Two-dimensional material stress regulation and control device, regulation and control method thereof and test system

Abstract

The embodiment of the invention provides a two-dimensional material stress regulation and control device, a regulation and control method thereof and a test system, and the two-dimensional material stress regulation and control device comprises a mounting frame (1) which is provided with a first groove (11) and a second groove (12), and the first groove (11) and the second groove (12) are arranged at an interval along a first direction (x) so as to form an elastic part (13) between the first groove (11) and the second groove (12), the areas, located on the two sides of the first groove (11) in the first direction (x), of the top of the installation frame (1) are constructed to bear the two-dimensional material (4) and are fixed to the two ends, in the first direction (x), of the two-dimensional material (4). And the driving part (2) is arranged on the mounting frame (1) and is configured to drive the elastic part (13) to deform in the first direction (x) so as to drive the part, located on the elastic part (13), of the two-dimensional material (4) to move to generate strain.

Description

Technical Field

[0001] The present disclosure relates to the technical field of two-dimensional materials, and in particular, to a two-dimensional material stress regulation device, a regulation method thereof, and a testing system. Background Art

[0002] Two-dimensional materials generally refer to materials with a thickness of only nanometers in one dimension and macroscopic scales in the other two dimensions. Their atomic layer thickness is extremely thin, resulting in many special properties in aspects such as electricity, optics, and mechanics, and they are key elements for preparing new quantum devices.

[0003] Two-dimensional materials have unique flexibility. When the material is stretched or compressed, the distance between its atoms changes, and this distance affects the physical properties of the material. Therefore, the physical properties can be regulated by stress. In recent years, the field of stress regulation of two-dimensional materials has received increasing attention. Currently, the strain regulation methods of two-dimensional materials are mainly divided into two categories: non-uniform strain regulation represented by patterned substrates and uniform strain regulation represented by stretching of flexible substrates.

[0004] However, there is a lack of a device in the prior art that can achieve a wide range of regulation of strain parameters, and this technical limitation seriously restricts the in-depth exploration of the physical properties of two-dimensional materials under different stress states. Therefore, there is a need for a device that can widely adjust the strain state of two-dimensional materials. Summary of the Invention

[0005] The present disclosure provides a two-dimensional material stress regulation device, a regulation method thereof, and a testing system, which can achieve a wide range of stress regulation of two-dimensional materials.

[0006] In a first aspect of the present disclosure, a two-dimensional material stress regulation device is provided, including:

[0007] A mounting frame having a first groove and a second groove, the first groove and the second groove being spaced apart along a first direction to form an elastic part between the first groove and the second groove. The regions of the top of the mounting frame on both sides of the first groove along the first direction are configured to carry the two-dimensional material and are fixed to the two ends of the two-dimensional material along the first direction; and

[0008] A driving component disposed on the mounting frame and configured to drive the elastic part to deform along the first direction, so as to drive the part of the two-dimensional material located on the elastic part to move, thereby generating strain.

[0009] In some embodiments, the two-dimensional material stress regulation device further includes:

[0010] A carrier layer, having a first gap, the first gap being aligned with and in line with the extending direction of the first groove, the carrier layer being disposed on the top of the mounting frame and configured to carry a two-dimensional material, and the part of the carrier layer on one side of the first gap being located on the elastic part; and

[0011] Two fixing members, configured to fix the two ends of the two-dimensional material to the parts of the carrier layer on both sides of the first gap respectively.

[0012] In some embodiments, the two-dimensional material stress regulation device further includes:

[0013] A sacrificial layer, removably disposed on the upper surface of the two-dimensional material, and located between the two fixing members along the first direction.

[0014] In some embodiments, the carrier layer is made of single crystal material.

[0015] In some embodiments, the driving component includes a piezoelectric ceramic, the piezoelectric ceramic is fixed to the mounting frame, and is configured to drive the elastic part to deform by applying a voltage.

[0016] In some embodiments, the tops of the mounting frames are all in the same plane.

[0017] In some embodiments, the elastic part is respectively provided with third grooves in the regions near the two ends along the second direction perpendicular to the first direction, and the elastic part includes:

[0018] A first wall, formed between the first groove and the two third grooves;

[0019] A second wall, formed between the second groove and the two third grooves; and

[0020] A carrier layer, formed between the two third grooves, and the carrier layer is connected between the first wall and the second wall along the first direction.

[0021] In some embodiments, at least one of the first groove, the second groove and the third groove penetrates along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0022] In some embodiments, the circumferential cross-section of the mounting frame forms a part of a circle, the two end walls of the first groove along the second direction, the wall of the second groove away from the elastic part, and the side walls of the two third grooves away from each other are located on the same circumference, and the center of the arc is located on the axis of the mounting frame.

[0023] In some embodiments, the first groove is located in the middle area of the mounting frame along the first direction and extends along the second direction perpendicular to the first direction.

[0024] In some embodiments, the bottom of the mounting frame further has a receiving cavity, the receiving cavity is located on the side of the first groove away from the second groove along the first direction, and the driving component is disposed in the receiving cavity.

[0025] In some embodiments, the maximum dimensions of the two-dimensional material stress regulation device in the first direction and the second direction are about 10 mm, and the maximum dimension in the third direction is about 6 mm; wherein, the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction.

[0026] In some embodiments, the two-dimensional material stress regulation device further includes:

[0027] A two-dimensional material, the two ends of which in the first direction are respectively fixed to the regions on both sides of the first slot along the first direction at the top of the mounting frame.

[0028] The second aspect of the present disclosure provides a test system, including:

[0029] The two-dimensional material stress regulation device of the above embodiment; and

[0030] A test component configured to detect the performance of the two-dimensional material during the process of generating strain in the two-dimensional material.

[0031] The third aspect of the present disclosure provides a regulation method based on the two-dimensional material stress regulation device described in the above embodiment, including the following steps:

[0032] Provide a two-dimensional material;

[0033] Carry the two-dimensional material on the top of the mounting frame, and the two-dimensional material straddles the first slot in the first direction and is located on both sides of the first slot;

[0034] Fix the two ends of the two-dimensional material in the first direction;

[0035] Drive the elastic part to deform in the first direction through the driving part, so as to drive the part of the two-dimensional material located on the elastic part to move to generate strain.

