surfaces of the first backplane 20 and the second backplane 30 away from the display panel 40.

[0107] Among them, the step of filling the groove with the glue material can be after fabricating the heat sink 10 and before fabricating the hardening layer 60.

[0108] Among them, the method of manual glue filling can be adopted.

[0109] Among them, a dispensing machine can also be used for dispensing, so as to dispose the glue material in the groove, and the dispensing machine can be in an offline state.

[0110] In one embodiment, the step of placing the second backplane 30 on the side of the heat sink 10 away from the first backplane 20 further includes: fabricating a hardening layer 60 on the side of the heat sink 10 away from the display section, and bending the bending section 403 so that the second backplane 30 is placed on the surface of the hardening layer 60 away from the heat sink 10.

[0111] Please refer to Figure 5, for randomly selected experimental samples Y1, Y2, and Y3, the support members 50 are prepared using Adhesives A and B with different moduli respectively, and a control group without a support member is set. Among them, the modulus of Adhesive A is greater than that of Adhesive B. The ordinate represents the value of the extrusion resistance ability, with the unit of N. It can be understood that by using an adhesive material to prepare the support member 50, the extrusion resistance ability of the overall structure formed by the bending section 403 and the support member 50 can be significantly improved, and the support member 50 obtained by using an adhesive material with a greater modulus has a stronger extrusion resistance ability.

[0112] It should be noted that Figures 5 to 8 All are experimental groups conducted for the case where the support member 50 is designed to be in imitation of and fit with the accommodation cavity.

[0113] Comparison Figure 6 , Figure 7 ; Among them, Figure 6 is an experiment on the risk of metal wire routing varying with displacement for a sample where the cross-sectional shape of the bending profile of the bending section 403 is an arc, and the arc is a semi-circle with a radius of 0.26 mm. Among them, Figure 7 is an experiment on the risk of metal wire routing varying with displacement for an elliptical sample where the cross-sectional shape of the bending profile of the bending section 403 is an arc. Specifically, the arc is a semi-ellipse with a major axis radius of 0.26 mm and a minor axis radius of 0.23 mm.

[0114] It can be understood that the ordinate represents the stress magnitude suffered by the metal wire routing of the source-drain layer in the wire routing area 2. The larger this value, the higher the risk of wire breakage; Figure 6 , Figure 7 The abscissa of and refers to the displacement, and the displacement refers to the length of the metal wire routing in the wire routing area 2. The dashed line BP1 refers to the stress value of the metal wire routing at the position of the first backplane 20, and the dashed line BP2 refers to the stress value of the metal wire routing at the position of the second backplane 30.

[0115] Please refer to Figure 8 , which shows the comparison of the extrusion resistance ability of the metal wire routing with and without the support member 50 when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse.

[0116] Among them, the abscissa is the apex position, and the apex position refers to: in the first direction, the left, middle, and right three different regions corresponding to the metal wire routing in the wire routing area 2. The ordinate is the extrusion resistance ability for randomly selected experimental samples Y4 and Y5 in different regions with and without the support member 50.

[0117] In the present application, a support member 50 is disposed in the accommodation cavity formed by the bending section 403 of the display panel 40, the heat sink 10, the first backplane 20, and the second backplane 30. One end of the support member 50 abuts against the side surface of at least one of the heat sink 10, the first backplane 20, and the second backplane 30. Thus, when the bending section 403 is deformed by extrusion, the amount of deformation of the bending section 403 is reduced by the support member 50, thereby preventing the metal trace from breaking due to excessive deformation, and further alleviating the bright line problem caused by the external force extrusion deformation of the bending section 403. Further, the present application may include, but is not limited to, using a glue material to fill the accommodation cavity to prepare the support member 50.

[0118] The present application also provides a terminal device, which includes the above display module and will not be described in detail here. Among them, the terminal device further includes a front frame and a middle frame. The terminal device includes, but is not limited to, mobile phones, computers, and flat panel display devices.