[0036] In some embodiments, the step of carrying the two-dimensional material on the top of the mounting frame includes:

[0037] Fix the bearing layer on the top of the mounting frame, and make the bearing layer straddle the first slot in the first direction and be located on both sides of the first slot;

[0038] Form a first gap on the bearing layer, and the first gap is consistent with the extending direction of the first slot and is vertically aligned;

[0039] Fix the two ends of the two-dimensional material to the bearing layer.

[0040] In some embodiments, the step of fixing the two ends of the two-dimensional material in the first direction includes:

[0041] Cover the sacrificial layer at the position where the two-dimensional material is aligned with the first gap;

[0042] Deposit metal layers at both ends of the two-dimensional material;

[0043] Remove the sacrificial layer and the metal layer attached to the sacrificial layer to form two fixing members, thereby fixing both ends of the two-dimensional material to the carrier layer.

[0044] In some embodiments, the step of forming the first slit on the carrier layer includes:

[0045] Locally press or cut the carrier layer with a hard tool to form the first slit.

[0046] In the two-dimensional material stress regulation device according to the embodiments of the present disclosure, an elastic part is formed by designing the structure of the installation frame, and one end of the two-dimensional material is fixed to the elastic part. In this way, when the driving component drives the elastic part to deform in the first direction, the first end of the two-dimensional material can also be driven to move accordingly, so that the two-dimensional material undergoes strain. This structure only needs to set a single driving component, has a simple structure and is easy to control, has high control precision, is easy to give the corresponding relationship between the driving force and the stress of the two-dimensional material, and can achieve real-time regulation. The working principle of the regulation device also requires a relatively low installation position for the driving component. Moreover, both ends of the two-dimensional material are fixed, and the first end of the two-dimensional material is driven to move by the elastic part, which is conducive to achieving a large range of regulation of the strain of the two-dimensional material. Description of the Drawings

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0048] Figure 1 It is an exploded view of some embodiments of the two-dimensional material stress regulation device of the present disclosure.

[0049] Figure 2 It is a schematic diagram of some embodiments of the two-dimensional material stress regulation device of the present disclosure in a test state.

[0050] Figure 3 It is a top view of some embodiments of the installation frame.

[0051] Figure 4 For Figure 3 The structural schematic diagram of the elastic part in

[0052] Figure 5 It is a schematic diagram of fixing the carrier layer on the installation frame and using a hard tool to break it to generate the first slit.

[0053] Figure 6Schematic diagram for transferring a two-dimensional material and a sacrificial layer onto a first gap of a carrier layer.

[0054] Figure 7 Schematic diagram for depositing a metal adhesion layer on a carrier layer, a two-dimensional material, and a sacrificial layer by magnetron sputtering.

[0055] Figure 8 Schematic diagram for removing the sacrificial layer and the metal layer attached thereto.

[0056] Figure 9 Schematic diagram for fixing a two-dimensional material to a carrier layer by two fixing members.

[0057] Figure 10 Schematic diagram for comparison of hexagonal boron nitride before and after stretching until fracture under an optical microscope.

[0058] Figure 11 Raman spectrum change of hexagonal boron nitride during the stretching process.

[0059] Figure 12 Optical-induced force microscopy image of hexagonal boron nitride at a specific wavelength.

[0060] Figure 13 Polariton line spectra measured under different stress states.

[0061] Explanation of reference numerals:

[0062] 1. Mounting frame; 11. First groove; 12. Second groove; 121. First side wall; 13. Elastic part; 131. Third groove; 1311. Second side wall; 132. Bearing part; 14. Flat part; 15. Wire passing hole; 16. First wall; 17. Second wall;

[0063] 2. Driving component;

[0064] 3. Carrier layer; 31. First gap;

[0065] 4. Two-dimensional material;

[0066] 5. Fixing member; 51. Second gap;

[0067] 6. Hard tool;

[0068] 7. Sacrificial layer;

[0069] 8. Metal layer;

[0070] x. First direction; y. Second direction; z. Third direction. Detailed implementation manners

[0071] The following further describes the embodiments of the present disclosure in conjunction with the accompanying drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, that is, the present disclosure is not limited to the described embodiments.

[0072] In the description of the embodiments of the present disclosure, the term "plurality" means two or more (including two). Similarly, "multiple groups" means two or more groups (including two groups).

[0073] The present disclosure uses descriptions of orientation or positional relationships indicated by "upper", "lower", "top", "bottom", "front", "rear", "inner" and "outer", etc. This is only for the convenience of describing the present disclosure, rather than indicating or implying that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the protection scope of the present disclosure.

[0074] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. The orientation terms appearing in the following description are all the directions shown in the figures and do not limit the specific structure of the present disclosure.

[0075] In the description of the present disclosure, it should also be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0076] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least some embodiments of the present disclosure. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0077] As Figures 1 to 13 shown, in some embodiments, the two-dimensional material stress regulation device of the present disclosure includes:

[0078] The mounting frame 1 has a first slot 11 and a second slot 12. The first slot 11 and the second slot 12 are spaced apart along a first direction x to form an elastic portion 13 therebetween. The regions of the top of the mounting frame 1 on both sides of the first slot 11 along the first direction x are configured to carry the two-dimensional material 4 and are fixed to the two ends of the two-dimensional material 4 along the first direction x; and

[0079] The driving member 2 is disposed on the mounting frame 1 and is configured to drive the elastic portion 13 to deform along the first direction x, so as to drive the portion of the two-dimensional material 4 on the elastic portion 13 to move, thereby generating strain.

[0080] Wherein, the mounting frame 1 can be made of a metal or plastic material. The material in the regions where the first slot 11 and the second slot 12 are located inside the mounting frame 1 is removed, and the elastic portion 13 can be formed between the first slot 11 and the second slot 12 through structural design. The elastic portion 13 has elasticity and the ability to deform towards any side along the first direction x.

[0081] The regions of the top of the mounting frame 1 on both sides of the first slot 11 along the first direction x are configured to jointly carry the two-dimensional material 4. The two-dimensional material 4 can be rectangular or other shapes. When adjustment is required, the two-dimensional material 4 is made to straddle the first slot 11 along the first direction x, and the portion on one side of the first slot 11 is carried on the elastic portion 13, and the portion on the other side of the first slot 11 is carried on the region away from the elastic portion 13 along the first direction x.

[0082] After fixing the two ends of the two-dimensional material 4 along the first direction x, by applying a driving force to the elastic portion 13 through the driving member 2, the elastic portion 13 can be driven to deform along the first direction x. Since one end of the two-dimensional material 4 is fixed to the top surface of the elastic portion 13, the driving member 2 can drive the first end of the two-dimensional material 4 to move synchronously, while the second end of the two-dimensional material 4 remains in place, thereby enabling the two-dimensional material 4 to generate strain. For example, the two ends of the two-dimensional material 4 can be fixed by bonding, or the two ends of the two-dimensional material 4 are respectively fixed by fixing members 5.

[0083] The driving member 2 can be arranged on the side of the first slot 11 away from the elastic portion 13 along the first direction x. The driving member 2 can apply a force to the middle region of the elastic portion 13 along a second direction y, so that the two sides of the elastic portion 13 deform more symmetrically and evenly. If the two-dimensional material 4 is placed in the middle region, a greater strain can also be achieved through adjustment. The driving member 2 can be disposed at the bottom of the mounting frame 1, and this setting method does not affect the arrangement of the two-dimensional material 4 at the top. The driving member 2 can adopt any linear driving member as long as it can stably apply a force to the elastic portion 13.

[0084] For example, when it is necessary to stretch the two-dimensional material 4, the driving component 2 applies a thrust to the elastic part 13, causing the entire elastic part 13 to deform in a direction away from the first groove 11, and the deformation amount is the largest in the middle region along the second direction y. At this time, the elastic part 13 can drive the first end of the two-dimensional material 4 to stretch to generate tensile strain.

[0085] For example, when it is necessary to compress the two-dimensional material 4, the driving component 2 applies a pulling force to the elastic part 13, causing the entire elastic part 13 to deform in a direction close to the first groove 11, and the deformation amount is the largest in the middle region along the second direction y. At this time, the elastic part 13 can drive the first end of the two-dimensional material 4 to compress to generate compressive strain.

[0086] In this embodiment, the elastic part 13 is formed by the structural design of the mounting frame 1, and one end of the two-dimensional material 4 is fixed to the elastic part 13. In this way, when the driving component 2 drives the elastic part 13 to deform along the first direction x, it can also drive the first end of the two-dimensional material 4 to move accordingly, so that the two-dimensional material 4 generates strain. This structure only needs to set a single driving component 2, with a simple structure and easy to control, high control accuracy, easy to give the corresponding relationship between the driving force and the stress of the two-dimensional material 4, and can achieve real-time regulation. The working principle of the regulation device also has relatively low requirements for the installation position of the driving component 2. Moreover, both ends of the two-dimensional material 4 are fixed, and the first end of the two-dimensional material 4 is driven by the elastic part 13, which is beneficial to realizing a large range of regulation of the strain of the two-dimensional material 4.

[0087] In some embodiments, the two-dimensional material stress regulation device further includes:

[0088] A bearing layer 3 having a first gap 31, the first gap 31 extending in the same direction as and aligned with the first groove 11. The bearing layer 3 is placed on top of the mounting frame 1 and is used to bear the two-dimensional material 4. The part of the bearing layer 3 on one side of the first gap 31 is located on the elastic part 13; and

[0089] Two fixing members 5 configured to fix the two ends of the two-dimensional material 4 to the parts of the bearing layer 3 on both sides of the first gap 31, respectively.

[0090] Among them, the bearing layer 3 is used as the bottom layer material, and a first gap 31 is provided thereon. The first gap 31 can penetrate through both the second direction y and the third direction z of the bearing layer 3. The second direction y is perpendicular to the first direction x, and the third direction z is perpendicular to both the first direction x and the second direction y.

[0091] Optionally, the two-dimensional material 4 is fixed to the mounting frame 1.

[0092] Optionally, the bearing layer 3 is formed by two independent layer structures respectively installed on both sides of the first groove 11 to form the first gap 31.

[0093] The width of the first gap 31 can be set according to actual requirements. For example, if the width of the first groove 11 is 100 micrometers, when the first gap 31 is formed by applying local pressure or scribing to the carrier layer 3, the width of the first gap 31 can be set to be from 1 micrometer to 10 micrometers; if two independent layer structures are respectively installed on both sides of the first groove 11, the width of the first gap 31 can be set to be about 100 micrometers. In comparison, applying local pressure or scribing to the carrier layer 3 is easier to form a narrower first gap 31, which can reduce the height difference of the carrier layer 3 on both sides of the first gap 31, facilitate placing the two-dimensional material 4 on the carrier layer 3, and enable the flatness of the two-dimensional material 4 placed on the carrier layer 3, facilitating accurate stress regulation.

[0094] If the width of the first gap 31 is too large, for example, when stretching at a relatively large distance between both ends of the two-dimensional material 4, during stretching, the distribution of the deformed area in the stretching direction is uneven, making the deformation of the two-dimensional material 4 unstable.

[0095] The carrier layer 3 is arranged on the top of the mounting frame 1. The part of the carrier layer 3 on one side of the first gap 31 is located on the elastic part 13, and the part of the carrier layer 3 on the other side of the first gap 31 is located in the area of the top of the mounting frame 1 that is away from the elastic part 13 along the first direction x of the first gap 31, and both ends of the carrier layer 3 are limited and fixed by the fixing member 5.

[0096] For example, the carrier layer 3 can be fixed by epoxy resin glue or ultraviolet curable glue.

[0097] For example, the fixing member 5 is a metal adhesion layer, which can be realized by metal deposition, and can tightly connect the two-dimensional material 4 and the carrier layer 3, prevent sliding during stretching, and is beneficial to increasing the stress regulation range of the two-dimensional material 4.

[0098] In this embodiment, the two-dimensional material 4 is fixed on the carrier layer 3, and both ends of the two-dimensional material 4 can be fixed on the carrier layer 3, which will not affect the structure of the mounting frame 1 and enables the repeated use of the mounting frame 1. When the driving member 2 applies a force to the elastic part 13, it can drive the elastic part 13 to deform, and at the same time drive the width of the first gap 31 to change, thereby applying stress to the two-dimensional material 4.