[0119] The display module provided by the embodiment of the present application includes a heat sink, a first backplane, a second backplane, and a display panel. The first backplane is disposed on one side of the heat sink in the film thickness direction, and the second backplane is disposed on the other side of the heat sink in the film thickness direction. The display panel includes a display section, a flat section, and a bending section. The display section is disposed on the side of the first backplane away from the heat sink, the flat section is disposed on the side of the second backplane away from the heat sink, the bending section is bent, and both ends of the bending section are respectively connected to the display section and the flat section. Among them, an accommodation cavity is formed between the bending section, the heat sink, the first backplane, and the second backplane. The edges of the first backplane and the second backplane facing the bending section exceed the edges of the heat sink. A support member is disposed in the accommodation cavity, and one end of the support member abuts against at least the heat sink. By disposing a support member in the accommodation cavity formed around the bending section, the support member is used to reduce the amount of deformation of the bending section. When preparing the support member with glue, by retracting the edge of the heat sink relative to the edges of the first backplane and the second backplane, the glue at least partially fills between the first backplane and the second backplane, so that one end of the support member abuts against at least the heat sink. Since the edge of the heat sink retracts relative to the edges of the first backplane and the second backplane to form an avoidance area, the volume of the accommodation cavity increases, and more glue can be accommodated, alleviating the excessive overflow of the glue, thereby alleviating the technical problem that the glue for forming the support member in the existing display module is prone to overflow.

[0120] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0121] The above has introduced in detail the display module and the method for manufacturing the display module provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A display module, characterized in that, Comprising: A heat sink; A first backplane disposed on one side of the heat sink in the film thickness direction; A second backplane disposed on the other side of the heat sink in the film thickness direction; A display panel including a display section, a flat section, and a bent section. The display section is disposed on the side of the first backplane away from the heat sink, the flat section is disposed on the side of the second backplane away from the heat sink, the bent section is bent, and two ends of the bent section are respectively connected to the display section and the flat section; Wherein, a receiving cavity is formed between the bent section, the heat sink, the first backplane, and the second backplane. Edges of the first backplane and the second backplane facing the bent section exceed the edges of the heat sink. A support member is disposed in the receiving cavity, and one end of the support member abuts at least against the heat sink.

2. The display module according to claim 1, characterized in that, The bent section includes a long side and a short side that is bent. The extending direction of the long side is a first direction. Along the first direction, the bent section includes a wiring area and reserved areas on both sides of the wiring area. Metal wirings are disposed in the wiring area, and the support member covers at least the wiring area.

3. The display module according to claim 2, characterized in that, The display panel further includes a GOA circuit. The GOA circuit includes an outgoing line end located in the wiring area. Along the first direction, the minimum distance between the edge of the bent section and the outgoing line end is d1, and the width of the reserved area is d2, where 0.2 mm ≤ d2 < d1.

4. The display module according to claim 1, characterized in that, The other end of the support member abuts against the bent section.

5. The display module according to claim 4, characterized in that, The support member is designed to be in imitation of the receiving cavity, and the outer contour surface of the support member is in fit with the inner contour surface of the receiving cavity.

6. The display module according to claim 1, characterized in that, The preparation material of the support member includes a glue material.

7. The display module according to claim 1, characterized in that, The cross-sectional shape of the bent contour of the bent section is any one of a semi-ellipse and a semi-circle.

8. The display module according to claim 7, characterized in that, The major axis of the semi-ellipse is disposed along the first direction, the minor axis of the semi-ellipse is perpendicular to the first direction and faces the bending vertex of the bent section, wherein the length of the major axis is greater than the length of the minor axis.

9. A method for manufacturing a display module, characterized in that, Comprising: Providing a display panel including a display section, a flat section, and a bent section located in the same plane; Successively preparing a first backplane and a heat sink on one side of the display section of the display panel; Preparing a second backplane on the same side of the flat section of the display panel, and a groove is formed at the spaced position between the first backplane and the second backplane; Filling the groove with a glue material; Bending the bent section so that the second backplane is disposed on the side of the heat sink away from the first backplane. Wherein, a receiving cavity is formed between the bent section, the heat sink, the first backplane, and the second backplane. The support member formed by the glue material is disposed in the receiving cavity, one end of the support member abuts at least against the heat sink, and the edges of the first backplane and the second backplane facing the bent section exceed the edges of the heat sink.

10. A terminal device, characterized in that, The terminal device includes the display module according to any one of claims 1 to 8.

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