[0099] In some embodiments, as Figure 7 and Figure 8 shown, the two-dimensional material stress regulation device further includes a sacrificial layer 7. The sacrificial layer 7 is removably disposed on the upper surface of the two-dimensional material 4 and is located between the two fixing members 5 along the first direction x.

[0100] For example, the sacrificial layer 7 can occupy the space between the two fixing members 5. In a first aspect, the dimension of the sacrificial layer 7 along the first direction x is consistent with the gap between the two fixing members 5. When the fixing members 5 are formed by metal deposition, the sacrificial layer 7 blocks the middle region of the two-dimensional material 4 along the first direction x, and the metal adhesion layers are formed on both sides of the sacrificial layer 7, thereby fixing the two ends of the two-dimensional material 4. In a second aspect, after the sacrificial layer 7 is removed, a second gap 51 penetrating along the second direction y can be formed between the two fixing members 5, and the two fixing members 5 only fix the two ends of the two-dimensional material 4 along the first direction x, thereby facilitating stress regulation of the two-dimensional material 4.

[0101] For example, the sacrificial layer 7 can be bonded to the upper surface of the two-dimensional material 4 or maintain its position on the upper surface of the two-dimensional material 4 under the action of gravity.

[0102] In this embodiment, the sacrificial layer 7 is provided on the upper surface of the two-dimensional material 4. Before stress regulation of the two-dimensional material 4 is required, the sacrificial layer 7 can be removed to form a second gap 51 between the two fixing members 5. The sacrificial layer 7 can define the minimum width of the second gap 51 along the first direction x to meet the stress regulation requirements, and prevent metal from adhering to the region where the second gap 51 is located when the fixing members 5 are formed by metal deposition, facilitating metal deposition on the predetermined region.

[0103] In some embodiments, the carrier layer 3 is made of a single crystal material. For example, single crystal silicon wafers, single crystal alumina substrates, etc.

[0104] The carrier layer 3 of this embodiment is made of a brittle material and is prone to fracture rather than significant plastic deformation when subjected to an external force. As Figure 5 shown, after the carrier layer 3 is fixed to the mounting frame 1, it is easy to apply a local external force on the carrier layer 3 through a hard tool 6 to form a first gap 31 of natural fracture. Moreover, since the carrier layer 3 is made of a single crystal material, it is easy to form a first gap 31 extending linearly and with neat edges when locally pressed or scribed. For example, the hard tool 6 can be a tweezer or a diamond knife, etc.

[0105] In some embodiments, as Figure 1 shown, the driving component 2 includes a piezoelectric ceramic, which is fixed to the mounting frame 1 and is configured to drive the elastic part 13 to deform by applying a voltage.

[0106] Piezoelectric ceramics are a type of functional ceramic materials that can generate electric charges when subjected to mechanical stress or undergo mechanical deformation when an electric field is applied. When a voltage is applied to piezoelectric ceramics, the internal electric dipole moments are affected by the electric field and undergo small changes (elongation or contraction). The accumulation of these microscopic changes leads to a measurable deformation in the macroscopic dimensions of the material. Within the normal operating range, this deformation process is reversible. When the applied voltage is removed, the piezoelectric ceramics return to their original state.

[0107] For example, when a positive voltage is applied to the piezoelectric ceramics, the two-dimensional material 4 can be stretched; when a negative voltage is applied to the piezoelectric ceramics, the two-dimensional material 4 can be compressed.

[0108] For example, the piezoelectric ceramics can be fixed to the mounting frame 1 through an adhesive.

[0109] In this embodiment, by setting the piezoelectric ceramics as the driving component 2, the response speed is fast, the accuracy of applying strain to the two-dimensional material 4 can be improved, and it is convenient to control the correspondence between the strain of the two-dimensional material 4 and the applied voltage, meeting the requirements of dynamic regulation. The required strain can be applied to the two-dimensional material 4 in real time by controlling the voltage value. Moreover, only one piezoelectric ceramic needs to be set, the structure is simple, the cost is low, and the working principle of the regulation device places relatively low requirements on the installation position of the piezoelectric ceramics.

[0110] In some embodiments, as Figure 2 shown, the tops of the mounting frame 1 are all in the same plane.

[0111] The mounting frame 1 of this embodiment is easy to process and is conducive to obtaining better flatness of the top of the mounting frame 1. When the two-dimensional material 4 is mounted on the mounting frame 1 or the two-dimensional material 4 is mounted on the mounting frame 1 through the bearing layer 3, it can be ensured that the parts of the two-dimensional material 4 on both sides of the first groove 11 are in the same plane, so as to better regulate its strain.

[0112] In addition, this structure can make the two-dimensional material 4 basically located at the top of the mounting frame 1. Even if the thickness occupied by the fixing member 5 is small, the two-dimensional material 4 is not blocked by the surrounding structure, which is convenient for detection by various detection devices; moreover, many detection devices have requirements for the volume and size of the regulation device used in cooperation. The regulation device of the present disclosure has a small volume and can meet the usage requirements of most detection devices. Therefore, the regulation device of the present disclosure can be compatible with a variety of high-precision characterization means, such as scanning probe, Raman spectroscopy detection equipment, etc.

[0113] In some embodiments, as Figure 3 and Figure 4 shown, the elastic part 13 is respectively provided with third grooves 131 in the regions near both ends along the second direction y perpendicular to the first direction x. The elastic part 13 includes:

[0114] A first wall 16 is formed between the first groove 11 and the two third grooves 131;

[0115] A second wall 17 formed between the second groove 12 and the two third grooves 131; and

[0116] The bearing portion 132 is formed between the two third grooves 131 , and the bearing portion 132 is connected between the first wall 16 and the second wall 17 along the first direction x.

[0117] exist Figure 4 In the figure, the white areas are all in the same plane, and the areas filled with dark grey are all provided with grooves. The first wall 16 and the second wall 17 are both thin-walled structures extending along the second direction y, which are conducive to deformation.

[0118] This embodiment, on the basis of forming a structure between the first groove 11 and the second groove 12, further arranges the third groove 131 in the area near the two ends along the second direction y, which can further increase the elasticity of the elastic part 13, and is more likely to deform when the driving component 2 applies a force. The first wall 16, the second wall 17 and the bearing part 132 are connected to form an "I"-shaped structure, and two thin walls are arranged at intervals along the first direction x, and the two thin walls are connected to the outer edge of the mounting frame 1 at both ends along the second direction y to form a frame structure. The structure is more stable, and when the driving component 2 applies an external force to the elastic part 13, it is not easy to tilt in the up and down direction, which can reduce the accuracy requirements for the position and direction of the force applied by the driving component 2.

[0119] For example, if the driving component 2 is located on the side of the first groove 11 away from the elastic part 13, when the driving component 2 applies a thrust to the bearing part 132, it will push the bearing part 132 to move in a direction away from the first groove 11, and at the same time drive the thinner first wall 16 and the second wall 17 to deform outward into an arc shape, thereby deforming the elastic part 13 outward as a whole.

[0120] Optionally, the mounting frame 1 may also form a single thin wall only through the first groove 11 and the second groove 12 , and a bearing portion 132 is provided on one side of the thin wall along the first direction x.

[0121] In some embodiments, at least one of the first groove 11, the second groove 12 and the third groove 131 is continuous along the third direction z, and the third direction z is perpendicular to the first direction x and the second direction y. By providing a continuous groove in the thickness direction of the mounting frame 1, the elasticity of the elastic part 13 can be increased, and it is easier to deform under the action of the driving component 2, so that the two-dimensional material 4 has a larger control range.

[0122] In some embodiments, Figure 3As shown, the circumferential cross-sectional shape of the mounting frame 1 is a part of a circle. The two end walls of the first groove 11 along the second direction y, the wall of the second groove 12 away from the elastic part 13, and the side walls of the two third grooves 131 away from each other are located on the same circumference, and the center of the arc is located on the axis of the mounting frame 1.

[0123] Among them, the wall of the second groove 12 away from the elastic part 13 is the first side wall 121, and the side walls of the two third grooves 131 away from each other are the second side walls 1311.

[0124] In this embodiment, by arranging the side walls of each groove close to the outer edge of the mounting frame 1 on the same circumference, the side walls can be equidistant from the outer edge of the mounting frame 1, so that the mounting frame 1 maintains sufficient structural strength, and the influence of the deformation of the elastic part 13 on the overall structure of the mounting frame 1 can be reduced.

[0125] In some embodiments, as Figure 3 shown, the first groove 11 is located in the middle area of the mounting frame 1 along the first direction x and extends along the second direction y perpendicular to the first direction x.

[0126] In this embodiment, by making the first groove 11 located in the middle area of the mounting frame 1 along the first direction x, sufficient space can be left on one side of the first groove 11 to arrange the elastic part 13, and it is convenient to leave enough space on the other side of the first groove 11 to arrange the driving component 2, so that the overall structural layout is more reasonable.

[0127] In some embodiments, as Figure 1 and Figure 2 shown, the bottom of the mounting frame 1 also has a receiving cavity. The receiving cavity is located on the side of the first groove 11 away from the second groove 12 along the first direction x, and the driving component 2 is arranged in the receiving cavity. For example, the driving component 2 is a piezoelectric ceramic, and the piezoelectric ceramic can be fixed in the receiving cavity through an adhesive.

[0128] In this embodiment, by arranging the driving component 2 in the receiving cavity, the driving component 2 does not need to occupy extra space, and the overall volume of the entire regulation device can be reduced. Moreover, this setting method facilitates the driving component 2 to be located in the middle area of the mounting frame 1 along the third direction z. When applying a force to the elastic part 13, the problem of uneven stress on the upper and lower parts of the elastic part 13 can be reduced.

[0129] In some embodiments, the maximum dimensions of the two-dimensional material stress regulation device in the first direction x and the second direction y are about 10 mm, and the maximum dimension in the third direction z is about 6 mm; among them, the second direction y is perpendicular to the first direction x, and the third direction z is perpendicular to the first direction x and the second direction y. For example, if the mounting frame 1 is cylindrical, its diameter is 10 mm and its height is 6 mm. Among them, due to the deviation in the measurement of the dimensions, "about" can mean that it is within the protection range within ±20% of this dimension.

[0130] This two-dimensional material stress regulation device is small in volume, compact in structure, and convenient to use. Moreover, many detection devices have requirements for the volume size of the regulation device used in cooperation. The regulation device of the present disclosure is small in volume size, can meet the usage requirements of most detection devices, and is conducive to being compatible with a variety of high-precision characterization means, such as scanning probe, Raman spectroscopy detection devices, etc.

[0131] In some embodiments, the two-dimensional material stress regulation device further includes:

[0132] A two-dimensional material 4, the two ends of which along the first direction x are respectively fixed in the regions on both sides of the first groove 11 along the first direction x at the top of the mounting frame 1.

[0133] Secondly, the present disclosure provides a test system. In some embodiments, it includes:

[0134] The two-dimensional material stress regulation device of the above embodiment; and

[0135] A test component configured to detect the performance of the two-dimensional material 4 during the process of generating strain in the two-dimensional material 4.

[0136] For example, the test component can test the physical properties or electrical properties, etc. of the two-dimensional material 4 under different stress states. For example, the test component can be a Raman spectroscopy instrument or an atomic force microscope instrument, etc. for testing physical properties.

[0137] The regulation device of this embodiment can regulate the stress of the two-dimensional material 4 in real time and over a large range. Since the overall volume is small and the two-dimensional material 4 is located in the top region, it can be conveniently compatible with a variety of test components. Therefore, the performance of the two-dimensional material 4 under different stress states can be conveniently and accurately tested.

[0138] Finally, the present disclosure also provides a regulation method based on the two-dimensional material stress regulation device of the above embodiment. In some embodiments, it includes the following steps:

[0139] Step 110: Provide the two-dimensional material 4;

[0140] Step 120: Place the two-dimensional material 4 on the top of the mounting frame 1, and the two-dimensional material 4 straddles the first groove 11 along the first direction x and is located on both sides of the first groove 11;

[0141] Step 130: Fix the two ends of the two-dimensional material 4 along the first direction x;

[0142] Step 140: Drive the elastic part 13 to deform along the first direction x through the driving part 2, so as to drive the part of the two-dimensional material 4 located on the elastic part 13 to move and generate strain.

[0143] Among them, steps 110 to 140 are executed in sequence. In step 120, the two-dimensional material 4 straddles the first groove 11 in the first direction x, and the first end is located on the elastic part 13.

[0144] In this embodiment, when the driving component 2 drives the elastic part 13 to deform in the first direction x, it can also drive the first end of the two-dimensional material 4 to move accordingly, so that the two-dimensional material 4 undergoes strain. This kind of structure only needs to set a single driving component 2, with a simple structure and easy to control, high control precision, easy to give the corresponding relationship between the driving force and the stress of the two-dimensional material 4, and can achieve real-time regulation. The working principle of the regulating device also requires a lower installation position for the driving component 2. Moreover, by only driving the first end of the two-dimensional material 4 to move through the elastic part 13, it is beneficial to realize a large range of regulation of the strain of the two-dimensional material 4.

[0145] In some embodiments, the step of carrying the two-dimensional material 4 on the top of the mounting frame 1 in step 120 includes:

[0146] Fix the carrier layer 3 on the top of the mounting frame 1, and make the carrier layer 3 straddle the first groove 11 in the first direction x and be located on both sides of the first groove 11;

[0147] Form a first slit 31 on the carrier layer 3, and the first slit 31 is consistent with the extending direction of the first groove 11 and is vertically aligned;

[0148] Transfer the two-dimensional material 4 to the carrier layer 3, and the two-dimensional material 4 straddles the first slit 31 in the first direction x.

[0149] Among them, the carrier layer 3, as the bottom layer material, can be fixed on the mounting frame 1 by epoxy resin glue or ultraviolet light-curing glue. The carrier layer 3 is made of a brittle material and is prone to break rather than undergo obvious plastic deformation when subjected to an external force. Subsequently, the two-dimensional material 4 is transferred onto the carrier layer 3 through a dry transfer technique.

[0150] In this embodiment, the two-dimensional material 4 is fixed on the carrier layer 3, and the two ends of the two-dimensional material 4 can be fixed on the carrier layer 3, which will not affect the structure of the mounting frame 1 and can realize the repeated use of the mounting frame 1. When the driving component 2 applies a force to the elastic part 13, it can drive the elastic part 13 to deform, and at the same time drive the width of the first slit 31 to change, so as to apply stress to the two-dimensional material 4.

[0151] In some embodiments, as Figures 6 to 9 shown, the step of fixing the two ends of the two-dimensional material 4 in the first direction x in step 140 includes:

[0152] Cover the sacrificial layer 7 at the position where the two-dimensional material 4 is aligned with the first slit 31;

[0153] Deposit metal layers at both ends of the two-dimensional material 4;

[0154] Remove the sacrificial layer 7 and the metal layer 8 attached to the sacrificial layer 7 to form two fixing members 5, thereby fixing both ends of the two-dimensional material 4 to the carrier layer 3.

[0155] Among them, as Figure 6 shown, a sacrificial layer 7 is provided above the two-dimensional material 4. The sacrificial layer 7 extends along the entire width of the two-dimensional material 4 in the second direction y. The width of the sacrificial layer 7 in the first direction x can be greater than the width of the first gap 31. The two-dimensional material 4 and the sacrificial layer 7 can be sequentially placed on the carrier layer 3 through a dry transfer technique. For example, the material of the sacrificial layer 7 is MoO3.

[0156] As Figure 7 shown, deposit a metal layer 8 at both ends of the two-dimensional material 4. The metal layer 8 can be deposited by magnetron sputtering. During the deposition process, cover the metal layer on both sides of the sacrificial layer 7 on the upper surface of the two-dimensional material 4. At the same time, it is inevitable that a metal layer 8 will also adhere to the upper surface of the sacrificial layer 7. The size of the two-dimensional material 4 in the first direction x is smaller than that of the carrier layer 3. Therefore, the deposited metal will also be located on the side of the carrier layer 3 to reliably fix the end of the two-dimensional material 4 on the carrier layer 3.

[0157] As Figure 8 shown, use the Pick-Up technique commonly used in two-dimensional material transfer to pick up the sacrificial layer 7 and the metal layer 8 covering the sacrificial layer 7, and finally obtain Figure 8 the structure shown. Both ends of the two-dimensional material 4 are adhered to the underlying carrier layer 3 by the deposited metal to form two fixing members 5. During the continuous application of voltage to the piezoelectric ceramic, the two-dimensional material 4 is subjected to continuous and reliable tensile stress.

[0158] The width of the sacrificial layer 7 in the first direction x can be slightly greater than the width of the first gap 31. After the sacrificial layer 7 is removed, a second gap 51 is formed. The width of the second gap 51 is also slightly greater than the width of the first gap 31. During the stretching process of the two-dimensional material 4, the stretching region can occur within the width region occupied by the sacrificial layer 7.

[0159] In this embodiment, by providing the sacrificial layer 7 and cooperating with the method of metal deposition, both ends of the two-dimensional material 4 can be reliably fixed to the carrier layer 3 to continuously and stably apply a tensile force to the two-dimensional material 4. Moreover, since the widths of both the first gap 31 and the second gap 51 are small, it is equivalent that the fixing area of the fixing member 5 to the two-dimensional material 4 is small, and it is easy to stably apply a force to the region with a small width in the middle, and a large strain regulation range can be achieved for the two-dimensional material 4.

[0160] In some embodiments, as Figure 5 shown, the step of forming the first gap 31 on the carrier layer 3 includes:

[0161] A hard tool 6 is used to locally press or cut the bearing layer 3 to form a first gap 31.

[0162] As Figure 5 shown, a first gap 31 formed by natural fracture is formed on the bearing layer 3 by applying a local external force with the hard tool 6. The bearing layer 3 is made of a single crystal material, and it is easy to form a first gap 31 extending in a straight line during local pressing or cutting, and the edge of the first gap 31 is neat. The width of the first gap 31 and the first groove 11 can be the same.

[0163] In this embodiment, the first gap 31 is formed on the bearing layer 3 by the hard tool 6, so that the width of the first gap 31 can be controlled to be appropriate, and the straightness of the first gap 31 can be improved. Moreover, by locally pressing or cutting with the hard tool 6 to form the first gap 31, the width of the first gap 31 can be reduced, thereby reducing the height difference between the two sides of the bearing layer 3 where the first gap 31 is located, facilitating the placement of the two-dimensional material 4 on the bearing layer 3, and enabling the flatness of the two-dimensional material 4 placed on the bearing layer 3, which is convenient for accurately regulating the stress.

[0164] The structure and working principle of the two-dimensional material stress regulation device of the present disclosure will be described below through a specific embodiment.

[0165] As Figure 1 and Figure 2 shown, the installation frame 1 has an overall cylindrical structure, and a slender first groove 11 is provided in the middle area thereof. The first groove 11 extends along the second direction y. A second groove 12 is provided at intervals along the first direction x on one side of the first groove 11. The second groove 12 has a semi-circular structure. Third grooves 131 are respectively provided at both end regions of the portion between the first groove 11 and the second groove 12 along the second direction y. A bearing portion 132 is formed between the two third grooves 131. A first wall 16 is formed between the first groove 11 and the third groove 131, and a second wall 17 is formed between the second groove 12 and the third groove 131. An "I"-shaped structure is formed among the first wall 16, the second wall 17 and the bearing portion 132 as an elastic portion 13. A receiving cavity is provided on the bottom of the installation frame 1 on the side of the first groove 11 away from the elastic portion 13, and a piezoelectric ceramic is provided in the receiving cavity. A flat portion 14 is provided on the side wall of the installation frame 1 opposite to the second groove 12, and a wire passing hole 15 is provided on the flat portion 14 for introducing a wire to connect to a driving component 2 such as a piezoelectric ceramic.

[0166] When it is necessary to regulate the two-dimensional material 4, the following steps are adopted:

[0167] 1. As Figure 5 shown, the bearing layer 3 is fixed on the installation frame 1, and a pressure is applied to the bearing layer 3 with the hard tool 6, so that the bearing layer 3 undergoes natural fracture to generate a first gap 31.

[0168] 2. AsFigure 6 As shown, using the dry transfer technique, the two-dimensional material 4 and the sacrificial layer 7 are sequentially transferred onto the first gap 31 of the carrier layer 3.

[0169] 3. As Figure 7 shown, using magnetron sputtering, a metal layer is deposited on the carrier layer 3, the two-dimensional material 4, and the sacrificial layer 7, and the metal layer covers both ends of the two-dimensional material 4 and the sacrificial layer 7.

[0170] 4. As Figure 8 shown, using the Pick-Up technique commonly used in two-dimensional material transfer, the sacrificial layer 7 and the metal layer 8 covering it are picked up.

[0171] 5. After forming the Figure 9 structure shown, the two-dimensional material 4 is adhered to the carrier layer 3 by the metal layer, forming two fixing parts 5. By applying a voltage to the piezoelectric ceramic, the elastic part 13 can be driven to deform, and the width of the first gap 31 increases. During the process of the elastic part 13 deforming away from the first groove 11, the first end of the two-dimensional material 4 is driven to stretch and is subjected to uniaxial tensile stress. The stress changes with the voltage applied to the piezoelectric ceramic.

[0172] The following takes the stress regulation of hexagonal boron nitride by the above-mentioned regulation device as an example for illustration.

[0173] In some embodiments, the stress of hexagonal boron nitride is regulated, and its Raman spectrum is measured. The Raman spectrum measurement uses a 532 nm laser with a power of 1 mW. The thickness of the hexagonal boron nitride is 70 nm, the carrier layer 3 is a silicon oxide wafer, and the metal adhesion layer is gold with a thickness of 100 nm.

[0174] Figure 10 shows the changes of hexagonal boron nitride before and after stretching under an optical microscope. By gradually applying a voltage to the piezoelectric ceramic, the hexagonal boron nitride is subjected to continuously increasing uniaxial tensile stress, which ultimately leads to its complete fracture. The left figure is the state diagram before applying the tensile stress, and the right figure is the state diagram stretched to fracture. The irregular light-colored area A is the fracture crack, and the scale is 20 um.

[0175] Figure 11 records the changes in the Raman spectrum of hexagonal boron nitride during the stretching process. It can be seen from the spectral data that as the tensile stress increases, the characteristic Raman peak position of hexagonal boron nitride undergoes an obvious red shift and partially recovers after fracture, which is consistent with the results seen under the optical microscope. This shows that such a regulation device is compatible with Raman spectrum detection and reflects the change of the Raman signal (the source of the Raman signal is phonon vibration, so it can also be said to be the phonon vibration mode) of hexagonal boron nitride with stress.

[0176] In some embodiments, stress regulation is performed on hexagonal boron nitride, and the change of its phonon polaritons with stress is measured using a photo-induced force microscope. The thickness of the hexagonal boron nitride is 40 nm, the carrier layer 3 is a silica wafer, and the metal adhesion layer is gold with a thickness of 100 nm.

[0177] A photo-induced force microscope (PiFM) is a scanning probe technique based on an atomic force microscope (AFM). It can measure the near-field optical signal of materials at the nanoscale. Its core principle is to utilize the local optical polarization effect generated between the AFM tip and the sample under light illumination, which changes the interaction force between the tip and the sample, thereby obtaining the local vibration characteristics and optical absorption distribution of the sample at the nanoscale.

[0178] Figure 12 Shows the photo-induced force microscopy image of hexagonal boron nitride at a wavelength of 1410 cm -1 The scale bar is 2 μm, and it can be clearly seen that the polaritons excited by the slit.

[0179] Figure 13 Shows the polariton line spectra measured under different stress states. As the stress increases, the polariton wavelength shows a decreasing trend. This wavelength modulation effect can be attributed to the lattice deformation caused by stress, which in turn changes the phonon properties of the material. Figure 13 The data in Figure 12 is extracted from the white dashed box in

[0180] Figure 12 and Figure 13 reflect that through the photo-induced force microscope, high-resolution imaging and analysis can be performed on the near-field optical signals of hexagonal boron nitride under different stress states. In particular, it can observe and characterize the changes of its phonon polaritons under stress regulation. Since the phonon polaritons in hexagonal boron nitride are strongly coupled with stress, the test results can intuitively show the correlation between the material stress distribution and the near-field optical properties.

[0181] Although the present disclosure has been described with reference to the preferred embodiments, various modifications can be made to it without departing from the scope of the present disclosure, and components therein can be replaced with equivalents. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A two-dimensional material stress control device, characterized in that: include: A mounting frame (1) having a first groove (11) and a second groove (12), wherein the first groove (11) and the second groove (12) are arranged at intervals along a first direction (x) to form an elastic portion (13) between the first groove (11) and the second groove (12), and an area of ​​the top of the mounting frame (1) located on both sides of the first groove (11) along the first direction (x) is configured to carry a two-dimensional material (4) and is fixed to both ends of the two-dimensional material (4) along the first direction (x); and A driving component (2) is disposed on the mounting frame (1) and is configured to drive the elastic portion (13) to deform along the first direction (x) so as to drive the portion of the two-dimensional material (4) located on the elastic portion (13) to move, thereby generating strain.

2. The two-dimensional material stress control device according to claim 1, characterized in that: Also includes: a bearing layer (3) having a first slit (31), the first slit (31) and the first groove (11) extending in the same direction and aligned with each other, the bearing layer (3) being arranged on the top of the mounting frame (1) and used for bearing the two-dimensional material (4), and a portion of the bearing layer (3) located on one side of the first slit (31) being located on the elastic portion (13); and The two fixing members (5) are configured to respectively fix two ends of the two-dimensional material (4) to portions of the supporting layer (3) located on both sides of the first slit (31).

3. The two-dimensional material stress control device according to claim 2, characterized in that: Also includes: The sacrificial layer (7) is removably disposed on the upper surface of the two-dimensional material (4) and is located between the two fixing members (5) along the first direction (x).

4. The two-dimensional material stress control device according to claim 2, characterized in that: The bearing layer (3) is made of single crystal material.

5. The two-dimensional material stress control device according to claim 1, characterized in that: The driving component (2) comprises a piezoelectric ceramic, which is fixed to the mounting frame (1) and is configured to drive the elastic part (13) to deform by applying a voltage.

6. The two-dimensional material stress control device according to claim 1, characterized in that: The tops of the installation frames (1) are all located in the same plane.

7. The two-dimensional material stress control device according to claim 1, characterized in that: The elastic part (13) is provided with third grooves (131) in areas close to both ends along a second direction (y) perpendicular to the first direction (x), respectively. The elastic part (13) comprises: A first wall (16) formed between the first groove (11) and the two third grooves (131); a second wall (17) formed between the second groove (12) and the two third grooves (131); and A bearing portion (132) is formed between the two third grooves (131), and the bearing portion (132) is connected between the first wall (16) and the second wall (17) along the first direction (x).

8. The two-dimensional material stress control device according to claim 7, characterized in that: At least one of the first groove (11), the second groove (12) and the third groove (131) is connected along a third direction (z), and the third direction (z) is perpendicular to the first direction (x) and the second direction (y).

9. The two-dimensional material stress control device according to claim 7, characterized in that: The circumferential cross-sectional shape of the mounting frame (1) is a portion of a circle, the two end walls of the first groove (11) along the second direction (y), the wall of the second groove (12) away from the elastic portion (13), and the side walls of the two third grooves (131) away from each other are located on the same circumference, and the center of the arc is located on the axis of the mounting frame (1).

10. The two-dimensional material stress control device according to any one of claims 1 to 9, characterized in that: The first groove (11) is located in a middle area of ​​the mounting frame (1) along the first direction (x), and extends along a second direction (y) perpendicular to the first direction (x).

11. The two-dimensional material stress control device according to any one of claims 1 to 9, characterized in that: The bottom of the mounting frame (1) also has a receiving cavity, the receiving cavity being located on a side of the first groove (11) away from the second groove (12) along the first direction (x), and the driving component (2) is arranged in the receiving cavity.

12. The two-dimensional material stress control device according to any one of claims 1 to 9, characterized in that: The maximum dimensions of the two-dimensional material stress regulation device in the first direction (x) and the second direction (y) are approximately 10 mm, and the maximum dimension in the third direction (z) is approximately 6 mm; wherein the second direction (y) is perpendicular to the first direction (x), and the third direction (z) is perpendicular to the first direction (x) and the second direction (y).

13. The two-dimensional material stress control device according to any one of claims 1 to 9, characterized in that: Also includes: The two-dimensional material (4) has its two ends along the first direction (x) respectively fixed to the regions on the top of the mounting frame (1) and located on both sides of the first groove (11) along the first direction (x).

14. A testing system, characterized in that: include: The two-dimensional material stress regulating device according to any one of claims 1 to 13; and The testing component is configured to detect the performance of the two-dimensional material (4) during the process of generating strain in the two-dimensional material (4).

15. A control method based on the two-dimensional material stress control device according to any one of claims 1 to 13, characterized in that: The following steps are involved: Providing two-dimensional materials (4); The two-dimensional material (4) is carried on the top of the installation frame (1), wherein the two-dimensional material (4) crosses the first groove (11) along the first direction (x) and is located on both sides of the first groove (11); Fixing the two-dimensional material (4) at both ends along the first direction (x); The elastic part (13) is deformed along the first direction (x) by the driving component (2), so as to drive the part of the two-dimensional material (4) located on the elastic part (13) to move and generate strain.

16. The control method according to claim 15, characterized in that: The step of carrying the two-dimensional material (4) on the top of the mounting frame (1) comprises: Fixing a bearing layer (3) on the top of the installation frame (1), and making the bearing layer (3) cross the first groove (11) along the first direction (x) and be located on both sides of the first groove (11); A first slit (31) is formed on the bearing layer (3), wherein the first slit (31) and the first groove (11) extend in the same direction and are aligned vertically; The two-dimensional material (4) is transferred to the supporting layer (3), and the two-dimensional material (4) crosses the first gap (31) along the first direction (x).

17. The control method according to claim 16, characterized in that: The step of fixing the two-dimensional material (4) at both ends along the first direction (x) comprises: Covering a sacrificial layer (7) at a position where the two-dimensional material (4) is aligned with the first gap (31); Depositing metal layers at both ends of the two-dimensional material (4); The sacrificial layer (7) and the metal layer (8) covering and attached to the sacrificial layer (7) are removed to form two fixing members (5), thereby fixing the two ends of the two-dimensional material (4) to the supporting layer (3).

18. The control method according to claim 16, characterized in that: The step of forming a first gap (31) on the bearing layer (3) comprises: A hard tool (6) is used to locally pressurize or cut the bearing layer (3) to form the first gap (31).

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